JP7104029B2 - 試験要素支持体 - Google Patents

試験要素支持体 Download PDF

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Publication number
JP7104029B2
JP7104029B2 JP2019516646A JP2019516646A JP7104029B2 JP 7104029 B2 JP7104029 B2 JP 7104029B2 JP 2019516646 A JP2019516646 A JP 2019516646A JP 2019516646 A JP2019516646 A JP 2019516646A JP 7104029 B2 JP7104029 B2 JP 7104029B2
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JP
Japan
Prior art keywords
test element
substrate
test
heater
support
Prior art date
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JP2019516646A
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English (en)
Japanese (ja)
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JP2019533900A (ja
JP2019533900A5 (enExample
Inventor
シュタイン，ライナー
メルテンス，マルティン
ハイト，ヴェルナー
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F Hoffmann La Roche AG
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F Hoffmann La Roche AG
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Publication of JP2019533900A publication Critical patent/JP2019533900A/ja
Publication of JP2019533900A5 publication Critical patent/JP2019533900A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L7/00—Heating or cooling apparatus; Heat insulating devices
    • B01L7/04—Heat insulating devices, e.g. jackets for flasks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L9/00—Supporting devices; Holding devices
    • B01L9/52—Supports specially adapted for flat sample carriers, e.g. for plates, slides, chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/28—Electrolytic cell components
    • G01N27/30—Electrodes, e.g. test electrodes; Half-cells
    • G01N27/327—Biochemical electrodes, e.g. electrical or mechanical details for in vitro measurements
    • G01N27/3271—Amperometric enzyme electrodes for analytes in body fluids, e.g. glucose in blood
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/48—Biological material, e.g. blood, urine; Haemocytometers
    • G01N33/483—Physical analysis of biological material
    • G01N33/487—Physical analysis of biological material of liquid biological material
    • G01N33/48707—Physical analysis of biological material of liquid biological material by electrical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/48—Biological material, e.g. blood, urine; Haemocytometers
    • G01N33/483—Physical analysis of biological material
    • G01N33/487—Physical analysis of biological material of liquid biological material
    • G01N33/49—Blood
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/48—Biological material, e.g. blood, urine; Haemocytometers
    • G01N33/483—Physical analysis of biological material
    • G01N33/487—Physical analysis of biological material of liquid biological material
    • G01N33/49—Blood
    • G01N33/4905—Determining clotting time of blood
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/06—Auxiliary integrated devices, integrated components
    • B01L2300/0609—Holders integrated in container to position an object
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/06—Auxiliary integrated devices, integrated components
    • B01L2300/0627—Sensor or part of a sensor is integrated
    • B01L2300/0663—Whole sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/18—Means for temperature control
    • B01L2300/1805—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/18—Means for temperature control
    • B01L2300/1883—Means for temperature control using thermal insulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/062—Means for thermal insulation, e.g. for protection of parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask

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  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Biomedical Technology (AREA)
  • Physics & Mathematics (AREA)
  • Hematology (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Biochemistry (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Molecular Biology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Food Science & Technology (AREA)
  • Urology & Nephrology (AREA)
  • Biophysics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Ecology (AREA)
  • Clinical Laboratory Science (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)
  • Structure Of Printed Boards (AREA)
  • Measuring Or Testing Involving Enzymes Or Micro-Organisms (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
JP2019516646A 2016-10-14 2017-10-12 試験要素支持体 Active JP7104029B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP16193896 2016-10-14
EP16193896.4 2016-10-14
PCT/EP2017/076028 WO2018069429A1 (en) 2016-10-14 2017-10-12 Test element support

Publications (3)

Publication Number Publication Date
JP2019533900A JP2019533900A (ja) 2019-11-21
JP2019533900A5 JP2019533900A5 (enExample) 2020-11-12
JP7104029B2 true JP7104029B2 (ja) 2022-07-20

Family

ID=57286206

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019516646A Active JP7104029B2 (ja) 2016-10-14 2017-10-12 試験要素支持体

Country Status (6)

Country Link
US (1) US11911768B2 (enExample)
EP (1) EP3527051B1 (enExample)
JP (1) JP7104029B2 (enExample)
KR (1) KR102209470B1 (enExample)
CN (1) CN109804718B (enExample)
WO (1) WO2018069429A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190275527A1 (en) * 2016-12-09 2019-09-12 Evonetix Ltd Temperature control device

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6819163B2 (ja) * 2016-09-12 2021-01-27 株式会社デンソーウェーブ 絶縁型信号伝達装置、電子機器
JP7604815B2 (ja) * 2020-09-10 2024-12-24 富士電機株式会社 半導体装置および半導体装置の製造方法
WO2024201074A1 (en) * 2023-03-31 2024-10-03 Servomex Group Limited Method and apparatus for use in optical gas absorption measurements

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000006761A1 (en) 1998-07-29 2000-02-10 Hemosense, Inc. Method and device for measuring blood coagulation or lysis by viscosity changes
JP2004045415A (ja) 1993-08-31 2004-02-12 Roche Diagnostics Corp 検体判定方法、及び装置向上方法
JP2005528756A (ja) 2002-05-31 2005-09-22 サーモ フィニガン エルエルシー 精度の向上した質量分析装置
JP2011501135A (ja) 2007-10-15 2011-01-06 バイエル・ヘルスケア・エルエルシー 試験センサの温度を決定する方法及びアセンブリ

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4301412A (en) * 1979-10-29 1981-11-17 United States Surgical Corporation Liquid conductivity measuring system and sample cards therefor
JPH03296292A (ja) * 1990-04-13 1991-12-26 Taiyo Yuden Co Ltd 混成集積回路部品
US6423940B1 (en) * 2001-03-02 2002-07-23 Agilent Technologies, Inc. Temperature stabilization scheme for a circuit board
EP1443325A1 (en) 2003-02-01 2004-08-04 Roche Diagnostics GmbH System and method for determining a coagulation parameter
KR100577406B1 (ko) * 2003-09-17 2006-05-10 박재상 Ｐｃｂ 방식을 이용한 히터 제조방법 및 히터
RU2333622C1 (ru) 2004-11-29 2008-09-10 Хитроникс Корп. Способы и система теплового подсоединения и отсоединения компонентов для поверхностного монтажа
CN101080962A (zh) * 2004-11-29 2007-11-28 希脱鲁尼克斯公司 用于表面安装元件的热附连与分离的方法与系统
DE102013211693B3 (de) * 2013-06-20 2014-07-24 I-For-T Gmbh Sensor mit einem mikroelektromechanischem Chip (MEMS-Chip)

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004045415A (ja) 1993-08-31 2004-02-12 Roche Diagnostics Corp 検体判定方法、及び装置向上方法
WO2000006761A1 (en) 1998-07-29 2000-02-10 Hemosense, Inc. Method and device for measuring blood coagulation or lysis by viscosity changes
JP2005528756A (ja) 2002-05-31 2005-09-22 サーモ フィニガン エルエルシー 精度の向上した質量分析装置
JP2011501135A (ja) 2007-10-15 2011-01-06 バイエル・ヘルスケア・エルエルシー 試験センサの温度を決定する方法及びアセンブリ

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Lei Xu，"A Low Power Catalytic Combustion Gas Sensor Based on a Suspended Membrane Microhotplate"，Proceedings of the 2011 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems，2011年，p.92-95

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190275527A1 (en) * 2016-12-09 2019-09-12 Evonetix Ltd Temperature control device
US11577251B2 (en) * 2016-12-09 2023-02-14 Evonetix Ltd Temperature control device

Also Published As

Publication number Publication date
US11911768B2 (en) 2024-02-27
CN109804718B (zh) 2021-06-18
KR102209470B1 (ko) 2021-01-29
US20190232292A1 (en) 2019-08-01
KR20190052082A (ko) 2019-05-15
CN109804718A (zh) 2019-05-24
JP2019533900A (ja) 2019-11-21
EP3527051A1 (en) 2019-08-21
WO2018069429A1 (en) 2018-04-19
EP3527051B1 (en) 2020-11-18

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