KR101739010B1 - Substrate processing system and tray therefor - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing system, and more particularly, to a substrate processing system and a tray used therein, in which a plurality of substrates are stacked and transported in a tray to perform substrate processing. The present invention is a tray used in a substrate processing system in which a plurality of substrates are stacked in a rectangular tray and transported to a process chamber and the substrate is processed after the tray is mounted on a tray support of the process chamber, A pair of main frames arranged; A pair of connection frames connecting the ends of the pair of main frames; And two or more sub-plate-like members installed on the main frame and the connection frame and coupled to each other to form one mounting surface on which a plurality of substrates are stacked, the sub-plate- The tray being used in the substrate processing system.

Description

[0001] Substrate processing system and tray therefor [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing system, and more particularly, to a substrate processing system and a tray used therein, in which a plurality of substrates are stacked and transported in a tray to perform substrate processing.

The substrate processing apparatus includes a vacuum chamber for forming a closed processing space, and a tray supporting unit installed in the vacuum chamber for mounting the substrate. The substrate is etched or deposited by applying a power while injecting the processing gas into the processing space And the like.

The substrates to be processed by the substrate processing apparatus include semiconductor wafers, glass substrates for LCD panels, and solar cell substrates.

In addition, a conventional substrate processing apparatus is configured to process a larger number of substrates by carrying a plurality of substrates on a tray, placing the substrates on a tray support, and then performing a deposition process or the like on the substrate.

The tray is configured to transport a plurality of substrates, and may have various configurations according to substrate processing. For example, the tray may include a plate-shaped member for forming a mounting surface on which a plurality of substrates are stacked, As shown in Fig.

The tray having the above-described structure is loaded with a plurality of substrates, is placed on the tray support portion of the process chamber, and is subjected to substrate processing while power is applied to the sheet member of the tray by surface contact with the tray support portion.

On the other hand, in order to constitute the large tray, the plate member is composed of a plurality of sub-plate members.

However, when the plate member is composed of a plurality of sub-plate members, a voltage deviation may occur in each sub-plate member, and the voltage deviation affects the substrate treatment on the substrate in each sub- There is a problem to be solved.

In particular, even though the sub-plate members are made of the same material, the voltages formed on the sub-plate members may be different from each other even though the same power source is applied by the tray support due to differences in manufacturing process and fine physical properties.

The voltage difference on each of the sub-plate members is different from that of the substrate placed on the sub-plate member, and there arises a problem that variations in substrate processing occur depending on each sub-plate member.

When the substrate processing is not uniform, for example, when the substrate processing is a vapor deposition process, the thickness or the film quality of the vapor deposition film may vary on the surface of the substrate depending on the position on the sub-platemember Which can be observed by naked eyes).

SUMMARY OF THE INVENTION It is an object of the present invention to minimize the voltage difference formed on each sub-plate member when forming a single mounting surface on which substrates are loaded by a plurality of sub-plate members, And to provide a substrate processing system capable of preventing variations in substrate processing and a tray used therein.

The present invention has been made in order to accomplish the above-mentioned object of the present invention. The present invention provides a method of manufacturing a semiconductor device in which a plurality of substrates are stacked on a rectangular tray and transferred to a process chamber, 1. A tray for use in a substrate processing system for performing processing, the tray comprising: a pair of main frames arranged in parallel; A pair of connection frames connecting the ends of the pair of main frames; And two or more sub-plate-like members installed on the main frame and the connection frame and coupled to each other to form one mounting surface on which a plurality of substrates are stacked, the sub-plate- The tray being used in the substrate processing system.

The conductive part may be composed of a conductive member such as a conductive sheet provided between the bottom surfaces of the sub-plate members and the upper surface of the connection frame so as to be in contact with the bottom surfaces of the sub-plate members adjacent to each other.

Wherein the conductive portion is inserted into an insertion portion formed over sub-plate-shaped members adjacent to each other on at least one of the mounting surface and the opposite surface of the mounting surface, and the conductive members, which are adjacent to each other, Member.

The conductive part may further include a non-conductive covering member that covers the conductive member to form a part of the opposite surface of the mounting surface or the mounting surface.

The clogging member may be bonded to the conductive member or may be joined by the fastening member.

At least one of the conductive member and the cover member may be configured to fix the adjacent sub-plate members to each other.

 For example, at least one of the conductive member and the cover member may have a U-shape and have a pair of projecting ends inserted into the insertion portion, or may be coupled to the sub-plate member by a fastening member .

The conductive member may be made of a nonconductive part forming part of the opposite surface of the mounting surface or the mounting surface, and the nonconductive part may be coated with a conductive material on a surface facing the sub-surface member.

Meanwhile, the conductive member may be configured to fix the adjacent sub-plate members to each other.

The conductive member may have a pair of protruding ends having a U-shape and inserted into the insertion portion, or may be coupled to the sub-plate member by a fastening member.

And one or more cover members installed to cover the edge of the loading surface in the sub-plate member.

The sub-plate member may have a CC composite or a graphite material.

The present invention also relates to a semiconductor integrated circuit device, comprising: a process module for performing a substrate process; a load lock module coupled to the process module for receiving a tray on which a plurality of substrates to be subjected to a substrate process are stacked, And an unload lock module for receiving a tray on which a plurality of substrates, which have been processed by the substrate processing, are transferred to the process module and discharged to the outside, wherein the tray is used.

The load lock module, the process module, and the unload lock module may be arranged in-line.

The load lock module and the unload lock module may be vertically disposed on one side of the process module.

At this time, the process module may be provided with a tray handling unit that receives the tray from the load lock module, places the tray on the tray supporting unit, and transfers the tray to the unloading lock module after the substrate processing.

The tray handling unit may include a first tray transferring unit that receives the tray from the load lock module and transfers the tray to the tray supporting unit, and a second tray transferring unit that transfers the tray from the tray supporting unit to the unloading lock module, May be installed so as to be movable up and down between the first tray sending part and the second tray sending part.

The load lock module and the unload lock module may be formed of one chamber or a separate chamber. Wherein the load lock module and the unload lock module can be independently vacuum controlled.

The tray used in the substrate processing system according to the present invention may be configured such that a plurality of sub-plate members forming one loading surface are electrically connected by a current carrying unit, thereby being stacked on each sub-plate member caused by a voltage difference between sub- There is an advantage that deviation of the substrate processing with respect to the substrate can be prevented.

Particularly, the substrate processing system according to the present invention can improve the chrominance of the substrate mounted on each sub-plate member after the substrate processing by the above-described structure, that is, perform uniform substrate processing.

Further, in the tray used in the substrate processing system according to the present invention, the fasteners for connecting the sub-plate members adjacent to each other are used as a current-conducting unit for energizing the sub-plate members, thereby stably fixing the sub- There is an advantage that stable energization between sub-plate members can be ensured.

1 is a cross-sectional view showing a part of a configuration of a substrate processing system according to the present invention.
Figure 2 is a cross-sectional view of the process chamber of the substrate processing system of Figure 1;
3 is an exploded perspective view of a tray used in the substrate processing system of FIG.
4 is a perspective view showing the tray of FIG. 3;
FIG. 5A is a partial plan view showing the conductive part according to the first embodiment installed in the tray of FIG. 3, and FIG. 5B is a partial cross-sectional view taken along line BB in FIG.
FIG. 6A is a partial plan view showing the conductive part according to the second embodiment installed in the tray of FIG. 3, and FIG. 6B is a partial cross-sectional view of the BB direction in FIG. 6A.
7 is a partial cross-sectional view showing a conductive part according to the third embodiment installed in the tray of FIG.

Hereinafter, a substrate processing system according to the present invention and a tray used therein will be described in detail with reference to the accompanying drawings.

FIG. 1 is a cross-sectional view of a portion of a substrate processing system in accordance with the present invention, and FIG. 2 is a cross-sectional view of a process chamber of the substrate processing system of FIG. 1, perpendicular to the substrate transfer direction.

As shown in FIG. 1, the substrate processing system according to the present invention includes a process module 100 for performing substrate processing, a process module 100, A load lock module 200 for receiving a tray 600 on which at least one substrate 10 to be subjected to a substrate processing is mounted and transferring the tray 600 from the outside to the process module 100; And an unloading lock module 300 for receiving and discharging the tray 600 to which the at least one substrate 10, which has been processed by the substrate processing, is loaded.

Here, the substrate processing system according to the present invention is preferably applied to an inline type in which each module is sequentially arranged, but is not limited thereto.

The substrate 10, which is an object of the substrate processing, may be any substrate such as a substrate for a solar cell, such as a silicon material, and may have various shapes such as a rectangular shape and a circular shape.

A substrate loading module 400 for loading a plurality of substrates 10 on a tray 600 may be further installed on one side of the load lock module 200.

The substrate loading module 400 removes the substrate 10 from a cassette (not shown) on which a plurality of substrates 10 are loaded by holding a tray 600 supporting the tray 600, And a substrate stacking apparatus 420 installed for stacking the substrate 10 on the substrate 10.

The loading tray supporting portion may be provided with a structure for moving the tray 600 up and down to transport the tray 600 described later.

A tray support 600 for supporting the tray 600 on which the substrate 10 is mounted is provided on one side of the unloading lock module 300 to receive the tray 600 on which the substrates 10 having been subjected to the substrate processing have been loaded. 510 may be additionally installed.

The tray collection module 500 may be configured similar to the substrate loading module 400 and the tray support 510 may include a tray transfer part 520 for returning to the substrate loading module 400, So that the tray 600 can be transferred to the tray 600.

Here, the tray transfer unit 520 may have any configuration as long as it can transfer the tray 600, and may have various configurations such as a conveyor, a roller, and a rail.

The process module 100 can be variously configured according to a substrate process, and includes a process chamber 110 forming an enclosed process space S as shown in FIG. 2; A tray support 130 installed inside the process chamber S for supporting a tray 600 on which at least one substrate 10 is loaded; And a gas supply unit 140 installed at an upper portion of the process chamber 110 to inject gas into the process space S. The process module 100 may perform a substrate process such as a deposition process or an etching process, and may perform a deposition process such as a PECVD process or a LPCVD process.

The process chamber 110 is configured to form a process space S for performing a substrate process. The process chamber 110 may have various configurations. As shown in FIG. 2, And an upper lead 111 detachably coupled to the main body 112.

The chamber body 112 has an open top shape and at least one gate 101 through which the substrate 10 can enter and exit is formed. In this embodiment, a pair of gates 101 are formed to face each other in the rectangular chamber body 112.

The upper lead 111 is configured to form a closed process space S with a sealing member (not shown) interposed therebetween on an upper side of the chamber main body 112. The upper lead 111 has a plate shape or a lower- .

The tray supporting unit 130 is configured to support the tray 600 so that the substrate can be smoothly processed. The tray supporting unit 130 may have various configurations according to design conditions and process conditions. Here, the tray supporting part 130 may be moved up and down as shown in FIG. 2 for the seating of the tray 600.

Meanwhile, the substrate processing system according to the present invention is characterized in that the substrate processing is performed while the plurality of substrates 10 are loaded on the tray 600 and transferred.

Here, in the substrate processing system, the tray 600 may be transported by various methods such as rollers and belts provided in the respective modules and frames supporting the respective modules.

Meanwhile, in the substrate processing system according to the present invention, the load lock module 200, the process module 100, and the unload lock module 300 may be arranged in various forms other than those arranged in-line.

That is, the load lock module 200 and the unload lock module 300 may be vertically disposed on one side of the process module 100.

The process module 100 receives the tray 600 from the load lock module 200 and places the tray 600 on the tray supporting part 130 and transfers the tray 600 to the unloading / Can be installed.

The tray handling unit includes a first tray transferring unit for receiving the tray 600 from the load lock module 300 and transferring the tray 600 to the tray supporting unit 130 and a second tray transferring unit for transferring the tray 600 from the tray supporting unit to the unloading lock module 300. [ 2 tray transmission. At this time, the tray supporting part 130 may be installed to be able to move up and down between the first tray transfer part and the second tray transfer part for transferring the tray 600.

Meanwhile, the load lock module 200 and the unload lock module 300 may be one chamber or a separate chamber. Further, the load lock module 200 and the unload lock module 300 can be independently controlled by a vacuum.

Reference numerals 210, 220, 310 and 320 denote gate valves, and reference numerals 190, 290, 390, 490 and 590 denote frames for supporting respective modules, a substrate loading module, and a tray collection module.

Hereinafter, the tray used in the substrate processing system will be described in detail with reference to the accompanying drawings.

3 is an exploded perspective view of the tray used in the substrate processing system of FIG. 1, FIG. 4 is a perspective view showing the tray of FIG. 3, 5A is a partial cross-sectional view taken along line BB in FIG. 5A, FIG. 6A is a partial plan view showing a conductive part according to the second embodiment installed in the tray of FIG. 3, and FIG. 6B is a partial cross- And FIG. 7 is a partial cross-sectional view showing a conductive part installed in the tray according to the third embodiment of the present invention.

The tray 600 used in the substrate processing system according to the present invention includes a pair of main frames 610 arranged in parallel, as shown in FIGS. 3 and 4; A pair of connection frames 620 connecting the ends of the pair of main frames 610; And two or more sub-plate members 631 which are installed on the main frame 610 and the connection frame 620 and are coupled to each other to form one mounting surface on which a plurality of substrates 10 are mounted.

The main frame 610 and the connection frame 620 may be variously configured to form a skeleton of the rectangular tray 600 by being coupled by a fastening member such as a bolt. (620) may have any one of aluminum, aluminum alloy, and stainless steel.

As shown in FIG. 2, the main frame 610 and the connection frame 620 may be formed of a plurality of conveying rollers 121 and 122 So that the tray 600 can be transported.

The conveying rollers 121 and 122 for conveying the tray 600 may be configured to convey the tray 600 by rotating while supporting the bottom surface of the main frames 610, 121 and 122 may be rotated and driven by a rotation driving device (not shown) by a belt, a chain, a driven roller, or the like.

The conveying rollers 121 for supporting any one of the pair of main frames 610 are provided with guide grooves 121a for inserting a part of the main frame 610 in order to prevent the tray 600 from moving in the Y- May be formed. Here, the Y axis direction means a direction perpendicular to the X axis when the moving direction of the tray 600 is the X axis.

In addition, the main frame 610 may be formed of one or more members, and a step 611 may be formed at a portion where the main frame 610 is coupled to the connection frame 620 for installation.

The connection frame 620 may have a variety of configurations including a pair of main frames 620 to form a skeleton of the rectangular tray 600 and at least one member. It is preferable that the connection frame 620 is installed on the main frame 620 because it is preferable that only the main frame 620 is supported on the conveying rollers 121 and 122.

The connection frame 620 may be made of the same material as the main frame 610 or may be made of the same material or ceramic material having the same thermal deformation as the sheet material 630 in consideration of thermal deformation of the sheet material 630, A member of a material may be used.

The connecting frame 620 may have a step 621 formed at a portion supporting the plate member 630 and may have a fitting hole 622 through which the fitting portion 641 of the cover member 640, .

The sub-plate member 631 is configured to form one mounting surface on which a plurality of substrates 10 are mounted, and may have various configurations and materials according to substrate processing. Here, the coupling between the sub-plate members 631 can be variously combined according to design and design.

For example, it is preferable that the sub-plate member 631 is made of a material having high thermal conductivity and high conductivity such as CC composite or graphite.

Two or more of the sub-plate members 631 are coupled to each other to form one loading surface.

It is difficult to manufacture a large tray 600 with one sub-plate member 631 as a material of CC composite or graphite. Therefore, when two or more sub-plate members 631 are used, the large tray 600 ) Can be produced.

As shown in FIG. 4, the sub-plate members 631 may have various shapes such as a rectangular shape and an interface between the sub-plate members 631 and the adjacent sub-plate members 631 in parallel with the main frame 610 have.

In addition, the sub-plate members 631 may be coated with Al ₂ O ₃ by spray coating or the like in order to protect the surface of the sub-plate members 631 of the CC composite material.

On the other hand, when the substrate 10 to be subjected to the substrate processing is a solar cell substrate, in particular, a crystal silicon substrate, the mounting surface of the sub-plate member 631 corresponds to each substrate 10, A plurality of seating positions 632 on which the first and second seating portions 632 and 632 are seated can be set.

The seating position 632 is a position where the substrate 10 is seated on the mounting surface. A plurality of guide pins (not shown) arranged corresponding to the shape of the substrate 10 are mounted on the mounting surface of the sub-plate member 631 on which the seating position 632 is set for smooth seating of the substrate 10, Or protrusions (not shown) may be installed.

Meanwhile, the sub-plate member 631 may be fixed to one of the main frame 610 and the connection frame 620 by one or more clamping members 650.

The clamping member 650 may have any structure as long as it can fix the sub-plate member 631 to the main frame 610 and / or the connection frame 620. For example, the sub-plate member 631 And the sub-plate member 631 may be fixed to the main frame 610 by engaging with the main frame 610 by a fastening member such as a bolt (not shown) while covering a part of the edge of the loading surface.

At this time, in order to prevent the clamping member 650 from projecting upward, the sub-plate member 631 may be formed with a step 634 at a portion contacting the clamping member 650.

Meanwhile, the tray 600 may further include one or more cover members 640 installed to cover the edges of the loading surface of the sub-plate member 631.

The cover member 640 may be a ceramic material such as Al ₂ O ₃ or the like which is strong against plasma, and is a member for covering the edges of the mounting surface in the sub-plate member 631 so that uniform substrate processing can be performed.

The cover member 640 has a fitting portion 641 formed on the bottom surface thereof to prevent the coupling member 640 from moving on the mounting surface and has a fitting hole 622 formed in the connecting frame 620, a main frame 610, And can be fitted and fixed in the fitting portion 635 formed in the member 631. [

FIGS. 5A and 5B are a partial plan view and a partial cross-sectional view showing a conductive part according to the first embodiment installed in the tray of FIG. 3, and FIGS. 6A and 6B show a conductive part according to the second embodiment, And FIG. 7 is a partial cross-sectional view showing a conductive part according to a third embodiment installed in the tray of FIG. 3. FIG.

Meanwhile, the tray 600 may be powered (e.g., RF power, grounded, etc.) to the tray support 130 during substrate processing.

The plurality of sub-plate members 631 generate a voltage difference with respect to the other sub-plate members 631 depending on the material properties and positions thereof, Which causes the substrate processing to be changed.

Particularly, when the substrate 10 mounted on each of the sub-plate members 631 is not electrically connected to the other sub-plate members 631, a significant color difference may be generated on the surface of the substrate 10 due to variations in the substrate processing .

Therefore, in order to solve the above problems, the plurality of sub-plate members 631 need to be electrically connected to each other, and the sub-plate member 631 is electrically connected to the adjacent sub- It is preferable that electricity is applied.

Here, the power supply unit for electrically energizing the sub-plate members 631 can be various embodiments.

For example, as shown in Figs. 5A and 6B, the conductive portion may include an insertion portion 636 formed across the sub-platemember 631 adjacent to each other on at least one of the loading surface and the opposite surface of the loading surface And may include a conductive member 712 for electrically connecting adjacent sub-plate members 631 to each other.

The conductive member 712 can be made of any electrically conductive material so that the sub-plate-like members 631 adjacent to each other can be electrically connected by surface contact with the sub-plate-like member 631.

On the other hand, when the conductive member 712 is exposed to the outside, particularly on the side of the mounting surface, the conductive member 712 may affect the substrate processing process. As shown in FIGS. 5A and 5B, And a closure member 711 of a nonconductive material which covers part of the opposite surface of the loading surface or the loading surface.

The covering member 711 is a member for preventing the conductive member 712 from being exposed to the outside, and any material can be used as long as it is a material that does not have electrical conductivity such as ceramics.

The covering member 711 may be bonded to the conductive member 712 by an adhesive or may be joined by a fastening member such as a bolt.

The conductive member 712 and the covering member 711 may be formed so that at least one of the conductive members 712 and the covering member 711 is adjacent to the adjacent sub- The members 631 can be fixedly coupled to each other.

For example, at least one of the conductive member 712 and the cover member 711 may have a pair of protruding ends having a U-shape, Lt; / RTI >

When the conductive member 712 and the cover member 711 have a pair of protruding ends, the insertion portion 636 has a shape corresponding to the shape of the conductive member 712.

On the other hand, the conductive member 712 and the cover member 711 may be configured as being coupled to each other without being formed as separate members.

For example, the conductive member 712 is made of a nonconductive portion forming a part of the opposite surface of the loading surface or the loading surface without a separate covering member, and the nonconductive portion is made of a conductive material The material can be coated.

The conductive member 712 fixes and connects the sub-plate-shaped members 631 adjacent to each other when the cover member 711 is not included, as in the case of being provided on the bottom surface of the sub-plate-shaped member 631 .

That is, the conductive member 712 may be combined with the sub-plate members 631 by a fastening member such as a bolt 732, as shown in FIGS. 6A and 6B.

In addition, the conductive member 712 may have a pair of protruding ends having a U-shape similar to the configuration shown in FIGS. 5A and 5B, in which case the inserting portion 636 is provided with a conductive member 712, As shown in Fig.

As shown in Fig. 7, the conductive member may be formed so as to be in contact with the bottom surfaces of sub-sheet-like members 631, which are adjacent to each other, between the bottom surface of the sub-sheet-shaped members 631 and the top surface of the connection frame 620 And the conductive member 720 may be provided.

The conductive member 720 makes surface contact with the bottom surface of the sub-plate members 631, thereby electrically connecting the sub-plate members 631 to each other.

On the other hand, the conductive member can be any material as long as it is electrically conductive, and a conductive sheet such as an aluminum foil can be used.

When the neighboring sub-plate members 631 are electrically connected to each other by the current passing unit as described above, the voltage difference between the sub-plate members 631 is reduced and the substrate 10 Can be prevented.

It should be understood that the present invention is not limited to the above embodiments and various changes and modifications may be apparent to those skilled in the art.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It is to be understood that both the technical idea and the technical spirit of the invention are included in the scope of the present invention.

10: substrate
100: Process module 130:
150: gas supply unit
600: Tray

Claims (19)

A plurality of substrates are stacked on a rectangular tray and transferred to a process chamber, the tray is installed in the process chamber, and the substrate is placed on a tray support where power is supplied or grounded during substrate processing, As a tray to be used,
The tray
A pair of main frames arranged in parallel;
A pair of connection frames connecting the ends of the pair of main frames;
And two or more sub-plate members provided on the main frame and the connection frame to form one mounting surface on which a plurality of substrates are stacked,
Wherein the sub-plate member is electrically energized by at least one of neighboring sub-plate members by a conductive member having a conductive material,
Wherein the conductive portion is provided on an adjacent portion of the adjacent sub-plate members and is electrically connected to the adjacent sub-plate members to electrically energize the neighboring sub-plate members. Tray being. The method according to claim 1,
Wherein the conductive member is a conductive member provided between the bottom surfaces of the sub-plate members and the upper surface of the connection frame so as to be brought into contact with the bottoms of the sub-plate members adjacent to each other. The method of claim 2,
Wherein the conductive member is a conductive sheet. The method according to claim 1,
The current-
And a conductive member which is inserted into an insertion portion formed between adjacent sub-platelets on at least any one of surfaces of the loading surface and the loading surface, and the sub-platelets adjacent to each other electrically conduct each other Wherein the tray is used in a substrate processing system. The method of claim 4,
Wherein the conductive portion further comprises a non-conductive covering member which covers the conductive member to form a part of the opposite surface of the mounting surface or the mounting surface. The method of claim 5,
Wherein the closure member is bonded to the conductive member or joined by a fastening member. The method of claim 5,
Wherein at least one of the conductive member and the covering member fixes the adjacent sub-plate members to each other. The method of claim 7,
Wherein at least one of the conductive member and the cover member has a U-shaped shape and has a pair of protruding ends to be inserted into the insertion portion, or is coupled to the sub-plate member by a fastening member. Tray used in processing system. The method of claim 4,
Wherein the conductive member is made of a nonconductive part forming part of the opposite surface of the mounting surface or the mounting surface, and the surface of the nonconductive part facing the sub-surface member is coated with a conductive material. Tray used in processing system. The method of claim 9,
Wherein the conductive member fixes the adjoining sub-plate members to each other in a fixed manner. The method of claim 10,
Wherein the conductive member has a U-shaped shape and has a pair of protruding ends to be inserted into the insertion portion, or is coupled to the sub-plate member by a fastening member. The method according to claim 1,
Wherein the sub-plate member has a CC composite or a graphite material. A load lock module that is connected to the process module and receives a tray on which a plurality of substrates to be processed by the substrate are stacked, and transfers the tray to the process module; And an unloading lock module coupled to the process module for receiving a tray on which a plurality of substrates having been subjected to the substrate processing have been stacked,
Wherein the tray is used with a tray according to any one of claims 1 to 12. 14. The method of claim 13,
Wherein the loadlock module, the process module and the unload lock module are arranged in-line. The method of claim 13,
Wherein the load lock module and the unload lock module are vertically disposed on one side of the process module. 16. The method of claim 15,
Wherein the process module is provided with a tray handling unit that receives the tray from the load lock module and mounts the tray on the tray supporting unit and transfers the tray to the unloading lock module after the substrate processing. 18. The method of claim 16,
The tray handling unit includes a first tray transfer unit that receives a tray from the load lock module and transfers the tray to the tray support unit, and a second tray transfer unit that transfers the tray from the tray support unit to the unload lock module,
Wherein the tray supporting portion is installed to be movable up and down between the first tray transferring portion and the second tray transferring portion. The method of claim 15,
Wherein the load lock module and the unload lock module comprise one chamber or a separate chamber. 19. The method of claim 18,
Wherein the load lock module and the unload lock module are independently vacuum controlled.

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