KR102101139B9 - 웨이퍼 형상 물품들의 액체 처리를 위한 방법 및 장치 - Google Patents

웨이퍼 형상 물품들의 액체 처리를 위한 방법 및 장치

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Publication number
KR102101139B9
KR102101139B9 KR1020197036695A KR20197036695A KR102101139B9 KR 102101139 B9 KR102101139 B9 KR 102101139B9 KR 1020197036695 A KR1020197036695 A KR 1020197036695A KR 20197036695 A KR20197036695 A KR 20197036695A KR 102101139 B9 KR102101139 B9 KR 102101139B9
Authority
KR
South Korea
Prior art keywords
liquid treatment
shaped articles
wafer shaped
wafer
articles
Prior art date
Application number
KR1020197036695A
Other languages
English (en)
Other versions
KR102101139B1 (ko
KR20190140114A (ko
Inventor
카를-헤인츠 호웬바르터
오토 라흐
Original Assignee
램 리서치 아게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=47828710&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR102101139(B9) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 램 리서치 아게 filed Critical 램 리서치 아게
Publication of KR20190140114A publication Critical patent/KR20190140114A/ko
Application granted granted Critical
Publication of KR102101139B1 publication Critical patent/KR102101139B1/ko
Publication of KR102101139B9 publication Critical patent/KR102101139B9/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020197036695A 2011-09-09 2012-08-30 웨이퍼 형상 물품들의 액체 처리를 위한 방법 및 장치 KR102101139B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/229,097 US9355883B2 (en) 2011-09-09 2011-09-09 Method and apparatus for liquid treatment of wafer shaped articles
US13/229,097 2011-09-09
KR1020197032060A KR102084910B1 (ko) 2011-09-09 2012-08-30 웨이퍼 형상 물품들의 액체 처리를 위한 방법 및 장치

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020197032060A Division KR102084910B1 (ko) 2011-09-09 2012-08-30 웨이퍼 형상 물품들의 액체 처리를 위한 방법 및 장치

Publications (3)

Publication Number Publication Date
KR20190140114A KR20190140114A (ko) 2019-12-18
KR102101139B1 KR102101139B1 (ko) 2020-04-16
KR102101139B9 true KR102101139B9 (ko) 2022-07-25

Family

ID=47828710

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020147006308A KR20140063679A (ko) 2011-09-09 2012-08-30 웨이퍼 형상 물품들의 액체 처리를 위한 방법 및 장치
KR1020197032060A KR102084910B1 (ko) 2011-09-09 2012-08-30 웨이퍼 형상 물품들의 액체 처리를 위한 방법 및 장치
KR1020197036695A KR102101139B1 (ko) 2011-09-09 2012-08-30 웨이퍼 형상 물품들의 액체 처리를 위한 방법 및 장치

Family Applications Before (2)

Application Number Title Priority Date Filing Date
KR1020147006308A KR20140063679A (ko) 2011-09-09 2012-08-30 웨이퍼 형상 물품들의 액체 처리를 위한 방법 및 장치
KR1020197032060A KR102084910B1 (ko) 2011-09-09 2012-08-30 웨이퍼 형상 물품들의 액체 처리를 위한 방법 및 장치

Country Status (5)

Country Link
US (1) US9355883B2 (ko)
JP (1) JP6073894B2 (ko)
KR (3) KR20140063679A (ko)
TW (1) TWI625818B (ko)
WO (1) WO2013035020A1 (ko)

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US9748120B2 (en) 2013-07-01 2017-08-29 Lam Research Ag Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus
US9093482B2 (en) * 2012-10-12 2015-07-28 Lam Research Ag Method and apparatus for liquid treatment of wafer shaped articles
JP6276924B2 (ja) * 2013-03-18 2018-02-07 芝浦メカトロニクス株式会社 基板処理装置
US9245777B2 (en) * 2013-05-15 2016-01-26 Lam Research Ag Apparatus for liquid treatment of wafer shaped articles and heating system for use in such apparatus
KR102119690B1 (ko) * 2013-12-06 2020-06-08 세메스 주식회사 기판 가열 유닛
US9536770B2 (en) 2014-01-14 2017-01-03 Lam Research Ag Method and apparatus for liquid treatment of wafer shaped articles
KR101681183B1 (ko) * 2014-07-11 2016-12-02 세메스 주식회사 기판 처리 장치
US10490426B2 (en) * 2014-08-26 2019-11-26 Lam Research Ag Method and apparatus for processing wafer-shaped articles
KR102343226B1 (ko) 2014-09-04 2021-12-23 삼성전자주식회사 스팟 히터 및 이를 이용한 웨이퍼 클리닝 장치
US9972514B2 (en) 2016-03-07 2018-05-15 Lam Research Ag Apparatus for liquid treatment of wafer shaped articles
JP6742124B2 (ja) 2016-03-30 2020-08-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US10720343B2 (en) 2016-05-31 2020-07-21 Lam Research Ag Method and apparatus for processing wafer-shaped articles
US10068792B2 (en) * 2016-05-31 2018-09-04 Lam Research Ag Method and apparatus for liquid treatment of wafer shaped articles
US20180040502A1 (en) * 2016-08-05 2018-02-08 Lam Research Ag Apparatus for processing wafer-shaped articles
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CN111243944A (zh) * 2020-01-21 2020-06-05 长江存储科技有限责任公司 晶圆的处理方法和晶圆的处理系统

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Also Published As

Publication number Publication date
WO2013035020A1 (en) 2013-03-14
KR102084910B9 (ko) 2022-07-25
KR102084910B1 (ko) 2020-03-04
KR102101139B1 (ko) 2020-04-16
KR20140063679A (ko) 2014-05-27
US20130061873A1 (en) 2013-03-14
JP2014528163A (ja) 2014-10-23
TWI625818B (zh) 2018-06-01
US9355883B2 (en) 2016-05-31
KR20190124825A (ko) 2019-11-05
JP6073894B2 (ja) 2017-02-01
TW201318102A (zh) 2013-05-01
KR20190140114A (ko) 2019-12-18

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