KR102331387B1 - 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 및 표시 소자용 접착제 - Google Patents

광 습기 경화형 수지 조성물, 전자 부품용 접착제, 및 표시 소자용 접착제 Download PDF

Info

Publication number
KR102331387B1
KR102331387B1 KR1020217022329A KR20217022329A KR102331387B1 KR 102331387 B1 KR102331387 B1 KR 102331387B1 KR 1020217022329 A KR1020217022329 A KR 1020217022329A KR 20217022329 A KR20217022329 A KR 20217022329A KR 102331387 B1 KR102331387 B1 KR 102331387B1
Authority
KR
South Korea
Prior art keywords
radically polymerizable
meth
compound
adhesive
resin composition
Prior art date
Application number
KR1020217022329A
Other languages
English (en)
Korean (ko)
Other versions
KR20210092846A (ko
Inventor
도루 다카하시
요시타카 구니히로
아키라 유우키
다쿠미 기다
Original Assignee
세키스이가가쿠 고교가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세키스이가가쿠 고교가부시키가이샤 filed Critical 세키스이가가쿠 고교가부시키가이샤
Publication of KR20210092846A publication Critical patent/KR20210092846A/ko
Application granted granted Critical
Publication of KR102331387B1 publication Critical patent/KR102331387B1/ko

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/04Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polyesters
    • C08F299/0407Processes of polymerisation
    • C08F299/0421Polymerisation initiated by wave energy or particle radiation
    • C08F299/0428Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08Processes
    • C08G18/16Catalysts
    • C08G18/22Catalysts containing metal compounds
    • C08G18/24Catalysts containing metal compounds of tin
    • C08G18/244Catalysts containing metal compounds of tin tin salts of carboxylic acids
    • C08G18/246Catalysts containing metal compounds of tin tin salts of carboxylic acids containing also tin-carbon bonds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30Low-molecular-weight compounds
    • C08G18/302Water
    • C08G18/307Atmospheric humidity
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40High-molecular-weight compounds
    • C08G18/48Polyethers
    • C08G18/4825Polyethers containing two hydroxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40High-molecular-weight compounds
    • C08G18/48Polyethers
    • C08G18/4854Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67Unsaturated compounds having active hydrogen
    • C08G18/671Unsaturated compounds having only one group containing active hydrogen
    • C08G18/672Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72Polyisocyanates or polyisothiocyanates
    • C08G18/74Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76Polyisocyanates or polyisothiocyanates cyclic aromatic
    • C08G18/7657Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
    • C08G18/7664Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
    • C08G18/7671Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/81Unsaturated isocyanates or isothiocyanates
    • C08G18/8108Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group
    • C08G18/8116Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group esters of acrylic or alkylacrylic acid having only one isocyanate or isothiocyanate group
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • C09J175/14Polyurethanes having carbon-to-carbon unsaturated bonds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • C09J201/02Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C09J201/06Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Polymerisation Methods In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020217022329A 2014-03-26 2015-03-23 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 및 표시 소자용 접착제 KR102331387B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014064244 2014-03-26
JPJP-P-2014-064244 2014-03-26
PCT/JP2015/058667 WO2015146878A1 (ja) 2014-03-26 2015-03-23 光湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤
KR1020167004100A KR102280354B1 (ko) 2014-03-26 2015-03-23 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 및 표시 소자용 접착제

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020167004100A Division KR102280354B1 (ko) 2014-03-26 2015-03-23 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 및 표시 소자용 접착제

Publications (2)

Publication Number Publication Date
KR20210092846A KR20210092846A (ko) 2021-07-26
KR102331387B1 true KR102331387B1 (ko) 2021-12-01

Family

ID=54195392

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020217022329A KR102331387B1 (ko) 2014-03-26 2015-03-23 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 및 표시 소자용 접착제
KR1020167004100A KR102280354B1 (ko) 2014-03-26 2015-03-23 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 및 표시 소자용 접착제

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020167004100A KR102280354B1 (ko) 2014-03-26 2015-03-23 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 및 표시 소자용 접착제

Country Status (5)

Country Link
JP (1) JP5824597B1 (ja)
KR (2) KR102331387B1 (ja)
CN (1) CN105492480B (ja)
TW (1) TWI682982B (ja)
WO (1) WO2015146878A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017111064A1 (ja) * 2015-12-22 2017-06-29 日立化成株式会社 光硬化性樹脂組成物、遮光用塗料、及び硬化物
JPWO2022149537A1 (ja) * 2021-01-07 2022-07-14
KR102594278B1 (ko) * 2021-12-07 2023-10-26 주식회사 한솔케미칼 저장안정성이 우수한 안료 함유형 광 습기 경화성 수지조성물

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001064543A (ja) * 1999-08-27 2001-03-13 Nippon Shokubai Co Ltd 硬化型被覆材用樹脂組成物
JP2006316175A (ja) * 2005-05-13 2006-11-24 Three Bond Co Ltd 硬化性組成物及びそれを用いた放熱部材の形成方法
JP2015221841A (ja) 2012-09-10 2015-12-10 スリーボンドファインケミカル株式会社 湿気硬化及び光硬化性樹脂組成物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG73647A1 (en) * 1998-06-09 2000-06-20 Nat Starch Chem Invest Uv / moisture cure adhesive
JP2000178342A (ja) 1998-12-17 2000-06-27 Sumitomo Bakelite Co Ltd 絶縁ペースト
JP4342684B2 (ja) 2000-03-21 2009-10-14 昭和高分子株式会社 水反応性光硬化性ウレタン樹脂組成物,frpライニング用樹脂組成物,プライマー樹脂組成物及びそれらの硬化方法
JP4405833B2 (ja) * 2003-03-20 2010-01-27 株式会社トクヤマ 積層体、光学部品、これらの製造方法ならびにコーティング液
EP1812381B1 (en) * 2004-11-04 2011-02-16 Showa Denko K.K. Ethylenically unsaturated group-containing isocyanate compound and process for producing the same, and reactive monomer, reactive (meth)acrylate polymer and its use
US20100010164A1 (en) * 2007-02-02 2010-01-14 Daikin Industries, Ltd Curable resin composition and process for preparing same
JP5921914B2 (ja) * 2012-03-01 2016-05-24 ハリマ化成株式会社 コーティング材およびその製造方法並びにコーティング組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001064543A (ja) * 1999-08-27 2001-03-13 Nippon Shokubai Co Ltd 硬化型被覆材用樹脂組成物
JP2006316175A (ja) * 2005-05-13 2006-11-24 Three Bond Co Ltd 硬化性組成物及びそれを用いた放熱部材の形成方法
JP2015221841A (ja) 2012-09-10 2015-12-10 スリーボンドファインケミカル株式会社 湿気硬化及び光硬化性樹脂組成物

Also Published As

Publication number Publication date
CN105492480A (zh) 2016-04-13
CN105492480B (zh) 2019-11-01
TW201602286A (zh) 2016-01-16
KR102280354B1 (ko) 2021-07-21
JP5824597B1 (ja) 2015-11-25
KR20160137941A (ko) 2016-12-02
JPWO2015146878A1 (ja) 2017-04-13
TWI682982B (zh) 2020-01-21
KR20210092846A (ko) 2021-07-26
WO2015146878A1 (ja) 2015-10-01

Similar Documents

Publication Publication Date Title
KR102323651B1 (ko) 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 및 표시 소자용 접착제
KR102320903B1 (ko) 광습기 경화형 수지 조성물, 전자 부품용 접착제, 및 표시 소자용 접착제
KR102323646B1 (ko) 경화체, 전자 부품, 및, 표시 소자
KR102271405B1 (ko) 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 및 표시 소자용 접착제
KR102260532B1 (ko) 경화체, 전자 부품, 표시 소자 및 광 습기 경화형 수지 조성물
KR102410694B1 (ko) 광 습기 경화형 수지 조성물, 전자 부품용 접착제 및 표시 소자용 접착제
KR102372448B1 (ko) 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 및 표시 소자용 접착제
JP6499561B2 (ja) 光湿気硬化型樹脂組成物
KR102331387B1 (ko) 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 및 표시 소자용 접착제
JP2016147969A (ja) 光湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤
KR20180089280A (ko) 광/습기 경화형 수지 조성물, 전자 부품용 접착제, 및, 표시 소자용 접착제
JP2019065309A (ja) 光湿気硬化型樹脂組成物硬化体

Legal Events

Date Code Title Description
A107 Divisional application of patent
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant