KR102290636B1 - PCB Side Vertical Bonding Device - Google Patents

Abstract

The present invention relates to a PCB side vertical bonding device and, more specifically, to a device configured to vertically arrange a panel, place a bonding part of the panel on an upper portion, and easily bond a PCB to a side of the panel when bonding the PCB to the panel. The PCB side vertical bonding device can be installed even in a narrow space without a space constraint compared to before, enables more equipment to be installed in a place, and enables bonding work to be performed more reliably and safely compared to before due to vertical bonding.

Description

PCB Side Vertical Bonding Device

The present invention relates to a PCB side vertical bonding device that bonds a PCB to a side portion of a panel, and enables vertical bonding by making the panel vertical.

In general, liquid crystal screens are driven in portable electronic devices such as mobile phones, notebook computers, PDA's, and navigation devices, but various types of high-density semiconductor packages (hereinafter referred to as PCB's) can be realized on the panel to realize features such as low voltage driving, low power consumption, and full color implementation. ) is mounted and used. Furthermore, in the operation of mounting a high-density PCB on a panel, a bonding device that mounts so that the PCB, which is a driving circuit, can be electrically connected to a display panel such as an LCD is used.

Such a bonding apparatus is typically configured to press-bond an anisotropic conductive film (ACF) to the PCB before bonding the PCB to the panel, and then bond the PCB to which the anisotropic conductive film is attached onto the panel.

However, in the conventional bonding apparatus, the ACF work process and the bonding work process are composed of separate facilities, or as the facilities of each process are arranged in a line, the facility occupies a large area and the space utilization is reduced, and the panel or PCB is loaded or Partial processes, including the unloading process, were performed semi-automatically, so there were problems such as lowering work efficiency and taking a lot of time.

Accordingly, there is an urgent need to develop a device capable of solving these problems.

Republic of Korea Patent Publication No. 10-1472366 (Registered on Dec. 8, 2014)

The present invention has been devised to solve the above problems, and an object of the present invention is to, in bonding the PCB to the panel, unlike the conventional bonding while transporting the panel horizontally, after the panel is erected vertically, the PCB By proposing a device that can be bonded vertically to the side of the panel, it can be installed in a narrow space without occupying a large space compared to existing facilities, and at the same time, more equipment can be installed in the same space than before. , It relates to a vertical bonding device on the PCB side that increases the efficiency and ease of bonding work by more reliably supporting the components to be bonded, unlike the existing ones.

Other objects and advantages of the present invention will be set forth below and will be learned by way of example of the present invention. Further, the objects and advantages of the present invention may be realized by means and combinations indicated in the claims.

The present invention is a means for solving the above problems,

Upright installed panel (10);

a stage 20 for fixing the panel 10 to be installed upright on the rear surface of the panel 10 and capable of forward, backward and elevating transport;

a tab IC (30) having one end coupled to the uppermost side of the panel (10) while being parallel to the ground, and forming a right angle with the panel (10);

a PCB 40 horizontally positioned on the bottom surface of the other end of the tab IC 30 ;

a backup part 50 supporting the PCB 40 from the bottom surface of the PCB 40 so as to be positioned on a vertical line with the bonding part of the tab IC 30 and the PCB 40;

A bonding tool ( 60);

At the uppermost end of the stage 20, it is hinged so as to be rotatably in contact with the upper surface of the PCB 40, and is spaced apart from the PCB 40 and the bonding tool 60 when the bonding process is performed by the bonding tool 60. When the panel 10, the tab IC 30, and the PCB 40 are simultaneously moved in one direction after the bonding process by the bonding tool 60 is completed, the PCB 40 It is rotated by the front end so as to be parallel to, and a fixing part 70 for fixing the PCB 40 in a horizontal state so as not to sag downward.

As described above, the present invention has the effect that it is possible to install more equipment in the same installation space as compared to the existing ones, as well as in a narrow space.

In addition, the present invention has the effect that, when bonding the PCB to the side of the panel, the panel is erected vertically and the side is placed on the upper surface to perform vertical bonding, so that the bonding operation can be performed more reliably and stably than before.

1 is a view of an embodiment showing a PCB side vertical bonding device according to the present invention.
Figure 2 is a view of an embodiment showing the difference between the bonding structure of the present invention and the prior art.

Before describing various embodiments of the present invention in detail, it is to be understood that the application is not limited to the details of the construction and arrangement of components described in the following detailed description or shown in the drawings. The invention is capable of being embodied and practiced in other embodiments and of being carried out in various ways. Also, device or element orientation (eg "front", "back", "up", "down", "top", "bottom") The expressions and predicates used herein with respect to terms such as ", "left", "right", "lateral", etc. are used merely to simplify the description of the invention, and the associated apparatus Or it will be appreciated that it does not simply indicate or imply that an element must have a particular orientation. Also, terms such as “first” and “second” are used in this application and the appended claims for the purpose of description and are not intended to indicate or imply relative importance or spirit.

In order to achieve the above object, the present invention has the following features.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, the terms or words used in the present specification and claims should not be construed as being limited to conventional or dictionary meanings, and the inventor should properly understand the concept of the term in order to best describe his invention. Based on the principle that it can be defined, it should be interpreted as meaning and concept consistent with the technical idea of the present invention.

Therefore, the configuration shown in the embodiments and drawings described in the present specification is only the most preferred embodiment of the present invention and does not represent all of the technical spirit of the present invention, so at the time of the present application, various It should be understood that there may be equivalents and variations.

Hereinafter, a PCB side vertical bonding apparatus according to a preferred embodiment of the present invention will be described in detail with reference to FIGS. 1 to 2 .

The PCB side vertical bonding apparatus according to the present invention includes a panel 10 , a stage 20 , a tab IC 30 , a PCB 40 , a backup unit 50 , and a fixing unit 70 .

The panel 10 is a place to which a tab IC 30 to be described later is attached, and in the present invention, it has a structure in which it is erected and transported in a vertical state.

The stage 20 is fixed so that the panel 10 is installed upright on the rear surface of the panel 10 described above. has a structure to be In addition, according to the user's embodiment, the stage 20 is installed in a form capable of moving forward, backward, elevating, and lowering by means of various separate transfer means toward the rear surface of the panel 10, so that the rear panel 10 is mounted on the rear surface of the panel 10. In a state in which the stage 20 is fixed, the stage 20 can be transported in one direction or can be transported in a desired direction.

In addition, the stage 20 has a plurality of first vacuum adsorption units 21 formed on one surface in contact with the panel 10 so that the panel 10 can be vertically fixed by vacuum adsorption.

The tab IC (TAB-IC (Tape Automated Bonding-Integrated Circuit)) 30 is installed on the uppermost side of the panel 10 so as to form a horizontal plane with the ground and one end to form a right angle with the panel 10 .

The printed circuit board (PCB) 40 is horizontally positioned and bonded to the bottom surface of the other end of the above-described tab IC 30 . Of course, it is natural that an ACF (Anisotropic Conductive Film) for pressure bonding with the tab IC 30 is formed on one end of the upper surface of the PCB 40 .

The backup part (Back up) 50 is installed vertically from the bottom surface of the PCB 40 so as to be positioned on a vertical line with the bonding part of the above-described tab IC 30 and the PCB 40 , the backup part 50 . While the upper surface of the PCB (40) is in contact with the bottom surface, it is to support the PCB (40). Of course, it is installed so as to be movable in elevating and descending and forward and backward, left and right directions.

In addition, the PCB 40 is a PCB support 80 with a backup part 50 on one side of the bottom surface of the PCB 40 to support the remaining bottom part of the PCB 40 that is not supported by the backup part 50 ( It is possible to move forward, backward, left and right, up and down) may be further installed.

The bonding tool 60 is installed so as to be able to ascend and descend from the upper part of the tab IC 30, and is vertically lowered toward the bonding portion of the tab IC 30 and the PCB 40 by applying heat and pressing, This is to ensure that they are vertically bonded to each other.

The fixing part 70 is hinged rotatably so as to be in contact with the upper surface of the PCB 40 at the top end of the stage 20, and when the bonding process is performed by the bonding tool 60, the PCB 40 and bonding When the tool 60 is rotated to the rear end to be spaced apart and vertically erected, the bonding process by the bonding tool 60 is completed and the panel 10, the tab IC 30, and the PCB 40 are simultaneously moved in one direction. In this case, the front end is rotated so as to be parallel to the PCB 40, and serves to fix the PCB 40 in a horizontal state so as not to sag downward.

The fixing part 70 for this includes a rotating part 71 , a fixing plate 72 , and a second vacuum adsorption part (Vac Pad) 73 .

The rotating part 71 is configured to be rotatably installed on the top of the stage 20 and serves as a hinge.

The fixed plate 72 is a plate material, and one end is fixedly installed on the rotating part 71 , and is rotated by the operation of the rotating part 71 .

The second vacuum adsorption part 73 is formed on one side of the bottom surface of the fixing plate 72 so that the PCB 40 can be maintained in a horizontal state by vacuum suction when in contact with the PCB 40 .

As described above, although the present invention has been described with reference to limited embodiments and drawings, the present invention is not limited thereto, and the technical spirit of the present invention and the following by those of ordinary skill in the art to which the present invention pertains. Of course, various modifications and changes are possible within the scope of equivalents of the claims to be described.

10: panel 20: stage
21: first vacuum adsorption unit 30: tap IC
40: PCB 50: backup part
60: bonding tool 70: fixed part
71: rotating part 72: fixed plate
73: second vacuum adsorption unit 80: PCB support

Claims (4)

Upright installed panel (10);
a stage 20 for fixing the panel 10 to be installed upright on the rear surface of the panel 10 and capable of forward, backward and elevating transport;
a tab IC (30) having one end coupled to the uppermost side of the panel (10) while being parallel to the ground, forming a right angle with the panel (10);
a PCB 40 horizontally positioned on the bottom surface of the other end of the tab IC 30 ;
a backup part 50 supporting the PCB 40 from the bottom surface of the PCB 40 so as to be positioned on a vertical line with the bonding part of the tab IC 30 and the PCB 40;
A bonding tool ( 60);
At the uppermost end of the stage 20, it is hinged so as to be rotatably in contact with the upper surface of the PCB 40, and is spaced apart from the PCB 40 and the bonding tool 60 when the bonding process is performed by the bonding tool 60. When the panel 10, the tab IC 30, and the PCB 40 are simultaneously moved in one direction after the bonding process by the bonding tool 60 is completed, the PCB 40 a fixing part 70 which is rotated to the front end so as to be parallel to and fixed in a horizontal state so that the PCB 40 does not sag downward; is made of,
The PCB 40 is
A PCB support 80 installed together with the backup part 50 on one side of the bottom surface of the PCB 40;
The stage 20 is
A plurality of first vacuum adsorption portions 21 are formed on one surface in contact with the panel 10 to vertically position the panel 10 by vacuum adsorption,
The fixing part 70 is
a rotating part 71 rotatably installed on the stage 20;
a fixed plate 72 having one end fixed to the rotating unit 71 and rotating by the operation of the rotating unit 71;
a second vacuum adsorption unit 73 formed on one side of the bottom surface of the fixing plate 72 and maintaining the PCB 40 in a horizontal state by vacuum adsorption when in contact with the PCB 40;
PCB side vertical bonding device, characterized in that consisting of.
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