KR102044235B1 - 전자부품의 제조 방법 및 성막 장치 - Google Patents

전자부품의 제조 방법 및 성막 장치 Download PDF

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Publication number
KR102044235B1
KR102044235B1 KR1020170123194A KR20170123194A KR102044235B1 KR 102044235 B1 KR102044235 B1 KR 102044235B1 KR 1020170123194 A KR1020170123194 A KR 1020170123194A KR 20170123194 A KR20170123194 A KR 20170123194A KR 102044235 B1 KR102044235 B1 KR 102044235B1
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KR
South Korea
Prior art keywords
electronic component
electronic components
electronic
metal film
holder
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KR1020170123194A
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English (en)
Korean (ko)
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KR20180035687A (ko
Inventor
테츠야 오다
잇세이 야마모토
토루 코마츠
Original Assignee
가부시키가이샤 무라타 세이사쿠쇼
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Publication of KR20180035687A publication Critical patent/KR20180035687A/ko
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Publication of KR102044235B1 publication Critical patent/KR102044235B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020170123194A 2016-09-29 2017-09-25 전자부품의 제조 방법 및 성막 장치 KR102044235B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2016-192042 2016-09-29
JP2016192042A JP2018056393A (ja) 2016-09-29 2016-09-29 電子部品の製造方法および成膜装置

Publications (2)

Publication Number Publication Date
KR20180035687A KR20180035687A (ko) 2018-04-06
KR102044235B1 true KR102044235B1 (ko) 2019-11-13

Family

ID=61836010

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170123194A KR102044235B1 (ko) 2016-09-29 2017-09-25 전자부품의 제조 방법 및 성막 장치

Country Status (2)

Country Link
JP (1) JP2018056393A (ja)
KR (1) KR102044235B1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118215995A (zh) * 2021-11-10 2024-06-18 株式会社村田制作所 模块

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001244284A (ja) * 2000-02-28 2001-09-07 Nec Corp 半導体装置およびその製造方法
JP2009044123A (ja) * 2007-07-19 2009-02-26 Citizen Finetech Miyota Co Ltd 電子部品の製造方法および電子部品。
JP2016115722A (ja) * 2014-12-11 2016-06-23 アピックヤマダ株式会社 半導体製造装置、半導体装置、及び、半導体装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001244284A (ja) * 2000-02-28 2001-09-07 Nec Corp 半導体装置およびその製造方法
JP2009044123A (ja) * 2007-07-19 2009-02-26 Citizen Finetech Miyota Co Ltd 電子部品の製造方法および電子部品。
JP2016115722A (ja) * 2014-12-11 2016-06-23 アピックヤマダ株式会社 半導体製造装置、半導体装置、及び、半導体装置の製造方法

Also Published As

Publication number Publication date
KR20180035687A (ko) 2018-04-06
JP2018056393A (ja) 2018-04-05

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