KR20240076760A - Handler for testing electronic components - Google Patents

Abstract

The present invention relates to a handler for testing electronic components that supports testing of electronic components.
A handler for testing electronic components according to the present invention includes a first gripping plate that grips electronic components moved from a loading tray on which electronic components are loaded in a live bug state; A rotation device that changes the electronic component from a live bug state to a dead bug state by rotating the first grip plate by 180 degrees; a second gripping plate that directly receives and grips electronic components in a dead bug state from the first gripping plate rotated by the rotating device; and a connection device that electrically connects the second grip plate to the connector so that electronic components can be tested by a tester. Includes.
According to the present invention, even when the terminal size of the electronic component or the gap between terminals is very small, the electronic component and the tester are precisely electrically connected to enable testing of the electronic component, ultimately improving productivity by eliminating unnecessary processes. It has the effect of improving performance and reducing waste of resources.

Description

Handler for testing electronic components {HANDLER FOR TESTING ELECTRONIC COMPONENTS}

The present invention relates to a handler for testing electronic components, and is particularly related to technology that can be applied when the terminal size of electronic components or the gap between terminals is small.

Produced electronic components such as semiconductor devices are tested by testers and then divided into good and defective products, and only good products are shipped.

Generally, the electrical connection between the tester and electronic components is made by the handler.

A handler is equipment that allows electronic components to be tested by a tester by electrically connecting multiple electronic components to a tester at the same time. The present invention relates to the development of a handler capable of testing semiconductor devices in a stacked die (DIE) state before reaching the stage of a finished product.

Currently, testing work on semiconductor devices in a wafer state is properly performed using a probe card, and testing work on semiconductor devices in a package state is performed by a handler suggested through a number of patent documents such as Korean Patent Publication No. 10-2015-0096912. It is being performed appropriately.

Since the dies before sawing are combined into one wide plate called a wafer, all dies can be aligned by accurately positioning the wafer, making electrical connection between the die and the tester possible using a probe card.

In addition, packaged semiconductor devices have terminals with a rather large diameter of about 100 micrometers, and the spacing between the terminals is relatively wide, so the technology of electrically connecting a large number of semiconductor devices to a tester at once can be implemented relatively easily. .

However, the importance and necessity of testing the stacked die, which is an intermediate stage between the wafer state and the package state, is only being raised and is currently an unavailable technology. This is because the size of the terminals (bumps) of the stacked die is very small and the gap between terminals is also very narrow, so a technology to accurately connect the terminals of the stacked die to the tester has not been developed.

Recently, an example of a packaged semiconductor device (PS) requiring a large number of dies is shown, as shown in FIG. 19. Referring to FIG. 19, four stacked dies (Ld) form one package-type semiconductor device (PS). Therefore, even if a defect occurs in one of the four stacked dies (Ld), the controller and the remaining stacked dies (Ld) must also be discarded. Referring further to FIG. 20, the stacked die (Ld) illustrated in FIG. 20 is formed by stacking four memory elements (MS) and one logic element (LS). Of course, a stacked die may be completed with only four memory elements (MS).

A stacked die is a semiconductor device in which multiple dies are stacked to increase capacity or realize required functions due to limitations in integration technology or to implement necessary functions. Therefore, the defect rate for stacked dies that have completed the stacking process is higher than the defect rate for dies simply sawed at the wafer stage. For this reason, the development of technology for testing stacked dies is continuously required. This is because when automated testing for stacked dies becomes possible, losses resulting from packaging defective stacked dies or losses of other electronic components packaged with the stacked dies can be prevented, thereby increasing productivity by reducing time and cost. Because you can.

In particular, as in the example of FIG. 20, the stacked die (Ld) in which the memory device (MS) and the logic device (LS) are stacked together requires additional additional equipment and processes to stack the heterogeneous devices together. Therefore, precise stacking of a stacked die (Ld) with heterogeneous elements is more difficult than a stacked die made of the same type of elements where sawing and stacking are performed in one place, and the defect rate also increases, so testing for the stacked die (Ld) is required. is being demanded more strongly.

According to such requirements, it can be considered to apply the technology of connecting a large number of packaged semiconductor devices to the tester at once to the electrical connection between the stacked die and the tester.

Packaged semiconductor devices are tested while loaded on a test tray in order to test large quantities at once. Here, the semiconductor device is inserted into an insert provided on a test tray and is electrically connected to the tester.

However, as shown in FIG. 20, the terminal of the stacked die (Ld) is very fine compared to the terminal (T ₃ ) of the package-type semiconductor device (PS). Of course, even in a stacked die in which four memory elements (MS) are stacked, the size of the terminal (T ₁ ) of the memory element (MS) at the bottom is very small. In contrast, it is inevitable that the tolerance in the process of manufacturing and assembling a test tray exceeds 10 micrometers, and that the cumulative tolerance of various other tolerances exceeds 20 micrometers.

Generally, in the case of a stacked die (Ld) that has been laminated after sawing, the size of the terminals (T ₁ , T ₂ / BUMP) is 20 to 25 micrometers, and the gap between the terminals (T ₁ and T ₂ ) is about 50 micrometers. It's just that. Therefore, current electrical connection technology cannot ensure electrical connection between the stacked die (Ld) and the tester.

In addition, in order to ensure proper electrical connection between the packaged semiconductor device (PS) and the tester, the insert of the test tray is installed to be somewhat movable, and this is also considering the size of the terminals (T ₁ and T ₂ ) of the stacked die (Ld). It is difficult to access the structure of electrically connecting the stacked die (Ld) to the tester using an existing test tray.

The purpose of the present invention is to provide a handler that can connect electronic components with very fine terminal sizes and spacing between terminals to a tester.

A handler for testing electronic components according to a first aspect of the present invention includes a first gripping plate that grips electronic components moved from a loading tray on which electronic components are loaded in a live bug state; a picker device provided to move electronic components from a loading tray to the first gripping plate and having at least one picker capable of gripping or releasing the electronic components; A rotation device that changes the electronic component from a live bug state to a dead bug state by rotating the first grip plate by 180 degrees; a second gripping plate that receives and grips electronic components in a dead bug state from the first gripping plate rotated by the rotating device; and a connecting device that electrically connects the electronic components held by the second gripping plate to the connector so that the electronic components can be tested by the tester. Includes.

a camera installed on the first grip plate and rotating in conjunction with the rotation of the first grip plate to check the position of the second grip plate; and an alignment device for aligning the position of the second grip plate confirmed by the camera. It further includes.

a vacuum generator that applies vacuum pressure to the first gripping plate or the second gripping plate; It further includes, wherein the first gripping plate or the second gripping plate is formed with vacuum holes for applying vacuum pressure from the vacuum generating device to the electronic components, so that the electronic components are adsorbed by the vacuum pressure coming from the vacuum generating device. By gripping, the positions of the electronic components are fixed to the positions placed by the picker.

The first gripping plate or the second gripping plate has several gripping areas and spaced apart areas, and the vacuum holes are formed only in the gripping areas.

The first gripping plate or the second gripping plate has a flat gripping surface for gripping electronic components.

The diameter of the vacuum holes is smaller than the diameter of the terminal of the electronic component to be tested.

It further includes a stimulation device for applying heat or cold to the electronic components held by the first gripping plate or the second gripping plate, and the first gripping plate or the second gripping plate is configured to apply heat or cold applied by the stimulating device. It is made of metal material to transfer cold air to electronic components.

The connection device holds the first grip plate so that electronic components in a dead bug state gripped by the first grip plate can be directly moved to the second grip plate while preventing their positions from being disturbed by the rotation of the first grip plate. While the plate and the second holding plate are maintained parallel to each other, the gap between them is narrowed so that one side of the electronic components is held by the first holding plate and the other side of the electronic components is in contact with the second holding plate. can do.

A handler for testing electronic components according to a second aspect of the present invention includes a gripping plate that grips electronic components that have been moved from a loading tray to a dead bug state; a picker device provided to move an electronic component from a loading tray to the gripping plate and having at least one picker capable of gripping or releasing the electronic component; and a connecting device that electrically connects the electronic components held by the gripping plate to a connector so that the electronic components can be tested by a tester. Includes.

A vacuum generator that applies vacuum pressure to the grip plate; It further includes,

The gripping plate is formed with vacuum holes for applying vacuum pressure from the vacuum generator to the electronic components, so that the electronic components are adsorbed and held by the vacuum pressure from the vacuum generator, thereby keeping the electronic components in the position placed by the picker. Fix their positions.

The gripping plate has several gripping areas and spaced apart areas, and the vacuum holes are formed only in the gripping areas.

*The gripping plate has a flat gripping surface for gripping electronic components.

According to the present invention, since electronic components can be maintained in a fixed state at the correct position, even in the case of electronic components such as stacked dies where the size of the terminals or the gap between terminals is very small, it is possible to properly connect them electrically to the tester, resulting in the following effects. There is.

First, even electronic components with very fine terminal sizes or spacing between terminals, such as stacked dies, can be tested in large quantities at once through an automated testing process, improving productivity.

Second, electronic components determined to be defective by the automated test process can be discarded without performing the next step, saving time and saving resources by not wasting resources that should be consumed in the next step. You can save money.

Third, since defective products are filtered out in advance at an intermediate stage, the testing process time for finished products is shortened, thereby reducing the time and costs required for testing finished products.

1 is a schematic plan view of a handler for testing electronic components according to a first embodiment of the present invention.
2 to 5 are reference views for explaining the first grip plate applied to the electronic component testing handler of FIG. 1.
FIG. 6 is a schematic diagram of a picker device applied to the handler for testing electronic components of FIG. 1.
FIGS. 7 and 8 are reference diagrams for explaining the picker device of FIG. 6.
FIG. 9 is a reference diagram for explaining a rotation device applied to the electronic component testing handler of FIG. 1.
FIG. 10 is a schematic diagram of an alignment device applied to the handler for testing electronic components of FIG. 1.
FIG. 11 is a reference diagram for explaining a stimulation device applied to the electronic component testing handler of FIG. 1.
FIG. 12 is a reference diagram for explaining a connection device applied to the handler for testing electronic components of FIG. 1.
FIG. 13 is a reference diagram for explaining the process of moving an electronic component from the first grip plate to the second grip plate in the electronic component test handler of FIG. 1.
FIG. 14 is a schematic plan view of a handler according to a first example in which the handler of FIG. 1 is modified.
FIG. 15 is a reference diagram for explaining the specific operation of the handler of FIG. 14.
FIG. 16 is a schematic plan view of a handler according to a second example modifying the handler of FIG. 1.
Figure 17 is a schematic plan view of a handler for testing electronic components according to a second embodiment of the present invention.
Figure 18 is a schematic plan view of a handler for testing electronic components according to a third embodiment of the present invention.
19 and 20 are reference diagrams for explaining a stacked die.

Preferred embodiments according to the present invention will be described with reference to the accompanying drawings, but for brevity of explanation, descriptions of overlapping or substantially identical configurations will be omitted or compressed as much as possible.

<Description of the first embodiment>

Figure 1 is a schematic plan view of a handler 100 (hereinafter abbreviated as 'handler') for testing electronic components according to a first embodiment of the present invention.

The handler 100 in FIG. 1 includes a first gripping plate 110, a picker device 120, a rotating device 130, a second gripping plate 140, an alignment device 150, a moving device 160, and a connecting device. (170), first camera 181, second camera 182, third camera 183, fourth camera 184, vacuum generator 191, stimulation device 192, and control device (CU) Includes.

The first gripping plate 110 grips the electronic component moved from the loading tray LT on the right side. Here, the loading tray (LT) is a loading element for supplying electronic components to be tested, and its shape may vary, such as a circle or a general square.

The electronic component loaded on the first grip plate 100 maintains a live bug state in which the terminal (T) of the electronic component (D) faces downward, as shown in FIG. 2, which is exaggerated. This first gripping plate 100 has minute vacuum holes (VH ₁ ) as shown in FIG. 3 .

And the first gripping plate 110 has several (eight in this embodiment) gripping areas (HF) for gripping the electronic component (D) and a separation area (IF) between the gripping areas (HF), A large number of vacuum holes (VH ₁ ) are formed in a group in the gripping area (HF) to grip one electronic component (D). Therefore, as compared in Figures 4 (a) and (b), electronic components (D ₁ , D ₂ ) with different areas can be properly fixed to the gripping area (HF), so that the electronic components (D _{1 )} to be tested , D ₂ ), there is no need to replace the first gripping plate 110 even if the specifications change.

On the other hand, in order to apply vacuum force to the electronic component (D) in a live bug state by the vacuum hole (VH ₁ ), the diameter of the vacuum hole (VH ₁ ) is equal to the terminal of the electronic component (D), as shown in the exaggerated reference diagram of FIG. It needs to be smaller than the diameter of (T). Therefore, the terminal (T) located on the vacuum hole (VH ₁ ) side blocks the vacuum hole (VH ₁ ), allowing vacuum pressure to be applied to the electronic component (D). Of course, there are vacuum holes (VH ₁ ) that deviate from the position of the terminal (T), so the vacuum pressure can be counted through the corresponding vacuum holes (VH ₁ ), but by applying a larger vacuum pressure to compensate for the number, the first The grip plate 110 allows the electronic components (D) to be properly gripped.

Furthermore, unlike the loading elements (test trays, etc.) provided in existing handlers, the first gripping plate 110 does not have a receiving groove for accommodating the electronic component (D) on the gripping surface (VF) and has a flat shape. has The receiving groove in the existing test tray functions to align the positions of the electronic components (D). However, tolerances according to the configuration of such receiving grooves interfere with automated testing of electronic components (D) such as stacked dies with a gap between terminals (T) of a fine size. Therefore, in the present invention, a separate receiving groove is not formed in the first gripping plate 110. Instead, the picker device 120 is configured to place the electronic component (D) at an accurate position on the gripping surface (VF) and to allow the electronic component (D) to stick to and be fixed in the position by vacuum pressure. .

The picker device 120 is provided to move the electronic component D from the loading tray LT to the first gripping plate 110. To this end, as shown in the schematic diagram of FIG. 6, the picker device 120 has at least one picker 121, a horizontal mover 122, a vertical mover 123, and a rotation driver 124.

As is well known, the picker 121 can grip the electronic component (D) by vacuum pressure, and releases the grip of the electronic component (D) when the vacuum pressure is released. However, the picker 121 to be applied to the handler 100 according to the present invention has a picking element 121a with a flat bottom as shown in the schematic diagram of FIG. 7, so that the picking element 121a is used in the process of holding the electronic component D. This prevents the posture or position of the electronic component D from being disturbed. And in the picking element 121a, fine vacuum holes (VH ₂ ) are formed to transmit vacuum pressure to the electronic component (D). Likewise, the vacuum holes (VH ₂ ) have a diameter smaller than the diameter of the terminal (T).

The horizontal mover 122 is provided to selectively position the picker 121 above the loading plate LT and above the first gripping plate 110. This horizontal mover 122 is preferably provided with a forward and backward moving means (122a) and a left and right moving means (122b) so that it can move the picker 121 in both forward and backward and left and right directions.

The vertical mover 123 raises and lowers the picker 121 to a position where the picker 121 can grip the electronic component (D) on the loading plate (LT), or lifts the electronic component (D) using the first gripping plate (110). Allow it to be lowered to a position where it can be put down. Of course, when the picker 121 is moved in the horizontal direction by the horizontal mover 122, the vertical mover 123 maintains the picker 121 in an elevated state.

The rotation driver 124 is provided to correct the posture of the picker 121 so that the picker 121 maintains an accurately vertical state. That is, the picker 121 may not maintain an appropriate upright state due to various reasons, and in this case, a defect may occur in the gripping operation of the electronic component D. Therefore, when the uprightness of the picker 121 is disturbed as shown in (b) of FIG. 8, the posture of the picker 121 is corrected by the rotation driver 124 so that the picker 121 can be correctly erected as shown in (a) of FIG. 8. do. Of course, if it is guaranteed that the upright state of the picker 121 will not be disturbed, the rotation driver 124 can be omitted.

The rotation device 130 is provided to rotate the first grip plate 110 by 180 degrees using the horizontal line in the left and right directions as the rotation axis. In terms of space saving, it is preferable that the rotation device 130 is provided to rotate the first gripping plate 110 using a horizontal line crossing the center of the first gripping plate 110 as a rotation axis. When the first gripping plate 110 is rotated by the rotating device 130 in this way, as can be seen from the comparison between (a) and (b) of FIG. 9, the electrons held by the first gripping plate 110 The components D change from a live bug state as shown in (a) of FIG. 9 to a dead bug state (a state in which the terminals face upward) as shown in (b) of FIG. 9. At this time, it is desirable that the rotation speed of the first gripping plate 110 by the rotating device 130 is such that an impact exceeding the gripping force holding the electronic component D is not applied.

The second grip plate 140 is provided to receive the electronic component D from the first grip plate 110 located above, and has the same basic structure as the first grip plate 110. However, in that the second gripping plate 140 grips the electronic component D in a dead bug state, there is little need to place a particularly fine limit on the size of the vacuum hole, but like the first gripping plate 110, the vacuum hole The gripping area where the holes are formed and the spacing area between the gripping areas are the same, and the gripping surface is also flat. Of course, the gripping area where the vacuum holes are formed must be in a position corresponding to the gripping area HF of the first gripping plate 110.

The alignment device 150 is provided to align the position of the second grip plate 140. Accordingly, as shown in the conceptual diagram of FIG. 10, the alignment device 150 includes a rotator 151 and a position mover 152.

The rotator 151 is provided to rotate the second grip plate 140 and includes a rotary plate 151a and a rotation motor 151b. This rotator 151 can rotate clockwise or counterclockwise when viewed from a plane.

Additionally, the rotator 151 may rotate to vary the inclination of the second grip plate 140. This is because there is a need to align the inclination of the second gripping plate 140 with respect to the first gripping plate 110.

The rotating plate 151a is rotated by a rotating motor 151b, and the second gripping plate 140 is fixed to the rotating plate 151a. Of course, it can also be fully considered to use the rotating plate 151a itself as a second gripping plate (refers to the second gripping plate being formed integrally).

The rotation motor 151b rotates the rotation plate 151a using the vertical line P passing through the center of the rotation plate 151a as its rotation axis. Of course, it may be considered to design the rotation axis of the rotation plate 151a so that it does not pass through the center of the rotation plate 151a, but designing it so that the rotation axis of the rotation plate 151a passes through the center of the rotation plate 151a can save space. It is more desirable because

The position mover 152 is provided to move the second grip plate 140 in a second direction (direction indicated as left-right direction in the drawing) perpendicular to the first direction (direction indicated as front-to-back direction in the drawing).

The moving device 160 is designed so that the second gripping plate 140 can be selectively positioned below the connector (C, for example, may be a probe card) on the tester side or below the first gripping plate 110. 2 Move the grip plate 140 in the forward and backward directions. Therefore, the second grip plate 140 can move both forward and backward and left and right, and can even rotate by the rotator 151.

The connection device 170 moves the second grip plate 140 upward when the second grip plate 140 is below the connector C, so that the electronic component held in a dead bug state by the second grip plate 140 (D) can be electrically connected to connector (C). In addition, the connection device 160 rotates the first gripping plate 110 so that when the electronic components D are held by the first gripping plate 110 in a dead bug state, the electronic components D are held by the first gripping plate 110. The second grip plate 140 is moved upward so that it can be moved directly from the plate 110 to the second grip plate 140. Of course, when the second holding plate 140 is horizontally moved by the moving device 160, the connecting device 160 lowers the second holding plate 140. And to enable this structure, as shown in FIG. 10, the connecting device 170 is coupled to the alignment device 150, and the moving device 160 moves the connecting device 170 in the forward and backward directions, ultimately 2 The grip plate 140 is moved forward and backward.

The first camera 181 is provided to determine whether the posture of the picker 121 is correct. For this purpose, the first camera 181 photographs the picker 121, and the control unit (CU) captures the image of the picker 121 photographed by the first camera 181 and the picker with an appropriate posture stored in advance ( After determining the posture of the picker 121 by comparing the images for 121), if it is determined that the posture of the picker 121 is inappropriate, the rotation actuator 124 is operated to bring the picker 121 into an appropriate upright state. Rotate it. Of course, the image of the picker 121 captured by the first camera 181 can also be used to set the zero point for the horizontal position of the picker 121, and in this case, the picker 121 is horizontally moved to a more accurate position. You become able to move.

Additionally, the first camera 181 can also be used to check whether the electronic component D is accurately held when the electronic component D is held by the picker 121. For example, after the picker 121 grips the electronic component D from the loading tray LT, on the way to the first gripping plate 110, the first camera 181 moves the electronic component D held by the picker 121. Photograph the part (D). And the control unit CU compares the pre-stored image with the image acquired by the first camera 181 to check the gripping state of the electronic component D held by the picker 121. When the gripping state of the electronic component (D) is confirmed in this way, the control unit (CU) appropriately operates the horizontal mover 122, the vertical mover 123, and the rotary driver 124 according to the confirmed gripping state of the electronic component (D). By operating, the electronic component (D) can be placed in the correct position of the first grip plate (110). Here, since the first camera 181 must be located below the picker 121, it can be considered to be fixedly installed on the floor side.

The second camera 182 is provided to accurately check the position of the electronic component (D) loaded on the loading tray (LT). Therefore, the control unit CU can confirm the exact position of the electronic component D through the image captured by the second camera 182 and then precisely position the picker 121 to that position. Therefore, the electronic component D can be held very precisely by the picker 121. This second camera 182 may be fixedly positioned on the upper ceiling of the loading tray D, but may also be configured to move integrally with the picker 121.

The third camera 183 is provided to check whether the position of the electronic component D held by the second holding plate 140 is accurate. For this purpose, the third camera 183 is located on the ceiling above the path along which the second grip plate 140 moves, and photographs the electronic component D while the second grip plate 140 moves. Accordingly, the control unit (CU) confirms the position of the electronic component (D) held by the second gripping plate 140 through the image captured by the second camera 182 and then moves the moving device 160. The distance is controlled to ensure that the electronic component (D) is positioned accurately below the connector (C) or to cause a jam.

The fourth camera 184 is installed on the rotating plate 151a on the second holding plate 140 side and is provided to precisely set the positions of the connector C and the second holding plate 140. That is, when the second grip plate 140 is located on the lower side of the connector C, the fourth camera 184 photographs the connector C, and the control unit CU selects the acquired image and the appropriate pre-stored image. After comparison, the horizontal or angular position of the second grip plate 140 is adjusted by controlling the aforementioned moving device 160, rotator 151, and position mover 152. Accordingly, the electronic components D held by the second holding plate 140 can be accurately electrically connected to the connector C.

The vacuum generator 191 generates vacuum pressure to be applied to the electronic component (D) through the vacuum holes (VH ₁ and VH ₂ ). This vacuum generator 191 may be provided on its own in the handler 100, but one built in a test factory may also be utilized.

The stimulation device 192 is provided to apply high-temperature heat or low-temperature cold air to the electronic component D held by the first gripping plate 110 and the second gripping plate 140. For this purpose, as shown in FIGS. 1 and 11, the stimulation device 192 includes a heater 192a for heating, a cooling pipe 192b for cooling, and a supplier 192c for supplying cooling fluid to the cooling pipe 192b. ) may include. Accordingly, the electronic component (D) can be preheated or precooled, and the electronic component (D) can be returned to room temperature.

Referring further to FIG. 11, the heater 192a and the cooling pipe 192b are preferably installed in contact with the first grip plate 110 or the second grip plate 140, and are covered by the receiving cover (EC). I lost. Therefore, the thermal stimulus applied through the heater 192a or the cooling pipe 192b is transmitted to the electronic component (D) via the first gripping plate 110 or the second gripping plate 140, and for this purpose, the first gripping plate 192b is transmitted to the electronic component D. The plate 110 and the second grip plate 120 are preferably made of a metal material with good thermal conductivity. Since thermal stimulation can be applied to the electronic component (D) in this way, the electronic component (D) can be properly tested according to various usage environments.

For reference, the internal space (IS) formed by the receiving cover (EC) in FIG. 11 can be used as a vacuum space for transmitting vacuum pressure to the vacuum hole (VH ₁ ).

The control unit (CU) controls the operation of each of the above components.

Next, the operation of the handler with the above configuration will be explained.

S1. Supply and movement of loading trays

The operator supplies the electronic components (D) to the handler 100 by loading the loading trays (LT) loaded with the electronic components (D) into the stacker (ST). Then, the loading trays (LT) are pulled out one by one from the stacker (ST) and moved rearward, so that they are located next to the right side of the first gripping plate (110).

S2. Picker's posture correction

When the first camera 181 photographs the picker 121 while the picker 121 is moving to the loading tray LT, the control unit CU detects the picker 121 through the image acquired by the first camera 181. Correct the posture of (121). Of course, at this time, it may be implemented to calculate the accurate teaching point (grip point for gripping the electronic component) by holding the zero point position of the picker 121.

S3. Check the location of electronic components <S3>

The second camera 182 photographs the electronic component (D) loaded on the loading tray (LT), and the control unit (CU) determines the electronic component (D) to be held by the picker 121 through the image acquired from the second camera 182. Check the exact location of the electronic component (D).

S4. Grasping, moving and checking electronic components

When the above steps S1 and S2 are completed, the control unit CU controls the picker 121 to grasp the electronic component D from the loading tray LT, and the picker 121 holds the electronic component D. When this is done, the picker 121 is moved upward to the first gripping plate 110.

At this time, when the picker 121 moves or stops for a while while moving, the first camera 181 photographs the electronic component D held by the picker 121, and the control unit CU captures the first camera 181. The gripping state of the electronic component D held by the picker 121 is confirmed using the image acquired by the camera 181. Through the image acquired by the first camera 181, the control unit (CU) can accurately determine the end point of movement of the picker 121 and operates the rotation driver 184 according to the degree of distortion of the electronic component (D). By operating it, the electronic component (D) can be accurately calibrated. For example, even if the center of the picker 121 and the center of the electronic component (D) do not slightly match due to a slight error in the teaching point, the correct gripping state of the electronic component (D) is confirmed in this process, so control The device (CU) can accurately calculate the destination of the movement of the electronic component (D). Additionally, depending on the structure or shape of the picking element 121, the horizontality of the electronic component (D) may be disturbed, so this disturbance can also be corrected.

S5. Grasping by the first gripping plate

When the picker 121 is accurately moved to the movement end point in step S4, the picker device 120 operates to place the electronic component (D) at the correct position and then releases the grip on the electronic component (D). Accordingly, vacuum pressure is applied to the first holding plate 110, so that the electronic component D is held by the first holding plate 110 so that it remains in the position lowered by the picker 121.

As steps S2 to S5 are repeated in this way, electronic components (D) are placed in all gripping areas (HF) of the first gripping plate 110, and the electronic components (D) are attached to the first gripping plate 110 by vacuum pressure. It is held securely by

S6. Rotation of the first gripping plate

As mentioned above, when the first gripping plate 110 grips all eight electronic components D, the rotation device 130 operates to rotate the first gripping plate 110 by 180 degrees. Accordingly, the electronic components (D) change from the live bug state to the dead bug state.

S7. Movement of electronic components

When step S6 is completed, the second grip plate 140 waiting below the first grip plate 110 is raised by the connection device 170. Accordingly, when the electronic component (D) in a dead bug state is placed on the second gripping plate 140, the vacuum pressure on the first gripping plate 110 is gradually weakened, while the vacuum pressure on the second gripping plate 140 increases. gradually rises. In this way, the electronic component (D) is directly moved from the first gripping plate 110 to the second gripping plate 140. In order to prevent the position of the electronic components (D) from being disturbed during the movement of the electronic components (D) using this movement method, the connecting device (170) maintains the first grip plate (110) in a dead bug state as shown in FIG. 12. While holding the electronic components (D) on the side where the terminal (T) is located, the second holding plate (140) is moved upward so that the other side is in contact with the second holding plate (140). Of course, in order to accurately move the electronic components D, the first gripping plate 110 and the second gripping plate 140 must remain parallel to each other. And the upward movement distance of the second grip plate 140 is equal to the value accurately calculated by the height (t, thickness) of the electronic component (D) to prevent damage to the first grip plate (110) and the second gripper. It should be set so that the gap between the plates 140 can be narrowed. Of course, the gripping surface of the first gripping plate 110 or the second gripping plate 140 is made of a very thin soft conductive rubber or silicone pad so that the somewhat excessive upward movement of the second gripping plate 140 can be compensated. It can also be considered to prevent damage to the electronic components (D). In addition, the first gripping plate 110 and the second gripping plate 140 may have a calibration block for correcting the gap between them, or may have a calibration block and a corresponding corresponding block, and in this case, the calibration block or One or more corresponding blocks may be provided. Of course, the calibration block or corresponding block may be installed in a detachable manner that matches the height of the electronic component (D), or may be precisely controlled by a separate motor.

S8. Check the movement and gripping status of the second gripping plate

When step S7 is completed, the moving device 160 operates to move the second gripping plate 140 below the connector C. And as referred to in FIG. 13, in this process, the electronic component (D) held by the second grip plate 140 by the third camera 183 while the second grip plate 140 is moving or briefly stopped. By accurately confirming the position, the movement end point of the second grip plate 140 is accurately calculated. And when this work is completed, the control unit CU further moves the second grip plate 140 to the movement end point so that the second grip plate 140 is located on the lower side of the connector.

9. Second gripping plate calibration

Meanwhile, when the second grip plate 140 is located below the connector C, the fourth camera 184 photographs the connector C. And the control unit (CU) checks whether the electronic component (D) can be precisely connected to the connector (C) by comparing the image acquired by the fourth camera 184 with a good image that is stored in advance. At this time, if it is determined that a defect will occur in the connection between the electronic component (D) and the connector (C), the control unit (CU) controls the moving device 160, the rotator 151, and the position mover 152 to control the connection between the electronic component (D) and the connector (C). 2 Precisely correct the horizontal or angular position of the grip plate 140. For this purpose, the fourth camera 184 may be located below the second gripping plate 140, and may be photographing the connector C in advance before or during work.

10. Connection of electronic components and connectors

When the movement and position correction of the second grip plate 140 are completed, the connection device 170 moves the second grip plate 140 upward, and thus the electronic component (D) held by the second grip plate 140 ) and the connector (C) are electrically connected. In this state, tests on the electronic component (D) are performed.

When all of the above processes are completed, the tested electronic component (D) is operated in the reverse order above and is transferred from the second holding plate 140 to the first holding tray 110 and then selected into good and good parts by the picker device 120. They are divided into defective products and moved to the empty loading tray (LT) on the left.

For reference, in this embodiment, the second gripping plate 140 is implemented to rise in order to transfer the electronic component (D) on the first gripping plate 110 to the second gripping plate 140, but depending on implementation, It can also be sufficiently considered to lower the first grip plate 110. Additionally, in order to accurately set the position between the first gripping plate 110 and the second gripping plate 140, it may be possible for the first gripping plate 110 to be implemented so that its horizontal or angular position is corrected.

<Description of the first modification>

Figure 14 shows a first modification to the first embodiment.

The handler 100 in FIG. 14 also includes a first gripping plate 110, a picker device 120, a rotating device 130, a second gripping plate 140, an alignment device 150, and the same as in the first embodiment. Moving device 160, connecting device 170, first camera 181, second camera 182, third camera 183, fourth camera 184, vacuum generator 191, stimulation device ( 192) and a control unit (CU).

However, it further includes a fifth camera 185 that can be paired with the fourth camera 184.

The fifth camera 185 is fixedly installed on the first grip plate 110 and rotates together with the first grip plate 110 according to the operation of the rotation device 130. If the fifth camera 185 is switched from facing upward to facing downward by rotation as shown in FIG. 15, the fifth camera 185 is positioned on the second grip plate 140 below. They face each other with the installed fourth camera 184. When the fifth camera 185 and the fourth camera 184 face each other and take pictures, the other side functions as a registration mark. Therefore, the control unit (CU) compares the images acquired by the fourth camera 184 and the fifth camera 185 with the pre-stored images to determine whether the first gripping plate 110 and the second gripping plate 140 are You can check whether they are positioned correctly. If the mutual positions of the first grip plate 110 and the second grip plate 140 are slightly offset, the control unit CU controls the first grip plate 110 and the second grip plate 140. The position of the second grip plate 140 is corrected by operating the mover 160, rotator 151, and position mover 152 so that they can face each other accurately. And in a state where the position is corrected, the second grip plate 140 is moved further backward by the set amount and moved to a position where the first grip plate 110 and the second grip plate 140 can be aligned. Here, matching means that the gripping area HF on the first gripping plate 110 and the gripping area on the second gripping plate 140 match in the vertical direction. Of course, the positioning function of the second grip plate 140 can be performed even if the first grip plate 110 is provided with another mark that can be identified by the fourth camera 184 instead of the fifth camera 185. .

According to this modification, the second camera 182 may be omitted and the fifth camera 185 may be used to check the posture of the picker 121 or the position of the electronic component D held by the picker 121. There will be. Of course, in this case, a more complicated movement line of the picker 121 will be required.

In addition, according to this modification, since the electronic components (D) can be accurately moved from the first gripping plate 110 to the second gripping plate 140, omitting the third camera 183 can be considered. It could be.

<Description of the second modification>

Figure 16 shows a second modification to the first embodiment.

The handler 100 in FIG. 16 also includes a first gripping plate 110, a picker device 120, a rotating device 130, a second gripping plate 140, an alignment device 150, and the same as in the first embodiment. Moving device 160, connecting device 170, first camera 181, second camera 182, third camera 183, fourth camera 184, vacuum generator 191, stimulation device ( 192) and a control unit (CU).

However, in this example, the electronic components (D) that are different from the first embodiment in that the tested electronic components (D) are reloaded on the loading tray (LT) for supplying the electronic components (D) to be tested. Have a flow.

<Description of the second embodiment>

*The first embodiment above assumes a case where the electronic component (D) is supplied to the handler 100 in a live bug state. However, in the production procedure, the electronic component (D) is loaded in a dead bug state on the loading tray (LT), and this loading tray (LT) may be supplied to the handler. Therefore, this example assumes a case where the electronic component (D) is supplied in a dead bug state. Therefore, the first gripping plate 110 or the rotating device 130 presented in the examples mentioned above does not need to be configured. Accordingly, as referred to in FIG. 17, the handler 200 according to the second embodiment includes a picker device 220, a gripping plate 240, an alignment device 250, a moving device 260, and a connecting device 270. , includes a first camera 281, a second camera 282, a third camera 283, a fourth camera 284, a vacuum generator 291, a stimulation device 292, and a control device (CU). .

According to this example, the picker 221 directly moves the dead bug electronic component (D) in the loading tray (LT) to the holding plate (240). To this end, the grip plate 240 is raised by the connection device 270 while being positioned backward by the moving device 260. Here, since the picker 221 must hold the electronic component (D) on the side where the terminal (T) is formed, according to the example of FIG. 7, a technology in which the diameter of the vacuum hole (VH ₂ ) is smaller than the diameter of the terminal (T) is applied. It is desirable.

In the handler 200 according to this embodiment, when all eight electronic components (D) are gripped by the gripping plate 240, the gripping plate 240 descends and moves forward to be positioned below the connector (C), In that state, the grip plate 240 rises to electrically connect the connector (C) and the electronic component (D).

Similarly, when the test is completed, the electronic components (D) for which the test has been completed are moved to the loading tray (LT) on the left.

<Description of the third embodiment>

Figure 18 shows a handler 300 according to a third embodiment of the present invention.

The handler 300 of FIG. 18, like the handler according to the first embodiment, includes a first gripping plate 310, a picker device 320, a rotating device 330, a second gripping plate 340, and an alignment device 350. , moving device 360, connecting device 370, first camera 381, second camera 382, third camera 383, fourth camera 384, vacuum generator 391, stimulation device (392) and a control unit (CU).

The handler 300 according to this embodiment operates in the first mode as in the first embodiment when the electronic component D is supplied in a live bug state.

However, if the electronic component D is supplied in a dead bug state, the functions of the first grip plate 310 and the rotation device 330 are not required. Therefore, the handler 300 according to this example operates in the second mode.

In the second mode, the first grip plate 310 and the rotating device 330 are lowered by the lowering means (DM), and the second grip plate 340 moves backward in a raised state to hold the first grip plate 310. It can be located upward. And in that state, it operates as in the second embodiment. For the lowering of the first grip plate 310, the width of both guide rails GR that guides the forward and backward movement is provided to be wider than the width of the first grip plate 310.

According to the third embodiment as above, the handler 300 can be properly operated regardless of whether the electronic component D is supplied as a live bug or a dead bug.

As described above, the specific description of the present invention has been made by way of examples with reference to the accompanying drawings. However, since the above-described embodiments are only explained by referring to preferred examples of the present invention, the present invention is not limited to the above embodiments. It should not be understood as being limited to only, and the scope of rights of the present invention should be understood as the scope of the claims described below and their equivalents.

100: Handler for electronic component testing
110: first gripping plate
HF: Gripping area IF: Separation area
VH ₁ : Vacuum hole
120: Picker device
121: picker
130: Rotating device
140: second gripping plate
150: alignment device
170: Connector
185: 5th camera
191: Vacuum generator
192: Stimulation device

Claims (4)

A gripping surface for gripping electronic components; has,
Vacuum holes are formed so that the electronic components placed on the gripping surface can be stuck and fixed in their position.
Gripping plate of handler for testing electronic components. According to claim 1,
It has gripping areas for gripping electronic components and a spaced area between the gripping areas,
The vacuum holes are formed in the gripping area.
Gripping plate of handler for testing electronic components. According to clause 2,
The vacuum holes are formed in groups to grip one electronic component, so that electronic components with different areas can be fixed to the gripping area.
Gripping plate of handler for testing electronic components. According to clause 3,
The gripping surface is formed flat
Gripping plate of handler for testing electronic components.

Images