KR102135649B1 - 전자파 실드재 - Google Patents

전자파 실드재 Download PDF

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Publication number
KR102135649B1
KR102135649B1 KR1020187031570A KR20187031570A KR102135649B1 KR 102135649 B1 KR102135649 B1 KR 102135649B1 KR 1020187031570 A KR1020187031570 A KR 1020187031570A KR 20187031570 A KR20187031570 A KR 20187031570A KR 102135649 B1 KR102135649 B1 KR 102135649B1
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KR
South Korea
Prior art keywords
resin layer
metal foil
shielding material
electromagnetic shielding
thickness
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KR1020187031570A
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English (en)
Korean (ko)
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KR20180132772A (ko
Inventor
코이치로 다나카
Original Assignee
제이엑스금속주식회사
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/095—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/18—Layered products comprising a layer of metal comprising iron or steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/42—Alternating layers, e.g. ABAB(C), AABBAABB(C)
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2605/00—Vehicles
    • B32B2605/08—Cars

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Fluid Mechanics (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
KR1020187031570A 2016-03-31 2016-12-01 전자파 실드재 Active KR102135649B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016073350A JP6341948B2 (ja) 2016-03-31 2016-03-31 電磁波シールド材
JPJP-P-2016-073350 2016-03-31
PCT/JP2016/085826 WO2017168840A1 (ja) 2016-03-31 2016-12-01 電磁波シールド材

Publications (2)

Publication Number Publication Date
KR20180132772A KR20180132772A (ko) 2018-12-12
KR102135649B1 true KR102135649B1 (ko) 2020-07-20

Family

ID=59963983

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187031570A Active KR102135649B1 (ko) 2016-03-31 2016-12-01 전자파 실드재

Country Status (7)

Country Link
US (1) US11019759B2 (https=)
EP (1) EP3439446B1 (https=)
JP (1) JP6341948B2 (https=)
KR (1) KR102135649B1 (https=)
CN (1) CN108886883B (https=)
TW (1) TWI640423B (https=)
WO (1) WO2017168840A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109769377A (zh) * 2019-02-16 2019-05-17 益阳市菲美特新材料有限公司 一种导热屏蔽泡棉
JP2021088099A (ja) * 2019-12-03 2021-06-10 Ｊｘ金属株式会社 金属樹脂複合材料の成形方法、並びに金属樹脂複合部品及びその製造方法
EP4212646A4 (en) * 2020-09-07 2024-05-22 Denka Company Limited MOLDED BODY PLATED WITH THERMOPLASTIC RESIN COMPOSITION
JP7008121B1 (ja) * 2020-12-09 2022-01-25 Ｊｘ金属株式会社 電磁波シールド材
JP2022153032A (ja) * 2021-03-29 2022-10-12 Ｊｘ金属株式会社 積層体及びその製造方法
JP7662578B2 (ja) * 2022-08-25 2025-04-15 リンテック株式会社 電磁波吸収部材
KR20250022789A (ko) * 2022-11-08 2025-02-17 제이엑스금속주식회사 전자파 차폐 재료, 피복재 또는 외장재 및 전기·전자 기기

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003060387A (ja) 2001-08-17 2003-02-28 Furukawa Techno Research Kk 電磁波シールド材
JP2004172909A (ja) 2002-11-19 2004-06-17 Tdk Corp 携帯通信機器
US20150305144A1 (en) 2012-06-07 2015-10-22 Tatsuta Electric Wire & Cable Co., Ltd. Shield film and shield printed wiring board

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Publication number Priority date Publication date Assignee Title
JPS462680Y1 (https=) 1968-11-05 1971-01-29
JPS5818253B2 (ja) 1976-05-26 1983-04-12 株式会社クボタ 歩行型田植機
JPS5818253A (ja) * 1981-07-25 1983-02-02 住友金属工業株式会社 積層板
JPH07290449A (ja) 1994-04-27 1995-11-07 Matsushita Electric Works Ltd シート状の電磁波シールド成形材料及びその製造方法
JP4235396B2 (ja) 2002-03-29 2009-03-11 真和工業株式会社 インバータカバー
JP4602680B2 (ja) 2004-03-22 2010-12-22 株式会社オーツカ 電磁波シールド構造
KR100962924B1 (ko) 2006-07-14 2010-06-10 삼성코닝정밀소재 주식회사 전자파 차폐용 광학 부재, 이를 포함하는 광학 필터 및디스플레이 장치
JP5497949B1 (ja) * 2013-07-03 2014-05-21 Ｊｘ日鉱日石金属株式会社 電磁波シールド用金属箔、電磁波シールド材及びシールドケーブル
KR101856405B1 (ko) * 2014-05-30 2018-05-09 제이엑스금속주식회사 전자파 실드용 금속박, 전자파 실드재 및 실드 케이블
JP6278922B2 (ja) * 2015-03-30 2018-02-14 Ｊｘ金属株式会社 電磁波シールド材
JP6129232B2 (ja) * 2015-03-31 2017-05-17 Ｊｘ金属株式会社 電磁波シールド材
JP6883449B2 (ja) * 2017-03-13 2021-06-09 Ｊｘ金属株式会社 電磁波シールド材

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003060387A (ja) 2001-08-17 2003-02-28 Furukawa Techno Research Kk 電磁波シールド材
JP2004172909A (ja) 2002-11-19 2004-06-17 Tdk Corp 携帯通信機器
US20150305144A1 (en) 2012-06-07 2015-10-22 Tatsuta Electric Wire & Cable Co., Ltd. Shield film and shield printed wiring board

Also Published As

Publication number Publication date
EP3439446A4 (en) 2019-02-20
EP3439446B1 (en) 2020-04-29
CN108886883B (zh) 2020-04-03
TWI640423B (zh) 2018-11-11
TW201736120A (zh) 2017-10-16
KR20180132772A (ko) 2018-12-12
WO2017168840A1 (ja) 2017-10-05
US20200315073A1 (en) 2020-10-01
JP2017183671A (ja) 2017-10-05
JP6341948B2 (ja) 2018-06-13
US11019759B2 (en) 2021-05-25
CN108886883A (zh) 2018-11-23
EP3439446A1 (en) 2019-02-06

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