JP2019533900A5 - - Google Patents

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Publication number
JP2019533900A5
JP2019533900A5 JP2019516646A JP2019516646A JP2019533900A5 JP 2019533900 A5 JP2019533900 A5 JP 2019533900A5 JP 2019516646 A JP2019516646 A JP 2019516646A JP 2019516646 A JP2019516646 A JP 2019516646A JP 2019533900 A5 JP2019533900 A5 JP 2019533900A5
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JP
Japan
Prior art keywords
test element
substrate
test
support
heater
Prior art date
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Application number
JP2019516646A
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English (en)
Japanese (ja)
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JP2019533900A (ja
JP7104029B2 (ja
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Priority claimed from PCT/EP2017/076028 external-priority patent/WO2018069429A1/en
Publication of JP2019533900A publication Critical patent/JP2019533900A/ja
Publication of JP2019533900A5 publication Critical patent/JP2019533900A5/ja
Application granted granted Critical
Publication of JP7104029B2 publication Critical patent/JP7104029B2/ja
Active legal-status Critical Current
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JP2019516646A 2016-10-14 2017-10-12 試験要素支持体 Active JP7104029B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP16193896 2016-10-14
EP16193896.4 2016-10-14
PCT/EP2017/076028 WO2018069429A1 (en) 2016-10-14 2017-10-12 Test element support

Publications (3)

Publication Number Publication Date
JP2019533900A JP2019533900A (ja) 2019-11-21
JP2019533900A5 true JP2019533900A5 (enExample) 2020-11-12
JP7104029B2 JP7104029B2 (ja) 2022-07-20

Family

ID=57286206

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019516646A Active JP7104029B2 (ja) 2016-10-14 2017-10-12 試験要素支持体

Country Status (6)

Country Link
US (1) US11911768B2 (enExample)
EP (1) EP3527051B1 (enExample)
JP (1) JP7104029B2 (enExample)
KR (1) KR102209470B1 (enExample)
CN (1) CN109804718B (enExample)
WO (1) WO2018069429A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6819163B2 (ja) * 2016-09-12 2021-01-27 株式会社デンソーウェーブ 絶縁型信号伝達装置、電子機器
GB2557592A (en) * 2016-12-09 2018-06-27 Evonetix Ltd Temperature control device
JP7604815B2 (ja) * 2020-09-10 2024-12-24 富士電機株式会社 半導体装置および半導体装置の製造方法
WO2024201074A1 (en) * 2023-03-31 2024-10-03 Servomex Group Limited Method and apparatus for use in optical gas absorption measurements

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4301412A (en) * 1979-10-29 1981-11-17 United States Surgical Corporation Liquid conductivity measuring system and sample cards therefor
JPH03296292A (ja) * 1990-04-13 1991-12-26 Taiyo Yuden Co Ltd 混成集積回路部品
US5522255A (en) * 1993-08-31 1996-06-04 Boehringer Mannheim Corporation Fluid dose, flow and coagulation sensor for medical instrument
WO2000006761A1 (en) * 1998-07-29 2000-02-10 Hemosense, Inc. Method and device for measuring blood coagulation or lysis by viscosity changes
US6423940B1 (en) * 2001-03-02 2002-07-23 Agilent Technologies, Inc. Temperature stabilization scheme for a circuit board
EP1509943A2 (en) * 2002-05-31 2005-03-02 Thermo Finnigan LLC Mass spectrometer with improved mass accuracy
EP1443325A1 (en) 2003-02-01 2004-08-04 Roche Diagnostics GmbH System and method for determining a coagulation parameter
KR100577406B1 (ko) * 2003-09-17 2006-05-10 박재상 Ｐｃｂ 방식을 이용한 히터 제조방법 및 히터
RU2333622C1 (ru) 2004-11-29 2008-09-10 Хитроникс Корп. Способы и система теплового подсоединения и отсоединения компонентов для поверхностного монтажа
CN101080962A (zh) * 2004-11-29 2007-11-28 希脱鲁尼克斯公司 用于表面安装元件的热附连与分离的方法与系统
EP2203725A4 (en) 2007-10-15 2011-04-20 Bayer Healthcare Llc METHOD AND ASSEMBLY FOR DETERMINING THE TEMPERATURE OF A TEST SENSOR
DE102013211693B3 (de) * 2013-06-20 2014-07-24 I-For-T Gmbh Sensor mit einem mikroelektromechanischem Chip (MEMS-Chip)

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