KR102269517B1 - 이방성 유전체 유전율을 가진 반도체 구조물의 모델 기반 광학 측정 - Google Patents
이방성 유전체 유전율을 가진 반도체 구조물의 모델 기반 광학 측정 Download PDFInfo
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- KR102269517B1 KR102269517B1 KR1020197009076A KR20197009076A KR102269517B1 KR 102269517 B1 KR102269517 B1 KR 102269517B1 KR 1020197009076 A KR1020197009076 A KR 1020197009076A KR 20197009076 A KR20197009076 A KR 20197009076A KR 102269517 B1 KR102269517 B1 KR 102269517B1
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Applications Claiming Priority (5)
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| US201662381987P | 2016-08-31 | 2016-08-31 | |
| US62/381,987 | 2016-08-31 | ||
| US15/649,843 | 2017-07-14 | ||
| US15/649,843 US10458912B2 (en) | 2016-08-31 | 2017-07-14 | Model based optical measurements of semiconductor structures with anisotropic dielectric permittivity |
| PCT/US2017/047159 WO2018044572A1 (en) | 2016-08-31 | 2017-08-16 | Model based optical measurements of semiconductor structures with anisotropic dielectric permittivity |
Publications (2)
| Publication Number | Publication Date |
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| KR20190039331A KR20190039331A (ko) | 2019-04-10 |
| KR102269517B1 true KR102269517B1 (ko) | 2021-06-24 |
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| JP (1) | JP6801110B2 (enExample) |
| KR (1) | KR102269517B1 (enExample) |
| CN (1) | CN109643672B (enExample) |
| IL (1) | IL264571B (enExample) |
| TW (1) | TWI728179B (enExample) |
| WO (1) | WO2018044572A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20250050573A (ko) | 2023-10-06 | 2025-04-15 | 한국과학기술원 | 강유전체 나노구조의 3차원 분극분포 분석 방법 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE102016208264A1 (de) * | 2016-05-13 | 2017-11-16 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Verfahren und Vorrichtung zur Überwachung, insbesondere zur Regelung, eines Schneidprozesses |
| US11156548B2 (en) | 2017-12-08 | 2021-10-26 | Kla-Tencor Corporation | Measurement methodology of advanced nanostructures |
| US11036898B2 (en) * | 2018-03-15 | 2021-06-15 | Kla-Tencor Corporation | Measurement models of nanowire semiconductor structures based on re-useable sub-structures |
| US11054250B2 (en) * | 2018-04-11 | 2021-07-06 | International Business Machines Corporation | Multi-channel overlay metrology |
| JP6830464B2 (ja) * | 2018-09-26 | 2021-02-17 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | 基板処理装置、半導体装置の製造方法および記録媒体。 |
| US11694916B2 (en) | 2018-10-15 | 2023-07-04 | Koh Young Technology Inc. | Apparatus, method and recording medium storing command for inspection |
| DE102018220629A1 (de) * | 2018-11-29 | 2020-06-04 | Carl Zeiss Smt Gmbh | Spiegel für eine Beleuchtungsoptik einer Projektionsbelichtungsanlage mit einem Spektralfilter in Form einer Gitterstruktur und Verfahren zur Herstellung eines Spektralfilters in Form einer Gitterstruktur auf einem Spiegel |
| CN109580551A (zh) * | 2018-11-30 | 2019-04-05 | 武汉颐光科技有限公司 | 一种傅里叶变换红外穆勒矩阵椭偏仪及其测量方法 |
| US11060846B2 (en) | 2018-12-19 | 2021-07-13 | Kla Corporation | Scatterometry based methods and systems for measurement of strain in semiconductor structures |
| CN111380464B (zh) * | 2018-12-28 | 2021-05-07 | 上海微电子装备（集团）股份有限公司 | 一种光栅尺的安装装置、安装方法、光栅测量系统及光刻机 |
| US11060982B2 (en) * | 2019-03-17 | 2021-07-13 | Kla Corporation | Multi-dimensional model of optical dispersion |
| CN112067559B (zh) * | 2019-06-11 | 2023-06-13 | 南开大学 | 材料光学常数的确定方法、材料数据库的扩展方法及装置 |
| CN110416106B (zh) * | 2019-07-30 | 2022-05-27 | 上海华力集成电路制造有限公司 | Ocd测试图形结构及其制造方法 |
| US11966203B2 (en) * | 2019-08-21 | 2024-04-23 | Kla Corporation | System and method to adjust a kinetics model of surface reactions during plasma processing |
| US11460418B2 (en) | 2019-08-26 | 2022-10-04 | Kla Corporation | Methods and systems for semiconductor metrology based on wavelength resolved soft X-ray reflectometry |
| CN110596011B (zh) | 2019-08-26 | 2020-12-29 | 华中科技大学 | 一种材料介电张量测量方法 |
| EP4065957A1 (de) * | 2019-11-28 | 2022-10-05 | EV Group E. Thallner GmbH | Vorrichtung und verfahren zur vermessung eines substrats |
| US11698251B2 (en) | 2020-01-07 | 2023-07-11 | Kla Corporation | Methods and systems for overlay measurement based on soft X-ray Scatterometry |
| CN111595812B (zh) * | 2020-05-29 | 2021-06-22 | 复旦大学 | 基于动量空间色散关系的关键参数的量测方法和系统 |
| WO2021260765A1 (ja) * | 2020-06-22 | 2021-12-30 | 株式会社日立ハイテク | 寸法計測装置、半導体製造装置及び半導体装置製造システム |
| KR102825817B1 (ko) * | 2020-08-28 | 2025-06-30 | 삼성전자주식회사 | 두께 추정 방법 및 공정 제어 방법 |
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| CN109643672A (zh) | 2019-04-16 |
| JP6801110B2 (ja) | 2020-12-16 |
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