JP6575708B1 - Flux and solder paste - Google Patents

Abstract

Provided are a flux and a solder paste using the flux that imparts thixotropy, is excellent in printability, print sagging suppression ability, and heating sagging suppression ability, and has improved solder wettability. A flux contains a thixotropic agent, a compound represented by the general formula (1), rosin, and a solvent. The thixotropic agent includes a cyclic amide compound and an acyclic amide compound, includes 0.1 to 8.0 wt% of the cyclic amide compound, 0.5 to 8.0 wt% of the non-cyclic amide compound, and the total of both is 1.5 to 10.0 wt%. The cyclic amide compound is a cyclic polycondensation of di and / or tricarboxylic acid and di and / or triamine. The acyclic amide compound is a non-cyclic condensation product of mono, di and / or tricarboxylic acid and mono, di and / or triamine. In formula (1), R1, R2, R3 and R4 represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. [Chemical 1] [Selected figure] None

Description

  The present invention relates to a flux used for soldering and a solder paste using the flux.

  In general, the flux used for soldering chemically removes metal oxides present on the metal surface of the solder and the object to be soldered, and enables movement of metal elements at the boundary between the two. Has the effect of For this reason, by performing soldering using a flux, an intermetallic compound can be formed between the solder and the metal surface of the object to be joined, and a strong joint can be obtained.

  In such a soldering flux and a solder paste containing metal powder, thixotropy is imparted by a thixotropic agent contained in the flux. The thixotropic agent builds a network in the flux and imparts thixotropic properties. When the flux has a thixotropy, when the shearing force is applied, the viscosity is lowered, so that workability such as printability is improved. In addition, by including a thixotropic agent, the sag of the solder paste after printing called printing sag and the sag of the solder paste when melted by heating called heating sag are retained by the network formed by the thixotropic agent. Sag is suppressed.

  As the thixotropic agent, an amide-based thixotropic agent comprising an amide compound obtained by dehydration condensation of a fatty acid and an amine is used from the viewpoint of imparting thixotropy, improving printability, suppressing printing sagging, and heating sagging (for example, Patent Documents). 1). As the thixotropic agent, an ester-based thixotropic agent made of castor oil is used.

Japanese Patent No. 3350767

  Amide-based thixotropic agents easily form hydrogen bonds within and between molecules due to amide bonds, and when they become polymers, they have poor compatibility and are difficult to disperse uniformly, thereby making printability unstable. Further, when the amount of the polymer amide compound is increased, the viscosity becomes extremely high, so that the printability is deteriorated. Furthermore, even with ester thixotropic agents, heating sag cannot be sufficiently suppressed. In addition, there is also a problem that the wettability of the metal surface of the joining object by solder tends to be lowered.

  The present invention has been made in order to solve such a problem. It imparts thixotropy, is excellent in printability, suppression of printing sag, and suppression of heating sag, and has improved solder wettability. It aims at providing the solder paste using a flux and a flux.

  A flux containing a thixotropic agent composed of a cyclic amide compound and an acyclic amide compound and the specific activator represented by the general formula (1) improves the thixotropy and improves the wettability of the solder. It has been found that a solder paste containing metal powder and metal powder can improve printability and suppress printing sag and heating sag.

  Therefore, the present invention is a flux containing a thixotropic agent, a compound represented by the following general formula (1), rosin, and a solvent, and the thixotropic agent includes a cyclic amide compound and an acyclic amide compound. The cyclic amide compound is contained in an amount of 0.1 wt% to 8.0 wt%, the acyclic amide compound is contained in an amount of 0.5 wt% to 8.0 wt%, and the cyclic amide compound and the acyclic amide compound The total is 1.5 wt% or more and 10.0 wt% or less, and the cyclic amide compound is an amide compound having a molecular weight of 3000 or less obtained by cyclic polycondensation of dicarboxylic acid and / or tricarboxylic acid and diamine and / or triamine. The acyclic amide compound includes monocarboxylic acid, dicarboxylic acid and / or tricarboxylic acid, monoamine, diamine and / or Is an amide compound of an triamine fused to a non-cyclic.

［式（１）中、Ｒ^１、Ｒ^２、Ｒ^３及びＲ^４は、それぞれ独立に、水素原子または炭素数１〜４のアルキル基を示す。］

[In Formula (1), R < ¹ >, R < ² >, R < ³ > and R < ⁴ > show a hydrogen atom or a C1-C4 alkyl group each independently. ]

  The compound represented by the general formula (1) is preferably picolinic acid.

  More preferably, the cyclic amide compound has 3 to 10 carbon atoms in the dicarboxylic acid and the tricarboxylic acid, and the cyclic amide compound has 6 to 10 carbon atoms in the dicarboxylic acid and the tricarboxylic acid.

  More preferably, the cyclic amide compound has 2 to 54 carbon atoms in the diamine and triamine, and the cyclic amide compound has 6 carbon atoms in the diamine and triamine.

  The cyclic amide compound is preferably an amide compound obtained by cyclic polycondensation of a dicarboxylic acid having 3 to 10 carbon atoms and a diamine having 2 to 54 carbon atoms, and the cyclic amide compound has a carbon number. Is more preferably an amide compound obtained by cyclic polycondensation of a dicarboxylic acid having 6 to 10 carbon atoms and a diamine having 6 carbon atoms.

  In the acyclic amide compound, the monocarboxylic acid, dicarboxylic acid, and tricarboxylic acid preferably have 2 to 28 carbon atoms, and the monoamine, diamine, and triamine have 0 to 54 carbon atoms.

  The thixotropic agent preferably further contains an ester compound, and the thixotropic agent preferably contains castor oil as the ester compound.

  More preferably, the thixotropic agent contains the cyclic amide compound in an amount of 0.1 wt% to 1.5 wt% and the acyclic amide compound in an amount of 0.5 wt% to 4.0 wt%. Furthermore, it is preferable that the thixotropic agent contains 0 wt% or more and 8.0 wt% or less of the ester compound.

  Further, the compound represented by the general formula (1) is preferably contained in an amount of 0.5 wt% or more and 7.0 wt% or less, and the rosin is preferably contained in an amount of 30 wt% or more and 60 wt% or less.

  Furthermore, it contains 0 wt% or more and 20 wt% or less of amine, 0 wt% or more and 5 wt% or less of organic halogen compound, 0 wt% or more and 2 wt% or less of amine hydrohalate, or 0 wt% or more and 5 wt% or less of antioxidant. preferable.

  Moreover, this invention is the solder paste containing the flux mentioned above and metal powder.

  In the thixotropic agent consisting of a cyclic amide compound and a non-cyclic amide compound, the non-cyclic amide compound is cross-linked with a low-molecular cyclic amide compound. And thixotropy can be improved without increasing content of an acyclic amide compound, and precipitation of a thixotropic agent can be suppressed.

  Moreover, in the flux of this invention, the wettability of solder can be improved by containing the compound represented by the said General formula (1) as a specific activator.

  With the solder paste using this flux, it is possible to obtain good printability in which bleeding, blurring and the like are suppressed, and it is possible to suppress printing sag through which the solder paste after printing flows. Furthermore, the heating sag of the solder paste due to heating during soldering can be suppressed.

It is a schematic diagram which shows the outline | summary of the molecular structure of dicarboxylic acid. It is a schematic diagram which shows the outline | summary of the molecular structure of diamine. It is a schematic diagram which shows the outline | summary of the molecular structure of an acyclic amide compound. It is a schematic diagram which shows the outline | summary of the molecular structure of an acyclic amide compound. It is a schematic diagram which shows the outline | summary of the molecular structure of a cyclic amide compound. It is a schematic diagram which shows the outline | summary of the molecular structure which bridge | crosslinked the acyclic amide compound with the cyclic amide compound. It is a schematic diagram which shows the outline | summary of the molecular structure of monocarboxylic acid. It is a schematic diagram which shows the outline | summary of the molecular structure of a monoamine. It is a schematic diagram which shows the outline | summary of the molecular structure of the acyclic amide compound which monocarboxylic acid and monoamine condensed.

<Example of flux of this embodiment>
The flux of the present embodiment contains a thixotropic agent, a compound represented by the general formula (1), rosin, and a solvent. The thixotropic agent is composed of a cyclic amide compound and an acyclic amide compound.

  The cyclic amide compound is a low molecular amide compound having a molecular weight of 3000 or less, particularly a molecular weight of 1000 or less, obtained by cyclic polycondensation of dicarboxylic acid and / or tricarboxylic acid and diamine and / or triamine. Further, the acyclic amide compound is a non-cyclic amide oligomer having a molecular weight of 3000 or less, which is a non-cyclic polycondensation of monocarboxylic acid, dicarboxylic acid and / or tricarboxylic acid and monoamine, diamine and / or triamine, or a molecular weight of more than 3000. This is an acyclic high molecular amide polymer.

  FIG. 1 is a schematic diagram showing an outline of the molecular structure of a dicarboxylic acid, FIG. 2 is a schematic diagram showing an outline of the molecular structure of a diamine, and FIG. 3 is a schematic diagram showing an outline of the molecular structure of an acyclic amide compound. . As shown in FIG. 3, an acyclic amide compound is synthesized by polycondensation (dehydration condensation) of the dicarboxylic acid shown in FIG. 1 and the diamine shown in FIG.

The thixotropic agent composed of the acyclic amide compound shown in FIG. 3 is an amide group in which the carboxyl group (COOH) of the dicarboxylic acid shown in FIG. 1 and the amino group (NH ₂ ) of the diamine shown in FIG. A network is formed by hydrogen bonding between hydrogen (H) and oxygen (O) in C (═O) —NH within and between molecules. The amide bond site is indicated by (A), and the hydrogen bond site is indicated by (B).

  FIG. 4 is a schematic diagram showing an outline of the molecular structure of an acyclic amide compound. When the acyclic amide compound is polymerized, as shown in FIG. 4, hydrogen bonding (B) proceeds in the molecule, so that the solubility (compatibility) becomes very poor in the flux and coarse in the flux. May occur, resulting in poor thixotropy. In addition, a solder paste in which such a flux and metal powder are mixed has poor printability, and printing sagging and heating sagging occur.

  Therefore, by using a cyclic amide compound in combination with an acyclic amide compound, the cyclic amide compound crosslinks the acyclic amide compound with a non-covalent interaction, and constructs a relatively uniform thixotropic agent component network. Inhibits excessive thixotropic agent precipitation.

  FIG. 5 is a schematic diagram showing an outline of the molecular structure of a cyclic amide compound. Now, by dicondensing the dicarboxylic acid shown in FIG. 1 and the diamine shown in FIG. 2, a cyclic amide compound is synthesized as a low molecular amide as shown in FIG.

  Since the cyclic amide compound has higher symmetry than the non-cyclic amide compound, it has a property of being easily crystallized as compared with the non-cyclic low-molecular amide. On the other hand, acyclic low molecular weight amides have polar end groups, so that they are easily compatible with the flux and difficult to crystallize, so that it is difficult to impart thixotropy due to network formation. On the other hand, since the cyclic amide compound does not have a polar end group, the cyclic amide compound is hardly compatible with the flux and easily imparts thixotropy due to network formation.

  As a result, in the thixotropic agent consisting of a cyclic amide compound and an acyclic amide compound, hydrogen bonding between the cyclic amide compound and the acyclic amide compound is promoted, and the hydrogen bond in the molecule of the acyclic amide compound is inhibited. It is thought that it is done.

  FIG. 6 is a schematic diagram showing an outline of a molecular structure in which a non-cyclic amide compound is crosslinked with a cyclic amide compound. In the thixotropic agent comprising a cyclic amide compound and an acyclic amide compound, as shown in FIG. 6, the cyclic amide compound and the acyclic amide compound are hydrogen bonded (B), so that the cyclic amide compound is non-cyclic amide compound. It is believed that a network of relatively uniform components crosslinked by covalent interactions is constructed.

  Therefore, in a flux containing a thixotropic agent composed of a cyclic amide compound and an acyclic amide compound, excessive precipitation of the thixotropic agent is suppressed and thixotropic properties are excellent as compared with a thixotropic agent composed of an acyclic amide compound. Further, a solder paste made of a metal powder and a flux containing a thixotropic agent composed of a cyclic amide compound and an acyclic amide compound is excellent in printability, suppresses printing sag, and further suppresses heat sag.

  The cyclic amide compound and the non-cyclic amide compound are represented as [n + n] type, where n is the number of carboxylic acids and n is the number of amines. The cyclic amide compound is constructed from [1 + 1] type to [n + n] type, preferably [1 + 1] type to [3 + 3] type, particularly preferably [2 + 2] type. FIG. 5 shows an example of the [2 + 2] type in which dicarboxylic acid and diamine are cyclically condensed, and the cyclic amide compound is preferably [2 + 2] type in which dicarboxylic acid and diamine are cyclically condensed.

  The cyclic amide compound is a [2 + 2] type in which tricarboxylic acid and diamine are polycondensed cyclically, and one of the functional groups of tricarboxylic acid is in an unbonded state with other compounds. Examples include [2 + 3] type in which a cyclic polycondensation forms a cage structure, and [3 + 2] type in which a dicarboxylic acid and triamine are polycondensed into a cage structure to form a cage structure.

  Thus, the cyclic amide compound includes an amide oligomer obtained by cyclic polycondensation of dicarboxylic acid and diamine, an amide oligomer obtained by cyclic polycondensation of tricarboxylic acid and diamine, an amide oligomer obtained by cyclic polycondensation of dicarboxylic acid and triamine, and tricarboxylic acid. Amide oligomer obtained by cyclic polycondensation of triamine, amide oligomer obtained by cyclic polycondensation of dicarboxylic acid and tricarboxylic acid and diamine, amide oligomer obtained by cyclic polycondensation of dicarboxylic acid and tricarboxylic acid and triamine, dicarboxylic acid, diamine and triamine are cyclic Any of amide oligomers polycondensed to amides, amide oligomers obtained by cyclic polycondensation of tricarboxylic acid with diamine and triamine, and amide oligomers obtained by cyclic polycondensation of dicarboxylic acid and tricarboxylic acid with diamine and triamine It may be.

  Further, the acyclic amide compound is an amide compound in which a monocarboxylic acid and a diamine and / or triamine are acyclic polycondensed, and a dicarboxylic acid and / or a tricarboxylic acid and a monoamine are acyclic polycondensed. In some cases, when the amide compound contains a monocarboxylic acid or a monoamine, the monocarboxylic acid and the monoamine function as terminal molecules, resulting in an acyclic amide oligomer having a reduced molecular weight. The acyclic amide compound becomes an acyclic polymer amide polymer when it is an amide compound part in which dicarboxylic acid and / or tricarboxylic acid and diamine and / or triamine are non-cyclically polycondensed. Furthermore, the acyclic amide compound also includes an amide compound in which a monocarboxylic acid and a monoamine are condensed non-cyclically.

  The reason why an amide compound in which a monocarboxylic acid and a monoamine are condensed non-cyclically can form a network will be described below.

  7 is a schematic diagram showing an outline of the molecular structure of a monocarboxylic acid, FIG. 8 is a schematic diagram showing an outline of the molecular structure of a monoamine, and FIG. 9 is a molecule of an acyclic amide compound in which a monocarboxylic acid and a monoamine are condensed. It is a schematic diagram which shows the outline | summary of a structure.

The carboxyl group (COOH) of the monocarboxylic acid shown in FIG. 7 and the amino group (NH ₂ ) of the monoamine shown in FIG. 8 are amide-bonded by condensation to form the acyclic amide compound shown in FIG. Further, the hydrogen (H) and oxygen (O) of the amide group C (═O) —NH of the acyclic amide compound are connected by hydrogen bonding between molecules. The amide bond site in the molecule of the acyclic amide compound is indicated by (A), and the hydrogen bond site between the molecules of the acyclic amide compound is indicated by (B).

  Thus, monoamides (monoamides) having one amide group in the molecule are connected by hydrogen bonds. This aggregate of monoamides due to hydrogen bonding is treated as a supramolecule. A supramolecule refers to a collection of molecules constructed from non-covalent interactions such as hydrogen bonds and hydrophobic interactions. Hydrogen bonds show strong interactions and become a stable structure.

  Acyclic amide compounds, which are monoamides condensed with monocarboxylic acids and monoamines, are linked by hydrogen bond interactions derived from amide bonds, and in addition, molecular chains connected by hydrogen bond interactions, especially main chain amides. A cross-linked site is formed by a hydrogen bond derived from a bond or an interaction between molecular chains by a hydrophobic interaction by a side chain, and grows into a three-dimensional network.

  As described above, it can be seen that a non-cyclic amide compound obtained by condensing a monocarboxylic acid and a monoamine has only one amide group, but can form a network by bonding by a non-covalent interaction by a hydrogen bond.

  The cyclic amide compound contained as a thixotropic agent is an amide compound obtained by cyclic polycondensation of dicarboxylic acid and / or tricarboxylic acid and diamine and / or triamine, and has two or more amide groups.

  Thereby, when a cyclic amide compound is added to the thixotropic agent, an acyclic amide compound that is an aggregate of monoamides connected by an interaction by hydrogen bonding is connected via the cyclic amide compound.

  In a solder paste using a flux in which the thixotropic agent includes a cyclic amide compound and an acyclic amide compound, thixotropic properties are considered to be imparted by forming a network between the cyclic amide compound and the acyclic amide compound.

  However, if the content of the cyclic amide compound and the non-cyclic amide compound is too small, a sufficient network cannot be formed, so that thixotropy is not imparted.

  On the other hand, in a thixotropic agent that does not contain a cyclic amide compound or has a cyclic amide compound content less than that specified in the present invention, if the acyclic amide compound is excessive, the intramolecular and intermolecular amounts of the acyclic amide compound In this case, the particles are excessively interacted with each other, and aggregation / precipitation is likely to occur.

  As a result, the rheological properties as a flux are impaired (the printability due to crystal precipitation is poor), and the density of the thixotropic agent is low at the portion where the aggregate is not formed, and the thixotropic agent is substantially insufficient as described above. It is considered that it becomes impossible to demonstrate the effect.

  On the other hand, dicarboxylic acid and / or tricarboxylic acid, cyclic amide compound in which diamine and / or triamine are polycondensed cyclically, monocarboxylic acid, dicarboxylic acid and / or tricarboxylic acid, monoamine, diamine and / or triamine By using together a non-cyclic condensed amide compound with a content specified in the present invention, the non-cyclic amide compound is cross-linked with a non-covalent bond with the cyclic amide compound, and is relatively uniform. A network of thixotropic agent components can be constructed to suppress excessive thixotropic agent precipitation. As long as the content of the cyclic amide compound and the non-cyclic amide compound is within the range specified by the present invention, the effect of combining the cyclic amide compound and the non-cyclic amide compound is that even if the molecular weight of the non-cyclic amide compound is 3000 or less. It is also demonstrated at over 3000.

  In addition, if the ratio of the total number of moles of the carboxyl group of dicarboxylic acid and / or tricarboxylic acid to the total number of moles of the amino group of diamine and / or triamine is 1: 1, the acyclic amide compound has a maximum molecular weight. Become. On the other hand, if the ratio of the total number of moles of carboxyl groups of dicarboxylic acid and / or tricarboxylic acid to the total number of moles of amino groups of diamine and / or triamine is 1: m or m: 1 (m> 1). It becomes an acyclic amide oligomer having a small molecular weight. Preferably it is 1: 2 to 2: 1.

  In the cyclic amide compound, the dicarboxylic acid and the tricarboxylic acid have 3 to 10 carbon atoms, and the dicarboxylic acid and the tricarboxylic acid have 6 to 10 carbon atoms.

  Moreover, as for a cyclic amide compound, it is more preferable that carbon number of diamine and a triamine is 2 or more and 54 or less, and carbon number of a diamine and a triamine is 6.

  Further, in the acyclic amide compound, the monocarboxylic acid, dicarboxylic acid and tricarboxylic acid preferably have 2 to 28 carbon atoms, and the monocarboxylic acid, dicarboxylic acid and tricarboxylic acid preferably have 2 or more carbon atoms. 18 or less, more preferably 2 or more and 10 or less, and still more preferably 6 or more and 10 or less. The acyclic amide compound preferably has 0 to 54 carbon atoms of monoamine, diamine and triamine, more preferably 0 to 18 carbon atoms, still more preferably 0 to 10 carbon atoms. More preferably, it is 6 or more and 10 or less.

  Examples of the dicarboxylic acid in the cyclic amide compound and the non-cyclic amide compound include adipic acid having 6 carbon atoms and sebacic acid having 10 carbon atoms.

  The dicarboxylic acid in the cyclic amide compound and the non-cyclic amide compound is malonic acid having 3 carbon atoms, succinic acid having 4 carbon atoms, glutaric acid having 5 carbon atoms, pimelic acid having 7 carbon atoms, suberic acid having 8 carbon atoms, Examples thereof include aliphatic dicarboxylic acids such as azelaic acid having 9 carbon atoms and cyclohexanedicarboxylic acid having 8 carbon atoms, and aromatic dicarboxylic acids such as phthalic acid having 6 carbon atoms and terephthalic acid having 6 carbon atoms.

  Furthermore, examples of the tricarboxylic acid in the cyclic amide compound and the non-cyclic amide compound include cyclohexane tricarboxylic acid having 9 carbon atoms and benzene tricarboxylic acid having 9 carbon atoms.

  In addition, the monocarboxylic acid in the acyclic amide compound includes acetic acid having 2 carbon atoms, palmitic acid having 16 carbon atoms, stearic acid having 18 carbon atoms, 12-hydroxystearic acid having 18 carbon atoms, behenic acid having 22 carbon atoms, carbon Examples include montanic acid of formula 28.

  Examples of the diamine in the cyclic amide compound and the non-cyclic amide compound include 1,6-hexanediamine.

  The diamines in the cyclic amide compound and the non-cyclic amide compound are ethylene diamine having 2 carbon atoms, 1,3-diaminopropane having 3 carbon atoms, 1,4-diaminobutane having 4 carbon atoms, dimer diamine having 36 carbon atoms, carbon Examples thereof include phenylenediamine having 6 carbon atoms, metaxylylenediamine having 8 carbon atoms, paraxylylenediamine having 8 carbon atoms, and 2,4-diaminotoluene having 8 carbon atoms.

  Furthermore, examples of the triamine in the cyclic amide compound and the non-cyclic amide compound include a triaminocyclohexane having 6 carbon atoms and a trimeric triamine having 54 carbon atoms.

  Examples of the monoamine in the acyclic amide compound include ammonia having 0 carbon atoms, ethylamine having 2 carbon atoms, hexylamine having 6 carbon atoms, octylamine having 8 carbon atoms, and stearylamine having 18 carbon atoms.

  Examples of the [1 + 1] type acyclic amide compound in which monocarboxylic acid and monoamine are condensed include stearic acid amide (molecular weight 283.49), p-toluamide (molecular weight 135.17), and the like. Examples of the [1 + 1] type acyclic amide compound in which monocarboxylic acid and diamine are condensed include ethylenediamine monostearic acid amide (molecular weight: 326.56).

  [2 + 1] type acyclic amide compounds in which monocarboxylic acid and diamine are condensed include ethylenediamine bisstearic acid amide (molecular weight 593.02), ethylenediamine bispalmitic acid amide (molecular weight 536.9), metaxylylenediamine bisstearin. And acid amide (molecular weight: 669.11).

  Examples of the [1 + 2] type acyclic amide compound in which dicarboxylic acid and monoamine are condensed include succinic acid bisstearylamide (molecular weight 621.07), adipic acid bisstearylamide (molecular weight 649.12), sebacic acid bisstearylamide (molecular weight). 705.27) and the like.

  The acyclic amide compound may be substituted even by ring-opening polymerization of lactam, and examples thereof include 6-nylon obtained by ring-opening polymerization of ε-caprolactam and 12-nylon obtained by ring-opening polymerization of lauryl lactam.

  The flux according to the present embodiment is 0.1 wt% or more and 8.0 wt% or less of the cyclic amide compound described above as the thixotropic agent, more preferably 0.1 wt% or more and 1.5 wt% or less of the cyclic amide compound. 0.5 wt% or more and 8.0 wt% or less of the compound, more preferably 0.5 wt% or more and 4.0 wt% or less of the acyclic amide compound, and the total of the cyclic amide compound and the acyclic amide compound is 1.5 wt% % To 10.0 wt%.

  If the amount of the cyclic amide compound is less than 0.1 wt%, the thixotropy is deteriorated. Further, it is not possible to suppress printing sag and heating sag. On the other hand, when the amount of the cyclic amide compound is more than 8.0 wt%, the total amount of the amide-based thixotropic agent is increased, so that precipitation occurs in the flux and printability is deteriorated.

The flux of the present embodiment preferably contains an ester compound as a thixotropic agent, and contains 0 wt% or more and 8.0 wt% or less, more preferably 0 wt% or more and 4.0 wt% or less of the ester compound.
As an ester compound, castor hydrogenated oil etc. are mentioned, for example.

  The flux of this Embodiment contains the compound represented by following General formula (1) as a specific activator.

［式（１）中、Ｒ^１、Ｒ^２、Ｒ^３及びＲ^４は、それぞれ独立に、水素原子または炭素数１〜４のアルキル基を示す。］

[In Formula (1), R < ¹ >, R < ² >, R < ³ > and R < ⁴ > show a hydrogen atom or a C1-C4 alkyl group each independently. ]

In Formula ^{(1), R 1, R} 2, R 3 and ^{R 4} each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. Examples of the alkyl group having 1 to 4 carbon atoms include a methyl group, an ethyl group, a propyl group, a cyclopropyl group, a butyl group, and a cyclobutyl group. Among them, R ¹ , R ² , R ³ and R ⁴ are preferably a hydrogen atom, a methyl group, an ethyl group or a cyclopropyl group, more preferably a hydrogen atom or a methyl group, and a hydrogen atom. Is particularly preferred. R ¹ , R ² , R ³ and R ⁴ may be the same or different.

Examples of the compound represented by the general formula (1) include picolinic acid, 6-methylpicolinic acid, 6-ethylpicolinic acid, 3-cyclopropylpicolinic acid, 4-cyclopropylpicolinic acid, 6-cyclopropylpicolinic acid, Examples include 5-butylpicolinic acid and 6-cyclobutylpicolinic acid. Among these, picolinic acid is particularly preferable.
The compound represented by General formula (1) may be used individually by 1 type, and 2 or more types may be mixed and used for it.

  The flux of the present embodiment preferably contains 0.5 wt% or more and 7 wt% or less of the compound represented by the general formula (1), more preferably 1.0 wt% of the compound represented by the general formula (1). % To 5.0 wt%.

  Examples of the rosin include raw material rosins such as gum rosin, wood rosin and tall oil rosin, and derivatives obtained from the raw rosin. Examples of the derivatives include purified rosin, hydrogenated rosin, disproportionated rosin, polymerized rosin, acid-modified rosin, phenol-modified rosin, and α, β-unsaturated carboxylic acid-modified products (acrylated rosin, maleated rosin, fumarized). Rosin, etc.), and purified, hydride and disproportionate of the polymerized rosin, and purified, hydride and disproportionate of the modified α, β unsaturated carboxylic acid, etc. Two or more types can be used.

  The flux of the present embodiment preferably contains 30 wt% or more and 60 wt% or less of rosin, and more preferably contains 35 wt% or more and 60 wt% or less of rosin.

  Examples of the solvent include water, alcohol solvents, glycol ether solvents, terpineols and the like. As alcohol solvents, isopropyl alcohol, 1,2-butanediol, isobornylcyclohexanol, 2,4-diethyl-1,5-pentanediol, 2,2-dimethyl-1,3-propanediol, 2,5 -Dimethyl-2,5-hexanediol, 2,5-dimethyl-3-hexyne-2,5-diol, 2,3-dimethyl-2,3-butanediol, 1,1,1-tris (hydroxymethyl) Ethane, 2-ethyl-2-hydroxymethyl-1,3-propanediol, 2,2′-oxybis (methylene) bis (2-ethyl-1,3-propanediol), 2,2-bis (hydroxymethyl) -1,3-propanediol, 1,2,6-trihydroxyhexane, bis [2,2,2-tris (hydroxymethyl) ethyl] ate 1-ethynyl-1-cyclohexanol, 1,4-cyclohexanediol, 1,4-cyclohexanedimethanol, erythritol, threitol, guaiacol glycerol ether, 3,6-dimethyl-4-octyne-3,6-diol, 2,4,7,9-tetramethyl-5-decyne-4,7-diol and the like. Glycol ether solvents include hexyl diglycol, diethylene glycol mono-2-ethylhexyl ether, ethylene glycol monophenyl ether, 2-methylpentane-2,4-diol, diethylene glycol monohexyl ether, diethylene glycol dibutyl ether, triethylene glycol monobutyl ether And tetraethylene glycol monomethyl ether.

  The flux of the present embodiment may further contain an organic acid (excluding the compound represented by the general formula (1)), an amine, and a halogen (an organic halogen compound, an amine hydrohalide). The flux of the present embodiment preferably contains 0 wt% or more and 10 wt% or less of an organic acid. The flux of the present embodiment preferably contains 0 wt% or more and 20 wt% or less of amine, and more preferably contains 0 wt% or more and 5 wt% or less of amine. The flux of the present embodiment preferably contains 0 wt% or more and 5 wt% or less of an organic halogen compound as halogen, and preferably contains 0 wt% or more and 2 wt% or less of an amine hydrohalide.

  Examples of organic acids (excluding compounds represented by the general formula (1)) include glutaric acid, adipic acid, azelaic acid, eicosandioic acid, citric acid, glycolic acid, succinic acid, salicylic acid, diglycolic acid, dipicolinic acid, Dibutylaniline diglycolic acid, suberic acid, sebacic acid, thioglycolic acid, terephthalic acid, dodecanedioic acid, parahydroxyphenylacetic acid, phenylsuccinic acid, phthalic acid, fumaric acid, maleic acid, malonic acid, lauric acid, benzoic acid, Tartaric acid, isocyanuric acid tris (2-carboxyethyl), glycine, 1,3-cyclohexanedicarboxylic acid, 2,2-bis (hydroxymethyl) propionic acid, 2,2-bis (hydroxymethyl) butanoic acid, 2,3- Dihydroxybenzoic acid, 2,4-diethylglutaric acid, 2-quinolinecarboxylic acid, - hydroxybenzoic acid, malic acid, p- anisic acid, stearic acid, 12-hydroxystearic acid, oleic acid, linoleic acid, and linolenic acid.

  Examples of the organic acid include dimer acid, trimer acid, hydrogenated dimer acid which is a hydrogenated product obtained by adding hydrogen to dimer acid, and hydrogenated trimer acid which is a hydrogenated product obtained by adding hydrogen to trimer acid.

  For example, dimer acid which is a reaction product of oleic acid and linoleic acid, trimer acid which is a reaction product of oleic acid and linoleic acid, dimer acid which is a reaction product of acrylic acid, trimer acid which is a reaction product of acrylic acid, methacrylic acid Dimer acid, which is a reaction product of dimer acid, trimer acid which is a reaction product of methacrylic acid, dimer acid which is a reaction product of acrylic acid and methacrylic acid, trimer acid which is a reaction product of acrylic acid and methacrylic acid, and a reaction product of oleic acid A dimer acid, a reaction product of oleic acid, a trimer acid, a reaction product of linoleic acid, a dimer acid, a reaction product of linoleic acid, a trimer acid, a reaction product of linolenic acid, a dimer acid, a reaction product of linolenic acid A trimer acid, a dimer acid that is a reaction product of acrylic acid and oleic acid, a trimer acid that is a reaction product of acrylic acid and oleic acid, Dimer acid that is a reaction product of rillic acid and linoleic acid, trimer acid that is a reaction product of acrylic acid and linoleic acid, dimer acid that is a reaction product of acrylic acid and linolenic acid, trimer that is a reaction product of acrylic acid and linolenic acid Dimer acid that is a reaction product of acid, methacrylic acid and oleic acid, trimer acid that is a reaction product of methacrylic acid and oleic acid, dimer acid that is a reaction product of methacrylic acid and linoleic acid, and a reaction product of methacrylic acid and linoleic acid Dimer acid, which is a reaction product of some trimer acid, methacrylic acid and linolenic acid, Trimer acid which is a reaction product of methacrylic acid and linolenic acid, Dimer acid which is a reaction product of oleic acid and linolenic acid, Reaction of oleic acid and linolenic acid Trimer acid that is a product, dimer acid that is a reaction product of linoleic acid and linolenic acid, and a reaction product of linoleic acid and linolenic acid Trimer acid that, hydrogenated dimer acid which is a hydrogenation product of the dimer acid as described above, hydrogenated trimer acid, and the like are hydrogenated products of the trimer acid described above.

  Examples of amines include monoethanolamine, diphenylguanidine, ditolylguanidine, ethylamine, triethylamine, cyclohexylamine, ethylenediamine, triethylenetetramine, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, and 1,2-dimethyl. Imidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methyl Imidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl 2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine 2,4-diamino-6- [2'-undecylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2'-ethyl-4'-methylimidazolyl- ( 1 ′)]-ethyl-s-triazine, 2,4-diamino-6- [2′-methylimidazolyl- (1 ′)]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro 1H-pyrrolo [1,2-a] benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, 2-phenylimidazoline, 2,4-diamino-6-vinyl-s- Triazine, 2,4-diamino-6-vinyl-s-triazine isocyanuric acid adduct, 2,4-diamino-6-methacryloyloxyethyl-s-triazine, epoxy-imidazole adduct, 2-methylbenzimidazole, 2-octyl Benzimidazole, 2-pentylbenzimidazole, 2- (1-ethylpentyl) benzimidazole, 2-nonylbenzimidazole, 2- (4-thiazolyl) benzimidazole, benzimidazole, 2- (2′-hydroxy-5′-) Methylphenyl) benzotriazole 2- (2′-hydroxy-3′-tert-butyl-5′-methylphenyl) -5-chlorobenzotriazole, 2- (2′-hydroxy-3 ′, 5′-di-tert-amylphenyl) Benzotriazole, 2- (2′-hydroxy-5′-tert-octylphenyl) benzotriazole, 2,2′-methylenebis [6- (2H-benzotriazol-2-yl) -4-tert-octylphenol], 6 -(2-benzotriazolyl) -4-tert-octyl-6'-tert-butyl-4'-methyl-2,2'-methylenebisphenol, 1,2,3-benzotriazole, 1- [N, N-bis (2-ethylhexyl) aminomethyl] benzotriazole, carboxybenzotriazole, 1- [N, N-bis (2-ethyl) Xyl) aminomethyl] methylbenzotriazole, 2,2 ′-[[(methyl-1H-benzotriazol-1-yl) methyl] imino] bisethanol, 1- (1 ′, 2′-dicarboxyethyl) benzotriazole , 1- (2,3-dicarboxypropyl) benzotriazole, 1-[(2-ethylhexylamino) methyl] benzotriazole, 2,6-bis [(1H-benzotriazol-1-yl) methyl] -4- Examples include methylphenol, 5-methylbenzotriazole, and 5-phenyltetrazole.

  Examples of the organic halogen compound include trans-2,3-dibromo-2-butene-1,4-diol, triallyl isocyanurate hexabromide, 1-bromo-2-butanol, 1-bromo-2-propanol, and 3-bromo. -1-propanol, 3-bromo-1,2-propanediol, 1,4-dibromo-2-butanol, 1,3-dibromo-2-propanol, 2,3-dibromo-1-propanol, 2,3- Dibromo-1,4-butanediol, 2,3-dibromo-1,4-butanediol, 2,3-dibromo-2-butene-1,4-diol, tris (2,3-dibromopropyl) isocyanurate, And chlorendic anhydride.

An amine hydrohalide is a compound obtained by reacting an amine with a hydrogen halide.
As the amine of the amine hydrohalide, the above-mentioned amines can be used, and examples include ethylamine, cyclohexylamine, ethylenediamine, triethylamine, diphenylguanidine, ditolylguanidine, methylimidazole, 2-ethyl-4-methylimidazole, and the like. It is done. Examples of the hydrogen halide include hydrides of chlorine, bromine, iodine and fluorine (hydrogen chloride, hydrogen bromide, hydrogen iodide, hydrogen fluoride). Further, a borofluoride may be included instead of the amine hydrohalide or together with the amine hydrohalide, and examples of the borofluoride include borohydrofluoric acid.
Examples of the amine hydrohalide include aniline hydrogen chloride, cyclohexylamine hydrogen chloride, aniline hydrogen bromide, diphenylguanidine hydrogen bromide, ditolylguanidine hydrogen bromide, ethylamine hydrogen bromide, and the like.

  The flux of the present embodiment may further contain an antioxidant, and examples of the antioxidant include hindered phenol-based antioxidants, and preferably contain 0 wt% or more and 5 wt% or less of the antioxidant. . The balance of the flux of the present embodiment is a solvent.

<Example of solder paste of this embodiment>
The solder paste of the present embodiment contains the above-described flux and metal powder.
The metal powder is preferably a solder that does not contain Pb, and is a powder of Sn alone, or Sn—Ag, Sn—Cu, Sn—Ag—Cu, Sn—Bi, Sn—In. It is composed of a solder alloy powder obtained by adding Sb, Bi, In, Cu, Zn, As, Ag, Cd, Fe, Ni, Co, Au, Ge, P, or the like to these alloys.

  The solder alloy has As: 25 mass ppm to 300 mass ppm, Sb: more than 0 mass ppm to 3000 mass ppm, Bi: more than 0 mass ppm to 10000 mass ppm, and Pb: more than 0 mass ppm to less than 5100 mass ppm. It is preferable to have an alloy composition composed of at least one of them and the balance (Bal) of Sn. The solder alloy may further contain at least one of Ag: 0% by mass to 4% by mass and Cu: 0% by mass to 0.9% by mass.

  As is an element that can suppress the change with time of the viscosity of the solder paste. It is presumed that As has a low reactivity with the flux and can exhibit a thickening suppressing effect because it is a noble element with respect to Sn. The lower limit of the As content is, for example, 25 ppm by mass or more, preferably 50 ppm by mass or more, and more preferably 100 ppm by mass or more. On the other hand, when there is too much As, the wettability of the solder alloy deteriorates. The upper limit of As content is 300 mass ppm or less, for example, Preferably it is 250 mass ppm or less, More preferably, it is 200 mass ppm or less.

  Sb is an element that has low reactivity with the flux and exhibits a thickening suppressing effect. When the solder alloy contains Sb, the lower limit of the Sb content is, for example, more than 0 ppm by mass, preferably 25 ppm by mass or more, more preferably 50 ppm by mass or more, and further preferably 100 ppm by mass or more. Especially preferably, it is 300 mass ppm or more. On the other hand, when there is too much Sb content, the wettability of a solder alloy will deteriorate, Therefore It is necessary to make it moderate content. The upper limit of Sb content is 3000 mass ppm or less, for example, Preferably it is 1150 mass ppm or less, More preferably, it is 500 mass ppm or less.

  Bi and Pb are elements that have a low reactivity with the flux and exhibit a thickening suppressing effect, as in Sb. Bi and Pb are elements that can suppress the deterioration of the wettability of the solder alloy by As in order to lower the liquidus temperature of the solder alloy and reduce the viscosity of the molten solder.

  If at least one element of Sb, Bi, and Pb exists, deterioration of the wettability of the solder alloy by As can be suppressed. When the solder alloy contains Bi, the lower limit of the Bi content is, for example, more than 0 ppm by mass, preferably 25 ppm by mass or more, more preferably 50 ppm by mass or more, and further preferably 75 ppm by mass or more. And is particularly preferably 100 ppm by mass or more, and most preferably 250 ppm by mass or more. When the solder alloy contains Pb, the lower limit of the Pb content is, for example, more than 0 ppm by mass, preferably 25 ppm by mass or more, more preferably 50 ppm by mass or more, and further preferably 75 ppm by mass or more. And is particularly preferably 100 ppm by mass or more, and most preferably 250 ppm by mass or more.

  On the other hand, if the content of these elements is too large, the solidus temperature is remarkably lowered, so that ΔT, which is the temperature difference between the liquidus temperature and the solidus temperature, becomes too wide. If ΔT is too wide, a liquid phase Bi or Pb is concentrated because a high melting point crystal phase with a small content of Bi or Pb is precipitated in the solidification process of the molten solder. Thereafter, when the temperature of the molten solder further decreases, a low melting point crystal phase having a high concentration of Bi or Pb is segregated. For this reason, the mechanical strength and the like of the solder alloy are deteriorated, and the reliability is inferior. In particular, since the crystal phase with a high Bi concentration is hard and brittle, the segregation in the solder alloy significantly reduces the reliability.

  From such a viewpoint, when the solder alloy contains Bi, the upper limit of the Bi content is, for example, 10000 mass ppm or less, preferably 1000 mass ppm or less, more preferably 600 mass ppm or less, Preferably it is 500 mass ppm or less. When the solder alloy contains Pb, the upper limit of the Pb content is, for example, 5100 mass ppm or less, preferably 5000 mass ppm or less, more preferably 1000 mass ppm or less, and even more preferably 850 mass ppm or less. And particularly preferably 500 ppm by mass or less.

  It is preferable that the solder alloy satisfies the following formula (1).

275 ≦ 2As + Sb + Bi + Pb (1)
In said numerical formula (1), As, Sb, Bi, and Pb represent content (mass ppm) in an alloy composition, respectively.

  As, Sb, Bi, and Pb are all elements that exhibit a thickening suppressing effect. The total of these is preferably 275 ppm by mass or more. The reason why the As content is doubled in the mathematical formula (1) is that As has a higher viscosity suppressing effect than Sb, Bi, and Pb.

  The lower limit of the mathematical formula (1) is preferably 350 or more, and more preferably 1200 or more. On the other hand, the upper limit of the formula (1) is not particularly limited from the viewpoint of the thickening suppression effect, but is preferably 25200 or less, more preferably 10200 or less from the viewpoint of setting ΔT to a suitable range. More preferably, it is 5300 or less, and particularly preferably 3800 or less.

  The following formula (1a) and formula (1b) are obtained by appropriately selecting the upper limit and the lower limit from the above preferred embodiments.

275 ≦ 2As + Sb + Bi + Pb ≦ 25200 (1a)
275 ≦ 2As + Sb + Bi + Pb ≦ 5300 (1b)
In said numerical formula (1a) and numerical formula (1b), As, Sb, Bi, and Pb represent content (mass ppm) in an alloy composition, respectively.

  Moreover, it is preferable that a solder alloy satisfy | fills following Numerical formula (2).

0.01 ≦ (2As + Sb) / (Bi + Pb) ≦ 10.00 (2)
In said numerical formula (2), As, Sb, Bi, and Pb represent content (mass ppm) in an alloy composition, respectively.

  If the content of As and Sb is large, the wettability of the solder alloy deteriorates. On the other hand, Bi and Pb suppress the deterioration of the wettability of the solder alloy due to containing As, but if the content is too large, ΔT increases. In particular, in an alloy composition containing Bi and Pb simultaneously, ΔT tends to increase. In view of these, if the content of Bi and Pb is increased to excessively improve the wettability of the solder alloy, ΔT spreads. On the other hand, if the content of As or Sb is increased to improve the thickening suppressing effect, the wettability of the solder alloy is deteriorated. Therefore, it is divided into the group of As and Sb and the group of Bi and Pb, and when the total amount of both groups is within an appropriate predetermined range, the thickening suppression effect, the narrowing of ΔT, and the wettability of the solder alloy Everything is satisfied at the same time.

  If the numerical formula (2) is less than 0.01, the total content of Bi and Pb is relatively larger than the total content of As and Pb, and therefore ΔT spreads. The lower limit of the mathematical formula (2) is preferably 0.02 or more, more preferably 0.41 or more, further preferably 0.90 or more, particularly preferably 1.00 or more, and most preferably. 1.40 or more. On the other hand, when the numerical formula (2) exceeds 10.00, the sum of the contents of As and Sb becomes relatively larger than the sum of the contents of Bi and Pb, so that the wettability of the solder alloy is deteriorated. The upper limit of the mathematical formula (2) is preferably 5.33 or less, more preferably 4.50 or less, further preferably 2.67 or less, and particularly preferably 2.30 or less.

  Note that the denominator of the formula (2) is “Bi + Pb”, and the formula (2) is not established unless these are included. Therefore, the solder alloy preferably contains at least one of Bi and Pb. As described above, the alloy composition not containing Bi and Pb is inferior in the wettability of the solder alloy.

  What appropriately selected the upper limit and the lower limit from the above preferred embodiments is the following mathematical formula (2a).

0.31 ≦ (2As + Sb) / (Bi + Pb) ≦ 10.00 (2a)
In said numerical formula (2a), As, Sb, Bi, and Pb represent content (mass ppm) in an alloy composition, respectively.

Ag is an optional element that can improve the reliability of the solder alloy by forming Ag ₃ Sn at the crystal interface. Further, Ag is an element having an ionization coefficient that is noble with respect to Sn, and coexists with As, Pb, and Bi, thereby promoting these thickening suppressing effects. The Ag content is preferably 0% by mass to 4% by mass, more preferably 0.5% by mass to 3.5% by mass, and further preferably 1.0% by mass to 3.0% by mass. It is as follows.

  Cu is an optional element that can improve the joint strength of the solder joint. Further, Cu is an element having an ionization coefficient that is noble with respect to Sn, and coexists with As, Pb, and Bi, thereby promoting these thickening suppressing effects. The Cu content is preferably 0% by mass to 0.9% by mass, more preferably 0.1% by mass to 0.8% by mass, and still more preferably 0.2% by mass to 0.7% by mass. It is below mass%.

  The balance (Bal) of the solder alloy is preferably Sn. The solder alloy may contain inevitable impurities in addition to the aforementioned elements. Even when inevitable impurities are contained, the above-mentioned effects are not affected. If the content of In is too large, ΔT spreads, so if it is 1000 ppm by mass or less, the above effect is not affected.

<Examples of effects of flux and solder paste of this embodiment>
In a flux containing a thixotropic agent, a compound represented by the general formula (1), rosin, and a solvent, and the thixotropic agent includes a cyclic amide compound and an acyclic amide compound, the thixotropic agent is changed from an acyclic amide compound. Compared to the case, the thixotropy can be improved without increasing the content of the acyclic amide compound, and precipitation of the thixotropic agent can be suppressed. In addition, high solder wettability can be expressed. With the solder paste using this flux, it is possible to obtain good printability in which bleeding, blurring and the like are suppressed, and it is possible to suppress printing sag through which the solder paste after printing flows. Furthermore, the heating sag of the solder paste due to heating during soldering can be suppressed.

  EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited by these examples.

The fluxes of Examples and Comparative Examples are prepared with the compositions shown in Table 1, Table 2, Table 3, Table 4, Table 5, Table 6, Table 7, Table 8, and the solder paste is prepared using this flux. Thus, the thixotropy of the flux, the ability to suppress the solder paste printing sag, the printability, the ability to suppress heat sag, and the wetting speed were verified.
In addition, the composition rate in Table 1, Table 2, Table 3, Table 4, Table 5, Table 6, Table 7, and Table 8 is wt (mass)% when the total amount of flux is 100.

  The solder paste has a flux of 11 wt% and metal powder of 89 wt%. Further, the metal powder in the solder paste is a Sn—Ag—Cu solder alloy in which Ag is 3.0 wt%, Cu is 0.5 wt%, and the balance is Sn, and the average particle size of the metal powder is φ20 μm. It is.

<Evaluation of flux thixotropy>
(1) Verification method The thixotropy was evaluated using a spiral viscometer in accordance with JIS Z3284-3 4.2. The rotation speed of the viscometer was set to 3 rpm and 30 rpm, the viscosity after rotation for a predetermined time was read, and the thixo ratio was calculated.

(2) Criteria ○ ○: Thixo ratio is 0.60 or more ○: Thixo ratio is 0.30 or more and less than 0.60 ×: Thixo ratio is less than 0.30

<Evaluation of printing sag suppression ability of solder paste>
(1) Verification method The evaluation of the ability to suppress the printing sag of the solder paste is based on JIS Z3284-3 4.3, using a stainless steel metal mask in which the solder paste printing part is formed with a predetermined pattern on the copper plate. After the paste is printed and the metal mask is removed, it is stored at room temperature 25 ± 5 ° C. and relative humidity 50 ± 10% for 10-20 minutes. Of the printed patterns, all the printed solder pastes are not integrated. The minimum spacing was confirmed visually. The thickness of the metal mask is 0.2 mm, the solder paste printing part is a rectangular opening, and the size is 3.0 × 1.5 mm. In the solder paste printing section, a plurality of openings of the same size are arranged at different intervals, and the interval L of the openings is 0.2-0.3-0.4-0.5-0.6-0.7- 0.8-0.9-1.0-1.1-1.2 mm.

(2) Criteria ◯: Minimum interval that does not become integrated after printing is 0.2 mm or less ×: Minimum interval that does not become integrated after printing exceeds 0.2 mm

<Evaluation of printability of solder paste>
(1) Verification method The evaluation of the printability of the solder paste is based on JIS Z3284-3 4.1, and the solder paste is applied to the copper plate using a stainless steel metal mask in which the solder paste printing part is formed in a predetermined pattern. After printing, it was visually confirmed whether there was any blur or blurring at the initial printing stage or during continuous printing.

(2) Judgment criteria 〇: No smearing or blurring after printing ×: Smearing or blurring after printing

<Evaluation of heat sag suppression ability of solder paste>
(1) Verification method The evaluation of the heat sag suppressing ability of the solder paste is based on JIS Z3284-3 4.4, and the solder is applied to the copper plate using a stainless steel metal mask in which the solder paste printing part is formed with a predetermined pattern. After the paste was printed and the metal mask was removed, heating was performed at 150 ± 10 ° C. for 10 minutes, and among the printed patterns, the minimum interval at which all the printed solder paste was not integrated was visually confirmed. The thickness of the metal mask is 0.2 mm, the solder paste printing part is a rectangular opening, and the size is 3.0 × 1.5 mm. In the solder paste printing section, a plurality of openings of the same size are arranged at different intervals, and the interval L of the openings is 0.2-0.3-0.4-0.5-0.6-0.7- 0.8-0.9-1.0-1.1-1.2 mm.

(2) Judgment criteria O: Minimum interval not integrated is 1.0 mm or less ×: Minimum interval not integrated is over 1.0 mm

<Evaluation of solder wettability (wetting speed)>
(1) Verification method The solder paste wetting rate is in accordance with the method of the meniscograph test. A copper plate having a width of 5 mm, a length of 25 mm, and a thickness of 0.5 mm is oxidized at 150 ° C. for 1 hour, and a copper oxide plate as a test plate. And Solder Checker SAT-5200 (manufactured by RHESCA) was used as a test apparatus, and Sn-3Ag-0.5Cu (each numerical value was mass%) was used as a solder.
First, 5 mm of the test plate was immersed in each of the fluxes of Examples 1 to 47 and Comparative Examples 1 to 5 measured in a beaker, and the flux was applied to the test plate. Subsequently, after applying the flux, the test plate on which the flux was applied was immediately immersed in a solder bath to obtain zero cross time (sec). Subsequently, five measurements were performed for each of the fluxes of Examples 1 to 47 and Comparative Examples 1 to 5, and the average value of the five obtained zero cross times (sec) was calculated. Test conditions were set as follows.
Immersion speed in solder bath: 5 mm / sec (JIS Z 3198-4)
Immersion depth in solder bath: 2 mm (JIS Z 3198-4)
Immersion time in solder bath: 10 sec (JIS Z 3198-4)
Solder bath temperature: 245 ° C. (JIS C 60068-2-54)
It means that the shorter the average value of the zero cross time (sec), the higher the wetting speed and the better the solder wettability.

(2) Criteria ○: The average value of zero cross time (sec) is 6 seconds or less.
X: The average value of zero crossing time (sec) exceeds 6 seconds.

<Comprehensive evaluation>
◯: Each evaluation of thixotropy of flux, printing sag suppression capability of solder paste, solder paste printing property, solder paste heating sag suppression capability, and wetting speed is ◯ or OO.
X: At least one of the evaluations of thixotropy of flux, printing sag suppressing ability of solder paste, printing ability of solder paste, heating sag suppressing ability of solder paste, and wetting speed is x.

  In the present invention, as shown in Example 1, sebacic acid, which is a dicarboxylic acid having 10 carbon atoms, and 1,6-hexanediamine, which is a diamine having 6 carbon atoms, are cyclically condensed as a thixotropic agent. A non-cyclic amide compound obtained by acyclic polycondensation of a cyclic amide compound, sebacic acid, which is a dicarboxylic acid having 10 carbon atoms, and 1,6-hexanediamine, which is a diamine having 6 carbon atoms, is defined in the present invention. By including within the range, it was possible to improve the thixotropy of the flux and suppress the precipitation of the thixotropic agent. In addition, by employing picolinic acid as the specific activator, the wetting speed was increased and the solder wettability could be improved. In addition, with the solder paste using this flux, it was possible to obtain good printability in which bleeding, blurring, and the like were suppressed, and it was possible to suppress printing sag through which the solder paste after printing flowed. Furthermore, the heating sag of the solder paste due to heating during soldering could be suppressed.

  Even if 7% by weight of picolinic acid is contained as in Example 2, the thixotropy of the flux, the ability to impart a high wetting rate, the ability to suppress the sag of the solder paste, the printability, and the ability to suppress heat sag are not inhibited. A sufficient effect was obtained. Furthermore, as in Example 3, containing 0.5 wt% picolinic acid and using an organic acid together, the thixotropy of the flux, the ability to impart a high wetting rate, the ability to suppress the printing sag of the solder paste, the printability, and the heating The ability to suppress sagging was not inhibited, and sufficient effects were obtained.

  As shown in Examples 4 to 6, containing picolinic acid as a specific active agent, and further changing the type or amount of the cyclic amide compound and the non-cyclic amide compound within the range defined by the present invention, Sufficient effects were obtained with respect to thixotropy, wetting speed, ability to suppress dripping of solder paste, printability, and ability to suppress dripping of heat.

  As shown in Examples 7 to 11, the thixotropy of the flux can be obtained by containing picolinic acid as a specific activator, further changing the type of organic acid, combining a plurality of types of organic acids, and changing the amount of organic acids. Sufficient effects were obtained with respect to the wetting speed, the ability to suppress printing sag of solder paste, the printability, and the ability to suppress heat sag.

  As shown in Examples 12 to 15, the thixotropy of the flux, the wetting speed, the printing sag of the solder paste can be obtained by combining picolinic acid as a specific active agent and further changing the type of rosin. Sufficient effects were obtained for suppression ability, printability, and heat sag suppression ability.

  As shown in Examples 16 to 17, it contains picolinic acid as a specific activator, and also contains an amine, so that the thixotropy of the flux, the wetting speed, the ability to suppress the printing sag of the solder paste, the printing property, and the heating sag. A sufficient effect on the inhibitory ability was obtained.

  As shown in Examples 18 to 19, containing picolinic acid as a specific activator, and further containing halogen, the flux thixotropy, wetting speed, solder paste printing sag suppressing ability, printability, heating sag A sufficient effect on the inhibitory ability was obtained.

  As shown in Example 20, containing picolinic acid as a specific activator, and further containing an antioxidant, the thixotropy of the flux, the wetting speed, the ability to suppress the sag of the solder paste, the printability, and the heat sag A sufficient effect on the inhibitory ability was obtained.

  As shown in Example 21, even if the amount of organic acid (excluding picolinic acid) is reduced by using picolinic acid as a specific activator and further using an amine, a halogen and an antioxidant together, the flux Sufficient effects were obtained with respect to the thixotropy, wetting speed, solder paste printing sag suppressing ability, printability, and heating sag suppressing ability.

  As shown in Examples 22 to 23, containing picolinic acid as a specific active agent, and further changing the amount of rosin, the thixotropy of the flux, the wetting speed, the ability to suppress the printing sag of the solder paste, and the printability A sufficient effect on the heat sag suppressing ability was obtained.

  As shown in Examples 24 to 28, the type of organic acid is changed by containing picolinic acid as a specific active agent and further containing an ester compound as a thixotropic agent within the range defined by the present invention. By combining multiple types of organic acids and changing the amount of organic acids, sufficient effects can be obtained for flux thixotropy, wetting speed, solder paste printing sag suppression, printability, and heat sag suppression. It was.

  As shown in Examples 29 to 32, the kind of rosin is changed by containing picolinic acid as a specific active agent and further containing an ester compound as a thixotropic agent within the range defined in the present invention. Even by combining multiple types of rosins, sufficient effects were obtained with respect to the flux thixotropy, wetting speed, solder paste printing sag suppression ability, printability, and heat sag suppression ability.

  As shown in Examples 33 to 34, it contains picolinic acid as a specific active agent, and further contains an ester compound as a thixotropic agent within the range defined in the present invention. Sufficient effects were obtained with respect to the thixotropy of the flux, the wetting speed, the ability to suppress the printing sag of the solder paste, the printing property, and the ability to suppress the heating sag.

  As shown in Example 35 to Example 36, picolinic acid is included as the specific active agent, and the ester compound is further included as a thixotropic agent within the range defined by the present invention. Sufficient effects were obtained with respect to the thixotropy of the flux, the wetting speed, the ability to suppress the printing sag of the solder paste, the printing property, and the ability to suppress the heating sag.

  As shown in Example 37, it contains picolinic acid as a specific active agent, and further contains an ester compound as a thixotropic agent within the range specified by the present invention, and further within the range specified by the present invention. By containing an antioxidant, sufficient effects were obtained with respect to the thixotropy of the flux, the wetting speed, the ability to suppress the printing sagging of the solder paste, the printability, and the heating sagging suppressing ability.

  As shown in Example 38, it contains picolinic acid as a specific active agent, further contains an ester compound as a thixotropic agent within the range specified in the present invention, and further contains an amine, a halogen, and an antioxidant. Therefore, even if the amount of organic acid (excluding picolinic acid) is reduced, sufficient effects can be obtained for the thixotropy of the flux, the wetting speed, the printing droop suppression ability of the solder paste, the printability, and the heating dripping suppression ability. It was.

  As shown in Examples 39 to 40, it contains picolinic acid as a specific active agent, and further contains an ester compound as a thixotropic agent within the range defined by the present invention, and further defined by the present invention. Even when the amount of rosin was changed within the above range, sufficient effects were obtained for the thixotropy of the flux, the wetting speed, the printing sag suppressing ability of the solder paste, the printing property, and the heating sag suppressing ability.

  As shown in Example 41, by containing picolinic acid as a specific active agent and further containing an ester compound as a thixotropic agent within the range defined by the present invention, even if the amount of the ester compound is reduced, the thixotrope of the flux Sufficient effects were obtained with respect to the properties, wetting speed, printing sag suppression ability of solder paste, printability, and heating sag suppression ability.

As shown in Examples 42 to 44, picolinic acid is contained as a specific active agent within the range defined by the present invention, and further, an ester compound is contained as a thixotropic agent within the range defined by the present invention. By increasing the amount of ester compound and reducing the amount of non-cyclic amide compounds, sufficient effects can be obtained on the thixotropy of the flux, the wetting speed, the printing sag suppressing ability of the solder paste, the printing ability, and the heating sag suppressing ability. It was.
Furthermore, it was heated from 25 ° C. to 250 ° C. at 1 ° C./sec by N ₂ reflow, then ultrasonically cleaned in a beaker with a solvent, and then dried and visually confirmed that there was no flux residue and cleaning. Sex was obtained.

  As shown in Example 45, containing picolinic acid as a specific active agent, containing 0.1 wt% of a cyclic amide compound at the lower limit within the range defined by the present invention, and a non-cyclic amide compound defined by the present invention. Within a range, the total of the cyclic amide compound and the non-cyclic amide compound is within the range defined by the present invention, and within the range defined by the present invention, the ester compound is included as a thixotropic agent, Sufficient effects were obtained with respect to the thixotropy of the flux, the wetting speed, the ability to suppress the printing sag of the solder paste, the printing property, and the ability to suppress the heating sag.

  As shown in Example 46, picolinic acid was included as the specific active agent, the cyclic amide compound was increased from the lower limit within the range defined by the present invention to contain 0.3 wt%, and the non-cyclic amide compound was Even if the content of the ester compound is reduced as compared with Example 45, the same amount of 2.5 wt% is included, and the total of the cyclic amide compound and the non-cyclic amide compound is within the range defined in the present invention. Sufficient effects were obtained with respect to thixotropy, wetting speed, ability to suppress dripping of solder paste, printability, and ability to suppress dripping of heat.

  As in Example 47, containing picolinic acid as a specific active agent, containing 0.3 wt% of the cyclic amide compound as in Example 46, and containing 8% by weight of the non-cyclic amide compound within the range defined by the present invention. Even if the total of the cyclic amide compound and the non-cyclic amide compound is within the range specified in the present invention, the thixotropy of the flux, the wetting speed, and the printing of the solder paste are not included as a thixotropic agent. Sufficient effects were obtained for sagging suppression ability, printability, and heating sagging suppression ability.

  On the other hand, as shown in Comparative Example 1, the content of the acyclic amide compound is included in the present invention even when the cyclic amide compound is included as the thixotropic agent and the picolinic acid is included as the specific active agent within the range defined in the present invention. If the total of the cyclic amide compound and the non-cyclic amide compound is outside the range specified in the present invention, the effect on the wetting rate was obtained, but the thixotropy of the flux, the solder The effect was not acquired with respect to the printing droop suppression capability of a paste, printability, and heating droop suppression capability.

  In addition, as shown in Comparative Example 2, the cyclic amide compound may contain a cyclic amide compound and an acyclic amide compound as a thixotropic agent within the range specified in the present invention, and a picolinic acid as a specific active agent. When the total of the compound and the acyclic amide compound is outside the range specified in the present invention, an effect was obtained on the wetting speed, but the thixotropy of the flux, the ability to suppress the printing sag of the solder paste, and the printability No effect was obtained on the ability to suppress heat sag.

  Further, as shown in Comparative Example 3, if the thixotropic agent is not included as a thixotropic agent and picolinic acid is included as a specific active agent, but a non-cyclic amide compound is included outside the range defined by the present invention, the thixotropic agent of the flux is included. The effect was obtained with respect to the printing property, the wetting speed, the printing sag suppressing ability of the solder paste, and the heating sag suppressing ability, but the effect was not obtained with respect to the printability.

  In addition, as shown in Comparative Example 4, the thixotropic agent does not include a cyclic amide compound and an acyclic amide compound, and even if picolinic acid is included as a specific active agent, the ester compound should be included within the range specified in the present invention. Thus, effects were obtained on the thixotropy of the flux, the wetting speed, the printing droop suppression ability of the solder paste, and the printability, but no effect was obtained on the heating dripping suppression ability.

  Further, as shown in Comparative Example 5, even if both a cyclic amide compound and a non-cyclic amide compound are contained as a thixotropic agent, and if picolinic acid is not included as a specific active agent, the thixotropy of the flux and the printing of the solder paste An effect was obtained with respect to sagging suppression capability, heating sagging suppression capability, and printability, but no effect was obtained with respect to the flux wetting rate.

  The thixotropic agent includes cyclic amide compounds and acyclic amide compounds using malonic acid, succinic acid, glutaric acid, pimelic acid, suberic acid, azelaic acid, cyclohexanedicarboxylic acid, phthalic acid or terephthalic acid as the dicarboxylic acid. Even in such a case, sufficient effects were obtained with respect to the thixotropy of the flux, the wetting speed, the printing sag suppressing ability of the solder paste, the printing property, and the heating sag suppressing ability.

  In addition, the thixotropic agent contains a cyclic amide compound and a non-cyclic amide compound using cyclohexanetricarboxylic acid, benzenetricarboxylic acid, etc. as tricarboxylic acid, so that the thixotropy of the flux, the wetting speed, the ability to suppress printing sag of the solder paste, printing Sufficient effects on heat resistance and heat sag suppression ability were obtained.

  Furthermore, thixotropic agents used ethylenediamine, 1,3-diaminopropane, 1,4-diaminobutane, dimer diamine, phenylenediamine, metaxylylenediamine, paraxylylenediamine, 2,4-diaminotoluene and the like as diamines. Even when the cyclic amide compound and the non-cyclic amide compound were included, sufficient effects were obtained with respect to the thixotropy of the flux, the wetting speed, the solder sag printing ability, the printability, and the heating sag inhibiting ability.

  In addition, the thixotropic agent also contains a cyclic amide compound and a non-cyclic amide compound using triaminocyclohexane, trimer triamine or the like as a triamine, so that the thixotropy of the flux, the wetting speed, the solder sag printing ability, the printability, A sufficient effect was obtained for the ability to suppress heating sag.

  Furthermore, even if the thixotropic agent contains an acyclic amide compound using acetic acid, palmitic acid, stearic acid, 12-hydroxystearic acid, behenic acid, montanic acid or the like as a monocarboxylic acid, the thixotropy of the flux, the wetting speed, Sufficient effects were obtained for the printing sag suppressing ability, printability, and heating sag suppressing ability of the solder paste.

  In addition, thixotropic agents also contain acyclic amide compounds using ammonia, ethylamine, hexylamine, octylamine, stearylamine, etc. as monoamines, so that the thixotropy of flux, wetting speed, solder paste printing sag suppression ability, printing Sufficient effects on heat resistance and heat sag suppression ability were obtained.

  Furthermore, even if the thixotropic agent contains an acyclic amide compound obtained by ring-opening polymerization of lactam, it has sufficient effects on flux thixotropy, wetting speed, solder paste printing sag suppression, printability, and heat sag suppression. was gotten.

<Evaluation of thickening suppression effect of solder paste>
It verified also about the thickening inhibitory effect of the solder paste prepared using the flux of each Example mentioned above and the solder alloy of the composition shown in the following Table 9. FIG.

(1) Verification method The obtained solder paste was rotated using a rotational viscometer (PCU-205, manufactured by Malcolm Co., Ltd.) according to the method described in “4.2 Viscosity characteristics test” of JIS Z 3284-3. The viscosity was continuously measured for 12 hours at a number of 10 rpm and a measurement temperature of 25 ° C. Then, the initial viscosity (viscosity after 30 minutes of stirring) was compared with the viscosity after 12 hours, and the thickening suppression effect was evaluated based on the following criteria.

(2) Criteria ○: Viscosity after 13 hours ≦ Initial viscosity × 1.2: Good small increase in viscosity over time ×: Viscosity after 13 hours> Initial viscosity × 1.2: Large increase in viscosity over time Bad

  In the solder paste using the flux of each example shown in Table 1 to Table 7 and the solder alloys of Test Examples A1 to A6 shown in Table 9 that satisfy the above formulas (1) and (2), the solder paste In addition to the printing sag suppressing ability, printability, heating sag suppressing ability, and wetting speed, a sufficient effect was obtained for the thickening suppressing effect.

  On the other hand, the solder which used the flux of each Example shown in Table 1 to Table 7, and the solder alloy of each Test Example B1-B6 shown in Table 9 which does not satisfy | fill said Numerical formula (1) and Numerical formula (2). In the paste, effects were obtained with respect to the printing sag suppressing ability, printability, heat sag suppressing ability, and wetting speed of the solder paste, but no effect was obtained with respect to the thickening inhibiting effect.

  From the above, the thixotropic agent, the compound represented by the general formula (1), the rosin, the organic acid and the solvent are contained, and the thixotropic agent is a cyclic mixture of dicarboxylic acid and / or tricarboxylic acid and diamine and / or triamine. A condensed cyclic amide compound and a non-cyclic amide compound obtained by polycyclic condensation of monocarboxylic acid, dicarboxylic acid and / or tricarboxylic acid and monoamine, diamine and / or triamine, or acyclic amide compound obtained by ring-opening polymerization of lactam The cyclic amide compound has a dicarboxylic acid and a tricarboxylic acid having 3 to 10 carbon atoms, and the diamine and triamine have a carbon number of 2 to 54, and the acyclic amide compound is a monocarboxylic acid, dicarboxylic acid and tricarboxylic acid. The carbon number of the acid is 2 or more and 28 or less, carbon of monoamine, diamine and triamine Is from 0 to 54 wt%, the cyclic amide compound is from 0.1 wt% to 8.0 wt%, more preferably the cyclic amide compound is from 0.1 wt% to 1.5 wt%, and the non-cyclic amide compound is 0.5 wt%. % To 8.0 wt%, more preferably 0.5 wt% to 4.0 wt% of the acyclic amide compound, and the total of the cyclic amide compound and the acyclic amide compound is 1.5 wt% to 10.0 wt% %, The thixotropic agent can be improved without increasing the content of the non-cyclic amide compound as compared with the case where the thixotropic agent is made of a non-cyclic amide compound. Precipitation could be suppressed, and in addition, solder wettability could be improved.

  With the solder paste using this flux, it was possible to obtain good printability in which bleeding, blurring and the like were suppressed, and it was possible to suppress printing sag through which the solder paste after printing flowed. Furthermore, the heating sag of the solder paste due to heating during soldering could be suppressed.

  Furthermore, the flux according to the present invention comprises an ester compound as a thixotropic agent in an amount of 0 wt% to 8.0 wt%, more preferably an ester compound of 0 wt% to 4.0 wt%; and a rosin of 30 wt% to 60 wt%. Preferably, rosin is 35 wt% or more and 60 wt% or less; organic acid is 0 wt% or more and 10 wt% or less; amine is 0 wt% or more and 20 wt% or less, more preferably, amine is 0 wt% or more and 5 wt% or less; 5 wt% or less, amine hydrohalide salt is contained in an amount of 0 wt% or more and 2 wt% or less; an antioxidant is contained in an amount of 0 wt% or more and 5 wt% or less, and the balance is a solvent. By having such a composition, the thixotropic agent includes a cyclic amide compound and an acyclic amide compound, so that the flux thixotropy, solder paste printing sag suppression ability, printability, heating sag suppression ability, and general formula The wetting rate due to the inclusion of the compound represented by (1) was not inhibited, and sufficient effects were obtained for these.

  Furthermore, with this flux, As: 25 mass ppm or more and 300 mass ppm or less, Sb: more than 0 mass ppm or more and 3000 mass ppm or less, Bi: more than 0 mass ppm or more and 10,000 mass ppm or less, and Pb: more than 0 mass ppm or more than 5100 mass ppm. At least one of the following, Ag: 0% by mass to 4% by mass and Cu: 0% by mass to 0.9% by mass, and the balance (Bal) is made of Sn, In addition, in the solder paste using the solder alloy satisfying the above formulas (1) and (2), the thixotropic agent includes a cyclic amide compound and a non-cyclic amide compound, and the thixotropic property of the flux and the suppression of the printing paste of the solder paste are included. Performance, printability, ability to suppress heating sag, and wetting rate due to inclusion of the compound represented by the general formula (1) is not inhibited, and thickening is suppressed. Sufficient effect is obtained for the result.

  ADVANTAGE OF THE INVENTION According to this invention, the solder paste using the flux which provided the thixotropy property, was excellent in printability, the suppression ability of printing sag, the suppression capability of heating sag, and the solder wettability was improved. be able to.

Claims (17)

A thixotropic agent, a compound represented by the following general formula (1), rosin, and a solvent,
The thixotropic agent includes a cyclic amide compound and an acyclic amide compound, the cyclic amide compound is included in an amount of 0.1 wt% to 8.0 wt%, and the acyclic amide compound is included in an amount of 0.5 wt% to 8.0 wt%. And the total of the cyclic amide compound and the acyclic amide compound is 1.5 wt% or more and 10.0 wt% or less,
The cyclic amide compound is an amide compound having a molecular weight of 3000 or less obtained by cyclic polycondensation of dicarboxylic acid and / or tricarboxylic acid and diamine and / or triamine.
The non-cyclic amide compound, monocarboxylic acids, dicarboxylic acids and / or tricarboxylic acids, monoamines, and the diamines and / or triamines Ri amide compound der fused acyclic,
A flux comprising 3.0 wt% or more and 7.0 wt% or less of a compound represented by the following general formula (1) .

[In Formula (1), R < ¹ >, R < ² >, R < ³ > and R < ⁴ > show a hydrogen atom or a C1-C4 alkyl group each independently. ] A thixotropic agent, a compound represented by the following general formula (1), an organic acid (excluding a compound represented by the following general formula (1)), rosin, and a solvent,
The thixotropic agent includes a cyclic amide compound and an acyclic amide compound, the cyclic amide compound is included in an amount of 0.1 wt% to 8.0 wt%, and the acyclic amide compound is included in an amount of 0.5 wt% to 8.0 wt%. And the total of the cyclic amide compound and the acyclic amide compound is 1.5 wt% or more and 10.0 wt% or less,
The cyclic amide compound is an amide compound having a molecular weight of 3000 or less obtained by cyclic polycondensation of dicarboxylic acid and / or tricarboxylic acid and diamine and / or triamine.
The non-cyclic amide compound, monocarboxylic acids, dicarboxylic acids and / or tricarboxylic acids, monoamines, and the diamines and / or triamines Ri amide compound der fused acyclic,
The compound represented by the following general formula (1) contains 0.5 wt% or more and 7.0 wt% or less, and the compound represented by the following general formula (1) and the organic acid (represented by the following general formula (1) And a total of 6.5 wt% or more .

[In Formula (1), R < ¹ >, R < ² >, R < ³ > and R < ⁴ > show a hydrogen atom or a C1-C4 alkyl group each independently. ] The flux according to claim 1 or 2 , wherein the compound represented by the general formula (1) is picolinic acid. The flux according to any one of claims 1 to 3, wherein the cyclic amide compound has a dicarboxylic acid and a tricarboxylic acid having 3 to 10 carbon atoms. The flux according to any one of claims 1 to 3, wherein the cyclic amide compound has 6 or more and 10 or less carbon atoms of dicarboxylic acid and tricarboxylic acid. The flux according to claim 4 or 5 , wherein the cyclic amide compound has diamine and triamine having 2 to 54 carbon atoms. The flux according to claim 4 or 5 , wherein the cyclic amide compound has 6 carbon atoms of diamine and triamine. The cyclic amide compound is characterized in that the number of carbon atoms with a dicarboxylic acid of 3 to 10, the amide compound is carbon atoms and 2 or more 54 or less of the diamine polycondensation annularly claim from claim 1 4. The flux according to any one of 3 above. The cyclic amide compound is characterized in that a dicarboxylic acid having 6 to 10 carbon atoms, with a diamine of the carbon atoms 6 is an amide compound polycondensation annularly any of claims 1 to 3 The flux according to claim 1 . In the cyclic amide compound, dicarboxylic acid and tricarboxylic acid have 3 to 10 carbon atoms, diamine and triamine have 2 to 54 carbon atoms,
The non-cyclic amide compound, a monocarboxylic acid, the carbon number of the dicarboxylic acids and tricarboxylic acids having 2 or more and 28 or less, and wherein the monoamine, the number of carbon atoms of the diamines and triamines is 0 or more 54 or less, from the claims 1 The flux according to claim 3 . The flux according to any one of claims 1 to 10 , wherein the thixotropic agent further contains an ester compound. The thixotropic agent, characterized in that it comprises a castor hardened oil as an ester compound, a flux according to claim 1 1. The thixotropic agent is the cyclic amide compound 0.1 wt% or more 2.0 wt% or less, characterized in that it comprises the non-cyclic amide compound of the following 0.5 wt% or more 4.0 wt%, wherein the preceding claims Item 4. The flux according to any one of items 3 . The thixotropic agent is characterized by comprising the ester compound less 0 wt% or more 8.0 wt%, the flux according to claim 1 1 or claim 1 2.   The flux according to any one of claims 1 to 14, wherein the rosin is contained in an amount of 30 wt% to 60 wt%. Furthermore, 0 wt% or more and 20 wt% or less of amine,
Organohalogen compounds in an amount of 0 wt% to 5 wt%
The flux according to any one of claims 1 to 15, comprising an amine hydrohalide in an amount of 0 wt% to 2 wt%, or an antioxidant in an amount of 0 wt% to 5 wt%.   A solder paste comprising the flux according to any one of claims 1 to 16 and a metal powder.

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