TWI653190B - Alignment method and alignment device - Google Patents

Alignment method and alignment device Download PDF

Info

Publication number
TWI653190B
TWI653190B TW106142020A TW106142020A TWI653190B TW I653190 B TWI653190 B TW I653190B TW 106142020 A TW106142020 A TW 106142020A TW 106142020 A TW106142020 A TW 106142020A TW I653190 B TWI653190 B TW I653190B
Authority
TW
Taiwan
Prior art keywords
moving
bonding material
component
alignment
images
Prior art date
Application number
TW106142020A
Other languages
Chinese (zh)
Other versions
TW201925070A (en
Inventor
林世偉
劉冠志
張浩禎
Original Assignee
財團法人金屬工業研究發展中心
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 財團法人金屬工業研究發展中心 filed Critical 財團法人金屬工業研究發展中心
Priority to TW106142020A priority Critical patent/TWI653190B/en
Application granted granted Critical
Publication of TWI653190B publication Critical patent/TWI653190B/en
Publication of TW201925070A publication Critical patent/TW201925070A/en

Links

Landscapes

  • Length Measuring Devices By Optical Means (AREA)
  • Labeling Devices (AREA)

Abstract

本揭露提出一種對位方法,用以進行第一貼合料與第二貼合料的對位。所述對位方法包括:利用第一移動元件朝目標區域移動第一貼合料;在移動第一貼合料的過程中,拍攝第一貼合料的多張第一影像,其中各張第一影像包括第一標記;以及依據多個第一標記判斷第一貼合料與第二貼合料之間的角度偏差以及橫向誤差,並且依據角度偏差與該橫向誤差調整第一移動元件。此外,一種使用此方法的對位裝置亦被提出。The present disclosure proposes a registration method for performing alignment of a first bonding material and a second bonding material. The alignment method includes: moving a first bonding material toward the target area by using the first moving component; and capturing a plurality of first images of the first bonding material during the moving of the first bonding material, wherein each of the first images An image includes a first mark; and an angular deviation and a lateral error between the first adhesive and the second adhesive are determined according to the plurality of first marks, and the first moving element is adjusted according to the angular deviation and the lateral error. In addition, a aligning device using this method has also been proposed.

Description

對位方法與對位裝置Registration method and alignment device

本揭露是有關於一種對位方法與對位裝置。 The disclosure relates to a registration method and a registration device.

隨著科技的進步與市場的變化,手持終端的設計從窄邊框到無邊框,大螢幕佔比的需求不斷上升。在這樣的設計當中,可佈線的區域越來越小,而產品所需的組裝精度也就越來越高,越來越精密。除此之外,近年來軟性電子產品也越來越熱門,可撓式螢幕面板的需求量也隨之大增。 With the advancement of technology and the changes in the market, the design of handheld terminals ranges from narrow borders to no borders, and the demand for large screens continues to rise. In such a design, the area where the wiring can be made smaller and smaller, and the assembly precision required for the product is getting higher and higher, and more and more precise. In addition, in recent years, soft electronic products have become more and more popular, and the demand for flexible screen panels has also increased.

為了因應這些需求,廠商必須將自身的產能提升。因此,捲對捲(Roll-to-Roll,R2R)或捲對片(Roll-to-Sheet,R2S)等連續生產製造的手段便時常被應用在連續貼合的製程當中。然而,無論是捲對捲或是捲對片的製造手段,如何能夠提升貼合時的精確度都是重要的課題之一。 In order to meet these needs, manufacturers must increase their production capacity. Therefore, continuous manufacturing methods such as Roll-to-Roll (R2R) or Roll-to-Sheet (R2S) are often used in continuous bonding processes. However, whether it is a roll-to-roll or roll-to-piece manufacturing method, how to improve the accuracy of the fit is one of the important issues.

本揭露實施例提供一種對位方法與對位裝置,能夠準確地將貼合料進行對位,提升精準度與產能。 The disclosed embodiment provides a aligning method and a aligning device, which can accurately align the bonding materials, thereby improving accuracy and productivity.

本揭露實施例的對位方法用以進行第一貼合料與第二貼合料的對位。所述對位方法包括以下步驟:利用第一移動元件朝目標區域移動第一貼合料;在移動第一貼合料的過程中,拍攝第一貼合料的多張第一影像,其中各張第一影像包括第一標記;以及依據多個第一標記判斷第一貼合料與第二貼合料之間的角度偏差以及橫向誤差,並且依據角度偏差與該橫向誤差調整第一移動元件。 The alignment method of the embodiment of the present disclosure is for performing alignment of the first bonding material and the second bonding material. The aligning method includes the steps of: moving a first tiling material toward a target area by using a first moving component; and capturing a plurality of first images of the first tiling material during moving the first tiling material, wherein each The first image includes a first mark; and determining an angular deviation and a lateral error between the first adhesive and the second adhesive according to the plurality of first marks, and adjusting the first moving component according to the angular deviation and the lateral error .

本揭露實施例的對位裝置用於進行第一貼合料與第二貼合料的對位。所述對位裝置包括第一移動元件、第一影像擷取元件以及控制元件。第一移動元件用以朝目標區域移動第一貼合料。第一影像擷取元件用以在第一移動元件移動第一貼合料的過程中,拍攝第一貼合料的多張第一影像,其中各張第一影像包括第一標記。控制元件耦接於第一移動元件以及第一影像擷取元件,用以依據多個第一標記判斷第一貼合料與第二貼合料之間的角度偏差以及橫向誤差,並且依據角度偏差與橫向誤差調整第一移動元件。 The alignment device of the embodiment is used for performing alignment of the first bonding material and the second bonding material. The alignment device includes a first moving element, a first image capturing element, and a control element. The first moving element is configured to move the first applicator toward the target area. The first image capturing component is configured to capture a plurality of first images of the first adhesive during the moving of the first moving component, wherein each of the first images includes the first marking. The control component is coupled to the first moving component and the first image capturing component for determining an angular deviation and a lateral error between the first bonding material and the second bonding material according to the plurality of first markings, and according to the angular deviation Adjusting the first moving element with lateral error.

基於上述,本揭露實施例所提出的對位方法與對位裝置,在第一貼合料移動至貼合的目標區域的過程中就即時的拍攝多張第一貼合料的第一影像,並且分析出其在貼合時可能出現的誤差。此外,本揭露實施例更在持續移動第一貼合料時就根據影像分析的結果,調整負責移動第一貼合料的第一移動元件,整個過程中無須經過轉位的機制,能夠即時且精準的完成對位。 Based on the above, the alignment method and the alignment device proposed by the embodiment of the present disclosure immediately capture the first image of the plurality of first stickers in the process of moving the first bonding material to the bonding target area. And analyze the errors that may occur when fitting. In addition, the embodiment of the present disclosure adjusts the first moving component responsible for moving the first bonding material according to the result of the image analysis when continuously moving the first bonding material, and does not need to go through the indexing mechanism in the whole process, and can be instantaneously Accurate completion of the alignment.

為讓本揭露的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 The above described features and advantages of the present invention will be more apparent from the following description.

100‧‧‧對位裝置 100‧‧‧ alignment device

110‧‧‧第一移動元件 110‧‧‧First moving element

111‧‧‧對位平台 111‧‧‧ alignment platform

112‧‧‧長行程移載機構 112‧‧‧Long-term transfer mechanism

120‧‧‧第二移動元件 120‧‧‧Second moving element

130‧‧‧第一影像擷取元件 130‧‧‧First image capture component

140‧‧‧第二影像擷取元件 140‧‧‧Second image capture component

150‧‧‧控制元件 150‧‧‧Control elements

ERRMD‧‧‧縱向誤差 ERR MD ‧‧‧Vertical error

ERRTD‧‧‧橫向誤差 ERR TD ‧‧‧lateral error

ERRθ‧‧‧角度偏差 ERR θ ‧‧‧ angular deviation

M1‧‧‧第一貼合料 M1‧‧‧ first patch

M2‧‧‧第二貼合料 M2‧‧‧Second patch

m1i、m11、m12、m13‧‧‧第一標記 m 1i , m 11 , m 12 , m 13 ‧‧‧ first mark

m2i、m21、m22、m23‧‧‧第二標記 m 2i , m 21, m 22 , m 23 ‧‧‧ second mark

MD‧‧‧縱向 MD‧‧‧ portrait

S401~S410‧‧‧對位方法的步驟 Steps of the S401~S410‧‧‧ alignment method

TA‧‧‧目標區域 TA‧‧‧Target area

TD‧‧‧橫向 TD‧‧ transverse

TR1‧‧‧第一軌跡 TR1‧‧‧ first track

TR2‧‧‧第二軌跡 TR2‧‧‧ second track

圖1繪示本揭露一實施例中對位裝置的概要方塊圖。 1 is a schematic block diagram of a registration device in an embodiment of the present disclosure.

圖2繪示本揭露一實施例中對位裝置的側視示意圖。 2 is a side elevational view of the alignment device in an embodiment of the present disclosure.

圖3繪示本揭露一實施例中對位裝置的俯視示意圖。 3 is a top plan view of a aligning device in an embodiment of the present disclosure.

圖4繪示本揭露一實施例中對位方法的流程圖。 4 is a flow chart of a method for aligning an embodiment of the present disclosure.

圖5繪示本揭露一實施例中在移動貼合料的過程中拍攝影像的示意圖。 FIG. 5 is a schematic diagram of capturing an image during the process of moving a sticker in an embodiment of the present disclosure.

圖6繪示本揭露一實施例中第一軌跡與第二軌跡的示意圖。 FIG. 6 is a schematic diagram of a first track and a second track in an embodiment of the disclosure.

圖7繪示本揭露一實施例中調整縱向誤差的示意圖。 FIG. 7 is a schematic diagram of adjusting longitudinal errors in an embodiment of the present disclosure.

本揭露實施例所提出的對位方法與對位裝置可在貼合第一貼合料與第二貼合料時,進行第一貼合料與第二貼合料的對位。為了說明上的方便,本揭露實施例將以捲對片(Roll-ro-Sheet,R2S)的對位裝置作為示範例來說明對位方法,並且以捲料來作為對位時的目標,調整片料的行進速度與方向,以使第一貼合料(例如,片料)與第二貼合料(例如,捲料)能夠在目標區域中精準的貼合。 The alignment method and the alignment device proposed in the embodiment can perform the alignment of the first bonding material and the second bonding material when the first bonding material and the second bonding material are bonded. For convenience of description, the embodiment of the present disclosure will use a aligning device of a Roll-Ro-Sheet (R2S) as an example to illustrate the aligning method, and adjust the retort as the target at the time of alignment. The speed and direction of travel of the flakes enables the first applicator (e.g., flakes) to be accurately conformed to the second applicator (e.g., web) in the target area.

必須注意的是,本揭露並不限於此。在其他實施例中,本 揭露所提出的對位裝置也可實作為片對片(Sheet-to-Sheet,S2S)或捲對捲(Roll-to-Roll,R2R)的對位裝置,並應用本揭露所提出的對位方法。此外,在其他實施例中也可以片料來作為目標,並調整捲料的行進速度與方向,或同時調整片料與捲料等,以使第一貼合料與第二貼合料在目標區域中精準的貼合。 It must be noted that the disclosure is not limited to this. In other embodiments, this It is disclosed that the proposed aligning device can also be used as a aligning device for a Sheet-to-Sheet (S2S) or a Roll-to-Roll (R2R), and the alignment proposed by the disclosure is applied. method. In addition, in other embodiments, the sheet material may be used as a target, and the traveling speed and direction of the web may be adjusted, or the sheet material and the coil material may be adjusted at the same time, so that the first bonding material and the second bonding material are at the target. Precise fit in the area.

圖1繪示本揭露一實施例中對位裝置的概要方塊圖;圖2繪示本揭露一實施例中對位裝置的側視示意圖;圖3繪示本揭露一實施例中對位裝置的俯視示意圖。 1 is a schematic block diagram of a aligning device in an embodiment of the present disclosure; FIG. 2 is a side view of the aligning device in an embodiment of the present disclosure; A bird's eye view.

請參照圖1至圖3,本實施例的對位裝置100包括第一移動元件110、第二移動元件120、第一影像擷取元件130、第二影像擷取元件140以及控制元件150,其中控制元件150耦接於第一移動元件110、第二移動元件120、第一影像擷取元件130以及第二影像擷取元件140。在本實施例中,第一貼合料M1(例如,片料)與第二貼合料M2(例如,捲料)在目標區域TA中進行貼合,而對位裝置100是用以進行第一貼合料M1與第二貼合料M2的對位。 Referring to FIG. 1 to FIG. 3 , the alignment device 100 of the present embodiment includes a first moving component 110 , a second moving component 120 , a first image capturing component 130 , a second image capturing component 140 , and a control component 150 . The control component 150 is coupled to the first moving component 110 , the second moving component 120 , the first image capturing component 130 , and the second image capturing component 140 . In the present embodiment, the first bonding material M1 (for example, a sheet material) and the second bonding material M2 (for example, a coil material) are bonded in the target area TA, and the alignment device 100 is used to perform the first The alignment of the bonding material M1 and the second bonding material M2.

在本實施例中,第一移動元件110包括對位平台111以及長行程移載機構112。如圖2與圖3所示,對位平台111設置於長行程移載機構112之上,用以承載第一貼合料M1,並且長行程移載機構112可利用滾輪或其他方式來縱向MD(又稱機器方向(machine direction))移動對位平台111,以將第一貼合料M1朝向目標區域TA移動。 In the present embodiment, the first moving element 110 includes an alignment platform 111 and a long stroke transfer mechanism 112. As shown in FIG. 2 and FIG. 3, the alignment platform 111 is disposed on the long stroke transfer mechanism 112 for carrying the first bonding material M1, and the long stroke transfer mechanism 112 can utilize the roller or other means to longitudinal MD. (also referred to as machine direction) moves the registration platform 111 to move the first bonding material M1 toward the target area TA.

在本實施例中,相對於第一貼合料M1的調整,對位平台111具有兩個自由度,並且長行程移載機構112具有一個自由度。詳細來說,對位平台111能夠沿著橫向TD(又稱跨機器方向(cross-machine direction))移動第一貼合料M1,也能夠在縱向MD與橫向TD所形成的平面上轉動第一貼合料M1;而長行程移載機構112僅能夠在縱向MD上移動第一貼合料M1。 In the present embodiment, the alignment platform 111 has two degrees of freedom with respect to the adjustment of the first bonding material M1, and the long stroke transfer mechanism 112 has one degree of freedom. In detail, the alignment platform 111 can move the first bonding material M1 along the lateral direction TD (also referred to as a cross-machine direction), and can also rotate the first surface on the plane formed by the longitudinal MD and the lateral direction TD. The material M1 is attached; and the long stroke transfer mechanism 112 is only capable of moving the first bonding material M1 in the longitudinal direction MD.

值得一提的是,為了能夠實現連續而不中斷的製造流程,本揭露並不限制對位平台111的數量。換言之,第一移動元件110可例如具有一個、兩個或更多個對位平台111,輪流地將第一貼合料M1朝向目標區域TA移動。 It is worth mentioning that the disclosure does not limit the number of alignment platforms 111 in order to enable a continuous and uninterrupted manufacturing process. In other words, the first moving element 110 can have, for example, one, two or more alignment platforms 111 that alternately move the first admixture M1 toward the target area TA.

在本實施例中,第二移動元件120例如但不限於是滾壓輪,用以帶動作為捲料的第二貼合料M2以使其朝向目標區域TA移動。本實施例的目標區域TA是位於第二移動元件120(例如,滾壓輪)的正下方,而第二移動元件120將第二貼合料M2從滾壓輪的上方捲動至滾壓輪的下方。 In the present embodiment, the second moving element 120 is, for example but not limited to, a rolling wheel for taking the second bonding material M2 that acts as a coil to move toward the target area TA. The target area TA of the present embodiment is located directly below the second moving element 120 (eg, the rolling wheel), and the second moving element 120 rolls the second bonding material M2 from above the rolling wheel to the rolling wheel Below.

在本實施例中,第一影像擷取元件130例如包括一組配備有電荷耦合元件(Charge Coupled Device,CCD)、互補性氧化金屬半導體(Complementary Metal-Oxide Semiconductor,CMOS)元件或其他種類的感光元件的相機。在本實施例中,第一影像擷取元件130例如設置於對位平台111上方,並且朝向對位平台111,用以接收來自第一移動元件110或控制元件150的拍攝觸發訊號,並且根據拍攝觸發訊號來拍攝第一貼合料M1的第一影像。 In this embodiment, the first image capturing component 130 includes, for example, a set of Charge Coupled Device (CCD), Complementary Metal-Oxide Semiconductor (CMOS) components, or other kinds of photosensitive materials. Component camera. In this embodiment, the first image capturing component 130 is disposed above the alignment platform 111 and faces the alignment platform 111 for receiving a shooting trigger signal from the first moving component 110 or the control component 150, and according to the shooting. The trigger signal is used to capture the first image of the first bonding material M1.

在本實施例中,控制元件150例如是中央處理單元(Central Processing Unit,CPU)、微處理器(Microprocessor)、數位訊號處理器、可程式化控制器、特殊應用積體電路(Application Specific Integrated Circuits,ASIC)、可程式化邏輯裝置(Programmable Logic Device,PLD)或其他具有資料運算功能的元件。在本實施例中,控制元件150會從第一影像擷取元件130取得第一影像,並執行本揭露實施例所提出的對位方法,以分析第一影像並且對應地調整第一移動元件110來進行第一貼合料M1與第二貼合料M2的對位。 In this embodiment, the control component 150 is, for example, a central processing unit (CPU), a microprocessor (Microprocessor), a digital signal processor, a programmable controller, and an application specific integrated circuit (Application Specific Integrated Circuits). , ASIC), Programmable Logic Device (PLD) or other components with data processing functions. In this embodiment, the control component 150 obtains the first image from the first image capturing component 130 and performs the alignment method proposed by the disclosed embodiment to analyze the first image and adjust the first moving component 110 correspondingly. The alignment of the first bonding material M1 and the second bonding material M2 is performed.

值得一提的是,為了補償作為對位目標的第二貼合料M2在捲動過程中因為張力或其他因素所產生的偏差,本實施例更在第二移動元件120上方設置第二影像擷取元件140。第二影像擷取元件140是類似於第一影像擷取元件130,用以接收來自第二移動元件120或控制元件150的拍攝觸發訊號,並且根據拍攝觸發訊號來拍攝第二貼合料M2的第二影像。如此一來,即使第二貼合料M2在捲動過程中發生了偏差,控制元件150只要比較第一影像與第二影像,仍然能夠準確地將第一貼合料M1與第二貼合料M2進行對位。 It is worth mentioning that in order to compensate for the deviation of the second bonding material M2 as the alignment target due to tension or other factors during the scrolling process, the second image is further disposed above the second moving component 120. Take element 140. The second image capturing component 140 is similar to the first image capturing component 130 for receiving the shooting trigger signal from the second moving component 120 or the control component 150, and capturing the second bonding material M2 according to the shooting trigger signal. Second image. In this way, even if the second bonding material M2 is deviated during the scrolling process, the control component 150 can accurately compare the first bonding material M1 with the second bonding material by comparing the first image and the second image. M2 is aligned.

以下將搭配上述的對位裝置100來舉實施例說明本揭露的對位方法的詳細步驟。 The detailed steps of the alignment method of the present disclosure will be described below with reference to the above-described alignment device 100.

圖4繪示本揭露一實施例中對位方法的流程圖。 4 is a flow chart of a method for aligning an embodiment of the present disclosure.

請參照圖4,在步驟S401中,第一移動元件110朝目標 區域TA移動第一貼合料M1,並且在步驟S402中,第二移動元件120朝目標區域TA移動第二貼合料M2,以使第一貼合料M1與第二貼合料M2能夠在目標區域TA中進行貼合。具體的移動方式已於前述段落搭配圖1至圖3舉實施例說明,在此不再贅述。 Referring to FIG. 4, in step S401, the first moving component 110 faces the target. The area TA moves the first bonding material M1, and in step S402, the second moving element 120 moves the second bonding material M2 toward the target area TA so that the first bonding material M1 and the second bonding material M2 can The bonding is performed in the target area TA. The specific movement mode has been described in the foregoing paragraphs with reference to FIG. 1 to FIG. 3, and details are not described herein again.

在步驟S403中,在第一移動元件110移動第一貼合料M1的過程中,第一影像擷取元件130拍攝第一貼合料M1的多張第一影像,並且在步驟S404中,在第二移動元件120移動第二貼合料M2的過程中,第二影像擷取元件140拍攝第二貼合料M2的多張第二影像。 In step S403, in the process that the first moving component 110 moves the first bonding material M1, the first image capturing component 130 captures a plurality of first images of the first bonding material M1, and in step S404, During the movement of the second moving component 120 to the second bonding material M2, the second image capturing component 140 captures a plurality of second images of the second bonding material M2.

圖5繪示本揭露一實施例中在移動貼合料的過程中拍攝影像的示意圖。 FIG. 5 is a schematic diagram of capturing an image during the process of moving a sticker in an embodiment of the present disclosure.

詳細來說,第一移動元件110例如包括至少一個第一編碼器(encoder),用以指示第一移動元件110的絕對移動位置。在本實施例中,第一移動元件110的絕對移動位置例如為長行程移載機構112的縱向移動距離。當長行程移載機構112每將對位平台111沿縱向MD移動一特定距離時,第一移動元件110例如會發送拍攝觸發訊號至第一影像擷取元件130,而響應於拍攝觸發訊號,第一影像擷取元件130便會進行拍攝。若連續多次拍攝時第一貼合料M1皆位於第一影像擷取元件130的視角當中,則第一影像擷取元件130便能夠拍攝到第一貼合料M1的多張第一影像。如圖5所示,第一貼合料M1上依序包括多個等間距的第一標記m1i,i為自然數。在一實施例中,在拍攝每張第一影像的同時,控 制元件150會記錄下拍攝時第一移動元件110的絕對移動位置,以推算每張第一影像中的第一標記m1i的絕對位置。 In detail, the first moving element 110 includes, for example, at least one first encoder for indicating the absolute moving position of the first moving element 110. In the present embodiment, the absolute moving position of the first moving member 110 is, for example, the longitudinal moving distance of the long stroke transfer mechanism 112. When the long-stroke transfer mechanism 112 moves the alignment platform 111 by a certain distance in the longitudinal direction MD, the first moving component 110 sends a shooting trigger signal to the first image capturing component 130, for example, in response to the shooting trigger signal. An image capture component 130 will take a picture. If the first bonding material M1 is located in the viewing angle of the first image capturing component 130, the first image capturing component 130 can capture the plurality of first images of the first bonding material M1. As shown in FIG. 5, the first bonding material M1 sequentially includes a plurality of equally spaced first marks m 1i , i being a natural number. In an embodiment, while each first image is captured, the control component 150 records the absolute movement position of the first moving component 110 at the time of shooting to estimate the absolute value of the first marker m 1i in each of the first images. position.

類似地,第二移動元件120例如包括至少一個第二編碼器,用以指示第二移動元件120的絕對移動位置。在本實施例中,第二移動元件120的絕對移動位置例如為滾壓輪的捲動角度。當滾壓輪每捲動一特定角度時,第二移動元件120例如會發送拍攝觸發訊號至第二影像擷取元件140,而響應於拍攝觸發訊號,第二影像擷取元件140便會進行拍攝。若連續多次拍攝時第二貼合料M2皆位於第二影像擷取元件140的視角當中,則第二影像擷取元件140便能夠拍攝第二貼合料M2的多張第二影像。如圖5所示,第二貼合料M2上依序包括多個等間距的第二標記m2i,i為自然數。在一實施例中,在拍攝每張第二影像的同時,控制元件150會記錄下拍攝時第二移動元件120的絕對移動位置,以推算每張第二影像中的第二標記m2i的絕對位置。特別是,在本實施例中,第二標記m2i之間的間距與第一標記m1i之間的間距相同。 Similarly, the second moving element 120 includes, for example, at least one second encoder to indicate the absolute moving position of the second moving element 120. In the present embodiment, the absolute moving position of the second moving member 120 is, for example, the rolling angle of the rolling wheel. When the rolling wheel is rotated by a specific angle, the second moving component 120 sends a shooting trigger signal to the second image capturing component 140, for example, and in response to the shooting triggering signal, the second image capturing component 140 performs shooting. . If the second bonding material M2 is located in the viewing angle of the second image capturing component 140, the second image capturing component 140 can capture the plurality of second images of the second bonding material M2. As shown in FIG. 5, the second bonding material M2 sequentially includes a plurality of equally spaced second marks m 2i , i being a natural number. In an embodiment, while each second image is captured, the control component 150 records the absolute movement position of the second moving component 120 at the time of shooting to estimate the absolute value of the second marker m 2i in each second image. position. In particular, in the present embodiment, the spacing between the second marks m 2i is the same as the spacing between the first marks m 1i .

在步驟S405中,控制元件150會判斷多張第一影像的多個第一標記m1i的第一起始位置以及多個第一位置變化,並且在步驟S406中,控制元件150會判斷多個第二影像的多個第二標記m2i的第二起始位置以及多個第二位置變化。隨後在步驟S407中,控制元件150會依據第一起始位置、第二起始位置、第一位置變化以及第二位置變化來判斷第一貼合料M1與第二貼合料M2之間的角度偏差以及橫向誤差。 In step S405, the control component 150 determines a first starting position of the plurality of first marks m 1i of the plurality of first images and a plurality of first position changes, and in step S406, the control component 150 determines the plurality of The second starting position of the plurality of second marks m 2i of the two images and the plurality of second positions are changed. Then, in step S407, the control component 150 determines the angle between the first bonding material M1 and the second bonding material M2 according to the first starting position, the second starting position, the first position change, and the second position change. Deviation and lateral error.

在本實施例中,第一貼合料M1上的第一個第一標記m11是以特定的態樣呈現,並且第二貼合料M2上的第一個第二標記m21也是以特定的態樣呈現。據此,當控制元件150從第一影像擷取元件130所擷取的多張影像的其中之一發現具有上述特定態樣的第一標記m11,表示此影像為首張第一影像,此時控制元件150便會記錄下第一標記m11在此張第一影像中的位置作為第一起始位置。類似地,當控制元件150從第二影像擷取元件140所擷取的多張影像的其中之一發現具有上述特定態樣的第二標記m21,表示此影像為首張第二影像,此時控制元件150便會記錄下第二標記m21在此張第二影像中的位置作為第二起始位置。 In the present embodiment, the first first mark m 11 on the first bonding material M1 is presented in a specific aspect, and the first second mark m 21 on the second bonding material M2 is also specified. The appearance of the situation. According to this, when the control component 150 finds the first mark m 11 having the specific aspect from one of the plurality of images captured by the first image capturing component 130, the image is the first image of the first image. The time control element 150 records the position of the first mark m 11 in the first image as the first starting position. Similarly, when the control element 150 finds the second mark m 21 having the specific aspect from one of the plurality of images captured by the second image capturing component 140, the image is the first second image, The time control element 150 records the position of the second mark m 21 in the second image as the second starting position.

在取得第一起始位置以及第二起始位置後,控制元件150會繼續從多張第一影像中取得多個第一標記m1i,並且判斷多個第一標記m1i在多張第一影像中的多個第一位置變化,以及從多張第二影像中取得多個第二標記m2i,並且判斷多個第二標記m2i在多張第二影像中的多個第二位置變化。 After obtaining the first starting position and the second starting position, the control component 150 continues to obtain the plurality of first marks m 1i from the plurality of first images, and determines that the plurality of first marks m 1i are in the plurality of first images. a first plurality of the change in position, and a plurality of second mark m 2i made from a plurality of the second image, and determines a second plurality of the plurality of marks in a plurality of m 2i second image a second change in position.

圖6繪示本揭露一實施例中第一軌跡與第二軌跡的示意圖。 FIG. 6 is a schematic diagram of a first track and a second track in an embodiment of the disclosure.

舉例而言,控制元件150可例如從首張第一影像之後的兩張(例如,第2、3張)第一影像中,繼續取得兩個連續的第一標記m12、m13在兩張第一影像中的位置,並且計算出第一標記m12與第一標記m11在第1、2張第一影像中的第一位置變化,以及第一標記m13與第一標記m12在第2、3張第一影像中的第一位置變 化。據此,只要再搭配控制元件150所記錄的拍攝此三張第一影像時,第一移動元件110的各個絕對移動位置,便能夠描繪出如圖6所示的第一軌跡TR1。 For example, the control component 150 can continue to obtain two consecutive first marks m 12, m 13 in two (for example, the second and third) first images after the first first image. a position in the first image, and calculating a first position change of the first mark m 12 and the first mark m 11 in the first and second first images, and the first mark m 13 and the first mark m 12 are The first position in the first and third first images changes. Accordingly, the first trajectory TR1 as shown in FIG. 6 can be drawn by the respective absolute movement positions of the first moving element 110 when the three first images recorded by the control element 150 are captured.

另一方面,控制元件150可例如從首張第二影像之後的兩張(例如,第2、3張)第二影像中,繼續取得兩個連續的第二標記m22、m23在兩張第二影像中的位置,並且計算出第二標記m22與第一標記m21在第1、2張第二影像中的第二位置變化,以及第二標記m23與第二標記m22在第2、3張第二影像中的第二位置變化。據此,只要再搭配控制元件150所記錄的拍攝此三張第二影像時,第二移動元件120的絕對移動位置,便能夠描繪出如圖6所示的第二軌跡TR2。 On the other hand, the control element 150 can continue to obtain two consecutive second marks m 22, m 23 in two (for example, the second and third) second images after the first second image. a position in the second image, and calculating a second position change of the second mark m 22 and the first mark m 21 in the first and second second images, and the second mark m 23 and the second mark m 22 are The second position in the second and third second images changes. Accordingly, the second trajectory TR2 as shown in FIG. 6 can be drawn by the absolute movement position of the second moving element 120 when the three second images recorded by the control element 150 are captured.

接著,只要比較第一軌跡TR1與第二軌跡TR2,便能夠取得第一貼合料M1與第二貼合料M2之間的角度偏差ERRθ以及橫向誤差ERRTD。在本實施例中,控制元件150能夠基於上述的原理來依據第一起始位置、第二起始位置、第一位置變化以及第二位置變化,搭配其所記錄的絕對移動位置,統計取得第一貼合料M1與第二貼合料M2之間的角度偏差ERRθ以及橫向誤差ERRTDNext, by comparing the first track TR1 and the second track TR2, the angular deviation ERR θ and the lateral error ERR TD between the first bonding material M1 and the second bonding material M2 can be obtained. In this embodiment, the control component 150 can obtain the first statistically based on the first starting position, the second starting position, the first position change, and the second position change according to the principle described above, and the absolute moving position recorded therein. The angular deviation ERR θ between the bonding material M1 and the second bonding material M2 and the lateral error ERR TD .

值得一提的是,本揭露並不在此限制控制元件150在取得起始位置後所取得的多個位置變化的數量。舉例而言,當貼合料上兩兩標記的間距較小時,控制元件150能夠在相同時間內取得更多的位置變化也不致影響到對位的即時性。換言之,應用本揭露實施例的通常知識者當可基於本揭露實施例的教示來依其需求進 行調整。 It is worth mentioning that the disclosure does not limit the number of position changes that the control element 150 takes after obtaining the starting position. For example, when the spacing between the two marks on the bonding material is small, the control element 150 can obtain more positional changes in the same time without affecting the immediacy of the alignment. In other words, the general knowledge of the embodiments to which the present disclosure is applied can be adapted to the needs based on the teachings of the disclosed embodiments. Line adjustment.

在步驟S408中,控制元件150會依據第一貼合料M1與第二貼合料M2之間的角度偏差ERRθ以及橫向誤差ERRTD調整第一移動元件110。具體來說,控制元件150會利用對位平台111的兩個自由度,來旋轉第一貼合料M1,以使第一軌跡TR1平行於第二軌跡TR2,並且橫向平移第一貼合料M1,以對準第一軌跡TR1與第二軌跡TR2。特別是,由於本揭露實施例的第一影像擷取元件110與第二影像擷取元件120可以持續的拍攝影像,因此即使對位平台111一次的旋轉角度不足或橫向位移的幅度不夠,控制元件150仍然能夠從持續拍攝的多張第一影像與多張第二影像來以上述方式進行分析,並持續的調整對位平台111,直到第一貼合料M1與第二貼合料M2的行進軌跡能夠對準。 In step S408, the control element 150 adjusts the first moving element 110 according to the angular deviation ERR θ between the first bonding material M1 and the second bonding material M2 and the lateral error ERR TD . Specifically, the control element 150 uses the two degrees of freedom of the alignment platform 111 to rotate the first bonding material M1 such that the first trajectory TR1 is parallel to the second trajectory TR2 and laterally translating the first bonding material M1. To align the first track TR1 with the second track TR2. In particular, since the first image capturing component 110 and the second image capturing component 120 of the embodiment of the present disclosure can continuously capture images, even if the alignment angle of the alignment platform 111 is insufficient or the amplitude of the lateral displacement is insufficient, the control component 150 can still analyze from the plurality of first images and the plurality of second images that are continuously captured in the above manner, and continuously adjust the alignment platform 111 until the progress of the first bonding material M1 and the second bonding material M2 The trajectories can be aligned.

在步驟S409中,控制元件150會依據第一起始位置、第二起始位置、第一位置變化以及第二位置變化,判斷第一貼合料M1與第二貼合料M2的縱向誤差。 In step S409, the control component 150 determines the longitudinal error of the first bonding material M1 and the second bonding material M2 according to the first starting position, the second starting position, the first position change, and the second position change.

舉例來說,假設第一貼合料M1與第二貼合料M2的原始長度相同,但第一貼合料M1可能在移動的過程中受到應力作用而被拉長,且第二貼合料M2也可能會受到捲動過程中的應力而被拉長,而兩者被拉長的程度可能不同。因此,在本實施例中,控制元件150會估計兩者分別的拉長程度,並使第一貼合料M1與第二貼合料M2在貼合時的中點重合。 For example, it is assumed that the original length of the first bonding material M1 and the second bonding material M2 are the same, but the first bonding material M1 may be elongated by the stress during the moving process, and the second bonding material M2 may also be elongated by the stress during the rolling process, and the extent to which the two are elongated may be different. Therefore, in the present embodiment, the control element 150 estimates the degree of elongation of the two, and the first bonding material M1 and the second bonding material M2 coincide at the midpoint of the bonding.

請在參照圖6,在本實施例中,控制元件15例如會取各 第一標記m1i與各第二標記m2i在縱向MD的偏移量的平均值,來視為第一貼合料M1與第二貼合料M2的縱向誤差。值得一提的是,由於本實施例中第一標記m1i的間距與第二標記m2i的間距相同,因此取各第一標記m1i與各第二標記m2i在縱向MD的偏移量的平均值來作為縱向誤差,但本揭露並不限於此。在其他實施例中,根據不同的情況,縱向誤差也可以基於不同的計算細節而被統計出來。 Referring to FIG. 6 , in the present embodiment, the control element 15 takes the average value of the offsets of the first marks m 1i and the second marks m 2i in the longitudinal direction MD as the first bonding material, for example. The longitudinal error of M1 and the second bonding material M2. It is worth mentioning that, since the pitch of the first mark m 1i is the same as the pitch of the second mark m 2i in this embodiment, the offset of each first mark m 1i and each second mark m 2i in the longitudinal direction MD is taken. The average value is taken as a longitudinal error, but the disclosure is not limited thereto. In other embodiments, longitudinal errors may also be counted based on different computational details, depending on the circumstances.

隨後在步驟S410中,控制元件150會依據此縱向誤差來調整第一移動元件110。具體來說,本實施例的控制元件150會調整第一移動元件110的長行程移載機構112,盡可能使得第一貼合料M1與第二貼合料M2在貼合時的中點重合。 Then in step S410, the control element 150 adjusts the first moving element 110 in accordance with this longitudinal error. Specifically, the control element 150 of the present embodiment adjusts the long stroke transfer mechanism 112 of the first moving element 110 to make the first bonding material M1 and the second bonding material M2 coincide at the midpoint of the bonding. .

圖7繪示本揭露一實施例中調整縱向誤差的示意圖。 FIG. 7 is a schematic diagram of adjusting longitudinal errors in an embodiment of the present disclosure.

請參照圖7,控制元件150例如統計出第一貼合料M1與第二貼合料M2的縱向誤差為ERRMD。因此,控制元件150可例如控制長行程移載機構112的移動速度或直接將第一貼合料M1移動縱向誤差ERRMD的一半,使得第一貼合料M1在目標區域TA貼合時能夠貼合於第二貼合料M2的正中間。 Referring to FIG. 7, the control element 150 calculates, for example, that the longitudinal error of the first bonding material M1 and the second bonding material M2 is ERR MD . Therefore, the control element 150 can, for example, control the moving speed of the long stroke transfer mechanism 112 or directly move the first bonding material M1 by half of the longitudinal error ERR MD so that the first bonding material M1 can be attached when the target area TA is attached. It is in the middle of the second bonding material M2.

值得一提的是,圖7實施例是繪示的是第二貼合料M2被拉長的長度較第一貼合料M1長的情況,但本揭露並不限於此。在其他實施例中,第一貼合料M1被拉長的長度也可能較第二貼合料M2來的長,而控制元件150同樣可例如控制長行程移載機構112的移動速度或將第一貼合料M1移動縱向誤差ERRMD的一半, 以使第一貼合料M1在目標區域TA貼合時能夠貼合於第二貼合料M2的正中間。 It should be noted that the embodiment of FIG. 7 illustrates that the second bonding material M2 is elongated longer than the first bonding material M1, but the disclosure is not limited thereto. In other embodiments, the length of the first bonding material M1 may be longer than that of the second bonding material M2, and the control element 150 may also control, for example, the moving speed of the long-travel transfer mechanism 112 or The bonding material M1 moves half of the longitudinal error ERR MD so that the first bonding material M1 can be attached to the middle of the second bonding material M2 when the target area TA is attached.

此外,本揭露亦不限制控制元件150是調整第一貼合料M1貼合於第二貼合料M2時的相對位置。舉例而言,控制元件150也可以依據其所統計出來的縱向誤差ERRMD,調整長行程移載機構112使得第一貼合料M1的前端貼合於第二貼合料M2的前端等。換言之,本揭露並不在此限制控制元件150根據第一起始位置、第二起始位置、第一位置變化以及第二位置變化統計出第一貼合料M1與第二貼合料M2的縱向誤差後,控制長行程移載機構112調整第一貼合料M1的方式。所屬技術領域具備通常知識者可依其需求來進行調整。 In addition, the disclosure does not limit the relative position of the control element 150 when the first bonding material M1 is attached to the second bonding material M2. For example, the control element 150 may adjust the long stroke transfer mechanism 112 according to the longitudinal error ERR MD calculated by the control element 150 so that the front end of the first bonding material M1 is attached to the front end of the second bonding material M2 or the like. In other words, the disclosure does not limit the longitudinal error of the first bonding material M1 and the second bonding material M2 according to the first starting position, the second starting position, the first position change, and the second position change. Thereafter, the manner in which the long stroke transfer mechanism 112 adjusts the first bonding material M1 is controlled. Those skilled in the art can make adjustments according to their needs.

綜上所述,本揭露實施例所提出的對位方法與對位裝置,在第一貼合料移動至貼合的目標區域的過程中就即時的拍攝多張第一貼合料的第一影像,並且分析出其在貼合時可能出現的角度偏差、橫向誤差以及縱向誤差。此外,本揭露實施例更在持續移動第一貼合料時就根據影像分析的結果,調整負責移動第一貼合料的第一移動元件,整個過程中無須經過轉位的機制,能夠即時且精準的完成對位。 In summary, the alignment method and the alignment device proposed in the embodiment of the present invention directly capture the first plurality of first stickers in the process of moving the first bonding material to the bonding target area. Image, and analyze the angular deviation, lateral error, and longitudinal error that may occur during the fit. In addition, the embodiment of the present disclosure adjusts the first moving component responsible for moving the first bonding material according to the result of the image analysis when continuously moving the first bonding material, and does not need to go through the indexing mechanism in the whole process, and can be instantaneously Accurate completion of the alignment.

雖然本揭露已以實施例揭露如上,然其並非用以限定本揭露,任何所屬技術領域中具有通常知識者,在不脫離本揭露的精神和範圍內,當可作些許的更動與潤飾,故本揭露的保護範圍當視後附的申請專利範圍所界定者為準。 The present disclosure has been disclosed in the above embodiments, but it is not intended to limit the disclosure, and any person skilled in the art can make some changes and refinements without departing from the spirit and scope of the disclosure. The scope of protection of this disclosure is subject to the definition of the scope of the appended claims.

Claims (20)

一種對位方法,用以進行第一貼合料與第二貼合料的對位,所述對位方法包括:利用第一移動元件朝目標區域移動該第一貼合料;在移動該第一貼合料的過程中,拍攝該第一貼合料的多張第一影像,其中各該第一影像包括第一標記;以及依據該些第一標記判斷該第一貼合料與該第二貼合料之間的角度偏差以及橫向誤差,並且依據該角度偏差與該橫向誤差調整該第一移動元件。 An alignment method for performing alignment of a first bonding material and a second bonding material, the alignment method comprising: moving the first bonding material toward a target area by using a first moving component; a plurality of first images of the first bonding material, wherein each of the first images includes a first marking; and determining the first bonding material and the first marking according to the first markings An angular deviation between the two patches and a lateral error, and adjusting the first moving element according to the angular deviation and the lateral error. 如申請專利範圍第1項所述的對位方法,更包括:利用第二移動元件朝該目標區域移動該第二貼合料;以及在移動該第二貼合料的過程中拍攝該第二貼合料的多張第二影像,其中各該第二影像包括第二標記。 The aligning method of claim 1, further comprising: moving the second tiling material toward the target area by using the second moving element; and photographing the second part during moving the second affixing material a plurality of second images of the composite, wherein each of the second images comprises a second indicia. 如申請專利範圍第2項所述的對位方法,其中依據該些第一標記判斷該第一貼合料與該第二貼合料之間的該角度偏差以及該橫向誤差包括:判斷該些第一標記的第一起始位置以及多個第一位置變化;判斷該些第二標記的第二起始位置以及多個第二位置變化;以及依據該第一起始位置、該第二起始位置、該些第一位置變化以及該些第二位置變化判斷該角度偏差以及該橫向誤差。 The aligning method of claim 2, wherein determining the angular deviation between the first affix and the second affixing according to the first markings and the lateral error comprises: determining the a first starting position of the first mark and a plurality of first position changes; determining a second starting position of the second marks and a plurality of second position changes; and according to the first starting position, the second starting position The first position changes and the second position changes determine the angle deviation and the lateral error. 如申請專利範圍第3項所述的對位方法,更包括: 依據該第一起始位置、該第二起始位置、該些第一位置變化以及該些第二位置變化,判斷該第一貼合料與該第二貼合料的縱向誤差;以及依據該縱向誤差調整該第一移動元件。 For example, the alignment method described in claim 3 of the patent scope further includes: Determining a longitudinal error of the first bonding material and the second bonding material according to the first starting position, the second starting position, the first position changes, and the second position changes; and according to the vertical direction The error adjusts the first moving element. 如申請專利範圍第4項所述的對位方法,其中該第一貼合料為片料,並且該第二貼合料為捲料。 The aligning method of claim 4, wherein the first affixing material is a sheet material, and the second tiling material is a coil material. 如申請專利範圍第5項所述的對位方法,其中該第一移動元件包括對位平台以及長行程移載機構,其中該對位平台用以承載該第一貼合料,並且該長行程移載機構用以縱向移動該對位平台。 The aligning method of claim 5, wherein the first moving component comprises a aligning platform and a long-stroke transfer mechanism, wherein the aligning platform is configured to carry the first affixing material, and the long stroke The transfer mechanism is used to move the alignment platform longitudinally. 如申請專利範圍第6項所述的對位方法,其中依據該角度偏差與該橫向誤差調整該第一移動元件包括:依據該角度偏差旋轉該對位平台;以及依據該橫向誤差橫向移動該對位平台,其中依據該縱向誤差調整該第一移動元件包括:依據該縱向誤差移動該長行程移載機構。 The aligning method of claim 6, wherein adjusting the first moving element according to the angular deviation and the lateral error comprises: rotating the alignment platform according to the angular deviation; and laterally moving the pair according to the lateral error a platform, wherein adjusting the first moving element according to the longitudinal error comprises: moving the long-travel transfer mechanism according to the longitudinal error. 如申請專利範圍第1項所述的對位方法,其中拍攝該第一貼合料的該些第一影像的步驟包括:記錄拍攝各該第一影像時,該第一移動元件的絕對移動位置。 The aligning method of claim 1, wherein the step of capturing the first images of the first adhesive comprises: recording an absolute moving position of the first moving component when each of the first images is captured . 如申請專利範圍第2項所述的對位方法,其中拍攝該第二貼合料的該些第二影像的步驟包括:記錄拍攝各該第二影像時,該第二移動元件的絕對移動位置。 The aligning method of claim 2, wherein the step of capturing the second images of the second patch comprises: recording an absolute moving position of the second moving component when each of the second images is captured . 如申請專利範圍第1項所述的對位方法,其中該第一貼合料以及該第二貼合料為捲料。 The aligning method of claim 1, wherein the first affixing material and the second tiling material are coil materials. 一種對位裝置,用於進行第一貼合料與第二貼合料的對位,包括:第一移動元件,用以朝目標區域移動該第一貼合料;第一影像擷取元件,用以在該第一移動元件移動該第一貼合料的過程中,拍攝該第一貼合料的多張第一影像,其中各該第一影像包括第一標記;以及控制元件,耦接於該第一移動元件以及該第一影像擷取元件,用以依據該些第一標記判斷該第一貼合料與該第二貼合料之間的角度偏差以及橫向誤差,並且依據該角度偏差與該橫向誤差調整該第一移動元件。 a aligning device, configured to perform alignment of the first bonding material and the second bonding material, comprising: a first moving component for moving the first bonding material toward the target area; and a first image capturing component, The plurality of first images of the first adhesive are photographed during the movement of the first adhesive component by the first moving component, wherein each of the first images includes a first mark; and a control component is coupled The first moving component and the first image capturing component are configured to determine an angular deviation and a lateral error between the first bonding material and the second bonding material according to the first markings, and according to the angle The deviation and the lateral error adjust the first moving element. 如申請專利範圍第11項所述的對位裝置,更包括:第二移動元件,耦接於該控制元件,用以朝該目標區域移動該第二貼合料;以及第二影像擷取元件,耦接於該控制元件,用以在該第二移動元件移動該第二貼合料的過程中拍攝該第二貼合料的多張第二影像,其中各該第二影像包括第二標記。 The aligning device of claim 11, further comprising: a second moving component coupled to the control component for moving the second bonding material toward the target area; and a second image capturing component And the control component is configured to capture a plurality of second images of the second adhesive during the moving of the second adhesive component, wherein each of the second images includes a second mark . 如申請專利範圍第12項所述的對位裝置,其中該控制元件用以:判斷該些第一標記的第一起始位置以及多個第一位置變化;判斷該些第二標記的第二起始位置以及多個第二位置變化; 以及依據該第一起始位置、該第二起始位置、該些第一位置變化以及該些第二位置變化判斷該角度偏差以及該橫向誤差。 The aligning device of claim 12, wherein the control component is configured to: determine a first starting position of the first markings and a plurality of first position changes; and determine a second of the second markings a starting position and a plurality of second position changes; And determining the angular deviation and the lateral error according to the first starting position, the second starting position, the first position changes, and the second position changes. 如申請專利範圍第13項所述的對位裝置,其中該控制元件更用以:依據該第一起始位置、該第二起始位置、該些第一位置變化以及該些第二位置變化,判斷該第一貼合料與該第二貼合料的縱向誤差;以及依據該縱向誤差調整該第一移動元件。 The aligning device of claim 13, wherein the control component is further configured to: according to the first starting position, the second starting position, the first position changes, and the second position changes, Determining a longitudinal error of the first applicator and the second applicator; and adjusting the first moving element according to the longitudinal error. 如申請專利範圍第14項所述的對位裝置,其中該對位裝置為片對捲對位裝置,其中該第一貼合料為片料,並且該第二貼合料為捲料。 The alignment device of claim 14, wherein the alignment device is a wafer-to-roll alignment device, wherein the first bonding material is a sheet material, and the second bonding material is a coil material. 如申請專利範圍第15項所述的對位裝置,其中該第一移動元件包括:對位平台,用以承載該第一貼合料;以及長行程移載機構,用以縱向移動該對位平台。 The alignment device of claim 15, wherein the first moving component comprises: a positioning platform for carrying the first bonding material; and a long-travel transfer mechanism for longitudinally moving the alignment platform. 如申請專利範圍第16項所述的對位裝置,其中該控制元件用以:依據該角度偏差旋轉該對位平台;依據該橫向誤差橫向移動該對位平台;以及依據該縱向誤差移動該長行程移載機構。 The alignment device of claim 16, wherein the control component is configured to: rotate the alignment platform according to the angular deviation; laterally move the alignment platform according to the lateral error; and move the length according to the longitudinal error Travel transfer mechanism. 如申請專利範圍第11項所述的對位裝置,其中該第一移動元件更包括:第一編碼器,耦接於該控制元件,用以指示該第一移動元件的絕對移動位置,其中該控制元件更用以記錄拍攝各該第一影像時,該第一移動元件的該絕對移動位置。 The aligning device of claim 11, wherein the first moving component further comprises: a first encoder coupled to the control component for indicating an absolute moving position of the first moving component, wherein the The control component is further configured to record the absolute moving position of the first moving component when each of the first images is captured. 如申請專利範圍第12項所述的對位裝置,其中該第二移動元件更包括:第二編碼器,耦接於該控制元件,用以指示該第二移動元件的絕對移動位置,其中該控制元件更用以記錄拍攝各該第二影像時,該第二移動元件的該絕對移動位置。 The aligning device of claim 12, wherein the second moving component further comprises: a second encoder coupled to the control component for indicating an absolute moving position of the second moving component, wherein the The control component is further configured to record the absolute moving position of the second moving component when each of the second images is captured. 如申請專利範圍第11項所述的對位裝置,其中該對位裝置為捲對捲對位裝置,並且該第一貼合料以及該第二貼合料為捲料。The aligning device of claim 11, wherein the aligning device is a roll-to-roll aligning device, and the first tiling material and the second tiling material are coil materials.
TW106142020A 2017-11-30 2017-11-30 Alignment method and alignment device TWI653190B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW106142020A TWI653190B (en) 2017-11-30 2017-11-30 Alignment method and alignment device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW106142020A TWI653190B (en) 2017-11-30 2017-11-30 Alignment method and alignment device

Publications (2)

Publication Number Publication Date
TWI653190B true TWI653190B (en) 2019-03-11
TW201925070A TW201925070A (en) 2019-07-01

Family

ID=66590742

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106142020A TWI653190B (en) 2017-11-30 2017-11-30 Alignment method and alignment device

Country Status (1)

Country Link
TW (1) TWI653190B (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005251972A (en) 2004-03-04 2005-09-15 Nikon Corp Method and apparatus for superimposing wafers
TWI248874B (en) 2004-11-19 2006-02-11 Ind Tech Res Inst Alignment-mounting method for substrate
TWM463664U (en) 2013-05-17 2013-10-21 Tian Yu Technology Co Ltd Panel laminating equipment with image alignment fine-tuning control
CN101828250B (en) 2007-08-15 2014-05-07 株式会社尼康 Aligning apparatus, bonding apparatus, laminated substrate manufacturing apparatus, exposure apparatus and aligning method
JP2014116519A (en) 2012-12-11 2014-06-26 Nikon Corp Alignment device, aligning method and laminate semiconductor device
TWI489224B (en) 2013-12-10 2015-06-21 Metal Ind Res & Dev Ct Different Position Method of Different Diameter Substrate
TWI575645B (en) 2016-06-06 2017-03-21 盟立自動化股份有限公司 Method for aligning object on alignment platform by utilizing two cameras, method for aligning and gluing substrate of display panel, and method for aligning upper and lower substrates of display panel

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005251972A (en) 2004-03-04 2005-09-15 Nikon Corp Method and apparatus for superimposing wafers
TWI248874B (en) 2004-11-19 2006-02-11 Ind Tech Res Inst Alignment-mounting method for substrate
CN101828250B (en) 2007-08-15 2014-05-07 株式会社尼康 Aligning apparatus, bonding apparatus, laminated substrate manufacturing apparatus, exposure apparatus and aligning method
JP2014116519A (en) 2012-12-11 2014-06-26 Nikon Corp Alignment device, aligning method and laminate semiconductor device
TWM463664U (en) 2013-05-17 2013-10-21 Tian Yu Technology Co Ltd Panel laminating equipment with image alignment fine-tuning control
TWI489224B (en) 2013-12-10 2015-06-21 Metal Ind Res & Dev Ct Different Position Method of Different Diameter Substrate
TWI575645B (en) 2016-06-06 2017-03-21 盟立自動化股份有限公司 Method for aligning object on alignment platform by utilizing two cameras, method for aligning and gluing substrate of display panel, and method for aligning upper and lower substrates of display panel

Also Published As

Publication number Publication date
TW201925070A (en) 2019-07-01

Similar Documents

Publication Publication Date Title
US10068872B2 (en) Mounting apparatus and method of correcting offset amount of the same
CN106289062B (en) A kind of bearing calibration of benchmark camera offset
JP2017062262A5 (en)
US9193143B2 (en) Precision overprinting method of printed electronics rotary printing where location can be adjusted in real time
JP6421722B2 (en) Image processing apparatus, calibration method, and calibration program
CN108807224A (en) For by the device and method of component be installed on substrate
WO2020073940A1 (en) Method and device for calibrating print positioning platform of crystalline silicon photovoltaic solar cell on the basis of machine vision
KR101375189B1 (en) Electronic device mounting apparatus
JP2010541293A5 (en)
CN103733138A (en) Method for correcting alignment of substrate to be exposed, and exposure device
CN108136764A (en) The transfer device of electronic equipment and the transfer method of electronic equipment
CN112792814B (en) Mechanical arm zero calibration method based on visual marks
CN111174696B (en) Laser-assisted calibration method based on CCD sensor
JP2011030015A5 (en)
JP3744251B2 (en) Electronic component mounting method
WO2015045649A1 (en) Component mounting device
JP6889778B2 (en) Component mounting device
TWI653190B (en) Alignment method and alignment device
KR101300192B1 (en) Precision Registration Method of Gravure offset Printing for Printed Electronics
JP3613055B2 (en) Substrate alignment method in screen printing
TWI716009B (en) Image calibrating method and related monitoring camera system
JP2006041006A (en) Bonding method and apparatus for semiconductor chip
CN108063104A (en) For adjusting the system of the relative position between the component of engagement device
TWI651794B (en) Method for correcting chip apparatus and chip apparatus using the method
JP2013170829A (en) Strain measuring device and strain measuring method