KR102110267B1 - 히터를 위한 열적 동적 응답 감지 시스템 - Google Patents

히터를 위한 열적 동적 응답 감지 시스템 Download PDF

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KR102110267B1
KR102110267B1 KR1020197016773A KR20197016773A KR102110267B1 KR 102110267 B1 KR102110267 B1 KR 102110267B1 KR 1020197016773 A KR1020197016773 A KR 1020197016773A KR 20197016773 A KR20197016773 A KR 20197016773A KR 102110267 B1 KR102110267 B1 KR 102110267B1
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heater
heater assembly
heating
layer
temperature
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Korean (ko)
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KR20190069624A (ko
Inventor
루이스 피. 스테인하우저
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와틀로 일렉트릭 매뉴팩츄어링 컴파니
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Priority claimed from US14/530,670 external-priority patent/US10163668B2/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/20—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only
    • H04N23/23—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only from thermal infrared radiation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0233—Industrial applications for semiconductors manufacturing
    • H01L21/67103—
    • H01L21/67248—
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/30—Transforming light or analogous information into electric information
    • H04N5/33—Transforming infrared radiation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/72—Investigating presence of flaws

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  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Resistance Heating (AREA)
  • Drying Of Semiconductors (AREA)
  • Resistance Heating (AREA)
KR1020197016773A 2014-10-31 2015-10-28 히터를 위한 열적 동적 응답 감지 시스템 Active KR102110267B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/530,670 2014-10-31
US14/530,670 US10163668B2 (en) 2011-08-30 2014-10-31 Thermal dynamic response sensing systems for heaters
PCT/US2015/057905 WO2016069808A1 (en) 2014-10-31 2015-10-28 Thermal dynamic response sensing systems for heaters

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020177011493A Division KR101999705B1 (ko) 2014-10-31 2015-10-28 히터를 위한 열적 동적 응답 감지 시스템

Publications (2)

Publication Number Publication Date
KR20190069624A KR20190069624A (ko) 2019-06-19
KR102110267B1 true KR102110267B1 (ko) 2020-05-14

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ID=54548258

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020197016773A Active KR102110267B1 (ko) 2014-10-31 2015-10-28 히터를 위한 열적 동적 응답 감지 시스템
KR1020177011493A Active KR101999705B1 (ko) 2014-10-31 2015-10-28 히터를 위한 열적 동적 응답 감지 시스템

Family Applications After (1)

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KR1020177011493A Active KR101999705B1 (ko) 2014-10-31 2015-10-28 히터를 위한 열적 동적 응답 감지 시스템

Country Status (6)

Country Link
EP (1) EP3213598B1 (https=)
JP (2) JP6431190B2 (https=)
KR (2) KR102110267B1 (https=)
CN (1) CN107078082B (https=)
TW (1) TWI681483B (https=)
WO (1) WO2016069808A1 (https=)

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JP6397588B2 (ja) * 2016-07-19 2018-09-26 日本碍子株式会社 静電チャックヒータ
US10651095B2 (en) * 2016-08-11 2020-05-12 Applied Materials, Inc. Thermal profile monitoring wafer and methods of monitoring temperature
DE112018005962T5 (de) * 2017-11-21 2020-08-06 WATLOW ELECTRIC MANUFACTURING COMPANY (n.d.Ges.d. Staates Missouri) Multi-zonen trägerheizung ohne durchkontaktierungen
CN111837453B (zh) * 2018-03-08 2023-07-11 沃特洛电气制造公司 用于控制加热器的控制系统
JP7006523B2 (ja) * 2018-06-19 2022-01-24 オムロン株式会社 情報処理装置、情報処理方法、およびプログラム
US10872747B2 (en) * 2018-08-08 2020-12-22 Lam Research Corporation Controlling showerhead heating via resistive thermal measurements
US11240881B2 (en) * 2019-04-08 2022-02-01 Watlow Electric Manufacturing Company Method of manufacturing and adjusting a resistive heater
TWI796572B (zh) * 2019-06-07 2023-03-21 美商瓦特洛威電子製造公司 用以校準操作電熱器的控制系統之系統及方法
CN114175208B (zh) * 2019-07-25 2024-05-24 朗姆研究公司 衬底处理系统
US12146795B2 (en) 2019-11-19 2024-11-19 Lam Research Corporation Temperature monitoring
WO2021173668A1 (en) * 2020-02-24 2021-09-02 Watlow Electric Manufacturing Company Dynamic calibration of a control system controlling a heater
US11551951B2 (en) * 2020-05-05 2023-01-10 Applied Materials, Inc. Methods and systems for temperature control for a substrate
JP7731373B2 (ja) * 2020-05-19 2025-08-29 ワトロー エレクトリック マニュファクチュアリング カンパニー 抵抗ヒーターのための受動的及び能動的な較正方法
KR102602807B1 (ko) * 2020-08-14 2023-11-15 세메스 주식회사 히터 제어 장치 및 이를 구비하는 기판 처리 시스템
KR102520584B1 (ko) * 2020-10-14 2023-04-10 세메스 주식회사 공정 계측 장치 및 방법
US12446122B2 (en) 2021-05-10 2025-10-14 Samsung Electronics Co., Ltd. Systems and methods for temperature profile control of microwave oven devices
US12146794B2 (en) 2021-05-17 2024-11-19 Rosemount Aerospace Inc. Infrared inspection system for heaters comprised of positive temperature coefficient resistors
CN116106652B (zh) * 2021-11-09 2025-11-25 苏州外延世电子材料有限公司 Pe-cvd加热板检测装置
US12520391B2 (en) 2022-02-24 2026-01-06 Samsung Electronics Co., Ltd. Systems and methods for mapping heat deposition in a cooking appliance through fast pattern temperature imaging
US12390046B2 (en) 2022-03-29 2025-08-19 Samsung Electronics Company, Ltd. Systems and methods for achieving a user-specified temperature profile in a cooking appliance through heating control algorithms
KR102579663B1 (ko) * 2023-06-27 2023-09-18 시스트로닉스 주식회사 공기 가열을 통해 측정 정확도를 향상시키는 공기성분측정 장치
CN119133323A (zh) * 2024-11-14 2024-12-13 中矿资源(天津)新材料有限公司 电池膜层的退火工艺及退火设备

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KR100194267B1 (ko) * 1990-01-19 1999-06-15 버킷 이.모리스 반도체 웨이퍼 또는 기판 가열장치 및 방법
KR100420871B1 (ko) * 1999-02-22 2004-03-02 스티그 하마테크 악티엔게젤샤프트 기판의 열처리를 위한 장치 및 방법
US20110092072A1 (en) 2009-10-21 2011-04-21 Lam Research Corporation Heating plate with planar heating zones for semiconductor processing

Also Published As

Publication number Publication date
TW201624588A (zh) 2016-07-01
TWI681483B (zh) 2020-01-01
KR101999705B1 (ko) 2019-07-12
EP3213598B1 (en) 2023-07-05
JP2019061960A (ja) 2019-04-18
KR20190069624A (ko) 2019-06-19
WO2016069808A1 (en) 2016-05-06
JP6692875B2 (ja) 2020-05-13
JP6431190B2 (ja) 2018-11-28
JP2018502443A (ja) 2018-01-25
CN107078082B (zh) 2021-04-09
KR20170078645A (ko) 2017-07-07
CN107078082A (zh) 2017-08-18
EP3213598A1 (en) 2017-09-06

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