KR20180012032A - Apparatus for testing semiconductor devices - Google Patents

Abstract

An apparatus for testing semiconductor device is disclosed. The apparatus includes: a DC tester for performing a DC test on semiconductor devices, sequentially performing the DC test on the semiconductor devices one by one, sorting the semiconductor devices according to a result of the DC test and storing them in trays; and a function tester which is adjacent to the DC tester and performs a functional test on the DC-tested semiconductor devices and classifies the semiconductor devices according to a result of the functional test and storing them in the trays.

Description

[0001] Apparatus for testing semiconductor devices [

Embodiments of the present invention relate to a semiconductor device test apparatus. More particularly, the present invention relates to a semiconductor device test apparatus for electrically testing individual semiconductor devices using a probe card.

In general, semiconductor devices may be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes, and the semiconductor devices formed as described above may be formed into semiconductor packages through a dicing process, a bonding process, and a packaging process .

The semiconductor packages manufactured as described above can be judged to be good or defective through electrical characteristic inspection. For the electrical characteristic inspection, a test handler for handling the semiconductor elements and a test apparatus for inspecting the semiconductor packages may be used.

Recently, as various types of semiconductor devices are developed, an electrical testing process for individual semiconductor devices by a dicing process may be required, and there is a demand for a test apparatus for performing the electrical testing process. For example, micro-pillar grid array (MPGA) devices formed on a wafer require electrical testing after individualization through a dicing process, but it is difficult to use a general type of test handler.

Korean Registered Patent No. 10-0922145 (Registered Date: October 10, 2009)

It is an object of the present invention to provide a new type of semiconductor device test apparatus for performing a test process for individual semiconductor devices through a dicing process.

According to an aspect of the present invention, there is provided a semiconductor device testing apparatus for performing a DC test on semiconductor devices, the DC test being sequentially performed on the semiconductor devices one by one, A DC tester for sorting the semiconductor elements and storing the semiconductor elements in trays; a functional test for semiconductor devices which are disposed adjacent to the DC tester and for which the DC test has been completed, and classifying the semiconductor elements according to the functional test result It may include a function tester that houses the trays.

According to embodiments of the present invention, the semiconductor device testing apparatus may further include a tray transfer module for transferring the tray containing the DC elements to the functional tester.

According to embodiments of the present invention, the DC tester includes: a stage unit for supporting a frame wafer including a dicing tape to which a plurality of semiconductor elements are attached and a ring-shaped mount frame on which the dicing tape is mounted; A DC test module including a DC test probe card for carrying out a DC test, and a controller for loading the semiconductor elements from the stage unit into the DC test module one by one and unloading the DC tested semiconductor element from the DC test module And a load / unload module for classifying the semiconductor devices according to the DC test result.

According to embodiments of the present invention, the DC tester may further include a die ejecting unit disposed below the stage unit for separating the semiconductor elements one by one from the dicing tape.

According to the embodiments of the present invention, the load / unload module includes a test stage for supporting semiconductor elements, a first element transfer section for picking up the semiconductor element from the stage unit and transferring the semiconductor element onto the test stage, A stage driver for loading the semiconductor device on the test stage into the DC test module and moving the test stage to unload the DC device from the DC test module; Two-element transfer part.

According to embodiments of the present invention, the first element transferring portion may include a first picker for picking up the semiconductor element from the dicing tape, and a first picker driving portion for moving the first picker vertically and horizontally .

According to embodiments of the present invention, the second device transfer section may include a second picker for picking up the semiconductor device from the test stage, a buffer tray for temporarily storing the semiconductor device, A second picker driver for moving the second picker vertically and horizontally for transfer from the stage to the buffer tray, a third picker for picking up the semiconductor element from the buffer tray, And a third picker driving unit for moving the third picker in the vertical and horizontal directions to receive the third picker.

According to the embodiments of the present invention, the DC tester includes a load port for supporting a cassette containing a plurality of frame wafers, and a wafer transfer unit for transferring the frame wafer from the cassette onto the stage unit .

According to embodiments of the present invention, the semiconductor device testing apparatus may further include: a second DC tester disposed adjacent to the functional tester and having the same configuration as the DC tester; and a second DC tester which is DC tested by the second DC tester And a second tray transfer module for transferring the tray accommodated in the elements to the functional tester.

According to embodiments of the present invention, the function tester may include a function test module including a function test probe card for functional testing of the semiconductor devices after the DC test is completed, and a function test module disposed at one side of the function test module And a load / unload module for loading the semiconductor elements with the function test module, unloading the functionally tested semiconductor elements from the function test module, and classifying the semiconductor elements according to the function test result.

According to embodiments of the present invention, the load / unload module comprises a test stage for supporting the semiconductor devices, a test stage for loading the test stage into the function test module and unloading the test stage from the function test module, And a stage driving unit for moving the stage.

According to embodiments of the present invention, the load / unload module transfers the semiconductor elements from the tray on which the semiconductor elements are housed, onto the test stage, and, according to the result of the functional test on the semiconductor elements, The apparatus may further include an element transfer unit for categorizing and storing the trays.

According to embodiments of the present invention, the load / unload module includes an element supply region in which the tray containing the semiconductor elements is located, and an element classification region in which trays for accommodating the semiconductor elements according to the test result are located. As shown in FIG.

According to embodiments of the present invention, the load / unload module may further include an empty tray supply region for supplying empty trays to the element sorting regions.

According to embodiments of the present invention, the test stage may be provided with vacuum holes for vacuum-adsorbing the semiconductor devices, respectively.

According to the embodiments of the present invention, the vacuum holes are divided into a plurality of groups, and the vacuum holes included in each group are connected to each other by one vacuum pipe, A flow control valve may be connected to regulate the flow so that the vacuum pressure at the outlet is always constant.

According to another aspect of the present invention, there is provided a device for testing a semiconductor device, the device comprising: a function for simultaneously performing a functional test on a plurality of semiconductor devices and sorting the semiconductor devices according to a result of the functional test, A method of testing a semiconductor device, the method comprising: performing a DC test on semiconductor devices, each of the devices being disposed on both sides of the functional tester, wherein the DC tests are sequentially performed on the semiconductor devices one by one, A first DC tester and a second DC tester for accommodating the DC testers in the first and second DC testers and a tray transfer module for transferring the trays accommodating the DC tested semiconductor devices to the function tester have.

According to embodiments of the present invention, the function tester may include a function test module including a probe card for performing a functional test on the semiconductor elements, and a function test module disposed on both sides of the function test module, And a load / unload module for loading the semiconductor devices into the test module and unloading the semiconductor devices from the test module after the functional test by the test module is completed, wherein the load / The semiconductor elements can be alternately loaded.

According to embodiments of the present invention, the load / unload modules may have the same configuration as each other.

According to embodiments of the present invention as described above, a semiconductor device testing apparatus can be used to test the electrical characteristics of individual semiconductor devices from a wafer through a dicing process. Particularly, the semiconductor device testing apparatus performs a DC test on semiconductor elements, sequentially performs the DC test on the semiconductor elements one by one, classifies the semiconductor elements according to the result of the DC test, And a function tester disposed adjacent to the DC tester for performing a functional test on the semiconductor devices after the DC test has been completed and storing the semiconductor devices in the trays according to the result of the functional test And trays in which the semiconductor devices having the DC test completed can be transferred from the DC tester to the function tester by a tray transfer module.

Therefore, the DC test and the functional test for the individualized semiconductor devices can be sequentially performed. In particular, the first and second DC testers can be disposed on both sides of the functional tester, By supplying the first and second load / unload modules of the functional tester respectively, the time required for the DC test and the functional test on the semiconductor devices can be greatly shortened.

1 is a schematic plan view for explaining a semiconductor device testing apparatus according to an embodiment of the present invention.
2 is a schematic plan view for explaining the semiconductor elements shown in FIG.
3 is a schematic diagram for explaining the first DC tester shown in FIG.
4 is a schematic configuration diagram for explaining the stage unit shown in Fig.
5 is a schematic configuration diagram for explaining the DC test module shown in FIG.
FIG. 6 is a schematic configuration diagram for explaining the functional tester shown in FIG. 1. FIG.
FIGS. 7 and 8 are schematic diagrams for explaining the function test module and the load / unload module of the function tester shown in FIG.
9 is a schematic configuration diagram for explaining a test stage of the functional tester shown in FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

In the embodiments of the present invention, when one element is described as being placed on or connected to another element, the element may be disposed or connected directly to the other element, . Alternatively, if one element is described as being placed directly on another element or connected, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used in the embodiments of the present invention is used for the purpose of describing specific embodiments only, and is not intended to be limiting of the present invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to schematic illustrations of ideal embodiments of the present invention. Accordingly, changes from the shapes of the illustrations, e.g., changes in manufacturing methods and / or tolerances, are those that can be reasonably expected. Accordingly, the embodiments of the present invention should not be construed as being limited to the specific shapes of the regions described in the drawings, but include deviations in the shapes, and the elements described in the drawings are entirely schematic and their shapes Is not intended to describe the exact shape of the elements and is not intended to limit the scope of the invention.

FIG. 1 is a schematic plan view for explaining a semiconductor device testing apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic plan view for explaining semiconductor devices shown in FIG.

Referring to FIG. 1, according to an embodiment of the present invention, a semiconductor device testing apparatus 10 performs a DC test and a functional test (see FIG. 2) on individual semiconductor devices 20 . ≪ / RTI > For example, a plurality of micro bumps 22 may be provided at a central portion of the semiconductor devices 20, and a plurality of electrode pads 24 may be provided at peripheral portions.

In the DC test, DC characteristics such as open / short, input current, output voltage, and power supply current can be measured by applying a preset voltage through the microbumps 22 of the semiconductor devices 20, It is possible to judge the amount or the defective amount of the semiconductor elements 20 from the semiconductor device.

In the functional test, a test pattern provided by the pattern generator can be tested through the electrode pads 24 of the semiconductor devices 20, The output signal from the semiconductor devices 20 is compared with a reference value, and the comparison result is compared with the output expectation pattern generated in the pattern generator, thereby evaluating the amount of operation and the failure.

Further, an AC test for the semiconductor devices 20 may be additionally performed together with the functional test. In the AC test, a pulse signal is applied through the electrode pads 24 of the semiconductor devices 20 to measure operation characteristics such as an input / output transfer delay time, a start / end time of an output signal, .

According to an embodiment of the present invention, the semiconductor device testing apparatus 10 includes a first DC tester 100 and a second DC tester 300 for performing a DC test on the semiconductor devices 20 can do. The first and second DC testers 100 and 300 sequentially perform the DC test on the semiconductor elements 20 one by one and classify the semiconductor elements 20 according to the DC test result, As shown in Fig.

The semiconductor device testing apparatus 10 includes a functional tester 200 disposed between the first and second DC testers 100 and 300 and performing a functional test on the plurality of semiconductor devices 20 at the same time can do. For example, the function tester 200 performs a functional test on the semiconductor devices 20 that have undergone the DC test, classifies the semiconductor devices 20 according to the result of the functional test, . As another example, the function test by the function tester 200 is limited to the semiconductor elements 20 classified as good according to the DC test result by the first and second DC testers 100 and 300 ≪ / RTI >

The semiconductor device testing apparatus 10 may be configured to transfer the trays accommodated in the DC tested semiconductor devices 20 from the first and second DC testers 100 and 300 to the functional tester 200 First and second tray transport modules 400 and 410. The first and second tray transport modules 400, The first and second tray transfer modules 400 and 410 include first and second transfer arms 402 and 412 for holding the tray and first and second transfer arms 402 and 412, The first and second DC testers 100 and 300 and the first and second DC testers 200 and 200 for moving along the Y axis direction as shown in FIG. And may include arm drivers 404 and 414, respectively.

FIG. 3 is a schematic diagram for explaining the first DC tester shown in FIG. 1, and FIG. 4 is a schematic diagram for explaining the stage unit shown in FIG.

3 and 4, the first DC tester 100 includes a dicing tape 32 to which a plurality of semiconductor elements 20 are attached, and a circular ring type A DC test module 120 including a stage unit 110 for supporting a frame wafer 30 including a mounting frame 34 of the mounting frame 34 and a DC test probe card 122 for performing the DC test, The semiconductor devices 20 are loaded into the DC test module 120 one by one from the stage unit 110 and unloaded from the DC test module 120 after the DC test is completed, And a load / unload module 130 for classifying the semiconductor devices 20 according to the result.

The stage unit 110 may include a wafer stage 112 for supporting the frame wafer 30. [ An extension ring 114 for supporting the dicing tape 32 and a clamp 116 for holding the mount frame 34 may be arranged on the wafer stage 112 so as to be movable in the vertical direction. The extension ring 114 can support the edge portions of the dicing tape 32 and the clamp 116 can be lowered after holding the mount frame 34, Lt; RTI ID = 0.0 > 32 < / RTI >

A die ejecting unit 118 for separating the semiconductor elements 20 from the dicing tape 32 may be disposed under the stage unit 110.

The load / unload module 130 includes a test stage 132 for supporting the semiconductor device 20 and a semiconductor device 20 for picking up the semiconductor device 20 from the stage unit 110, (Not shown) for loading and unloading the semiconductor device 20 on the test stage 134 to the DC test module 120 and unloading the DC test module 120 from the DC test module 120, And a second element transferring unit 142 for picking up the semiconductor element 20 from the test stage 132 and accommodating the semiconductor element 20 in the trays 50 can do.

The first element transferring unit 134 includes a first picker 136 for picking up the semiconductor element 20 from the dicing tape 32 and a second picker 136 for picking up the first picker 136 in the vertical and horizontal directions X And a first picker driving unit 138 for moving the first picker driving unit 138 in the axial direction. The second element transfer unit 142 includes a second picker 144 for picking up the semiconductor element 20 from the test stage 132 and a buffer tray 146 for temporary storage of the semiconductor element 20 And a second picker 144 for moving the second picker 144 in the vertical and horizontal directions (Y-axis direction) so as to transfer the semiconductor device 20 from the test stage 132 to the buffer tray 146, A third picker 150 for picking up the semiconductor element 20 from the buffer tray 146 and a second picker 150 for picking up the semiconductor element 20 from the buffer tray 146, 3 picker 150 in the vertical and horizontal directions (X-axis direction and Y-axis direction). The first, second, and third pickers 136, 144, and 150 may vacuum adsorb the semiconductor device 20 using vacuum pressure.

The first picker 136 can vacuum adsorb the semiconductor device 20 separated from the dicing tape 32 by the die ejecting unit 118 and the first picker drive unit 138 can vacuum- The semiconductor element 20 can be picked up from the dicing tape 32 by raising the first picker 136.

The die ejecting unit 118 can separate the semiconductor element 20 from the dicing tape 32 by raising the eject pins under the dicing tape 32. [ At this time, the stage unit 110 may be configured to be movable in the horizontal direction to separate the semiconductor elements 20 sequentially or selectively from the dicing tape 32. For example, although not shown, the stage unit 110 can be moved in a horizontal direction by a separate stage driving unit (not shown).

The first DC tester 100 includes a load port 160 for supporting a cassette 40 in which a plurality of frame wafers 30 are accommodated and a second port for discharging the frame wafer 30 from the cassette 40 And a wafer transfer unit 162 for transferring the wafer W onto the stage unit 110. The stage unit 110 can be moved adjacent to the wafer transfer section 162 for loading and unloading the frame wafer 30 by the wafer transfer section 162 and the semiconductor elements 20 can be moved one by one And the first picker 136 can be moved to pick up the semiconductor elements 20 one by one.

An alignment camera 170 may be disposed under the movement path of the first picker 136 to identify the state in which the semiconductor device 20 is picked up by the first picker 136, The angle of deviation of the semiconductor element 20 can be corrected according to the observation result by the camera 170. [ The degree of deformation of the semiconductor device 20 can be corrected by rotating the first picker 136 or the test stage 132.

5 is a schematic configuration diagram for explaining the DC test module shown in FIG.

5, after the semiconductor element 20 is loaded on the test stage 132 by the first picker 136, the test stage 132 is driven by the stage driver 140 RTI ID = 0.0 > 120 < / RTI > Particularly, the DC test module 120 includes a DC test probe card 122 for the DC test and a DC test head 124 connected to the DC test probe card 122 for applying test signals can do.

The stage driving unit 140 can horizontally move the test stage 132 below the DC test probe card 122 and then raise the test stage 132 to move the microbumps (22) may be connected to the probes of the DC test probe card (122).

After the completion of the DC test by the DC test module 120, the stage driver 140 drives the test stage 132 by the transfer position of the semiconductor device 20, that is, the first picker 136, The semiconductor device 20 can be moved to a position where the semiconductor device 20 is loaded onto the wafer 132.

Referring again to FIG. 3, the second picker 144 may pick up the semiconductor device 20 on the test stage 132 and move it to the buffer tray 146 while the first picker 136 May move the subsequent semiconductor element 20 from the frame wafer 30 to the test stage 132. [

The third picker 150 may pick up the semiconductor device 20 housed in the buffer tray 146 and move it to one of the trays 50 according to the DC test result.

The first DC tester 100 may include an element sorting region 180 provided with the trays 50. The semiconductor device 20 having undergone the DC test may be classified into a good product, a defective product, and a re-inspection according to a result of the DC test and stored in the trays 50. The first DC tester 100 may include stackers 52 for receiving the plurality of trays 50. The stackers 52 may include empty trays, Trays, trays in which defective semiconductor elements are housed, trays in which semiconductor elements to be resampled are housed, and the like. The transfer of the trays 50 between the element sorting region 180 and the stackers 52 may be performed by the first transfer arm 402 of the first tray transfer module 400 have. Alternatively, the stackers 52 may be disposed directly in the device dividing region 180. [

Referring again to FIG. 1, the second DC tester 300 may be configured in the same manner as the first DC tester 100. That is, the second DC tester 300 may have substantially the same components as the first DC tester 100, so that detailed description of the second DC tester 300 will be omitted. The semiconductor devices 20 that have undergone the DC testing by the first and second DC testers 100 and 300 are stored in the trays 50 and the first and second tray transfer modules 400, 410 to the functional tester 200.

FIG. 6 is a schematic configuration diagram for explaining the functional tester shown in FIG. 1. FIG.

6, the function tester 200 includes a function test module 210 including a function test probe card 212 for performing a function test on the semiconductor devices 20, The semiconductor devices 20 are placed on both sides of the test module 210 and the semiconductor devices 20 are loaded into the function test module 210. After the functional tests are completed by the function test module 210, And a pair of load / unload modules 220A and 220B for unloading the function test module 210 from the functional test module 210. [ In particular, the load / unload modules 220A and 220B may alternately load the semiconductor devices 20 into the functional test module 210. [

FIGS. 7 and 8 are schematic diagrams for explaining the function test module and the load / unload module of the function tester shown in FIG.

6 to 8, the functional tester includes a first load / unload module 220A for loading and unloading the semiconductor devices 20 to the functional test module 210, and a second load / Module 220B.

As shown in FIG. 7, after the first semiconductor elements 20A are loaded into the functional test module 210 by the first load / unload module 220A, the first semiconductor elements 20A The second load / unload module 220B may perform load preparation for the second semiconductor elements 20B while the first test process for the second semiconductor elements 20A is performed. After the first test process is completed, the first semiconductor elements 20A can be unloaded from the functional test module 210 by the first load / unload module 220A, and then, as shown in FIG. 8 The second semiconductor elements 20B may be loaded into the functional test module 210 by the second load / unload module 220B.

Particularly, while the second test process for the second semiconductor elements 20B is performed, the first semiconductor elements 20A can be classified as good and defective according to the result of the first test process. In addition, after the first semiconductor elements 20A have been classified, the first load / unload module 220A may perform load preparation for the subsequent third semiconductor elements.

The load and unload of the semiconductor elements 20 are alternately performed by the load / unload modules 220A and 220B as described above, and during the functional test process for the semiconductor elements 20, The operation speed of the semiconductor device testing apparatus 200 can be greatly improved since the unloading and sorting steps for the semiconductor elements 20 and the load preparation stage of the subsequent semiconductor elements 20 can be performed simultaneously, The time required for the test process of the semiconductor device 20 can be greatly shortened.

According to an embodiment of the present invention, the load / unload modules 220A and 220B may have the same configuration. That is, the first load / unload module 220A and the second load / unload module 220B may have the same configuration. For convenience of explanation, the first load / unload module 220A and the second load / ) Will be described.

The first load / unload module 220A includes a test stage 222 for supporting the semiconductor devices 20, and a controller 220 for loading the test stage 222 into the function test module 210, And a stage driver 224 for unloading from the module 210. That is, the stage driving unit 224 horizontally moves the test stage 222 between the functional test module 210 and the element transfer region 226 in which the load preparing step and the classifying step of the semiconductor elements 20 are performed, So that loading and unloading of the semiconductor devices 20 to the functional test module 210 can be performed.

The first load / unload module 220A transfers the semiconductor elements 20 from the tray 50 accommodating the semiconductor elements 20 onto the stage 222, And a device transfer unit 228 for sorting and transferring the semiconductor devices 20 into the prepared trays 52 and 54 according to the test results of the semiconductor devices 20. Particularly, the first load / unload module 220A includes an element supply region 234 in which the tray 50 accommodating the semiconductor elements is located, and a first load / unload module 220A for accommodating the semiconductor elements 20 according to the test result May include device isolation regions (236, 538) where trays (52, 54) are located. At this time, the tray 50 containing the semiconductor devices may be provided from the first DC tester 100.

For example, the element transfer unit 228 may include a picker 230 for picking up the semiconductor elements 20 using vacuum pressure and the picker 230 for transferring the semiconductor elements 20 And a picker driver 232 for moving the picker in the vertical and horizontal directions. The element transfer unit 228 transfers the semiconductor elements 20 from the tray 50 accommodated therein to the test stage 222 located in the element transfer region 226 And after the functional test process is completed, the semiconductor elements 20 may be classified into good and defective products according to the test result from the test stage 222 and stored in the trays 52 and 54, respectively .

The tray 50 accommodating the semiconductor elements 20 before the functional test and the semiconductor elements 20 after the functional test are accommodated in the element supplying area 234 and the element sorting areas 236 and 238, (Not shown) on which the trays 52 and 54 are placed, respectively. Alternatively, the device supply region 234 may be provided with a stacker (not shown) on which the trays 50 accommodating the semiconductor elements 20 are stacked, and the device isolation regions 236 and 238 (Not shown) in which the trays 52 accommodating the good semiconductor elements and the trays 54 accommodating the defective semiconductor elements are stacked, respectively.

In addition, the first load / unload module 220A may include an empty tray supply region 240 for supplying empty trays 56 to the element sorting regions 236 and 238, , And a stacker (not shown) in which a plurality of empty trays 56 are stacked may be provided in the empty tray supply region 240.

9 is a schematic configuration diagram for explaining a test stage of the functional tester shown in FIG.

9, the semiconductor elements 20 transferred onto the test stage 222 by the device transfer unit 228 are transferred to the test stage 222 through vacuum holes 223A provided in the test stage 222, Can be adsorbed. For example, the stage 222 may have a plurality of vacuum holes 223A, and the semiconductor elements 20 may be vacuum-adsorbed by the vacuum holes 223A, respectively.

According to an embodiment of the present invention, the vacuum holes 223A may be divided into a plurality of groups, and the vacuum holes 223A included in the respective groups may be divided into a single vacuum tube 223B. Particularly, the vacuum pipes 223B connected to the vacuum holes 223A included in the respective groups can be connected to the vacuum pipes 250. The vacuum pipes 250 are connected to the vacuum holes 223A, Flow control valves 252 may be provided to maintain the internal vacuum pressure constant.

In particular, when one of the vacuum holes 223A included in one of the groups is described as an example, if the semiconductor elements 20 are sequentially placed on the vacuum holes 223A, The flow rate sucked in through the suction port 223B can be gradually reduced. The opening degree of the flow control valve 252 may be adjusted to constantly adjust the flow rate so that the vacuum pressure applied to the semiconductor elements 20 vacuum-adsorbed by the vacuum holes 223A Can always be controlled constantly.

That is, while the semiconductor elements 20 are sequentially loaded onto the test stage 222, the flow control valves 252 are connected to the vacuum conduits 223B in accordance with the load of the semiconductor elements 20, It is possible to gradually increase the flow rate when the semiconductor elements 20 are unloaded from the test stage 222 one by one. As a result, the semiconductor elements 20 loaded onto the test stage 222 can be stably held by the vacuum holes 223A.

Although only vacuum lines 250 and flow control valves 252 are illustrated as being connected to some groups by way of example only, vacuum lines 250 and flow control valves 252 , And the vacuum pipes 250 may be connected to a vacuum source (not shown) including a vacuum pump or the like.

According to one embodiment of the present invention, although not shown, the first load / unload module 220A may include an alignment camera for alignment of the semiconductor elements 20. [ The alignment camera can image the semiconductor element 20 picked up by the element transfer unit 228 or the semiconductor element 20 placed on the stage 222, The alignment of the semiconductor element 20 can be performed based on the image of the semiconductor element 20. The picker drive unit 232 may rotate the picker 230 for alignment of the semiconductor device 20 and may adjust the position of the semiconductor devices 20 based on the image.

After the semiconductor elements 20 are loaded on the test stage 222, the stage driver 224 may transfer the test stage 222 to the functional test module 210. For example, the stage driver 224 may move the test stage 222 below the functional test probe card 212. 2, the test module 210 includes a function test probe card 212 having a plurality of probes for connection with the electrode pads 24 of the semiconductor devices 20, And a test head 214 for applying test signals to the semiconductor devices 20 through a card 212. [

7, the first load / unload module 220A includes an alignment driver 242 for aligning the probes of the probe card 212 with the semiconductor elements 20 on the test stage 222 . Although not shown, the position of the semiconductor elements 20 on the test stage 222 and the position of the probes of the probe card 212 can be detected by upper and lower cameras (not shown) An alignment step using the upper and lower cameras may be performed before the process.

The alignment driver 242 may adjust the position of the test stage 222 using the position information of the probes of the semiconductor device 20 and the probe card 212 detected by the upper and lower cameras have. For example, the position of the test stage 222 in the Y-axis direction can be adjusted by the stage driving unit 224, and the position of the test stage 222 in the X-axis direction can be adjusted by the alignment driving unit 242. The test driver 222 may be configured to be rotatable by the alignment driver 242 and the alignment driver 242 may be disposed between the semiconductor elements 20 and the probes of the probe card 212. [ The placement angle of the test stage 212 can be adjusted for alignment.

After the aligning step between the semiconductor elements 20 and the probes of the probe card 212 is completed, the test stage 222 can be lifted by the connection driving unit 244. For example, the first load / unload module 220A may connect the semiconductor devices 20 to the probes of the probe card 212 by moving the test stage 222 vertically, (244).

According to an embodiment of the present invention, the test stage 222 may be lifted by the connection driver 244. Accordingly, the probes of the probe card 212 can be contacted to the electrode pads 24 of the semiconductor devices 20, and the functional test can be performed.

6, the second load / unload module 220B may have substantially the same configuration as that of the first load / unload module 220A. Accordingly, the second load / unload module 220B may have substantially the same configuration as the first load / Will not be described in detail.

Meanwhile, the first and second tray transfer modules 400 and 410 are connected to the first and second load / unload modules 220A and 220B from the first and second DC testers 100 and 300, respectively. It is possible to move the trays 50 accommodated by the DC tested semiconductor elements 20 into the element supply regions 234 and to pick up the empty tray 56 from the empty tray supply regions 240. [ To the device isolation regions (236, 238).

According to embodiments of the present invention as described above, the semiconductor device testing apparatus 10 can be used to test the electrical characteristics of the individual semiconductor devices 20 from the wafer through the dicing process. Particularly, the semiconductor device testing apparatus 10 performs a DC test on the semiconductor devices 20, sequentially performing the DC test on the semiconductor devices 20 one by one, and according to the DC test result, DC testers 100 and 300 for sorting semiconductor elements 20 and storing the semiconductor elements 20 in trays 50; semiconductor devices 20 disposed adjacent to the DC testers 100 and 300, And a function tester 200 for performing a functional test on the semiconductor devices 20 and sorting the semiconductor devices 20 according to a result of the functional test and storing the semiconductor devices 20 in the trays 52 and 54, The trays 50 in which the elements 20 are housed can be transferred from the DC tester 100 or 300 to the function tester 200 by the tray transfer module 400 or 410. [

Accordingly, DC testing and functional testing of the individualized semiconductor devices 20 can be performed sequentially, and in particular, the first and second DC testers 100 and 300 can be mounted on both sides of the functional tester 200 And supplying the semiconductor devices 20 having completed the DC test to the first and second load / unload modules 220A and 220B of the functional tester 200, respectively, to the semiconductor elements 20 The time required for DC testing and functional testing can be greatly shortened.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined in the following claims. It can be understood that.

10: Semiconductor device test apparatus 20: Semiconductor device
30: frame wafer 40: cassette
50: Tray 100: 1st DC tester
110: stage unit 120: DC test module
122: DC test probe card 130: Load / unload module
132: Test stage 136: First picker
144: second picker 146: buffer tray
150: third picker 160: load port
200: Function Tester 210: Function Test Module
220A: first load / unload module 220B: second load / unload module
222: Test stage 228: Device transfer unit
230: Picker 300: Second DC tester
400: first tray feed module 410: second tray feed module

Claims (19)

A DC tester performing a DC test on semiconductor elements, sequentially performing the DC test on the semiconductor elements, one by one, and sorting the semiconductor elements according to the result of the DC test and storing them in trays; And
And a function tester disposed adjacent to the DC tester for performing a functional test on the semiconductor devices that have undergone the DC test and classifying the semiconductor devices according to a result of the functional test and storing the semiconductor devices in the trays. Device test equipment. The semiconductor device test apparatus according to claim 1, further comprising a tray transfer module for transferring the tray containing the DC elements to the functional tester. The DC tester according to claim 1,
A stage unit for supporting a frame wafer including a dicing tape having a plurality of semiconductor elements attached thereto and a ring-shaped mount frame equipped with the dicing tape;
A DC test module including a DC test probe card for performing the DC test; And
And a load / unload module for loading the semiconductor devices one by one from the stage unit to the DC test module, unloading the DC tested semiconductor device from the DC test module, and classifying the semiconductor devices according to the DC test result And the semiconductor device test apparatus. 4. The semiconductor device test apparatus according to claim 3, wherein the DC tester further comprises a die ejecting unit disposed below the stage unit for separating the semiconductor elements one by one from the dicing tape. 4. The apparatus of claim 3, wherein the load /
A test stage for supporting semiconductor devices;
A first element transfer unit for picking up the semiconductor element from the stage unit and transferring the semiconductor element onto the test stage;
A stage driver for loading the semiconductor device on the test stage into the DC test module and moving the test stage to unload the DC test module from the DC test module; And
And a second element transferring part for picking up the semiconductor element from the test stage and accommodating the semiconductor element in the trays. 6. The device according to claim 5, wherein the first device-
A first picker for picking up the semiconductor element from the dicing tape; And
And a first picker driving unit for moving the first picker in vertical and horizontal directions. 6. The device according to claim 5,
A second picker for picking up the semiconductor device from the test stage;
A buffer tray for temporarily storing the semiconductor device;
A second picker driver for moving the second picker vertically and horizontally to transfer the semiconductor device from the test stage to the buffer tray;
A third picker for picking up the semiconductor element from the buffer tray; And
And a third picker driver for moving the third picker vertically and horizontally to accommodate the semiconductor devices in the trays. The apparatus of claim 3, wherein the DC tester comprises:
A load port for supporting a cassette containing a plurality of frame wafers; And
Further comprising a wafer transfer unit for transferring the frame wafer from the cassette and moving the frame wafer onto the stage unit. The apparatus of claim 1, further comprising: a second DC tester disposed adjacent to the functional tester and having the same configuration as the DC tester; And
Further comprising a second tray transfer module for transferring the tray containing the semiconductor devices having undergone DC testing by the second DC tester to the function tester. 2. The apparatus according to claim 1,
A function test module including a function test probe card for functional testing of the semiconductor devices after the DC test is completed; And
A load / unload circuit which is disposed at one side of the functional test module and loads the semiconductor elements with the functional test module, unloads the semiconductor elements whose functional tests have been completed from the functional test module, and classifies the semiconductor elements according to the functional test result Wherein the semiconductor device is a semiconductor device. 11. The apparatus of claim 10, wherein the load /
A test stage for supporting the semiconductor elements; And
And a stage driver for loading the test stage into the functional test module and moving the test stage to unload the functional test module from the functional test module. 12. The apparatus of claim 11, wherein the load /
Further comprising an element transferring unit for transferring the semiconductor elements from the tray accommodated in the semiconductor elements onto the test stage and sorting the semiconductor elements into the trays according to the result of the functional test for the semiconductor elements, Wherein the semiconductor device is a semiconductor device. 13. The system of claim 12, wherein the load /
An element supply region in which the tray containing the semiconductor elements is located; And
Further comprising device isolation regions in which trays for accommodating the semiconductor devices in accordance with the test results are located. 14. The load / unload module of claim 13, wherein the load /
Further comprising an empty tray supply region for supplying empty trays to the element sorting regions. 12. The semiconductor device test apparatus according to claim 11, wherein the test stage is provided with vacuum holes for respectively vacuum-attracting the semiconductor devices. 16. The vacuum degassing apparatus according to claim 15, wherein the vacuum holes are divided into a plurality of groups, and the vacuum holes included in each group are connected to each other by a vacuum tube, Wherein a flow control valve is connected to adjust the flow rate so that the air pressure is always constant. A function tester for simultaneously performing a functional test on a plurality of semiconductor elements and classifying the semiconductor elements according to a result of the functional test and storing the classified semiconductor elements in trays;
Wherein the DC testers are disposed on both sides of the functional tester and perform a DC test on the semiconductor elements, wherein the DC tests are sequentially performed on the semiconductor elements one by one, and the semiconductor elements are sorted according to the DC test result, A first DC tester and a second DC tester; And
And a tray transfer module for transferring the trays containing the semiconductor devices completed DC testing by the first and second DC testers to the function tester. 18. The system of claim 17,
A function test module including a probe card for performing a functional test on the semiconductor devices; And
And a pair of load / unload modules disposed on both sides of the function test module and loading the semiconductor elements with the function test module and unloading the semiconductor elements from the test module after the functional test by the test module is completed However,
Wherein the load / unload modules alternately load the semiconductor elements into the test module. 19. The semiconductor device test apparatus according to claim 18, wherein the load / unload modules have the same configuration.

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