KR102176869B1 - 기판 가공 장치 및 기판 가공 방법 - Google Patents

기판 가공 장치 및 기판 가공 방법 Download PDF

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Publication number
KR102176869B1
KR102176869B1 KR1020180088461A KR20180088461A KR102176869B1 KR 102176869 B1 KR102176869 B1 KR 102176869B1 KR 1020180088461 A KR1020180088461 A KR 1020180088461A KR 20180088461 A KR20180088461 A KR 20180088461A KR 102176869 B1 KR102176869 B1 KR 102176869B1
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KR
South Korea
Prior art keywords
substrate
panel
laser beam
cutout
gas
Prior art date
Application number
KR1020180088461A
Other languages
English (en)
Korean (ko)
Other versions
KR20200013354A (ko
Inventor
김진락
Original Assignee
주식회사 탑 엔지니어링
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 탑 엔지니어링 filed Critical 주식회사 탑 엔지니어링
Priority to KR1020180088461A priority Critical patent/KR102176869B1/ko
Priority to CN201811375495.0A priority patent/CN110776250A/zh
Publication of KR20200013354A publication Critical patent/KR20200013354A/ko
Application granted granted Critical
Publication of KR102176869B1 publication Critical patent/KR102176869B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/076—Laminated glass comprising interlayers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
KR1020180088461A 2018-07-30 2018-07-30 기판 가공 장치 및 기판 가공 방법 KR102176869B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020180088461A KR102176869B1 (ko) 2018-07-30 2018-07-30 기판 가공 장치 및 기판 가공 방법
CN201811375495.0A CN110776250A (zh) 2018-07-30 2018-11-19 基板加工装置及基板加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020180088461A KR102176869B1 (ko) 2018-07-30 2018-07-30 기판 가공 장치 및 기판 가공 방법

Publications (2)

Publication Number Publication Date
KR20200013354A KR20200013354A (ko) 2020-02-07
KR102176869B1 true KR102176869B1 (ko) 2020-11-11

Family

ID=69383105

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180088461A KR102176869B1 (ko) 2018-07-30 2018-07-30 기판 가공 장치 및 기판 가공 방법

Country Status (2)

Country Link
KR (1) KR102176869B1 (zh)
CN (1) CN110776250A (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007160766A (ja) 2005-12-15 2007-06-28 Seiko Epson Corp 層状基板の分割方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100623970B1 (ko) * 1999-11-22 2006-09-13 삼성전자주식회사 레이저 커팅 설비 및 이를 이용한 커팅 방법
KR20050019815A (ko) * 2002-07-02 2005-03-03 미쓰보시 다이야몬도 고교 가부시키가이샤 접합기판의 기판절단 시스템 및 기판절단방법
CN1929978A (zh) * 2004-04-27 2007-03-14 三星钻石工业股份有限公司 脆性基板的垂直裂痕形成方法及垂直裂痕形成装置
CN101001729B (zh) * 2004-07-30 2011-03-23 三星钻石工业股份有限公司 基板的垂直裂纹形成方法及垂直裂纹形成装置
JP4251203B2 (ja) * 2006-08-29 2009-04-08 セイコーエプソン株式会社 貼合せマザー基板のスクライブ方法および貼合せマザー基板の分割方法
JP2010023071A (ja) * 2008-07-18 2010-02-04 Mitsuboshi Diamond Industrial Co Ltd 貼り合わせ基板の端子加工方法
KR101152864B1 (ko) * 2010-08-04 2012-06-12 (주)큐엠씨 에어젯을 이용한 대상물 브레이킹 장치
JP5965239B2 (ja) * 2012-07-31 2016-08-03 三星ダイヤモンド工業株式会社 貼り合わせ基板の加工方法並びに加工装置
JP2014224010A (ja) * 2013-05-16 2014-12-04 旭硝子株式会社 レーザ光照射によりガラス基板に貫通孔を形成する方法
KR102388723B1 (ko) * 2015-08-07 2022-04-21 삼성디스플레이 주식회사 레이저 어닐링 장치 및 이를 이용한 디스플레이 장치 제조방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007160766A (ja) 2005-12-15 2007-06-28 Seiko Epson Corp 層状基板の分割方法

Also Published As

Publication number Publication date
CN110776250A (zh) 2020-02-11
KR20200013354A (ko) 2020-02-07

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