KR102209470B1 - 테스트 엘리먼트 지지체 - Google Patents

테스트 엘리먼트 지지체 Download PDF

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KR102209470B1
KR102209470B1 KR1020197010639A KR20197010639A KR102209470B1 KR 102209470 B1 KR102209470 B1 KR 102209470B1 KR 1020197010639 A KR1020197010639 A KR 1020197010639A KR 20197010639 A KR20197010639 A KR 20197010639A KR 102209470 B1 KR102209470 B1 KR 102209470B1
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substrate
test element
test
heater
active region
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KR20190052082A (ko
Inventor
라이너 슈타인
마르틴 메르텐스
베르너 하이트
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에프. 호프만-라 로슈 아게
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212Printed circuits or mounted components having integral heating means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L7/00Heating or cooling apparatus; Heat insulating devices
    • B01L7/04Heat insulating devices, e.g. jackets for flasks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L9/00Supporting devices; Holding devices
    • B01L9/52Supports specially adapted for flat sample carriers, e.g. for plates, slides, chips
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/28Electrolytic cell components
    • G01N27/30Electrodes, e.g. test electrodes; Half-cells
    • G01N27/327Biochemical electrodes, e.g. electrical or mechanical details for in vitro measurements
    • G01N27/3271Amperometric enzyme electrodes for analytes in body fluids, e.g. glucose in blood
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/48Biological material, e.g. blood, urine; Haemocytometers
    • G01N33/483Physical analysis of biological material
    • G01N33/487Physical analysis of biological material of liquid biological material
    • G01N33/48707Physical analysis of biological material of liquid biological material by electrical means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/48Biological material, e.g. blood, urine; Haemocytometers
    • G01N33/483Physical analysis of biological material
    • G01N33/487Physical analysis of biological material of liquid biological material
    • G01N33/49Blood
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/48Biological material, e.g. blood, urine; Haemocytometers
    • G01N33/483Physical analysis of biological material
    • G01N33/487Physical analysis of biological material of liquid biological material
    • G01N33/49Blood
    • G01N33/4905Determining clotting time of blood
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/144Stacked arrangements of planar printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/368Assembling printed circuits with other printed circuits parallel to each other
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00Additional constructional details
    • B01L2300/06Auxiliary integrated devices, integrated components
    • B01L2300/0609Holders integrated in container to position an object
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00Additional constructional details
    • B01L2300/06Auxiliary integrated devices, integrated components
    • B01L2300/0627Sensor or part of a sensor is integrated
    • B01L2300/0663Whole sensors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00Additional constructional details
    • B01L2300/08Geometry, shape and general structure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00Additional constructional details
    • B01L2300/18Means for temperature control
    • B01L2300/1805Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00Additional constructional details
    • B01L2300/18Means for temperature control
    • B01L2300/1883Means for temperature control using thermal insulation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/041Stacked PCBs, i.e. having neither an empty space nor mounted components in between
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06Thermal details
    • H05K2201/062Means for thermal insulation, e.g. for protection of parts
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09063Holes or slots in insulating substrate not used for electrical connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10151Sensor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115Resistance heating, e.g. by current through the PCB conductors or through a metallic mask

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Biomedical Technology (AREA)
  • Physics & Mathematics (AREA)
  • Hematology (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Biochemistry (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Molecular Biology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Food Science & Technology (AREA)
  • Urology & Nephrology (AREA)
  • Biophysics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Ecology (AREA)
  • Clinical Laboratory Science (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)
  • Structure Of Printed Boards (AREA)
  • Measuring Or Testing Involving Enzymes Or Micro-Organisms (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
KR1020197010639A 2016-10-14 2017-10-12 테스트 엘리먼트 지지체 Active KR102209470B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP16193896 2016-10-14
EP16193896.4 2016-10-14
PCT/EP2017/076028 WO2018069429A1 (en) 2016-10-14 2017-10-12 Test element support

Publications (2)

Publication Number Publication Date
KR20190052082A KR20190052082A (ko) 2019-05-15
KR102209470B1 true KR102209470B1 (ko) 2021-01-29

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197010639A Active KR102209470B1 (ko) 2016-10-14 2017-10-12 테스트 엘리먼트 지지체

Country Status (6)

Country Link
US (1) US11911768B2 (enExample)
EP (1) EP3527051B1 (enExample)
JP (1) JP7104029B2 (enExample)
KR (1) KR102209470B1 (enExample)
CN (1) CN109804718B (enExample)
WO (1) WO2018069429A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6819163B2 (ja) * 2016-09-12 2021-01-27 株式会社デンソーウェーブ 絶縁型信号伝達装置、電子機器
GB2557592A (en) * 2016-12-09 2018-06-27 Evonetix Ltd Temperature control device
JP7604815B2 (ja) * 2020-09-10 2024-12-24 富士電機株式会社 半導体装置および半導体装置の製造方法
WO2024201074A1 (en) * 2023-03-31 2024-10-03 Servomex Group Limited Method and apparatus for use in optical gas absorption measurements

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000006761A1 (en) * 1998-07-29 2000-02-10 Hemosense, Inc. Method and device for measuring blood coagulation or lysis by viscosity changes
JP2004045415A (ja) * 1993-08-31 2004-02-12 Roche Diagnostics Corp 検体判定方法、及び装置向上方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4301412A (en) * 1979-10-29 1981-11-17 United States Surgical Corporation Liquid conductivity measuring system and sample cards therefor
JPH03296292A (ja) * 1990-04-13 1991-12-26 Taiyo Yuden Co Ltd 混成集積回路部品
US6423940B1 (en) * 2001-03-02 2002-07-23 Agilent Technologies, Inc. Temperature stabilization scheme for a circuit board
EP1509943A2 (en) * 2002-05-31 2005-03-02 Thermo Finnigan LLC Mass spectrometer with improved mass accuracy
EP1443325A1 (en) 2003-02-01 2004-08-04 Roche Diagnostics GmbH System and method for determining a coagulation parameter
KR100577406B1 (ko) * 2003-09-17 2006-05-10 박재상 Pcb 방식을 이용한 히터 제조방법 및 히터
RU2333622C1 (ru) 2004-11-29 2008-09-10 Хитроникс Корп. Способы и система теплового подсоединения и отсоединения компонентов для поверхностного монтажа
CN101080962A (zh) * 2004-11-29 2007-11-28 希脱鲁尼克斯公司 用于表面安装元件的热附连与分离的方法与系统
EP2203725A4 (en) 2007-10-15 2011-04-20 Bayer Healthcare Llc METHOD AND ASSEMBLY FOR DETERMINING THE TEMPERATURE OF A TEST SENSOR
DE102013211693B3 (de) * 2013-06-20 2014-07-24 I-For-T Gmbh Sensor mit einem mikroelektromechanischem Chip (MEMS-Chip)

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004045415A (ja) * 1993-08-31 2004-02-12 Roche Diagnostics Corp 検体判定方法、及び装置向上方法
WO2000006761A1 (en) * 1998-07-29 2000-02-10 Hemosense, Inc. Method and device for measuring blood coagulation or lysis by viscosity changes

Also Published As

Publication number Publication date
US11911768B2 (en) 2024-02-27
CN109804718B (zh) 2021-06-18
US20190232292A1 (en) 2019-08-01
KR20190052082A (ko) 2019-05-15
CN109804718A (zh) 2019-05-24
JP2019533900A (ja) 2019-11-21
EP3527051A1 (en) 2019-08-21
JP7104029B2 (ja) 2022-07-20
WO2018069429A1 (en) 2018-04-19
EP3527051B1 (en) 2020-11-18

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