KR102305796B1 - 웨이퍼 연마 장치용 연마 패드, 그의 제조 장치 및 제조 방법 - Google Patents

웨이퍼 연마 장치용 연마 패드, 그의 제조 장치 및 제조 방법 Download PDF

Info

Publication number
KR102305796B1
KR102305796B1 KR1020200013622A KR20200013622A KR102305796B1 KR 102305796 B1 KR102305796 B1 KR 102305796B1 KR 1020200013622 A KR1020200013622 A KR 1020200013622A KR 20200013622 A KR20200013622 A KR 20200013622A KR 102305796 B1 KR102305796 B1 KR 102305796B1
Authority
KR
South Korea
Prior art keywords
pad
polyurethane
polishing
manufacturing
nonwoven
Prior art date
Application number
KR1020200013622A
Other languages
English (en)
Korean (ko)
Other versions
KR102305796B9 (ko
KR20210099808A (ko
Inventor
안진우
장수천
Original Assignee
에스케이실트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에스케이실트론 주식회사 filed Critical 에스케이실트론 주식회사
Priority to KR1020200013622A priority Critical patent/KR102305796B1/ko
Priority to CN202080095684.1A priority patent/CN115087519A/zh
Priority to PCT/KR2020/006076 priority patent/WO2021157781A1/ko
Priority to JP2022535856A priority patent/JP2023506029A/ja
Priority to US17/783,059 priority patent/US20230040654A1/en
Publication of KR20210099808A publication Critical patent/KR20210099808A/ko
Application granted granted Critical
Publication of KR102305796B1 publication Critical patent/KR102305796B1/ko
Publication of KR102305796B9 publication Critical patent/KR102305796B9/ko

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B24D11/003—Manufacture of flexible abrasive materials without embedded abrasive particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0027—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impregnation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020200013622A 2020-02-05 2020-02-05 웨이퍼 연마 장치용 연마 패드, 그의 제조 장치 및 제조 방법 KR102305796B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020200013622A KR102305796B1 (ko) 2020-02-05 2020-02-05 웨이퍼 연마 장치용 연마 패드, 그의 제조 장치 및 제조 방법
CN202080095684.1A CN115087519A (zh) 2020-02-05 2020-05-08 晶片抛光装置用抛光垫以及用于制造其的设备和方法
PCT/KR2020/006076 WO2021157781A1 (ko) 2020-02-05 2020-05-08 웨이퍼 연마 장치용 연마 패드, 그의 제조 장치 및 제조 방법
JP2022535856A JP2023506029A (ja) 2020-02-05 2020-05-08 ウエハー研磨装置用研磨パッド並びにその製造装置及び製造方法
US17/783,059 US20230040654A1 (en) 2020-02-05 2020-05-08 Polishing pad for wafer polishing device, and apparatus and method for manufacturing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020200013622A KR102305796B1 (ko) 2020-02-05 2020-02-05 웨이퍼 연마 장치용 연마 패드, 그의 제조 장치 및 제조 방법

Publications (3)

Publication Number Publication Date
KR20210099808A KR20210099808A (ko) 2021-08-13
KR102305796B1 true KR102305796B1 (ko) 2021-09-28
KR102305796B9 KR102305796B9 (ko) 2022-01-17

Family

ID=77200097

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200013622A KR102305796B1 (ko) 2020-02-05 2020-02-05 웨이퍼 연마 장치용 연마 패드, 그의 제조 장치 및 제조 방법

Country Status (5)

Country Link
US (1) US20230040654A1 (zh)
JP (1) JP2023506029A (zh)
KR (1) KR102305796B1 (zh)
CN (1) CN115087519A (zh)
WO (1) WO2021157781A1 (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5061694B2 (ja) * 2007-04-05 2012-10-31 信越半導体株式会社 研磨パッドの製造方法及び研磨パッド並びにウエーハの研磨方法
JP2015096286A (ja) * 2013-11-15 2015-05-21 株式会社ツールバンク 研磨パッド

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4511605A (en) * 1980-09-18 1985-04-16 Norwood Industries, Inc. Process for producing polishing pads comprising a fully impregnated non-woven batt
JPH074769B2 (ja) * 1991-10-11 1995-01-25 ロデール・ニッタ株式会社 研磨用クロス
JPH10249737A (ja) * 1997-03-14 1998-09-22 Nikon Corp 磁気記録媒体用基板の研磨用パッド及び研磨方法
JP2001001270A (ja) * 1999-06-17 2001-01-09 Sumitomo Osaka Cement Co Ltd 研摩用パッド
JP4754921B2 (ja) * 2005-09-30 2011-08-24 富士紡ホールディングス株式会社 研磨布
JP2008155358A (ja) * 2006-11-30 2008-07-10 Toray Ind Inc ガラステクスチャー用研磨布及びその製造方法
JP2012056032A (ja) * 2010-09-09 2012-03-22 Fujibo Holdings Inc 発泡シート材
CN103402706B (zh) * 2011-02-28 2017-02-15 东丽高帝斯株式会社 研磨垫
JP2012223875A (ja) * 2011-04-22 2012-11-15 Toray Coatex Co Ltd 研磨パッド
JP2014193518A (ja) * 2013-02-26 2014-10-09 Crystal Kogaku:Kk 研磨パッドの製造方法
JP6654357B2 (ja) * 2015-04-02 2020-02-26 富士紡ホールディングス株式会社 研磨パッド、研磨パッドの製造方法及び研磨方法
JP2017136662A (ja) * 2016-02-03 2017-08-10 株式会社クリスタル光学 研磨パッド
JP2018122427A (ja) * 2017-02-03 2018-08-09 学校法人立命館 研磨パッドの製造方法
KR101986110B1 (ko) * 2017-07-24 2019-09-03 주식회사 덕성 곡면 글라스 연마용 연마패드 및 그 제조방법
JP6951895B2 (ja) * 2017-07-25 2021-10-20 ニッタ・デュポン株式会社 研磨布

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5061694B2 (ja) * 2007-04-05 2012-10-31 信越半導体株式会社 研磨パッドの製造方法及び研磨パッド並びにウエーハの研磨方法
JP2015096286A (ja) * 2013-11-15 2015-05-21 株式会社ツールバンク 研磨パッド

Also Published As

Publication number Publication date
KR102305796B9 (ko) 2022-01-17
US20230040654A1 (en) 2023-02-09
KR20210099808A (ko) 2021-08-13
CN115087519A (zh) 2022-09-20
JP2023506029A (ja) 2023-02-14
WO2021157781A1 (ko) 2021-08-12

Similar Documents

Publication Publication Date Title
KR100909140B1 (ko) 반도체웨이퍼의 제조방법 및 웨이퍼
JP4555559B2 (ja) 研磨布及び研磨布の製造方法
JPH0623664A (ja) シート状弾性発泡体及びそれを用いたウェーハ研磨加工用治具
JP2830907B2 (ja) 半導体基板研磨装置
US6893337B2 (en) Web-format polishing pads and methods for manufacturing and using web-format polishing pads in mechanical and chemical-mechanical planarization of microelectronic substrates
KR101107652B1 (ko) 패턴화된 반도체 기판 연마 방법
US5964646A (en) Grinding process and apparatus for planarizing sawed wafers
JPH09201765A (ja) バッキングパッドおよび半導体ウエーハの研磨方法
JP6608239B2 (ja) 研磨パッド
JP6423352B2 (ja) 保持パッド
US20050014455A1 (en) Method and pad for polishing wafer
CN109983562B (zh) 双面研磨装置用载体、双面研磨装置及双面研磨方法
KR102305796B1 (ko) 웨이퍼 연마 장치용 연마 패드, 그의 제조 장치 및 제조 방법
JP7081915B2 (ja) 研磨用保持具
JP2006247807A (ja) 研磨布及び研磨布の製造方法
EP0798078A2 (en) Method for manufacturing backing pad and apparatus used therefor
JP3821947B2 (ja) ウェーハ研磨装置及びウェーハ研磨方法
JP6247254B2 (ja) 研磨パッド及びその製造方法
JP4982037B2 (ja) 研磨布用ドレッシングプレート及び研磨布のドレッシング方法並びにワークの研磨方法
JP4104950B2 (ja) 基板研磨方法
US11534889B2 (en) Polishing pad for wafer polishing apparatus and manufacturing method therefor
JP7539240B2 (ja) 研磨パッド、その製造方法、及び研磨加工物の製造方法
KR20210023134A (ko) 웨이퍼 연마 패드 제조장치 및 그를 이용한 웨이퍼 연마 패드의 제조방법
JP3638138B2 (ja) ウエーハ保持盤の作製方法及びウエーハの研磨方法
JP2023133815A (ja) 研磨体

Legal Events

Date Code Title Description
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
G170 Re-publication after modification of scope of protection [patent]