KR102383708B1 - 전도성 트렌치 깊이의 유도성 모니터링 - Google Patents

전도성 트렌치 깊이의 유도성 모니터링 Download PDF

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KR102383708B1
KR102383708B1 KR1020177002030A KR20177002030A KR102383708B1 KR 102383708 B1 KR102383708 B1 KR 102383708B1 KR 1020177002030 A KR1020177002030 A KR 1020177002030A KR 20177002030 A KR20177002030 A KR 20177002030A KR 102383708 B1 KR102383708 B1 KR 102383708B1
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South Korea
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substrate
sequence
polishing
layer
values
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Korean (ko)
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KR20170018960A (ko
Inventor
웨이 루
제푸 왕
지홍 왕
하싼 지. 이라바니
도미닉 제이. 벤베뉴
잉마르 칼슨
보그슬라우 에이. 스위덱
웬-치앙 투
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어플라이드 머티어리얼스, 인코포레이티드
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H01L21/304—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H01L21/30625—
    • H01L21/3212—
    • H01L22/14—
    • H01L22/26—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/207—Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020177002030A 2014-06-23 2015-06-18 전도성 트렌치 깊이의 유도성 모니터링 Active KR102383708B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/312,503 US9754846B2 (en) 2014-06-23 2014-06-23 Inductive monitoring of conductive trench depth
US14/312,503 2014-06-23
PCT/US2015/036520 WO2015200101A1 (en) 2014-06-23 2015-06-18 Inductive monitoring of conductive trench depth

Publications (2)

Publication Number Publication Date
KR20170018960A KR20170018960A (ko) 2017-02-20
KR102383708B1 true KR102383708B1 (ko) 2022-04-05

Family

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Application Number Title Priority Date Filing Date
KR1020177002030A Active KR102383708B1 (ko) 2014-06-23 2015-06-18 전도성 트렌치 깊이의 유도성 모니터링

Country Status (6)

Country Link
US (3) US9754846B2 (https=)
JP (1) JP6640754B2 (https=)
KR (1) KR102383708B1 (https=)
CN (2) CN106463380B (https=)
TW (2) TWI649799B (https=)
WO (1) WO2015200101A1 (https=)

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US10427272B2 (en) * 2016-09-21 2019-10-01 Applied Materials, Inc. Endpoint detection with compensation for filtering
TWI816620B (zh) 2017-04-21 2023-09-21 美商應用材料股份有限公司 使用神經網路來監測的拋光裝置
TWI783037B (zh) * 2017-09-25 2022-11-11 美商應用材料股份有限公司 使用機器學習方式以產生製程控制參數的半導體製造
TWI825075B (zh) 2018-04-03 2023-12-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體
JP7083279B2 (ja) 2018-06-22 2022-06-10 株式会社荏原製作所 渦電流センサの軌道を特定する方法、基板の研磨の進行度を算出する方法、基板研磨装置の動作を停止する方法および基板研磨の進行度を均一化する方法、これらの方法を実行するためのプログラムならびに当該プログラムが記録された非一過性の記録媒体
US11056351B2 (en) * 2018-08-31 2021-07-06 Synaptics Incorporated Process monitor for wafer thinning
US11009798B2 (en) 2018-09-05 2021-05-18 Micron Technology, Inc. Wafer alignment markers, systems, and related methods
US11251096B2 (en) 2018-09-05 2022-02-15 Micron Technology, Inc. Wafer registration and overlay measurement systems and related methods
CN118943037A (zh) 2018-09-26 2024-11-12 应用材料公司 针对原位电磁感应监测的边缘重建中的基板掺杂的补偿
JP7291558B2 (ja) * 2019-07-03 2023-06-15 株式会社荏原製作所 渦電流センサ
JP7341022B2 (ja) 2019-10-03 2023-09-08 株式会社荏原製作所 基板研磨装置および膜厚マップ作成方法
JP7507576B2 (ja) * 2020-03-17 2024-06-28 株式会社東京精密 研削装置
KR20250073489A (ko) 2020-05-14 2025-05-27 어플라이드 머티어리얼스, 인코포레이티드 연마 동안의 인-시튜 모니터링에 사용하기 위한 신경망을 훈련시키기 위한 기법 및 연마 시스템
TWI810069B (zh) 2020-06-08 2023-07-21 美商應用材料股份有限公司 用於在拋光相鄰導電層的堆疊期間的輪廓控制的系統、方法及電腦程式產品
JP7447284B2 (ja) * 2020-06-24 2024-03-11 アプライド マテリアルズ インコーポレイテッド 研磨パッドの摩耗補償による基板層の厚さの決定
US11980995B2 (en) * 2021-03-03 2024-05-14 Applied Materials, Inc. Motor torque endpoint during polishing with spatial resolution

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US20030223150A1 (en) 2002-05-28 2003-12-04 Lee Edward Hin Pong Method of protecting the pole piece of a magnetic head during the ion mill patterning of the yoke
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JP2008286766A (ja) 2007-05-21 2008-11-27 Tokyo Seimitsu Co Ltd 研磨終了時点の予測・検出方法とその装置
JP2014514770A (ja) 2011-04-27 2014-06-19 アプライド マテリアルズ インコーポレイテッド 高感度渦電流モニタシステム

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Publication number Priority date Publication date Assignee Title
US20030201768A1 (en) 2000-04-07 2003-10-30 Le Cuong Duy Eddy current measuring system for monitoring and controlling a CMP process
US20030223150A1 (en) 2002-05-28 2003-12-04 Lee Edward Hin Pong Method of protecting the pole piece of a magnetic head during the ion mill patterning of the yoke
US20050072528A1 (en) 2002-06-28 2005-04-07 Lam Research Corporation Integration of sensor based metrology into semiconductor processing tools
JP2008286766A (ja) 2007-05-21 2008-11-27 Tokyo Seimitsu Co Ltd 研磨終了時点の予測・検出方法とその装置
JP2014514770A (ja) 2011-04-27 2014-06-19 アプライド マテリアルズ インコーポレイテッド 高感度渦電流モニタシステム

Also Published As

Publication number Publication date
JP2017520124A (ja) 2017-07-20
CN106463380B (zh) 2019-10-29
WO2015200101A1 (en) 2015-12-30
TW201603134A (zh) 2016-01-16
JP6640754B2 (ja) 2020-02-05
TWI701733B (zh) 2020-08-11
US10103073B2 (en) 2018-10-16
US20190035699A1 (en) 2019-01-31
US20150371913A1 (en) 2015-12-24
CN111211052A (zh) 2020-05-29
TWI649799B (zh) 2019-02-01
US20170365532A1 (en) 2017-12-21
US10741459B2 (en) 2020-08-11
CN111211052B (zh) 2023-09-19
KR20170018960A (ko) 2017-02-20
TW201929080A (zh) 2019-07-16
US9754846B2 (en) 2017-09-05
CN106463380A (zh) 2017-02-22

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