JP6431190B2 - ヒーター用熱動的応答感知システム - Google Patents

ヒーター用熱動的応答感知システム Download PDF

Info

Publication number
JP6431190B2
JP6431190B2 JP2017522916A JP2017522916A JP6431190B2 JP 6431190 B2 JP6431190 B2 JP 6431190B2 JP 2017522916 A JP2017522916 A JP 2017522916A JP 2017522916 A JP2017522916 A JP 2017522916A JP 6431190 B2 JP6431190 B2 JP 6431190B2
Authority
JP
Japan
Prior art keywords
heater
heating
heater assembly
layer
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017522916A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018502443A5 (https=
JP2018502443A (ja
Inventor
シュタインハウザー、ルイス・ピー
Original Assignee
ワットロー・エレクトリック・マニュファクチャリング・カンパニー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/530,670 external-priority patent/US10163668B2/en
Application filed by ワットロー・エレクトリック・マニュファクチャリング・カンパニー filed Critical ワットロー・エレクトリック・マニュファクチャリング・カンパニー
Publication of JP2018502443A publication Critical patent/JP2018502443A/ja
Publication of JP2018502443A5 publication Critical patent/JP2018502443A5/ja
Application granted granted Critical
Publication of JP6431190B2 publication Critical patent/JP6431190B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00Investigating or analyzing materials by the use of thermal means
    • G01N25/20Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/20Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only
    • H04N23/23Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only from thermal infrared radiation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00Details of electric heating devices
    • H05B1/02Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227Applications
    • H05B1/023Industrial applications
    • H05B1/0233Industrial applications for semiconductors manufacturing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/20Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0431Apparatus for thermal treatment
    • H10P72/0432Apparatus for thermal treatment mainly by conduction
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602Temperature monitoring
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00Investigating or analyzing materials by the use of thermal means
    • G01N25/72Investigating presence of flaws

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Resistance Heating (AREA)
  • Drying Of Semiconductors (AREA)
  • Resistance Heating (AREA)
JP2017522916A 2014-10-31 2015-10-28 ヒーター用熱動的応答感知システム Active JP6431190B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/530,670 2014-10-31
US14/530,670 US10163668B2 (en) 2011-08-30 2014-10-31 Thermal dynamic response sensing systems for heaters
PCT/US2015/057905 WO2016069808A1 (en) 2014-10-31 2015-10-28 Thermal dynamic response sensing systems for heaters

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018206740A Division JP6692875B2 (ja) 2014-10-31 2018-11-01 ヒーターシステムに対する熱動的応答感知の方法

Publications (3)

Publication Number Publication Date
JP2018502443A JP2018502443A (ja) 2018-01-25
JP2018502443A5 JP2018502443A5 (https=) 2018-07-12
JP6431190B2 true JP6431190B2 (ja) 2018-11-28

Family

ID=54548258

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2017522916A Active JP6431190B2 (ja) 2014-10-31 2015-10-28 ヒーター用熱動的応答感知システム
JP2018206740A Active JP6692875B2 (ja) 2014-10-31 2018-11-01 ヒーターシステムに対する熱動的応答感知の方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2018206740A Active JP6692875B2 (ja) 2014-10-31 2018-11-01 ヒーターシステムに対する熱動的応答感知の方法

Country Status (6)

Country Link
EP (1) EP3213598B1 (https=)
JP (2) JP6431190B2 (https=)
KR (2) KR102110267B1 (https=)
CN (1) CN107078082B (https=)
TW (1) TWI681483B (https=)
WO (1) WO2016069808A1 (https=)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6806704B2 (ja) * 2015-05-22 2021-01-06 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 方位角方向に調整可能なマルチゾーン静電チャック
JP6397588B2 (ja) * 2016-07-19 2018-09-26 日本碍子株式会社 静電チャックヒータ
US10651095B2 (en) * 2016-08-11 2020-05-12 Applied Materials, Inc. Thermal profile monitoring wafer and methods of monitoring temperature
DE112018005962T5 (de) * 2017-11-21 2020-08-06 WATLOW ELECTRIC MANUFACTURING COMPANY (n.d.Ges.d. Staates Missouri) Multi-zonen trägerheizung ohne durchkontaktierungen
CN111837453B (zh) * 2018-03-08 2023-07-11 沃特洛电气制造公司 用于控制加热器的控制系统
JP7006523B2 (ja) * 2018-06-19 2022-01-24 オムロン株式会社 情報処理装置、情報処理方法、およびプログラム
US10872747B2 (en) * 2018-08-08 2020-12-22 Lam Research Corporation Controlling showerhead heating via resistive thermal measurements
US11240881B2 (en) * 2019-04-08 2022-02-01 Watlow Electric Manufacturing Company Method of manufacturing and adjusting a resistive heater
TWI796572B (zh) * 2019-06-07 2023-03-21 美商瓦特洛威電子製造公司 用以校準操作電熱器的控制系統之系統及方法
CN114175208B (zh) * 2019-07-25 2024-05-24 朗姆研究公司 衬底处理系统
US12146795B2 (en) 2019-11-19 2024-11-19 Lam Research Corporation Temperature monitoring
WO2021173668A1 (en) * 2020-02-24 2021-09-02 Watlow Electric Manufacturing Company Dynamic calibration of a control system controlling a heater
US11551951B2 (en) * 2020-05-05 2023-01-10 Applied Materials, Inc. Methods and systems for temperature control for a substrate
JP7731373B2 (ja) * 2020-05-19 2025-08-29 ワトロー エレクトリック マニュファクチュアリング カンパニー 抵抗ヒーターのための受動的及び能動的な較正方法
KR102602807B1 (ko) * 2020-08-14 2023-11-15 세메스 주식회사 히터 제어 장치 및 이를 구비하는 기판 처리 시스템
KR102520584B1 (ko) * 2020-10-14 2023-04-10 세메스 주식회사 공정 계측 장치 및 방법
US12446122B2 (en) 2021-05-10 2025-10-14 Samsung Electronics Co., Ltd. Systems and methods for temperature profile control of microwave oven devices
US12146794B2 (en) 2021-05-17 2024-11-19 Rosemount Aerospace Inc. Infrared inspection system for heaters comprised of positive temperature coefficient resistors
CN116106652B (zh) * 2021-11-09 2025-11-25 苏州外延世电子材料有限公司 Pe-cvd加热板检测装置
US12520391B2 (en) 2022-02-24 2026-01-06 Samsung Electronics Co., Ltd. Systems and methods for mapping heat deposition in a cooking appliance through fast pattern temperature imaging
US12390046B2 (en) 2022-03-29 2025-08-19 Samsung Electronics Company, Ltd. Systems and methods for achieving a user-specified temperature profile in a cooking appliance through heating control algorithms
KR102579663B1 (ko) * 2023-06-27 2023-09-18 시스트로닉스 주식회사 공기 가열을 통해 측정 정확도를 향상시키는 공기성분측정 장치
CN119133323A (zh) * 2024-11-14 2024-12-13 中矿资源(天津)新材料有限公司 电池膜层的退火工艺及退火设备

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6016383A (en) * 1990-01-19 2000-01-18 Applied Materials, Inc. Rapid thermal heating apparatus and method including an infrared camera to measure substrate temperature
DE69132826T2 (de) * 1990-01-19 2002-08-22 Applied Materials, Inc. Heizgerät für Halbleiterwafers oder Substrate
US5549874A (en) * 1992-04-23 1996-08-27 Ebara Corporation Discharge reactor
JP2651793B2 (ja) * 1993-12-20 1997-09-10 坂口電熱株式会社 セラミックファイバーヒーター
US6073577A (en) 1998-06-30 2000-06-13 Lam Research Corporation Electrode for plasma processes and method for manufacture and use thereof
DE19907497C2 (de) * 1999-02-22 2003-05-28 Steag Hamatech Ag Vorrichtung und Verfahren zur Wärmebehandlung von Substraten
DE10059665C1 (de) * 2000-12-01 2002-07-11 Steag Hamatech Ag Verfahren zum thermischen Behandeln von Substraten
US7196295B2 (en) 2003-11-21 2007-03-27 Watlow Electric Manufacturing Company Two-wire layered heater system
US7178353B2 (en) 2004-02-19 2007-02-20 Advanced Thermal Sciences Corp. Thermal control system and method
JP2006339447A (ja) * 2005-06-02 2006-12-14 Sumco Corp エピタキシャル成長装置及びエピタキシャル成長方法
US7763831B2 (en) * 2006-12-15 2010-07-27 Ngk Insulators, Ltd. Heating device
JP5117146B2 (ja) * 2006-12-15 2013-01-09 日本碍子株式会社 加熱装置
EP1937032B1 (en) * 2006-12-20 2020-11-04 Electrolux Home Products Corporation N.V. Household appliance
US7942969B2 (en) * 2007-05-30 2011-05-17 Applied Materials, Inc. Substrate cleaning chamber and components
US8540819B2 (en) * 2008-03-21 2013-09-24 Ngk Insulators, Ltd. Ceramic heater
US8532832B2 (en) 2008-09-23 2013-09-10 Be Aerospace, Inc. Method and apparatus for thermal exchange with two-phase media
JP5430192B2 (ja) * 2009-03-19 2014-02-26 東京エレクトロン株式会社 温度調節装置、温度調節方法、基板処理装置及び対向電極
US8637794B2 (en) * 2009-10-21 2014-01-28 Lam Research Corporation Heating plate with planar heating zones for semiconductor processing
WO2013033340A1 (en) * 2011-08-30 2013-03-07 Watlow Electric Manufacturing Company Thermal array system
KR102226887B1 (ko) * 2012-02-29 2021-03-12 오아시스 머티리얼 코포레이션 천이 액체상, 알루미늄 질화물 부품의 무가압 연결
CN102975486B (zh) * 2012-12-11 2015-04-15 苏州市晨彩纺织研发有限公司 一种印花均热装置
JP6140457B2 (ja) * 2013-01-21 2017-05-31 東京エレクトロン株式会社 接着方法、載置台及び基板処理装置

Also Published As

Publication number Publication date
TW201624588A (zh) 2016-07-01
TWI681483B (zh) 2020-01-01
KR101999705B1 (ko) 2019-07-12
EP3213598B1 (en) 2023-07-05
KR102110267B1 (ko) 2020-05-14
JP2019061960A (ja) 2019-04-18
KR20190069624A (ko) 2019-06-19
WO2016069808A1 (en) 2016-05-06
JP6692875B2 (ja) 2020-05-13
JP2018502443A (ja) 2018-01-25
CN107078082B (zh) 2021-04-09
KR20170078645A (ko) 2017-07-07
CN107078082A (zh) 2017-08-18
EP3213598A1 (en) 2017-09-06

Similar Documents

Publication Publication Date Title
JP6431190B2 (ja) ヒーター用熱動的応答感知システム
US20240371665A1 (en) Thermal dynamic response sensing systems for heaters
KR101731566B1 (ko) 유체 매질을 구비한 고정밀 히터 시스템
AU2015203558A1 (en) High definition heater and method of operation

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180601

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20180601

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20180601

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20180620

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180703

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180921

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20181002

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20181101

R150 Certificate of patent or registration of utility model

Ref document number: 6431190

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250