KR102256655B1 - 전자파 차폐 필름, 차폐 프린트 배선판 및 전자 기기 - Google Patents

전자파 차폐 필름, 차폐 프린트 배선판 및 전자 기기 Download PDF

Info

Publication number
KR102256655B1
KR102256655B1 KR1020197015506A KR20197015506A KR102256655B1 KR 102256655 B1 KR102256655 B1 KR 102256655B1 KR 1020197015506 A KR1020197015506 A KR 1020197015506A KR 20197015506 A KR20197015506 A KR 20197015506A KR 102256655 B1 KR102256655 B1 KR 102256655B1
Authority
KR
South Korea
Prior art keywords
electromagnetic wave
shielding film
wave shielding
layer
wiring board
Prior art date
Application number
KR1020197015506A
Other languages
English (en)
Korean (ko)
Other versions
KR20190116972A (ko
Inventor
겐지 가미노
시로 야마우치
준 시라카미
아키라 무라카와
Original Assignee
타츠타 전선 주식회사
디아이씨 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 타츠타 전선 주식회사, 디아이씨 가부시끼가이샤 filed Critical 타츠타 전선 주식회사
Publication of KR20190116972A publication Critical patent/KR20190116972A/ko
Application granted granted Critical
Publication of KR102256655B1 publication Critical patent/KR102256655B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
    • B32B3/18—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by an internal layer formed of separate pieces of material which are juxtaposed side-by-side
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
KR1020197015506A 2017-02-08 2018-02-07 전자파 차폐 필름, 차폐 프린트 배선판 및 전자 기기 KR102256655B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2017-021650 2017-02-08
JP2017021650 2017-02-08
PCT/JP2018/004112 WO2018147301A1 (ja) 2017-02-08 2018-02-07 電磁波シールドフィルム、シールドプリント配線板及び電子機器

Publications (2)

Publication Number Publication Date
KR20190116972A KR20190116972A (ko) 2019-10-15
KR102256655B1 true KR102256655B1 (ko) 2021-05-25

Family

ID=63107549

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197015506A KR102256655B1 (ko) 2017-02-08 2018-02-07 전자파 차폐 필름, 차폐 프린트 배선판 및 전자 기기

Country Status (5)

Country Link
JP (1) JP6404534B1 (ja)
KR (1) KR102256655B1 (ja)
CN (1) CN110199583B (ja)
TW (1) TWI761446B (ja)
WO (1) WO2018147301A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110783014A (zh) * 2018-11-26 2020-02-11 广州方邦电子股份有限公司 导电胶膜、线路板及导电胶膜的制备方法
CN113545180A (zh) * 2019-03-22 2021-10-22 拓自达电线株式会社 电磁波屏蔽膜

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004273577A (ja) 2003-03-06 2004-09-30 Sumitomo Electric Printed Circuit Inc シールドフィルムおよびその製造方法
WO2014192494A1 (ja) 2013-05-29 2014-12-04 タツタ電線株式会社 電磁波シールドフィルム、それを用いたプリント配線板、及び圧延銅箔

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3017987B1 (ja) * 1998-12-25 2000-03-13 住友ゴム工業株式会社 透光性電磁波シ―ルド部材およびその製造方法
JP4647924B2 (ja) * 2004-03-23 2011-03-09 タツタ電線株式会社 プリント配線板用シールドフィルム及びその製造方法
JP5498032B2 (ja) * 2009-02-17 2014-05-21 富士フイルム株式会社 微細構造体の製造方法および微細構造体
TWI444132B (zh) * 2011-12-08 2014-07-01 Ind Tech Res Inst 電磁波屏蔽複合膜及具有該複合膜之軟性印刷電路板
TWI488280B (zh) * 2012-11-21 2015-06-11 Ind Tech Res Inst 電磁波屏蔽結構及其製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004273577A (ja) 2003-03-06 2004-09-30 Sumitomo Electric Printed Circuit Inc シールドフィルムおよびその製造方法
WO2014192494A1 (ja) 2013-05-29 2014-12-04 タツタ電線株式会社 電磁波シールドフィルム、それを用いたプリント配線板、及び圧延銅箔

Also Published As

Publication number Publication date
JP6404534B1 (ja) 2018-10-10
CN110199583B (zh) 2020-12-22
KR20190116972A (ko) 2019-10-15
WO2018147301A1 (ja) 2018-08-16
TWI761446B (zh) 2022-04-21
TW201836465A (zh) 2018-10-01
CN110199583A (zh) 2019-09-03
JPWO2018147301A1 (ja) 2019-02-14

Similar Documents

Publication Publication Date Title
KR102267570B1 (ko) 전자파 차폐 필름, 차폐 프린트 배선판 및 전자 기기
KR102245681B1 (ko) 전자파 차폐 필름, 차폐 프린트 배선판 및 전자 기기
KR102256655B1 (ko) 전자파 차폐 필름, 차폐 프린트 배선판 및 전자 기기
KR102231053B1 (ko) 전자파 차폐 필름, 차폐 프린트 배선판 및 전자 기기
JP7395711B2 (ja) 金属層及び電磁波シールドフィルム
WO2023038097A1 (ja) 電磁波シールドフィルム
WO2022210631A1 (ja) 電磁波シールドフィルム及びシールドプリント配線板

Legal Events

Date Code Title Description
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant