KR102342666B1 - Manufacturing apparatus for semiconductor ic test socket - Google Patents

Abstract

The present invention provides a socket manufacturing device for a semiconductor test, wherein after cutting a contact pin from a contact pin carrier and automatically inserting the contact pin into a contact pin insertion hole formed in a socket base supplied from a supply tray, the socket base to which the contact pin is assembled can be discharged to a discharge tray. Provided is the socket manufacturing device for semiconductor testing. According to the present invention, it is possible to prevent a defective contact pin from being inserted into an insertion hole of the socket by immediately identifying a contact pin defect using a vision inspection and a digital microscope, thereby preventing a socket manufacturing defect. By controlling a transfer to be performed repeatedly, it is possible to improve production efficiency by supplying empty sockets to the socket alignment part and discharging the assembled sockets to the discharge tray at the same time.

Description

Socket manufacturing device for semiconductor test {MANUFACTURING APPARATUS FOR SEMICONDUCTOR IC TEST SOCKET}

The present invention relates to an apparatus for manufacturing a socket for semiconductor testing, and more particularly, after cutting a contact pin from a contact pin carrier and automatically inserting a contact pin into a contact pin insertion hole formed in a socket base supplied from a supply tray, the contact pin It relates to a socket manufacturing apparatus for semiconductor testing capable of discharging the assembled socket base to a discharge tray.

After the semiconductor package manufactured by the semiconductor package manufacturing process is manufactured, various tests are performed to confirm the reliability of the product. In the test, all input/output terminals of the semiconductor package are connected to the inspection signal generating circuit to check normal operation and disconnection. There is a burn-in test that examines the lifespan of a semiconductor package and whether defects occur by applying stress such as high temperature, voltage, and current. The socket for semiconductor package inspection may have a contact pin type using a pogo pin type having a coil spring therein as a contact pin, or a contact pin complex in which a plurality of contact pins having elastic force are inserted into a plate by forming a linear curved part.

In relation to a technology for manufacturing a semiconductor test socket by assembling a contact pin to a plate, Korean Patent Registration No. 10-1841414 discloses an apparatus for manufacturing a socket for semiconductor testing. In the prior art, when the transferred separator is laminated on the lower plate, the terminal pins of the separator are aligned by receiving force while in contact between the pickup pad and the alignment block. Since the inserted separators are stacked, a structure for inserting a contact pin into an insertion hole formed in the base for semiconductor inspection is not disclosed.

As another prior art, the semiconductor test socket manufacturing apparatus of Korean Patent No. 10-181414 manufactures a semiconductor test socket by transferring the picked-up separator to the stacking part through the pickup part, and then stacking the transferred separator on the lower plate. . However, the prior art inserts a contact pin into the contact pin receiving hole after stacking the separators, but does not disclose a structure for manufacturing a socket base having a plurality of contact pin insertion holes.

On the other hand, even if only one contact pin inserted into a plurality of contact pin insertion holes formed in the socket base is defective, the socket is defective, resulting in a problem in that production efficiency is significantly reduced.

1. Republic of Korea Patent Publication No. 10-1841414 2. Republic of Korea Patent Publication No. 10-181414

The present invention has been devised to solve the above problems, and an object of the present invention is to cut a contact pin from a contact pin carrier and automatically insert a contact pin into a contact pin insertion hole formed in a socket base supplied from a supply tray. An object of the present invention is to provide an apparatus for manufacturing a socket for semiconductor testing capable of discharging a socket base, to which a contact pin is assembled, to a discharge tray.

Another object of the present invention is to determine whether the contact pin is defective in each manufacturing step, such as the state of the cut contact pin and the state of the contact pin inserted into the socket base, thereby fundamentally preventing the defect of the semiconductor test socket to increase production efficiency. To provide an apparatus for manufacturing a socket for semiconductor test that can improve

In order to solve the above problems, an apparatus for manufacturing a socket for semiconductor test according to an embodiment of the present invention transfers a contact pin carrier wound on a reel to cut one side of the contact pin carrier by cutting the contact pin carrier, and removes the contact pin from the contact pin carrier. A contact pin assembly unit for assembling a contact pin into the contact pin insertion hole formed in the socket base after cutting, a socket transport unit for transporting empty sockets in the supply tray to the socket alignment unit, and a socket transport unit for transporting the assembled socket to the discharge tray, and the socket transport unit It may include a socket aligning unit for aligning the sockets so that the contact pins are inserted by the contact pin assembly unit by rotating the socket transferred from the at right angles.

According to an embodiment of the present invention, a camera that acquires an image of a contact pin connected to a contact pin carrier whose one side is cut by a contact pin carrier cutting unit and an image of an assembly region in which a contact pin of a contact pin assembly unit is inserted into an insertion hole of a socket It may further include a control unit for controlling to perform a vision inspection by determining the image obtained from the digital microscope and the camera to obtain, and to display the shape obtained from the digital microscope in real time through the display unit.

According to an embodiment of the present invention, when it is determined that the contact pin is defective as a result of reading the image obtained from the camera, the controller controls so that the defective contact pin is not inserted into the insertion hole of the socket.

According to an embodiment of the present invention, the socket transfer unit clamps an assembly socket in which a supply chuck for supplying an empty socket contained in the supply tray to the socket alignment unit by clamping the supply tray and a contact pin in the socket alignment unit are assembled, and discharges to the discharge tray It may include a transfer chuck including a chuck, a transfer chuck transfer unit for reciprocating the transfer chuck between the socket alignment unit and the supply and discharge trays, and a control unit for controlling the transfer chuck transfer unit and the transfer chuck.

According to an embodiment of the present invention, the socket aligning unit rotates vertically to align the seated socket in the contact pin insertion direction, and the contact pin cut by the contact pin assembly unit is inserted into the insertion hole of the socket. It may include an X, Y, Z driving unit for transferring the vertical alignment unit in the X, Y, and Z directions, and a control unit for controlling the operation of the vertical alignment unit and the X, Y, Z driving unit.

According to the present invention as described above, the contact pin carrier forms an S-shaped transport path and is put into the contact pin assembly part, so that the reel, the contact pin carrier cutout part and the contact pin assembly part can be arranged in a predetermined area, so production efficiency can increase

By using vision inspection and digital microscope to detect contact pin defects immediately, it is possible to fundamentally prevent the defective contact pins from being inserted into the socket insertion hole, thereby preventing socket manufacturing defects.

By controlling the transfer of the pair of transfer chucks to be repeatedly performed, the empty sockets are supplied to the socket alignment unit and the assembly sockets are discharged to the discharge tray at the same time to improve production efficiency.

1 is a perspective view of an apparatus for manufacturing a socket for semiconductor testing according to an embodiment of the present invention.
2a and 2b are views showing the transfer of the contact pin carrier according to an embodiment of the present invention.
3A and 3D are views for explaining the operation of the contact pin carrier cutout according to an embodiment of the present invention.
4A to 4C are views for explaining a perspective view and a cam configuration of a contact pin assembly part of a socket for semiconductor inspection according to an embodiment of the present invention.
5A and 5B are views for explaining the operations of the cutting unit, the gripper unit, and the inserting unit according to the rotation of the cam according to an embodiment of the present invention.
6A and 6B are views for explaining the operation of the temporary insertion unit according to the rotation of the cam according to an embodiment of the present invention.
7A and 7B are views illustrating an initial alignment state of contact pins according to an embodiment of the present invention.
8A and 8B are views illustrating a state in which a contact pin is seated on a gripper according to an embodiment of the present invention.
9A and 9B are views illustrating a state in which a contact pin is cut from a contact pin carrier according to an embodiment of the present invention.
10A and 10B are views illustrating a state in which a contact pin is temporarily inserted into a socket base according to an embodiment of the present invention.
11A to 11C are views illustrating a state in which a contact pin is completely inserted into a socket base according to an embodiment of the present invention.
12 is a perspective view of a socket transfer unit according to an embodiment of the present invention.
13A and 13B are diagrams illustrating a supply chuck and a discharge chuck configured as a pair according to an embodiment of the present invention.
14A to 14E are views illustrating a socket alignment unit according to an embodiment of the present invention.
15 is a view illustrating a process of assembling a contact pin to a socket by a contact pin assembly unit according to an embodiment of the present invention.

The detailed description below is merely an example, and only shows an embodiment of the present invention. Also, the principles and concepts of the present invention are provided for the most useful and easy to explain purposes.

Accordingly, it is not intended to provide a detailed structure more than necessary for a basic understanding of the present invention, and, of course, various forms that can be implemented in the substance of the present invention by those of ordinary skill in the art are illustrated through the drawings.

Hereinafter, the configuration and operation of the preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view of an apparatus for manufacturing a socket for semiconductor testing according to an embodiment of the present invention.

As shown in FIG. 1 , the semiconductor test socket manufacturing apparatus 1000 transports the contact pin carrier 10 wound on the reel 1 to move one side of the contact pin carrier 12 (see (a) of FIG. 3D ). After cutting the contact pin carrier cutting unit 100 to cut the contact pin 11 from the contact pin carrier 10, the contact pin assembly unit 200 for assembling the contact pin into the contact pin insertion hole formed in the socket base, supply The contact pin assembly unit by rotating the socket transfer unit 300 and the socket transferred from the socket transfer unit at a right angle to transfer the empty socket in the tray 330 to the socket alignment unit and transfer the assembled socket to the discharge tray 340 It may include a socket aligning unit 400 that aligns the socket so that the contact pin is inserted by the . Although not shown, the semiconductor test socket manufacturing apparatus 1000 controls the overall device, including the contact pin carrier cutting unit 100 , the contact pin assembly unit 200 , the socket transfer unit 300 and the socket alignment unit 400 . It may include a control unit, and the control unit may be a microcontroller unit.

2a and 2b are views showing the transfer of the contact pin carrier according to an embodiment of the present invention.

Referring to FIG. 2A , in order to cut the contact pin 11 connected to the contact pin carrier 10 and assemble it into the socket, first cut one side 12 of the contact pin carrier that obstructs the assembly path, and then cut the one side 12 ), the cut contact pin carrier must be inserted into the contact pin assembly unit 200 . That is, the contact pin carrier cutting unit 100 for cutting the one side 12 of the contact pin carrier should be located in front of the contact pin assembly unit 200 on the carrier transport path. The path for transporting the contact pin carrier from the reel 1 to the contact pin carrier cutting unit 100 and the contact pin assembly unit 200 is very important in terms of space efficiency and cost reduction of the device. By locating the contact pin carrier cutout part 100 on the upper right side at a predetermined distance based on the pin assembly part 200, the contact pin carrier 10 is S along each of the contact pin carrier guides 2a, 2b, and 2c. Production efficiency because the reel 1, the contact pin carrier cutting unit 100, and the contact pin assembly unit 200 can be arranged in a predetermined area by forming a female-shaped transport path and feeding it to the contact pin assembly unit 200 can increase

Referring to FIG. 2A , the semiconductor test socket manufacturing apparatus 1000 has to assemble each contact pin 11 into a plurality of contact pin insertion holes formed in the socket base, so if one contact pin is defective, the semiconductor test The whole socket is defective. Therefore, on the transport path of the contact pin carrier, the camera 3 that acquires an image of the contact pin connected to the contact pin carrier cut on one side by the contact pin carrier cutting unit 100, the contact pin of the contact pin assembly unit 200 is the socket A digital microscope (4) that acquires an image of the assembly region inserted into the insertion hole of It may include a control unit (not shown). Here, when it is determined that the result of reading the image obtained from the camera is defective, the control unit controls the transfer sprocket of the contact pin assembling unit 200 so that the defective contact pin is inserted into the insertion hole of the socket. By controlling the contact pin assembly unit 200 to not cut (skip) the contact pin determined as , it is possible to prevent the contact pin determined to be defective from being assembled into the socket. For this, the control unit knows the predetermined distance between the contact pin determined to be defective and the assembly area and the rotation position of the sprocket (via the encoder of the motor, etc.) When it comes to the rotation position of the transfer sprocket 201 of the contact pin assembling unit 200 set in advance to skip the contact pin, control to stop the operation of the cam of the contact pin assembling unit 200 to cut the defective contact pin. It is possible to allow the defective contact pin to pass through the assembly area in the non-defective state. The controller can control the contact pin assembly by continuously rotating the transfer sprocket 201 to position the normal contact pin in the assembly area and then control the contact pin assembly unit 200 to operate the cam. On the other hand, the control unit controls the image obtained from the digital microscope 4 to be displayed in real time through the display unit (not shown), so that the operator can check the moment when the contact pin is assembled into the insertion hole of the socket in real time, thereby preventing defects at the source. can be prevented with

3A and 3D are views for explaining the operation of the contact pin carrier cutout according to an embodiment of the present invention.

Referring to FIGS. 3A and 3D , the contact pin carrier cutting part 100 is connected to the motor and connected to the transport hole 14 wound around the reel 1 , and the sprocket 101 for transporting the contact pin carrier 10 . ), a cutting block 120 connected to the cylinder 110 and reciprocating up and down to cut one side 12 of the contact pin carrier located in the cutting area on the cutting die 150, and a control unit for controlling the operation of the motor and the cylinder may include The contact pin carrier cutting part 100 includes a connection block 121 connected to the piston rod 111 of the cylinder 110, a first guide block 130 for guiding the vertical movement of the cutting block 120, and a second guide block It may include a 131 and a third guide block 132 . The cutting block 120 is guided by the first to third guide blocks 130 , 131 , 132 during vertical movement of the piston rod 111 of the cylinder 110 , and one side 12 of the contact pin carrier positioned on the cutting die 150 . is cut, and the contact pin carrier 10 from which one side is cut may be continuously transferred to the contact pin assembly unit 200 .

4A to 4C are views for explaining a perspective view and a cam configuration of a contact pin assembly part of a socket for semiconductor inspection according to an embodiment of the present invention.

4A to 4C, the contact pin assembly unit 200 of the socket for semiconductor inspection is a device for inserting the contact pin into the socket base after cutting the contact pin connected to the contact pin carrier according to the rotation of the cam. In the contact pin assembly unit 200 of the socket for semiconductor inspection, the camshaft 211 is connected to the fixed block 205 through a bearing, and the cam drive motor 203 is connected to the cam 210 through the timing belt 204 . By rotating the cam pulley 212, the cam 210 may rotate. The cam 210 is formed with four cam grooves 251a, and each of the cam grooves 241a, 251a, 227a, 237a is a cutting part driving cam follower 227, a gripper driving cam follower 237, and a temporary insertion part driving cam. The follower 241 and the insertion part driving cam follower 251 may move along each cam groove having a predetermined shape according to the rotation of the cam 210 . The cam grooves 241a, 251a, 227a, and 237a may have different shapes along the outer circumferential surface of the cam 210 and may be formed to have a predetermined path for guiding each cam follower. The gripper and the cutting punch can be moved up and down by a path according to the shape of each of these cam grooves, and by advancing the advancing block and advancing the insert pusher, the contact pin can be precisely assembled into the contact pin insertion hole without error.

The contact pin assembly unit 200 of the socket for semiconductor inspection is a contact pin carrier 10 loaded by the transfer sprocket 201 on the transfer block 207 according to the movement of each cam follower (227, 237, 241, 251). ), a gripper part 230 for supporting the contact pin 11 connected to the ), a cutting part 220 for cutting the contact pin 11 supported on the gripper part from the contact pin carrier 10, ) into the contact pin insertion hole 51 formed in the socket base 50 by advancing the temporary insertion part 240 and the insert pusher for temporarily inserting a predetermined portion of the contact pin into the contact pin 11 into the socket base 50 It may be made of an insertion part 250 that is completely inserted into the . Although not shown, the contact pin assembly unit 200 of the socket for semiconductor inspection may include a control unit including a microcontroller to control overall operations of the contact pin assembly unit, such as rotation control of a cam and rotation control of a transfer sprocket. 3D is a view showing a contact pin carrier according to an embodiment of the present invention. Referring to FIG. 3D , the contact pin carrier 10 is connected to the body, the body and the sprocket to transport the cut portion 13 cut by the cutting punch and the contact pin after being connected to the contact pin 11 and extending from the body. It may be configured to include a transfer hole (14). The contact pin carrier 10 transferred to the contact pin assembly unit 200 of the socket for semiconductor inspection of the present invention is shown in FIG. 3D (b), and the body portion located in the body in the direction in which the contact pin is assembled is first cut in advance. can be supplied.

Hereinafter, the operation of the contact pin assembly unit 200 of the socket for semiconductor inspection will be described in detail with reference to FIGS. 5A to 11C .

5A and 5B are views for explaining the operations of the cutting unit, the gripper unit, and the inserting unit according to the rotation of the cam according to an embodiment of the present invention.

The contact pin assembly part 200 of the socket for semiconductor inspection includes the steps of seating the contact pin on the gripper according to the rotation of the cam 210 (drive the gripper part), and the steps of cutting the contact pin seated on the gripper (drive the cutting part) , one contact pin is inserted into the socket base through the steps of temporarily inserting the cut contact pin into the socket base (acting the temporary insertion part) and fully inserting the contact pin into the socket base by advancing the insert pusher (drive the insertion part) It can be assembled into one formed contact pin insertion hole. Since the contact pin assembly unit 200 of the socket for semiconductor inspection requires assembling each contact pin 11 in a plurality of contact pin insertion holes 51 formed in the socket base 50, if one contact pin is defective, The entire socket for semiconductor inspection becomes defective. Therefore, when inserting each contact pin into the contact pin insertion hole 51, instead of inserting the contact pin into the contact pin insertion hole with one operation, a part of the contact pin is temporarily inserted into the contact pin insertion hole and aligned, and then the insert pusher It is possible to minimize product defects caused by assembling the contact pins by completely inserting them into the rest of the contact pins.

7A and 7B are views illustrating an initial alignment state of contact pins according to an embodiment of the present invention.

7A and 7B , the contact pin carrier 10 to which the contact pin 11 is connected is located in the assembly area, the gripper 235 supporting the contact pin is located below the contact pin, and the contact pin is located above the contact pin. A cutting punch 225 for cutting from the contact pin carrier is positioned. The cut portion of the contact pin 11 (refer to 13 of FIG. 3D ) is located on the cutting die 208a protruding from the cutting block 208 connected to the transfer block 207 and can be cut by the lowering of the cutting punch. .

Referring to FIGS. 5A and 5B , the gripper part 230 for raising the gripper 235 moves along the cam groove 237a by the rotation of the cam 210 so that the gripper-driven cam follower 237 moves along the cam groove 237a. The horizontal connection block 232 connected to the follower 237 may reciprocate on the rail 231 . One side of the horizontal connection block 232 is connected to one side of the link 233 , and the other side of the link 233 is connected to one side of the vertical connection block 234 . The rotation shaft 233a of the link 233 is connected to one end of the fixed block 205 to perform a function of changing a horizontal reciprocating motion into a vertical reciprocating motion. The other side of the vertical connection block 234 is connected to the gripper 235 so that the gripper 235 can rise and fall by the rotation of the cam 210 . The vertical connection block 234 may be connected to the advancing block 206 . The gripper 235 may be guided during vertical reciprocation by the gripper guide 236 connected to the advance block 206 .

8A and 8B are views illustrating a state in which a contact pin is seated on a gripper according to an embodiment of the present invention. Referring to FIGS. 8A and 8B , the gripper unit 230 raises the gripper 235 to support the contact pin 11 located in the assembly area to thereby raise the first and second seating surfaces 11a and 2nd seating surfaces of the contact pins. The first contact pin seating protrusion 235a and the second contact pin seating protrusion 235b formed on the upper surface of the gripper 235 may be respectively inserted into the 11b. Since the lower surface of the contact pin is seated and supported on the upper surface of the gripper 235 , the contact pin may be positioned at the correct position so that the contact pin is not shaken when cutting and temporarily inserting the contact pin. On the other hand, the alignment pin 239 connected to the gripper 235 is inserted into the alignment pin insertion groove 207a formed on the lower surface of the transfer block 207 when the gripper rises to increase the accuracy of positioning so that the upper surface of the gripper is inserted and connected to the lower surface of the contact pin. can be raised

5A and 5B , the cutting unit 220 may vertically lower the cutting punch 225 to cut the contact pin 11 connected to the contact pin carrier 10 . It may be understood that the operation of the cutting unit 220 corresponds to the operation of the gripper unit 230 . As the cutting unit 220 moves along the cam groove 227a by the rotation of the cam 210, the cutting unit driving cam follower 227 moves along the cam follower 227 and the horizontal connection block 222 connected to the rail 221 ) can reciprocate. One side of the horizontal connection block 222 is connected to one side of the link 223 , and the other side of the link 223 is connected to one side of the vertical connection block 224 . The rotation shaft 223a of the link 223 is connected to one end of the fixed block 205 to change the horizontal reciprocating motion into the vertical reciprocating motion. The other side of the vertical connection block 224 is connected to the cutting punch 225 so that the cutting punch 225 can rise and fall by the rotation of the cam 210 . The vertical connection block 224 may be connected to the advance block 206 . The cutting punch 225 may be guided during vertical reciprocation by the cutting punch guide 226 connected to the advancing block 206 . 9A and 9B are views illustrating a state in which a contact pin is cut from a contact pin carrier according to an embodiment of the present invention. 9A and 9B, the cutting punch 225 crosses the cutting die by descending to cut the contact pin 11 from the contact pin carrier, and descends until one end of the contact pin is seated on the insert pusher 255. can The contact pin 11 is positioned and supported between the cutting punch 225 and the gripper 235 , and one end of the contact pin may be prepared for temporary insertion while seated on the insert pusher 255 .

6A and 6B are views for explaining the operation of the temporary insertion unit according to the rotation of the cam according to an embodiment of the present invention.

Referring to FIG. 6A , the temporary insertion unit 240 moves along the cam groove 241a by the rotation of the cam 210 so that the advancing block 206 is temporarily inserted. By advancing by a predetermined distance, a portion of the contact pin 11 may be inserted into the contact pin insertion hole 51 . Temporary insertion portion 240 is centrally connected to the temporary insertion portion driving cam follower 241, both sides of the shaft (206a, 206b) through a shaft connection block 242 connected to one end of each shaft (206a, 206b) ) may advance the advancing block 206 connected to the other end according to the rotational movement of the cam 210 . The shafts 206a and 206b may be connected to the insert driving cam follower 251 and the fixed block 205 through bearings 252b and 205a, respectively.

Referring to FIG. 6B , the vertical connection block 224 of the cutting unit connected to the advancing block may be connected through a roller 224a connected to one end of the link 223 . When the advancing block 206 advances, the vertical connecting block 224 is a roller for guiding the vertical connecting block 224 by rotating the roller 224a fixed to the link in order to also advance the vertical connecting block 224. A guide groove 224b may be formed. Therefore, the vertical connection block 224 is supported by the roller 224a in contact with any one inner surface of the roller guide groove 224b, so that it can advance together with the advancing block 206 when it is temporarily inserted. Although not shown, the vertical connection block 234 of the gripper part has the same configuration as the vertical connection block 224 of the cutting part, and can move forward together with the advancing block. 10A and 10B are views illustrating a state in which a contact pin is temporarily inserted into a socket base according to an embodiment of the present invention. Referring to FIG. 10A , the cutting punch 225 and the gripper 235 connected to the advancing block (not shown) advance the contact pin 11 in close contact and support from the top and bottom. can be minimized. Referring to FIG. 10B , it can be seen that the contact pin 11 is temporarily inserted into the socket base 50 . That is, as described above in FIG. 8B, one end of the contact pin is temporarily inserted into the contact pin insertion groove in a state in which each seating protrusion on the upper surface of the gripper is inserted into each seating surface of the lower surface of the contact pin and firmly supported. It is possible to assemble the contact pin more precisely compared to the case where the contact pin is inserted by pushing the insert pusher at once while the outer surface of the contact pin is guided.

Referring back to FIGS. 5A and 5B , in the insertion part 250 , the insertion part driving cam follower 251 moves along the cam groove 251a by the rotation of the cam 210 to move the insert pusher 255 a predetermined distance. By advancing as much as possible, the contact pin 11 can be completely inserted into the contact pin insertion hole 51 and assembled. The insertion part 250 is centrally connected to the insertion part driving cam follower 251, and through a shaft connection block 242 connected to each shaft 206a, 206b through a bearing 252b, an insert pusher 255. The insert pusher connection block 252a connected to one end of the can be advanced by the rotational movement of the cam 210 . 11A to 11C are views illustrating a state in which a contact pin is completely inserted into a socket base according to an embodiment of the present invention. 11A to 11C , before the insert pusher 255 advances, the gripper may descend in order to be assembled into the contact pin insertion hole 51 by pushing the contact pin as the insert pusher 255 advances. The lowering of the gripper 235 is achieved by the rotation of the cam 210 and the movement of the gripper-driven cam follower 237 along the cam groove 237a. The insert pusher 255 has a contact pin support groove 255a into which the end of the contact pin 11 is inserted and supported, and after the gripper descends, one side of the contact pin 11 is inserted into the contact pin insertion hole 51 . The contact pin 11 can be assembled to the socket base by advancing the insert pusher while the other side of the contact pin 11 is supported by the contact pin support groove 255a of the insert pusher.

12 is a perspective view of a socket transfer unit according to an embodiment of the present invention, and FIGS. 13A and 13B are views illustrating a supply chuck and a discharge chuck configured as a pair according to an embodiment of the present invention.

Referring to FIG. 12 , the socket transfer unit 300 clamps the empty socket contained in the supply tray 330 and supplies the supply chuck 310a to the socket alignment unit 400 and the contact pins in the socket alignment unit 400 . A transfer chuck 310 including a discharge chuck 310b for clamping the assembled assembly socket and discharging to the discharge tray 340, and supplying the conveying chuck 310 with the socket alignment unit 400, discharge trays 330 and 340 It may include a transfer chuck transfer unit 320 for reciprocating therebetween, and a control unit for controlling the transfer chuck transfer unit and the transfer chuck.

The transfer chuck transfer unit 320 includes a sliding rail 321 for guiding the reciprocation of the transfer chuck 310, a timing belt (not shown) connected to the table 311 of the transfer chuck guided by the sliding rail 321, and the It may include a motor 322 connected to the timing belt for reciprocating the transfer chuck. Here, it has been described that the transfer chuck transfer unit 320 reciprocates the transfer chuck 310 by a motor and a timing belt, but is not limited thereto, and various structures such as an LM guide that guides linear motion by rolling contact of a plurality of balls are used. can be done

The transfer chuck 310 may be simultaneously moved by the transfer chuck transfer unit 320 by the table 311 connecting the supply chuck 310a and the discharge chuck 310b. The transfer chuck 310 includes a clamp 315 for clamping the socket in the supply and discharge tray and the socket alignment part, a clamp cylinder 314 connected to the upper side of the clamp to open or close both sides of the clamp, and the clamp A rotating cylinder 313 connected to the upper part of the cylinder 314 to rotate the tongs 315 and a vertical cylinder 312 installed on the upper part of the rotating cylinder 313 to move the tongs 315 up and down. . Here, the vertical cylinder 312, the rotating cylinder 313, and the tong cylinder 314 of the transfer chuck 310 may be controlled by the control of the controller, and the present invention is not limited thereto. The socket can be accurately seated on the seating block of the socket alignment unit by opening, rotating, and moving the tongs up and down, or the socket can be picked up or discharged in a predetermined area of the supply and discharge tray. The transfer chuck 310 is composed of a pair of a supply chuck 310a and a discharge chuck 310b, and by one transfer, the socket in the socket alignment unit is discharged and the socket is simultaneously supplied, thereby shortening the manufacturing time. The control unit transfers the transfer chuck 310 toward the socket aligner 400 by controlling the transfer chuck transfer unit in a state in which the empty socket is clamped only to the supply chuck 310a in the transfer chuck located at the upper part of the tray. The control unit controls the transfer chuck 310 to continuously take out the assembly socket in the socket alignment unit using the discharge chuck 310b, and directly supply the empty socket clamped to the supply chuck 310a to the seating block of the socket alignment unit. do. Finally, the controller controls the transfer chuck transfer unit to move the assembly socket clamped to the discharge chuck to the upper portion of the discharge tray 340 , and then controls the transfer chuck 310 to discharge the assembly socket to the discharge tray 340 . By controlling the transfer of the pair of transfer chucks to be repeatedly performed, the control unit supplies the empty sockets to the socket alignment unit and discharges the assembly sockets to the discharge tray at the same time to improve production efficiency.

On the other hand, the semiconductor test socket manufacturing apparatus 1000 checks whether the contact pins clamped by the discharge chuck 310b of the transfer chuck 310 are assembled to the assembly socket before moving to the trays 330 and 340, whether the contact pins are well assembled in the socket. It may further include a camera 500 for acquiring an image for confirmation. The control unit determines whether the socket assembly is defective by using the image obtained from the camera 500, and controls the transfer chuck transfer unit 320 to discharge the defective assembly socket to the partitioned area of the discharge tray 340. .

14A to 14E are views illustrating a socket alignment unit according to an embodiment of the present invention.

14A to 14E, the socket alignment unit 400 is cut by the vertical alignment unit 410, which rotates vertically to align the seated socket 50 in the contact pin insertion direction, and the contact pin assembly unit. X, Y, Z driving units 401, 402, 403 and vertical alignment units 410 and X for transferring the vertical alignment unit 410 in X, Y, and Z directions so that the contact pin can be inserted into the insertion hole of the socket 50 , may include a control unit for controlling the operation of the Y, Z driving unit (401, 402, 403).

The vertical alignment unit 410 is connected to the seating block 415 on which the socket 50 transported by the transport chuck is seated, the lower part of the seating block 415, and the rotation block 414 rotated by the motor 411. and a locking part 413 for supporting the vertically rotated rotational block by inserting the locking pin 413a by the locking cylinder 413b into the locking hole 414a formed on one side of the rotational block. The vertical alignment unit 410 is positioned in the contact pin insertion direction in which the contact pins of the contact pin assembly unit 200 are horizontally inserted, and the socket 50 supplied to the seating block 415 in the vertical direction by the transfer chuck is vertically aligned. by rotating to align the socket in the horizontal contact pin insertion direction (refer to FIG. 15). The socket 50 supplied to the seating block 415 receives a horizontal force by the separation prevention block 415a connected to the piston rod 412a of the clamping cylinder 412 and extends from the top of the seating block 415 . It is inserted into the lower portion of the separation prevention protrusion 415b to prevent separation during rotation and can be supported. The vertical alignment part 410 is one side of the rotation block 414 by the stopper 416a formed on the support plate 416 to maintain the correct verticality when the rotation block 414 rotates by the rotation of the motor 411 ( 414b) may be contacted.

The X, Y, and Z driving units 401, 402, 403 insert the contact pins cut and inserted by the contact pin assembly unit into the insertion holes of the sockets, and then insert the sockets into X, It can be transferred in Y and Z directions. A structure in which a linear bushing is connected to an LM guide or an LM shaft in order to linearly reciprocate the vertical alignment part 410 in each of the X, Y, and Z directions in order to transport the socket in the X, Y, and Z directions, a motor and a screw. A linear motion device having various mechanical structures such as a ball screw may be used.

In the above, the present invention has been described in detail through representative embodiments, but those of ordinary skill in the art to which the present invention pertains can make various modifications to the above-described embodiments without departing from the scope of the present invention. will understand

Therefore, the scope of the present invention should not be limited to the described embodiments, but should be defined by the claims described below as well as the claims and equivalents.

3: Camera 4: Digital Microscope
10: contact pin carrier 11: contact pin
11a: first seating surface 11b: second seating surface
50: socket base 51: contact pin insertion hole
100: contact pin carrier cutout 110: cylinder
101: sprocket 120: cutting block
200: contact pin assembly 201: transfer sprocket
202: sprocket drive motor 203: cam drive motor
204: timing belt 205: fixed block
205a: bearing 206: forward block
206a, 206b: shaft 207: transfer block
207a: alignment pin insertion groove 208: cutting block
208: cutting die 208a: contact pin
210: cam 211: camshaft
212: pulley 221, 231: rail
222, 232: horizontal connection block 223, 233: link
224, 234: vertical connection block 224a: roller
224b: roller guide groove 225: cutting punch
226: cutting punch guide 227: cutting unit driving cam follower
235: gripper
235a: first contact pin seating projection 235b: second contact pin seating projection
236: gripper guide 237: gripper driven cam follower
239: alignment pin 241: Temporarily inserted part driven cam follower
241a, 251a, 227a, 237a: cam groove 242, 252: shaft connection block
251: insert drive cam follower 252a: insert pusher connection block
255: insert pusher 300: socket transfer unit
310: transfer chuck 312: vertical cylinder
313: rotating cylinder 314: clamp cylinder
315: clamp 320: transfer chuck transfer unit
400: socket alignment unit 410: vertical alignment unit
415: seating block 414: rotation block
420: X, Y, Z drive unit
1000: Socket manufacturing device for semiconductor test

Claims (5)

A contact pin carrier cutting unit 100 for cutting one side of the contact pin carrier by transporting the contact pin carrier 10 wound on the reel (1);
After cutting the contact pin 11 from the contact pin carrier 10, the contact pin assembly unit 200 for assembling the contact pin into the contact pin insertion hole formed in the socket base;
Socket transfer unit 300 for transferring empty sockets in the supply tray 330 to the socket alignment unit, and transporting the assembled sockets to the discharge tray 340, and
and a socket aligning unit 400 for aligning the socket so that the contact pin is inserted by the contact pin assembly unit by rotating the socket transferred from the socket conveying unit at a right angle.
The method of claim 1,
A camera 3 for acquiring an image of a contact pin connected to a contact pin carrier whose one side is cut by the contact pin carrier cutting unit 100 and
A digital microscope 4 for acquiring an image of an assembly area in which the contact pin of the contact pin assembly unit 200 is inserted into the insertion hole of the socket, and
Socket manufacturing apparatus for semiconductor testing further comprising a control unit for performing vision inspection by determining the image obtained from the camera, and controlling to display the shape obtained from the digital microscope in real time through the display unit.
3. The method of claim 2,
The control unit, when it is determined that the contact pin is defective as a result of reading the image obtained from the camera, controls the defective contact pin not to be inserted into the insertion hole of the socket.
The method of claim 1,
The socket transfer unit
The supply chuck 310a that clamps the empty socket contained in the supply tray 330 and supplies it to the socket alignment unit 400 and the contact pin in the socket alignment unit 400 are assembled by clamping the assembly socket to the discharge tray 340 Transfer chuck 310 including a discharge chuck 310b for discharging to
A transfer chuck transfer unit 320 for reciprocating the transfer chuck 310 between the socket alignment unit 400 and the supply and discharge trays 330 and 340, and
and a control unit for controlling the transfer chuck transfer unit and the transfer chuck.
The method of claim 1,
The socket alignment part
The vertical alignment part 410 rotates vertically to align the seated socket 50 in the contact pin insertion direction, and the contact pin cut by the contact pin assembly part can be inserted into the insertion hole of the socket 50. X, Y, Z driving units 401, 402, 403 for transferring the vertical alignment unit 410 in the X, Y, Z directions and a control unit for controlling the operation of the vertical alignment unit 410 and the X, Y, Z driving units 401, 402, 403 Socket manufacturing equipment for semiconductor testing.

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