TWI651794B - Method for correcting chip apparatus and chip apparatus using the method - Google Patents

Method for correcting chip apparatus and chip apparatus using the method Download PDF

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TWI651794B
TWI651794B TW106118460A TW106118460A TWI651794B TW I651794 B TWI651794 B TW I651794B TW 106118460 A TW106118460 A TW 106118460A TW 106118460 A TW106118460 A TW 106118460A TW I651794 B TWI651794 B TW I651794B
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image
holding member
correcting
correction
image sensing
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TW201903929A (en
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盧彥豪
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梭特科技股份有限公司
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Abstract

本發明係提供一種置晶設備的校正方法,用於校正置晶設備的持取構件在置晶平面中各個預定位置的誤差,該校正方法包含使影像感測構件擷取含有基準校正構件的基準位置影像的基準校正影像擷取步驟、擷取顯示出持取構件與基準校正構件之相對位置關係的對位影像之對位影像擷取步驟、以及影像處理計算步驟,計算出持取構件在位置對應於基準校正構件之狀態下,持取構件與預定位置之間的差值,並對應產生持取構件對應該預定位置的補償校正值。本發明並提供一種使用該校正方法的置晶設備。 The present invention provides a method for correcting a crystallizing apparatus for correcting errors of respective predetermined positions of a holding member of a crystallizing apparatus in a crystal plane, the correction method comprising: causing an image sensing member to draw a reference including a reference correcting member The reference image correcting image capturing step of the position image, the collating image capturing step of the aligning image showing the relative positional relationship between the holding member and the reference correcting member, and the image processing calculating step, and calculating the position of the holding member Corresponding to the state of the reference correcting member, the difference between the holding member and the predetermined position is taken, and the compensation correction value corresponding to the predetermined position of the holding member is generated correspondingly. The present invention also provides a crystallizing apparatus using the correction method.

Description

置晶設備的校正方法及使用該方法的置晶設備 Method for correcting crystallizing device and crystallizing device using the same

本發明相關於一種置晶設備的校正方法及使用該方法的置晶設備,特別是相關於一種校正在一置晶平面中各個預定位置的誤差之置晶設備的校正方法及使用該方法的置晶設備。 The present invention relates to a method for calibrating a crystallizing apparatus and a crystallizing apparatus using the same, and more particularly to a method for correcting a crystallizing apparatus for correcting errors at respective predetermined positions in a crystal plane and using the method Crystal equipment.

在半導體晶圓級封裝的製程中,必須將晶圓切割成複數晶粒,再從中挑出良品,重新配置到基板上以進行後續的加工。在重新配置的過程中,由於精密製程的因素,故對晶粒置放位置、排列的精確度有極為嚴格的要求,通常要求微米以下甚至更小的精確度。為了確保置晶的高精確度,傳統的置晶設備通常在機械手臂前加裝一個與機械手臂連動的影像感測構件,由於影像感測構件與機械手臂之間的位置差距為已知,故利用影像感測構件所拍攝的影像可推算出機械手臂的位置。 In the process of semiconductor wafer level packaging, the wafer must be cut into a plurality of crystal grains, and then the good products are picked out and reconfigured onto the substrate for subsequent processing. In the process of reconfiguration, due to the precision process, the accuracy of the placement and arrangement of the crystal grains is extremely strict, and the accuracy below micron or less is usually required. In order to ensure the high precision of the crystal, the conventional crystal setting device usually adds an image sensing member linked with the robot arm in front of the robot arm. Since the position difference between the image sensing member and the robot arm is known, The position of the robot arm can be derived from the image captured by the image sensing member.

然而,實際上機械手臂與影像感測構件之間的位置差距並不總是保持恆定,機械手臂在移動一段距離後,實際位置往往與預定位置之間存有誤差,因而導致機械手臂與影像感測構件之間的位置差距在置晶平面上的各處都有所不同。且這個位置差距會隨著溫度(熱膨脹造成置晶設備結構變形)、設備狀況(例如移動軸的平滑程度)而波動。因此,導致機械手臂與影像感測構件之間在置晶平面上的各個置晶位置都出現程度不一的誤差,且這個誤差難以 被測量而無法校正,導致影像感測構件無法正確、精確地推算出機械手臂的位置,進而使得置放的晶粒無法排列整齊。 However, in fact, the position difference between the robot arm and the image sensing member is not always constant, and after the robot arm moves for a certain distance, there is an error between the actual position and the predetermined position, thereby causing the robot arm and the image sense. The positional difference between the members is different everywhere on the crystal plane. And this positional difference fluctuates with temperature (deformation of the crystallizer structure due to thermal expansion) and equipment conditions (such as the smoothness of the moving axis). Therefore, a degree of error occurs in each of the crystallographic positions on the crystal plane between the robot arm and the image sensing member, and this error is difficult. Being measured and unable to be corrected, the image sensing member cannot accurately and accurately calculate the position of the robot arm, so that the placed crystal grains cannot be arranged neatly.

因此,為解決上述問題,本發明的目的即在提供一種校正在一置晶平面中的誤差之置晶設備的校正方法及使用該方法的置晶設備。 Accordingly, in order to solve the above problems, it is an object of the present invention to provide a method of correcting a crystallizing apparatus for correcting errors in a crystal plane and a crystallizing apparatus using the same.

本發明為解決習知技術之問題所採用之技術手段係提供一種置晶設備的校正方法,用於校正一置晶設備的一持取構件在一置晶平面中各個預定位置的誤差,該置晶設備包括一置晶機構及一對位機構,該置晶機構包括該持取構件及一影像感測構件,該對位機構包括一對位影像感測構件及一設於該置晶平面的基準校正構件,其中該持取構件用以持取一晶粒或一標記件,該校正方法包含:一基準校正影像擷取步驟,在該影像感測構件於一預定位置而位置對應該基準校正構件的狀態下,該影像感測構件擷取一含有該基準校正構件的基準位置影像;一對位影像擷取步驟,使該持取構件位置對應於該基準校正構件,並利用該對位影像感測構件,在該持取構件位置對應於該基準校正構件之狀態下,擷取一顯示出該持取構件持取之該標記件與該基準校正構件之相對位置關係的對位影像;以及一影像處理計算步驟,係比對該對位影像與該基準位置影像,計算出該持取構件在位置對應於該基準校正構件之狀態下,該持取構件件與該預定位置之間的差值,並對應產生該持取構件對應該預定位置的一補償校正值。 The technical means adopted by the present invention to solve the problems of the prior art provides a method for correcting a crystallizing device for correcting errors of a predetermined position of a holding member of a crystallizing device in a crystal plane. The crystal device includes a crystal arranging mechanism and a pair of positioning mechanism, the crystallization mechanism includes the holding member and an image sensing member, the aligning mechanism includes a pair of image sensing members and a plane disposed on the crystal plane a reference correction member, wherein the holding member is configured to hold a die or a marking member, the correction method comprises: a reference correction image capturing step, wherein the image sensing member is correspondingly corrected in position at a predetermined position In the state of the member, the image sensing member captures a reference position image containing the reference correction member; a pair of bit image capturing steps, the position of the holding member corresponds to the reference correction member, and the alignment image is utilized a sensing member, in a state in which the position of the holding member corresponds to the reference correcting member, capturing a mark indicating that the holding member held by the holding member is opposite to the reference correcting member And an image processing calculation step, wherein the holding member is calculated in a state that the holding member is in position corresponding to the reference correcting member, and the positional image and the reference position image are calculated a difference from the predetermined position, and correspondingly generating a compensation correction value corresponding to the predetermined position of the holding member.

在本發明的一實施例中係提供一種置晶設備的校正方法,係為依序進行該基準校正影像擷取步驟、該對位影像擷取步驟以及該影像處理計算步驟。 In an embodiment of the invention, a method for correcting a crystallizing device is provided, which is a step of sequentially performing the reference correction image capturing step, the alignment image capturing step, and the image processing calculating step.

在本發明的一實施例中係提供一種置晶設備的校正方法,依序進行該對位影像擷取步驟、該基準校正影像擷取步驟以及該影像處理計算步驟。 In an embodiment of the invention, a method for correcting a crystallizing device is provided, wherein the alignment image capturing step, the reference corrected image capturing step, and the image processing calculating step are sequentially performed.

在本發明的一實施例中係提供一種置晶設備的校正方法,於該影像處理計算步驟後更包括一逐序校正步驟,係依照該持取構件的置晶順序,在各個預定位置重複該基準校正影像擷取步驟、該對位影像擷取步驟以及該影像處理計算步驟,而依序計算該持取構件在各個預定位置的補償校正值。 In an embodiment of the present invention, a method for correcting a crystallizing device is provided. After the image processing calculation step, a step-by-step correction step is further included, and the method is repeated at each predetermined position according to a seeding sequence of the holding member. The reference correction image capturing step, the alignment image capturing step, and the image processing calculating step, and sequentially calculating the compensation correction values of the holding members at respective predetermined positions.

在本發明的一實施例中係提供一種置晶設備的校正方法,於該逐序校正步驟後更包括一置晶步驟,使該影像感測構件擷取一實際待置晶區域影像並以影像辨識決定一待置晶位置,而使該持取構件持取該晶粒以依據該待置晶位置所對應的補償校正值置晶。 In an embodiment of the present invention, a method for correcting a crystallizing device is provided. After the step of correcting the step, a step of crystallizing is further included, so that the image sensing component captures an image of the actual to-be-crystallized region and images the image. The identification determines a position to be crystallized, and the holding member holds the die to be crystallized according to a compensation correction value corresponding to the position to be crystallized.

本發明為解決習知技術之問題所採用之另一技術手段係提供一種置晶設備,用於在一置晶平面置晶,該置晶設備包含:一置晶機構,包括一持取構件及一影像感測構件,該持取構件用以持取一晶粒或一標記件;一對位機構,包括一基準校正構件及一對位影像感測構件,該對位影像感測構件在光路上對應該基準校正構件,其中在該影像感測構件於一預定位置而位置對應該基準校正構件的狀態下,該影像感測構件擷取一含有該基準校正構件的基準位置影像;以及一校正系統,包括:一移動控制單元,連接該持取構件,該移動控制單元經配置而使該持取構件移動至該預定位置而使該持取構件位置對應於該基準校正構件;一對位影像擷取控制單元,連接該對位影像感測構件,在該持取構件位置對應於該基準校正構件之狀態下,該對位影像擷取控制單元經配置而使該對位影像感測構件擷取一顯示出該持取構件持取之該標記件與該基準校正構件之相對位置關係的對位影像;以及一影像處理計算控制單元,連接該對位影像感測構件、該影像感測構件及該移動控制單元,該影像處理計算控制單元比對該對位影像與該基準位置影像,計算出該持取構件在位置對應於該基準校正構件之狀態下,該持取構件與該預定位置之間的差值,並對應產生該持取構件對應該預定位置的一補償校正值。 Another technical means for solving the problems of the prior art is to provide a crystal device for crystallizing in a crystal plane, the crystal device comprising: a crystal mechanism comprising a holding member and An image sensing member for holding a die or a marking member; a pair of positioning mechanisms including a reference correcting member and a pair of bit image sensing members, the alignment image sensing member being in the light a reference correction member is disposed on the road, wherein the image sensing member captures a reference position image containing the reference correction member in a state where the image sensing member corresponds to the reference correction member at a predetermined position; and a correction The system includes: a movement control unit coupled to the holding member, the movement control unit configured to move the holding member to the predetermined position such that the holding member position corresponds to the reference correction member; a pair of bit images The capturing control unit is connected to the aligning image sensing member, and the aligning image capturing control unit is matched in a state that the holding member position corresponds to the reference correcting member And causing the alignment image sensing component to capture a registration image showing a relative positional relationship between the marker and the reference correction component held by the holding member; and an image processing calculation control unit connecting the alignment The image sensing member, the image sensing member, and the movement control unit, the image processing calculation control unit calculates a state in which the holding member corresponds to the reference correction member at the position of the alignment image and the reference position image And a difference between the holding member and the predetermined position, and correspondingly generating a compensation correction value corresponding to the predetermined position of the holding member.

在本發明的一實施例中係提供一種置晶設備,該基準校正構件為一光罩或一具有影像特徵標誌的透光構件。 In an embodiment of the invention, a crystal setting device is provided, the reference correction member being a photomask or a light transmissive member having an image signature.

在本發明的一實施例中係提供一種置晶設備,該基準校正構件的上表面與該置晶平面齊平。 In an embodiment of the invention, a crystal setting apparatus is provided, the upper surface of the reference correction member being flush with the crystallographic plane.

在本發明的一實施例中係提供一種置晶設備,該對位影像感測構件係設置為直接朝向該基準校正構件以直接擷取該對位影像。 In an embodiment of the invention, a crystal setting device is provided, the alignment image sensing member being disposed directly toward the reference correction member to directly capture the alignment image.

在本發明的一實施例中係提供一種置晶設備,該對位機構更包括一反射鏡,設置為與該基準校正構件夾一傾斜角度以使該對位影像感測構件透過該反射鏡擷取該對位影像。 In an embodiment of the invention, a crystal setting device is provided. The alignment mechanism further includes a mirror disposed to be inclined at an angle to the reference correction member to pass the alignment image sensing member through the mirror. Take the alignment image.

經由本發明所採用之技術手段,可精確地校正持取構件在置晶平面中的各個預定位置的誤差,而能根據各位置的誤差進行補償校正,使持取構件在預定位置的誤差能被彌補,藉此大幅提高置晶的精確度。 Through the technical means adopted by the present invention, the error of each predetermined position of the holding member in the crystal plane can be accurately corrected, and the compensation correction can be performed according to the error of each position, so that the error of the holding member at the predetermined position can be Make up, thereby greatly improving the accuracy of the crystal.

本發明所採用的具體實施例,將藉由以下之實施例及附呈圖式作進一步之說明。 The specific embodiments of the present invention will be further described by the following examples and the accompanying drawings.

100‧‧‧置晶設備 100‧‧ ‧ crystallizing equipment

100a‧‧‧置晶設備 100a‧‧ ‧ crystallizing equipment

1‧‧‧置晶機構 1‧‧ ‧ crystallizing mechanism

11‧‧‧持取構件 11‧‧‧ Holding components

111‧‧‧標記件 111‧‧‧Markings

12‧‧‧影像感測構件 12‧‧‧Image sensing components

2‧‧‧對位機構 2‧‧‧ Alignment agency

21‧‧‧基準校正構件 21‧‧‧ benchmark correction component

22‧‧‧對位影像感測構件 22‧‧‧ Alignment image sensing component

22a‧‧‧對位影像感測構件 22a‧‧‧ Alignment image sensing component

23‧‧‧反射鏡 23‧‧‧Mirror

2a‧‧‧對位機構 2a‧‧‧ Alignment agency

3‧‧‧校正系統 3‧‧‧ calibration system

31‧‧‧移動控制單元 31‧‧‧Mobile Control Unit

32‧‧‧對位影像擷取控制單元 32‧‧‧ Alignment image capture control unit

33‧‧‧影像處理計算控制單元 33‧‧‧Image Processing Calculation Control Unit

F‧‧‧置晶平面 F‧‧‧ crystal plane

M1‧‧‧基準位置影像 M1‧‧‧ reference position image

M2‧‧‧對位影像 M2‧‧‧ alignment image

S101‧‧‧基準校正影像擷取步驟 S101‧‧‧Reference corrected image capture step

S102‧‧‧對位影像擷取步驟 S102‧‧‧ Alignment image capture step

S103‧‧‧影像處理計算步驟 S103‧‧‧Image processing calculation steps

第1圖為顯示根據本發明一實施例的置晶設備的校正方法之流程圖。 1 is a flow chart showing a method of correcting a crystallizing apparatus according to an embodiment of the present invention.

第2圖為顯示根據本發明的實施例的置晶設備的影像感測構件擷取基準位置影像之示意圖。 2 is a schematic diagram showing an image sensing member capturing a reference position image according to an embodiment of the present invention.

第3圖為顯示根據本發明的對位影像感測構件擷取對位影像之示意圖。 FIG. 3 is a schematic diagram showing the alignment image captured by the alignment image sensing member according to the present invention.

第4圖為顯示根據本發明的實施例的基準位置影像之示意圖。 Fig. 4 is a schematic view showing a reference position image according to an embodiment of the present invention.

第5圖為顯示根據本發明的實施例的對位影像之示意圖。 Figure 5 is a schematic diagram showing a registration image in accordance with an embodiment of the present invention.

第6圖為顯示根據本發明的實施例的影像處理計算步驟之假想示意圖。 Fig. 6 is a schematic diagram showing an image processing calculation step according to an embodiment of the present invention.

第7圖為顯示根據本發明另一實施例的置晶設備之示意圖。 Fig. 7 is a view showing a crystal placing apparatus according to another embodiment of the present invention.

以下根據第1圖至第7圖,而說明本發明的實施方式。該說明並非為限制本發明的實施方式,而為本發明之實施例的一種。 Hereinafter, embodiments of the present invention will be described with reference to Figs. 1 to 7 . This description is not intended to limit the embodiments of the invention, but is an embodiment of the invention.

參閱第1圖所示,並配合參閱第2圖至第6圖,本實施例之說明如下。本發明一實施例的置晶設備的校正方法,用於校正一置晶設備100的一持取構件11在一置晶平面F中各個預定位置的誤差。置晶設備100包括一置晶機構1、一對位機構2及一校正系統3。本實施例的校正方法包含一基準校正影像擷取步驟S101、一對位影像擷取步驟S102及一影像處理計算步驟S103。 Referring to Fig. 1, and referring to Figs. 2 to 6, the description of this embodiment is as follows. A method for correcting a crystallizing apparatus according to an embodiment of the present invention is for correcting an error of a predetermined position of a holding member 11 of a crystallizing apparatus 100 in a crystal plane F. The crystal device 100 includes a crystal seeding mechanism 1, a pair of position mechanisms 2, and a correction system 3. The correction method of this embodiment includes a reference correction image capturing step S101, a pair of bit image capturing step S102, and an image processing calculating step S103.

置晶機構1包括一持取構件11及一影像感測構件12,持取構件11用以持取一晶粒或一標記件111。在本實施例中,持取構件11係為一吸取式的真空吸嘴,標記件111為一具有標記圖案的光罩,但本發明不限於此。 The crystallizing mechanism 1 includes a holding member 11 and an image sensing member 12 for holding a die or a marking member 111. In the present embodiment, the holding member 11 is a suction type vacuum nozzle, and the marking member 111 is a photomask having a marking pattern, but the invention is not limited thereto.

對位機構2包括一基準校正構件21及一對位影像感測構件22,對位影像感測構件22在光路上對應基準校正構件21。基準校正構件21為一光罩或一具有影像特徵標誌的透光構件,在本實施例中,基準校正構件21的上表面與置晶平面F齊平,且基準校正構件21係為透光。 The registration mechanism 2 includes a reference correction member 21 and a pair of bit image sensing members 22, and the registration image sensing member 22 corresponds to the reference correction member 21 on the optical path. The reference correction member 21 is a photomask or a light transmissive member having an image signature. In the present embodiment, the upper surface of the reference correction member 21 is flush with the crystal plane F, and the reference correction member 21 is light transmissive.

校正系統3包括一移動控制單元31、一對位影像擷取控制單元32及一影像處理計算控制單元33。移動控制單元31連接持取構件11,對位影像擷取控制單元32連接對位影像感測構件22,影像處理計算控制單元33連接對位影像感測構件22、影像感測構件12及移動控制單元31。 The correction system 3 includes a movement control unit 31, a pair of bit image capture control unit 32, and an image processing calculation control unit 33. The movement control unit 31 is connected to the holding member 11 , and the alignment image capturing control unit 32 is connected to the alignment image sensing member 22 . The image processing calculation control unit 33 is connected to the alignment image sensing member 22 , the image sensing member 12 and the movement control. Unit 31.

接著說明本發明實施例的置晶設備100如何執行該校正方法。 Next, how the crystal setting apparatus 100 of the embodiment of the present invention performs the correction method will be described.

參考第2圖,於基準校正影像擷取步驟S101,在影像感測構件12於一預定位置而位置對應基準校正構件21的狀態下,影像感測構件12擷取一含有 基準校正構件21的基準位置影像M1。基準校正構件21於影像感測構件12的視野即如第4圖所示。 Referring to FIG. 2, in the reference corrected image capturing step S101, in a state where the image sensing member 12 is positioned to correspond to the reference correcting member 21 at a predetermined position, the image sensing member 12 captures a The reference position image M1 of the reference correction member 21. The field of view of the reference correction member 21 on the image sensing member 12 is as shown in Fig. 4.

於對位影像擷取步驟S102,如第3圖所示,移動控制單元31經配置而使持取構件11移動從而使持取構件11位置對應基準校正構件21。在本實施例中,係移動控制使持取構件11移動到前述的預定位置而位置對應基準校正構件21。在本實施例中,係為利用線性光學尺或位置編碼器等方式得知持取構件11當下的位置,而使持取構件11自一待命位置或前一個位置移動到該預定位置,且本發明不限於此。藉由本次移動,使持取構件11將標記件111在Z方向上疊於基準校正構件21的上方而貼於置晶平面F。然而,由於機械震動、溫度、摩擦力等總總原因,持取構件11移動至該預定位置時通常會出現程度不一的誤差,而無法完美重合影像感測構件12的預定位置。因此,接下來的步驟便要計算持取構件11與該預定位置之間的差值。 In the aligning image capturing step S102, as shown in FIG. 3, the movement control unit 31 is configured to move the holding member 11 so that the position of the holding member 11 corresponds to the reference correcting member 21. In the present embodiment, the movement control causes the holding member 11 to move to the aforementioned predetermined position and the position corresponds to the reference correcting member 21. In this embodiment, the position of the holding member 11 is known by using a linear optical scale or a position encoder, and the holding member 11 is moved from a standby position or a previous position to the predetermined position, and The invention is not limited to this. By this movement, the holding member 11 is attached to the crystal plane F by superimposing the marker 111 on the upper side of the reference correction member 21 in the Z direction. However, due to the total cause of mechanical shock, temperature, friction, etc., when the holding member 11 is moved to the predetermined position, a degree of error often occurs, and the predetermined position of the image sensing member 12 cannot be perfectly overlapped. Therefore, the next step is to calculate the difference between the holding member 11 and the predetermined position.

在持取構件11位置對應於基準校正構件21之狀態下,對位影像擷取控制單元32經配置而使對位影像感測構件22擷取一顯示出持取構件11持取之標記件111與基準校正構件21之相對位置關係的對位影像M2(如第5圖所示)。 In a state where the position of the holding member 11 corresponds to the reference correcting member 21, the aligning image capturing control unit 32 is configured to cause the aligning image sensing member 22 to capture a marker 111 that displays the holding member 11 The registration image M2 (as shown in Fig. 5) in the relative positional relationship with the reference correction member 21.

如第5圖所示,在本實施例中,標記件111的表面具有複數個排列的圓圈形標記圖案;如第4圖及第5圖所示,基準校正構件21的表面在本實施例中為網格狀的圖案,但本發明不限於此,標記件111及基準校正構件21之圖案、排列方式亦可以為其他的標記樣式。 As shown in FIG. 5, in the present embodiment, the surface of the marking member 111 has a plurality of arranged circle-shaped marking patterns; as shown in FIGS. 4 and 5, the surface of the reference correcting member 21 is in this embodiment. It is a grid-like pattern, but the present invention is not limited thereto, and the pattern and arrangement of the marker 111 and the reference correction member 21 may be other marking patterns.

參考第6圖,接著於影像處理計算步驟S103,影像處理計算控制單元33比對對位影像M2與基準位置影像M1,計算出持取構件11在位置對應於基準校正構件21之狀態下,持取構件11與該預定位置之間的差值,該差值包含位置及角度誤差,並對應產生持取構件11於對應該預定位置的一補償校正值。舉例來說,如第6圖所示,米字標記為表示預定位置(可為影像感測構件12內建的比 對基準點,也可以是基準位置影像M1中特定位置的像素,或經影像辨識的特定區域)若圓圈標記與米字標記位置為重合,代表持取構件11與預定位置之間沒有誤差。而第6圖顯示為圓圈標記與米字標記之間有部分位差,代表該預定位置與持取構件11之間存有誤差,這個差值(包含位置及角度)可藉由計算圓圈標記與米字標記之間的位差及角度而得知。 Referring to FIG. 6, in the image processing calculation step S103, the image processing calculation control unit 33 compares the registration image M2 with the reference position image M1, and calculates that the holding member 11 is in the state corresponding to the reference correction member 21, The difference between the member 11 and the predetermined position is taken, the difference including the position and angle error, and correspondingly produces a compensation correction value of the holding member 11 at a predetermined position. For example, as shown in FIG. 6, the meter is marked to indicate a predetermined position (which may be a built-in ratio of the image sensing member 12). For the reference point, it may also be a pixel at a specific position in the reference position image M1, or a specific area recognized by the image. If the circle mark coincides with the position of the rice mark, there is no error between the holding member 11 and the predetermined position. Figure 6 shows a partial difference between the circle mark and the meter mark, indicating that there is an error between the predetermined position and the holding member 11, and the difference (including the position and angle) can be calculated by calculating the circle mark and The difference between the meters and the angle between the marks is known.

影像處理計算步驟S103的精神為,由於影像感測構件12無法直接拍攝持取構件11而得知持取構件11的真實位置,故利用透光的基準校正構件21當作比對的基準點,將基準位置影像M1與對位影像M2中的基準校正構件21疊合,即可推算出持取構件11在位置對應於基準校正構件21之狀態下在影像感測構件12原先的視野中的位置,而算出該預定位置與持取構件11之間的差值,並對應產生持取構件11對應該預定位置的補償校正值。 The spirit of the image processing calculation step S103 is that since the image sensing member 12 cannot directly capture the holding member 11 and knows the true position of the holding member 11, the light-receiving reference correction member 21 is used as a reference point for comparison. By superimposing the reference position image M1 on the reference correction member 21 in the registration image M2, the position of the holding member 11 in the original field of view of the image sensing member 12 in a state where the position corresponds to the reference correction member 21 can be estimated. And calculating the difference between the predetermined position and the holding member 11, and correspondingly generating the compensation correction value corresponding to the predetermined position of the holding member 11.

補償校正值可為包含X、Y方向及角度的數值,例如,經影像分析得到預定位置與持取構件11之間的誤差數值為在XY平面上的(-1,-1,-0.1°),則對應產生補償校正值為(1,1,0.1°)。 The compensation correction value may be a value including the X, Y direction and the angle. For example, the error value between the predetermined position and the holding member 11 obtained by image analysis is (-1, -1, -0.1°) on the XY plane. , the corresponding correction correction value is (1, 1, 0.1°).

然而本發明不限於此,可以藉由各種可能的影像處理及計算方式比對基準位置影像M1與對位影像M2,算出預定位置與持取構件11之間的誤差,進而計算出持取構件11對應該預定位置的補償校正值。 However, the present invention is not limited thereto, and the error between the predetermined position and the holding member 11 can be calculated by comparing the reference position image M1 and the registration image M2 by various possible image processing and calculation methods, thereby calculating the holding member 11 The compensation correction value corresponding to the predetermined position.

參考第2圖及第3圖,進一步地,在本實施例中,對位機構2更包括一反射鏡23,設置為與基準校正構件21夾一傾斜角度以使對位影像感測構件22透過反射鏡23擷取對位影像M2。藉由這樣的設置,可以折疊對位機構2在Z方向上的長度,而有利於置晶設備100縮減體積。 Referring to FIG. 2 and FIG. 3, further, in the embodiment, the alignment mechanism 2 further includes a mirror 23 disposed at an oblique angle with the reference correction member 21 to allow the alignment image sensing member 22 to pass through. The mirror 23 captures the alignment image M2. With such an arrangement, the length of the alignment mechanism 2 in the Z direction can be folded, which is advantageous for the crystallizer 100 to reduce the volume.

如第7圖所示,進一步地,在另一個實施例中,置晶設備100a的對位機構2a僅包括基準校正構件21及對位影像感測構件22a。基準校正構件21與前 一實施例完全相同,而對位影像感測構件22a設置為直接朝向基準校正構件21以直接擷取對位影像M2。藉由這樣的設置,可以減少元件的數量而降低生產成本。 As shown in FIG. 7, further, in another embodiment, the alignment mechanism 2a of the crystal device 100a includes only the reference correction member 21 and the alignment image sensing member 22a. Reference correction member 21 and front An embodiment is identical, and the aligning image sensing member 22a is disposed directly toward the reference correcting member 21 to directly capture the aligning image M2. With such an arrangement, the number of components can be reduced and the production cost can be reduced.

進一步地,在本實施例的校正方法中,於影像處理計算步驟S103後更包括一逐序校正步驟及於逐序校正步驟後的一置晶步驟。 Further, in the correction method of the embodiment, after the image processing calculation step S103, a sequence correction step and a seeding step after the sequence correction step are further included.

逐序校正步驟係依照持取構件11的置晶順序,在各個預定位置重複基準校正影像擷取步驟S101、對位影像擷取步驟S102以及影像處理計算步驟S103。而影像處理計算控制單元33依序計算持取構件11在各個預定位置的補償校正值。 The sequential correction step repeats the reference correction image capturing step S101, the registration image capturing step S102, and the image processing calculating step S103 at respective predetermined positions in accordance with the seeding order of the holding member 11. The image processing calculation control unit 33 sequentially calculates the compensation correction values of the holding members 11 at respective predetermined positions.

舉例來說,根據置晶順序,各個預定位置的補償校正值可例如下表所示。 For example, the compensation correction values for the respective predetermined positions may be, for example, as shown in the following table according to the crystallographic order.

接著於置晶步驟,可將對位機構2撤去並換上預備置晶的基板。影像處理計算控制單元33係使影像感測構件12擷取該基板上的一實際待置晶區域影像並以影像辨識決定一待置晶位置,而使持取構件11持取一晶粒以依據該待置晶位置所對應的補償校正值置晶。例如以影像辨識決定的待置晶位置的座標為(100,100),則對應的補償校正值為(+0.1,+0.2,0.01°),持取構件11以(+0.1,+0.2,0.01°)補償位置及角度並執行置晶。又由於基準校正構件21的上表面與置晶平面F齊平,而置晶平面F就是對位機構2撤去後在同一位置所擺放的置晶基板的表面,故由前述對位影像擷取步驟S102至影像處理計算步驟S103所計算出來的誤差是完全符合實際置晶情況,而不會受到持取構件11在Z方向上的變化的影響。 Next, in the seeding step, the alignment mechanism 2 can be removed and replaced with a substrate to be crystallized. The image processing calculation control unit 33 causes the image sensing member 12 to capture an actual image of the area to be crystallized on the substrate and determine a position to be crystallized by image recognition, so that the holding member 11 holds a die according to the image. The compensation correction value corresponding to the position to be crystallized is crystallized. For example, if the coordinate of the position to be crystallized determined by image recognition is (100, 100), the corresponding compensation correction value is (+0.1, +0.2, 0.01°), and the holding member 11 is (+0.1, +0.2, 0.01°). Compensate the position and angle and perform crystallization. Moreover, since the upper surface of the reference correction member 21 is flush with the crystal plane F, and the crystal plane F is the surface of the crystal substrate placed at the same position after the alignment mechanism 2 is removed, the image is captured by the alignment image. The error calculated in step S102 to the image processing calculation step S103 is completely in accordance with the actual crystallizing condition, and is not affected by the change of the holding member 11 in the Z direction.

值得注意的是,在本實施例中係為依序進行基準校正影像擷取步驟S101、對位影像擷取步驟S102以及影像處理計算步驟S103作為說明;然而本發明不限於此,亦可以為依序進行對位影像擷取步驟S102、基準校正影像擷取步驟S101以及影像處理計算步驟S103。換句話說,基準校正影像擷取步驟S101及對位影像擷取步驟S102之間的順序可調換,只要能分別擷取到基準位置影像M1及對位影像M2,以執行影像處理計算步驟S103。 It should be noted that, in this embodiment, the reference correction image capturing step S101, the aligning image capturing step S102, and the image processing calculating step S103 are sequentially performed as the description; however, the present invention is not limited thereto, and may be The aligning image capturing step S102, the reference corrected image capturing step S101, and the image processing calculating step S103 are sequentially performed. In other words, the order between the reference corrected image capturing step S101 and the aligning image capturing step S102 can be changed as long as the reference position image M1 and the aligning image M2 can be respectively captured to perform the image processing calculating step S103.

以上之敘述以及說明僅為本發明之較佳實施例之說明,對於此項技術具有通常知識者當可依據以下所界定申請專利範圍以及上述之說明而作其他之修改,惟此些修改仍應是為本發明之發明精神而在本發明之權利範圍中。 The above description and description are only illustrative of the preferred embodiments of the present invention, and those of ordinary skill in the art can make other modifications in accordance with the scope of the invention as defined below and the description above, but such modifications should still be It is within the scope of the invention to the invention of the invention.

Claims (10)

一種置晶設備的校正方法,用於校正一置晶設備的一持取構件在一置晶平面中各個預定位置的誤差,該置晶設備包括一置晶機構及一對位機構,該置晶機構包括該持取構件及一影像感測構件,該對位機構包括一對位影像感測構件及一設於該置晶平面的基準校正構件,其中該持取構件用以持取一晶粒或一標記件,該校正方法包含:一基準校正影像擷取步驟,在該影像感測構件於一預定位置而位置對應該基準校正構件的狀態下,該影像感測構件擷取一含有該基準校正構件的基準位置影像;一對位影像擷取步驟,使該持取構件位置對應於該基準校正構件,並利用該對位影像感測構件,在該持取構件位置對應於該基準校正構件之狀態下,擷取一顯示出該持取構件持取之該標記件與該基準校正構件之相對位置關係的對位影像;以及一影像處理計算步驟,係比對該對位影像與該基準位置影像,計算出該持取構件在位置對應於該基準校正構件之狀態下,該持取構件與該預定位置之間的差值,並對應產生該持取構件對應該預定位置的一補償校正值。 A method for correcting a crystallizing device for correcting an error of a predetermined position of a holding member of a crystallizing device in a crystal plane, the seeding device comprising a crystal mechanism and a pair of positioning mechanisms The mechanism includes the holding member and an image sensing member, the alignment mechanism includes a pair of image sensing members and a reference correction member disposed on the crystal plane, wherein the holding member is configured to hold a die Or a marking component, the calibration method includes: a reference correction image capturing step, wherein the image sensing component captures a reference to the reference correction component in a predetermined position and the image sensing component captures the reference a reference position image of the correcting member; a pair of bit image capturing steps to position the holding member corresponding to the reference correcting member, and using the aligning image sensing member at the position of the holding member corresponding to the reference correcting member a state in which a relative image showing the relative positional relationship between the marker and the reference correction member held by the holding member is captured; and an image processing calculation step is performed Calculating, by the alignment image and the reference position image, a difference between the holding member and the predetermined position in a state where the holding member corresponds to the reference correction member, and correspondingly generating the pair of holding members A compensation correction value for the position should be predetermined. 如請求項1所述之置晶設備的校正方法,係為依序進行該基準校正影像擷取步驟、該對位影像擷取步驟以及該影像處理計算步驟。 The method for correcting the crystallizing device according to claim 1 is to sequentially perform the reference correction image capturing step, the alignment image capturing step, and the image processing calculating step. 如請求項1所述之置晶設備的校正方法,係為依序進行該對位影像擷取步驟、該基準校正影像擷取步驟以及該影像處理計算步驟。 The method for correcting the crystallizing device according to claim 1 is to sequentially perform the alignment image capturing step, the reference corrected image capturing step, and the image processing calculating step. 如請求項1所述之置晶設備的校正方法,於該影像處理計算步驟後更包括一逐序校正步驟,係依照該持取構件的一置晶順序,在各個預定位置重複該基準校正影像擷取步驟、該對位影像擷取步驟以及該影像處理計算步驟,而依序計算該持取構件在各個預定位置的補償校正值。 The method for correcting a crystallizing device according to claim 1, further comprising a step by step correction step of repeating the reference corrected image at each predetermined position according to a crystallographic sequence of the holding member The capturing step, the aligning image capturing step, and the image processing calculating step, and sequentially calculating the compensation correction values of the holding members at respective predetermined positions. 如請求項4所述之置晶設備的校正方法,於該逐序校正步驟後更包括一置晶步驟,使該影像感測構件擷取一實際待置晶區域影像並以影像辨識決定一待置晶位置,而使該持取構件持取該晶粒以依據該待置晶位置所對應的補償校正值置晶。 The method for correcting the crystallizing device according to claim 4, further comprising a crystallizing step after the step of the sequential correction step, so that the image sensing component captures an image of the actual to-be-crystallized region and determines the image recognition by image recognition. The crystallizing position is such that the holding member holds the die to be crystallized according to the compensation correction value corresponding to the position to be crystallized. 一種置晶設備,用於在一置晶平面置晶,該置晶設備包含:一置晶機構,包括一持取構件及一影像感測構件,該持取構件用以持取一晶粒或一標記件;一對位機構,包括一基準校正構件及一對位影像感測構件,該對位影像感測構件在光路上對應該基準校正構件,其中在該影像感測構件於一預定位置而位置對應該基準校正構件的狀態下,該影像感測構件擷取一含有該基準校正構件的基準位置影像;以及一校正系統,包括:一移動控制單元,連接該持取構件,該移動控制單元經配置而使該持取構件移動而使該持取構件位置對應於該基準校正構件;一對位影像擷取控制單元,連接該對位影像感測構件,在該持取構件位置對應於該基準校正構件之狀態下,該對位影像擷取控制單元經配置而使該對位影像感測構件擷取一顯示出該持取構件持取之該標記件與該基準校正構件之相對位置關係的對位影像;以及一影像處理計算控制單元,連接該對位影像感測構件、該影像感測構件及該移動控制單元,該影像處理計算控制單元比對該對位影像與該基準位置影像,計算出該持取構件在位置對應於該基準校正構件之狀態下,該持取構件與該預定位置之間的差值,並對應產生該持取構件對應該預定位置的一補償校正值。 A crystal device for crystallizing in a crystallographic plane, the crystallizer comprising: a crystal pulling mechanism comprising a holding member and an image sensing member for holding a die or a marking member; a pair of positioning mechanisms including a reference correcting member and a pair of bit image sensing members, the alignment image sensing member corresponding to the reference correcting member on the optical path, wherein the image sensing member is at a predetermined position And the image sensing member captures a reference position image containing the reference correction member; and a correction system includes: a movement control unit that connects the holding member, the movement control The unit is configured to move the holding member such that the holding member position corresponds to the reference correcting member; a pair of bit image capturing control unit is coupled to the aligning image sensing member, wherein the position of the holding member corresponds to In the state of the reference correcting member, the aligning image capturing control unit is configured to cause the aligning image sensing member to capture a mark indicating that the holding member is held by the aligning image sensing member And an image processing calculation control unit, connected to the image sensing member And determining, by the bit image and the reference position image, a difference between the holding member and the predetermined position in a state where the holding member corresponds to the reference correcting member, and correspondingly generating the holding member corresponds to a predetermined A compensation correction value for the position. 如請求項6所述之置晶設備,其中該基準校正構件為一光罩或一具有影像特徵標誌的透光構件。 The crystallizing device of claim 6, wherein the reference correcting member is a photomask or a light transmissive member having an image signature. 如請求項6所述之置晶設備,其中該基準校正構件的上表面與該置晶平面齊平。 The seeding apparatus of claim 6, wherein an upper surface of the reference correction member is flush with the crystallographic plane. 如請求項6所述之置晶設備,其中該對位影像感測構件係設置為直接朝向該基準校正構件以直接擷取該對位影像。 The crystallizing device of claim 6, wherein the alignment image sensing member is disposed directly toward the reference correction member to directly capture the alignment image. 如請求項6所述之置晶設備,其中該對位機構更包括一反射鏡,設置為與該基準校正構件夾一傾斜角度以使該對位影像感測構件透過該反射鏡擷取該對位影像。 The crystallizing device of claim 6, wherein the alignment mechanism further comprises a mirror disposed to be inclined at an angle to the reference correction member to cause the alignment image sensing member to capture the pair through the mirror Bit image.
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