JP2014116519A - Alignment device, aligning method and laminate semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem in which connection parts are not aligned properly.SOLUTION: An alignment device for aligning a first member and a second member includes: an acquiring section for acquiring position relation information related to a structure actual measurement position which is an actual measurement position of a structure provided on the first member, a mark actual measurement position which is an actual measurement position of an alignment mark arranged on the first member and used for alignment with the second member, and a structure design position which is a design position of the structure; and an aligning section for aligning the first member and the second member using the acquired position relation information, the position of the alignment mark of the first member and the position of the alignment mark of the second member. The aligning section aligns the first member and the second member so that the structure overlaps a predetermined position of the second member.

Description

  The present invention relates to an alignment apparatus, an alignment method, and a stacked semiconductor device.

2. Description of the Related Art An alignment apparatus that aligns a pair of substrates to be bonded by observing an alignment mark with a microscope or the like to acquire the position is known (for example, see Patent Document 1).
[Patent Document 1] Japanese Patent Application Laid-Open No. 2009-245963

  However, since the substrate and the substrate are aligned according to the position of the alignment mark, if the alignment mark and the connection portion such as the bump are deviated from a predetermined positional relationship, the connection portions formed on the substrate are properly connected. There is a problem that it is not aligned.

  In the first aspect of the present invention, the alignment apparatus aligns the first member and the second member with each other, and the structure is the actual measurement position of the structure provided on the first member. The actual measurement position, the actual mark position that is the actual measurement position of the alignment mark used for alignment with the second member, and the structure that is the design position of the structure. Using the acquisition unit that acquires positional relationship information related to the design position, the acquired positional relationship information, the position of the alignment mark of the first member, and the position of the alignment mark of the second member, An alignment portion for aligning the first member and the second member, wherein the alignment portion is arranged so that the structure overlaps a predetermined position of the second member. 1 member and Providing alignment apparatus for aligning the serial second member.

  According to a second aspect of the present invention, there is provided an alignment method for aligning a first member and a second member with each other, wherein the structure is a measured position of a structure provided on the first member. An actual measured position of the object, a measured mark position that is an actual position of the alignment mark used for alignment with the second member disposed on the first member, and a structure that is the designed position of the structure Using the acquisition stage of acquiring positional relationship information related to the object design position, the acquired positional relationship information, the position of the alignment mark of the first member, the position of the alignment mark of the second member, An alignment step of aligning the first member and the second member, wherein in the alignment step, the structure overlaps with a predetermined position of the second member. First Providing to align with the the wood second member.

  According to a third aspect of the present invention, there is provided a laminated semiconductor device manufactured by separating a pair of substrates aligned by the alignment device described above.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

1 is an overall configuration diagram of a substrate bonding apparatus 10. FIG. It is a figure explaining the bonding process of the bonding board | substrate 95 by the board | substrate bonding apparatus 10. FIG. It is a figure explaining the bonding process of the bonding board | substrate 95 by the board | substrate bonding apparatus 10. FIG. It is a figure explaining the bonding process of the bonding board | substrate 95 by the board | substrate bonding apparatus 10. FIG. It is a figure explaining the bonding process of the bonding board | substrate 95 by the board | substrate bonding apparatus 10. FIG. 3 is a side view of the alignment device 28. FIG. 3 is a block diagram illustrating a control system of alignment device 28. FIG. 4 is a flowchart of an alignment process performed by the alignment device 28. 4 is a flowchart of an alignment process performed by the alignment device 28. It is a figure explaining the amount of bump movement required for alignment of bump Ba. It is a figure explaining the state which divided | segmented the board | substrate 90 to which this embodiment is applied into the cluster Cl. It is a figure explaining the position shift of alignment mark M and bump Ba within one cluster Cl.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is an overall configuration diagram of the substrate bonding apparatus 10. The substrate bonding apparatus 10 manufactures a bonded substrate 95 by bonding two substrates 90 and 90 together. The substrate bonding apparatus 10 may manufacture the bonded substrate 95 by bonding three or more substrates 90 together.

  As shown in FIG. 1, the substrate bonding apparatus 10 includes an atmospheric environment unit 14, a vacuum environment unit 16, a control unit 18, and a plurality of substrate cassettes 20.

  The atmospheric environment unit 14 includes an environment chamber 12, a substrate holder rack 22, robot arms 24, 30, 31, a pre-aligner 26, an alignment device 28, and a rail 32. The environmental chamber 12 is formed so as to surround the atmospheric environment unit 14. The area surrounded by the environmental chamber 12 is communicated with an air conditioner or the like, and the temperature is controlled. Thereby, the accuracy of alignment between the substrate 90 and the substrate 90 is improved.

  The substrate cassette 20 accommodates the substrate 90 and the bonded substrate 95 that are bonded together in the substrate bonding apparatus 10. In addition to a semiconductor substrate such as a single silicon wafer, a compound semiconductor wafer, a glass substrate, or the like, the substrate 90 to be bonded by the substrate bonding apparatus 10 may have elements, circuits, terminals, and the like formed thereon.

  The substrate holder rack 22 accommodates a plurality of pairs of substrate holders 94 that hold the overlapping substrate 92 and the bonded substrate 95 from above and below. The overlapping substrate 92 is a pair of substrates 90 that are overlapped before being bonded. The substrate holder 94 holds the substrate 90 by electrostatic adsorption. The substrate holder 94 may hold the substrate 90 by vacuum suction. The substrate holder rack 22 separates the bonded substrate 95 transferred from the vacuum environment unit 16 from the substrate holder 94.

  The robot arm 24 transports the substrate 90 loaded in the substrate cassette 20 and the substrate holder 94 loaded in the substrate holder rack 22 to the pre-aligner 26. The robot arm 24 transports the substrate holder 94 holding the substrate 90 on the pre-aligner 26 to the moving stage 38 of the alignment apparatus 28 described later. The robot arm 24 turns over one of the two sets of substrates 90 and substrate holders 94 that are successively conveyed and conveys them to the moving stage 38. The robot arm 24 transports the bonded substrate 95 separated from the substrate holder 94 by the substrate holder rack 22 to one of the substrate cassettes 20.

  Since the pre-aligner 26 is highly accurate when loading the substrates 90 into the alignment device 28, the substrate holder 94 of each substrate 90 is loaded so that each substrate 90 is loaded within the narrow adjustment range of the alignment device 28. Temporarily align the position with respect to. Thereby, positioning of the board | substrate 90 in the alignment apparatus 28 can be performed rapidly and correctly.

  The alignment device 28 is disposed between the robot arm 24 and the robot arm 30. The alignment device 28 aligns the pair of substrates 90. The alignment device 28 includes a frame body 34, a fixed stage 36, and a moving stage 38. The moving stage 38 moves in the horizontal plane and the vertical direction. As a result, the moving stage 38 transfers the substrate 90 and the substrate holder 94 that are turned upside down and transferred by the robot arm 24 to the fixed stage 36. Further, the moving stage 38 moves the substrate 90 and the substrate holder 94 that are transported without being turned over from the robot arm 24 to align with the substrate 90 of the fixed stage 36. Details of other alignment devices 28 will be described later.

  The robot arm 30 vacuum-sucks the substrate holder 94 including the pair of substrates 90 aligned by the moving stage 38 and conveys the substrate holder 94 to the vacuum environment unit 16. The robot arm 30 transports the bonded substrate 95 from the vacuum environment unit 16 to the robot arm 31. The robot arm 31 transports the bonded substrate 95 along the rail 32 to the substrate holder rack 22.

  The vacuum environment unit 16 is set to a high temperature and a vacuum state in the bonding process of the substrate bonding apparatus 10. The vacuum environment unit 16 includes a load lock chamber 48, a pair of access doors 50 and a gate valve 52, a robot arm 54, three storage chambers 55, three heating and pressurizing devices 56, a robot arm 58, The cooling chamber 60 is provided. Note that the number of the heating and pressing devices 56 is not limited to three, and may be changed as appropriate.

  The load lock chamber 48 connects the atmospheric environment unit 14 and the vacuum environment unit 16. The load lock chamber 48 can be set to a vacuum state and an atmospheric pressure. Openings are formed in the load lock chamber 48 on the atmosphere environment unit 14 side and the vacuum environment unit 16 side so that the superposed substrate 92 and the bonded substrate 95 held by the pair of substrate holders 94 can be conveyed.

  The access door 50 opens and closes the opening of the load lock chamber 48 on the atmosphere environment unit 14 side. The gate valve 52 opens and closes the opening of the load lock chamber 48 on the vacuum environment unit 16 side. The robot arm 54 carries the superposed substrate 92 carried into the load lock chamber 48 by the robot arm 30 into one of the heating and pressing devices 56.

  The storage chamber 55 has a gate valve 57 and is connected to the robot chamber 53 via the gate valve 57. The accommodation chamber 55 opens and closes the gate valve 57 in order to carry in and carry out the overlapping substrate 92 and the bonded substrate 95.

  The three heating / pressurizing devices 56 are arranged radially around the robot arm 54. The heating and pressing device 56 is bonded by heating and pressing while sandwiching the overlapping substrate 92. The heating and pressurizing device 56 can bond the overlapping substrate 92 carried in from the load lock chamber 48. Further, the heating and pressurizing device 56 can also cool the bonded substrate board 95.

  The robot arm 58 is rotatably arranged at the center of the robot chamber 53. Thereby, the robot arm 58 conveys the bonded substrate 95 from the heating / pressurizing device 56 to the cooling chamber 60. Further, the robot arm 58 transports the bonded substrate 95 from the cooling chamber 60 to the load lock chamber 48.

  The cooling chamber 60 has a cooling function. Thereby, the cooling chamber 60 cools the bonded substrate 95 bonded by the robot arm 58. The cooling chamber 60 is connected to the robot chamber 53 through a gate valve 57. The control unit 18 controls the overall operation of the substrate bonding apparatus 10.

  2 to 5 are diagrams for explaining a bonding process of the bonded substrate 95 by the substrate bonding apparatus 10. In the bonding step, first, the robot arm 24 transports the substrate holder 94 from the substrate holder rack 22 to the pre-aligner 26. The robot arm 24 transports the substrate 90 from any of the substrate cassettes 20 onto the substrate holder 94 of the pre-aligner 26. The pre-aligner 26 temporarily aligns the position of the substrate 90 with respect to the substrate holder 94. Thereafter, the substrate holder 94 holds the substrate 90.

  Next, as shown in FIG. 2, the robot arm 24 turns the substrate 90 and the substrate holder 94 upside down and conveys them from the pre-aligner 26 to the moving stage 38. The moving stage 38 transfers the substrate 90 and the substrate holder 94 to the fixed stage 36. Similarly, the robot arm 24 conveys the substrate holder 94 and the substrate 90 to the pre-aligner 26 in this order. Thereby, the substrate holder 94 holds the substrate 90. Thereafter, as shown in FIG. 3, the robot arm 24 transports the substrate 90 and the substrate holder 94 to the moving stage 38 without turning over.

  Next, the moving stage 38 moves below the fixed stage 36 that holds the substrate 90 and the substrate holder 94 while holding the substrate 90 and the substrate holder 94. Thereby, the substrate 90 of the movable stage 38 and the substrate 90 of the fixed stage 36 are aligned with each other.

  Next, as shown in FIG. 4, the moving stage 38 moves upward, and the upper surface of the substrate 90 of the moving stage 38 and the lower surface of the substrate 90 of the fixed stage 36 are brought together. Thereafter, the robot arm 30 transports the stacked substrate 92 on the moving stage 38 to the load lock chamber 48 with the substrate holder 94 interposed therebetween. The robot arm 54 carries the superimposed substrate 92 from the load lock chamber 48 to the heating and pressurizing device 56.

  Next, the heating and pressurizing device 56 heats the overlapping substrate 92 to the bonding temperature, and then pressurizes the overlapping substrate 92 from above and below while maintaining the bonding temperature. As a result, the pair of substrates 90 of the overlapping substrate 92 are bonded to form a bonded substrate 95. Thereafter, the bonded substrate 95 is cooled to a certain temperature, and then the robot arm 58 carries the bonded substrate 95 into the cooling chamber 60. The cooling chamber 60 further cools the bonded substrate 95. The robot arm 58 transports the cooled bonded substrate 95 together with the substrate holder 94 from the cooling chamber 60 to the load lock chamber 48.

  Next, the robot arm 30 carries the bonded substrate 95 out of the load lock chamber 48 and delivers it to the robot arm 31. The robot arm 31 conveys the bonded substrate 95 to the substrate holder rack 22. As shown in FIG. 5, the bonded substrate 95 is separated from the substrate holder 94 by the substrate holder rack 22. Thereafter, the robot arm 24 carries the bonded substrate board 95 to one of the substrate cassettes 20. Thereby, the bonding process by the board | substrate bonding apparatus 10 is complete | finished, and the bonded substrate board 95 is completed. After that, along the dotted line shown in FIG. 5, the laminated substrate 95 is separated into individual pieces, thereby completing the laminated semiconductor device 96.

  FIG. 6 is a side view of the alignment device 28. XYZ indicated by arrows in FIG. 6 is defined as the XYZ direction of the alignment device 28.

  The alignment device 28 includes an upper microscope 70 that is an example of an observation unit and a lower microscope 72 that is an example of an observation unit, in addition to the frame 34, the fixed stage 36, and the moving stage 38 described above.

  The frame 34 is formed so as to surround the fixed stage 36 and the moving stage 38. The frame body 34 includes a top plate 74, a bottom plate 75, and side walls 76. The top plate 74 and the bottom plate 75 are horizontally arranged so as to be parallel to each other. The side wall 76 connects the top plate 74 and the bottom plate 75 together. The surface of the side wall 76 on the side of the substrate cassette 20 and the surface of the side wall 76 on the side of the vacuum environment unit 16 are opened so that the substrate 90, the superimposed substrate 92 and the bonded substrate 95 can be carried in and out.

  The fixed stage 36 is fixed to the lower surface of the top plate 74. The fixed stage 36 is provided at a position higher than the moving stage 38. The lower surface of the fixed stage 36 is turned upside down by the robot arm 24 while holding the substrate 90 and vacuum-sucks the substrate holder 94 placed by the moving stage 38. Note that the lower surface of the fixed stage 36 may electrostatically attract the substrate holder 94.

  The moving stage 38 is placed on the upper surface of the bottom plate 75. The moving stage 38 includes a guide rail 78, an X stage 80, a Y stage 82, an elevating part 84, a fine movement stage 85, and a suction part 86.

  The guide rail 78 is fixed to the bottom plate 75. The guide rail 78 extends in the X direction. The X stage 80 is disposed on the bottom plate 75. The X stage 80 moves in the X direction while being guided by the guide rail 78. The Y stage 82 is disposed on the X stage 80. The Y stage 82 moves in the Y direction along the guide rail on the X stage 80. The elevating unit 84 is fixed to the upper surface of the Y stage 82. The raising / lowering part 84 raises / lowers the adsorption | suction part 86 up and down. The fine movement stage 85 moves the suction part 86 around the vertical axis while moving the suction part 86 in the XY directions. The fine movement stage 85 moves in the XY direction at a fine pitch and has a small movable range as compared with the movement of the X stage 80 and the Y stage 82.

  The upper surface of the suction portion 86 vacuum-sucks the substrate holder 94 holding the substrate 90. The bump Ba arranged on the substrate 90 adsorbed by the adsorbing portion 86 is electrically joined to the bump Ba arranged on the substrate 90 adsorbed by the fixed stage 36. The bump Ba is an example of a structure and an example of a connection portion. Note that the upper surface of the suction portion 86 may electrostatically attract the substrate holder 94. Further, the suction unit 86 is turned over by the robot arm 24 and holds the substrate 90 and the substrate holder 94 delivered to the fixed stage 36 while floating by pins. The adsorption part 86 is fixed to the upper surface of the elevating part 84. The suction unit 86 is moved in the XYZ directions by the X stage 80, the Y stage 82, and the elevating unit 84. As a result, the substrate 90 adsorbed by the adsorbing unit 86 is aligned with the substrate 90 adsorbed to the fixed stage 36 and then temporarily bonded in an overlapped state. The substrate 90 and the substrate 90 may be temporarily bonded with an adhesive or may be temporarily bonded with plasma. The substrate 90 and the substrate 90 may be simply overlapped.

  The upper microscope 70 is fixed to the top plate 74. The upper microscope 70 is disposed at a distance from the fixed stage 36. The upper microscope 70 observes and images the alignment mark M formed on the substrate 90 adsorbed by the adsorbing portion 86 of the moving stage 38. The alignment mark M arranged on the substrate 90 adsorbed by the adsorbing unit 86 is used for calculating the position of the substrate 90 and aligning the fixed stage 36 with the substrate 90 in bonding. The alignment mark M is formed on the upper surface of the substrate 90 that can be observed by the upper microscope 70. The upper microscope 70 outputs the captured image of the alignment mark M.

  The lower microscope 72 is fixed on the Y stage 82. The lower microscope 72 is disposed at a distance from the elevating unit 84. Therefore, the lower microscope 72 moves in the XY direction together with the lifting unit 84 and the suction unit 86. The lower microscope 72 observes and images the alignment mark M formed on the substrate 90 adsorbed to the fixed stage 36. The alignment mark M is formed on the lower surface of the substrate 90 that can be observed with the lower microscope 72. The lower microscope 72 outputs the captured image of the alignment mark M.

  FIG. 7 is a block diagram illustrating a control system of the alignment device 28. As shown in FIG. 7, the alignment apparatus 28 further includes a control unit 100 and a storage unit 102. The control unit 100 may also serve as the control unit 18. An example of the control unit 100 is a computer. The control unit 100 includes an acquisition unit 110, a positional relationship calculation unit 112, and an alignment unit 114. The control unit 100 functions as the acquisition unit 110, the positional relationship calculation unit 112, and the alignment unit 114 by reading the alignment program stored in the storage unit 102.

  The acquisition unit 110 is connected to the upper microscope 70 and the lower microscope 72 so as to be able to transmit and receive information. The acquisition unit 110 causes the upper microscope 70 and the lower microscope 72 to observe the same number of alignment marks M, and generates an image of the alignment mark M. The acquisition unit 110 acquires an image of the alignment mark M from the upper microscope 70 and the lower microscope 72. The image of the alignment mark M is an example of positional relationship information related to the measured mark position that is the measured position of the alignment mark M.

  The acquisition unit 110 is connected to an external device such as a bump manufacturing apparatus 120 that forms the bump Ba on the substrate 90 and an exposure apparatus 122 that exposes a pattern such as the bump Ba so that information can be transmitted and received. The acquisition unit 110 acquires the bump actual measurement position and the bump design position of the bump Ba with respect to the alignment mark M from an external device such as the bump manufacturing apparatus 120 or the exposure apparatus 122. An example of the measured bump relative position is the relative position of the bump Ba with respect to the actually observed alignment mark M. An example of the bump design position is the position of the bump Ba on the ideal substrate 90 in design. The bump measured relative position and the bump design position may be acquired for each substrate 90, or only the first substrate 90 may be acquired in the same manufacturing process, or acquired for the first plurality of substrates in the same manufacturing process. May be. The acquisition unit 110 acquires a bump actual measurement relative position and a bump design position associated with the substrate 90. The acquisition unit 110 outputs the acquired image of the alignment mark M, the bump actual relative position of the bump Ba, and the bump design position to the positional relationship calculation unit 112. The measured bump relative position is an example of positional relationship information related to the measured bump position, which is the measured bump position.

  The positional relationship calculation unit 112 acquires an image of the alignment mark M captured by the upper microscope 70 and the lower microscope 72 from the acquisition unit 110. The positional relationship calculation unit 112 calculates the mark actual measurement position of the alignment mark M from the acquired image of the alignment mark M. The mark actual measurement position is a position from the reference point of the fixed stage 36 and the moving stage 38. An example of the reference point is the center of the fixed stage 36 and the moving stage 38. The positional relationship calculation unit 112 calculates the mark measurement position from the position from the reference point and the position of the alignment mark M with respect to the center of the field of view of the upper microscope 70 and the lower microscope 72. The positional relationship calculation unit 112 acquires the mark design position of the alignment mark M from the storage unit 102. The positional relationship calculation unit 112 calculates a mark movement amount, which is a movement amount of the substrate 90 by the moving stage 38 necessary for moving the alignment mark M to the vicinity of the mark design position, from the mark actual measurement position and the mark design position. Here, not all alignment marks M can be accurately moved to the mark design position due to factors such as errors in the manufacturing process and bending of the substrate 90. Accordingly, the positional relationship calculation unit 112 calculates the mark movement amount so that the difference between the positions of all the alignment marks M after movement and the mark design positions becomes small.

  The positional relationship calculation unit 112 acquires the bump measured relative position and the bump design position, which are the positions of the measured bump Ba with respect to the alignment mark M, from the acquisition unit 110. The positional relationship calculation unit 112 calculates a bump actual measurement position that is a position where the bump Ba is actually measured with respect to the reference point, from the calculated actual measurement position of the alignment mark M and the acquired bump actual measurement relative position of the bump Ba.

  The positional relationship calculation unit 112 calculates a bump movement amount, which is a movement amount of the substrate 90 by the moving stage 38 necessary for moving the bump Ba to the vicinity of the bump design position, from the bump actual measurement position and the bump design position. Due to the above-mentioned factors, it is not possible to accurately move all the bumps Ba to the design position. Therefore, the positional relationship calculation unit 112 calculates the bump movement amount so that the difference between the bump movement position, which is the position of all the bumps Ba after movement, and the bump design position becomes small.

  The positional relationship calculation unit 112 calculates a movement amount from the mark movement amount and the bump movement amount and outputs the movement amount to the alignment unit 114. The amount of movement is the amount of movement of the moving stage 38 necessary for aligning the bumps Ba. In other words, the moving amount is an example of a relative positional relationship between the bump Ba of the substrate 90 of the fixed stage 36 and the bump Ba of the substrate 90 of the moving stage 38.

  The alignment unit 114 acquires the movement amount acquired from the positional relationship calculation unit 112. The alignment unit 114 aligns the bumps Ba by moving the movement stage 38 based on the acquired movement amount.

  The storage unit 102 stores the mark design position of the alignment mark M. The storage unit 102 stores an alignment program that causes the control unit 100 to function.

  FIG. 8 is a flowchart of the alignment process performed by the alignment device 28. FIG. 9 is a diagram for explaining the amount of mark movement necessary for alignment between the alignment marks M. FIG. FIG. 10 is a diagram for explaining the amount of bump movement necessary for alignment of the bumps Ba.

  As shown in FIG. 8, in the alignment process, the acquisition unit 110 acquires the bump actual measurement relative position and the bump design position from an external device such as the bump manufacturing apparatus 120 or the exposure apparatus 122, and sends it to the positional relationship calculation unit 112. Output (S10). The acquisition unit 110 acquires the image of the alignment mark M from the upper microscope 70 and the lower microscope 72, and outputs the acquired image to the positional relationship calculation unit 112 (S12).

  The positional relationship calculation unit 112 calculates the mark actual measurement position of the alignment mark M from the acquired image of the alignment mark M (S14). The positional relationship calculation unit 112 acquires the mark design position of the alignment mark M from the storage unit 102 (S16).

  The positional relationship calculation unit 112 calculates the movement amount from the bump actual measurement relative position, the bump design position, the mark actual measurement position, and the mark design position (S18).

  In calculating the movement amount, first, the positional relationship calculation unit 112 calculates the mark movement amount. As shown in FIG. 9, in the present embodiment, an example of calculating the mark movement amount of the three alignment marks M will be described. Here, first, a method of calculating the mark movement amount of the substrate 90 of the moving stage 38 will be described. The coordinates of the mark design position and the mark actual measurement position of the three alignment marks M on the substrate 90 of the moving stage 38 are (XMdan, YMdan) and (XMdbn, YMdbn), respectively. Further, the coordinates of the mark movement position, which is the position after the three alignment marks M at the actual measurement position are moved by the mark movement amount, are assumed to be (XMdcn, YMdcn). However, n = 1, 2, and 3. The amount of mark movement is (SMdx, SMdy, θMd). SMdx is the amount of movement of the moving stage 38 in the X direction. SMdy is the amount of movement of the moving stage 38 in the Y direction. θMd is the rotation angle of the moving stage 38 around the vertical axis.

The relationship between the mark actual measurement position and the mark movement position is expressed by the following equation using the mark movement amount corresponding to the movement stage 38 being able to move to XYθ.

Further, a mark movement amount (SMdx, SMdy, θMd) that minimizes the residual sum of squares of Equation (2) is calculated.

  As described above, the positional relationship calculation unit 112 uses the expressions (1) and (2) to determine the mark movement amounts (SMdx, SMdy) that statistically minimize the difference between all mark movement positions with respect to all mark design positions. , ΘMd).

  Next, in the calculation of the movement amount, the positional relationship calculation unit 112 calculates the bump movement amount of the substrate 90 of the movement stage 38. As shown in FIG. 10, in the present embodiment, an example of calculating the mark movement amount of the three bumps Ba will be described. The coordinates of the bump design position and the bump actual measurement position of the three bumps Ba on the substrate 90 of the moving stage 38 are (XBdan, YBdan) and (XBdbn, YBdbn), respectively. Further, the coordinates of the bump movement position, which is the position after the three bumps Ba at the bump actual measurement position are moved by the bump movement amount, are (XBdcn, YBdcn). However, n = 1, 2, and 3. The amount of bump movement is (SBdx, SBdy, θBd). Note that SBdx is the amount of movement of the moving stage 38 in the X direction. SBdy is the amount of movement of the moving stage 38 in the Y direction. θBd is the rotation angle of the moving stage 38 around the vertical axis.

The positional relationship calculation unit 112 uses the following formulas (3) and (4), and the bump movement amounts (SBdx, SBdy, SBdyx, SBdy, θBd) is calculated.

  The positional relationship calculation unit 112 sets the coordinates of the mark design position, the mark actual measurement position, and the mark movement position of the alignment mark M on the substrate 90 of the fixed stage 36 to (XMuan, YMuan), (XMubn, YMdbn), (XMucn, YMucn), respectively. As described above, the mark movement amounts (SMux, SMuy, θMu) are calculated in the same manner using the equations (1) and (2).

  The positional relationship calculation unit 112 sets the coordinates of the bump design position, actual bump measurement position, and bump movement position of the bump Ba on the substrate 90 of the fixed stage 36 as (XBuan, YBuan), (XBubn, YBdbn), and (XBucn, YBucn), respectively. Similarly, the amount of bump movement (SBux, SBuy, θBu) is calculated using equations (1) and (2).

The positional relationship calculation unit 112 substitutes the two calculated mark movement amounts and two bump movement amounts into the equation (5) to calculate the movement amount (Sx, Sy, θ), and the alignment unit. To 114.

  The alignment unit 114 moves the movement stage 38 according to the movement amount acquired from the positional relationship calculation unit 112 (S20). Thereby, the bump Ba of the substrate 90 of the fixed stage 36 and the bump Ba of the substrate 90 of the moving stage 38 are aligned. Thereafter, the alignment unit 114 raises the moving stage 38 to bring the bumps Ba into contact with each other.

  As described above, in the alignment apparatus 28, the positional relationship calculation unit 112 calculates the amount of movement necessary to align the bumps from the measured relative position, which is the positional relationship information between the alignment mark M and the bump Ba. ing. Thus, the alignment device 28 can accurately align the bumps even if the bump Ba is arranged without using the alignment mark M as a reference.

  Next, an alignment apparatus 28 in which a part of the above-described embodiment is changed will be described. In the alignment apparatus 28 according to the present embodiment, a part of the bump actual measurement position of the bump Ba is virtually calculated.

  FIG. 11 is a diagram for explaining a state in which the substrate 90 to which this embodiment is applied is divided into clusters Cl. FIG. 12 is a diagram for explaining the positional deviation between the alignment mark M and the bump Ba within one cluster Cl.

  As shown in FIG. 11, in the alignment apparatus 28 of the present embodiment, the positional relationship calculation unit 112 divides the first set of substrates 90 into a plurality of virtual clusters Cl. Here, the number of divided clusters Cl is four. In each cluster Cl, three alignment marks Ma1 to Ma3,..., Md3 to Md3 are formed. The acquisition unit 110 causes the upper microscope 70 and the lower microscope 72 to observe and image the plurality of alignment marks M for each cluster Cl. For example, when the image of the alignment mark Ma of the cluster Cla is acquired from the acquisition unit 110, the positional relationship calculation unit 112 calculates the mark actual measurement position of the alignment marks Ma1 to Ma3. As shown in FIG. 12, the positional relationship calculation unit 112 calculates the cluster center MC from the mark measured positions of the alignment marks Ma1 to Ma3.

  Next, the positional relationship calculation unit 112 acquires the bump actual relative position of the bump Ba from the external device via the acquisition unit 110. The positional relationship calculation unit 112 calculates a bump actual measurement position that is a position in the cluster of the bump Ba actually measured from the mark actual measurement position of the alignment mark M and the bump actual measurement relative position. The bump design position and the bump actual measurement position are (XB2an, YB2an) and (XB2bn, YB2bn), respectively. However, n = 1, 2,. The positional relationship calculation unit 112 calculates a cluster error that is an error between the bump design position and the bump actual measurement position for each cluster. Let the cluster error be (SDx, SDy, θD). SDx and SDy are XY components of the cluster error. θD is an angular component of the cluster error around the vertical axis passing through the center of the cluster Cl.

The bump position corrected by the cluster error from the bump actual measurement position is defined as a bump correction position (XB2cn, YB2cn). The relationship between the bump actual measurement position (XB2bn, YB2bn) and the bump correction position (XB2cn, YB2cn) can be expressed by the following equation (6).

Further, a cluster error (SB2x, SB2y, θB2) that minimizes the residual sum of squares of the equation (7) is calculated.

  As described above, the positional relationship calculation unit 112 uses the following formulas (6) and (7), and the cluster in which the difference between all the bump correction positions with respect to all the bump design positions in the cluster Cl is statistically minimized. The error (SB2x, SB2y, θB2) is calculated.

  The positional relationship calculation unit 112 similarly calculates cluster errors of other clusters. The positional relationship calculation unit 112 calculates the mark error position of the alignment mark M having the same design position as the alignment mark M of the first set on the second and subsequent sets of substrates 90, and then the cluster error, the bump actual measurement relative position, and From the mark measurement position, the virtual bump measurement position of the bump Ba in each cluster Cl is calculated. Thereby, the positional relationship calculation part 112 can reduce time required for calculation of the bump actual measurement position of a bump. Thereafter, the positional relationship calculation unit 112 applies the bump actual measurement position of the virtual bump as the bump actual measurement position described above, and calculates the movement amount necessary to align the bumps by the above method.

  The positional relationship calculation unit 112 has a bump position error that is an error between the bump actual measurement position of any one of the clusters Cl and the bump actual measurement position of the same cluster Cl in the first set is less than a predetermined bump position threshold. In this case, a virtual bump actual measurement position may be calculated. As a result, the positional relationship calculation unit 112 calculates the virtual bump actual measurement position only for the bump actual measurement position of the first set of substrates 90 and the substrate 90 of the correlated bump actual measurement position. The positioning accuracy can be maintained while shortening the calculation time.

  Further, the positional relationship calculation unit 112 may reduce the calculation of the actual measurement position of the alignment mark M when there is a correlation between the actual measurement positions of the alignment mark M of the substrate 90 in the first set and the second and subsequent sets. Good. For example, when the mark position error between the first set and the mark actual measurement position of the alignment mark M of the substrate 90 in any one of the second and subsequent sets is less than the mark position threshold, the positional relationship calculation unit 112 It is determined that the mark measurement position of the alignment mark M on the second set of substrates 90 has a relative relationship.

  Further, when the positional relationship calculation unit 112 determines that the mark actual measurement position has a relative relationship, the number of the mark actual measurement positions of the alignment mark M to be calculated in the second and subsequent sets of substrates 90 is larger than the number of the first group. cut back. In this case, the upper microscope 70 and the lower microscope 72 observe the alignment marks M corresponding to the alignment marks M observed in the first group on the second and subsequent substrates 90. The positional relationship calculation unit 112 calculates virtual mark actual measurement positions of the remaining alignment marks M from the observed alignment marks M in the second and subsequent sets of substrates 90. Thereby, since the positional relationship calculation part 112 can reduce the time which measures the alignment mark M, it can reduce the time which calculates a moving amount | distance.

  In the above-described embodiment, an example in which the acquisition unit 110 acquires the bump actual measurement relative position as the positional relationship information has been described. However, in the step of arranging the bump, information regarding the bump reference mark as a reference is related to the bump actual measurement position. You may acquire as positional relationship information. An example of information regarding the bump reference mark is information on the relative position of the actually measured bump reference mark with respect to the alignment mark M. The positional relationship calculation unit 112 calculates a bump actual measurement relative position or a bump actual measurement position from the bump reference mark.

  In the above-described embodiment, the example in which the semiconductor substrates on which the bumps are formed is aligned is shown. However, the technique of the above-described embodiment may be applied to an alignment apparatus that aligns the other two members. For example, in the nanoimprint, the above technique may be applied to an alignment apparatus that aligns an original and a substrate. The nanoimprint alignment device is a structure measurement position that is the actual measurement position of the structure provided on the original plate, and a mark measurement position that is the actual measurement position of the alignment mark placed on the original plate and used for alignment with the substrate. An alignment unit that aligns the original and the substrate using the acquired positional relationship information, the position of the alignment mark of the original, and the position of the alignment mark of the substrate. With. In the nanoimprint alignment apparatus, the alignment unit aligns the original plate and the substrate so that the structure overlaps a predetermined position of the substrate. In this case, the structure may function as a structure reference mark, or a structure reference mark may be provided separately from the structure. In addition, you may align based on the position shift of the structure design position which is a design position of a structure, and the measurement position of a structure.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

  The order of execution of each process such as operations, procedures, steps, and stages in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the description, and the drawings, even if it is described using “first”, “next”, etc. for convenience, it means that it is essential to carry out in this order. It is not a thing.

  DESCRIPTION OF SYMBOLS 10 Board | substrate bonding apparatus, 12 Environmental chamber, 14 Atmospheric environment part, 16 Vacuum environment part, 18 Control part, 20 Substrate cassette, 22 Substrate holder rack, 24 Robot arm, 26 Pre-aligner, 28 Alignment apparatus, 30 Robot arm, 31 Robot Arm, 32 Rail, 34 Frame, 36 Fixed stage, 38 Moving stage, 48 Load lock chamber, 50 Access door, 52 Gate valve, 53 Robot chamber, 54 Robot arm, 55 Storage chamber, 56 Heating and pressurizing device, 57 Gate Valve, 58 Robot arm, 60 Cooling chamber, 70 Upper microscope, 72 Lower microscope, 74 Top plate, 75 Bottom plate, 76 side walls, 78 guide rails, 80 X stage, 82 Y stage, 84 lifting / lowering part, 85 fine movement stage, 86 suction part, 90 substrate, 92 superposed substrate, 94 substrate holder, 95 bonded substrate, 96 laminated semiconductor device, 100 Control unit, 102 storage unit, 110 acquisition unit, 112 positional relationship calculation unit, 114 alignment unit, 120 bump manufacturing apparatus, 122 exposure apparatus

Claims (11)

An alignment apparatus for aligning a first member and a second member with each other,
The actual measurement position of the alignment mark used for alignment with the second member and the actual measurement position of the structure, which is the actual measurement position of the structure provided on the first member. An acquisition unit for acquiring positional relationship information related to a mark actual measurement position and a structure design position that is a design position of the structure;
Position for aligning the first member and the second member using the acquired positional relationship information, the position of the alignment mark of the first member, and the position of the alignment mark of the second member With a mating part,
The alignment unit is an alignment apparatus that aligns the first member and the second member such that the structure overlaps a predetermined position of the second member. The first member is a first semiconductor substrate, the second member is a second semiconductor substrate, the structure is provided on the first semiconductor substrate, and the second semiconductor The alignment apparatus according to claim 1, wherein the alignment apparatus is a connection part electrically connected to the substrate. A positional relationship calculation unit that calculates and outputs a relative positional relationship between the structure of the first semiconductor substrate and the structure of the second semiconductor substrate from the positional relationship information;
The alignment apparatus according to claim 2, wherein the structure of the first semiconductor substrate and the structure of the second semiconductor substrate are aligned based on the relative positional relationship.   The alignment apparatus according to any one of claims 1 to 3, wherein the positional relationship information related to the actually measured position of the structure includes information calculated from the position of the actually measured structure.   The positional relationship information related to the structure actual measurement position includes information on a position where the structure reference mark used as a reference in the step of arranging the structure is actually measured. Alignment equipment.   The alignment apparatus according to claim 3, further comprising an observation unit that observes the alignment mark and outputs an image to the acquisition unit. In aligning a plurality of sets of the first semiconductor substrate and the second semiconductor substrate,
The positional relationship calculation unit divides the first semiconductor substrate into a plurality of clusters, calculates an error of the structure actual measurement position with respect to the design position of the structure for each cluster, and sets other semiconductor substrates. The alignment apparatus according to claim 6, wherein a virtual structure actual measurement position is calculated from the actual measurement position of the alignment mark, the positional relationship information, and the error. The positional relationship calculation unit reduces the number of the actually measured positions of the alignment mark calculated in the subsequent group of the substrate from the number of the actually measured positions of the alignment mark calculated in the first group of the substrates. The alignment apparatus described in 1. The alignment apparatus according to claim 8, wherein the observation unit observes an alignment mark corresponding to the alignment mark used for calculating the actual measurement position in the first set of the substrates in a subsequent set of the substrates. An alignment method for aligning a first member and a second member with each other,
The actual measurement position of the alignment mark used for alignment with the second member and the actual measurement position of the structure, which is the actual measurement position of the structure provided on the first member. An acquisition step of acquiring positional relationship information related to the mark actual measurement position and the structure design position that is the design position of the structure;
Position for aligning the first member and the second member using the acquired positional relationship information, the position of the alignment mark of the first member, and the position of the alignment mark of the second member With a matching stage,
An alignment method for aligning the first member and the second member so that the structure overlaps a predetermined position of the second member in the alignment step.   A laminated semiconductor device manufactured by separating a pair of substrates aligned by the alignment apparatus according to claim 1.

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