KR102337625B1 - 입자의 경로의 말단부가 노출된 입자의 경로를 포함하는 제품을 제조하기 위한 방법 - Google Patents
입자의 경로의 말단부가 노출된 입자의 경로를 포함하는 제품을 제조하기 위한 방법 Download PDFInfo
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- KR102337625B1 KR102337625B1 KR1020167034422A KR20167034422A KR102337625B1 KR 102337625 B1 KR102337625 B1 KR 102337625B1 KR 1020167034422 A KR1020167034422 A KR 1020167034422A KR 20167034422 A KR20167034422 A KR 20167034422A KR 102337625 B1 KR102337625 B1 KR 102337625B1
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Images
Classifications
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- B29K2995/0005—Conductive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
- B29K2995/0008—Magnetic or paramagnetic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3462—Cables
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2429/00—Presence of polyvinyl alcohol
- C09J2429/006—Presence of polyvinyl alcohol in the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
- H01F1/28—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder dispersed or suspended in a bonding agent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Laminated Bodies (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP14169206.1 | 2014-05-21 | ||
| EP14169206.1A EP2947662A1 (en) | 2014-05-21 | 2014-05-21 | A method for arranging particles at an interface |
| PCT/EP2015/061244 WO2015177275A1 (en) | 2014-05-21 | 2015-05-21 | A method for forming an article comprising a pathway of particles wherein a termination of the pathway of particles is exposed |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20170012304A KR20170012304A (ko) | 2017-02-02 |
| KR102337625B1 true KR102337625B1 (ko) | 2021-12-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020167034422A Active KR102337625B1 (ko) | 2014-05-21 | 2015-05-21 | 입자의 경로의 말단부가 노출된 입자의 경로를 포함하는 제품을 제조하기 위한 방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US20170080609A1 (enExample) |
| EP (2) | EP2947662A1 (enExample) |
| JP (1) | JP6518698B2 (enExample) |
| KR (1) | KR102337625B1 (enExample) |
| CN (1) | CN106459697A (enExample) |
| WO (1) | WO2015177275A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NO342507B1 (en) | 2017-03-29 | 2018-06-04 | Condalign As | A method for forming av body comprising at least one through-going passage |
| KR102676719B1 (ko) | 2018-12-11 | 2024-06-18 | 현대자동차주식회사 | 친환경 차량용 고전압 배터리의 출력제어 시스템 |
| CN114207842B (zh) * | 2019-07-25 | 2024-01-30 | 中国建材国际工程集团有限公司 | 用于制造无机薄膜太阳能电池装置的方法和无机薄膜太阳能电池装置 |
| KR20210031275A (ko) | 2019-09-11 | 2021-03-19 | 현대자동차주식회사 | 실린더 휴지를 구현하는 엔진의 제어 방법 및 그 방법이 적용된 엔진 |
| KR102278410B1 (ko) | 2020-11-17 | 2021-07-19 | 주식회사 클레스앤피 | 개인 건강 상태 동시 측정이 가능한 고성능 딥러닝 지정맥 인증 시스템 및 방법 |
| KR102843032B1 (ko) | 2021-02-26 | 2025-08-05 | 현대자동차주식회사 | 커넥터 차폐용 연결 부품 및 이를 포함하는 쉴드 커넥터 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USRE21762E (en) | 1941-04-08 | Adhesive sheeting | ||
| JPS6155809A (ja) * | 1984-08-27 | 1986-03-20 | 日立化成工業株式会社 | 導電性接着フイルム巻重体 |
| US5045249A (en) * | 1986-12-04 | 1991-09-03 | At&T Bell Laboratories | Electrical interconnection by a composite medium |
| US4923739A (en) * | 1987-07-30 | 1990-05-08 | American Telephone And Telegraph Company | Composite electrical interconnection medium comprising a conductive network, and article, assembly, and method |
| US4820376A (en) * | 1987-11-05 | 1989-04-11 | American Telephone And Telegraph Company At&T Bell Laboratories | Fabrication of CPI layers |
| JPH07230840A (ja) * | 1994-02-17 | 1995-08-29 | Hitachi Chem Co Ltd | 接続部材及びこれを用いた電極の接続構造 |
| US5509815A (en) | 1994-06-08 | 1996-04-23 | At&T Corp. | Solder medium for circuit interconnection |
| JPH08273442A (ja) * | 1995-03-22 | 1996-10-18 | Whitaker Corp:The | 異方性導電膜およびその製造方法 |
| US5975922A (en) | 1998-03-09 | 1999-11-02 | Lucent Technologies Inc. | Device containing directionally conductive composite medium |
| US6322713B1 (en) | 1999-07-15 | 2001-11-27 | Agere Systems Guardian Corp. | Nanoscale conductive connectors and method for making same |
| JP3928389B2 (ja) * | 2001-08-31 | 2007-06-13 | Jsr株式会社 | 異方導電性シートおよびその製造方法 |
| JP2003187885A (ja) * | 2001-12-20 | 2003-07-04 | Sony Corp | 異方性導電フィルムおよび異方性導電フィルムの製造方法ならびに電子部品の実装体 |
| JP2004047268A (ja) * | 2002-07-11 | 2004-02-12 | Shin Etsu Polymer Co Ltd | 圧接型コネクタ |
| JP2005116291A (ja) * | 2003-10-07 | 2005-04-28 | Sumitomo Electric Ind Ltd | 異方性導電膜及びその製造方法 |
| KR100601341B1 (ko) * | 2004-06-23 | 2006-07-14 | 엘에스전선 주식회사 | 이방 도전성 접착제 및 이를 이용한 접착필름 |
| US8057889B2 (en) * | 2007-05-21 | 2011-11-15 | Corning Incorporated | Method for producing anisoptropic bulk materials |
| JP2011530426A (ja) * | 2008-08-05 | 2011-12-22 | ワールド プロパティーズ インク. | 導電性ポリマー発泡体、その製造方法、およびその物品 |
| KR100976548B1 (ko) | 2008-09-12 | 2010-08-17 | 김희구 | 약재 성분의 방출이 조절되는 생약패드 및 이의 제조방법 |
| US10090076B2 (en) * | 2009-06-22 | 2018-10-02 | Condalign As | Anisotropic conductive polymer material |
| NO333507B1 (no) * | 2009-06-22 | 2013-06-24 | Condalign As | Fremgangsmate for a lage et anisotropisk, ledende lag og en derav frembrakt gjenstand |
| SG181555A1 (en) * | 2009-12-29 | 2012-07-30 | Rogers Corp | Conductive polymer foams, method of manufacture, and uses thereof |
| US10071902B2 (en) * | 2010-12-08 | 2018-09-11 | Condalign As | Method for assembling conductive particles into conductive pathways and sensors thus formed |
| KR101892198B1 (ko) * | 2010-12-15 | 2018-08-27 | 콘달리그 에이에스 | 자외선 경화성 전도성 조성물의 제조 방법 및 그 방법으로 제조된 조성물 |
| KR101263327B1 (ko) | 2011-05-06 | 2013-05-16 | 광주과학기술원 | 레이저 유도 이온 가속용 박막 부재 제조방법 및 이를 이용한 박막 표적 및 그 제조방법 |
| NO20120740A1 (no) * | 2012-06-25 | 2013-12-26 | Inst Energiteknik | En metode for forming av et legeme med en partikkelstruktur fiksert i et matrisemateriale |
| NO20120739A1 (no) * | 2012-06-25 | 2013-12-26 | Inst Energiteknik | En metode for forming av et legeme med en partikkelstruktur fiksert i et matrisemateriale |
-
2014
- 2014-05-21 EP EP14169206.1A patent/EP2947662A1/en not_active Withdrawn
-
2015
- 2015-05-21 EP EP15724283.5A patent/EP3146530B1/en active Active
- 2015-05-21 JP JP2016568555A patent/JP6518698B2/ja active Active
- 2015-05-21 CN CN201580030329.5A patent/CN106459697A/zh active Pending
- 2015-05-21 US US15/312,485 patent/US20170080609A1/en not_active Abandoned
- 2015-05-21 KR KR1020167034422A patent/KR102337625B1/ko active Active
- 2015-05-21 WO PCT/EP2015/061244 patent/WO2015177275A1/en not_active Ceased
-
2021
- 2021-07-09 US US17/371,214 patent/US11618186B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20170080609A1 (en) | 2017-03-23 |
| EP3146530B1 (en) | 2021-04-21 |
| CN106459697A (zh) | 2017-02-22 |
| US20220134609A1 (en) | 2022-05-05 |
| EP2947662A1 (en) | 2015-11-25 |
| US11618186B2 (en) | 2023-04-04 |
| KR20170012304A (ko) | 2017-02-02 |
| EP3146530A1 (en) | 2017-03-29 |
| JP6518698B2 (ja) | 2019-05-22 |
| JP2017518611A (ja) | 2017-07-06 |
| WO2015177275A1 (en) | 2015-11-26 |
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