KR102191947B1 - 연성이고 컨디셔닝가능한 화학 기계적 연마 패드 적층물 - Google Patents

연성이고 컨디셔닝가능한 화학 기계적 연마 패드 적층물 Download PDF

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Publication number
KR102191947B1
KR102191947B1 KR1020140064220A KR20140064220A KR102191947B1 KR 102191947 B1 KR102191947 B1 KR 102191947B1 KR 1020140064220 A KR1020140064220 A KR 1020140064220A KR 20140064220 A KR20140064220 A KR 20140064220A KR 102191947 B1 KR102191947 B1 KR 102191947B1
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Prior art keywords
curing agent
polishing
layer
molecular weight
weight
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Korean (ko)
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KR20140141490A (ko
Inventor
제임스 머네인
배이니언 콰이언
존 지 나울랜드
미쉘 케이 젠슨
제프리 제임스 헨드런
마티 더블유 디그룻
데이빗 비 제임스
펑지 예
Original Assignee
롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
다우 글로벌 테크놀로지스 엘엘씨
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Publication of KR20140141490A publication Critical patent/KR20140141490A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
    • C08G18/3271—Hydroxyamines
    • C08G18/3278—Hydroxyamines containing at least three hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C08G18/6633—Compounds of group C08G18/42
    • C08G18/6637—Compounds of group C08G18/42 with compounds of group C08G18/32 or polyamines of C08G18/38
    • C08G18/664—Compounds of group C08G18/42 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3203
    • C08G18/6644—Compounds of group C08G18/42 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3203 having at least three hydroxy groups

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Laminated Bodies (AREA)
KR1020140064220A 2013-05-31 2014-05-28 연성이고 컨디셔닝가능한 화학 기계적 연마 패드 적층물 Active KR102191947B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/906,715 US9233451B2 (en) 2013-05-31 2013-05-31 Soft and conditionable chemical mechanical polishing pad stack
US13/906,715 2013-05-31

Publications (2)

Publication Number Publication Date
KR20140141490A KR20140141490A (ko) 2014-12-10
KR102191947B1 true KR102191947B1 (ko) 2020-12-17

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KR1020140064220A Active KR102191947B1 (ko) 2013-05-31 2014-05-28 연성이고 컨디셔닝가능한 화학 기계적 연마 패드 적층물

Country Status (7)

Country Link
US (1) US9233451B2 (https=)
JP (1) JP6334266B2 (https=)
KR (1) KR102191947B1 (https=)
CN (1) CN104209854B (https=)
DE (1) DE102014007024A1 (https=)
FR (1) FR3006218B1 (https=)
TW (1) TWI574793B (https=)

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US9238296B2 (en) * 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer
US9216489B2 (en) * 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9259820B2 (en) * 2014-03-28 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with polishing layer and window
US10092998B2 (en) * 2015-06-26 2018-10-09 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making composite polishing layer for chemical mechanical polishing pad
US9484212B1 (en) * 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
US20180345449A1 (en) * 2017-06-06 2018-12-06 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pads for improved removal rate and planarization
US10464187B2 (en) * 2017-12-01 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High removal rate chemical mechanical polishing pads from amine initiated polyol containing curatives
EP3967452A1 (en) * 2020-09-07 2022-03-16 SKC Solmics Co., Ltd. Polishing pad and method of fabricating semiconductor device using the same
CN116847948A (zh) 2020-12-22 2023-10-03 Cmc材料有限责任公司 具有带有聚合物型外壳的成孔剂的化学-机械抛光副垫
CN112757153B (zh) * 2021-03-09 2022-07-12 万华化学集团电子材料有限公司 一种多结构体化学机械抛光垫、制造方法及其应用
KR102594068B1 (ko) * 2021-10-12 2023-10-24 에스케이엔펄스 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법
CN116985031B (zh) * 2023-03-27 2025-11-04 万华化学集团电子材料有限公司 一种化学机械抛光垫、制备方法及其应用

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Also Published As

Publication number Publication date
KR20140141490A (ko) 2014-12-10
TWI574793B (zh) 2017-03-21
CN104209854B (zh) 2017-01-18
JP6334266B2 (ja) 2018-05-30
JP2014233833A (ja) 2014-12-15
CN104209854A (zh) 2014-12-17
FR3006218A1 (fr) 2014-12-05
FR3006218B1 (fr) 2016-02-19
US9233451B2 (en) 2016-01-12
TW201518038A (zh) 2015-05-16
US20140357169A1 (en) 2014-12-04
DE102014007024A1 (de) 2014-12-04

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