KR102295360B1 - 집적형 팬아웃 패키지 및 그를 형성하는 방법 - Google Patents

집적형 팬아웃 패키지 및 그를 형성하는 방법 Download PDF

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KR102295360B1
KR102295360B1 KR1020190110172A KR20190110172A KR102295360B1 KR 102295360 B1 KR102295360 B1 KR 102295360B1 KR 1020190110172 A KR1020190110172 A KR 1020190110172A KR 20190110172 A KR20190110172 A KR 20190110172A KR 102295360 B1 KR102295360 B1 KR 102295360B1
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South Korea
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layer
forming
composite
die
package
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KR1020190110172A
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Korean (ko)
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KR20200028315A (ko
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첸-후아 유
쿠오 룽 판
틴-하오 쿠오
하오-이 차이
시우-젠 린
하오-잔 페이
칭-후아 시에
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타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드
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Priority claimed from US16/529,989 external-priority patent/US11309294B2/en
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Publication of KR20200028315A publication Critical patent/KR20200028315A/ko
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    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2924/181—Encapsulation

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
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