KR102345640B1 - 반도체 공정용 칠러 장치 - Google Patents

반도체 공정용 칠러 장치 Download PDF

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Publication number
KR102345640B1
KR102345640B1 KR1020200021565A KR20200021565A KR102345640B1 KR 102345640 B1 KR102345640 B1 KR 102345640B1 KR 1020200021565 A KR1020200021565 A KR 1020200021565A KR 20200021565 A KR20200021565 A KR 20200021565A KR 102345640 B1 KR102345640 B1 KR 102345640B1
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KR
South Korea
Prior art keywords
line
heat exchanger
temperature
channel
control
Prior art date
Application number
KR1020200021565A
Other languages
English (en)
Korean (ko)
Other versions
KR20210106723A (ko
Inventor
지옥규
오치훈
김영래
Original Assignee
(주)피티씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)피티씨 filed Critical (주)피티씨
Priority to KR1020200021565A priority Critical patent/KR102345640B1/ko
Priority to CN202110191287.0A priority patent/CN113294945A/zh
Publication of KR20210106723A publication Critical patent/KR20210106723A/ko
Application granted granted Critical
Publication of KR102345640B1 publication Critical patent/KR102345640B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K19/00—Arrangements of valves and flow lines specially adapted for mixing fluids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B49/00—Arrangement or mounting of control or safety devices
    • F25B49/02—Arrangement or mounting of control or safety devices for compression type machines, plants or systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Heat-Pump Type And Storage Water Heaters (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
KR1020200021565A 2020-02-21 2020-02-21 반도체 공정용 칠러 장치 KR102345640B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020200021565A KR102345640B1 (ko) 2020-02-21 2020-02-21 반도체 공정용 칠러 장치
CN202110191287.0A CN113294945A (zh) 2020-02-21 2021-02-19 半导体工艺用冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020200021565A KR102345640B1 (ko) 2020-02-21 2020-02-21 반도체 공정용 칠러 장치

Publications (2)

Publication Number Publication Date
KR20210106723A KR20210106723A (ko) 2021-08-31
KR102345640B1 true KR102345640B1 (ko) 2021-12-31

Family

ID=77319115

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200021565A KR102345640B1 (ko) 2020-02-21 2020-02-21 반도체 공정용 칠러 장치

Country Status (2)

Country Link
KR (1) KR102345640B1 (zh)
CN (1) CN113294945A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102510849B1 (ko) 2022-11-15 2023-03-17 주식회사 에프에스티 반도체 장비 온도 조절 장치

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115129092B (zh) * 2022-03-22 2023-08-22 无锡暖芯半导体科技有限公司 一种用于半导体晶圆制造的温控系统

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013200056A (ja) * 2012-03-23 2013-10-03 Sanden Corp 冷凍サイクル及び冷凍ショーケース
KR101975007B1 (ko) * 2018-09-19 2019-05-07 (주)본씨앤아이 반도체 설비 냉각용 냉각 시스템

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE383039B (sv) * 1975-02-18 1976-02-23 Projectus Ind Produkter Ab Aggregat for vermning av ett fluidum, foretredesvis vatten, i en konventionell central vermeanleggning, under utnyttjande av avgaende verme fran ett flertal kylmaskiner
JP2541173B2 (ja) * 1989-07-17 1996-10-09 ダイキン工業株式会社 空気調和装置
JPH055566A (ja) * 1991-06-28 1993-01-14 Daikin Ind Ltd 空気調和装置
KR100925236B1 (ko) * 2007-10-18 2009-11-05 주식회사 글로벌스탠다드테크놀로지 반도체 제조 장비의 온도 조절 시스템
JP2009300041A (ja) * 2008-06-16 2009-12-24 Mitsubishi Electric Corp 冷凍サイクル装置及び冷凍サイクル装置の圧力損失抑制方法
JP5653451B2 (ja) * 2010-11-24 2015-01-14 三菱電機株式会社 ヒートポンプ式給湯装置
JP2018076995A (ja) * 2016-11-08 2018-05-17 株式会社ナカヤ 遠隔制御によるエリア別パラメータ制御方式チラーを用いた循環液温度制御方法及びメンテナンス方法。
KR101910347B1 (ko) * 2016-12-05 2018-10-23 주식회사 글로벌스탠다드테크놀로지 반도체 제조설비의 고도화 온도제어장치
KR101993204B1 (ko) * 2017-08-14 2019-06-27 (주)피티씨 반도체 공정용 칠러 장치

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013200056A (ja) * 2012-03-23 2013-10-03 Sanden Corp 冷凍サイクル及び冷凍ショーケース
KR101975007B1 (ko) * 2018-09-19 2019-05-07 (주)본씨앤아이 반도체 설비 냉각용 냉각 시스템

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102510849B1 (ko) 2022-11-15 2023-03-17 주식회사 에프에스티 반도체 장비 온도 조절 장치

Also Published As

Publication number Publication date
KR20210106723A (ko) 2021-08-31
CN113294945A (zh) 2021-08-24

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