KR102204741B1 - 내부의 높은 인덱스 기둥을 가지는 ｌｅｄ 돔 - Google Patents

내부의 높은 인덱스 기둥을 가지는 ｌｅｄ 돔 Download PDF

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KR102204741B1
KR102204741B1 KR1020167005308A KR20167005308A KR102204741B1 KR 102204741 B1 KR102204741 B1 KR 102204741B1 KR 1020167005308 A KR1020167005308 A KR 1020167005308A KR 20167005308 A KR20167005308 A KR 20167005308A KR 102204741 B1 KR102204741 B1 KR 102204741B1
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South Korea
Prior art keywords
pillar
substrate
light emitting
emitting device
refractive index
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KR1020167005308A
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Korean (ko)
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KR20160039269A (ko
Inventor
토니 로페즈
케네스 밤폴라
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루미리즈 홀딩 비.브이.
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    • H01L33/58—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H01L33/0093—
    • H01L33/22—
    • H01L33/54—
    • H01L33/56—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H01L2924/12041—
    • H01L2933/0058—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means

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  • Led Device Packages (AREA)
KR1020167005308A 2013-07-26 2014-07-02 내부의 높은 인덱스 기둥을 가지는 ｌｅｄ 돔 Active KR102204741B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361858658P 2013-07-26 2013-07-26
US61/858,658 2013-07-26
PCT/IB2014/062793 WO2015011586A1 (en) 2013-07-26 2014-07-02 Led dome with inner high index pillar

Publications (2)

Publication Number Publication Date
KR20160039269A KR20160039269A (ko) 2016-04-08
KR102204741B1 true KR102204741B1 (ko) 2021-01-20

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167005308A Active KR102204741B1 (ko) 2013-07-26 2014-07-02 내부의 높은 인덱스 기둥을 가지는 ｌｅｄ 돔

Country Status (6)

Country Link
US (1) US9653665B2 (enExample)
EP (1) EP3033775B1 (enExample)
JP (1) JP6574768B2 (enExample)
KR (1) KR102204741B1 (enExample)
CN (1) CN105393372B (enExample)
WO (1) WO2015011586A1 (enExample)

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* Cited by examiner, † Cited by third party
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KR102204741B1 (ko) * 2013-07-26 2021-01-20 루미리즈 홀딩 비.브이. 내부의 높은 인덱스 기둥을 가지는 ｌｅｄ 돔
TWI644454B (zh) * 2015-08-19 2018-12-11 佰鴻工業股份有限公司 Light-emitting diode structure
DE102016114474A1 (de) * 2016-08-04 2018-02-08 Osram Opto Semiconductors Gmbh Bauteil mit einem lichtemittierenden Bauelement
JP6555247B2 (ja) 2016-12-28 2019-08-07 日亜化学工業株式会社 発光装置及びその製造方法
CN111211209B (zh) * 2020-01-16 2021-09-28 江西新正耀光学研究院有限公司 紫外光发光二极管及其制作方法
US20220190213A1 (en) * 2020-12-15 2022-06-16 Lumileds Llc Material stack for leds with a dome

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110062469A1 (en) * 2009-09-17 2011-03-17 Koninklijke Philips Electronics N.V. Molded lens incorporating a window element

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US20020047131A1 (en) * 1999-12-22 2002-04-25 Ludowise Michael J. Selective placement of quantum wells in flipchip light emitting diodes for improved light extraction
DE10039433B4 (de) * 2000-08-11 2017-10-26 Osram Opto Semiconductors Gmbh Halbleiterchip für die Optoelektronik
JP2002141556A (ja) * 2000-09-12 2002-05-17 Lumileds Lighting Us Llc 改良された光抽出効果を有する発光ダイオード
US7053419B1 (en) * 2000-09-12 2006-05-30 Lumileds Lighting U.S., Llc Light emitting diodes with improved light extraction efficiency
US6455878B1 (en) 2001-05-15 2002-09-24 Lumileds Lighting U.S., Llc Semiconductor LED flip-chip having low refractive index underfill
JP2003017756A (ja) * 2001-06-28 2003-01-17 Toyoda Gosei Co Ltd 発光ダイオード
EP1536487A4 (en) * 2002-05-28 2008-02-06 Matsushita Electric Works Ltd ELECTROLUMINESCENT ELEMENT, LIGHT EMITTING DEVICE AND SURFACE EMISSION LIGHTING DEVICE USING THE SAME
US6784460B2 (en) * 2002-10-10 2004-08-31 Agilent Technologies, Inc. Chip shaping for flip-chip light emitting diode
US7009213B2 (en) * 2003-07-31 2006-03-07 Lumileds Lighting U.S., Llc Light emitting devices with improved light extraction efficiency
US7582905B2 (en) * 2004-09-08 2009-09-01 Rohm Co., Ltd. Semiconductor light emitting device
US7304425B2 (en) * 2004-10-29 2007-12-04 3M Innovative Properties Company High brightness LED package with compound optical element(s)
US7419839B2 (en) * 2004-11-12 2008-09-02 Philips Lumileds Lighting Company, Llc Bonding an optical element to a light emitting device
US7452737B2 (en) 2004-11-15 2008-11-18 Philips Lumileds Lighting Company, Llc Molded lens over LED die
JP2009515344A (ja) * 2005-11-04 2009-04-09 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア 高い光抽出効率の発光ダイオード（ｌｅｄ）
JP2007242820A (ja) * 2006-03-08 2007-09-20 Asahi Kasei Corp 発光デバイス及び発光デバイスモジュール
US20070257271A1 (en) * 2006-05-02 2007-11-08 3M Innovative Properties Company Led package with encapsulated converging optical element
JP2008053263A (ja) * 2006-08-22 2008-03-06 Toyoda Gosei Co Ltd 発光素子及びこれを備えた光源装置
US20080121911A1 (en) * 2006-11-28 2008-05-29 Cree, Inc. Optical preforms for solid state light emitting dice, and methods and systems for fabricating and assembling same
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DE102008025756B4 (de) * 2008-05-29 2023-02-23 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiteranordnung
JP2010147446A (ja) * 2008-12-22 2010-07-01 Panasonic Electric Works Co Ltd 発光装置
JP5689225B2 (ja) * 2009-03-31 2015-03-25 日亜化学工業株式会社 発光装置
WO2011007816A1 (ja) * 2009-07-15 2011-01-20 三菱化学株式会社 半導体発光素子、半導体発光装置、半導体発光素子の製造方法、および半導体発光装置の製造方法
EP2464685A1 (en) * 2009-08-12 2012-06-20 Koninklijke Philips Electronics N.V. Optical composition
JP2011060966A (ja) * 2009-09-09 2011-03-24 Panasonic Electric Works Co Ltd 発光装置
JP2011233870A (ja) * 2010-04-09 2011-11-17 Mitsubishi Chemicals Corp 半導体発光装置
JP5671982B2 (ja) * 2010-11-30 2015-02-18 三菱化学株式会社 半導体発光素子および半導体発光素子の製造方法
KR101212654B1 (ko) * 2011-05-20 2012-12-14 (주)라이타이저코리아 발광 다이오드 패키지 및 그의 제조 방법
KR102204741B1 (ko) * 2013-07-26 2021-01-20 루미리즈 홀딩 비.브이. 내부의 높은 인덱스 기둥을 가지는 ｌｅｄ 돔

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110062469A1 (en) * 2009-09-17 2011-03-17 Koninklijke Philips Electronics N.V. Molded lens incorporating a window element

Also Published As

Publication number Publication date
JP6574768B2 (ja) 2019-09-11
KR20160039269A (ko) 2016-04-08
CN105393372A (zh) 2016-03-09
JP2016525288A (ja) 2016-08-22
EP3033775B1 (en) 2019-09-11
US9653665B2 (en) 2017-05-16
US20160163936A1 (en) 2016-06-09
EP3033775A1 (en) 2016-06-22
CN105393372B (zh) 2018-06-15
WO2015011586A1 (en) 2015-01-29

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