KR102088652B1 - Solder composition and printed circuit board using the same - Google Patents

Abstract

The solder composition of the present invention contains a rosin-based resin, amide-based condensate fine particles, a solvent, an active agent, an amine-based compound, and solder powder, and the amide-based condensate fine particles contain hydroxy aliphatic monocarboxylic acid. A low-molecular-weight amide compound obtained by condensing an aliphatic carboxylic acid having 2 to 22 carbon atoms and a diamine having 2 to 16 carbon diamines and dimer diamine, the same carboxylic acid, the same diamine, and weight average molecular weight Fine particles containing a high molecular weight amide compound condensed with a carboxyl group-containing polymer of 2000 to 100,000, and the content of the fine particles of the amide condensate is 1.1 parts by mass or more and 2.7 parts by mass or less with respect to 100 parts by mass of the rosin-based resin.

Description

Solder composition and printed wiring board using the same {SOLDER COMPOSITION AND PRINTED CIRCUIT BOARD USING THE SAME}

The present invention relates to a solder composition (so-called solder paste) for mounting components on a printed wiring board of an electronic device, and a printed wiring board on which electronic components are mounted using the solder composition.

The solder paste is a mixture obtained by kneading solder powder, rosin-based resin, activator, solvent, and the like. In this solder paste, a property (sagging property) that suppresses sagging during preheating in the reflow process (the form of the coating film of the solder paste collapsing during preheating) is required. However, in order to improve the sagging properties of the solder paste, increasing the viscosity and thixotropy of the solder paste tends to decrease the printability of the solder paste. In this way, printability and sagging property are in a relationship of yield ratio, and it is difficult to make them compatible.

Therefore, for example, a solder paste containing a predetermined block polymer has been proposed (Document 1; Japanese Patent Laid-Open No. 2002-336993). However, sagging is likely to occur because the preheating temperature tends to increase with the recent lead freeization of solder powder. In addition, since the spacing between terminals decreases as the size of electronic components decreases, further suppression of sagging is required. Therefore, the sagging property at the time of preheating is further improved.

An object of the present invention is to provide a solder composition capable of sufficiently suppressing sagging during preheating while maintaining printability, and a printed wiring board using the solder composition.

As a result of repeated studies of the inventors to achieve the above object, the following findings have been found. That is, when there are many components (so-called thixotropic agents) that can adjust the thixotropy of the solder composition, among these multiple thixotropic agents, when amide-based condensate fine particles containing a specific low molecular weight amide compound and a specific high molecular weight amide compound are used It has been found that, in some cases, sagging during preheating can be sufficiently suppressed while maintaining printability, and the present invention has been completed.

That is, the solder composition of the present invention contains a rosin-based resin, amide-based condensate fine particles, a solvent, an active agent, an amine-based compound, and solder powder, and the amide-based condensate fine particles are hydroxy aliphatic monocarboxyl Low-molecular-weight amide compounds condensing an aliphatic carboxylic acid having 2 to 22 carbon atoms containing an acid and a diamine having 2 to 16 carbon diamines and dimer diamine, and the same carboxylic acid, the same diamine and weight It is a fine particle containing a high molecular weight amide compound condensed with a carboxyl group-containing polymer having an average molecular weight of 2000 to 100,000, and the content of the fine particles of the amide-based condensate is 1.1 parts by mass or more and 2.7 parts by mass or less with respect to 100 parts by mass of the rosin-based resin. Is to do.

The printed wiring board of the present invention is characterized in that electronic components are mounted on the printed wiring board using the solder composition.

According to the present invention, it is possible to provide a solder composition capable of sufficiently suppressing sagging during preheating while maintaining printability, and a printed wiring board using the solder composition.

The solder composition of the present invention contains the solder powder described below and the flux described below.

The solder powder used in the present invention is preferably lead-free solder powder, but may be lead solder powder. As the solder alloy in the solder powder, an alloy containing tin or bismuth as a main component is preferable. Moreover, silver, copper, zinc, bismuth, tin, lead, etc. are mentioned as a 2nd element of this alloy. In addition, other elements (hereinafter, a third element) may be added to the alloy as necessary. Examples of other elements include copper, silver, nickel, cobalt, iron, antimony, titanium, phosphorus, and germanium.

It is preferable that content of this solder powder is 85 mass% or more and 92 mass% or less with respect to 100 mass% of solder compositions. When the content of the solder powder is less than 85% by mass (when the flux content exceeds 15% by mass), it is difficult to form a sufficient solder joint when the obtained solder composition is used, while the content of the solder powder When it exceeds 92 mass% (when the flux content is less than 8 mass%), the flux as a binder is insufficient, and thus there is a tendency that the flux and the solder powder are difficult to mix.

In addition, the average particle size of the solder powder is preferably 1 μm or more and 40 μm or less, more preferably 10 μm or more and 35 μm or less, and particularly preferably 15 μm or more and 25 μm or less. If the average particle diameter is within the above range, it can also cope with recent printed circuit boards in which the pitch of the solder land is narrowed. In addition, the average particle diameter can be measured by a dynamic light scattering particle diameter measuring device.

The flux used in the present invention contains rosin-based resin, amide-based condensate fine particles, solvent, activator, and amine-based compound.

Examples of the rosin-based resin used in the present invention include rosin and rosin derivatives. Examples of rosin derivatives include modified rosin, polymerized rosin, and hydrogenated rosin. Among these rosin-based resins, hydrogenated rosin is preferred from the viewpoint of active action. These rosin-based resins may be used alone or in combination of two or more.

The amide-based condensate fine particles used in the present invention have a low molecular weight obtained by condensing a diamine of any one of diamine diamine and diamine diamine having 2 to 22 carbon atoms and aliphatic carboxylic acid having 2 to 22 carbon atoms containing hydroxy aliphatic monocarboxylic acid. Fine particles containing a high molecular weight amide compound condensed with an amide compound, the same carboxylic acid, the same diamine, and a carboxyl group-containing polymer having a weight average molecular weight of 2000 to 100,000.

It is preferable that the fine particles of the amide condensate contain the low molecular weight amide compound: the high molecular weight amide compound 99 to 50: 1 to 50 in a mass ratio.

In the fine particles of the amide-based condensate, it is preferable that the aliphatic carboxylic acid contains an aliphatic dicarboxylic acid having 2 to 12 carbon atoms or the same aliphatic dicarboxylic acid and dimer acid.

In the amide-based condensate fine particles, it is preferable that the hydroxy aliphatic monocarboxylic acid is a hydrolyzate of castor oil hydrogenated.

In the fine particles of the amide-based condensate, the carboxyl group-containing polymer is a polyalkylene oxide, and a polyalkylene oxide is selected from a compound copolymerized with a carboxyl group-containing compound monomer or copolymerized with a copolymerization monomer or polycondensation monomer. It is preferred.

It is preferable to use the amide condensate fine particles as a dispersion. Moreover, the dispersion liquid of amide-type condensate fine particles can be manufactured as follows, for example.

First, 1 mol equivalent of aliphatic carboxylic acid and 0.5 mol equivalent of aliphatic diamine are dehydrated and condensed for 2 to 10 hours while heating at 160 to 230 ° C. under normal pressure or vacuum in a solventless state. Then, the aliphatic carboxylic acid and the aliphatic diamine are condensed, the acid value and the amine value are 20 or less, a pale yellow to light brown solid, and a low-molecular-weight amide compound having a melting point of 100 to 160 ° C. and heat-melting. To this, at least 1% by mass, preferably 1 to 50% by mass, more preferably 1 to 10% by mass of a carboxyl group-containing polymer is added, followed by dehydration condensation reaction for 1 to 5 hours. Then, a part of the low molecular weight amide compound becomes a high molecular weight amide compound by dehydration condensation reaction of its unreacted amino group and carboxyl group-containing polymer carboxyl group. As a result, a wax containing a high molecular weight amide compound and a low molecular weight amide compound, having an acid value of 30 or less, preferably 5 to 20, and an amine value of 20 or less, preferably 7 or less is obtained. Subsequently, the wax is used as a micron order with a pulverizer, for example, fine particles pulverized to 20 µm or less, preferably 10 µm or less. The fine particles and a solvent are mixed, and the fine particles are heated in a solvent by a mechanical dispersing method using a disper or by a dispersing method using a wet disperser using a medium such as glass beads. While heating to ∼100 ° C, preferably 50 to 90 ° C, the solvent is impregnated with an appropriate time depending on the heating conditions or the solvent. Then, the fine particles swell to obtain a dispersion of the amide-based condensate fine particles.

Further, after dehydrating and condensing the aliphatic carboxylic acid and the aliphatic diamine, an example of further dehydrating and condensing by adding a carboxyl group-containing polymer is shown, but the dehydration and condensation may be performed by simultaneously mixing the aliphatic carboxylic acid, the aliphatic diamine, and the carboxyl group-containing polymer.

It is necessary that the content of the fine particles of the amide-based condensate is 1.1 parts by mass or more and 2.7 parts by mass or less with respect to 100 parts by mass of the rosin-based resin. When the content is less than the lower limit, printability is insufficient and sagging is likely to occur. On the other hand, when the content exceeds the upper limit, the printability is insufficient. Further, from the viewpoint of further improving sagging during preheating while maintaining printability, the content of the amide-based condensate fine particles is preferably 1.4 parts by mass or more and 2.5 parts by mass or less with respect to 100 parts by mass of the rosin-based resin. , More preferably 1.7 parts by mass or more and 2.3 parts by mass or less, and particularly preferably 1.9 parts by mass or more and 2.2 parts by mass or less.

In the flux used in the present invention, the fine particles of the amide condensate and other thixotropic agents may be used in combination.

Examples of the thixotropic agent include olefin waxes, fatty acid amides, substituted urea waxes, polymer compounds, and inorganic particles.

Examples of the olefin-based wax include caster wax (cured castor oil = hydrogenated castor oil), beeswax, and carnauba wax.

As fatty acid amides, stearic acid amide, hydroxystearic acid bisamide, m-xylylene bistearic acid amide, N, N'-distearylisophthalic acid amide, N, N'-distearylsebacic acid amide, N, N '-Distearyladipic acid amide, butylenebishydroxystearic acid amide, hexamethylene bishydroxystearic acid amide, hexamethylene bisbehenic acid amide, hexamethylene bisbenzoic acid amide, ethylene bisbehenic acid amide, ethylene bishydride Hydroxy stearic acid amide, ethylene bistearic acid amide, ethylene bislauric acid amide, ethylene biscapric acid amide, ethylene biscaprylic acid amide, methylene bishydroxystearic acid amide, methylene bislauric amide, methylene bis stearic acid And amides.

Examples of the substituted urea wax include N-butyl-N'-stearyl urea, N-phenyl-N'-stearyl urea, N-stearyl-N'-stearyl urea, xylylene bistearyl urea, toluylene bisstea And aryl urea, hexamethylene bisstearyl urea, diphenylmethane bisstearyl urea, and diphenylmethane bislauryl urea.

Examples of the polymer compound include 1,2-hydroxystearic acid triglyceride, polyethylene glycol, polyethylene oxide, methyl cellulose, ethyl cellulose, and hydroxyethyl cellulose.

Examples of the inorganic particles include silica particles and kaolin particles.

These thixotropic agents may be used alone or in combination of two or more.

The content of the thixotropic agent is preferably 1 part by mass or more and 10 parts by mass or less with respect to 100 parts by mass of the rosin-based resin. If the content is less than the lower limit, the thixotropy is not obtained and sagging tends to occur. On the other hand, when the amount exceeds the upper limit, the thixotropy tends to be too high and coating tends to be poor.

As the solvent used in the present invention, a known solvent can be suitably used. It is preferable to use a water-soluble solvent having a boiling point of 170 ° C or higher as the solvent.

Examples of the solvent include diethylene glycol, dipropylene glycol, triethylene glycol, hexylene glycol, hexyl diglycol, 1,5-pentanediol, methylcarbitol, butylcarbitol, 2-ethylhexyldiglycol, and octane And diol, phenyl glycol, and diethylene glycol monohexyl ether. These solvents may be used alone or in combination of two or more.

The content of the solvent is preferably 20 parts by mass or more and 100 parts by mass or less with respect to 100 parts by mass of the rosin-based resin. When the content of the solvent is within the above range, the viscosity of the resulting solder composition can be appropriately adjusted within an appropriate range.

As an active agent used for this invention, an organic acid and an organic halogen compound are mentioned, for example. These active agents may be used alone or in combination of two or more.

As said organic acid, other organic acids other than monocarboxylic acid, dicarboxylic acid, etc. are mentioned, for example. These organic acids may be used alone or in combination of two or more.

Examples of the monocarboxylic acid are formic acid, acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, enanthic acid, capric acid, lauric acid, myristic acid, pentadecyl acid, palmitic acid, margaric acid, stearic acid, and tu And berculostearic acid, arachidic acid, behenic acid, lignoseric acid, and glycolic acid.

Examples of dicarboxylic acids include oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, fumaric acid, maleic acid, tartaric acid and diglycolic acid.

Other organic acids include dimer acid, levulinic acid, lactic acid, acrylic acid, benzoic acid, salicylic acid, anise acid, citric acid and picolinic acid.

Examples of the organic halogen compound include dibromobutenediol, dibromosuccinic acid, 5-bromobenzoic acid, 5-bromonicotinic acid, and 5-bromophthalic acid. These organic halogen compounds may be used singly or in combination of two or more.

The content of the active agent is preferably 2 parts by mass or more and 20 parts by mass or less, more preferably 5 parts by mass or more and 10 parts by mass or less with respect to 100 parts by mass of the rosin-based resin. When the content is less than the above lower limit, solder balls tend to tend to occur, while when the above upper limit is exceeded, the insulating properties of the flux tend to decrease.

As an amine compound used for this invention, an imidazole compound and a triazole compound are mentioned, for example. These amine-based compounds may be used alone or in combination of two or more.

Examples of the imidazole compound include benzoimidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole and the like.

As a triazole compound, benzotriazole, 1H-benzotriazole-1-methanol, 1-methyl-1H-benzotriazole, etc. are mentioned.

The content of the amine-based compound is preferably 0.1 parts by mass or more and 5 parts by mass or less, more preferably 0.3 parts by mass or more and 1 part by mass or less with respect to 100 parts by mass of the rosin-based resin. When the content is less than the lower limit, unmelting of solder or non-wetting to the substrate land tends to occur, while when the amount exceeds the upper limit, storage stability of the resulting solder composition tends to decrease.

The flux used in the present invention may contain additives such as thixotropic agents, antifoaming agents, antioxidants, rust inhibitors, surfactants, and thermosetting agents in addition to the above components, if necessary. The content of these additives is preferably 20 parts by mass or less with respect to 100 parts by mass of the rosin-based resin.

Next, the printed wiring board of the present invention will be described. The printed wiring board of the present invention is characterized in that electronic components are mounted on the printed wiring board using the solder composition described above. Therefore, even in the printed wiring board of the present invention, sagging during preheating can be sufficiently suppressed.

Example

Next, the present invention will be described in more detail by examples and comparative examples, but the present invention is not limited by these examples. In addition, materials used in Examples and Comparative Examples are shown below.

Rosin-based resin: hydrogenated rosin, Arakawa Chemical Industries, Ltd. product

Solvent: Hexyl Diglycol (DEH), Nippon Nyukazai Co., Ltd. product

Dispersion of amide-based condensate fine particles: See Production Example 1 below, concentration of amide-based condensate fine particles in the dispersion is 20% by mass

Thixotropic agent A: Fatty acid amide (fatty acid amide), trade name "SLIPACKS LA", Nippon Kasei Chemical Co., Ltd. product

Thixotropic agent B: fatty acid amide (fatty acid amide), trade name "SLIPACKS H", Nippon Kasei Chemical Co., Ltd. product

Thixotropic agent C: 12-hydroxystearic acid triglyceride, Nippon Kasei Chemical Co., Ltd. product

Activator A: dibromobutenediol, ARBROWN CO., LTD. product

Activator B: Adipic acid, Tokyo Chemical Industry Co., Ltd. product

Activator C: malonic acid, Toshin Chemicals Co., Ltd. product

Amine-based compounds: benzoimidazole, Tokyo Chemical Industry Co., Ltd. product

Lead-free solder powder: average particle diameter of 17㎛, solder composition is 96.5Sn / 3Ag / 0.5Cu

[Production Example 1]

600.0 parts by mass of 12-hydroxystearic acid derived from hydrogenated castor oil fatty acid was added to a reaction device equipped with a stirrer, thermometer, and water fountain, and the mixture was heated to 80 to 100 ° C to melt. Thereafter, 116.0 parts by mass of hexamethylenediamine, a diamine, was added and subjected to a condensation reaction while dehydrating at 170 ° C under a nitrogen atmosphere for 5 to 8 hours to amid to obtain a low molecular weight diamide compound having an acid value of 4.2 and an amine value of 9.4. In addition, 68.0 parts by mass of a carboxyl group-containing polymer, which is a propylene-maleic anhydride copolymer having a weight average molecular weight of 10000 and an acid value of 80 mgKOH / g, is added and subjected to condensation reaction while dehydrating at 170 ° C for 1 to 2 hours, and some unreacted low molecular weight diamide compounds It was reacted with an amino group to amidate to produce a high molecular weight diamide compound. As a result, a pale yellow mixture of a low molecular weight diamide compound and a high molecular weight diamide compound (acid value 6.0, amine value 4.2) was obtained as a waxy product. The obtained product was pulverized to obtain amide-based condensate fine particles atomized to an average particle diameter of 7 µm.

Then, 120 parts by mass of mineral terpene, 40 parts by mass of benzyl alcohol, and 40 parts by mass of fine particles of the resulting amide condensate were added to a sealed container to obtain a suspension by sufficiently dispersing at 10 to 20 ° C. Thereafter, when the sealed container containing the suspension was heated by a known method, the fine particles swelled to obtain a dispersion of amide-based condensate fine particles. Further, the concentration of the fine particles of the amide condensate in this dispersion was 20% by mass.

[Example 1]

In a container, 100 parts by mass of a rosin-based resin, 51 parts by mass of a solvent, 6.3 parts by mass of a dispersion of amide-based condensate fine particles, 1.8 parts by mass of activator A, 4.5 parts by mass of activator B, 1.2 parts by mass of activator C, and 0.4 parts by mass of amine compound It was charged and mixed using a brain agitator to obtain a flux.

Then, 11 mass% of the obtained flux and 89 mass% of lead-free solder powder (100 mass% in total) were put into a container, and the solder composition was prepared by mixing in a kneader for 2 hours.

[Examples 2 to 9]

A solder composition was obtained in the same manner as in Example 1 except that each material was blended along the composition shown in Table 1.

[Comparative Examples 1 to 5]

A solder composition was obtained in the same manner as in Example 1 except that each material was blended along the composition shown in Table 2.

<Evaluation of solder composition>

The solder composition was evaluated (viscosity, viscosity index, properties, sagging properties during heating, printability) in the following manner. The obtained results are shown in Table 1 and Table 2.

(1) Viscosity and viscosity index

The solder composition is left at room temperature (25 ° C) for 2-3 hours. Open the lid of the container of the solder composition to avoid mixing of the air with a spatula, carefully scrape it for 1-2 minutes and use it as a sample. Then, the sample is set in a spiral viscometer (MALCOM CO., LTD. Product, PCU-II type), and the rotor is rotated for 6 minutes with a rotation speed of 10 rpm and a temperature of 25 ° C. Then, once the rotation was stopped and the temperature was adjusted, the number of revolutions was adjusted to 10 rpm, and the viscosity value after 3 minutes was read.

In addition, the viscosity value (30 rpm viscosity) when the rotational speed is adjusted to 30 rpm and the viscosity value (3 rpm viscosity) when the rotational speed is adjusted to 3 rpm are read as described above. And, the following formula:

(Viscosity index) = log [(3rpm viscosity) / (30rpm viscosity)]

Based on, calculate the viscosity index.

(2) Icon

It is visually checked whether the solder composition is glossy. Subsequently, the solder composition was mixed with the center and sides of the container using Hera and checked for smoothness.

A: There is no problem in glossiness and smoothness.

B: There is a problem with at least one of gloss and smoothness.

(3) Sagging property during heating

Prepare the cleaned ceramic substrate (SANYU INDUSTRIES, LTD. Product: 25mm × 50mm × 0.8mm). A metal mask with a thickness of 0.2 mm (with an error of 0.001 mm or less) having a pattern hole of 3.0 mm x 1.5 mm and having it arranged in 0.1 mm steps from 0.1 mm to 1.2 mm is used, and on this ceramic substrate The solder composition was printed on the test plate. In addition, two trial versions are prepared. Then, the test plate is placed in a furnace heated to 170 ° C and heated for 1 minute. Each of the two test plates after heating was observed, and the minimum gap in which the printed solder composition in the pattern hole was not integrated was measured.

(4) Printability

SP-TDC substrate at a printing speed of 50mm / s using a printer MI-878SV (manufactured by Minami Co., Ltd.) and a metal mask and metal squeegee with a thickness of 0.1mm (substrate with a dot pattern of 100 dots, diameter of dots: The solder composition is printed on 0.2 mmφ to 0.5 mmφ). After printing on 20 SP-TDC substrates, they are left at 25 ° C and 50% for 1 hour. After standing, printing was resumed and the solder composition was printed on 10 SP-TDC substrates. Then, the transfer rate (average value of the volume fraction for 100 dots) is measured by a three-dimensional shape analysis device.

A: It is within the third sheet that the average transfer rate after standing (average of the transfer rate of 10 substrates) becomes the same as before standing.

B: It is the 4th or 5th sheet that the average transfer rate after standing becomes the same value as before standing.

C: After the sixth sheet, the average transfer rate after standing becomes the same value as before standing.

As is clear from the results shown in Tables 1 and 2, when the solder composition of the present invention was used (Examples 1 to 9), both printability and sagging properties during heating were excellent. Therefore, it was confirmed that according to the solder composition of the present invention, sagging during preheating can be sufficiently suppressed while maintaining printability.

On the other hand, when a solder composition containing no amide-based condensate fine particles was used (Comparative Examples 1 to 2), sagging properties during heating were insufficient. Moreover, when the content of the fine particles of the amide-based condensate in the flux was not appropriate (Comparative Examples 3 to 5), it was not possible to achieve both printability and sagging properties during heating.

Claims (3)

Contains rosin-based resin, amide-based condensate fine particles, solvent, activator, amine-based compound, and solder powder,
The amide-based condensate fine particles include a low molecular weight amide compound condensing a diamine of any one of diamine diamine and diamine diamine having 2 to 16 carbon atoms and aliphatic carboxylic acid having 2 to 22 carbon atoms, including hydroxy aliphatic monocarboxylic acid, Fine particles containing a high molecular weight amide compound condensed with a homogeneous carboxylic acid, a diamine of the same kind, and a carboxyl group-containing polymer having a weight average molecular weight of 2000 to 100,000,
The content of the amide-based condensate fine particles is 1.1 parts by mass or more and 2.7 parts by mass or less with respect to 100 parts by mass of the rosin-based resin,
The content of the solvent is 20 parts by mass or more and 100 parts by mass or less with respect to 100 parts by mass of the rosin-based resin,
The content of the active agent is 2 parts by mass or more and 20 parts by mass or less with respect to 100 parts by mass of the rosin-based resin,
The content of the amine-based compound is 0.1 parts by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the rosin-based resin,
The content of the solder powder is 85% by mass or more and 92% by mass or less with respect to 100% by mass of the solder composition,
The solder composition does not contain a thixotropic agent other than the amide-based condensate fine particles. Contains rosin-based resin, amide-based condensate fine particles, thixotropic agents other than the amide-based condensate fine particles, a solvent, an activator, an amine compound, and solder powder,
The amide-based condensate fine particles include a low molecular weight amide compound condensing a diamine of any one of diamine diamine and diamine diamine having 2 to 16 carbon atoms and aliphatic carboxylic acid having 2 to 22 carbon atoms, including hydroxy aliphatic monocarboxylic acid, Fine particles containing a high molecular weight amide compound condensed with a homogeneous carboxylic acid, a diamine of the same kind, and a carboxyl group-containing polymer having a weight average molecular weight of 2000 to 100,000,
The content of the amide-based condensate fine particles is 1.1 parts by mass or more and 2.7 parts by mass or less with respect to 100 parts by mass of the rosin-based resin,
The content of the thixotropic agent is 1 part by mass or more and 10 parts by mass or less with respect to 100 parts by mass of the rosin-based resin,
The content of the solvent is 20 parts by mass or more and 100 parts by mass or less with respect to 100 parts by mass of the rosin-based resin,
The content of the active agent is 2 parts by mass or more and 20 parts by mass or less with respect to 100 parts by mass of the rosin-based resin,
The content of the amine-based compound is 0.1 parts by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the rosin-based resin,
The content of the solder powder is 85% by mass or more and 92% by mass or less with respect to 100% by mass of the solder composition. A printed wiring board, wherein the electronic component is mounted on a printed wiring board using the solder composition according to claim 1 or 2.