KR102080763B1 - Substrate processing apparatus, and tray therefor - Google Patents

Abstract

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus and a tray of the substrate processing apparatus for performing substrate processing using a tray on which a plurality of substrates are mounted.
The present invention is a tray of a substrate processing apparatus including a process chamber forming a processing space, and a tray support portion supporting a tray in which a plurality of substrates are seated at a distance in the process chamber, corresponding to the arrangement of the plurality of substrates Disclosed is a tray of a substrate processing apparatus, characterized in that a pad portion supporting an edge bottom surface of the substrate is formed to protrude.

Description

Substrate processing apparatus, and tray therefor}

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus and a tray of the substrate processing apparatus for performing substrate processing using a tray on which a plurality of substrates are mounted.

The substrate processing apparatus refers to a process chamber that forms a closed processing space and a device that performs substrate processing such as etching or depositing the surface of the substrate by applying power while injecting the processing gas into the processing space.

Here, the substrate processed by the substrate processing apparatus includes a semiconductor wafer, an LCD panel glass substrate, and a solar cell substrate.

As an example of the substrate processing apparatus, a plurality of solar cell substrates are mounted on a substrate support by using a tray, and then the purpose of forming fine irregularities and irregularities on the surface of the substrate using dry etching such as reactive ion etching is a characteristic of the device. There is a substrate processing apparatus that performs substrate processing to form a substrate that can be varied depending on the type, and in particular, to reduce the reflectance of light by the substrate in order to increase the efficiency of the solar cell device.

The substrate processing apparatus for forming minute irregularities on the surface of the substrate as described above forms irregularities on the surface of the substrate through the following steps.

The substrate processing apparatus according to an example of the related art etches the surface of the substrate by forming plasma in the processing space when power is applied while injecting gas into the process chamber.

In addition, some of the compounds formed by the substrate etching are attached to the surface of the substrate to act as a mask during the substrate etching process, thereby promoting the formation of unevenness on the substrate surface.

5A is a photograph showing a substrate processed by a conventional substrate processing apparatus, FIG. 5B is a vertical cross-section of the center portion of the substrate of FIG. 5A, and FIG. 5C is an electron microscope of a vertical cross-section of the edge of the substrate of FIG. 5A. It is a picture taken with.

On the other hand, the conventional substrate processing method of forming the unevenness, as shown in Figures 5a to 5c, the substrate seated on the tray has a problem that causes variations in the formation of unevenness at the edges, causing color difference on the substrate.

The color difference formed on the substrate surface means a difference in reflectance, and the effect of reducing the reflectance due to the formation of unevenness on the substrate is not sufficiently achieved, thereby deteriorating the efficiency of the solar cell device.

In addition, there is a problem in that the substrate having a color difference is not visually good, and thus it is not easy to sell in the market, such as being mistaken for a defective product, thereby lowering the reliability of the product in the market and being distributed at a lower price compared to the substrate without the color difference.

An object of the present invention, the substrate processing apparatus and the tray of the substrate processing apparatus that can minimize the deviation of the substrate processing at the central portion and the edge of each substrate in processing the substrate in a state of being seated in the tray with a plurality of substrates spaced apart To provide.

An object of the present invention is to achieve the object of the present invention as described above, the present invention is a process chamber forming a processing space, and a plurality of substrates in the process chamber, the tray support portion for supporting a tray seated at a distance Disclosed is a tray of a substrate processing apparatus, wherein the tray of the substrate processing apparatus is characterized in that a pad portion supporting an edge bottom surface of the substrate is projected to correspond to the arrangement of the plurality of substrates.

The pad portion may include a protrusion portion supporting a bottom surface of the substrate edge, and a recessed groove portion or a penetration portion corresponding to a portion other than the portion supported by the protrusion portion.

The pad portion may be installed in a grid pattern.

The pad portion may be attached to or coated on the upper surface of the tray.

The pad portion may be integrally formed on the upper surface of the tray by processing.

The tray may include a plate member on which the pad portion is installed, and an outer frame coupled along the edge of the plate member.

The pad portion may have an insulating material that is electrically insulating.

The pad portion may have a silicone polymer material.

The pad portion may have any one of a polymer material, engineering plastic material, ceramic material, and crystalline silicon material.

The pad portion may have a polymer material, and an adhesive material may be applied to the bottom surface to be attached to the top surface of the tray.

The present invention is also a substrate processing apparatus including a process chamber forming a processing space, and a tray support portion supporting a tray in which a plurality of substrates are seated at intervals in the process chamber, wherein the tray has a tray having the above-described configuration. Disclosed is a substrate processing apparatus characterized by using.

The substrate processing apparatus may perform dry etching.

The substrate processing apparatus may form irregularities on the surface of the substrate by reactive ion etching.

The substrate processing apparatus according to the present invention and the tray used therein, by providing a pad portion supporting both the bottom and bottom edges of the substrate in processing the substrate in a state where the plurality of substrates are placed on the tray at intervals, are additionally provided on the upper surface of each substrate. It has the advantage of minimizing variations in substrate processing at the center and edges.

In particular, when performing substrate processing to form a large number of microscopic irregularities on the substrate surface by dry etching such as reactive ion etching, pad portions supporting both the bottom and bottom edges of the substrate are additionally installed on the upper surface, thereby forming a central portion and an edge of each substrate. This has the advantage of minimizing variations in substrate processing.

Specifically, when looking at the results of the substrate processing under the same process conditions, the prior art, that is, when the pad portion of the present invention is not installed in the tray is shown in FIGS. 5A to 5C, and when the pad portion of the present invention is installed, FIGS. 5A to 5A It is shown in Figure 5c.

In the case of the prior art, referring to FIG. 5A, a black band at the edge of the substrate (the black band has a deviation in the formation of unevenness during the etching process, and the deviation of the unevenness affects the reflectivity and reflectance in the black area) This shows a smaller state), and as shown in FIGS. 5B and 5C, it can be seen that the unevenness formed at the central portion and the edge of the substrate is different from each other.

In the case of the present invention, referring to FIG. 6A, a black band as shown in FIG. 5A is not formed (this means that unevenness is uniformly formed over the entire surface of the substrate), as shown in FIGS. 6B and 6C. It can be seen that the unevenness formed at the center and edge of the substrate does not have a large deviation.

That is, it can be seen that the substrate processing apparatus according to the present invention can minimize variations in substrate processing at the central portion and edges of each substrate.

1 is a cross-sectional view showing a substrate processing apparatus according to the present invention.
FIG. 2 is a perspective view showing a tray and a substrate mounted on the tray in the substrate processing apparatus of FIG. 1.
3 is a plan view showing a tray in the substrate processing apparatus of FIG. 1.
4 is a partial cross-sectional view showing a part of a cross section in the direction IV-IV in FIG. 3.
5A is a photograph showing a substrate processed by a conventional substrate processing apparatus, FIG. 5B is a vertical cross-section of the center portion of the substrate of FIG. 5A, and FIG. 5C is an electron microscope of a vertical cross-section of the edge of the substrate of FIG. 5A. It is a picture taken with.
Figure 6a is a photograph showing a substrate processed by the substrate processing apparatus according to the present invention, Figure 6b is a vertical cross-section for the central portion in the substrate of Figure 6a, Figure 6c is a vertical cross-section for the edge in the substrate of Figure 6a This is a picture taken with an electron microscope.

Hereinafter, a substrate processing apparatus and a tray of the substrate processing apparatus according to the present invention will be described with reference to the accompanying drawings.

The substrate processing apparatus according to the present invention, as shown in Figure 1, the process chamber 100 for forming a closed processing space (S); A tray support unit 130 installed in the process chamber S to support the tray 200 on which one or more substrates 10 are mounted; It is installed on the upper portion of the process chamber 100 may be configured to include a gas supply unit 140 for injecting gas into the processing space (S).

The substrate processing apparatus may perform substrate processing such as deposition and etching, and may perform deposition processes such as PECVD, LPCVD, and substrate processing using plasma.

In particular, the substrate processing apparatus may perform a process of forming unevenness on the surface of the substrate by dry etching, particularly reactive ion etching.

Here, the substrate 10, which is the object of the substrate processing, is a substrate such as a substrate for a solar cell, such as silicon, and may be made of any material, and its shape may have various shapes such as a rectangle and a circle.

The process chamber 100 is a configuration for forming a processing space S for performing substrate processing, and various configurations are possible. As shown in FIG. 1, the chamber body 120 and the chamber with the upper side open It may be configured to include an upper lead 110 that is detachably coupled to the body 120.

The chamber body 120 has a bowl shape with an open top side, and one or two or more gates through which the substrate 10 can enter and exit may be formed. In this embodiment, the pair of gates 121 and 122 are formed to face each other in the rectangular chamber body 120.

The upper lead 110 is configured to form a closed processing space (S) by being coupled with a sealing member (not shown) interposed on the upper side of the chamber body 120, and may have a plate or bowl shape with an open lower side. You can.

The tray support 130 is a configuration for supporting the tray 200 so that substrate processing can be smoothly performed, and various configurations are possible according to design conditions and process conditions. Here, the tray support 130 may be moved up and down for the seating of the tray 200.

In particular, the tray support 130 may be grounded or powered according to the type of substrate processing, and further, various configurations such as a heater for heating the substrate 10 may be installed.

The gas injection unit 140 is a so-called shower head that is installed on the upper side of the processing space (S) and is supplied from an externally installed gas supply device (not shown) to inject the processing gas into the processing space (S). Various configurations are possible depending on the type, number, and injection method.

On the other hand, the process chamber 100, by discharging the gas in the processing space (S), the exhaust portion for the pressure and exhaust of the processing space (S) is installed, for example, the gas outlet is the bottom of the chamber body 130, In addition to being connected to one or more exhaust ports 160 formed on the side, it may include an exhaust pipe connected to a vacuum pump or the like.

On the other hand, the substrate processing apparatus according to the present invention is characterized in that a plurality of substrates 10 perform substrate processing while loading and transporting the trays 200 at intervals in an array of m × n (m, n is a natural number of 2 or more). Is done.

Here, in the substrate processing apparatus, the tray 200 may be transported by various methods such as rollers and belts installed on each module and a frame supporting each module.

In addition, in the substrate processing apparatus, the tray 200 may be transported by a transport robot (not shown) having a robot arm supporting the tray 200.

In addition, the substrate processing apparatus according to the present invention may be arranged in-line with the load lock module and the unload lock module, or a transport chamber may be additionally installed to be disposed in a cluster form. In this case, a transport robot for transport of the tray 200 may be installed in the transport chamber.

The tray 200 is a configuration for loading and transporting a plurality of substrates 10, and various configurations are possible.

For example, the tray 200 may include a plate member 210 on which the pad unit 300 to be described later is installed, and an outer frame 220 coupled along the edge of the plate member 210.

The plate member 210 is a pad material 300, which will be described later, is a structure for supporting a substrate and is an electrically non-conductive insulating material, such as Al ₂ O ₃ , glass, quartz, borosilicate glass (pyrex), Plasma-resistant materials such as engineering plastics such as polyether ketone (PEK) may be used.

The outer frame 220 is a configuration that is coupled along the edge of the plate member 210, various configurations are possible.

In particular, the outer frame 220 supports the plate member 210 and has various configurations to be supported by the rollers, etc. described above. In consideration of structural rigidity, metal materials such as aluminum and aluminum alloy are used on the bottom surface and the top surface is Plasma-resistant materials such as Al ₂ O ₃ , engineering glass such as glass, quartz, borosilicate glass (pyrex), and polyether ketone (PEK) may be installed and configured.

Here, the outer frame 220, Al ₂ O ₃ , glass (Glass), quartz, borosilicate glass (pyrex), polyether ketone (PEK), such as engineering plastics, etc., may be composed of only materials that are resistant to plasma. Of course.

Meanwhile, the tray 200 maximizes the formation effect of the fine concavo-convex when substrate processing is performed to form a large number of concavo-convex on the substrate surface using a reactive ion etching process in a state where a plurality of substrates 10 are seated. For this, the substrate processing may be performed in a state in which a cover member (not shown) in which a plurality of openings are formed in a vertical direction is installed and spaced apart from the substrate 10.

The cover member is installed at a distance from the substrate 10, and a plurality of openings are formed in the vertical direction, whereby plasma penetrates through the opening to etch and etch the surface of the substrate, and the floating floating residue is covered with the cover member and the tray 200. To remain on the surface and adhere to the surface of the substrate to maximize the formation effect of unevenness.

On the other hand, the tray 200, as shown in Figures 2 to 4, the pad portion 300 supporting the bottom surface of the edge of the substrate 10 corresponding to the arrangement of the plurality of substrates 10 is formed to protrude Is done.

The pad part 300 is installed on the tray 200, that is, the plate member 210, and supports a bottom of the edge of the substrate 10 in correspondence with the arrangement of the plurality of substrates 10. Various configurations are possible. .

Particularly, the pad part 300 may be attached to or coated on the upper surface of the tray 200 when installed in the tray 200, that is, the plate member 210.

Further, the pad part 300 may be integrally formed on the upper surface of the tray 200, that is, the plate member 210 by machining, plasma spraying, or the like.

And the pad portion 300, the tray 200, that is installed on the upper surface of the plate member 210 to correspond to the arrangement of the plurality of substrates 10 so as to protrude to support the bottom edge of the substrate 10 It can be configured can be installed in various patterns according to the arrangement method of the substrate 10.

Particularly, the pad part 300 may include a protrusion part 310 supporting the bottom surface of the substrate 10 and a recessed groove part or a through part 320 corresponding to the rest of the part except for the part supported by the protrusion part. .

For example, when the substrate 10 has a rectangular shape, the pad unit 300 may be installed in a grid pattern, as shown in FIGS. 2 and 3.

And the pad portion 300, as shown in Figures 3 and 4, supports the bottom surface of the edge of the substrate 10, and the rest of the support the substrate 10 at a distance from the top surface of the tray 200 Preferably.

Here, the recessed groove portion or the through portion 320 formed between the bottom surface of the substrate 10 and the top surface of the tray 200 is preferably maintained in an empty state.

Of course, the recessed groove portion or the through portion 320 may be filled with a buffer material having a heat transfer rate lower than that of the pad portion 300.

On the other hand, the material of the pad portion 300, it is preferable that an insulating material that is electrically insulating is used.

For example, the material of the pad portion 300 is a polymer material such as silicone polymer, an engineering plastic material such as PTFE, FKM, PEEK, a ceramic material such as Al ₂ O ₃ , a crystalline silicon material such as monocrystalline silicon, polycrystalline silicon, etc. Etc. can be used, and it is more preferable that a silicone polymer material is used.

Meanwhile, when the pad part 300 has a polymer material, it may include a band member made of a polymer material, and an adhesive material may be applied to the bottom surface to be attached to the upper surface of the tray 200.

As described above, when the pad portion 300 is formed of a belt-like member and attached to the upper surface of the tray 200, the pad portion 300 is easily installed on the upper surface of the tray 200.

On the other hand, before the pad portion 300 is attached to the upper surface of the tray 200, it is preferable that a release paper (not shown) is attached to the bottom surface.

-Experimental example

Meanwhile, the substrate processing is performed using the substrate processing apparatus according to the prior art and the tray according to the present invention, as shown in FIGS. 5A to 6C.

And the specific experimental conditions, the solar electric substrate is a polycrystalline silicon substrate, Cl ₂ , SF ₆ and O ₂ is used as a reaction gas to perform a process of forming a fine concavo-convex for lowering the reflectivity on the substrate surface by a reactive ion etching process. Did.

And, the pad portion 300, as shown in Figure 2, a band member of a silicone polymer material (commercial silicone polymer pad), that is, in a sticker form in a position where the substrate 10 is seated on the top surface of the tray 200 Correspondingly, it was installed on the upper surface of the tray 200 to support all of the bottom surfaces of the edges of the substrate 10.

Through the above experiments, as shown in FIGS. 5A to 6C, it was confirmed that the deviation in the central portion and the edge portion of the substrate was significantly improved after the substrate treatment compared to the prior art.

The above is merely a description of some of the preferred embodiments that can be implemented by the present invention, so, as is well known, the scope of the present invention should not be construed as being limited to the above embodiments, and the present invention described above. It will be said that both the technical idea and the technical idea together with the fundamental are included in the scope of the present invention.

10: substrate 100: process chamber
200: Tray 300: Pad portion

Claims (17)

A tray of a substrate processing apparatus including a process chamber for forming a processing space for forming irregularities on the surface of a substrate by reactive ion etching, and a tray support for supporting a tray in which a plurality of substrates are placed at intervals within the process chamber. as,
A pad portion supporting the bottom surface of the substrate is formed protrudingly corresponding to the arrangement of the plurality of substrates,
The tray includes a plate member on which the pad portion is installed, and an outer frame coupled along the edge of the plate member,
The pad portion, the tray of the substrate processing apparatus, characterized in that it has an insulating material and is formed to protrude on the upper surface of the plate member to support the bottom surface of the substrate edge. The method according to claim 1,
The pad portion, the tray of the substrate processing apparatus, characterized in that it includes a recess or a through portion corresponding to the rest of the portion except for the portion supported by the protrusion. The method according to claim 1,
The pad portion, the tray of the substrate processing apparatus, characterized in that installed in a grid pattern. The method according to claim 1,
The pad portion is attached to the upper surface of the tray, the tray of the substrate processing apparatus characterized in that the coating. The method according to claim 1,
The pad portion, the tray of the substrate processing apparatus, characterized in that integrally formed on the upper surface of the tray by processing. delete The method according to any one of claims 1 to 5,
The pad portion, the tray of the substrate processing apparatus characterized in that it has an insulating material that is electrically insulated. The method according to claim 7,
The pad portion, the tray of the substrate processing apparatus characterized in that it has a silicone polymer material. The method according to claim 7,
The pad portion, the tray of the substrate processing apparatus, characterized in that it has any one of a polymer material, engineering plastic material, ceramic material and crystalline silicon material. The method according to any one of claims 1 to 5,
The pad portion, the tray of the substrate processing apparatus, characterized in that the polymer material and the adhesive material is applied to the bottom surface is attached to the upper surface of the tray. A substrate processing apparatus comprising a process chamber forming a processing space and a tray support part supporting a tray in which a plurality of substrates are seated at intervals in the process chamber,
The tray is a substrate processing apparatus characterized in that the tray according to any one of claims 1 to 5. The method according to claim 11,
The pad portion, the substrate processing apparatus characterized in that it has an insulating material that is electrically insulating. The method according to claim 12,
The pad portion, the substrate processing apparatus characterized in that it has a silicone polymer material. The method according to claim 12,
The pad portion, the substrate processing apparatus characterized in that it has any one of a polymer material, engineering plastics, ceramic material and crystalline silicon. The method according to claim 12,
The pad portion has a polymer material, the substrate processing apparatus characterized in that the adhesive material is applied to the bottom surface is attached to the upper surface of the tray. The method according to claim 12,
The substrate processing apparatus is characterized in that to perform a dry etching substrate processing apparatus. The method according to claim 16,
The substrate processing apparatus is a substrate processing apparatus characterized in that to form the unevenness on the surface of the substrate by reactive ion etching.

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