KR102244251B1 - 배선기판 - Google Patents

배선기판 Download PDF

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Publication number
KR102244251B1
KR102244251B1 KR1020190123187A KR20190123187A KR102244251B1 KR 102244251 B1 KR102244251 B1 KR 102244251B1 KR 1020190123187 A KR1020190123187 A KR 1020190123187A KR 20190123187 A KR20190123187 A KR 20190123187A KR 102244251 B1 KR102244251 B1 KR 102244251B1
Authority
KR
South Korea
Prior art keywords
pedestal
mounting
mounting area
substrate
wiring board
Prior art date
Application number
KR1020190123187A
Other languages
English (en)
Korean (ko)
Other versions
KR20200039598A (ko
Inventor
요스케 이모토
신이치로 하네이시
겐지 스즈키
노리히코 가와이
나오키 기토
Original Assignee
니혼도꾸슈도교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 니혼도꾸슈도교 가부시키가이샤 filed Critical 니혼도꾸슈도교 가부시키가이샤
Publication of KR20200039598A publication Critical patent/KR20200039598A/ko
Application granted granted Critical
Publication of KR102244251B1 publication Critical patent/KR102244251B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
KR1020190123187A 2018-10-05 2019-10-04 배선기판 KR102244251B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2018190122 2018-10-05
JPJP-P-2018-190122 2018-10-05
JPJP-P-2019-152452 2019-08-23
JP2019152452A JP6775071B2 (ja) 2018-10-05 2019-08-23 配線基板

Publications (2)

Publication Number Publication Date
KR20200039598A KR20200039598A (ko) 2020-04-16
KR102244251B1 true KR102244251B1 (ko) 2021-04-23

Family

ID=70220280

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190123187A KR102244251B1 (ko) 2018-10-05 2019-10-04 배선기판

Country Status (2)

Country Link
JP (1) JP6775071B2 (ja)
KR (1) KR102244251B1 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015185622A (ja) 2014-03-22 2015-10-22 京セラ株式会社 電子素子実装用基板及び電子装置
JP2018110263A (ja) 2016-08-10 2018-07-12 京セラ株式会社 電気素子搭載用パッケージ、アレイ型パッケージおよび電気装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0742964U (ja) * 1993-12-28 1995-08-11 株式会社住友金属セラミックス 半導体素子収納用パッケージ
JPH10303323A (ja) * 1997-04-25 1998-11-13 Fukushima Nippon Denki Kk 半導体集積回路の気密封止パッケージ
KR100543836B1 (ko) * 1997-08-19 2006-01-23 가부시키가이샤 히타치세이사쿠쇼 멀티칩 모듈 구조체 및 그 제작 방법
JP5216981B2 (ja) * 2007-07-09 2013-06-19 Ｊｆｅ精密株式会社 半導体用放熱部品およびそれを取付けた半導体用ケース、半導体用キャリア
JP6328475B2 (ja) 2014-04-16 2018-05-23 Ｎｇｋエレクトロデバイス株式会社 電子部品収納用パッケージ
JP2018185622A (ja) * 2017-04-25 2018-11-22 株式会社日立システムズ サーバー装置、認証システムおよび認証方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015185622A (ja) 2014-03-22 2015-10-22 京セラ株式会社 電子素子実装用基板及び電子装置
JP2018110263A (ja) 2016-08-10 2018-07-12 京セラ株式会社 電気素子搭載用パッケージ、アレイ型パッケージおよび電気装置

Also Published As

Publication number Publication date
JP2020061545A (ja) 2020-04-16
JP6775071B2 (ja) 2020-10-28
KR20200039598A (ko) 2020-04-16

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