KR102331387B1 - Light-/moisture-curable resin composition, electronic component adhesive, and display element adhesive - Google Patents
Light-/moisture-curable resin composition, electronic component adhesive, and display element adhesive Download PDFInfo
- Publication number
- KR102331387B1 KR102331387B1 KR1020217022329A KR20217022329A KR102331387B1 KR 102331387 B1 KR102331387 B1 KR 102331387B1 KR 1020217022329 A KR1020217022329 A KR 1020217022329A KR 20217022329 A KR20217022329 A KR 20217022329A KR 102331387 B1 KR102331387 B1 KR 102331387B1
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- KR
- South Korea
- Prior art keywords
- radically polymerizable
- meth
- compound
- adhesive
- resin composition
- Prior art date
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- 239000000853 adhesive Substances 0.000 title claims abstract description 48
- 230000001070 adhesive effect Effects 0.000 title claims description 30
- 239000011342 resin composition Substances 0.000 title abstract description 80
- 150000001875 compounds Chemical class 0.000 claims abstract description 92
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims abstract description 42
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims abstract description 30
- 239000003795 chemical substances by application Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 22
- 239000000945 filler Substances 0.000 claims description 21
- 125000000524 functional group Chemical group 0.000 claims description 8
- 239000003999 initiator Substances 0.000 claims description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 5
- 239000001257 hydrogen Substances 0.000 claims description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- 125000006832 (C1-C10) alkylene group Chemical group 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 abstract description 79
- 239000007870 radical polymerization initiator Substances 0.000 abstract description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 89
- -1 methacryloyl Chemical group 0.000 description 54
- 239000003822 epoxy resin Substances 0.000 description 37
- 229920000647 polyepoxide Polymers 0.000 description 37
- 229920005862 polyol Polymers 0.000 description 30
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 23
- 239000004593 Epoxy Substances 0.000 description 22
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 19
- 150000003077 polyols Chemical class 0.000 description 19
- 239000000126 substance Substances 0.000 description 18
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 17
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 17
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 15
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 14
- 150000003254 radicals Chemical class 0.000 description 14
- 239000010936 titanium Substances 0.000 description 14
- 229910052719 titanium Inorganic materials 0.000 description 14
- 238000011156 evaluation Methods 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 10
- 150000002148 esters Chemical class 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 239000011164 primary particle Substances 0.000 description 10
- 229920000515 polycarbonate Polymers 0.000 description 9
- 239000004417 polycarbonate Substances 0.000 description 9
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 8
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 8
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000012948 isocyanate Substances 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 239000000377 silicon dioxide Substances 0.000 description 7
- 238000003786 synthesis reaction Methods 0.000 description 7
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 6
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 6
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 6
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 6
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 5
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 5
- 239000004721 Polyphenylene oxide Substances 0.000 description 5
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000001723 curing Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 229920005906 polyester polyol Polymers 0.000 description 5
- 229920000570 polyether Polymers 0.000 description 5
- 229920001223 polyethylene glycol Polymers 0.000 description 5
- 239000005056 polyisocyanate Substances 0.000 description 5
- 229920001228 polyisocyanate Polymers 0.000 description 5
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 5
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 4
- 239000002202 Polyethylene glycol Substances 0.000 description 4
- 208000034189 Sclerosis Diseases 0.000 description 4
- 239000004305 biphenyl Substances 0.000 description 4
- 235000010290 biphenyl Nutrition 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 125000005442 diisocyanate group Chemical group 0.000 description 4
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- 235000011187 glycerol Nutrition 0.000 description 4
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 4
- 230000005661 hydrophobic surface Effects 0.000 description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 230000009974 thixotropic effect Effects 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000001588 bifunctional effect Effects 0.000 description 3
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 150000002009 diols Chemical class 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
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- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 3
- 239000011163 secondary particle Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 2
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- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
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- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- VZTQQYMRXDUHDO-UHFFFAOYSA-N [2-hydroxy-3-[4-[2-[4-(2-hydroxy-3-prop-2-enoyloxypropoxy)phenyl]propan-2-yl]phenoxy]propyl] prop-2-enoate Chemical compound C=1C=C(OCC(O)COC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OCC(O)COC(=O)C=C)C=C1 VZTQQYMRXDUHDO-UHFFFAOYSA-N 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
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- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 2
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- ZCIJAGHWGVCOHJ-UHFFFAOYSA-N naphthalene phenol Chemical compound C1(=CC=CC=C1)O.C1(=CC=CC=C1)O.C1=CC=CC2=CC=CC=C12.C1(=CC=CC=C1)O ZCIJAGHWGVCOHJ-UHFFFAOYSA-N 0.000 description 2
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- 125000004206 2,2,2-trifluoroethyl group Chemical group [H]C([H])(*)C(F)(F)F 0.000 description 1
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- FWLHAQYOFMQTHQ-UHFFFAOYSA-N 2-N-[8-[[8-(4-aminoanilino)-10-phenylphenazin-10-ium-2-yl]amino]-10-phenylphenazin-10-ium-2-yl]-8-N,10-diphenylphenazin-10-ium-2,8-diamine hydroxy-oxido-dioxochromium Chemical compound O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.Nc1ccc(Nc2ccc3nc4ccc(Nc5ccc6nc7ccc(Nc8ccc9nc%10ccc(Nc%11ccccc%11)cc%10[n+](-c%10ccccc%10)c9c8)cc7[n+](-c7ccccc7)c6c5)cc4[n+](-c4ccccc4)c3c2)cc1 FWLHAQYOFMQTHQ-UHFFFAOYSA-N 0.000 description 1
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
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- C—CHEMISTRY; METALLURGY
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
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- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
- C08F299/04—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polyesters
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- C08F299/0421—Polymerisation initiated by wave energy or particle radiation
- C08F299/0428—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G18/246—Catalysts containing metal compounds of tin tin salts of carboxylic acids containing also tin-carbon bonds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C—CHEMISTRY; METALLURGY
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C—CHEMISTRY; METALLURGY
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- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
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- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/67—Unsaturated compounds having active hydrogen
- C08G18/671—Unsaturated compounds having only one group containing active hydrogen
- C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
- C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
- C08G18/7671—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group
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- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/81—Unsaturated isocyanates or isothiocyanates
- C08G18/8108—Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group
- C08G18/8116—Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group esters of acrylic or alkylacrylic acid having only one isocyanate or isothiocyanate group
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- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
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Abstract
본 발명은 유연성, 접착성, 및 고온 고습 환경하에 있어서의 신뢰성이 우수한 광 습기 경화형 수지 조성물을 제공하는 것을 목적으로 한다. 또, 본 발명은 그 광 습기 경화형 수지 조성물을 사용하여 이루어지는 전자 부품용 접착제 및 표시 소자용 접착제를 제공하는 것을 목적으로 한다. 본 발명은 라디칼 중합성 화합물과, 습기 경화형 우레탄 수지와, 광 라디칼 중합 개시제를 함유하고, 상기 라디칼 중합성 화합물은, 이소시아네이트기와 라디칼 중합성기를 갖는 화합물, 및 이소시아네이트기를 갖지 않고, 라디칼 중합성기를 갖는 화합물을 함유하는 광 습기 경화형 수지 조성물이다.An object of the present invention is to provide an optical moisture curable resin composition excellent in flexibility, adhesiveness, and reliability in a high-temperature, high-humidity environment. Moreover, an object of this invention is to provide the adhesive agent for electronic components and the adhesive agent for display elements which use this optical moisture hardening type resin composition. The present invention contains a radically polymerizable compound, a moisture-curable urethane resin, and an optical radical polymerization initiator, wherein the radically polymerizable compound is a compound having an isocyanate group and a radically polymerizable group, and without an isocyanate group, having a radically polymerizable group It is an optical moisture hardening type resin composition containing a compound.
Description
본 발명은 유연성, 접착성, 및 고온 고습 환경하에 있어서의 신뢰성이 우수한 광 습기 경화형 수지 조성물에 관한 것이다. 또, 본 발명은 그 광 습기 경화형 수지 조성물을 사용하여 이루어지는 전자 부품용 접착제 및 표시 소자용 접착제에 관한 것이다.The present invention relates to an optical moisture curable resin composition excellent in flexibility, adhesiveness, and reliability in a high-temperature, high-humidity environment. Moreover, this invention relates to the adhesive agent for electronic components and the adhesive agent for display elements which use this optical moisture hardening type resin composition.
최근, 박형, 경량, 저소비 전력 등의 특징을 갖는 표시 소자로서, 액정 표시 소자나 유기 EL 표시 소자 등이 널리 이용되고 있다. 이들 표시 소자에서는, 통상적으로 액정이나 발광층의 밀봉, 기판이나 광학 필름이나 보호 필름이나 각종 부재의 접착 등에 광 경화형 수지 조성물이 사용되고 있다.In recent years, a liquid crystal display element, an organic electroluminescent display element, etc. are widely used as a display element which has characteristics, such as thin shape, light weight, and low power consumption. In these display elements, a photocurable resin composition is normally used for sealing of a liquid crystal and a light emitting layer, adhesion|attachment of a board|substrate, an optical film, a protective film, and various members, etc.
그런데, 휴대 전화, 휴대 게임기 등, 각종 표시 소자가 부착된 모바일 기기가 보급되어 있는 현대에 있어서, 표시 소자의 소형화는 가장 요구되고 있는 과제이며, 소형화의 수법으로서, 화상 표시부를 협액자화하는 것이 실시되고 있다 (이하, 협액자 설계라고도 한다). 그러나, 협액자 설계에 있어서는, 충분히 광이 닿지 않는 부분에 광 경화형 수지 조성물이 도포되는 경우가 있고, 그 결과, 광이 닿지 않는 부분에 도포된 광 경화형 수지 조성물은 경화가 불충분해진다는 문제가 있었다. 그래서, 광이 닿지 않는 부분에 도포되었을 경우에도 충분히 경화시킬 수 있는 수지 조성물로서 광열 경화형 수지 조성물을 사용하여, 광 경화와 열 경화를 병용하는 것도 실시되고 있지만, 고온에서의 가열에 의해 소자 등에 악영향을 미칠 우려가 있었다.By the way, in the present age in which mobile devices equipped with various display elements, such as mobile phones and portable game machines, are widespread, miniaturization of display elements is the most demanded problem, and as a method of miniaturization, narrowing the image display unit is (hereinafter also referred to as a narrow frame design). However, in a narrow frame design, the photocurable resin composition may be applied to a portion not sufficiently exposed to light. As a result, the photocurable resin composition applied to a portion not exposed to light has a problem that curing becomes insufficient . Therefore, using a photothermal curing resin composition as a resin composition capable of sufficiently curing even when applied to a portion not exposed to light, using a photothermal curing resin composition in combination with photocuring and thermal curing is also carried out. There was a risk of affecting
또, 최근, 반도체 칩 등의 전자 부품에서는, 고집적화, 소형화가 요구되고 있고, 예를 들어, 접착제층을 개재하여 복수의 얇은 반도체 칩을 접합하여 반도체 칩의 적층체로 하는 것이 실시되고 있다. 이와 같은 반도체 칩의 적층체는, 예를 들어, 일방의 반도체 칩 상에 접착제를 도포한 후, 그 접착제를 통해 타방의 반도체 칩을 적층하고, 그 후, 접착제를 광이나 열로 경화시키는 방법이나, 일정한 간격을 두고 유지한 반도체 칩 사이에 접착제를 충전하고, 그 후, 광이나 열로 접착제를 경화시키는 방법 등에 의해 제조되고 있다.Moreover, in recent years, in electronic components, such as a semiconductor chip, high integration and miniaturization are calculated|required, for example, bonding a plurality of thin semiconductor chips through an adhesive layer to set it as a laminated body of a semiconductor chip is performed. Such a semiconductor chip laminate is, for example, a method in which an adhesive is applied on one semiconductor chip, the other semiconductor chip is laminated through the adhesive, and then the adhesive is cured with light or heat, It is manufactured by the method of filling an adhesive agent between the semiconductor chips hold|maintained at regular intervals, and hardening the adhesive agent with light or heat after that.
이와 같은 전자 부품의 접착에 사용되는 접착제로서, 광 경화형에서는 광이 닿지 않는 부분이 발생하여, 충분한 접착력을 얻을 수 없기 때문에, 예를 들어, 특허문헌 1 에는, 수평균 분자량이 600 ∼ 1000 인 에폭시 화합물을 함유하는 열 경화형의 접착제가 개시되어 있다. 그러나, 특허문헌 1 에 개시되어 있는 바와 같은 열 경화형의 접착제는, 열에 의해 손상될 가능성이 있는 전자 부품의 접착에는 적합하지 않은 것이었다.As an adhesive used for bonding such electronic components, in a photocurable type, a portion that does not reach light occurs and sufficient adhesive strength cannot be obtained. For example, in
고온에서의 가열을 실시하지 않고 수지 조성물을 경화시키는 방법으로서, 특허문헌 2 에는, 라디칼 중합성 화합물과, 습기 경화형 우레탄 수지와, 광 라디칼 중합 개시제를 함유하는 광 습기 경화형 수지 조성물을 사용하여, 광 경화와 습기 경화를 병용하는 방법이 개시되어 있다. 그러나, 특허문헌 2 에 개시되어 있는 바와 같은 광 습기 경화형 수지 조성물은, 유연성, 접착성, 및 고온 고습 환경하에 있어서의 신뢰성 (특히 내크리프성) 모두 우수한 것으로 하는 것이 곤란하였다.As a method of hardening a resin composition without heating at high temperature, in
본 발명은 유연성, 접착성, 및 고온 고습 환경하에 있어서의 신뢰성이 우수한 광 습기 경화형 수지 조성물을 제공하는 것을 목적으로 한다. 또, 본 발명은 그 광 습기 경화형 수지 조성물을 사용하여 이루어지는 전자 부품용 접착제 및 표시 소자용 접착제를 제공하는 것을 목적으로 한다.An object of the present invention is to provide an optical moisture curable resin composition excellent in flexibility, adhesiveness, and reliability in a high-temperature, high-humidity environment. Moreover, an object of this invention is to provide the adhesive agent for electronic components and the adhesive agent for display elements which use this optical moisture hardening type resin composition.
본 발명은 라디칼 중합성 화합물과, 습기 경화형 우레탄 수지와, 광 라디칼 중합 개시제를 함유하고, 상기 라디칼 중합성 화합물은, 이소시아네이트기와 라디칼 중합성기를 갖는 화합물, 및 이소시아네이트기를 갖지 않고, 라디칼 중합성기를 갖는 화합물을 함유하는 광 습기 경화형 수지 조성물이다.The present invention contains a radically polymerizable compound, a moisture-curable urethane resin, and an optical radical polymerization initiator, wherein the radically polymerizable compound is a compound having an isocyanate group and a radically polymerizable group, and without an isocyanate group, having a radically polymerizable group It is an optical moisture hardening type resin composition containing a compound.
이하에 본 발명을 상세히 서술한다.Hereinafter, the present invention will be described in detail.
본 발명자들은, 라디칼 중합성 화합물과, 습기 경화형 우레탄 수지와, 광 라디칼 중합 개시제를 함유하는 광 습기 경화형 수지 조성물에 있어서, 유연성이나, 접착성이나, 고온 고습 환경하에 있어서의 신뢰성이 충분히 얻어지지 않는 원인이, 라디칼 중합성 화합물과 습기 경화형 우레탄 수지를 경화시켰을 때의 상분리에 의해 균일한 경화물을 얻지 못했기 때문으로 생각하였다. 그래서 본 발명자들은, 라디칼 중합성 화합물의 일부에 이소시아네이트기와 라디칼 중합성기를 갖는 화합물을 사용함으로써, 유연성, 접착성, 및 고온 고습 환경하에 있어서의 신뢰성 모두 우수한 광 습기 경화형 수지 조성물을 얻을 수 있는 것을 알아내어, 본 발명을 완성시키기에 이르렀다.The present inventors, in the optical moisture curable resin composition containing a radically polymerizable compound, a moisture curable urethane resin, and an optical radical polymerization initiator, flexibility, adhesiveness, and reliability in a high-temperature, high-humidity environment are not sufficiently obtained. It was thought that the cause was because a uniform hardened|cured material was not obtained by phase separation at the time of hardening a radically polymerizable compound and a moisture-curable urethane resin. Therefore, the present inventors found that by using a compound having an isocyanate group and a radically polymerizable group in a part of the radically polymerizable compound, an optical moisture curable resin composition excellent in both flexibility, adhesiveness, and reliability in a high-temperature, high-humidity environment can be obtained. and came to complete the present invention.
본 발명의 광 습기 경화형 수지 조성물은, 라디칼 중합성 화합물을 함유한다.The optical moisture hardening type resin composition of this invention contains a radically polymerizable compound.
상기 라디칼 중합성 화합물은, 이소시아네이트기와 라디칼 중합성기를 갖는 화합물 (이하, 「이소시아네이트기를 갖는 라디칼 중합성 화합물」 이라고도 한다), 및 이소시아네이트기를 갖지 않고, 라디칼 중합성기를 갖는 화합물 (이하, 「이소시아네이트기를 갖지 않는 라디칼 중합성 화합물」 이라고도 한다) 을 함유한다. 상기 이소시아네이트기를 갖는 라디칼 중합성 화합물이, 상기 이소시아네이트기를 갖지 않는 라디칼 중합성 화합물과, 습기 경화형 우레탄 수지의 양방과 반응함으로써, 상분리가 억제되고, 얻어지는 광 습기 경화형 수지 조성물이 유연성, 접착성, 및 고온 고습 환경하에 있어서의 신뢰성이 우수한 것이 된다.The radical polymerizable compound is a compound having an isocyanate group and a radical polymerizable group (hereinafter also referred to as “a radical polymerizable compound having an isocyanate group”), and a compound having no isocyanate group and a radical polymerizable group (hereinafter referred to as “having an isocyanate group”). Also called "radical polymerizable compound"). When the radical polymerizable compound having an isocyanate group reacts with both the radical polymerizable compound not having an isocyanate group and a moisture curable urethane resin, phase separation is suppressed, and the optical moisture curable resin composition obtained is flexible, adhesive, and high temperature It becomes the thing excellent in the reliability in a high-humidity environment.
상기 이소시아네이트기를 갖는 라디칼 중합성 화합물이 갖는 라디칼 중합성 관능기로는, 불포화 이중 결합을 갖는 기가 바람직하고, 특히 반응성의 면에서 (메트)아크릴로일기가 보다 바람직하다.As a radically polymerizable functional group which the radically polymerizable compound which has the said isocyanate group has, group which has an unsaturated double bond is preferable, and a (meth)acryloyl group is more preferable especially from a reactive point.
또한 본 명세서에 있어서, 상기 「(메트)아크릴로일」 은, 아크릴로일 또는 메타크릴로일을 의미한다.In addition, in this specification, the said "(meth)acryloyl" means acryloyl or methacryloyl.
상기 이소시아네이트기를 갖는 라디칼 중합성 화합물로는, 구체적으로는 예를 들어, 하기 식 (1) 로 나타내는 화합물, 비닐이소시아네이트 등을 들 수 있다. 또, 각종 디이소시아네이트 화합물과, 수산기 및 (메트)아크릴로일기를 갖는 화합물을, 이소시아네이트기/수산기 (몰비) 가 2 가 되는 비율로 반응시킴으로써 합성되는 화합물 등도 사용할 수 있다. 그 중에서도, 입수가 용이한 점에서, 하기 식 (1) 로 나타내는 화합물이 바람직하다.Specific examples of the radically polymerizable compound having an isocyanate group include a compound represented by the following formula (1), vinyl isocyanate, and the like. Moreover, the compound etc. which are synthesize|combined by making various diisocyanate compounds and the compound which have a hydroxyl group and a (meth)acryloyl group react in the ratio used as isocyanate group/hydroxyl group (molar ratio) become 2 can also be used. Especially, the compound represented by following formula (1) is preferable at the point which an acquisition is easy.
[화학식 1][Formula 1]
식 (1) 중, R1 은 수소 또는 메틸기를 나타내고, R2 는 에테르 결합을 가지고 있어도 되는 탄소수 1 ∼ 10 의 알킬렌기를 나타낸다.In Formula (1), R<1> represents hydrogen or a methyl group, and R<2> represents the C1-C10 alkylene group which may have an ether bond.
상기 이소시아네이트기를 갖는 라디칼 중합성 화합물의 함유량은, 라디칼 중합성 화합물 전체 100 중량부에 대하여, 바람직한 하한이 1 중량부, 바람직한 상한이 30 중량부이다. 상기 이소시아네이트기를 갖는 라디칼 중합성 화합물의 함유량이 1 중량부 미만이면, 얻어지는 광 습기 경화형 수지 조성물을 경화시켰을 때에 균일한 경화물을 얻지 못하고, 유연성이나 접착성이나 고온 고습 환경하에 있어서의 신뢰성이 불충분해지는 경우가 있다. 상기 이소시아네이트기를 갖는 라디칼 중합성 화합물의 함유량이 30 중량부를 초과하면, 얻어지는 광 습기 경화형 수지 조성물이, 가교가 지나치게 진행되어 유연성이 떨어지는 경우가 있다. 상기 이소시아네이트기를 갖는 라디칼 중합성 화합물의 함유량의 보다 바람직한 하한은 2 중량부, 보다 바람직한 상한은 20 중량부이다.As for content of the radically polymerizable compound which has the said isocyanate group, with respect to 100 weight part of all radically polymerizable compounds, a preferable minimum is 1 weight part, and a preferable upper limit is 30 weight part. When the content of the radically polymerizable compound having an isocyanate group is less than 1 part by weight, a uniform cured product cannot be obtained when the optical moisture curable resin composition obtained is cured, and flexibility, adhesiveness, and reliability in a high-temperature, high-humidity environment are insufficient. There are cases. When content of the radically polymerizable compound which has the said isocyanate group exceeds 30 weight part, bridge|crosslinking advances too much and the softness|flexibility of the optical moisture hardening type resin composition obtained may be inferior. The minimum with more preferable content of the radically polymerizable compound which has the said isocyanate group is 2 weight part, and a more preferable upper limit is 20 weight part.
상기 이소시아네이트기를 갖지 않는 라디칼 중합성 화합물로는, 이소시아네이트기를 갖지 않고, 분자 중에 라디칼 중합성 관능기를 갖는 화합물이면 특별히 한정되지 않지만, 라디칼 중합성 관능기로서 불포화 이중 결합을 갖는 화합물이 바람직하고, 특히 반응성의 면에서 (메트)아크릴로일기를 갖는 화합물 (이하, 「(메트)아크릴 화합물」 이라고도 한다) 이 바람직하다.The radically polymerizable compound not having an isocyanate group is not particularly limited as long as it is a compound that does not have an isocyanate group and has a radically polymerizable functional group in the molecule, but a compound having an unsaturated double bond as the radically polymerizable functional group is preferable, and particularly reactive A compound (henceforth a "(meth)acryl compound") which has a (meth)acryloyl group in view is preferable.
또한 본 명세서에 있어서, 상기 「(메트)아크릴」 은, 아크릴 또는 메타크릴을 의미한다.In addition, in this specification, the said "(meth)acryl" means acryl or methacryl.
상기 (메트)아크릴 화합물로는, 예를 들어, (메트)아크릴산에 수산기를 갖는 화합물을 반응시킴으로써 얻어지는 에스테르 화합물, (메트)아크릴산과 에폭시 화합물을 반응시킴으로써 얻어지는 에폭시(메트)아크릴레이트, 이소시아네이트 화합물에 수산기를 갖는 (메트)아크릴산 유도체를 반응시킴으로써 얻어지는 우레탄(메트)아크릴레이트 등을 들 수 있다.Examples of the (meth)acrylic compound include an ester compound obtained by reacting (meth)acrylic acid with a compound having a hydroxyl group, an epoxy (meth)acrylate obtained by reacting (meth)acrylic acid with an epoxy compound, and an isocyanate compound. The urethane (meth)acrylate etc. which are obtained by making the (meth)acrylic acid derivative which have a hydroxyl group react are mentioned.
또한 본 명세서에 있어서, 상기 「(메트)아크릴레이트」 란, 아크릴레이트 또는 메타크릴레이트를 의미한다. 또, 상기 우레탄(메트)아크릴레이트의 원료가 되는 이소시아네이트의 이소시아네이트기는, 모두 우레탄 결합의 형성에 사용되고, 상기 우레탄(메트)아크릴레이트는, 잔존 이소시아네이트기를 갖지 않는다.In addition, in this specification, the said "(meth)acrylate" means an acrylate or a methacrylate. Moreover, all isocyanate groups of the isocyanate used as the raw material of the said urethane (meth)acrylate are used for formation of a urethane bond, and the said urethane (meth)acrylate does not have a residual isocyanate group.
상기 에스테르 화합물 중 단관능의 것으로는, 예를 들어, N-아크릴로일옥시에틸헥사하이드로프탈이미드 등의 프탈이미드아크릴레이트류나 각종 이미드아크릴레이트, 메틸(메트)아크릴레이트, 에틸(메트)아크릴레이트, n-프로필(메트)아크릴레이트, n-부틸(메트)아크릴레이트, 이소부틸(메트)아크릴레이트, t-부틸(메트)아크릴레이트, n-옥틸(메트)아크릴레이트, 이소옥틸(메트)아크릴레이트, 2-에틸헥실(메트)아크릴레이트, 이소노닐(메트)아크릴레이트, 이소데실(메트)아크릴레이트, 라우릴(메트)아크릴레이트, 이소미리스틸(메트)아크릴레이트, 스테아릴(메트)아크릴레이트, 시클로헥실(메트)아크릴레이트, 이소보르닐(메트)아크릴레이트, 디시클로펜테닐(메트)아크릴레이트, 벤질(메트)아크릴레이트, 2-하이드록시에틸(메트)아크릴레이트, 2-하이드록시프로필(메트)아크릴레이트, 2-하이드록시부틸(메트)아크릴레이트, 4-하이드록시부틸(메트)아크릴레이트, 2-메톡시에틸(메트)아크릴레이트, 2-에톡시에틸(메트)아크릴레이트, 2-부톡시에틸(메트)아크릴레이트, 메톡시에틸렌글리콜(메트)아크릴레이트, 메톡시폴리에틸렌글리콜(메트)아크릴레이트, 에틸카르비톨(메트)아크릴레이트, 테트라하이드로푸르푸릴(메트)아크릴레이트, 2-페녹시에틸(메트)아크릴레이트, 페녹시디에틸렌글리콜(메트)아크릴레이트, 페녹시폴리에틸렌글리콜(메트)아크릴레이트, 2,2,2-트리플루오로에틸(메트)아크릴레이트, 2,2,3,3-테트라플루오로프로필(메트)아크릴레이트, 1H,1H,5H-옥타플루오로펜틸(메트)아크릴레이트, 디메틸아미노에틸(메트)아크릴레이트, 디에틸아미노에틸(메트)아크릴레이트, 2-(메트)아크릴로일옥시에틸숙신산, 2-(메트)아크릴로일옥시에틸헥사하이드로프탈산, 2-(메트)아크릴로일옥시에틸2-하이드록시프로필프탈레이트, 글리시딜(메트)아크릴레이트, 2-(메트)아크릴로일옥시에틸포스페이트 등을 들 수 있다.As a monofunctional thing among the said ester compounds, For example, phthalimide acrylates, such as N-acryloyloxyethyl hexahydrophthalimide, various imide acrylates, methyl (meth)acrylate, ethyl ( Meth) acrylate, n-propyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, n-octyl (meth) acrylate, iso Octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isononyl (meth) acrylate, isodecyl (meth) acrylate, lauryl (meth) acrylate, isomyristyl (meth) acrylate, Stearyl (meth) acrylate, cyclohexyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentenyl (meth) acrylate, benzyl (meth) acrylate, 2-hydroxyethyl (meth) Acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 2-methoxyethyl (meth) acrylate, 2- Toxyethyl (meth) acrylate, 2-butoxyethyl (meth) acrylate, methoxyethylene glycol (meth) acrylate, methoxy polyethylene glycol (meth) acrylate, ethyl carbitol (meth) acrylate, tetrahydro Furfuryl (meth) acrylate, 2-phenoxyethyl (meth) acrylate, phenoxydiethylene glycol (meth) acrylate, phenoxy polyethylene glycol (meth) acrylate, 2,2,2-trifluoroethyl ( Meth)acrylate, 2,2,3,3-tetrafluoropropyl (meth)acrylate, 1H,1H,5H-octafluoropentyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, diethyl Aminoethyl (meth) acrylate, 2- (meth) acryloyloxyethyl succinic acid, 2- (meth) acryloyloxyethyl hexahydrophthalic acid, 2- (meth) acryloyloxyethyl 2-hydroxypropyl phthalate , glycidyl (meth)acrylate, 2-(meth)acryloyloxyethyl phosphate, and the like.
또, 상기 에스테르 화합물 중 2 관능의 것으로는, 예를 들어, 1,3-부탄디올디(메트)아크릴레이트, 1,4-부탄디올디(메트)아크릴레이트, 1,6-헥산디올디(메트)아크릴레이트, 1,9-노난디올디(메트)아크릴레이트, 1,10-데칸디올디(메트)아크릴레이트, 2-n-부틸-2-에틸-1,3-프로판디올디(메트)아크릴레이트, 에틸렌글리콜디(메트)아크릴레이트, 디에틸렌글리콜디(메트)아크릴레이트, 테트라에틸렌글리콜디(메트)아크릴레이트, 폴리에틸렌글리콜디(메트)아크릴레이트, 디프로필렌글리콜디(메트)아크릴레이트, 트리프로필렌글리콜디(메트)아크릴레이트, 폴리프로필렌글리콜(메트)아크릴레이트, 에틸렌옥사이드 부가 비스페놀 A 디(메트)아크릴레이트, 프로필렌옥사이드 부가 비스페놀 A 디(메트)아크릴레이트, 에틸렌옥사이드 부가 비스페놀 F 디(메트)아크릴레이트, 디메틸올디시클로펜타디에닐디(메트)아크릴레이트, 네오펜틸글리콜디(메트)아크릴레이트, 에틸렌옥사이드 변성 이소시아누르산디(메트)아크릴레이트, 2-하이드록시-3-(메트)아크릴로일옥시프로필(메트)아크릴레이트, 카보네이트디올디(메트)아크릴레이트, 폴리에테르디올디(메트)아크릴레이트, 폴리에스테르디올디(메트)아크릴레이트, 폴리카프로락톤디올디(메트)아크릴레이트, 폴리부타디엔디올디(메트)아크릴레이트 등을 들 수 있다.Moreover, as a bifunctional thing among the said ester compounds, 1, 3- butanediol di (meth) acrylate, 1, 4- butanediol di (meth) acrylate, 1, 6- hexanediol di (meth) acrylate, Acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, 2-n-butyl-2-ethyl-1,3-propanediol di(meth)acryl rate, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, dipropylene glycol di (meth) acrylate, Tripropylene glycol di(meth)acrylate, polypropylene glycol (meth)acrylate, ethylene oxide addition bisphenol A di(meth)acrylate, propylene oxide addition bisphenol A di(meth)acrylate, ethylene oxide addition bisphenol F di( Meth) acrylate, dimethyloldicyclopentadienyl di (meth) acrylate, neopentyl glycol di (meth) acrylate, ethylene oxide-modified isocyanuric acid di (meth) acrylate, 2-hydroxy-3- (meth) Acryloyloxypropyl (meth) acrylate, carbonate diol di (meth) acrylate, polyether diol di (meth) acrylate, polyester diol di (meth) acrylate, polycaprolactone diol di (meth) acrylate , polybutadienediol di(meth)acrylate, and the like.
또, 상기 에스테르 화합물 중 3 관능 이상의 것으로는, 예를 들어, 트리메틸올프로판트리(메트)아크릴레이트, 에틸렌옥사이드 부가 트리메틸올프로판트리(메트)아크릴레이트, 프로필렌옥사이드 부가 트리메틸올프로판트리(메트)아크릴레이트, 카프로락톤 변성 트리메틸올프로판트리(메트)아크릴레이트, 펜타에리트리톨트리(메트)아크릴레이트, 에틸렌옥사이드 부가 이소시아누르산트리(메트)아크릴레이트, 글리세린트리(메트)아크릴레이트, 프로필렌옥사이드 부가 글리세린트리(메트)아크릴레이트, 트리스(메트)아크릴로일옥시에틸포스페이트, 디트리메틸올프로판테트라(메트)아크릴레이트, 펜타에리트리톨테트라(메트)아크릴레이트, 디펜타에리트리톨펜타(메트)아크릴레이트, 디펜타에리트리톨헥사(메트)아크릴레이트 등을 들 수 있다.Moreover, as a thing more than trifunctional among the said ester compound, trimethylol propane tri(meth)acrylate, ethylene oxide addition trimethylol propane tri(meth)acrylate, propylene oxide addition trimethylol propane tri(meth)acryl Rate, caprolactone-modified trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, ethylene oxide addition isocyanuric acid tri(meth)acrylate, glycerin tri(meth)acrylate, propylene oxide addition Glycerin tri (meth) acrylate, tris (meth) acryloyloxyethyl phosphate, ditrimethylolpropane tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate , dipentaerythritol hexa(meth)acrylate, and the like.
상기 에폭시(메트)아크릴레이트로는, 예를 들어, 에폭시 화합물과 (메트)아크릴산을, 통상적인 방법에 따라 염기성 촉매의 존재하에서 반응시킴으로써 얻어지는 것 등을 들 수 있다.As said epoxy (meth)acrylate, the thing obtained by making an epoxy compound and (meth)acrylic acid react in presence of a basic catalyst according to a conventional method, etc. are mentioned, for example.
상기 에폭시(메트)아크릴레이트를 합성하기 위한 원료가 되는 에폭시 화합물로는, 예를 들어, 비스페놀 A 형 에폭시 수지, 비스페놀 F 형 에폭시 수지, 비스페놀 S 형 에폭시 수지, 2,2'-디알릴비스페놀 A 형 에폭시 수지, 수소 첨가 비스페놀형 에폭시 수지, 프로필렌옥사이드 부가 비스페놀 A 형 에폭시 수지, 레조르시놀형 에폭시 수지, 비페닐형 에폭시 수지, 술파이드형 에폭시 수지, 디페닐에테르형 에폭시 수지, 디시클로펜타디엔형 에폭시 수지, 나프탈렌형 에폭시 수지, 페놀 노볼락형 에폭시 수지, 오르토 크레졸 노볼락형 에폭시 수지, 디시클로펜타디엔 노볼락형 에폭시 수지, 비페닐 노볼락형 에폭시 수지, 나프탈렌페놀 노볼락형 에폭시 수지, 글리시딜아민형 에폭시 수지, 알킬폴리올형 에폭시 수지, 고무 변성형 에폭시 수지, 글리시딜에스테르 화합물, 비스페놀 A 형 에피술파이드 수지 등을 들 수 있다.As an epoxy compound used as a raw material for synthesizing the said epoxy (meth)acrylate, For example, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a bisphenol S type epoxy resin, 2,2'- diallyl bisphenol A Epoxy resin, hydrogenated bisphenol type epoxy resin, propylene oxide added bisphenol A type epoxy resin, resorcinol type epoxy resin, biphenyl type epoxy resin, sulfide type epoxy resin, diphenyl ether type epoxy resin, dicyclopentadiene type epoxy resin Epoxy resin, naphthalene type epoxy resin, phenol novolak type epoxy resin, ortho cresol novolak type epoxy resin, dicyclopentadiene novolak type epoxy resin, biphenyl novolak type epoxy resin, naphthalenephenol novolak type epoxy resin, glycol Cydylamine type epoxy resin, alkyl polyol type epoxy resin, rubber-modified type epoxy resin, glycidyl ester compound, bisphenol A type episulfide resin, etc. are mentioned.
상기 비스페놀 A 형 에폭시 수지 중 시판되고 있는 것으로는, 예를 들어, jER828EL, jER1001, jER1004 (모두 미츠비시 화학사 제조), 에피크론 850-S (DIC 사 제조) 등을 들 수 있다.As what is marketed among the said bisphenol A epoxy resins, jER828EL, jER1001, jER1004 (all are made by Mitsubishi Chemical Corporation), Epicron 850-S (made by DIC Corporation), etc. are mentioned, for example.
상기 비스페놀 F 형 에폭시 수지 중 시판되고 있는 것으로는, 예를 들어, jER806, jER4004 (모두 미츠비시 화학사 제조) 등을 들 수 있다.As what is marketed among the said bisphenol F-type epoxy resins, jER806, jER4004 (all are Mitsubishi Chemical Corporation make) etc. are mentioned, for example.
상기 비스페놀 S 형 에폭시 수지 중 시판되고 있는 것으로는, 예를 들어, 에피크론 EXA1514 (DIC 사 제조) 등을 들 수 있다.As what is marketed among the said bisphenol S epoxy resins, Epicron EXA1514 (made by DIC Corporation) etc. are mentioned, for example.
상기 2,2'-디알릴비스페놀 A 형 에폭시 수지 중 시판되고 있는 것으로는, 예를 들어, RE-810NM (닛폰 가야쿠사 제조) 등을 들 수 있다.As what is marketed among the said 2,2'- diallylbisphenol A epoxy resins, RE-810NM (made by Nippon Kayaku Co., Ltd.) etc. are mentioned, for example.
상기 수소 첨가 비스페놀형 에폭시 수지 중 시판되고 있는 것으로는, 예를 들어, 에피크론 EXA7015 (DIC 사 제조) 등을 들 수 있다.As what is marketed among the said hydrogenated bisphenol-type epoxy resins, Epicron EXA7015 (made by DIC Corporation) etc. are mentioned, for example.
상기 프로필렌옥사이드 부가 비스페놀 A 형 에폭시 수지 중 시판되고 있는 것으로는, 예를 들어, EP-4000S (ADEKA 사 제조) 등을 들 수 있다.As what is marketed among the said propylene oxide addition bisphenol A epoxy resins, EP-4000S (made by ADEKA) etc. are mentioned, for example.
상기 레조르시놀형 에폭시 수지 중 시판되고 있는 것으로는, 예를 들어, EX-201 (나가세 켐텍스사 제조) 등을 들 수 있다.As what is marketed among the said resorcinol-type epoxy resins, EX-201 (made by Nagase Chemtex) etc. is mentioned, for example.
상기 비페닐형 에폭시 수지 중 시판되고 있는 것으로는, 예를 들어, jERYX-4000H (미츠비시 화학사 제조) 등을 들 수 있다.As what is marketed among the said biphenyl type epoxy resin, jERYX-4000H (made by Mitsubishi Chemical Corporation) etc. are mentioned, for example.
상기 술파이드형 에폭시 수지 중 시판되고 있는 것으로는, 예를 들어, YSLV-50TE (신닛테츠 스미킨 화학사 제조) 등을 들 수 있다.As what is marketed among the said sulfide-type epoxy resins, YSLV-50TE (made by Nippon-Sumikin Chemical Co., Ltd.) etc. are mentioned, for example.
상기 디페닐에테르형 에폭시 수지 중 시판되고 있는 것으로는, 예를 들어, YSLV-80DE (신닛테츠 스미킨 화학사 제조) 등을 들 수 있다.As what is marketed among the said diphenyl ether type|mold epoxy resins, YSLV-80DE (made by the Nippon Tetsu Sumikin Chemical Company) etc. are mentioned, for example.
상기 디시클로펜타디엔형 에폭시 수지 중 시판되고 있는 것으로는, 예를 들어, EP-4088S (ADEKA 사 제조) 등을 들 수 있다.As what is marketed among the said dicyclopentadiene type epoxy resins, EP-4088S (made by ADEKA) etc. are mentioned, for example.
상기 나프탈렌형 에폭시 수지 중 시판되고 있는 것으로는, 예를 들어, 에피크론 HP4032, 에피크론 EXA-4700 (모두 DIC 사 제조) 등을 들 수 있다.As what is marketed among the said naphthalene-type epoxy resins, Epicron HP4032, Epicron EXA-4700 (all are made by DIC Corporation), etc. are mentioned, for example.
상기 페놀 노볼락형 에폭시 수지 중 시판되고 있는 것으로는, 예를 들어, 에피크론 N-770 (DIC 사 제조) 등을 들 수 있다.As what is marketed among the said phenol novolak-type epoxy resins, Epicron N-770 (made by DIC Corporation) etc. are mentioned, for example.
상기 오르토 크레졸 노볼락형 에폭시 수지 중 시판되고 있는 것으로는, 예를 들어, 에피크론 N-670-EXP-S (DIC 사 제조) 등을 들 수 있다.As what is marketed among the said ortho cresol novolak-type epoxy resins, Epicron N-670-EXP-S (made by DIC Corporation) etc. are mentioned, for example.
상기 디시클로펜타디엔 노볼락형 에폭시 수지 중 시판되고 있는 것으로는, 예를 들어, 에피크론 HP7200 (DIC 사 제조) 등을 들 수 있다.As what is marketed among the said dicyclopentadiene novolak-type epoxy resins, Epicron HP7200 (made by DIC Corporation) etc. are mentioned, for example.
상기 비페닐 노볼락형 에폭시 수지 중 시판되고 있는 것으로는, 예를 들어, NC-3000P (닛폰 가야쿠사 제조) 등을 들 수 있다.As what is marketed among the said biphenyl novolak-type epoxy resins, NC-3000P (made by Nippon Kayaku Co., Ltd.) etc. are mentioned, for example.
상기 나프탈렌페놀 노볼락형 에폭시 수지 중 시판되고 있는 것으로는, 예를 들어, ESN-165S (신닛테츠 스미킨 화학사 제조) 등을 들 수 있다.As what is marketed among the said naphthalene phenol novolak-type epoxy resins, ESN-165S (made by the Nippon Tetsu Sumikin Chemical Company) etc. are mentioned, for example.
상기 글리시딜아민형 에폭시 수지 중 시판되고 있는 것으로는, 예를 들어, jER630 (미츠비시 화학사 제조), 에피크론 430 (DIC 사 제조), TETRAD-X (미츠비시 가스 화학사 제조) 등을 들 수 있다.As what is marketed among the said glycidylamine type epoxy resins, jER630 (made by Mitsubishi Chemical Corporation), Epicron 430 (made by DIC Corporation), TETRAD-X (made by Mitsubishi Gas Chemicals), etc. are mentioned, for example.
상기 알킬폴리올형 에폭시 수지 중 시판되고 있는 것으로는, 예를 들어, ZX-1542 (신닛테츠 스미킨 화학사 제조), 에피크론 726 (DIC 사 제조), 에포라이트 80MFA (쿄에이샤 화학사 제조), 데나콜 EX-611 (나가세 켐텍스사 제조) 등을 들 수 있다.As what is marketed among the said alkyl polyol type epoxy resins, For example, ZX-1542 (made by Nippon-Sumikin Chemical Co., Ltd.), Epicron 726 (made by DIC), Eporite 80MFA (made by Kyoeisha Chemical Co., Ltd.), Dena Cole EX-611 (made by Nagase Chemtex) etc. are mentioned.
상기 고무 변성형 에폭시 수지 중 시판되고 있는 것으로는, 예를 들어, YR-450, YR-207 (모두 신닛테츠 스미킨 화학사 제조), 에포리드 PB (다이셀사 제조) 등을 들 수 있다.As what is marketed among the said rubber-modified epoxy resins, YR-450, YR-207 (all are the Shin-Nitetsu Sumikin Chemicals make), Epolide PB (made by Daicel) etc. are mentioned, for example.
상기 글리시딜에스테르 화합물 중 시판되고 있는 것으로는, 예를 들어, 데나콜 EX-147 (나가세 켐텍스사 제조) 등을 들 수 있다.As what is marketed among the said glycidyl ester compound, Denacol EX-147 (made by Nagase Chemtex) etc. is mentioned, for example.
상기 비스페놀 A 형 에피술파이드 수지 중 시판되고 있는 것으로는, 예를 들어, jERYL-7000 (미츠비시 화학사 제조) 등을 들 수 있다.As what is marketed among the said bisphenol A episulfide resins, jERYL-7000 (made by Mitsubishi Chemical Corporation) etc. are mentioned, for example.
상기 에폭시 화합물 중 그 밖에 시판되고 있는 것으로는, 예를 들어, YDC-1312, YSLV-80XY, YSLV-90CR (모두 신닛테츠 스미킨 화학사 제조), XAC4151 (아사히 화성사 제조), jER1031, jER1032 (모두 미츠비시 화학사 제조), EXA-7120 (DIC 사 제조), TEPIC (닛산 화학사 제조) 등을 들 수 있다.Other commercially available epoxy compounds include, for example, YDC-1312, YSLV-80XY, YSLV-90CR (all manufactured by Shin-Nittetsu Sumikin Chemical Co.), XAC4151 (all manufactured by Asahi Chemical Co., Ltd.), jER1031, jER1032 (all of them). Mitsubishi Chemical Corporation make), EXA-7120 (DIC Corporation make), TEPIC (made by Nissan Chemical Corporation), etc. are mentioned.
상기 에폭시(메트)아크릴레이트 중 시판되고 있는 것으로는, 예를 들어, EBECRYL860, EBECRYL3200, EBECRYL3201, EBECRYL3412, EBECRYL3600, EBECRYL3700, EBECRYL3701, EBECRYL3702, EBECRYL3703, EBECRYL3800, EBECRYL6040, EBECRYL RDX63182 (모두 다이셀·올넥스사 제조), EA-1010, EA-1020, EA-5323, EA-5520, EA-CHD, EMA-1020 (모두 신나카무라 화학 공업사 제조), 에폭시에스테르 M-600A, 에폭시에스테르 40EM, 에폭시에스테르 70PA, 에폭시에스테르 200PA, 에폭시에스테르 80MFA, 에폭시에스테르 3002M, 에폭시에스테르 3002A, 에폭시에스테르 1600A, 에폭시에스테르 3000M, 에폭시에스테르 3000A, 에폭시에스테르 200EA, 에폭시에스테르 400EA (모두 쿄에이샤 화학사 제조), 데나콜 아크릴레이트 DA-141, 데나콜 아크릴레이트 DA-314, 데나콜 아크릴레이트 DA-911 (모두 나가세 켐텍스사 제조) 등을 들 수 있다.Among the above-mentioned epoxy (meth) acrylates, commercially available ones include, for example, EBECRYL860, EBECRYL3200, EBECRYL3201, EBECRYL3412, EBECRYL3600, EBECRYL3700, EBECRYL3701, EBECRYL3702, EBECRYL3702, EBECRYL3703, EBECRYLDXL3182 from Daicel Inc. Manufactured), EA-1010, EA-1020, EA-5323, EA-5520, EA-CHD, EMA-1020 (all manufactured by Shin-Nakamura Chemical Co., Ltd.), Epoxy Ester M-600A, Epoxy Ester 40EM, Epoxy Ester 70PA, Epoxy Ester 200PA, Epoxy Ester 80MFA, Epoxy Ester 3002M, Epoxy Ester 3002A, Epoxy Ester 1600A, Epoxy Ester 3000M, Epoxy Ester 3000A, Epoxy Ester 200EA, Epoxy Ester 400EA (all manufactured by Kyoeisha Chemical Company), Denacol Acrylate DA-141 , denacol acrylate DA-314, denacol acrylate DA-911 (all manufactured by Nagase Chemtex), and the like.
상기 우레탄(메트)아크릴레이트는, 예를 들어, 이소시아네이트 화합물에 대해, 수산기를 갖는 (메트)아크릴산 유도체를, 촉매량의 주석계 화합물 존재하에서 반응시킴으로써 얻을 수 있다.The urethane (meth)acrylate can be obtained, for example, by reacting a (meth)acrylic acid derivative having a hydroxyl group with an isocyanate compound in the presence of a tin-based compound in a catalytic amount.
상기 우레탄(메트)아크릴레이트의 원료가 되는 이소시아네이트 화합물로는, 예를 들어, 이소포론디이소시아네이트, 2,4-톨릴렌디이소시아네이트, 2,6-톨릴렌디이소시아네이트, 헥사메틸렌디이소시아네이트, 트리메틸헥사메틸렌디이소시아네이트, 디페닐메탄-4,4'-디이소시아네이트 (MDI), 수소 첨가 MDI, 폴리메릭 MDI, 1,5-나프탈렌디이소시아네이트, 노르보르난디이소시아네이트, 톨리딘디이소시아네이트, 자일릴렌디이소시아네이트 (XDI), 수소 첨가 XDI, 리신디이소시아네이트, 트리페닐메탄트리이소시아네이트, 트리스(이소시아네이트페닐)티오포스페이트, 테트라메틸자일렌디이소시아네이트, 1,6,11-운데칸트리이소시아네이트 등을 들 수 있다.As an isocyanate compound used as the raw material of the said urethane (meth)acrylate, For example, isophorone diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, hexamethylene diisocyanate, trimethylhexamethylene di Isocyanate, diphenylmethane-4,4'-diisocyanate (MDI), hydrogenated MDI, polymeric MDI, 1,5-naphthalene diisocyanate, norbornane diisocyanate, tolidine diisocyanate, xylylene diisocyanate (XDI), Hydrogenated XDI, lysine diisocyanate, triphenylmethane triisocyanate, tris (isocyanate phenyl) thiophosphate, tetramethylxylene diisocyanate, 1,6,11- undecane triisocyanate, etc. are mentioned.
또, 상기 이소시아네이트 화합물로는, 예를 들어, 에틸렌글리콜, 프로필렌글리콜, 글리세린, 소르비톨, 트리메틸올프로판, 카보네이트디올 등의 폴리올과 과잉된 이소시아네이트의 반응에 의해 얻어지는 사슬 연장된 이소시아네이트 화합물도 사용할 수 있다.In addition, as the isocyanate compound, for example, a chain-extended isocyanate compound obtained by reaction of a polyol such as ethylene glycol, propylene glycol, glycerin, sorbitol, trimethylolpropane, carbonatediol and an excess of isocyanate can also be used.
상기 우레탄(메트)아크릴레이트의 원료가 되는 수산기를 갖는 (메트)아크릴산 유도체로는, 예를 들어, 에틸렌글리콜, 프로필렌글리콜, 1,3-프로판디올, 1,3-부탄디올, 1,4-부탄디올, 폴리에틸렌글리콜 등의 2 가의 알코올의 모노(메트)아크릴레이트나, 트리메틸올에탄, 트리메틸올프로판, 글리세린 등의 3 가의 알코올의 모노(메트)아크릴레이트 또는 디(메트)아크릴레이트나, 비스페놀 A 형 에폭시(메트)아크릴레이트 등의 에폭시(메트)아크릴레이트 등을 들 수 있다.As the (meth)acrylic acid derivative having a hydroxyl group as a raw material of the urethane (meth)acrylate, for example, ethylene glycol, propylene glycol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol , mono(meth)acrylates of dihydric alcohols such as polyethylene glycol, mono(meth)acrylates or di(meth)acrylates of trihydric alcohols such as trimethylolethane, trimethylolpropane, and glycerin, and bisphenol A type Epoxy (meth)acrylates, such as an epoxy (meth)acrylate, etc. are mentioned.
또, 상기 이소시아네이트기를 갖지 않는 라디칼 중합성 화합물로는, 상기 서술한 것 이외의 그 밖의 라디칼 중합성 화합물도 적절히 사용할 수 있다.Moreover, as a radically polymerizable compound which does not have the said isocyanate group, other radically polymerizable compounds other than what was mentioned above can also be used suitably.
상기 그 밖의 라디칼 중합성 화합물로는, 예를 들어, N,N-디메틸(메트)아크릴아미드, N-(메트)아크릴로일모르폴린, N-하이드록시에틸(메트)아크릴아미드, N,N-디에틸(메트)아크릴아미드, N-이소프로필(메트)아크릴아미드, N,N-디메틸아미노프로필(메트)아크릴아미드 등의 (메트)아크릴아미드 화합물이나, 스티렌, α-메틸스티렌, N-피롤리돈, N-비닐카프로락톤 등의 비닐 화합물 등을 들 수 있다.Examples of the other radically polymerizable compound include N,N-dimethyl (meth)acrylamide, N-(meth)acryloylmorpholine, N-hydroxyethyl (meth)acrylamide, N,N - (meth)acrylamide compounds such as diethyl (meth)acrylamide, N-isopropyl (meth)acrylamide, N,N-dimethylaminopropyl (meth)acrylamide, styrene, α-methylstyrene, N- Vinyl compounds, such as pyrrolidone and N-vinyl caprolactone, etc. are mentioned.
상기 이소시아네이트기를 갖지 않는 라디칼 중합성 화합물은, 경화성을 조정하는 등의 관점에서, 단관능 라디칼 중합성 화합물과 다관능 라디칼 중합성 화합물을 함유하는 것이 바람직하다. 단관능 라디칼 중합성 화합물만을 사용한 경우, 얻어지는 광 습기 경화형 수지 조성물이 경화성이 떨어지는 경우가 있고, 다관능 라디칼 중합성 화합물만을 사용한 경우, 얻어지는 광 습기 경화형 수지 조성물이 택성이 떨어지는 경우가 있다. 그 중에서도, 상기 단관능 라디칼 중합성 화합물로서 분자 중에 질소 원자를 갖는 화합물과, 상기 다관능 라디칼 중합성 화합물로서 우레탄(메트)아크릴레이트를 조합하여 사용하는 것이 보다 바람직하다.It is preferable that the radically polymerizable compound which does not have the said isocyanate group contains a monofunctional radically polymerizable compound and a polyfunctional radically polymerizable compound from a viewpoint, such as adjusting sclerosis|hardenability. When only a monofunctional radically polymerizable compound is used, the optical moisture hardening type resin composition obtained may be inferior to sclerosis|hardenability, and when only a polyfunctional radically polymerizable compound is used, the optical moisture hardening type resin composition obtained may be inferior in tackiness. Especially, it is more preferable to use combining the compound which has a nitrogen atom in a molecule|numerator as said monofunctional radically polymerizable compound, and urethane (meth)acrylate as said polyfunctional radically polymerizable compound.
또, 상기 다관능 라디칼 중합성 화합물은, 2 관능 또는 3 관능인 것이 바람직하고, 2 관능인 것이 보다 바람직하다.Moreover, it is preferable that it is bifunctional or trifunctional, and, as for the said polyfunctional radically polymerizable compound, it is more preferable that it is bifunctional.
상기 이소시아네이트기를 갖지 않는 라디칼 중합성 화합물이, 상기 단관능 라디칼 중합성 화합물과 상기 다관능 라디칼 중합성 화합물을 함유하는 경우, 상기 다관능 라디칼 중합성 화합물의 함유량은, 상기 단관능 라디칼 중합성 화합물과 상기 다관능 라디칼 중합성 화합물의 합계 100 중량부에 대하여, 바람직한 하한이 2 중량부, 바람직한 상한이 30 중량부이다. 상기 다관능 라디칼 중합성 화합물의 함유량이 2 중량부 미만이면, 얻어지는 광 습기 경화형 수지 조성물이 경화성이 떨어지는 경우가 있다. 상기 다관능 라디칼 중합성 화합물의 함유량이 30 중량부를 초과하면, 얻어지는 광 습기 경화형 수지 조성물이 택성이 떨어지는 경우가 있다. 상기 다관능 라디칼 중합성 화합물의 함유량의 보다 바람직한 하한은 5 중량부, 보다 바람직한 상한은 20 중량부이다.When the radically polymerizable compound which does not have an isocyanate group contains the said monofunctional radically polymerizable compound and the said polyfunctional radically polymerizable compound, content of the said polyfunctional radically polymerizable compound is the said monofunctional radically polymerizable compound and With respect to a total of 100 weight part of the said polyfunctional radically polymerizable compound, a preferable minimum is 2 weight part, and a preferable upper limit is 30 weight part. When content of the said polyfunctional radically polymerizable compound is less than 2 weight part, the optical moisture hardening type resin composition obtained may be inferior to sclerosis|hardenability. When content of the said polyfunctional radically polymerizable compound exceeds 30 weight part, the optical moisture hardening type resin composition obtained may be inferior to a tackiness. A more preferable minimum of content of the said polyfunctional radically polymerizable compound is 5 weight part, and a more preferable upper limit is 20 weight part.
본 발명의 광 습기 경화형 수지 조성물은, 습기 경화형 우레탄 수지를 함유한다.The optical moisture hardening type resin composition of this invention contains a moisture hardening type urethane resin.
상기 습기 경화형 우레탄 수지는, 분자 내의 이소시아네이트기가 공기 중 또는 피착체 중의 수분과 반응하여 경화된다. 또, 습기 경화 성분으로서 가교성 실릴기를 갖는 화합물 등을 사용하는 경우와 비교하여, 얻어지는 광 습기 경화형 수지 조성물이 속경화성이 우수한 것이 된다.The moisture-curable urethane resin is cured by reacting isocyanate groups in the molecule with moisture in the air or in the adherend. Moreover, compared with the case where the compound etc. which have a crosslinking|crosslinked silyl group are used as a moisture hardening component, the optical moisture hardening type resin composition obtained becomes a thing excellent in quick-setting property.
상기 습기 경화형 우레탄 수지는, 1 분자 중에 이소시아네이트기를 1 개만 가지고 있어도 되고, 2 개 이상 가지고 있어도 된다. 그 중에서도, 양 말단에 이소시아네이트기를 갖는 우레탄 프레폴리머인 것이 바람직하다.The said moisture-curable urethane resin may have only one isocyanate group in 1 molecule, and may have it two or more. Especially, it is preferable that it is a urethane prepolymer which has an isocyanate group at both terminals.
상기 우레탄 프레폴리머는, 1 분자 중에 2 개 이상의 수산기를 갖는 폴리올 화합물과, 1 분자 중에 2 개 이상의 이소시아네이트기를 갖는 폴리이소시아네이트 화합물을 반응시킴으로써 얻을 수 있다.The urethane prepolymer can be obtained by reacting a polyol compound having two or more hydroxyl groups in one molecule with a polyisocyanate compound having two or more isocyanate groups in one molecule.
상기 폴리올 화합물과 폴리이소시아네이트 화합물의 반응은, 통상적으로 폴리올 화합물 중의 수산기 (OH) 와 폴리이소시아네이트 화합물 중의 이소시아네이트기 (NCO) 의 몰비로 [NCO]/[OH] = 2.0 ∼ 2.5 의 범위에서 실시된다.The reaction of the polyol compound and the polyisocyanate compound is usually carried out in a molar ratio of the hydroxyl group (OH) in the polyol compound and the isocyanate group (NCO) in the polyisocyanate compound in the range of [NCO]/[OH] = 2.0 to 2.5.
상기 폴리올 화합물로는, 폴리우레탄의 제조에 통상적으로 사용되고 있는 공지된 폴리올 화합물을 사용할 수 있고, 예를 들어, 폴리에스테르폴리올, 폴리에테르폴리올, 폴리알킬렌폴리올, 폴리카보네이트폴리올 등을 들 수 있다. 이들 폴리올 화합물은, 단독으로 사용되어도 되고, 2 종 이상을 조합하여 사용되어도 된다.As the polyol compound, a known polyol compound commonly used in the production of polyurethane can be used, and for example, polyester polyol, polyether polyol, polyalkylene polyol, polycarbonate polyol, and the like can be used. These polyol compounds may be used independently and may be used in combination of 2 or more type.
상기 폴리에스테르폴리올로는, 예를 들어, 다가 카르복실산과 폴리올의 반응에 의해 얻어지는 폴리에스테르폴리올이나, ε-카프로락톤을 개환 중합하여 얻어지는 폴리-ε-카프로락톤폴리올 등을 들 수 있다.As said polyester polyol, the polyester polyol obtained by reaction of polyhydric carboxylic acid and a polyol, poly-epsilon-caprolactone polyol obtained by ring-opening polymerization of epsilon caprolactone, etc. are mentioned, for example.
상기 폴리에스테르폴리올의 원료가 되는 상기 다가 카르복실산으로는, 예를 들어, 테레프탈산, 이소프탈산, 1,5-나프탈산, 2,6-나프탈산, 숙신산, 글루타르산, 아디프산, 피멜산, 수베르산, 아젤라산, 세바크산, 데카메틸렌디카르복실산, 도데카메틸렌디카르복실산 등을 들 수 있다.As said polyhydric carboxylic acid used as a raw material of the said polyester polyol, For example, terephthalic acid, isophthalic acid, 1,5-naphthalic acid, 2,6-naphthalic acid, succinic acid, glutaric acid, adipic acid, p and melic acid, suberic acid, azelaic acid, sebacic acid, decamethylene dicarboxylic acid, and dodecamethylene dicarboxylic acid.
상기 폴리에스테르폴리올의 원료가 되는 상기 폴리올로는, 예를 들어, 에틸렌글리콜, 프로필렌글리콜, 1,3-프로판디올, 1,4-부탄디올, 네오펜틸글리콜, 1,5-펜탄디올, 1,6-헥산디올, 디에틸렌글리콜, 시클로헥산디올 등을 들 수 있다.Examples of the polyol used as the raw material of the polyester polyol include ethylene glycol, propylene glycol, 1,3-propanediol, 1,4-butanediol, neopentyl glycol, 1,5-pentanediol, 1,6 - hexanediol, diethylene glycol, cyclohexanediol, etc. are mentioned.
상기 폴리에테르폴리올로는, 예를 들어, 에틸렌글리콜, 프로필렌글리콜, 테트라하이드로푸란, 3-메틸테트라하이드로푸란의 개환 중합물, 및 이들이나 그 유도체의 랜덤 공중합체 또는 블록 공중합체나, 비스페놀형의 폴리옥시알킬렌 변성체 등을 들 수 있다.Examples of the polyether polyol include ring-opening polymers of ethylene glycol, propylene glycol, tetrahydrofuran, 3-methyltetrahydrofuran, random copolymers or block copolymers of these or derivatives thereof, and bisphenol-type polyols. An oxyalkylene modified product, etc. are mentioned.
상기 비스페놀형의 폴리옥시알킬렌 변성체는, 비스페놀형 분자 골격의 활성 수소 부분에 알킬렌옥사이드 (예를 들어, 에틸렌옥사이드, 프로필렌옥사이드, 부틸렌옥사이드, 이소부틸렌옥사이드 등) 를 부가 반응시켜 얻어지는 폴리에테르폴리올이고, 랜덤 공중합체여도 되고, 블록 공중합체여도 된다.The bisphenol-type polyoxyalkylene-modified product is obtained by adding an alkylene oxide (eg, ethylene oxide, propylene oxide, butylene oxide, isobutylene oxide, etc.) to the active hydrogen portion of the bisphenol-type molecular skeleton. It is a polyether polyol, and a random copolymer may be sufficient and a block copolymer may be sufficient.
상기 비스페놀형의 폴리옥시알킬렌 변성체는, 비스페놀형 분자 골격의 양 말단에 1 종 또는 2 종 이상의 알킬렌옥사이드가 부가되어 있는 것이 바람직하다.As for the said bisphenol-type polyoxyalkylene modified body, it is preferable that 1 type, or 2 or more types of alkylene oxides are added to both terminals of a bisphenol type molecular skeleton.
비스페놀형으로는 특별히 한정되지 않고, A 형, F 형, S 형 등을 들 수 있고, 바람직하게는 비스페놀 A 형이다.It does not specifically limit as a bisphenol type, A type, F type, S type, etc. are mentioned, Preferably it is a bisphenol A type.
상기 폴리알킬렌폴리올로는, 예를 들어, 폴리부타디엔폴리올, 수소화 폴리부타디엔폴리올, 수소화 폴리이소프렌폴리올 등을 들 수 있다.As said polyalkylene polyol, polybutadiene polyol, hydrogenated polybutadiene polyol, hydrogenated polyisoprene polyol, etc. are mentioned, for example.
상기 폴리카보네이트폴리올로는, 예를 들어, 폴리헥사메틸렌카보네이트폴리올, 폴리시클로헥산디메틸렌카보네이트폴리올 등을 들 수 있다.As said polycarbonate polyol, polyhexamethylene carbonate polyol, polycyclohexane dimethylene carbonate polyol, etc. are mentioned, for example.
상기 폴리이소시아네이트 화합물로는, 예를 들어, 디페닐메탄디이소시아네이트, 디페닐메탄디이소시아네이트의 액상 변성물, 폴리메릭 MDI, 톨릴렌디이소시아네이트, 나프탈렌-1,5-디이소시아네이트 등을 들 수 있다. 그 중에서도, 증기압이나 독성이 낮은 점, 취급 용이성의 점에서 디페닐메탄디이소시아네이트 및 그 변성물이 바람직하다. 상기 폴리이소시아네이트 화합물은, 단독으로 사용되어도 되고, 2 종 이상을 조합하여 사용되어도 된다.Examples of the polyisocyanate compound include diphenylmethane diisocyanate, a liquid modified product of diphenylmethane diisocyanate, polymeric MDI, tolylene diisocyanate, and naphthalene-1,5-diisocyanate. Among them, diphenylmethane diisocyanate and a modified product thereof are preferred from the viewpoint of low vapor pressure and toxicity and ease of handling. The said polyisocyanate compound may be used independently and may be used in combination of 2 or more type.
또, 상기 습기 경화형 우레탄 수지는, 하기 식 (2) 로 나타내는 구조를 갖는 폴리올 화합물을 사용하여 얻어진 것이 바람직하다. 하기 식 (2) 로 나타내는 구조를 갖는 폴리올 화합물을 사용함으로써, 접착성이 우수한 조성물이나, 유연하고 신장이 양호한 경화물을 얻을 수 있고, 상기 라디칼 중합성 화합물과의 상용성이 우수한 것이 된다. 또, 상기 습기 경화형 우레탄 수지는, 분기 사슬을 가지고 있는 것이 바람직하다.Moreover, it is preferable that the said moisture hardening type urethane resin is obtained using the polyol compound which has a structure represented by following formula (2). By using the polyol compound having a structure represented by the following formula (2), a composition excellent in adhesiveness and a flexible and elongated cured product can be obtained, and compatibility with the radically polymerizable compound is excellent. Moreover, it is preferable that the said moisture-curable urethane resin has a branched chain.
그 중에서도, 프로필렌글리콜이나, 테트라하이드로푸란 (THF) 화합물의 개환 중합 화합물이나, 메틸기 등의 치환기를 갖는 테트라하이드로푸란 화합물의 개환 중합 화합물로 이루어지는 폴리에테르폴리올을 사용하는 것이 바람직하다.Among them, it is preferable to use a polyether polyol composed of propylene glycol, a ring-opening polymerization compound of a tetrahydrofuran (THF) compound, or a ring-opening polymerization compound of a tetrahydrofuran compound having a substituent such as a methyl group.
[화학식 2][Formula 2]
식 (2) 중, R 은 수소, 메틸기, 또는 에틸기를 나타내고, n 은 1 ∼ 10 의 정수, L 은 0 ∼ 5 의 정수, m 은 1 ∼ 500 의 정수이다. n 은 1 ∼ 5 인 것이 바람직하고, L 은 0 ∼ 4 인 것이 바람직하고, m 은 50 ∼ 200 인 것이 바람직하다.In formula (2), R represents hydrogen, a methyl group, or an ethyl group, n is an integer of 1-10, L is an integer of 0-5, m is an integer of 1-500. It is preferable that n is 1-5, it is preferable that L is 0-4, It is preferable that m is 50-200.
또한 L 이 0 인 경우란, R 과 결합한 탄소가 직접 산소와 결합하고 있는 경우를 의미한다.In addition, the case where L is 0 means the case where the carbon couple|bonded with R couple|bonded with oxygen directly.
또한, 상기 습기 경화형 우레탄 수지는, 라디칼 중합성 관능기를 가지고 있어도 된다.Moreover, the said moisture-curable urethane resin may have a radically polymerizable functional group.
상기 습기 경화형 우레탄 수지가 가지고 있어도 되는 라디칼 중합성 관능기로는, 불포화 이중 결합을 갖는 기가 바람직하고, 특히 반응성의 면에서 (메트)아크릴로일기가 보다 바람직하다.As a radically polymerizable functional group which the said moisture-curable urethane resin may have, group which has an unsaturated double bond is preferable, and a (meth)acryloyl group is more preferable especially from a reactive point.
또한 습기 경화형 우레탄 수지는, 상기 서술한 바와 같이 이소시아네이트기를 갖지만, 라디칼 중합성 관능기를 갖는 습기 경화형 우레탄 수지는, 이소시아네이트기를 갖는 라디칼 중합성 화합물에는 포함하지 않고, 습기 경화형 우레탄 수지로서 취급한다.In addition, although a moisture-curable urethane resin has an isocyanate group as mentioned above, the moisture-curable urethane resin which has a radically polymerizable functional group is not included in the radically polymerizable compound which has an isocyanate group, It is handled as a moisture-curable urethane resin.
상기 습기 경화형 우레탄 수지의 중량 평균 분자량의 바람직한 하한은 800, 바람직한 상한은 1 만이다. 상기 습기 경화형 우레탄 수지의 중량 평균 분자량이 800 미만이면, 가교 밀도가 높아지고, 유연성이 저해되는 경우가 있다. 상기 습기 경화형 우레탄 수지의 중량 평균 분자량이 1 만을 초과하면, 얻어지는 광 습기 경화형 수지 조성물이 도포성이 떨어지는 경우가 있다. 상기 습기 경화형 우레탄 수지의 중량 평균 분자량의 보다 바람직한 하한은 2000, 보다 바람직한 상한은 8000, 더욱 바람직한 하한은 2500, 더욱 바람직한 상한은 6000 이다.A preferable lower limit of the weight average molecular weight of the moisture-curable urethane resin is 800, and a preferable upper limit thereof is 10,000. When the weight average molecular weight of the said moisture-curable urethane resin is less than 800, a crosslinking density may become high and a softness|flexibility may be impaired. When the weight average molecular weight of the said moisture hardening type urethane resin exceeds 10,000, the optical moisture hardening type resin composition obtained may be inferior to applicability|paintability. A more preferable lower limit of the weight average molecular weight of the moisture-curable urethane resin is 2000, a more preferable upper limit is 8000, a more preferable lower limit is 2500, and a still more preferable upper limit is 6000.
또한 본 명세서에 있어서 상기 중량 평균 분자량은, 겔 퍼미에이션 크로마토그래피 (GPC) 로 측정을 실시하여, 폴리스티렌 환산에 의해 구해지는 값이다. GPC 에 의해 폴리스티렌 환산에 의한 중량 평균 분자량을 측정할 때의 칼럼으로는, 예를 들어, Shodex LF-804 (쇼와 전공사 제조) 등을 들 수 있다. 또, GPC 에서 사용하는 용매로는, 테트라하이드로푸란 등을 들 수 있다.In addition, in this specification, the said weight average molecular weight is a value calculated|required by polystyrene conversion by measuring by gel permeation chromatography (GPC). As a column at the time of measuring the weight average molecular weight by polystyrene conversion by GPC, Shodex LF-804 (made by Showa Denko Co., Ltd.) etc. are mentioned, for example. Moreover, tetrahydrofuran etc. are mentioned as a solvent used by GPC.
상기 습기 경화형 우레탄 수지의 함유량은, 상기 라디칼 중합성 화합물과 상기 습기 경화형 우레탄 수지의 합계 100 중량부에 대하여, 바람직한 하한이 20 중량부, 바람직한 상한이 90 중량부이다. 상기 습기 경화형 우레탄 수지의 함유량이 20 중량부 미만이면, 얻어지는 광 습기 경화형 수지 조성물이 습기 경화성이 떨어지는 경우가 있다. 상기 습기 경화형 우레탄 수지의 함유량이 90 중량부를 초과하면, 얻어지는 광 습기 경화형 수지 조성물이 광 경화성이 떨어지는 경우가 있다. 상기 습기 경화형 우레탄 수지의 함유량의 보다 바람직한 하한은 30 중량부, 보다 바람직한 상한은 75 중량부이고, 더욱 바람직한 하한은 41 중량부, 더욱 바람직한 상한은 70 중량부이다.As for content of the said moisture-curable urethane resin, with respect to a total of 100 weight part of the said radically polymerizable compound and the said moisture-curable urethane resin, a preferable minimum is 20 weight part, and a preferable upper limit is 90 weight part. When content of the said moisture hardening type urethane resin is less than 20 weight part, the optical moisture hardening type resin composition obtained may be inferior to moisture sclerosis|hardenability. When content of the said moisture hardening type urethane resin exceeds 90 weight part, the optical moisture hardening type resin composition obtained may be inferior to photocurability. A more preferable lower limit of the content of the moisture-curable urethane resin is 30 parts by weight, a more preferable upper limit is 75 parts by weight, a still more preferable lower limit is 41 parts by weight, and a still more preferable upper limit is 70 parts by weight.
본 발명의 광 습기 경화형 수지 조성물은, 광 라디칼 중합 개시제를 함유한다.The optical moisture hardening type resin composition of this invention contains an optical radical polymerization initiator.
상기 광 라디칼 중합 개시제로는, 예를 들어, 벤조페논계 화합물, 아세토페논계 화합물, 아실포스핀옥사이드계 화합물, 티타노센계 화합물, 옥심에스테르계 화합물, 벤조인에테르계 화합물, 티오크산톤 등을 들 수 있다.Examples of the radical photopolymerization initiator include benzophenone compounds, acetophenone compounds, acylphosphine oxide compounds, titanocene compounds, oxime ester compounds, benzoin ether compounds, thioxanthone, and the like. can
상기 광 라디칼 중합 개시제 중 시판되고 있는 것으로는, 예를 들어, IRGACURE184, IRGACURE369, IRGACURE379, IRGACURE651, IRGACURE784, IRGACURE819, IRGACURE907, IRGACURE2959, IRGACUREOXE01, 루시린 TPO (모두 BASF 사 제조), 벤조인메틸에테르, 벤조인에틸에테르, 벤조인이소프로필에테르 (모두 도쿄 화성 공업사 제조) 등을 들 수 있다.Among the radical photopolymerization initiators, commercially available ones include, for example, IRGACURE184, IRGACURE369, IRGACURE379, IRGACURE651, IRGACURE784, IRGACURE819, IRGACURE907, IRGACURE2959, IRGACUREOXE01, lucirin TPO (all manufactured by BASF), benzoinmethyl ether, Phosphorus ethyl ether, benzoin isopropyl ether (all are the Tokyo Chemical Industry make), etc. are mentioned.
상기 광 라디칼 중합 개시제의 함유량은, 상기 라디칼 중합성 화합물 100 중량부에 대하여, 바람직한 하한이 0.01 중량부, 바람직한 상한이 10 중량부이다. 상기 광 라디칼 중합 개시제의 함유량이 0.01 중량부 미만이면, 얻어지는 광 습기 경화형 수지 조성물을 충분히 광 경화시킬 수 없는 경우가 있다. 상기 광 라디칼 중합 개시제의 함유량이 10 중량부를 초과하면, 얻어지는 광 습기 경화형 수지 조성물의 보존 안정성이 저하되는 경우가 있다. 상기 광 라디칼 중합 개시제의 함유량의 보다 바람직한 하한은 0.1 중량부, 보다 바람직한 상한은 5 중량부이다.As for content of the said radical photopolymerization initiator, with respect to 100 weight part of said radically polymerizable compounds, a preferable minimum is 0.01 weight part, and a preferable upper limit is 10 weight part. When content of the said radical radical polymerization initiator is less than 0.01 weight part, the optical moisture hardening type resin composition obtained may not fully be photocured. When content of the said radical radical polymerization initiator exceeds 10 weight part, the storage stability of the optical moisture hardening type resin composition obtained may fall. A more preferable minimum of content of the said radical radical polymerization initiator is 0.1 weight part, and a more preferable upper limit is 5 weight part.
본 발명의 광 습기 경화형 수지 조성물은 차광제를 함유해도 된다. 상기 차광제를 함유함으로써, 본 발명의 광 습기 경화형 수지 조성물은, 차광성이 우수한 것이 되어 표시 소자의 광 누출을 방지할 수 있다.The optical moisture hardening type resin composition of this invention may contain a light-shielding agent. By containing the said light-shielding agent, the optical moisture hardening type resin composition of this invention can become a thing excellent in light-shielding property, and can prevent the light leakage of a display element.
또한 본 명세서에 있어서, 상기 「차광제」 는, 가시광 영역의 광을 잘 투과시키지 않는 능력을 갖는 재료를 의미한다.In addition, in this specification, the said "light-shielding agent" means a material which has the ability to hardly transmit light in a visible region.
상기 차광제로는, 예를 들어, 산화철, 티탄 블랙, 아닐린 블랙, 시아닌 블랙, 플러렌, 카본 블랙, 수지 피복형 카본 블랙 등을 들 수 있다. 또, 상기 차광제는, 흑색을 나타내는 것이 아니어도 되고, 가시광 영역의 광을 잘 투과시키지 않는 능력을 갖는 재료이면, 실리카, 탤크, 산화티탄 등, 후술하는 충전제로서 예시하는 재료 등도 상기 차광제에 포함된다. 그 중에서도, 티탄 블랙이 바람직하다.Examples of the light-shielding agent include iron oxide, titanium black, aniline black, cyanine black, fullerene, carbon black, and resin-coated carbon black. In addition, the light-shielding agent does not need to be black, and as long as it is a material having the ability to hardly transmit light in the visible region, materials exemplified as fillers to be described later, such as silica, talc, titanium oxide, etc., may also be used in the light-shielding agent. Included. Especially, titanium black is preferable.
상기 티탄 블랙은, 파장 300 ∼ 800 ㎚ 의 광에 대한 평균 투과율과 비교하여, 자외선 영역 부근, 특히 파장 370 ∼ 450 ㎚ 의 광에 대한 투과율이 높아지는 물질이다. 즉, 상기 티탄 블랙은, 가시광 영역의 파장의 광을 충분히 차폐함으로써 본 발명의 광 습기 경화형 수지 조성물에 차광성을 부여하는 한편, 자외선 영역 부근의 파장의 광은 투과시키는 성질을 갖는 차광제이다. 따라서, 광 라디칼 중합 개시제로서, 상기 티탄 블랙의 투과율이 높아지는 파장 (370 ∼ 450 ㎚) 의 광에 의해 반응을 개시 가능한 것을 사용함으로써, 본 발명의 광 습기 경화형 수지 조성물의 광 경화성을 보다 증대시킬 수 있다. 또 한편으로, 본 발명의 광 습기 경화형 수지 조성물에 함유되는 차광제로는, 절연성이 높은 물질이 바람직하고, 절연성이 높은 차광제로서도 티탄 블랙이 바람직하다.The said titanium black is a substance whose transmittance with respect to the light of wavelength 370-450 nm becomes high in the vicinity of an ultraviolet region, especially compared with the average transmittance|permeability with respect to the light of wavelength 300-800 nm. That is, the titanium black is a light-shielding agent having a property of providing light-shielding properties to the optical moisture-curable resin composition of the present invention by sufficiently shielding light of a wavelength in the visible region, while transmitting light having a wavelength in the vicinity of an ultraviolet region. Therefore, by using a radical photopolymerization initiator that can initiate a reaction with light having a wavelength (370 to 450 nm) at which the transmittance of the titanium black is increased, the photocurability of the optical moisture curable resin composition of the present invention can be further increased. have. On the other hand, as a light-shielding agent contained in the optical moisture hardening type resin composition of this invention, a substance with high insulation is preferable, and titanium black is preferable also as a light-shielding agent with high insulation.
상기 티탄 블랙은, 광학 농도 (OD 값) 가 3 이상인 것이 바람직하고, 4 이상인 것이 보다 바람직하다. 또, 상기 티탄 블랙은, 흑색도 (L 값) 가 9 이상인 것이 바람직하고, 11 이상인 것이 보다 바람직하다. 상기 티탄 블랙의 차광성은 높으면 높을수록 좋고, 상기 티탄 블랙의 OD 값에 바람직한 상한은 특별히 없지만, 통상은 5 이하가 된다.It is preferable that the optical density (OD value) of the said titanium black is 3 or more, and it is more preferable that it is 4 or more. Moreover, it is preferable that blackness (L value) is 9 or more, and, as for the said titanium black, it is more preferable that it is 11 or more. The higher the light-shielding property of the titanium black, the better.
상기 티탄 블랙은, 표면 처리되어 있지 않은 것이라도 충분한 효과를 발휘하지만, 표면이 커플링제 등의 유기 성분으로 처리되어 있는 것이나, 산화규소, 산화티탄, 산화게르마늄, 산화알루미늄, 산화지르코늄, 산화마그네슘 등의 무기 성분으로 피복되어 있는 것 등, 표면 처리된 티탄 블랙을 사용할 수도 있다. 그 중에서도, 유기 성분으로 처리되어 있는 것은, 보다 절연성을 향상시킬 수 있는 점에서 바람직하다.Although the said titanium black exhibits sufficient effect even if it is not surface-treated, the thing whose surface is treated with organic components, such as a coupling agent, silicon oxide, titanium oxide, germanium oxide, aluminum oxide, zirconium oxide, magnesium oxide, etc. Surface-treated titanium black, such as one coated with an inorganic component of Especially, the thing processed with the organic component is preferable at the point which can improve insulation more.
또, 본 발명의 광 습기 경화형 수지 조성물을 사용하여 제조한 표시 소자는, 광 습기 경화형 수지 조성물이 충분한 차광성을 갖기 때문에, 광의 누출이 없어 높은 콘트라스트를 갖고, 우수한 화상 표시 품질을 갖는 것이 된다.Moreover, since the optical moisture hardening type resin composition has sufficient light-shielding property, the display element manufactured using the optical moisture hardening type resin composition of this invention has high contrast without light leakage, and it will have the outstanding image display quality.
상기 티탄 블랙 중 시판되고 있는 것으로는, 예를 들어, 12S, 13M, 13M-C, 13R-N (모두 미츠비시 머티리얼사 제조), 틸락 D (아코 화성사 제조) 등을 들 수 있다.Examples of the titanium black commercially available include 12S, 13M, 13M-C, 13R-N (all manufactured by Mitsubishi Materials), and Tillac D (manufactured by Ako Chemical Company).
상기 티탄 블랙의 비표면적의 바람직한 하한은 5 ㎡/g, 바람직한 상한은 40 ㎡/g 이고, 보다 바람직한 하한은 10 ㎡/g, 보다 바람직한 상한은 25 ㎡/g 이다.A preferable lower limit of the specific surface area of the titanium black is 5 m2/g, a preferable upper limit is 40 m2/g, a more preferable lower limit is 10 m2/g, and a more preferable upper limit is 25 m2/g.
또, 상기 티탄 블랙의 시트 저항의 바람직한 하한은, 수지와 혼합되었을 경우 (70 ％ 배합) 에 있어서, 109 Ω／□ 이고, 보다 바람직한 하한은 1011 Ω／□ 이다.In addition, a preferable lower limit of the sheet resistance of the titanium black is 10 9 Ω/square when mixed with a resin (70% blending), and a more preferable lower limit is 10 11 Ω/square.
본 발명의 광 습기 경화형 수지 조성물에 있어서, 상기 차광제의 1 차 입자 직경은, 표시 소자의 기판간의 거리 이하 등, 용도에 따라 적절히 선택되지만, 바람직한 하한은 30 ㎚, 바람직한 상한은 500 ㎚ 이다. 상기 차광제의 1 차 입자 직경이 30 ㎚ 미만이면, 얻어지는 광 습기 경화형 수지 조성물의 점도나 틱소트로피가 크게 증대되어 버려, 작업성이 나빠지는 경우가 있다. 상기 차광제의 1 차 입자 직경이 500 ㎚ 를 초과하면, 얻어지는 광 습기 경화형 수지 조성물 중에 있어서의 차광제의 분산성이 저하되어, 차광성이 저하되는 경우가 있다. 상기 차광제의 1 차 입자 직경의 보다 바람직한 하한은 50 ㎚, 보다 바람직한 상한은 200 ㎚ 이다.In the optical moisture curable resin composition of the present invention, the primary particle diameter of the light-shielding agent is appropriately selected depending on the application, such as the distance between the substrates of the display element or less, and a preferable lower limit is 30 nm, and a preferable upper limit is 500 nm. When the primary particle diameter of the said light-shielding agent is less than 30 nm, the viscosity and thixotropy of the optical moisture hardening type resin composition obtained may increase significantly, and workability|operativity may worsen. When the primary particle diameter of the said light-shielding agent exceeds 500 nm, the dispersibility of the light-shielding agent in the optical moisture hardening type resin composition obtained may fall, and light-shielding property may fall. A more preferable lower limit of the primary particle diameter of the light-shielding agent is 50 nm, and a more preferable upper limit thereof is 200 nm.
또한 상기 차광제의 입자 직경은, NICOMP 380ZLS (PARTICLE SIZING SYSTEMS 사 제조) 를 사용하여, 상기 차광제를 용매 (물, 유기 용매 등) 에 분산시켜 측정할 수 있다.The particle diameter of the light-shielding agent can be measured by dispersing the light-shielding agent in a solvent (water, organic solvent, etc.) using NICOMP 380ZLS (manufactured by PARTICLE SIZING SYSTEMS).
본 발명의 광 습기 경화형 수지 조성물 전체에 있어서의 상기 차광제의 함유량은 특별히 한정되지 않지만, 바람직한 하한은 0.05 중량％, 바람직한 상한은 10 중량％ 이다. 상기 차광제의 함유량이 0.05 중량％ 미만이면, 충분한 차광성이 얻어지지 않는 경우가 있다. 상기 차광제의 함유량이 10 중량％ 를 초과하면, 얻어지는 광 습기 경화형 수지 조성물의 기판 등에 대한 접착성이나 경화 후의 강도가 저하되거나, 묘화성이 저하되거나 하는 경우가 있다. 상기 차광제의 함유량의 보다 바람직한 하한은 0.1 중량％, 보다 바람직한 상한은 2 중량％, 더욱 바람직한 상한은 1 중량％ 이다.Although content of the said light-shielding agent in the whole optical moisture hardening type resin composition of this invention is not specifically limited, A preferable minimum is 0.05 weight%, and a preferable upper limit is 10 weight%. When content of the said light-shielding agent is less than 0.05 weight%, sufficient light-shielding property may not be acquired. When content of the said light-shielding agent exceeds 10 weight%, the adhesiveness to the board|substrate etc. of the optical moisture hardening type resin composition obtained, the intensity|strength after hardening may fall, or drawing property may fall. A more preferable lower limit of content of the said light-shielding agent is 0.1 weight%, a more preferable upper limit is 2 weight%, and a more preferable upper limit is 1 weight%.
본 발명의 광 습기 경화형 수지 조성물은, 얻어지는 광 습기 경화형 수지 조성물의 도포성이나 형상 유지성을 조정하는 등의 관점에서 충전제를 함유해도 된다.The optical moisture hardening type resin composition of this invention may contain a filler from a viewpoint, such as adjusting the applicability|paintability and shape retentivity of the optical moisture hardening type resin composition obtained.
상기 충전제는, 1 차 입자 직경의 바람직한 하한이 1 ㎚, 바람직한 상한이 50 ㎚ 이다. 상기 충전제의 1 차 입자 직경이 1 ㎚ 미만이면, 얻어지는 광 습기 경화형 수지 조성물이 도포성이 떨어지는 경우가 있다. 상기 충전제의 1 차 입자 직경이 50 ㎚ 를 초과하면, 얻어지는 광 습기 경화형 수지 조성물이 도포 후의 형상 유지성이 떨어지는 경우가 있다. 상기 충전제의 1 차 입자 직경의 보다 바람직한 하한은 5 ㎚, 보다 바람직한 상한은 30 ㎚, 더욱 바람직한 하한은 10 ㎚, 더욱 바람직한 상한은 20 ㎚ 이다.As for the said filler, a preferable lower limit of a primary particle diameter is 1 nm, and a preferable upper limit is 50 nm. When the primary particle diameter of the said filler is less than 1 nm, the optical moisture hardening type resin composition obtained may be inferior to applicability|paintability. When the primary particle diameter of the said filler exceeds 50 nm, the shape retentivity after application|coating of the optical moisture hardening type resin composition obtained may be inferior. A more preferable lower limit of the primary particle diameter of the filler is 5 nm, a more preferable upper limit is 30 nm, a more preferable lower limit is 10 nm, and a more preferable upper limit is 20 nm.
또한 상기 충전제의 1 차 입자 직경은, NICOMP 380ZLS (PARTICLE SIZING SYSTEMS 사 제조) 를 사용하여, 상기 충전제를 용매 (물, 유기 용매 등) 에 분산시켜 측정할 수 있다.The primary particle diameter of the filler can be measured by dispersing the filler in a solvent (water, organic solvent, etc.) using NICOMP 380ZLS (manufactured by PARTICLE SIZING SYSTEMS).
또, 상기 충전제는, 본 발명의 광 습기 경화형 수지 조성물 중에 있어서 2 차 입자 (1 차 입자가 복수 모인 것) 로서 존재하는 경우가 있고, 이와 같은 2 차 입자의 입자 직경의 바람직한 하한은 5 ㎚, 바람직한 상한은 500 ㎚, 보다 바람직한 하한은 10 ㎚, 보다 바람직한 상한은 100 ㎚ 이다. 상기 충전제의 2 차 입자의 입자 직경은, 본 발명의 광 습기 경화형 수지 조성물 또는 그 경화물을, 투과형 전자 현미경 (TEM) 을 사용하여 관찰함으로써 측정할 수 있다.In addition, the said filler may exist as secondary particles (a collection of a plurality of primary particles) in the optical moisture curable resin composition of the present invention, and the preferable lower limit of the particle diameter of such secondary particles is 5 nm, A preferable upper limit is 500 nm, a more preferable lower limit is 10 nm, and a more preferable upper limit is 100 nm. The particle diameter of the secondary particle of the said filler can be measured by observing the optical moisture hardening type resin composition of this invention, or its hardened|cured material using a transmission electron microscope (TEM).
상기 충전제로는, 예를 들어, 실리카, 탤크, 산화티탄, 산화아연 등을 들 수 있다. 그 중에서도, 얻어지는 광 습기 경화형 수지 조성물이 UV 광 투과성이 우수한 것이 되는 점에서, 실리카가 바람직하다. 이들 충전제는, 단독으로 사용되어도 되고, 2 종 이상을 조합하여 사용되어도 된다.Examples of the filler include silica, talc, titanium oxide, and zinc oxide. Especially, since the optical moisture hardening type resin composition obtained becomes a thing excellent in UV light transmittance, a silica is preferable. These fillers may be used independently and may be used in combination of 2 or more type.
상기 충전제는, 소수성 표면 처리가 이루어지고 있는 것이 바람직하다. 상기 소수성 표면 처리에 의해, 얻어지는 광 습기 경화형 수지 조성물이 도포 후의 형상 유지성이 보다 우수한 것이 된다.As for the said filler, it is preferable that hydrophobic surface treatment is performed. By the said hydrophobic surface treatment, the optical moisture hardening type resin composition obtained becomes a thing more excellent in shape retentivity after application|coating.
상기 소수성 표면 처리로는, 실릴화 처리, 알킬화 처리, 에폭시화 처리 등을 들 수 있다. 그 중에서도, 형상 유지성을 향상시키는 효과가 우수한 점에서, 실릴화 처리가 바람직하고, 트리메틸실릴화 처리가 보다 바람직하다.Examples of the hydrophobic surface treatment include silylation treatment, alkylation treatment, and epoxidation treatment. Especially, since it is excellent in the effect of improving shape retentivity, a silylation process is preferable and a trimethylsilylation process is more preferable.
상기 충전제를 소수성 표면 처리하는 방법으로는, 예를 들어, 실란 커플링제 등의 표면 처리제를 사용하여, 충전제의 표면을 처리하는 방법 등을 들 수 있다.As a method of treating the hydrophobic surface of the filler, for example, a method of treating the surface of the filler using a surface treating agent such as a silane coupling agent may be mentioned.
구체적으로는 예를 들어, 상기 트리메틸실릴화 처리 실리카는, 예를 들어, 실리카를 졸 겔법 등의 방법으로 합성하고, 실리카를 유동시킨 상태에서 헥사메틸디실라잔을 분무하는 방법이나, 알코올, 톨루엔 등의 유기 용매 중에 실리카를 첨가하고, 추가로 헥사메틸디실라잔과 물을 첨가한 후, 물과 유기 용매를 이배퍼레이터로 증발 건조시키는 방법 등에 의해 제조할 수 있다.Specifically, for example, the trimethylsilylation-treated silica is a method of synthesizing silica by a method such as a sol-gel method and spraying hexamethyldisilazane in a state in which silica is flowed, alcohol, toluene It can manufacture by the method of adding silica in organic solvents, such as, further adding hexamethyldisilazane and water, and evaporating water and an organic solvent to dryness with an evaporator, etc.
상기 충전제의 함유량은, 본 발명의 광 습기 경화형 수지 조성물 전체 100 중량부 중에 있어서, 바람직한 하한이 1 중량부, 바람직한 상한이 20 중량부이다. 상기 충전제의 함유량이 1 중량부 미만이면, 얻어지는 광 습기 경화형 수지 조성물이 도포 후의 형상 유지성이 떨어지는 경우가 있다. 상기 충전제의 함유량이 20 중량부를 초과하면, 얻어지는 광 습기 경화형 수지 조성물이 도포성이 떨어지는 경우가 있다. 상기 충전제의 함유량의 보다 바람직한 하한은 2 중량부, 보다 바람직한 상한은 15 중량부이고, 더욱 바람직한 하한은 3 중량부, 더욱 바람직한 상한은 10 중량부, 특히 바람직한 하한은 4 중량부이다.As for content of the said filler, in 100 weight part of all 100 weight part of optical moisture hardening type resin compositions of this invention, a preferable minimum is 1 weight part, and a preferable upper limit is 20 weight part. When content of the said filler is less than 1 weight part, the optical moisture hardening type resin composition obtained may be inferior to the shape retentivity after application|coating. When content of the said filler exceeds 20 weight part, the optical moisture hardening type resin composition obtained may be inferior to applicability|paintability. A more preferable lower limit of the content of the filler is 2 parts by weight, a more preferable upper limit is 15 parts by weight, a more preferable lower limit is 3 parts by weight, a more preferable upper limit is 10 parts by weight, and a particularly preferable lower limit is 4 parts by weight.
본 발명의 광 습기 경화형 수지 조성물은, 추가로, 필요에 따라, 이온 액체, 용제, 금속 함유 입자, 반응성 희석제 등의 첨가제를 함유해도 된다.The optical moisture hardening type resin composition of this invention may contain additives, such as an ionic liquid, a solvent, a metal containing particle|grains, and a reactive diluent, further as needed.
본 발명의 광 습기 경화형 수지 조성물을 제조하는 방법으로는, 예를 들어, 호모디스퍼, 호모믹서, 만능 믹서, 플래니터리 믹서, 니더, 3 개 롤 등의 혼합기를 사용하여, 라디칼 중합성 화합물과, 습기 경화형 우레탄 수지와, 광 라디칼 중합 개시제와, 필요에 따라 첨가하는 첨가제를 혼합하는 방법 등을 들 수 있다.As a method for manufacturing the optical moisture curable resin composition of the present invention, for example, using a mixer such as a homodisper, a homomixer, a universal mixer, a planetary mixer, a kneader, and three rolls, a radically polymerizable compound And the method of mixing a moisture hardening type urethane resin, an optical radical polymerization initiator, and the additive added as needed, etc. are mentioned.
본 발명의 광 습기 경화형 수지 조성물에 있어서의 콘 플레이트형 점도계를 사용하여, 25 ℃, 1 rpm 의 조건으로 측정한 점도의 바람직한 하한은 50 ㎩·s, 바람직한 상한은 500 ㎩·s 이다. 상기 점도가 50 ㎩·s 미만이거나, 500 ㎩·s 를 초과하거나 하면, 광 습기 경화형 수지 조성물을 전자 부품용 접착제나 표시 소자용 접착제에 사용하는 경우에 기판 등의 피착체에 도포할 때의 작업성이 나빠지는 경우가 있다. 상기 점도의 보다 바람직한 하한은 80 ㎩·s, 보다 바람직한 상한은 300 ㎩·s, 더욱 바람직한 상한은 200 ㎩·s 이다.The preferable lower limit of the viscosity measured on the conditions of 25 degreeC and 1 rpm using the cone plate type viscometer in the optical moisture hardening type resin composition of this invention is 50 Pa.s, and a preferable upper limit is 500 Pa.s. When the viscosity is less than 50 Pa·s or exceeds 500 Pa·s, when the optical moisture curable resin composition is used in an adhesive for electronic components or an adhesive for display elements, an operation when applied to an adherend such as a substrate There is a case where the sex gets worse. A more preferable lower limit of the viscosity is 80 Pa·s, a more preferable upper limit is 300 Pa·s, and a still more preferable upper limit is 200 Pa·s.
본 발명의 광 습기 경화형 수지 조성물의 틱소트로픽 인덱스의 바람직한 하한은 1.3, 바람직한 상한은 5.0 이다. 상기 틱소트로픽 인덱스가 1.3 미만이거나, 5.0 을 초과하거나 하면, 광 습기 경화형 수지 조성물을 전자 부품용 접착제나 표시 소자용 접착제에 사용하는 경우에 기판 등의 피착체에 도포할 때의 작업성이 나빠지는 경우가 있다. 상기 틱소트로픽 인덱스의 보다 바람직한 하한은 1.5, 보다 바람직한 상한은 4.0 이다.A preferable lower limit of the thixotropic index of the optical moisture curable resin composition of the present invention is 1.3, and a preferable upper limit thereof is 5.0. When the thixotropic index is less than 1.3 or exceeds 5.0, when the optical moisture curable resin composition is used in an adhesive for electronic components or an adhesive for display elements, workability when applied to an adherend such as a substrate is deteriorated. There are cases. A more preferable lower limit of the thixotropic index is 1.5, and a more preferable upper limit is 4.0.
또한 본 명세서에 있어서 상기 틱소트로픽 인덱스란, 콘 플레이트형 점도계를 사용하여 25 ℃, 1 rpm 의 조건으로 측정한 점도를, 콘 플레이트형 점도계를 사용하여 25 ℃, 10 rpm 의 조건으로 측정한 점도로 나눈 값을 의미한다.In addition, in the present specification, the thixotropic index refers to the viscosity measured at 25 ° C. and 1 rpm using a cone plate type viscometer, and the viscosity measured at 25 ° C. and 10 rpm using a cone plate type viscometer. means the divided value.
본 발명의 광 습기 경화형 수지 조성물은, 경화물의 25 ℃ 에 있어서의 인장 탄성률의 바람직한 하한이 0.5 ㎏f/㎠, 바람직한 상한이 8 ㎏f/㎠ 이다. 상기 인장 탄성률이 0.5 ㎏f/㎠ 미만이면, 지나치게 부드러워, 응집력이 약하고, 접착력이 낮아지는 경우가 있다. 상기 인장 탄성률이 8 ㎏f/㎠ 를 초과하면, 유연성이 저해되는 경우가 있다. 상기 인장 탄성률의 보다 바람직한 하한은 1 ㎏f/㎠, 보다 바람직한 상한은 6 ㎏f/㎠ 이다.As for the optical moisture hardening type resin composition of this invention, the preferable minimum of the tensile elasticity modulus in 25 degreeC of hardened|cured material is 0.5 kgf/cm<2>, and a preferable upper limit is 8 kgf/cm<2>. When the said tensile modulus is less than 0.5 kgf/cm<2>, it may be too soft, the cohesive force is weak, and adhesive force may become low. When the said tensile elasticity modulus exceeds 8 kgf/cm<2>, softness|flexibility may be impaired. A more preferable lower limit of the tensile modulus is 1 kgf/
또한 본 명세서에 있어서 상기 「인장 탄성률」 은, 인장 시험기 (예를 들어, 시마즈 제작소사 제조, 「EZ-Graph」) 를 사용하여, 경화물을 10 ㎜/min 의 속도로 인장하여, 50 ％ 신장되었을 때의 힘으로서 측정되는 값을 의미한다.In addition, in this specification, the said "tensile modulus" uses a tensile tester (for example, Shimadzu Corporation make, "EZ-Graph"), pulls the hardened|cured material at a speed of 10 mm/min, and elongates 50%. It means the value measured as the force when the
본 발명의 광 습기 경화형 수지 조성물은, 전자 부품용 접착제나 표시 소자용 접착제로서 특히 바람직하게 사용할 수 있다. 본 발명의 광 습기 경화형 수지 조성물을 사용하여 이루어지는 전자 부품용 접착제, 및 본 발명의 광 습기 경화형 수지 조성물을 사용하여 이루어지는 표시 소자용 접착제도 또한, 각각 본 발명의 하나이다.The optical moisture hardening type resin composition of this invention can be used especially suitably as an adhesive agent for electronic components, and an adhesive agent for display elements. The adhesive for electronic components which uses the optical moisture hardening type resin composition of this invention, and the adhesive agent for display elements formed using the optical moisture hardening type resin composition of this invention are also one of this invention, respectively.
본 발명에 의하면, 유연성, 접착성, 및 고온 고습 환경하에 있어서의 신뢰성이 우수한 광 습기 경화형 수지 조성물을 제공할 수 있다. 또, 본 발명에 의하면, 그 광 습기 경화형 수지 조성물을 사용하여 이루어지는 전자 부품용 접착제 및 표시 소자용 접착제를 제공할 수 있다.ADVANTAGE OF THE INVENTION According to this invention, the optical moisture hardening type resin composition excellent in flexibility, adhesiveness, and the reliability in a high-temperature, high-humidity environment can be provided. Moreover, according to this invention, the adhesive agent for electronic components and the adhesive agent for display elements which use this optical moisture hardening type resin composition can be provided.
도 1(a) 는, 접착성 평가용 샘플을 위에서 보았을 경우를 나타내는 모식도이고, (b) 는, 접착성 평가용 샘플을 옆에서 보았을 경우를 나타내는 모식도이다.Fig.1 (a) is a schematic diagram which shows the case where the sample for adhesive evaluation is viewed from above, (b) is a schematic diagram which shows the case where the sample for adhesive evaluation is seen from the side.
이하에 실시예를 들어 본 발명을 더욱 상세하게 설명하지만, 본 발명은 이들 실시예에만 한정되지 않는다.The present invention will be described in more detail below with reference to Examples, but the present invention is not limited only to these Examples.
(합성예 1 (우레탄 프레폴리머 A 의 제조))(Synthesis Example 1 (Preparation of Urethane Prepolymer A))
폴리올로서 100 중량부의 폴리테트라메틸렌에테르글리콜 (미츠비시 화학사 제조, 「PTMG-2000」) 과, 0.01 중량부의 디부틸주석디라우레이트를 500 ㎖ 용적의 세퍼러블 플라스크에 넣고, 진공하 (20 ㎜Hg 이하), 100 ℃ 에서 30 분간 교반하고, 혼합하였다. 그 후 상압으로 하고, 디이소시아네이트로서 26.5 중량부의 Pure MDI (닛소 상사사 제조) 를 넣고, 80 ℃ 에서 3 시간 교반하고, 반응시켜, 우레탄 프레폴리머 A (중량 평균 분자량 2700) 를 얻었다.As a polyol, 100 parts by weight of polytetramethylene ether glycol (manufactured by Mitsubishi Chemical, "PTMG-2000") and 0.01 parts by weight of dibutyltin dilaurate were placed in a separable flask with a volume of 500 ml, and placed under vacuum (20 mmHg or less). ), stirred at 100°C for 30 minutes, and mixed. Then, it was set as normal pressure, 26.5 weight part of Pure MDI (made by Nisso Corporation) was put as diisocyanate, it stirred at 80 degreeC for 3 hours, it was made to react, and the urethane prepolymer A (weight average molecular weight 2700) was obtained.
(합성예 2 (우레탄 프레폴리머 B 의 제조))(Synthesis Example 2 (Preparation of Urethane Prepolymer B))
폴리올로서 100 중량부의 폴리프로필렌글리콜 (아사히 글라스사 제조, 「EXCENOL 2020」) 과, 0.01 중량부의 디부틸주석디라우레이트를 500 ㎖ 용적의 세퍼러블 플라스크에 넣고, 진공하 (20 ㎜Hg 이하), 100 ℃ 에서 30 분간 교반하고, 혼합하였다. 그 후 상압으로 하고, 디이소시아네이트로서 26.5 중량부의 Pure MDI (닛소 상사사 제조) 를 넣고, 80 ℃ 에서 3 시간 교반하고, 반응시켜, 우레탄 프레폴리머 B (중량 평균 분자량 2900) 를 얻었다.As a polyol, 100 parts by weight of polypropylene glycol (manufactured by Asahi Glass Co., Ltd., "EXCENOL 2020") and 0.01 parts by weight of dibutyltin dilaurate were placed in a 500 ml separable flask, and under vacuum (20 mmHg or less), It stirred at 100 degreeC for 30 minutes, and mixed. Then, it was set as normal pressure, 26.5 weight part of Pure MDI (made by Nisso Corporation) was put as diisocyanate, it stirred at 80 degreeC for 3 hours, it was made to react, and the urethane prepolymer B (weight average molecular weight 2900) was obtained.
(합성예 3 (우레탄 프레폴리머 C 의 제조))(Synthesis Example 3 (Preparation of Urethane Prepolymer C))
합성예 1 과 동일하게 하여 얻어진 우레탄 프레폴리머 A 가 들어간 반응 용기에, 하이드록시에틸메타크릴레이트 1.3 중량부와, 중합 금지제로서 N-니트로소페닐하이드록실아민알루미늄염 (와코우 순약 공업사 제조, 「Q-1301」) 0.14 중량부를 첨가하고, 질소 기류하, 80 ℃ 에서 1 시간 교반하고, 혼합하여, 분자 말단에 이소시아네이트기와 메타크릴로일기를 갖는 우레탄 프레폴리머 C (중량 평균 분자량 3100) 를 얻었다.In a reaction vessel containing the urethane prepolymer A obtained in the same manner as in Synthesis Example 1, 1.3 parts by weight of hydroxyethyl methacrylate and N-nitrosophenylhydroxylamine aluminum salt as a polymerization inhibitor (manufactured by Wako Pure Chemical Industries, Ltd., "Q-1301") 0.14 parts by weight was added, stirred for 1 hour at 80° C. under a nitrogen stream, and mixed to obtain a urethane prepolymer C (weight average molecular weight 3100) having an isocyanate group and a methacryloyl group at the molecular terminal. .
(실시예 1 ∼ 10, 비교예 1, 2)(Examples 1 to 10, Comparative Examples 1 and 2)
표 1 에 기재된 배합비에 따라, 각 재료를, 유성식 교반 장치 (싱키사 제조, 「아와토리 렌타로」) 로 교반한 후, 세라믹 3 개 롤로 균일하게 혼합하여 실시예 1 ∼ 10, 비교예 1, 2 의 광 습기 경화형 수지 조성물을 얻었다.According to the mixing ratio shown in Table 1, each material was stirred with a planetary stirring device (manufactured by Sinki Corporation, "Awatori Rentaro"), and then uniformly mixed with three ceramic rolls in Examples 1 to 10 and Comparative Example 1 The optical moisture hardening type resin composition of , 2 was obtained.
또한 표 1 에 있어서의 「우레탄 프레폴리머 A」 는 합성예 1 에 기재한, 양 말단에 이소시아네이트기를 갖는 우레탄 프레폴리머이고, 「우레탄 프레폴리머 B」는 합성예 2 에 기재한, 양 말단에 이소시아네이트기를 갖는 우레탄 프레폴리머이고, 「우레탄 프레폴리머 C」 는 합성예 3 에 기재한, 분자 말단에 이소시아네이트기와 메타크릴로일기를 갖는 우레탄 프레폴리머이다.In addition, "urethane prepolymer A" in Table 1 is a urethane prepolymer having an isocyanate group at both terminals described in Synthesis Example 1, and "urethane prepolymer B" is a urethane prepolymer having an isocyanate group at both terminals described in Synthesis Example 2 It is a urethane prepolymer which has, and "urethane prepolymer C" is a urethane prepolymer which has an isocyanate group and methacryloyl group at the molecular terminal as described in Synthesis Example 3.
<평가><Evaluation>
실시예 및 비교예에서 얻어진 각 광 습기 경화형 수지 조성물에 대해 이하의 평가를 실시하였다. 결과를 표 1 에 나타냈다.The following evaluation was performed about each optical moisture hardening type resin composition obtained by the Example and the comparative example. The results are shown in Table 1.
(접착성)(Adhesive)
실시예 및 비교예에서 얻어진 각 광 습기 경화형 수지 조성물을, 디스펜스 장치를 사용하여, 폴리카보네이트 기판에 약 2 ㎜ 의 폭으로 도포하였다. 그 후, 고압 수은 램프를 사용하여, 자외선을 500 mJ/㎠ 조사함으로써, 광 습기 경화형 수지 조성물을 광 경화시켰다. 그 후, 폴리카보네이트 기판에 유리판을 첩합 (貼合) 하고, 100 g 의 추를 두고, 하룻밤 방치함으로써 습기 경화시켜, 접착성 평가용 샘플을 얻었다.Each optical moisture curable resin composition obtained by the Example and the comparative example was apply|coated to the polycarbonate board|substrate with a width of about 2 mm using the dispensing apparatus. Then, the optical moisture hardening type resin composition was photocured by irradiating 500 mJ/cm<2> of ultraviolet-ray using a high pressure mercury lamp. Then, the glass plate was bonded to the polycarbonate board|substrate, a 100 g weight was put, and it was made to moisture harden by leaving it to stand overnight, and the sample for adhesive evaluation was obtained.
도 1 에 접착성 평가용 샘플을 위에서 보았을 경우를 나타내는 모식도 (도 1(a)), 및 접착성 평가용 샘플을 옆에서 보았을 경우를 나타내는 모식도 (도 1(b)) 를 나타냈다.The schematic diagram (FIG. 1(a)) which shows the case where the sample for adhesive evaluation is viewed from above, and the schematic diagram (FIG. 1(b)) which shows the case where the sample for adhesive evaluation is seen from the side were shown in FIG.
제조한 접착성 평가용 샘플을, 인장 시험기 (시마즈 제작소사 제조, 「Ez-Graph」) 를 사용하여, 전단 방향으로 5 ㎜/sec 의 속도로 인장하여, 폴리카보네이트 기판과 유리판이 박리될 때의 강도를 측정하였다.The prepared sample for evaluation of adhesiveness was pulled using a tensile tester (manufactured by Shimadzu Corporation, "Ez-Graph") at a rate of 5 mm/sec in the shear direction, and the polycarbonate substrate and the glass plate were peeled off. The strength was measured.
(고온 고습 신뢰성 (내크리프성))(High temperature, high humidity reliability (creep resistance))
상기 「(접착성)」 의 평가에 있어서의 접착성 평가용 샘플과 동일하게 하여 고온 고습 신뢰성 평가용 샘플을 제조하였다. 얻어진 고온 고습 신뢰성 평가용 샘플의 폴리카보네이트 기판의 단 (端) 에 100 g 의 추를 매달고, 샘플을 지면에 대해 수직으로 매단 상태에서 60 ℃, 90 RH％ 의 항온항습 오븐에 넣고, 24 시간 가만히 정지시켰다. 24 시간 가만히 정지시킨 후, 폴리카보네이트 기판과 유리판이 박리되지 않은 경우를 「○」, 폴리카보네이트 기판과 유리판이 박리된 경우를 「×」 로 하여, 광 습기 경화형 수지 조성물의 고온 고습 신뢰성 (내크리프성) 을 평가하였다.It carried out similarly to the sample for adhesive evaluation in evaluation of said "(adhesiveness)", and produced the sample for high temperature, high humidity reliability evaluation. A 100 g weight is hung on the end of the polycarbonate substrate of the obtained high-temperature, high-humidity reliability evaluation sample, and the sample is placed in a constant temperature and humidity oven at 60° C. and 90 RH% in a state suspended perpendicular to the ground, and left still for 24 hours. stopped After standing still for 24 hours, the case where the polycarbonate substrate and the glass plate did not peel was taken as "○", and the case where the polycarbonate substrate and the glass plate were peeled was "x", and the high temperature, high humidity reliability (creep resistance) of the optical moisture curing type resin composition sex) was evaluated.
(유연성)(flexibility)
고압 수은 램프를 사용하여, 자외선을 500 mJ/㎠ 조사함으로써, 실시예 및 비교예에서 얻어진 광 습기 경화형 수지 조성물을 광 경화시키고, 그 후, 하룻밤 방치함으로써 습기 경화시켰다. 얻어진 경화물을 덤벨상 (「JIS K 6251」 에서 규정되는 6 호형) 으로 타발하여 얻어진 시험편을, 인장 시험기 (시마즈 제작소사 제조, 「EZ-Graph」) 를 사용하여, 10 ㎜/min 의 속도로 인장하여, 50 ％ 신장되었을 때의 힘을 탄성률로서 구하였다.The optical moisture hardening type resin composition obtained by the Example and the comparative example was photocured by irradiating 500 mJ/cm<2> of ultraviolet-ray using a high pressure mercury lamp, and it was made to moisture harden by leaving it to stand overnight after that. The test piece obtained by punching out the obtained hardened|cured material into the shape of a dumbbell (Type 6 prescribed|regulated by "JIS K 6251") was subjected to a tensile tester (manufactured by Shimadzu Corporation, "EZ-Graph") at a speed of 10 mm/min. The force at the time of tensile and 50% elongation was calculated|required as an elastic modulus.
산업상 이용가능성Industrial Applicability
본 발명에 의하면, 유연성, 접착성, 및 고온 고습 환경하에 있어서의 신뢰성이 우수한 광 습기 경화형 수지 조성물을 제공할 수 있다. 또, 본 발명에 의하면, 그 광 습기 경화형 수지 조성물을 사용하여 이루어지는 전자 부품용 접착제 및 표시 소자용 접착제를 제공할 수 있다.ADVANTAGE OF THE INVENTION According to this invention, the optical moisture hardening type resin composition excellent in flexibility, adhesiveness, and the reliability in a high-temperature, high-humidity environment can be provided. Moreover, according to this invention, the adhesive agent for electronic components and the adhesive agent for display elements which use this optical moisture hardening type resin composition can be provided.
1 폴리카보네이트 기판
2 광 습기 경화형 수지 조성물
3 유리판1 polycarbonate substrate
2 Optical moisture curable resin composition
3 glass plate
Claims (10)
상기 라디칼 중합성 화합물은, 이소시아네이트기와 라디칼 중합성기를 갖는 화합물, 및 이소시아네이트기를 갖지 않고, 라디칼 중합성기를 갖는 화합물을 함유하고,
콘 플레이트형 점도계를 사용하여 25 ℃, 1 rpm 의 조건으로 측정한 점도가 50 ㎩·s 이상, 500 ㎩·s 이하인 것을 특징으로 하는 전자 부품용 접착제.It contains a radically polymerizable compound, a moisture-curable urethane resin, and a radical photopolymerization initiator,
The said radically polymerizable compound contains the compound which has an isocyanate group and a radically polymerizable group, and the compound which does not have an isocyanate group and has a radically polymerizable group,
An adhesive for electronic components, characterized in that the viscosity measured using a cone plate viscometer at 25°C and 1 rpm is 50 Pa·s or more and 500 Pa·s or less.
이소시아네이트기와 라디칼 중합성기를 갖는 화합물은, 하기 식 (1) 로 나타내는 화합물인 것을 특징으로 하는 전자 부품용 접착제.
식 (1) 중, R1 은 수소 또는 메틸기를 나타내고, R2 는 에테르 결합을 가지고 있어도 되는 탄소수 1 ∼ 10 의 알킬렌기를 나타낸다.The method of claim 1,
The compound which has an isocyanate group and a radically polymerizable group is a compound represented by following formula (1), The adhesive agent for electronic components characterized by the above-mentioned.
In Formula (1), R<1> represents hydrogen or a methyl group, and R<2> represents the C1-C10 alkylene group which may have an ether bond.
습기 경화형 우레탄 수지는 라디칼 중합성 관능기를 갖는 것을 특징으로 하는 전자 부품용 접착제.3. The method according to claim 1 or 2,
The moisture-curable urethane resin is an adhesive for electronic components, characterized in that it has a radically polymerizable functional group.
차광제를 함유하는 것을 특징으로 하는 전자 부품용 접착제.3. The method according to claim 1 or 2,
Adhesive for electronic components characterized by containing a light-shielding agent.
충전제를 함유하는 것을 특징으로 하는 전자 부품용 접착제.3. The method according to claim 1 or 2,
An adhesive for electronic components characterized by containing a filler.
상기 라디칼 중합성 화합물은, 이소시아네이트기와 라디칼 중합성기를 갖는 화합물, 및 이소시아네이트기를 갖지 않고, 라디칼 중합성기를 갖는 화합물을 함유하고,
콘 플레이트형 점도계를 사용하여 25 ℃, 1 rpm 의 조건으로 측정한 점도가 50 ㎩·s 이상, 500 ㎩·s 이하인 것을 특징으로 하는 표시 소자용 접착제.It contains a radically polymerizable compound, a moisture-curable urethane resin, and a radical photopolymerization initiator,
The said radically polymerizable compound contains the compound which has an isocyanate group and a radically polymerizable group, and the compound which does not have an isocyanate group and has a radically polymerizable group,
Viscosity measured on condition of 25 degreeC and 1 rpm using cone plate type viscometer is 50 Pa.s or more and 500 Pa.s or less, The adhesive agent for display elements characterized by the above-mentioned.
이소시아네이트기와 라디칼 중합성기를 갖는 화합물은, 하기 식 (1) 로 나타내는 화합물인 것을 특징으로 하는 표시 소자용 접착제.
식 (1) 중, R1 은 수소 또는 메틸기를 나타내고, R2 는 에테르 결합을 가지고 있어도 되는 탄소수 1 ∼ 10 의 알킬렌기를 나타낸다.7. The method of claim 6,
The compound which has an isocyanate group and a radically polymerizable group is a compound represented by following formula (1), The adhesive agent for display elements characterized by the above-mentioned.
In Formula (1), R<1> represents hydrogen or a methyl group, and R<2> represents the C1-C10 alkylene group which may have an ether bond.
습기 경화형 우레탄 수지는 라디칼 중합성 관능기를 갖는 것을 특징으로 하는 표시 소자용 접착제.8. The method according to claim 6 or 7,
The moisture-curable urethane resin has a radically polymerizable functional group, The adhesive for a display element characterized by the above-mentioned.
차광제를 함유하는 것을 특징으로 하는 표시 소자용 접착제.8. The method according to claim 6 or 7,
A light-shielding agent is contained, The adhesive for display elements characterized by the above-mentioned.
충전제를 함유하는 것을 특징으로 하는 표시 소자용 접착제.8. The method according to claim 6 or 7,
A filler is contained, The adhesive for display elements characterized by the above-mentioned.
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| PCT/JP2015/058667 WO2015146878A1 (en) | 2014-03-26 | 2015-03-23 | Light-/moisture-curable resin composition, electronic component adhesive, and display element adhesive |
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| JP2006316175A (en) * | 2005-05-13 | 2006-11-24 | Three Bond Co Ltd | Curable composition and method for forming heat radiating member using the same |
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