KR102051042B1 - Electric circuit using variable low resistance area and controlling thereof - Google Patents

Abstract

An embodiment of the present invention discloses an electronic circuit which comprises: an active layer comprising a spontaneous polarizable material; at least one application electrode disposed to be adjacent to the active layer; a polarization region formed in the active layer by applying an electric field to the active layer through the application electrode; a variable low resistance region including a region having a lower electrical resistance than another adjacent region corresponding to a boundary of the polarization region; and a plurality of connection electrode portions spaced from the application electrode and having a selectively generated current path by the variable low resistance region. According to the present invention, the electronic circuit can be used for various purposes.

Description

Electronic circuit using variable low resistance area and controlling method thereof

The present invention relates to an electronic circuit using a variable low resistance region and a control method thereof.

As the interest in the development of technology and the convenience of people's life has increased, attempts to develop various electronic products have been active.

In addition, these electronic products are becoming smaller and more compact, and the places where they are used are widely increasing.

Such electronic products include various electrical elements, for example CPUs, memories, and various other electrical elements. Such base elements may include various types of electrical circuits.

For example, electric devices are used in various fields such as computers and smartphones, as well as home sensor devices for IoT and bioelectronic devices for ergonomics.

On the other hand, according to the recent speed of technology development and the rapid improvement of the living standard of users, the use and application fields of such electric devices are rapidly increased, and the demand is increasing accordingly.

According to this trend, there are limitations in implementing and controlling electronic circuits that are easily and quickly applied to various commonly used electrical components.

The present invention can provide an electronic circuit and a control method thereof using a variable low resistance region that can be easily applied to various applications.

An embodiment of the present invention provides an active layer comprising a spontaneous polarizable material, at least one applying electrode disposed to be adjacent to the active layer, a polarization region formed in the active layer by applying an electric field to the active layer through the applying electrode, and the polarization region. A variable low resistance region including a region having a lower electrical resistance than another adjacent region corresponding to the boundary of the electrode; and a plurality of connection electrode portions spaced apart from the applied electrode and selectively generated by the variable low resistance region. An electronic circuit is disclosed.

In the present embodiment, the application electrode may be formed to include a plurality of application electrodes spaced apart from each other.

In the present embodiment, at least one connection electrode of the plurality of connection electrodes is disposed on one side of the plurality of application electrodes, and at least another connection electrode of the plurality of connection electrodes is disposed on the other side of the plurality of application electrodes. It may include being.

In the present embodiment, the application electrode may include a plurality of application electrodes arranged in at least one direction and a plurality of application electrodes arranged in another direction crossing the same.

In the present embodiment, one connection electrode of the plurality of connection electrodes is disposed on one side of the plurality of application electrodes arranged in the one direction, and one connection electrode of the plurality of connection electrodes is arranged in the one direction. It may be disposed on the other side of the two applying electrodes.

In the present embodiment, the application electrode may include a plurality of application electrodes spaced apart from each other, and at least one of the plurality of connection electrodes may be disposed between the plurality of application electrodes.

In the present embodiment, the connection electrode part may include a terminal part.

In the present exemplary embodiment, the variable low resistance region may be generated or extinguished under the control of the polarization region by controlling the electric field through the application electrode.

In the present exemplary embodiment, polarization regions in different directions may be formed on both sides of one variable low resistance region of the plurality of variable low resistance regions.

In this embodiment, by controlling the time to apply the electric field through the application electrode, a plurality of polarization regions spaced apart from each other includes a region overlapping in one region, one region of the plurality of variable low resistance region corresponding to It may include regions overlapping each other and integrated.

In the present exemplary embodiment, the variable low resistance region may be maintained even when the electric field applied through the application electrode is removed.

In the present exemplary embodiment, the variable low resistance region may be formed to include a linear shape around the application electrode.

Another embodiment of the present invention is to form a polarized region of the active layer by applying an electric field to the active layer through the application electrode for the active layer comprising a spontaneous polarizable material and the applied electrode disposed adjacent to the active layer, Forming a variable low resistance region including a region having a lower electrical resistance than another adjacent region corresponding to the boundary of the polarization region and a plurality of connection electrode portions spaced apart from the applied electrode by the variable low resistance region; Disclosed is an electronic circuit control method comprising the step of selectively generating a path.

In the present exemplary embodiment, the application electrode may be formed to include a plurality of application electrodes spaced apart from each other, and a plurality of variable low resistance regions may be formed through the plurality of application electrodes.

In the present exemplary embodiment, the plurality of variable low resistance regions may be overlapped and integrated in at least one region.

In the present embodiment, a flow of current may be formed in at least one direction through the plurality of connection electrodes.

In the present embodiment, the flow of current may be formed in one direction and the other direction crossing the plurality of connection electrodes.

In the present exemplary embodiment, the variable low resistance region may include generating or dissipating under the control of the polarization region by controlling an electric field through the applying electrode.

In the present exemplary embodiment, the application electrode may be formed to include a plurality of application electrodes spaced apart from each other, and a logic circuit including a product or sum may be formed through the plurality of application electrodes and the plurality of connection electrodes.

Other aspects, features, and advantages other than those described above will become apparent from the following drawings, claims, and detailed description of the invention.

The electronic circuit using the variable low resistance region and the control method thereof according to the present invention can be easily applied to various applications.

1 is a schematic plan view showing an electronic circuit according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1.
FIG. 3 is an enlarged view of K of FIG. 2.
4A to 4C are diagrams for describing the electronic circuit related control method of FIG. 1.
5 is a schematic plan view showing an electronic circuit according to an embodiment of the present invention.
FIG. 6 is a cross-sectional view taken along the line II-II of FIG. 5.
7 to 11 are diagrams for describing an operation of the electronic circuit of FIG. 5.
12 is a schematic plan view showing an electronic circuit according to another embodiment of the present invention.
FIG. 13 is a cross-sectional view taken along the line VV of FIG. 12.
14 is a schematic plan view showing an electronic circuit according to another embodiment of the present invention.
15 is a schematic plan view showing an electronic circuit according to another embodiment of the present invention.
16 is a schematic plan view showing an electronic circuit according to another embodiment of the present invention.
17 is a schematic plan view of an electronic device according to still another embodiment of the present invention.
18 and 19 are diagrams for describing an operation of the electronic device of FIG. 17.
20 is a schematic plan view of an electronic device according to still another embodiment of the present invention.
21 and 22 are diagrams for describing an operation of the electrical device of FIG. 20.
23 is a schematic plan view of an electronic device according to still another embodiment of the present invention.
24 and 25 are diagrams for describing an operation of the electrical device of FIG. 23.
FIG. 26 is a diagram for describing another example of the operation of the electric element of FIG. 23.

Hereinafter, with reference to the embodiments of the present invention shown in the accompanying drawings will be described in detail the configuration and operation of the present invention.

As the invention allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the written description. Effects and features of the present invention, and methods of achieving them will be apparent with reference to the embodiments described below in detail together with the drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various forms.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, and the same or corresponding components will be denoted by the same reference numerals, and redundant description thereof will be omitted. .

In the following embodiments, the terms first, second, etc. are used for the purpose of distinguishing one component from other components rather than a restrictive meaning.

In the following examples, the singular forms "a", "an" and "the" include plural forms unless the context clearly indicates otherwise.

In the following examples, the terms including or having have meant that there is a feature or component described in the specification and does not preclude the possibility of adding one or more other features or components.

In the drawings, components may be exaggerated or reduced in size for convenience of description. For example, the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of description, and thus the present invention is not necessarily limited to the illustrated.

In the following embodiments, the x-axis, y-axis and z-axis are not limited to three axes on the Cartesian coordinate system, but may be interpreted in a broad sense including the same. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may refer to different directions that are not orthogonal to each other.

In the case where an embodiment may be implemented differently, a specific process order may be performed differently from the described order. For example, two processes described in succession may be performed substantially simultaneously or in the reverse order of the described order.

1 is a schematic plan view showing an electronic circuit according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1, and FIG. 3 is an enlarged view of K of FIG.

1 and 2, the electronic circuit 10 of the present exemplary embodiment may include an active layer 11, an application electrode 12, and a variable low resistance region VL.

The active layer 11 may comprise a spontaneous polarizable material. For example, the active layer 11 may include an insulating material and may include a ferroelectric material. That is, the active layer 11 may comprise a material having spontaneous electrical polarization (electric dipole) that can be reversed in the presence of an electric field.

As an alternative embodiment the active layer 11 may comprise a perovskite-based material, for example, it may include _{BaTiO 3, SrTiO 3, BiFe3,} PbTiO3, PbZrO3, SrBi2Ta2O9.

As another example, the active layer 11 may have an ABX3 structure, and A may include one or more materials selected from an alkyl group of CnH2n + 1 and inorganic materials such as Cs and Ru, which may form perovskite solar cells, and B May comprise one or more materials selected from the group consisting of Pb, Sn, Ti, Nb, Zr, and Ce, and X may comprise a halogen material. Specific examples of the active layer 11 include CH ₃ NH ₃ PbI ₃ , CH ₃ NH ₃ PbI _x Cl _3-x , MAPbI _3, CH ₃ NH ₃ PbI _x Br _3-x , CH ₃ NH ₃ PbClxBr _3-x , HC (NH ₂ ) ₂ PbI ₃ , HC (NH ₂ ) ₂ PbI _x Cl _3-x , HC (NH ₂ ) ₂ PbI _x Br _3-x , HC (NH ₂ ) ₂ PbCl _x Br _3-x , (CH ₃ NH ₃ ) (HC (NH ₂ ) ₂ ) _1-y PbI ₃ , (CH ₃ NH ₃ ) (HC (NH ₂ ) ₂ ) _1-y PbI _x Cl _3-x , (CH ₃ NH ₃ ) (HC ( NH ₂ ) ₂ ) _1-y PbI _x Br _3-x , or (CH ₃ NH ₃ ) (HC (NH ₂ ) ₂ ) _1-y PbCl _x Br _3-x (0 ≦ x, y ≦ 1) can do.

Since the active layer 11 may be formed using various other ferroelectric materials, description of all examples thereof will be omitted. In addition, when the active layer 11 is formed, the ferroelectric material may be doped with various other materials to include additional functions or to improve electrical characteristics.

The active layer 11 has spontaneous polarization and can control the degree and direction of polarization according to the application of an electric field. In addition, the active layer 11 may maintain the polarization state even if the applied electric field is removed.

The applying electrode 12 may be formed to apply an electric field to the active layer 11, for example, to apply a voltage to the active layer 11.

In some embodiments, the applying electrode 12 may be formed to contact the top surface of the active layer 11.

In addition, the applying electrode 12 may be formed to apply various voltages to the active layer 11 and to control the time of applying the voltage.

In some embodiments, the applying electrode 12 may be a gate electrode.

For example, the applying electrode 12 may be electrically connected to a power source (not shown) or a power control unit.

The applying electrode 12 may include various materials and may include a material having high electrical conductivity. For example, the application electrode 12 may be formed using various metals.

For example, the application electrode 12 may be formed to contain aluminum, chromium, titanium, tantalum, molybdenum, tungsten, neodymium, scandium or copper. Or may be formed using alloys of these materials or nitrides of these materials.

In some embodiments, the applying electrode 12 may also include a laminate structure.

Although not shown, in some embodiments, one or more insulating layers may be further disposed between the applying electrode 12 and the active layer 11.

The variable low resistance region VL is a region formed in the active layer 11 and is a region through which current can flow, and may be formed as a path of a current having a linear shape around the application electrode 12 as shown in FIG. 1. have.

Specifically, the variable low resistance region VL is a region in which the electrical resistance is lower than that of other regions adjacent to the variable low resistance region VL among the regions of the active layer 11.

In addition, after the variable low resistance region VL is formed through the application electrode 12, even if the electric field through the application electrode 12 is removed or, for example, the voltage is removed, the polarization state of the active layer 11 is maintained. Since the variable low resistance region VL is maintained, the state where the path of the current is formed can be maintained.

Through this, various electronic circuits can be configured.

The variable low resistance region VL has a height HVL, and this height HVL may correspond to the entire thickness of the active layer 11.

The height HVL of the variable low resistance region VL may be proportional to the strength of the electric field when the electric field is applied through the application electrode 12, for example, the magnitude of the voltage. At least the magnitude of this electric field may be larger than the inherent anti-electric field of the active layer 11.

The variable low resistance region VL is a region formed when a voltage is applied to the active layer 11 through the application electrode 12, and may be changed, for example generated, disappeared, or moved through the control of the application electrode 12. .

The active layer 11 may include a first polarization region 11F having a first polarization direction, and the variable low resistance region VL may be formed at the boundary of the first polarization region 11F.

In addition, a second polarization region 11R having a second polarization direction may be included adjacent to the first polarization region 11F, and the variable low resistance region VL is formed at the boundary of the second polarization region 11R. Can be formed. The second direction may be at least a different direction from the first direction, for example, a direction opposite to the first direction.

For example, the variable low resistance region VL may be formed between the first polarization region 11F and the second polarization region 11R.

The variable low resistance region VL may have a width WVL in one direction, which may be proportional to the moving distance of the variable low resistance region VL.

In addition, the width WVL may be a width of a planar region defined as the variable low resistance region VL, which may correspond to the width of the first polarization region 11F.

In addition, the variable low resistance region VL may be formed to correspond to the entire side surface of the boundary line of the first polarization region 11F, and may have a thickness TVL1 in a direction away from the side surface of the first polarization region 11F. have.

In an alternative embodiment, this thickness TVL1 may be between 0.1 and 0.3 nanometers.

4A to 4C are diagrams for describing a current path range control method for the electronic circuit of FIG. 1.

Referring to FIG. 4A, the active layer 11 may include a second polarization region 11R having a second polarization direction. In some embodiments, a polarization state of the active layer 11 as illustrated in FIG. 4A may be formed by applying an initialization electric field through the application electrode 12.

4B, the first polarization region 11F is formed in the active layer 11. As a specific example, the first polarization region 11F may first be formed in an area overlapping the application electrode 12 so as to correspond to the width of the application electrode 12.

The height HVL of the first polarization region 11F can be formed to be larger than the anti-electromagnetic field of the active layer 11 through the applying electrode 12 and at least correspond to the entire thickness of the active layer 11. An electric field may be applied to the active layer 11.

The polarization direction of one region of the second polarization region 11R of the active layer 11 may be changed to the first polarization region 11F by applying the electric field through the application electrode 12.

In some embodiments, the growth speed in the height HVL direction of the first polarization region 11F may be very fast, for example, it may grow at a speed of 1 km / sec.

Then, continuously maintaining the electric field through the applying electrode 12, that is, as time passes, the first polarization region 11F moves in the horizontal direction H, that is, the direction orthogonal to the height HVL, and becomes large in size. Can be. That is, the region of the second polarization region 11R can be gradually converted to the first polarization region 11F.

As an optional embodiment, the growth speed of the first polarization region 11F in the horizontal direction H may be very fast, for example, it may grow at a speed of 1 m / sec (seconds).

Through this, the size of the variable low resistance region VL can be controlled. For example, the size of the variable low resistance region VL is the width of the variable low resistance region VL and corresponds to the growth distance of the first polarization region 11F. It can be proportional to the holding time. For example, the growth distance can be proportional to the product of the growth speed and the field hold time.

In addition, the growth speed of the first polarization region 11F may be proportional to the sum of the growth speed in the height HVL direction and the growth speed in the horizontal direction H. FIG.

Therefore, the size of the variable low resistance region VL can be adjusted as desired by controlling the electric field holding time.

In detail, as illustrated in FIG. 4C, the first polarization region 11F is widened and widened, so that the variable low resistance region VL may also move away from the application electrode 12.

The present embodiment applies an electric field to the active layer through an application electrode to form a first polarization region having a first polarization direction different from the second polarization direction in the active layer, and at the boundary between the first polarization region and the second polarization region. A corresponding variable low resistance region can be formed. Such a variable low resistance region is a region of low resistance and may be a path of current as a region of low resistance, thereby easily forming an electronic circuit.

In addition, the present embodiment may control the magnitude of the electric field through the applied electrode, for example, to control the magnitude of the voltage to determine the height of the variable low resistance region, and specifically, to have a height corresponding to the overall thickness of the active layer. can do.

In addition, the size of the variable low resistance region, for example, the width, can be determined by controlling the time for maintaining the electric field through the application electrode. The size of the path of the current flow can be easily controlled by controlling the size of the variable low resistance region.

In addition, even if the electric field through the applied electrode is removed, the polarization state of the polarization region is maintained, so that the passage of current can be easily maintained, and if the polarization region is expanded by continuously maintaining the electric field through the application electrode, the already formed variation is reduced. The resistance region may have a low resistance so that no current flows.

Through this, it is possible to control the disappearance of the current path, and as a result, it is possible to easily control the flow of the current.

The electronic circuit of the present embodiment can be controlled to be used for various purposes, and for example, one or more electrodes can be connected to contact the variable low resistance region.

FIG. 5 is a schematic plan view showing an electronic circuit according to an embodiment of the present invention, and FIG. 6 is a cross-sectional view taken along the line II-II of FIG. 5.

5 and 6, the electronic circuit 100 of the present exemplary embodiment may include an active layer 110, an application electrode 120, a variable low resistance region VL, and one or more connection electrode portions 131 and 132. have.

The active layer 110 may comprise a spontaneous polarizable material. For example, the active layer 110 may include an insulating material and may include a ferroelectric material. That is, the active layer 110 may include a material having spontaneous electrical polarization (electric dipole) that may be reversed in the presence of an electric field.

As an alternative embodiment the active layer 110 may comprise a perovskite-based material, for example, it may include _{BaTiO 3, SrTiO 3, BiFe3,} PbTiO3, PbZrO3, SrBi2Ta2O9.

As another example, the active layer 110 may have an ABX3 structure, and A may include at least one material selected from an alkyl group of CnH2n + 1, and inorganic materials such as Cs and Ru, which may form perovskite solar cells. May comprise one or more materials selected from the group consisting of Pb, Sn, Ti, Nb, Zr, and Ce, and X may comprise a halogen material. As an example, the active layer 110 may be formed of CH ₃ NH ₃ PbI ₃ , CH ₃ NH ₃ PbI _x Cl _3-x , MAPbI _3, CH ₃ NH ₃ PbI _x Br _3-x , CH ₃ NH ₃ PbClxBr _3-x , HC (NH ₂ ) ₂ PbI ₃ , HC (NH ₂ ) ₂ PbI _x Cl _3-x , HC (NH ₂ ) ₂ PbI _x Br _3-x , HC (NH ₂ ) ₂ PbCl _x Br _3-x , (CH ₃ NH ₃ ) (HC (NH ₂ ) ₂ ) _1-y PbI ₃ , (CH ₃ NH ₃ ) (HC (NH ₂ ) ₂ ) _1-y PbI _x Cl _3-x , (CH ₃ NH ₃ ) (HC ( NH ₂ ) ₂ ) _1-y PbI _x Br _3-x , or (CH ₃ NH ₃ ) (HC (NH ₂ ) ₂ ) _1-y PbCl _x Br _3-x (0 ≦ x, y ≦ 1) can do.

Since the active layer 110 may be formed using various other ferroelectric materials, description of all examples thereof will be omitted. In addition, when the active layer 110 is formed, the ferroelectric material may be doped with various other materials to include additional functions or to improve electrical characteristics.

The active layer 110 has spontaneous polarization and can control the degree and direction of polarization according to the application of an electric field. In addition, the active layer 110 may maintain the polarization state even if the applied electric field is removed.

The applying electrode 120 may be formed to apply an electric field to the active layer 110, for example, to apply a voltage to the active layer 110.

In some embodiments, the applying electrode 120 may be formed to contact the top surface of the active layer 110.

In addition, the applying electrode 120 may apply various voltages to the active layer 110 and may be formed to control the time of applying the voltage.

In some embodiments, the applying electrode 120 may be a gate electrode.

For example, the applying electrode 120 may be electrically connected to a power source (not shown) or a power control unit.

The applying electrode 120 may include various materials and may include a material having high electrical conductivity. For example, the application electrode 120 may be formed using various metals.

For example, the application electrode 120 may be formed to contain aluminum, chromium, titanium, tantalum, molybdenum, tungsten, neodymium, scandium, or copper. Or may be formed using alloys of these materials or nitrides of these materials.

In some embodiments, the applying electrode 120 may also include a laminate structure.

The connection electrode parts 131 and 132 may include one or more electrode members, for example, the first connection electrode member 131 and the second connection electrode member 132.

The connection electrode parts 131 and 132 may be formed on the active layer 110, for example, may be formed on the top surface of the active layer 110 to be spaced apart from the application electrode 120, and in some embodiments, the active layer 110. It may be formed in contact with).

The first connection electrode member 131 and the second connection electrode member 132 may be formed using various conductive materials. For example, the first connection electrode member 131 and the second connection electrode member 132 may be formed to contain aluminum, chromium, copper, tantalum, titanium, molybdenum, or tungsten.

In some embodiments, the first connection electrode member 131 and the second connection electrode member 132 may include a structure in which a plurality of conductive layers are stacked.

In some embodiments, the first connection electrode member 131 and the second connection electrode member 132 may be formed using a conductive metal oxide, for example, indium oxide (eg, In ₂ O ₃ ) or tin oxide. (E.g., SnO ₂ ), zinc oxide (eg, ZnO), indium tin oxide alloy (eg, In ₂ O ₃ -SnO ₂ ) or indium zinc oxide alloy (eg, In ₂ O ₃ -ZnO) Can be formed.

In some embodiments, the connection electrode parts 131 and 132 may be terminal members including input and output of electrical signals.

As a specific example, the first connection electrode member 131 and the second connection electrode member 132 of the connection electrode parts 131 and 132 may include a source electrode or a drain electrode.

7 to 11 are diagrams for describing an operation of the electronic circuit of FIG. 5.

FIG. 7 is a view illustrating a state in which a first electric field is applied through the applying electrode 120, FIG. 8 is a cross-sectional view taken along the line VII-VII of FIG. 7, and FIG. 9 is an enlarged view of K of FIG. 8. to be.

7 to 9, when the first electric field is applied to the active layer 110 through the application electrode 120, at least one region of the active layer 110 may include a polarization region 110F.

The polarization region 110F may be shaped to surround the application electrode 120 around the application electrode 120. The polarization region 110F may have a boundary line.

The first variable low resistance region VL1 may be formed in an area corresponding to the side surface of the boundary line. Referring to FIG. 10, the application electrode 120 may be formed to linearly surround the application electrode 120.

For example, the first variable low resistance region VL1 may have a first width WVL1 in one direction to surround the application electrode 120.

In addition, the first variable low resistance region VL1 may be formed to correspond to the entire side surface of the boundary line of the polarization region 110F and may have a thickness TVL1 in a direction away from the side surface of the polarization region 110F.

In an alternative embodiment, this thickness TVL1 may be between 0.1 and 0.3 nanometers.

In some embodiments, the initialization electric field may be applied to the active layer 110 before the first voltage is applied to the active layer 110 through the application electrode 120.

The process of applying the initializing electric field to the active layer 110 may include converting all regions of the active layer 110 into polarization in a different direction from the polarization region 110F, for example, in the opposite polarization region. .

Then, the polarization region 110F may be formed in one region by applying an electric field in the opposite direction.

The first variable low resistance region VL1 formed at the boundary of the polarization region 110F of the active layer 110 may be changed to a region having a lower resistance than other regions of the active layer 110. For example, the first variable low resistance region VL1 may have a lower resistance than the polarization region 110F of the active layer 110 and the area of the active layer 110 around the first variable low resistance region VL1.

As a result, the first variable low resistance region VL1 may form a current passage.

In some embodiments, the first variable low resistance region VL1 may correspond to one region of a plurality of domain walls provided in the active layer 110.

In addition, the first variable low resistance region VL1 may be maintained when the polarization state of the polarization region 110F of the active layer 110 is maintained. That is, even when the first voltage applied to the active layer 110 is removed through the application electrode 120, the state of the variable low resistance region VL1, that is, the low resistance state may be maintained.

As illustrated in FIGS. 7 and 8, a passage of current may be formed through the first variable low resistance region VL1. However, since the connection electrode parts 131 and 132 do not correspond to the first variable low resistance region VL1, the flow of current through the connection electrode parts 131 and 132 may not occur.

FIG. 10 is a view illustrating a state in which the first electric field is further maintained for a predetermined time through the applying electrode 120, and FIG. 11 is a cross-sectional view taken along the line VII-XI of FIG. 10.

Referring to FIGS. 10 and 11, the holding time of the first electric field through the applying electrode 120 is long, so that the polarization region 110F of FIGS. 7 and 8 moves in the horizontal direction, thereby increasing the polarization region 110F. A second variable low resistance region VL2 that is larger than the first variable low resistance region VL1 may be formed.

For example, the voltage applied in FIGS. 7 and 8 may be continuously maintained for a predetermined time to form a structure as shown in FIGS. 10 and 11.

The polarization region 110F may be shaped to surround the application electrode 120 around the application electrode 120. The polarization region 110F may have a boundary line. The second variable low resistance region VL2 may be formed in a region corresponding to the side of the boundary line of the polarization region 110F. Referring to FIG. 10, the application electrode 120 may be formed to linearly surround the application electrode 120.

For example, the second variable low resistance region VL2 may have a second width WVL2 in one direction so as to surround the application electrode 120, and the second width WVL2 is greater than the first width WVL1. Can be.

In addition, the second variable low resistance region VL2 may be formed to correspond to the entire side of the boundary line of the polarization region 110F, may have a thickness in a direction away from the side of the polarization region 110F, and an exemplary embodiment As such, the thickness may be between 0.1 and 0.3 nanometers.

The second variable low resistance region VL2 formed at the boundary of the polarization region 110F of the active layer 110 may be changed to a region having a lower resistance than other regions of the active layer 110. For example, the second variable low resistance region VL2 may have a lower resistance than the polarization region 110F of the active layer 110 and the area of the active layer 110 around the second variable low resistance region VL2.

As a result, the second variable low resistance region VL2 may form a passage for current.

In some embodiments, the second variable low resistance region VL2 may correspond to one region of a plurality of domain walls provided in the active layer 110.

In addition, the second variable low resistance region VL2 may be maintained when the polarization state of the active layer 110 is maintained. That is, even when the second voltage applied to the active layer 110 is removed through the application electrode 120, the state of the second variable low resistance region VL2, that is, the low resistance state may be maintained.

Therefore, a passage of current may be formed through the second variable low resistance region VL2.

In addition, as a specific example, the connection electrode parts 131 and 132 are formed to correspond to the second variable low resistance region VL2, for example, the first connection electrode member 131 and the connection electrode parts 131 and 132. The second connection electrode member 132 may be disposed to contact the top surface of the second variable low resistance region VL2 while being spaced apart from each other.

As a result, current may flow through the first connection electrode member 131 and the second connection electrode member 132 of the connection electrode parts 131 and 132.

In addition, various electrical signals may be generated. For example, when the electric field is continuously applied in the states of FIGS. 10 and 11, that is, when the application time increases, the second variable low resistance region VL2 moves further to move the first connection electrode member 131 and the first connection electrode. 2 may be out of the connecting electrode member 132. Accordingly, no current may flow through the first connection electrode member 131 and the second connection electrode member 132.

In addition, as an optional embodiment, the initialization process may be performed for the entirety of the active layer 110.

Then, when the electric field is applied to the active layer 110 through the application electrode 120, current flows in the first connection electrode member 131 and the second connection electrode member 132 of the connection electrode parts 131 and 132. Can be.

The electronic circuit of this embodiment can apply various sizes of voltages to the active layer through the application electrode, and can control the time of application.

As a result, a polarization region may be formed in the active layer with a region having a desired size, and a variable low resistance region may be formed at the boundary of the polarization region.

When the connection electrode portion is formed to correspond to such a variable low resistance region, for example, a current may flow through the connection electrode portion, and even if the voltage is removed, the active layer containing the ferroelectric material may maintain the polarization state. The variable low resistance region of the boundary can also be maintained so that current can continue to flow.

In addition, a voltage may be applied to the active layer through the applying electrode so that the variable low resistance region is changed into the polarization region, so that no current flows through the connection electrode portion through which the current flows.

The flow of current can be controlled by controlling the voltage of the applied electrode, and the electronic circuit can be used for various applications through the control of the flow of current.

As an alternative embodiment, the electronic circuitry can be used as a memory.

For example, it can be used as a memory by defining a current flow as 1 and a non-flowing value as 0. As a specific example, it can be used as a nonvolatile memory as the current can flow even when voltage is removed.

In addition, the electronic circuit may constitute a circuit unit that generates and transmits various signals, and may also be used as a switching element.

In addition, since it can be applied in a simple structure to the part requiring the control of the electrical signal can be applied to various fields such as a variable circuit, a CPU, a biochip.

12 is a schematic plan view of an electronic circuit according to another exemplary embodiment of the present invention, and FIG. 13 is a cross-sectional view taken along the line VV of FIG. 12.

12 and 13, the electronic circuit 200 of the present exemplary embodiment may include an active layer 210, an applying electrode 220, a variable low resistance region VL, and connection electrode portions 231 and 232.

For convenience of explanation, the following description will focus on differences from the above-described embodiment.

The active layer 210 may comprise a spontaneous polarizable material. For example, the active layer 210 may include an insulating material and may include a ferroelectric material. That is, the active layer 210 may include a material having spontaneous electrical polarization (electric dipole) that may be reversed in the presence of an electric field.

Description of the material for forming the active layer 210 is the same as described in the above embodiments or may be applied by modifying the bar, a detailed description thereof will be omitted.

The applying electrode 220 may be formed to apply an electric field to the active layer 210, for example, to apply a voltage to the active layer 210.

In some embodiments, the applying electrode 220 may be formed to contact the top surface of the active layer 210.

The description of the material forming the application electrode 220 may be the same as described in the above-described embodiment or may be modified and applied thereto, and thus a detailed description thereof will be omitted.

The connection electrode parts 231 and 232 may include one or more electrode members, for example, the first connection electrode member 231 and the second connection electrode member 232.

The connection electrode parts 231 and 232 may be formed on the active layer 210, for example, on the opposite side of the surface of the active layer 210 on which the application electrode 220 is formed so as to be spaced apart from the application electrode 220. Can be formed.

The applying electrode 220 may be formed on the top surface of the active layer 210, and the connection electrode parts 231 and 232 may be formed on the bottom surface of the active layer 210.

In some embodiments, the connection electrode parts 231 and 232 may be formed to contact the active layer 210.

The first connection electrode member 231 and the second connection electrode member 232 may be formed using various conductive materials.

The description of the material forming the first connection electrode member 231 and the second connection electrode member 232 may be the same as described in the above-described embodiment, or may be modified and applied thereto.

Referring to FIG. 13, when a voltage is applied to the active layer 210 through the applying electrode 220, at least one region of the active layer 210 may include a polarization region 210F.

The variable low resistance region VL may be formed in a region corresponding to the side of the boundary line of the polarization region 210F. Referring to FIG. 12, the variable low resistance region VL surrounds the application electrode 220 around the application electrode 220. It can be formed as.

For example, the variable low resistance region VL2 may have a width in one direction to surround the application electrode 220.

In addition, the variable low resistance region VL may be formed to correspond to the entire side of the boundary line of the polarization region 210F, and may have a thickness in a direction away from the side of the polarization region 210F. The thickness can be 0.1 to 0.3 nanometers.

The variable low resistance region VL formed at the boundary of the polarization region 210F of the active layer 210 may be changed to a region having a lower resistance than other regions of the active layer 210. For example, the variable low resistance region VL may have a lower resistance than the polarization region 210F of the active layer 210 and the area of the active layer 210 around the variable low resistance region VL.

As a result, the variable low resistance region VL may form a passage for current.

In some embodiments, the variable low resistance region VL may correspond to one region of a plurality of domain walls provided in the active layer 210.

In addition, the variable low resistance region VL may be maintained when the polarization state of the active layer 210 is maintained. That is, even when the voltage applied to the active layer 210 is removed through the application electrode 220, the state of the variable low resistance region VL, that is, the low resistance state may be maintained.

A passage of current may be formed through the variable low resistance region VL.

In addition, as a specific example, the connection electrode parts 231 and 232 are formed to correspond to the variable low resistance region VL, for example, the first connection electrode member 231 and the second connection of the connection electrode parts 231 and 232. The electrode member 232 may be disposed to contact the bottom surface of the variable low resistance region VL while being spaced apart from each other.

As a result, current may flow through the first connection electrode member 231 and the second connection electrode member 232 of the connection electrode units 231 and 232.

The electronic circuit of this embodiment can apply various sizes of voltages to the active layer through the application electrode, and can control the time of application.

As a result, a polarization region may be formed in the active layer with a region having a desired size, and a variable low resistance region may be formed at the boundary of the polarization region.

In addition, an application electrode may be formed on one surface of the active layer and a connection electrode portion may be formed on the other surface to facilitate precise patterning and miniaturization of the electronic circuit.

14 is a schematic plan view showing an electronic circuit according to another embodiment of the present invention.

Referring to FIG. 14, the electronic circuit 600 of the present exemplary embodiment may include an active layer 610, first and second applied electrodes 621 and 622, first and second variable low resistance regions VL1 and VL2, and a connecting electrode part 631. , 632, 641, 642.

The active layer 610 may comprise a spontaneous polarizable material. For example, the active layer 610 may include an insulating material and may include a ferroelectric material. That is, the active layer 610 may comprise a material with spontaneous electrical polarization (electric dipole) that can be reversed in the presence of an electric field.

Description of the material for forming the active layer 610 is the same as described in the above embodiments or may be modified and applied to the bar, a detailed description thereof will be omitted.

The first and second applying electrodes 621 and 622 may be formed to apply an electric field to the active layer 610, and for example, a voltage may be applied to the active layer 610.

In some embodiments, the first and second application electrodes 621 and 622 may be formed to contact the top surface of the active layer 610, and the first and second application electrodes 621 and 622 may be spaced apart from each other. Can be.

The material for forming the first and second application electrodes 621 and 622 may be the same as or different from the application electrode described in the above-described embodiment, and thus a detailed description thereof will be omitted.

The connection electrode portions 631, 632, 641, and 642 may include one or more electrode members, for example, the first connection electrode member 631, the second connection electrode member 632, and the third connection electrode member ( 641 and a fourth connection electrode member 642.

The connection electrode portions 631, 632, 641, and 642 may be formed on the active layer 610, for example, may be formed on the upper surface of the active layer 610 so as to be spaced apart from the application electrode 620. It may be formed to contact the active layer 610 as.

The first connection electrode member 631, the second connection electrode member 632, the third connection electrode member 641, and the fourth connection electrode member 642 may be formed using various conductive materials.

The first connection electrode member 631, the second connection electrode member 632, the third connection electrode member 641, and the fourth connection electrode member 642 are the same as the descriptions of the connection electrode part in the above-described embodiment. Or it can be applied by modifying the specific description thereof will be omitted.

FIG. 14 is a diagram illustrating a state in which a first electric field is applied through the first and second applying electrodes 621 and 622.

Referring to FIG. 14, when a first voltage is applied to the active layer 610 through the first applying electrode 621, at least one region of the active layer 610 may include a polarization region (eg, an inner region of VL1). .

The polarization region of the active layer 610 may be shaped to surround the application electrode 620 around the first application electrode 621. That is, the inner region of the first variable low resistance region VL1 may correspond to the polarization region of the active layer 610.

The first variable low resistance region VL1 may be formed in an area corresponding to the side surface of the boundary line. Referring to FIG. 14, the applied electrode 620 may be formed to linearly surround the applied electrode 620.

In addition, the first variable low resistance region VL1 may be formed to correspond to the entire side surface of the boundary line of the polarization region of the active layer 610, and may have a thickness in a direction away from the side surface of the polarization region.

In an alternative embodiment, such thickness may be between 0.1 and 0.3 nanometers.

Referring to FIG. 14, when the first electric field is applied to the active layer 610 through the second applying electrode 622, at least one region of the active layer 610 may include a polarization region (eg, an inner region of VL2). .

The polarization region of the active layer 610 may be shaped to surround the application electrode 620 around the second application electrode 621. That is, the inner region of the second variable low resistance region VL2 may correspond to the polarization region of the active layer 610.

The second variable low resistance region VL2 may be formed in a region corresponding to the side of the boundary line. Referring to FIG. 14, the applied electrode 620 may be formed to linearly surround the applied electrode 620.

In addition, the second variable low resistance region VL2 may be formed to correspond to the entire side surface of the boundary line of the polarization region of the active layer 610, and may have a thickness in a direction away from the side surface of the polarization region.

In an alternative embodiment, such thickness may be between 0.1 and 0.3 nanometers.

The second variable low resistance region VL2 may be formed to be spaced apart from the first variable low resistance region VL1.

For example, the first variable low resistance region VL1 and the second variable low resistance region VL2 may have a polygonal shape or a closed curve, respectively.

The first and second variable low resistance regions VL1 and VL2 may form passages of current, respectively.

A current path may be formed through the first variable low resistance region VL1, and the connection electrode portions 631 and 632 correspond to the first variable low resistance region VL1 to connect the connection electrode portions 631 and 632. The flow of current through may occur.

In addition, a passage of current may be formed through the second variable low resistance region VL2, and the connection electrode portions 641 and 642 correspond to the second variable low resistance region VL2 to connect the connection electrode portions 641 and 642. The flow of current through) may occur.

That is, the application of voltage through the first and second application electrodes 621 and 622 may be controlled to simultaneously form a passage of a different current for each region.

In some embodiments, the formation positions of the first connection electrode member 641 and the second connection electrode member 642 are disposed to face the formation positions of the third connection electrode member 643 and the fourth connection electrode member 644. The position of the passage of the current can be controlled to be distinguished.

The electronic circuit of this embodiment can apply various sizes of voltages to the active layer through the application electrode, and can control the time of application.

As a result, a polarization region may be formed in the active layer in a region having a desired size, and a first variable low resistance region and a second variable low resistance region may be formed at the boundary of the polarization region.

When the connection electrode portion is formed to correspond to the first variable low resistance region and the second variable low resistance region, for example, a current may flow through the connection electrode portion, and the active layer containing the ferroelectric material even if the voltage is removed. Can maintain the polarization state, and thus the variable low resistance region of the boundary can be maintained, so that the current can continue to flow.

In addition, a voltage may be applied to the active layer through the applying electrode so that the variable low resistance region is changed into the polarization region, so that no current flows through the connection electrode portion through which the current flows.

The flow of current can be controlled by controlling the voltage of the applied electrode, and the electronic circuit can be used for various applications through the control of the flow of current.

In addition, two current paths may be formed in the first variable low resistance region and the second variable low resistance region to facilitate generation and use of various signals.

15 is a schematic plan view showing an electronic circuit according to another embodiment of the present invention.

Referring to FIG. 15, the electronic circuit 700 of the present embodiment includes an active layer 710, first and second applied electrodes 721 and 722, a variable low resistance region VL, and a connection electrode part 731, 732, 741, and 742. ) May be included.

The active layer 710 may comprise a spontaneous polarizable material. For example, the active layer 710 may comprise an insulating material and may comprise a ferroelectric material. That is, the active layer 710 may comprise a material with spontaneous electrical polarization (electric dipole) that can be reversed in the presence of an electric field.

The description of the material for forming the active layer 710 is the same as described in the above embodiments or may be applied by modifying the bar, a detailed description thereof will be omitted.

The first and second applying electrodes 721 and 722 may be formed to apply an electric field to the active layer 710, for example, a voltage may be applied to the active layer 710.

In some embodiments, the first and second application electrodes 721 and 722 may be formed to contact the top surface of the active layer 710, and the first and second application electrodes 721 and 722 may be spaced apart from each other. Can be.

The description of the material forming the first and second application electrodes 721 and 722 may be the same as or different from the application electrode described in the above-described embodiment, and thus a detailed description thereof will be omitted.

The connection electrode parts 731, 732, 741, and 742 may include one or more electrode members. For example, the first connection electrode member 731, the second connection electrode member 732, and the third connection electrode member ( 741 and a fourth connection electrode member 742.

The connection electrode portions 731, 732, 741, and 742 may be formed on the active layer 710, for example, may be formed on the top surface of the active layer 710 so as to be spaced apart from the application electrode 720. It may be formed to contact the active layer 710 as.

The first connection electrode member 731, the second connection electrode member 732, the third connection electrode member 741, and the fourth connection electrode member 742 may be formed using various conductive materials.

The first connection electrode member 731, the second connection electrode member 732, the third connection electrode member 741, and the fourth connection electrode member 742 are the same as the descriptions of the connection electrode part in the above-described embodiment. Or it can be applied by modifying the specific description thereof will be omitted.

FIG. 15 illustrates a state in which a second electric field is applied through the first and second application electrodes 721 and 722.

As an alternative embodiment, FIG. 15 may have the same structure as that of FIG. 14 and maintain the first electric field longer than the state of FIG. 14 through the first and second applying electrodes 721 and 722. As a specific example, the two polarization regions formed in FIG. 14 may overlap each other and may be integrated. Accordingly, the variable low resistance region VL of FIG. 15 may be combined with the first variable low resistance region VL1 and the second variation of FIG. 14. The low resistance region VL2 may be overlapped while being integrated.

The variable low resistance region VL may be extended to correspond to one side of the active layer 710 and the other side facing the active layer 710.

The variable low resistance region VL may form a passage of current.

The connection electrode parts 731 and 741 may correspond to one line of the variable low resistance region VL to generate current.

In addition, the connection electrode portions 732 and 742 may correspond to one line of the variable low resistance region VL to generate a current.

As a result, current may flow on both sides of the active layer 710 with the first and second applied electrodes 721 and 722 at the center thereof.

The electronic circuit of this embodiment can apply various sizes of voltages to the active layer through the plurality of application electrodes, and can control the time of application.

As a result, a polarization region may be formed in the active layer with a region having a desired size, and the polarization region may be controlled to overlap.

The variable low resistance region may be formed at the boundary of the polarization region of the overlapped size, and may be formed to correspond to the side surface of the active layer.

Through the variable low resistance region, a current flow can be formed in various regions of the active layer.

16 is a schematic plan view showing an electronic circuit according to another embodiment of the present invention.

Referring to FIG. 16, the electronic circuit 800 according to the present exemplary embodiment includes the active layer 810, the first, second, and third applied electrodes 821, 822, and 823, the variable low resistance region VL, and the connection electrode portions 831, 832. ) May be included.

The active layer 810 may comprise a spontaneous polarizable material. For example, the active layer 810 may include an insulating material and may include a ferroelectric material. That is, the active layer 810 may include a material having spontaneous electrical polarization (electric dipole) that may be reversed in the presence of an electric field.

The description of the material for forming the active layer 810 is the same as described in the above-described embodiment or may be applied by modifying the bar, a detailed description thereof will be omitted.

The first, second, and third applying electrodes 821, 822, and 823 may be formed to apply an electric field to the active layer 810, and for example, a voltage may be applied to the active layer 810.

In some embodiments, the first, second, and third application electrodes 821, 822, and 823 may be formed to be in contact with the top surface of the active layer 810, and the first and second application electrodes 821, the second application electrode 822, and The third applying electrode 823 may be disposed to be spaced apart from each other.

The description of the material forming the first, second, and third application electrodes 821, 822, and 823 may be the same as or different from the application electrode described in the above-described embodiment, and thus a detailed description thereof will be omitted.

The connection electrode parts 831 and 832 may include one or more electrode members, for example, the first connection electrode member 831 and the second connection electrode member 832.

Also, as a specific example, the first connection electrode member 831 and the second connection electrode member 832 may correspond to the terminal portion, and the first connection electrode member 831 may be the first terminal portion and the second connection electrode member 832. ) May correspond to the second terminal unit.

The connection electrode portions 831 and 832 may be formed on the active layer 810, for example, may be formed on the top surface of the active layer 810 so as to be spaced apart from the application electrode 820, and in some embodiments, the active layer 810. It may be formed in contact with).

The first connection electrode member 831 and the second connection electrode member 832 may be formed using various conductive materials. The first connection electrode member 831 and the second connection electrode member 832 may be the same as the description of the connection electrode unit in the above-described embodiment or may be modified and applied thereto.

FIG. 16 is a diagram illustrating a state in which an electric field is applied through the first, second, and third application electrodes 821, 822, and 823.

For example, referring to FIG. 16, a voltage is applied to the active layer 810 through the first applying electrode 821, a voltage is applied to the active layer 810 through the second applying electrode 822, and a third applying electrode. The voltage may be applied to the active layer 810 through 823.

The polarization region through the first application electrode 821, the polarization region through the second application electrode 822, and the third application electrode 822 may overlap, and thus, the variation low resistance region also overlaps to reduce one variation. The resistance region VL may be formed.

In an exemplary embodiment, a region inside the one variable low resistance region VL may include a polarization region through the first application electrode 821, a polarization region through the second application electrode 822, and a third application electrode 822. It may be an overlapping area.

The variable low resistance region VL may form a passage of current.

The connection electrode parts 831 and 832 correspond to the variable low resistance region VL, and current may flow.

As a specific example, a current may flow from the first connection electrode member 831 corresponding to the first terminal part to the second connection electrode member 832 corresponding to the second terminal part, or a current flow may be generated in the opposite direction. .

The electronic circuit of this embodiment can apply various sizes of voltages to the active layer through the plurality of application electrodes, and can control the time of application.

As a result, a polarization region may be formed in the active layer with a region having a desired size, and the polarization region may be controlled to overlap.

The variable low resistance region may be formed at the boundary of the polarization region of the overlapped size, and may be formed to correspond to the side surface of the active layer.

Through the variable low resistance region, a current flow can be formed in various regions of the active layer.

17 is a schematic plan view of an electronic device according to still another embodiment of the present invention.

Referring to FIG. 17, the electronic device 900 of the present exemplary embodiment may include an active layer 910, a plurality of application electrodes 921, 922, 923, 924, 925, 925, 926, 927, 928, and 929 and a connection electrode part 931. , 932, 933, 934, 935, 936).

The active layer 910 may comprise a spontaneous polarizable material. For example, the active layer 910 may include an insulating material and may include a ferroelectric material. That is, the active layer 910 may include a material having spontaneous electrical polarization (electric dipole) that may be reversed in the presence of an electric field.

Description of the material for forming the active layer 910 is the same as described in the above-described embodiment or may be applied by modifying the bar, a detailed description thereof will be omitted.

The plurality of applying electrodes 921, 922, 923, 924, 925, 925, 926, 927, 928, and 929 may be formed to apply an electric field to the active layer 910, and for example, a voltage may be applied to the active layer 910. ) Can be applied.

In some embodiments, the plurality of application electrodes 921, 922, 923, 924, 925, 925, 926, 927, 928, and 929 may be formed to contact the top surface of the active layer 910.

In addition, the plurality of application electrodes 921, 922, 923, 924, 925, 925, 926, 927, 928, and 929 may apply various sizes of voltages to the active layer 910 and control the time of voltage application. It can be formed to be.

The plurality of application electrodes 921, 922, 923, 924, 925, 926, 927, 928, and 929 may be spaced apart from each other.

In some embodiments, the plurality of application electrodes 921, 922, 923, 924, 925, 926, 927, 928, and 929 may be arranged along one direction and another direction crossing the same.

The description of the material forming the plurality of application electrodes 921, 922, 923, 924, 925, 926, 927, 928, and 929 may be the same as described in the above embodiments or may be modified and applied thereto. Is omitted.

The connecting electrode parts 931, 932, 933, 934, 935, 936, 941, 942, 943, 944, 945, and 946 may include one or more electrode members, for example, the first connecting electrode member 931. , The second connection electrode member 932, the third connection electrode member 933, the fourth connection electrode member 934, the fifth connection electrode member 935, the sixth connection electrode member 936, and the seventh connection electrode The member 941, the eighth connection electrode member 942, the ninth connection electrode member 943, the tenth connection electrode member 944, the eleventh connection electrode member 945, and the twelfth connection electrode member 946. It may include.

The connecting electrode portions 931, 932, 933, 934, 935, 936, 941, 942, 943, 944, 945, and 946 may be formed on the active layer 910, for example, on an upper surface of the active layer 910. The plurality of application electrodes 921, 922, 923, 924, 925, 926, 927, 928, and 929 may be formed to be spaced apart from each other, and in some embodiments, may be formed to contact the active layer 910.

The connecting electrode parts 931, 932, 933, 934, 935, 936, 941, 942, 943, 944, 945, and 946 may be disposed to be spaced apart from each other, and in some embodiments, the plurality of applying electrodes 921 and 922 may be disposed. , 923, 924, 925, 926, 927, 928, and 929.

In some embodiments, the connecting electrode parts 931, 932, 933, 934, 935, 936, 941, 942, 943, 944, 945, and 946 may include a plurality of applied electrodes 921, 922, 923, 924, 925, 926, 927, 928, and 929 may be arranged on both sides along the arrangement direction.

For example, each of the connection electrode parts 931, 932, 933, 934, 935, 936, 941, 942, 943, 944, 945, and 946 is provided with a plurality of applied electrodes 921, 922, 923, 924, 925, 926, 927, 928, 929 disposed on both sides of each of the arrays in the X-axis direction, and a plurality of applied electrodes 921, 922, 923, 924, 925, 926, 927, 928, 929 It can be arranged on both sides of each array in the Y-axis direction of.

As a specific example, each of the connection electrode parts 931, 932, 933, 934, 935, 936, 941, 942, 943, 944, 945, and 946 may correspond to the terminal part.

The first connection electrode member 931, the third connection electrode member 933, and the fifth connection electrode member 935 may correspond to the right terminal portion, respectively, and the second connection electrode member 932 and the fourth connection electrode The member 934 and the sixth connection electrode member 936 may correspond to the left terminal portion, respectively.

The seventh connection electrode member 941, the ninth connection electrode member 943, and the eleventh connection electrode member 945 may correspond to upper terminal portions, respectively, and the eighth connection electrode member 942 and the tenth connection electrode The member 944 and the twelfth connection electrode member 946 may correspond to the lower terminal portion.

The description of the material forming the connecting electrode parts 931, 932, 933, 934, 935, 936, 941, 942, 943, 944, 945, and 946 is the same as or modified with the connection electrode part described in the above-described embodiment. The specific description that can be applied to it will be omitted.

18 and 19 are diagrams for describing an operation of the electronic device of FIG. 17.

Referring to FIG. 18, a voltage is applied to the active layer 910 through the plurality of application electrodes 924, 925, and 926, and at least one region of the active layer 910 may include a polarization region. And the polarization regions formed through each of the application electrodes 924, 925, 926 can be integrated and overlapped as described above, so that the variable low resistance regions can also be integrated while overlapping.

For example, as shown in FIG. 21, the horizontal variable low resistance region VLH may be formed at the boundary surface of the polarization region.

For example, a region inside the horizontal variable low resistance region VLH may correspond to a polarization region of the active layer 910.

The current flows through the third connection electrode member 933 and the fourth connection electrode member 934 corresponding to the horizontal variable low resistance region VLH.

As a specific example, a current may flow from the third connection electrode member 933 which is one of the right terminal parts, to the fourth connection electrode member 934 which is one of the left terminal parts, or a current flow may be generated in the opposite direction.

19 illustrates a state in which a voltage is applied to the active layer 910 through the plurality of application electrodes 922, 925, and 928, whereby at least one region of the active layer 910 may include a polarization region. The polarization regions formed through each of the application electrodes 922, 925, and 928 can be integrated and overlapped as described above, so that the variable low resistance regions can also be integrated while overlapping.

As a result, as shown in FIG. 19, the vertically variable low resistance region VLv may be formed at the boundary surface of the polarization region, and the region inside the vertically variable low resistance region VLv corresponds to the polarization region of the active layer 910. Can be.

Current may flow through the ninth connection electrode member 943 and the tenth connection electrode member 944 corresponding to the vertical variable low resistance region VLv.

As a specific example, a current may flow from the ninth connection electrode member 943, which is one of the upper terminal parts, to the tenth connection electrode member 944, which is one of the lower terminal parts, or a current flow in the opposite direction.

The electrical device of the present embodiment can apply various sizes of voltages to the active layer through the application electrode and control the time of application.

A plurality of application electrodes may be arranged in one direction and another direction, and a plurality of connection electrode members may be formed around the plurality of application electrodes.

Through this, a voltage can be selectively applied to the plurality of application electrodes, thereby forming a variable low resistance region in a desired shape, thereby controlling the direction of current flow.

That is, it is possible to easily form the electric element of the desired shape and function by controlling the flow of the current in the desired position, the desired direction.

20 is a schematic plan view of an electronic device according to still another embodiment of the present invention.

Referring to FIG. 20, the electrical device 1000 according to the present embodiment may include an active layer 1010, a plurality of applied electrodes 1021, 1022, 1023, 1024, 1025, 1121, 1122, 1123, 1124, 1125, 1221, 1222, 1223, 1224, 1225, 1321, 1322, 1323, 1324, 1325, and connecting electrode portions 1031, 1032, 1131, 1132, 1231, 1232, 1331, 1332, 1041, 1042, 1141, 1142, 1241, 1242, 1341, 1342 , 1441, 1442).

The active layer 1010 may comprise a spontaneous polarizable material. For example, the active layer 1010 may include an insulating material and may include a ferroelectric material. That is, the active layer 1010 may comprise a material having spontaneous electrical polarization (electric dipole) that may be reversed in the presence of an electric field.

Description of the material for forming the active layer 1010 is the same as described in the above embodiments or may be applied by modifying the bar, a detailed description thereof will be omitted.

The plurality of applied electrodes 1021, 1022, 1023, 1024, 1025, 1121, 1122, 1123, 1124, 1125, 1221, 1222, 1223, 1224, 1225, 1321, 1322, 1323, 1324, and 1325 are the active layers 1010. It may be formed to apply an electric field to, for example, a voltage may be applied to the active layer 1010.

In some embodiments, the plurality of application electrodes 1021, 1022, 1023, 1024, 1025, 1121, 1122, 1123, 1124, 1125, 1221, 1222, 1223, 1224, 1225, 1321, 1322, 1323, 1324, 1325 It may be formed to contact the upper surface of the active layer 1010.

In addition, the plurality of applied electrodes 1021, 1022, 1023, 1024, 1025, 1121, 1122, 1123, 1124, 1125, 1221, 1222, 1223, 1224, 1225, 1321, 1322, 1323, 1324, and 1325 may be formed of an active layer ( Voltages of various magnitudes may be applied to the 1010 and may be formed to control the time of voltage application.

The plurality of applied electrodes 1021, 1022, 1023, 1024, 1025, 1121, 1122, 1123, 1124, 1125, 1221, 1222, 1223, 1224, 1225, 1321, 1322, 1323, 1324, 1325 are spaced apart from each other. Can be arranged.

In some embodiments, the plurality of application electrodes 1021, 1022, 1023, 1024, 1025, 1121, 1122, 1123, 1124, 1125, 1221, 1222, 1223, 1224, 1225, 1321, 1322, 1323, 1324, 1325 It may be arranged along one direction and another direction crossing it. As an alternative embodiment, as shown in FIG. 20, the X-axis direction and the Y-axis direction intersecting with the X-axis direction may be arranged.

To a material forming a plurality of applied electrodes 1021, 1022, 1023, 1024, 1025, 1121, 1122, 1123, 1124, 1125, 1221, 1222, 1223, 1224, 1225, 1321, 1322, 1323, 1324, 1325. Description of the bar is the same as described in the above embodiment or may be applied by modifying the bar, detailed description thereof will be omitted.

In addition, the number of the plurality of applied electrodes 1021, 1022, 1023, 1024, 1025, 1121, 1122, 1123, 1124, 1125, 1221, 1222, 1223, 1224, 1225, 1321, 1322, 1323, 1324, 1325 More or less can be freely determined to suit the electrical element.

The connecting electrode portions 1031, 1032, 1131, 1132, 1231, 1232, 1331, 1332, 1041, 1042, 1141, 1142, 1241, 1242, 1341, 1342, 1441, 1442 may include one or more electrode members. For example, the first connection electrode member 1031, the second connection electrode member 1032, the third connection electrode member 1131, the fourth connection electrode member 1132, the fifth connection electrode member 1231, and the first connection electrode member 1031. 6 connection electrode member 1232, 7th connection electrode member 1331, 8th connection electrode member 1332, 9th connection electrode member 1041, 10th connection electrode member 1042, and 11th connection electrode member ( 1141, a twelfth connection electrode member 1142, a thirteenth connection electrode member 1241, a fourteenth connection electrode member 1242, a fifteenth connection electrode member 1341 and a sixteenth connection electrode member 1342, and a seventeenth connection electrode member 1242. The connection electrode member 1442 and the eighteenth connection electrode member 1442 may be included.

The number of connecting electrode portions 1031, 1032, 1131, 1132, 1231, 1232, 1331, 1332, 1041, 1042, 1141, 1142, 1241, 1242, 1341, 1342, 1441, 1442 can be determined more or less freely. Can be.

The connecting electrode portions 1031, 1032, 1131, 1132, 1231, 1232, 1331, 1332, 1041, 1042, 1141, 1142, 1241, 1242, 1341, 1342, 1441, and 1442 may be formed on the active layer 1010. For example, a plurality of applied electrodes 1021, 1022, 1023, 1024, 1025, 1121, 1122, 1123, 1124, 1125, 1221, 1222, 1223, 1224, 1225, 1321, 1322 on the top surface of the active layer 1010. , 1323, 1324, and 1325, and may be formed to contact the active layer 1010 in an optional embodiment.

The connecting electrode portions 1031, 1032, 1131, 1132, 1231, 1232, 1331, 1332, 1041, 1042, 1141, 1142, 1241, 1242, 1341, 1342, 1441, and 1442 may be spaced apart from each other. In some embodiments, the plurality of applied electrodes 1021, 1022, 1023, 1024, 1025, 1121, 1122, 1123, 1124, 1125, 1221, 1222, 1223, 1224, 1225, 1321, 1322, 1323, 1324, 1325. It can be placed around.

In some embodiments, the connection electrode portions 1031, 1032, 1131, 1132, 1231, 1232, 1331, 1332, 1041, 1042, 1141, 1142, 1241, 1242, 1341, 1342, 1441, and 1442 may include a plurality of application electrodes ( 1021, 1022, 1023, 1024, 1025, 1121, 1122, 1123, 1124, 1125, 1221, 1222, 1223, 1224, 1225, 1321, 1322, 1323, 1324, 1325 respectively. Can be.

For example, each of the connecting electrode portions 1031, 1032, 1131, 1132, 1231, 1232, 1331, 1332, 1041, 1042, 1141, 1142, 1241, 1242, 1341, 1342, 1441, 1442 is based on FIG. 23. X-axis direction of the plurality of applied electrodes 1021, 1022, 1023, 1024, 1025, 1121, 1122, 1123, 1124, 1125, 1221, 1222, 1223, 1224, 1225, 1321, 1322, 1323, 1324, 1325 A plurality of applied electrodes 1021, 1022, 1023, 1024, 1025, 1121, 1122, 1123, 1124, 1125, 1221, 1222, 1223, 1224, 1225, 1321, 1322, 1323, 1324, and 1325 may be disposed on both sides of each of the arrangements in the Y-axis direction.

Also, as a specific example, each of the connection electrode parts 1031, 1032, 1131, 1132, 1231, 1232, 1331, 1332, 1041, 1042, 1141, 1142, 1241, 1242, 1341, 1342, 1441, and 1442 may be connected to the terminal part. It may correspond to.

The first connection electrode member 1031, the third connection electrode member 1131, the fifth connection electrode member 1231, and the seventh connection electrode member 1331 may correspond to the right terminal part, respectively, and the second connection electrode The member 1032, the fourth connection electrode member 1132, the sixth connection electrode member 1232, and the eighth connection electrode member 1332 may respectively correspond to the left terminal part.

The ninth connection electrode member 1041, the eleventh connection electrode member 1141, the thirteenth connection electrode member 1241, the fifteenth connection electrode member 1341, and the seventeenth connection electrode member 1441 respectively correspond to an upper terminal portion. The tenth connecting electrode member 1042, the twelfth connecting electrode member 1142, the fourteenth connecting electrode member 1242, and the sixteenth connecting electrode member 1342, and the eighteenth connecting electrode member 1442 ) May correspond to the lower terminal unit.

The material for forming the connecting electrode portions 1031, 1032, 1131, 1132, 1231, 1232, 1331, 1332, 1041, 1042, 1141, 1142, 1241, 1242, 1341, 1342, 1441, 1442 has been described above. The same as the connection electrode unit described in the embodiment or may be applied by modifying it, a detailed description thereof will be omitted.

21 and 22 are diagrams for describing an operation of the electrical device of FIG. 20.

Referring to FIG. 21, a voltage is applied to the active layer 1010 through the plurality of application electrodes 1022, 1122, 1222, and 1221, and at least one region of the active layer 1010 may be a polarization region ( 1010F), and the variable low resistance region VLa may be formed on the boundary surface of the polarization region 1010F.

For example, as described in the above embodiments, a voltage is applied to the active layer 1010 through the plurality of application electrodes 1022, 1122, 1222, 1221, so that the plurality of polarization regions overlap and integrate, and thus the variable low resistance. The regions may also be overlapped and integrated to form the polarization region 1010F and the variable low resistance region VLa shown in FIG. 21.

A current may flow through the sixth connection electrode member 1232 and the eleventh connection electrode member 1141 corresponding to the variable low resistance region VLa. This current flow can provide an easy method in the implementation of a logic circuit, for example, it can be seen that Figure 21 implements a logic circuit (AND) of the product.

That is, when a voltage is first applied to the active layer 1010 through the applying electrode 1221 and then a voltage is applied to the active layer 1010 through all of the plurality of applying electrodes 1022, 1122 and 1222, the sixth connection electrode member A current flow between the 1232 and the eleventh connection electrode member 1141 may be generated.

In addition, a current may flow from the sixth connection electrode member 1232, which is one of the left terminal parts, to the eleventh connection electrode member 1141, which is one of the upper terminal parts, or a current flow in the opposite direction.

Referring to FIG. 22, a voltage is applied to the active layer 1010 through the plurality of application electrodes 1122, 1123, 1124, 1222, 1223, 1224, 1322, and 1324, and thus, the active layer 1010. At least one region of may include a polarization region 1010F, and a variable low resistance region VLr may be formed at an interface of the polarization region 1010F.

For example, as described in the above-described embodiment, a voltage is applied to the active layer 1010 through the plurality of application electrodes 1122, 1123, 1124, 1222, 1223, 1224, 1322, and 1324 so that the plurality of polarization regions overlap. And the variable low resistance regions are overlapped and integrated accordingly to form the polarization region 1010F and the variable low resistance region VLr illustrated in FIG. 22.

A current may flow through the twelfth connection electrode member 1142 and the sixteenth connection electrode member 1342 corresponding to the variable low resistance region VLr. This flow of current can provide an easy method in the implementation of a logic circuit, for example, it can be seen that Figure 22 implements a consensus logic circuit (OR).

That is, first, a voltage is applied to the active layer 1010 through the application electrodes 1122, 1222, 1322, 1124, 1224, and 1324, and then a voltage is applied to the active layer through at least one of the plurality of application electrodes 1123 and 1223. When applied to the 1010, a flow of current between the twelfth connection electrode member 1142 and the sixteenth connection electrode member 1342 may be generated.

In addition, current may flow from the twelfth connection electrode member 1142, which is one of the lower terminal parts, to the sixteenth connection electrode member 1342, which is another one of the lower terminal parts, or a current flow may be generated in the opposite direction.

The electrical device of the present embodiment can apply various sizes of voltages to the active layer through the application electrode and control the time of application.

A plurality of application electrodes may be arranged in one direction and another direction, and a plurality of connection electrode members may be formed around the plurality of application electrodes.

Through this, a voltage can be selectively applied to the plurality of application electrodes, thereby forming a variable low resistance region in a desired shape, thereby controlling the direction of current flow.

That is, by controlling the flow of current in a desired position and a desired direction, an electric element having a desired shape and function can be easily formed, and various types of logic circuits can be implemented.

23 is a schematic plan view of an electronic device according to still another embodiment of the present invention.

Referring to FIG. 23, the electric device 2000 according to the present embodiment includes an active layer 2010, a plurality of applied electrodes 2021, 2022, 2023, and 2024, and a connection electrode part 2031, 2032, 2033, 2034, 2131, 2132, and 2133. , 2134, 2231, 2232, 2233, 2234, 2331, 2332, 2333, 2334.

The active layer 2010 may comprise a spontaneous polarizable material. For example, the active layer 2010 may include an insulating material and may include a ferroelectric material. That is, the active layer 2010 may include a material having spontaneous electrical polarization (electric dipole) that may be reversed in the presence of an electric field.

Description of the material for forming the active layer 2010 is the same as described in the above-described embodiment or may be applied by modifying the bar, a detailed description thereof will be omitted.

The plurality of application electrodes 2021, 2022, 2023, and 2024 may be formed to apply an electric field to the active layer 2010, and for example, a voltage may be applied to the active layer 2010.

In some embodiments, the plurality of application electrodes 2021, 2022, 2023, and 2024 may be in contact with the top surface of the active layer 2010.

In addition, the plurality of application electrodes 2021, 2022, 2023, and 2024 may be configured to apply voltages of various sizes to the active layer 2010 and to control the time of voltage application.

The plurality of application electrodes 2021, 2022, 2023, and 2024 may be spaced apart from each other.

In some embodiments, the plurality of application electrodes 2021, 2022, 2023, and 2024 may be arranged along one direction and another direction crossing the same.

In some embodiments, at least one of the plurality of application electrodes 2021, 2022, 2023, and 2024 may be disposed at an end of the active layer 2010, and may be disposed at an edge as another example.

For example, as illustrated in FIG. 23, a plurality of application electrodes 2021, 2022, 2023, and 2024 may be arranged at each corner of the active layer 2010.

The description of the material forming the plurality of application electrodes 2021, 2022, 2023, and 2024 may be the same as described in the above-described embodiment or may be modified and applied thereto, and thus detailed description thereof will be omitted.

In addition, the number of the plurality of application electrodes 2021, 2022, 2023, 2024 can be freely determined to be more or less suitable for the electric element.

The connecting electrode portions 2031, 2032, 2033, 2034, 2131, 2132, 2133, 2134, 2231, 2232, 2233, 2234, 2331, 2332, 2333, 2334 may include one or more electrode members, for example First connection electrode member 2031, second connection electrode member 2032, third connection electrode member 2033, fourth connection electrode member 2034, fifth connection electrode member 2131, and sixth connection electrode member 2132, seventh connection electrode member 2133, eighth connection electrode member 2134, ninth connection electrode member 2231, tenth connection electrode member 2232, eleventh connection electrode member 2233, and The connection electrode member 2234, the thirteenth connection electrode member 2331, the fourteenth connection electrode member 2332, the fifteenth connection electrode member 2333, and the sixteenth connection electrode member 2334 may be included.

The number of connection electrode portions 2031, 2032, 2033, 2034, 2131, 2132, 2133, 2134, 2231, 2232, 2233, 2234, 2331, 2332, 2333, 2334 can be freely determined more or less.

Connection electrode portions 2031, 2032, 2033, 2034, 2131, 2132, 2133, 2134, 2231, 2232, 2233, 2234, 2331, 2332, 2333, 2334 may be formed on the active layer 2010, for example. For example, the active layer 2010 may be formed to be spaced apart from the plurality of application electrodes 2021, 2022, 2023, and 2024, and may be formed to contact the active layer 2010 as an optional embodiment.

The connection electrode parts 2031, 2032, 2033, 2034, 2131, 2132, 2133, 2134, 2231, 2232, 2233, 2234, 2331, 2332, 2333, and 2334 may be spaced apart from each other.

In some embodiments, the plurality of application electrodes 2021, 2022, 2023, and 2024 may be disposed between two electrodes along the arrangement direction of the plurality of application electrodes 2021, 2022, 2023, and 2024.

For example, connecting electrode parts 2031, 2032, 2033, and 2034 may be arranged between the applying electrode 2021 and the applying electrode 2023, and the connecting electrode between the applying electrode 2023 and the applying electrode 2022. The portions 2331, 2332, 2333, and 2334 may be arranged, and the connecting electrode portions 2231, 2232, 2233, and 2234 may be arranged between the applying electrode 2022 and the applying electrode 2024, and the applying electrode. The connection electrode portions 2131, 2132, 2133, and 2134 may be arranged between the 2024 and the applying electrode 2021.

First connection electrode member 2031, second connection electrode member 2032, third connection electrode member 2033, fourth connection electrode member 2034, fifth connection electrode member 2131, and sixth connection electrode member 2132, seventh connection electrode member 2133, eighth connection electrode member 2134, ninth connection electrode member 2231, tenth connection electrode member 2232, eleventh connection electrode member 2233, and 12th connection electrode member 2234, 13th connection electrode member 2331, 14th connection electrode member 2332, 15th connection electrode member 2333, and 16th connection electrode member 2334.

As a specific example, each of the connection electrode parts 2031, 2032, 2033, 2034, 2131, 2132, 2133, 2134, 2231, 2232, 2233, 2234, 2331, 2332, 2333, 2334 may correspond to the terminal part. have.

The first connection electrode member 2031, the second connection electrode member 2032, the third connection electrode member 2033, and the fourth connection electrode member 2034 may correspond to upper terminal portions, respectively, and the ninth connection electrode The member 2231, the tenth connecting electrode member 2232, the eleventh connecting electrode member 2233, and the twelfth connecting electrode member 2234 may correspond to the lower terminal unit, respectively.

The fifth connection electrode member 2131, the sixth connection electrode member 2132, the seventh connection electrode member 2133, and the eighth connection electrode member 2134 may correspond to the left terminal part, respectively, and the thirteenth connection electrode The member 2331, the fourteenth connection electrode member 2332, the fifteenth connection electrode member 2333, and the sixteenth connection electrode member 2334 may correspond to the right terminal part, respectively.

The material for forming the connecting electrode portions 2031, 2032, 2033, 2034, 2131, 2132, 2133, 2134, 2231, 2232, 2233, 2234, 2331, 2332, 2333, and 2334 are described in the above embodiments. The same as the connection electrode unit or may be applied by modifying it, a detailed description thereof will be omitted.

24 and 25 are diagrams for describing an operation of the electrical device of FIG. 23.

24 illustrates a state in which a voltage is applied to the active layer 2010 through the plurality of application electrodes 2021 and 2022, and thus the active layer 2010 includes two polarization regions 2010F1 and 2010F2. In addition, two variable low resistance regions VL1 and VL2 may be formed at respective boundary surfaces of the polarization regions 2010F1 and 2010F2.

For example, a voltage is applied to the active layer 2010 through the application electrode 2021 to form a polarization region 2010F1 and to form a variable low resistance region VL1, and a voltage to the active layer 20 through the application electrode 2022. 2010 may be applied to form a polarization region 2010F2 and a variable low resistance region VL1.

The flow of current may occur through two connection electrode members 2031 and 2131 corresponding to the first variable low resistance region VL1.

For example, a current may flow from the fifth connection electrode member 2131, which is one of the left terminal parts, to the first connection electrode member 2031, which is one of the upper terminal parts, or a current flow in the opposite direction.

In addition, current may flow through two connection electrode members 2231 and 2331 corresponding to the second variable low resistance region VL2.

For example, a current may flow from the thirteenth connection electrode member 2331, which is one of the right terminal parts, to the ninth connection electrode member 2231, which is one of the lower terminal parts, or a current flow may be generated in the opposite direction.

In addition, due to the intersection of the variable low resistance regions VL1 and VL2, the two connection electrode members 2031 and 2131 and the two connection electrode members 2231 and 2331 may form an electrical passage.

For example, one of the fifth connection electrode member 2131 which is one of the left terminal parts, the first connection electrode member 2031 which is one of the upper terminal parts, the thirteenth connection electrode member 2331 which is one of the right terminal parts, and one of the lower terminal parts A flow of current may be generated between the ninth connection electrode members 2231.

Referring to FIG. 25, a voltage is applied to the active layer 2010 through the plurality of application electrodes 2021 and 2022. The active layer 2010 includes two polarization regions 2010F1 and 2010F2. In addition, two variable low resistance regions VL1 and VL2 may be formed at respective boundary surfaces of the polarization regions 2010F1 and 2010F2.

For example, a voltage is applied to the active layer 2010 through the applying electrode 2021 to form the polarization region 2010F1 and to form the first variable low resistance region VL1, and the voltage is applied through the applying electrode 2022. The polarization region 2010F2 may be formed and the second variable low resistance region VL1 may be formed by being applied to the active layer 2010.

Referring to FIG. 25, in comparison with FIG. 24, the sizes of the variable low resistance regions VL1 and VL2 have changed. Specifically, the size of the first variable low resistance region VL1 is increased and the second variable low resistance region VL2 is increased. The size of the smaller.

The size of the variable low resistance region may be proportional to the magnitude of the voltage applied through the application electrode and the application sustain time. That is, FIG. 25 may have a larger magnitude of a voltage applied to the application electrode 2021 or a value of the application sustain time than in FIG. 24.

 In addition, FIG. 25 may have a smaller value of a voltage or an application holding time applied through the application electrode 2022 than in FIG. 24.

A current may flow through two connection electrode members 2032 and 2132 corresponding to the first variable low resistance region VL1.

For example, a current may flow from the sixth connection electrode member 2132, which is one of the left terminal parts, to the second connection electrode member 2032, which is one of the upper terminal parts, or a current flow in the opposite direction.

In addition, current may flow through two connection electrode members 2232 and 2332 corresponding to the second variable low resistance region VL2.

For example, a current may flow from the fourteenth connection electrode member 2332, which is one of the right terminal parts, to the tenth connection electrode member 2232, which is one of the lower terminal parts, or a current flow in the opposite direction.

In addition, due to the intersection of the variable low resistance regions VL1 and VL2, the two connection electrode members 2032 and 2132 and the two connection electrode members 2232 and 2332 may form an electrical passage.

For example, one of the sixth connection electrode member 2132 which is one of the left terminal parts, the second connection electrode member 2032 which is one of the upper terminal parts, the fourteenth connection electrode member 2332 and one of the lower terminal parts, which is one of the right terminal parts, A flow of current may be generated between the tenth connecting electrode members 2232.

FIG. 26 is a diagram for describing another example of the operation of the electric element of FIG. 23.

Referring to FIG. 26, the third variable low resistance region VL3 is formed inside the second variable low resistance region VL2.

Such a structure may be formed by controlling an electric field applied through the applying electrode 2022 in the state of FIG. 26.

For example, the polarization region 2010F3 having the polarization direction opposite to the polarization region 2010F2 may be formed by applying an electric field opposite to the electric field applied through the application electrode 2022 to achieve the state of FIG. 25. have.

The third variable low resistance region VL3 may be formed at the boundary between the polarization region 2010F3 and the polarization region 2010F2.

That is, after controlling the intensity and direction of the electric field through the applied electrode 2022 to form one variable low resistance region (eg, the second variable low resistance region VL2), one or more variable low resistance regions are formed therein. For example, the third variable low resistance region VL3 can be formed.

As a result, current may flow through the two connection electrode members 2032 and 2132 corresponding to the first variable low resistance region VL1.

In addition, current may flow through two connection electrode members 2232 and 2332 corresponding to the second variable low resistance region VL2.

In addition, a current flow may occur through two connection electrode members 2233 and 2333 corresponding to the third variable low resistance region VL3. The electric element of the present embodiment applies voltages of various magnitudes to the active layer through an application electrode. Can be applied, and the time of application can be controlled.

A plurality of application electrodes may be arranged in one direction and another direction, and a plurality of connection electrode members may be formed therebetween.

Through this, a voltage can be selectively applied to the plurality of application electrodes, thereby forming a variable low resistance region in a desired shape, thereby controlling the direction of current flow. For example, it is possible to control the magnitude of the variable low resistance region by controlling the magnitude of the voltage through the applying electrode and the application time, and thus control the flow of current in a desired direction.

That is, it is possible to easily form the electric element of the desired shape and function by controlling the flow of the current in the desired position, the desired direction.

As described above, the present invention has been described with reference to the embodiments illustrated in the drawings, which are merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible. . Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Specific implementations described in the embodiments are examples, and do not limit the scope of the embodiments in any way. In addition, unless specifically mentioned, such as "essential", "important" may not be a necessary component for the application of the present invention.

In the specification of the embodiments (particularly in the claims), the use of the term " above " and similar indicating terms can be used in the singular and plural. In addition, when the range is described in the examples, the invention includes the invention in which the individual values belonging to the range are applied (unless stated to the contrary), and the description is the same as describing each individual value constituting the range. . Finally, if there is no explicit order or contradiction with respect to the steps constituting the method according to the embodiment, the steps may be performed in a suitable order. The embodiments are not necessarily limited according to the description order of the steps. The use of all examples or exemplary terms (eg, etc.) in the embodiments is merely for describing the embodiments in detail, and the scope of the embodiments is limited by the above examples or exemplary terms unless the scope of the claims is defined. It is not. In addition, one of ordinary skill in the art appreciates that various modifications, combinations and changes can be made depending on design conditions and factors within the scope of the appended claims or equivalents thereof.

10, 100, 200, 600, 700, 800, 900, 1000, 2000: electronic circuit
11, 21, 110, 210, 610, 710, 810, 910, 1010, 2010: active layer
12, 120, 220, 621, 622, 721, 722, 821, 822, 823, 921-929, 1021-1025, 1121-1125, 1221-1225, 1321-1325, 2021-2024: applied electrode
131, 132, 231, 232, 631, 632, 641, 642, 731, 732, 741, 742, 831, 832, 931-936, 941-946, 1031, 1032, 1131, 1132, 1231, 1232, 1331, 1332, 1041, 1042, 1141, 1142, 1241, 1242, 1341, 1342, 1441, 1442, 2031-2034, 2131-2134, 2231-2234, 2331-2334: connecting electrode
VL: variable low resistance region

Claims (19)

An active layer comprising a spontaneous polarizable material;
A plurality of application electrodes disposed to be adjacent to the active layer;
A polarization region formed in the active layer by applying an electric field to the active layer through the applying electrode;
A variable low resistance region including a region having an electrical resistance lower than another region adjacent to the boundary of the polarization region; And
A plurality of connection electrode portions spaced from the application electrode and formed to selectively generate a path of the current by the variable low resistance region,
The polarization region is formed to correspond to the entire thickness in the thickness direction of the active layer, the variable low resistance region is formed to correspond to the total thickness in the thickness direction of the active layer along the polarization region,
The variable low resistance region is not in contact with the plurality of application electrodes, and the variable low resistance region is formed so as not to overlap the plurality of application electrodes based on a thickness direction of the active layer.
And the plurality of applying electrodes are configured to apply an electric field to the active layer independently of each other. According to claim 1,
The plurality of application electrodes are formed to be spaced apart from each other. According to claim 1,
At least one connection electrode part of the plurality of connection electrode parts is disposed on one side of the plurality of application electrodes,
At least another connection electrode part of the plurality of connection electrode parts is disposed on the other side of the plurality of application electrodes. According to claim 1,
And the applying electrode comprises a plurality of applying electrodes arranged in at least one direction and a plurality of applying electrodes arranged in another direction crossing the same. The method of claim 4, wherein
One connection electrode part of the plurality of connection electrode parts is disposed on one side of the plurality of application electrodes arranged in the one direction,
One connection electrode part of the plurality of connection electrode parts is disposed on the other side of the plurality of application electrodes arranged in the one direction. According to claim 1,
The plurality of application electrodes includes a plurality of application electrodes spaced apart from each other,
At least one of the plurality of connection electrode portions is disposed between the plurality of application electrodes. According to claim 1,
And the connection electrode part is a terminal part. According to claim 1,
And the variable low resistance region generates or disappears under the control of the polarization region by controlling an electric field through the application electrode. According to claim 1,
An electronic circuit having polarization regions in different directions formed on both sides of the variable low resistance region. According to claim 1,
By controlling the time of applying the electric field through the applying electrode,
And a region in which a plurality of polarization regions spaced apart from each other include an overlapping region in one region, and a region in which one region of the plurality of variable low resistance regions corresponding to each other overlaps and is integrated. According to claim 1,
And the variable low resistance region is maintained even if the electric field applied through the applying electrode is removed. According to claim 1,
The variable low resistance region is formed to include a line around the applied electrode. For an active layer comprising a spontaneous polarizable material and a plurality of applied electrodes disposed adjacent to the active layer,
Applying an electric field to the active layer through the applying electrode to form a polarization region in the active layer;
Forming a variable low resistance region corresponding to a boundary of the polarization region, the region having a lower electrical resistance than another adjacent region; And
Selectively generating a path of a current in the plurality of connection electrode portions spaced apart from the application electrode by the variable low resistance region,
The polarization region is formed to correspond to the entire thickness in the thickness direction of the active layer, the variable low resistance region is formed to correspond to the total thickness in the thickness direction of the active layer along the polarization region,
The variable low resistance region is not in contact with the plurality of application electrodes, and the variable low resistance region is formed so as not to overlap the plurality of application electrodes based on a thickness direction of the active layer.
And the plurality of applying electrodes are configured to apply an electric field to the active layer independently of each other. The method of claim 13,
The plurality of application electrodes are formed to be spaced apart from each other,
And a plurality of variable low resistance regions are formed through the plurality of application electrodes. The method of claim 14,
And the plurality of variable low resistance regions overlapping and integrated in at least one region. The method of claim 13,
The electronic circuit control method of forming a current flow in at least one direction through the plurality of connection electrode. The method of claim 16,
And a current flow in one direction and the other direction crossing the plurality of connection electrode parts. The method of claim 13,
And controlling the electric field through the applying electrode to generate or dissipate the variable low resistance region under control of the polarization region. The method of claim 13,
And forming a logic circuit including a product or sum value through the plurality of applied electrodes and the plurality of connection electrodes.

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