KR102171734B1 - 멀티플 존 히터 - Google Patents

멀티플 존 히터 Download PDF

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Publication number
KR102171734B1
KR102171734B1 KR1020157029798A KR20157029798A KR102171734B1 KR 102171734 B1 KR102171734 B1 KR 102171734B1 KR 1020157029798 A KR1020157029798 A KR 1020157029798A KR 20157029798 A KR20157029798 A KR 20157029798A KR 102171734 B1 KR102171734 B1 KR 102171734B1
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KR
South Korea
Prior art keywords
plate
heater
layer
shaft
semiconductor manufacturing
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KR1020157029798A
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English (en)
Korean (ko)
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KR20150132515A (ko
Inventor
브렌트 디. 엘리오트
프랭크 발마
알프레드 그랜트 엘리오트
알렉산더 베이트저
데니스 지. 렉스
리차드 이. 슈스터
Original Assignee
컴포넌트 알이-엔지니어링 컴퍼니, 인코포레이티드
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Publication date
Priority claimed from US13/831,670 external-priority patent/US9984866B2/en
Application filed by 컴포넌트 알이-엔지니어링 컴퍼니, 인코포레이티드 filed Critical 컴포넌트 알이-엔지니어링 컴퍼니, 인코포레이티드
Publication of KR20150132515A publication Critical patent/KR20150132515A/ko
Application granted granted Critical
Publication of KR102171734B1 publication Critical patent/KR102171734B1/ko
Assigned to 와틀로 일렉트릭 매뉴팩츄어링 컴파니 reassignment 와틀로 일렉트릭 매뉴팩츄어링 컴파니 권리의 전부이전등록 Assignors: 컴포넌트 알이-엔지니어링 컴퍼니, 인코포레이티드
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H01L21/68792—
    • H01L21/02002—
    • H01L21/324—
    • H01L21/67098—
    • H01L21/67103—
    • H01L21/67248—
    • H01L22/12—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/283—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/037—Heaters with zones of different power density

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Resistance Heating (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Surface Heating Bodies (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
KR1020157029798A 2013-03-15 2014-03-14 멀티플 존 히터 Active KR102171734B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/831,670 US9984866B2 (en) 2012-06-12 2013-03-15 Multiple zone heater
US13/831,670 2013-03-15
PCT/US2014/028937 WO2014144502A1 (en) 2012-06-12 2014-03-14 Multiple zone heater

Publications (2)

Publication Number Publication Date
KR20150132515A KR20150132515A (ko) 2015-11-25
KR102171734B1 true KR102171734B1 (ko) 2020-10-29

Family

ID=53040011

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157029798A Active KR102171734B1 (ko) 2013-03-15 2014-03-14 멀티플 존 히터

Country Status (5)

Country Link
EP (1) EP2973659A4 (https=)
JP (1) JP6382295B2 (https=)
KR (1) KR102171734B1 (https=)
CN (1) CN105518825B (https=)
TW (2) TWM644795U (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250095085A (ko) 2023-12-19 2025-06-26 주식회사 에스지에스코리아 멀티 존 히터의 제어 장치 및 제어 방법

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102461150B1 (ko) 2015-09-18 2022-11-01 삼성전자주식회사 3차원 반도체 메모리 장치
CN111373487B (zh) 2017-10-24 2024-09-24 沃特洛电气制造公司 设有陶瓷绝缘体和铝套的电连接器及其制造方法
US11961747B2 (en) * 2018-03-28 2024-04-16 Kyocera Corporation Heater and heater system
KR102608397B1 (ko) * 2018-10-16 2023-12-01 주식회사 미코세라믹스 미들 영역 독립 제어 세라믹 히터
KR102558722B1 (ko) * 2018-12-20 2023-07-24 엔지케이 인슐레이터 엘티디 세라믹 히터
JP7520111B2 (ja) * 2019-10-12 2024-07-22 アプライド マテリアルズ インコーポレイテッド 背面パージが設けられ斜面パージが組み込まれたウエハヒータ
JP7240341B2 (ja) 2020-02-03 2023-03-15 日本碍子株式会社 セラミックヒータ及び熱電対ガイド
JP7202322B2 (ja) * 2020-02-03 2023-01-11 日本碍子株式会社 セラミックヒータ
JP7360992B2 (ja) * 2020-06-02 2023-10-13 京セラ株式会社 端子付構造体
KR102242589B1 (ko) * 2020-09-09 2021-04-21 주식회사 미코세라믹스 세라믹 히터
JP7468710B2 (ja) * 2021-01-26 2024-04-16 住友電気工業株式会社 ヒータ
JP2024172480A (ja) * 2023-05-31 2024-12-12 株式会社Kokusai Electric 基板処理方法、半導体装置の製造方法、基板処理装置及びプログラム
WO2026038385A1 (ja) * 2024-08-16 2026-02-19 日本碍子株式会社 セラミックヒータおよびセラミックヒータの製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004247210A (ja) 2003-02-14 2004-09-02 Nhk Spring Co Ltd ヒータユニット及びヒータユニットの製造方法
JP2004356624A (ja) 2003-05-07 2004-12-16 Tokyo Electron Ltd 載置台構造及び熱処理装置
JP2012069947A (ja) 2010-09-24 2012-04-05 Ngk Insulators Ltd サセプター及びその製法
JP2012080103A (ja) 2010-10-01 2012-04-19 Ngk Insulators Ltd サセプター及びその製法

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US4854495A (en) * 1986-06-20 1989-08-08 Hitachi, Ltd. Sealing structure, method of soldering and process for preparing sealing structure
US6583638B2 (en) * 1999-01-26 2003-06-24 Trio-Tech International Temperature-controlled semiconductor wafer chuck system
KR20010111058A (ko) * 2000-06-09 2001-12-15 조셉 제이. 스위니 전체 영역 온도 제어 정전기 척 및 그 제조방법
JP3897563B2 (ja) * 2001-10-24 2007-03-28 日本碍子株式会社 加熱装置
JP2005166354A (ja) * 2003-12-01 2005-06-23 Ngk Insulators Ltd セラミックヒーター
WO2006046308A1 (ja) * 2004-10-29 2006-05-04 Cxe Japan Co., Ltd. 半導体基板の支持体
JP4787568B2 (ja) * 2004-11-16 2011-10-05 日本碍子株式会社 接合剤、窒化アルミニウム接合体及びその製造方法
JP4640842B2 (ja) * 2006-10-11 2011-03-02 日本碍子株式会社 加熱装置
JP4450106B1 (ja) * 2008-03-11 2010-04-14 東京エレクトロン株式会社 載置台構造及び処理装置
JP5791412B2 (ja) * 2010-07-26 2015-10-07 日本碍子株式会社 セラミックヒーター
WO2012039453A1 (ja) * 2010-09-24 2012-03-29 日本碍子株式会社 半導体製造装置部材
US20120211484A1 (en) * 2011-02-23 2012-08-23 Applied Materials, Inc. Methods and apparatus for a multi-zone pedestal heater
WO2012118606A2 (en) * 2011-03-01 2012-09-07 Applied Materials, Inc. Thin heated substrate support

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Publication number Priority date Publication date Assignee Title
JP2004247210A (ja) 2003-02-14 2004-09-02 Nhk Spring Co Ltd ヒータユニット及びヒータユニットの製造方法
JP2004356624A (ja) 2003-05-07 2004-12-16 Tokyo Electron Ltd 載置台構造及び熱処理装置
JP2012069947A (ja) 2010-09-24 2012-04-05 Ngk Insulators Ltd サセプター及びその製法
JP2012080103A (ja) 2010-10-01 2012-04-19 Ngk Insulators Ltd サセプター及びその製法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250095085A (ko) 2023-12-19 2025-06-26 주식회사 에스지에스코리아 멀티 존 히터의 제어 장치 및 제어 방법

Also Published As

Publication number Publication date
EP2973659A1 (en) 2016-01-20
EP2973659A4 (en) 2016-11-09
CN105518825A (zh) 2016-04-20
JP2016522881A (ja) 2016-08-04
TW201506989A (zh) 2015-02-16
KR20150132515A (ko) 2015-11-25
JP6382295B2 (ja) 2018-08-29
TWM644795U (zh) 2023-08-11
TWI632589B (zh) 2018-08-11
CN105518825B (zh) 2018-02-06

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