KR102354146B1 - 접속 구조체의 제조 방법 및 회로 접속 재료 - Google Patents

접속 구조체의 제조 방법 및 회로 접속 재료 Download PDF

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Publication number
KR102354146B1
KR102354146B1 KR1020150013947A KR20150013947A KR102354146B1 KR 102354146 B1 KR102354146 B1 KR 102354146B1 KR 1020150013947 A KR1020150013947 A KR 1020150013947A KR 20150013947 A KR20150013947 A KR 20150013947A KR 102354146 B1 KR102354146 B1 KR 102354146B1
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KR
South Korea
Prior art keywords
circuit
circuit member
temperature
peroxide
touch panel
Prior art date
Application number
KR1020150013947A
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English (en)
Korean (ko)
Other versions
KR20150096320A (ko
Inventor
유스께 다나까
신이찌 하야시
고스께 아사바
Original Assignee
데쿠세리아루즈 가부시키가이샤
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Application filed by 데쿠세리아루즈 가부시키가이샤 filed Critical 데쿠세리아루즈 가부시키가이샤
Publication of KR20150096320A publication Critical patent/KR20150096320A/ko
Application granted granted Critical
Publication of KR102354146B1 publication Critical patent/KR102354146B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Wire Bonding (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
KR1020150013947A 2014-02-14 2015-01-29 접속 구조체의 제조 방법 및 회로 접속 재료 KR102354146B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014026083 2014-02-14
JPJP-P-2014-026083 2014-02-14
JP2015011589A JP6437323B2 (ja) 2014-02-14 2015-01-23 接続構造体の製造方法、及び回路接続材料
JPJP-P-2015-011589 2015-01-23

Publications (2)

Publication Number Publication Date
KR20150096320A KR20150096320A (ko) 2015-08-24
KR102354146B1 true KR102354146B1 (ko) 2022-01-21

Family

ID=54257958

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150013947A KR102354146B1 (ko) 2014-02-14 2015-01-29 접속 구조체의 제조 방법 및 회로 접속 재료

Country Status (2)

Country Link
JP (1) JP6437323B2 (ja)
KR (1) KR102354146B1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6915544B2 (ja) * 2015-11-04 2021-08-04 昭和電工マテリアルズ株式会社 接着剤組成物及び構造体

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5111711B2 (ja) * 2002-01-31 2013-01-09 日立化成工業株式会社 接着剤組成物、回路接続用接着剤組成物及び回路接続方法
JP5013067B2 (ja) * 2007-01-22 2012-08-29 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電フィルム
KR101109906B1 (ko) * 2007-02-20 2012-02-08 미쓰이 가가쿠 가부시키가이샤 액정 밀봉용 경화성 수지 조성물 및 이를 사용한 액정 표시 패널의 제조 방법
CN101617267B (zh) * 2007-02-20 2012-08-15 三井化学株式会社 液晶密封用固化性树脂组合物及使用该组合物的液晶显示面板的制造方法
US20100307805A1 (en) * 2007-10-29 2010-12-09 Hitachi Chemical Company, Ltd. Circuit connecting material, connection structure and method for producing the same
KR20110036733A (ko) * 2008-07-11 2011-04-08 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 이방성 도전 필름
WO2010125965A1 (ja) * 2009-04-28 2010-11-04 日立化成工業株式会社 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及び回路部材の接続方法
EP2436715B1 (en) * 2009-05-28 2016-08-24 Showa Denko K.K. Epoxy resin-based coating composition
JP5565277B2 (ja) * 2010-11-09 2014-08-06 デクセリアルズ株式会社 異方性導電フィルム

Also Published As

Publication number Publication date
JP6437323B2 (ja) 2018-12-12
JP2015167223A (ja) 2015-09-24
KR20150096320A (ko) 2015-08-24

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