KR102040144B1 - Abrasive - Google Patents

Abstract

An object of the present invention is to provide an abrasive having a low polishing efficiency and a relatively low polishing cost.
An abrasive of the present invention is an abrasive comprising a substrate and an abrasive layer laminated on the surface side of the substrate and comprising abrasive grains and a binder thereof, wherein the abrasive layer includes a plurality of abrasive portions separated by grooves on the surface thereof. And a plurality of kinds of regions having different occupied area ratios of the plurality of polished portions along the polishing direction, and the difference in the occupied area ratios of the plurality of polished portions in the pair of regions adjacent to each other along the polishing direction is 3% or more 21 It is% or less. What is necessary is just to provide the said area | region with the magnitude | size which can contain the circle | round | yen of diameter 5cm when it sees in plan view. Among the pair of regions adjacent along the polishing direction, the occupying area ratio of the plurality of polishing portions in one region is preferably 4.5% or more and 9% or less, and as the occupying area ratio of the plurality of polishing portions in the other region, 9% or more and 16% or less are preferable.

Description

Abrasive

The present invention relates to an abrasive.

In recent years, the precision of electronic devices, such as a hard disk, is progressing. As the substrate material of such an electronic device, glass is often used in consideration of rigidity, impact resistance, and heat resistance that can cope with miniaturization and thinning. Since this glass substrate is a brittle material, mechanical strength is remarkably impaired by surface damage. Therefore, the polishing of such a board | substrate requires a flattening precision with few damages as well as a polishing rate.

In general, the machining time tends to be long to improve the leveling accuracy of the polished surface, and the polishing rate and the leveling precision are in a trade off relationship. For this reason, it is difficult to make both a polishing rate and planarization precision compatible. On the other hand, in order to make the polishing rate and planarization accuracy compatible, the abrasive which has the abrasive | polishing part which disperse | distributed abrasive grain and a filler is proposed (Japanese Patent Publication No. 2002-542057). See the Gazette publication.

However, in such a conventional abrasive, the polishing rate decreases due to glazing of abrasive grains or loading of the surface of the polishing layer after polishing for a predetermined time. In order to regenerate this reduced polishing rate, it is necessary to peel off the surface of the abrasive and to make a so-called dressing with the new surface as the surface. Cleaning of the abrasive is also required before and after this dressing, so this dressing is a time-consuming operation. Since the polishing of the glass substrate, which is a workpiece, is stopped during the dressing, the conventional abrasive material has a large decrease in the polishing efficiency due to the dressing.

In recent years, the demand for substrates having hard brittleness and chemical stability such as sapphire or silicon carbide for LED or power devices has been increasing. Such a difficult substrate requires a polishing method of higher efficiency than the polishing of a silicon substrate already established. In addition, since such a substrate is chemically stable, time is required for CMP (Chemical Mechanical Polishing) processing performed in the final step of polishing. Therefore, it is necessary to reduce roughness and damage of the surface of a board | substrate as much as possible in the grinding | polishing which is a preprocess, and to shorten the processing time of CMP. Therefore, the polishing of the whole CMP process requires high polishing precision.

As a method of grinding this hard-working substrate, for example, glass abrasive grains using a diamond slurry and an abrasive (see Japanese Patent Application Laid-Open No. 2014-100766), or glass abrasive grains are coated on a surface of an abrasive. A semi-fixed abrasive grain polishing (see Japanese Laid-Open Patent Publication No. 2002-86350) is proposed, in which polishing is carried out by supporting a hole.

In this conventional free abrasive grain polishing and semi-fixed abrasive grain polishing, high efficiency polishing is realized by using diamond for abrasive grains. However, in this conventional free abrasive grain and semi-fixed abrasive grain polishing, since it is necessary to continue supplying abrasive grains to an abrasive material, polishing cost is high.

Patent Document 1: Japanese Patent Application Publication No. 2002-542057 Patent Document 2: Japanese Unexamined Patent Publication No. 2014-100766 Patent Document 3: Japanese Patent Application Laid-Open No. 2002-86350

The present invention has been made in view of the above disadvantages, and an object of the present invention is to provide an abrasive having high polishing accuracy, a low polishing efficiency, and a relatively low polishing cost.

An invention made in order to solve the above problems is an abrasive comprising a substrate and an abrasive layer laminated on the surface side of the substrate and comprising abrasive grains and binders thereof. The polishing layer may include a plurality of polishing portions, each of which is divided by a groove on a surface thereof, and a plurality of kinds of regions having different occupancy ratios of the plurality of polishing portions along the polishing direction, and adjacent to each other in the polishing direction. It is characterized by the difference of the occupancy area ratio of several grinding | polishing parts in a pair of said area | regions being 3% or more and 21% or less.

The said abrasive | polishing material has the difference of the occupied area ratio of the some abrasive | polishing part in a pair of said area | regions adjacent along a grinding direction in the said range. For this reason, in the said abrasive | polishing material, the grinding | polishing pressure received during grinding | polishing in the area | region where the occupancy area is low is moderately large. Because of this polishing pressure difference, the region having the lower occupied area ratio is worn out first, so that the abrasive produces an appropriate step between adjacent regions. Therefore, at the time of grinding, the workpiece is polished while moving from the low height area to the high area or in the reverse direction. The resistance according to the step when moving this region improves the grip force of the abrasive, and further increases the surface pressure in the region of high height, that is, high occupancy area ratio. Thereby, since the said abrasive | polishing material can utilize the surface pressure at the time of grinding | polishing more effectively, it has a high grinding | polishing rate and flattening precision, and a grinding | polishing force hardly falls a comparatively long term. Therefore, since the abrasive does not need to be frequently dressed, the operating cost can be reduced and the process management can be simplified, and the polishing precision and polishing efficiency are excellent. In addition, since it is not necessary to supply new abrasive grains at the time of polishing, polishing cost using the abrasive is lower than polishing using free abrasive grains.

What is necessary is just to provide the said area | region with the magnitude | size which can contain the circle | round | yen of diameter 5cm when it sees in plan view. Thus, by making each said area into the magnitude | size which can contain a 5 cm diameter circle in plan view, the improvement effect of the grip force by the resistance according to a step can be acquired reliably.

In a pair of area | region which adjoins along a grinding | polishing direction, as area ratio of the several grinding | polishing part in one area | region, 4.5% or more and 9% or less are preferable. Moreover, as area area ratio of several grinding | polishing part in another area | region, 9% or more and 16% or less are preferable. Thus, by making the area area ratio of a pair of adjoining area | regions along a grinding | polishing direction into the said range, it becomes difficult to wear a polishing layer and can produce an appropriate step | step in an adjacent area | region. For this reason, the improvement effect of the grip force by the resistance according to a level | step difference can be acquired more reliably, maintaining the durability of a grinding | polishing layer.

The abrasive grains may be diamond abrasive grains. Thus, since the abrasive force can be improved by making the abrasive grain into a diamond abrasive grain, the surface pressure at the time of grinding | polishing can be utilized more effectively, and the improvement effect of the grip force by resistance according to a step can be acquired reliably.

The main component of the binder may be an inorganic substance. Thus, by using the main component of the binder as an inorganic substance, it is possible to increase the bearing capacity of the abrasive grains and to suppress the degranulation of the abrasive grains. For this reason, a polishing rate becomes hard to fall further.

The binder may contain a filler containing oxide as a main component. Thus, since the elastic modulus of the said binder can be improved by containing the filler which has an oxide as a main component in the said binder, it becomes easy to control the abrasion of an abrasive layer. Therefore, since it becomes easy to produce a suitable level | step in the adjacent area | region in the said abrasive | polishing material at the time of grinding | polishing, the improvement effect of the grip force by the resistance according to a level | step difference can be acquired reliably.

Therefore, the said abrasive is suitably used for planar polishing of board | substrates including a glass substrate.

Here, the "region" provided by the polishing layer means a region where the variation in the area of each polishing portion and the variation in the width of the grooves are within 3%. In addition, "the width | variety of a groove" means the shortest distance between a pair of adjacent grinding | polishing parts.

In addition, a "main component" means the component with the highest content, for example, a component whose content is 50 mass% or more.

As described above, the abrasive of the present invention is excellent in polishing accuracy, hardly deteriorates in polishing efficiency, and has low polishing cost. Therefore, the said abrasive can be used suitably for the grinding of the glass substrate used for an electronic device, etc., a hard board | substrate called sapphire or silicon carbide.

1A is a schematic plan view of an abrasive according to an embodiment of the present invention.
FIG. 1B is a schematic sectional view taken along line AA of the abrasive of FIG. 1A.
FIG. 2 is a schematic sectional view showing an abrasive material of an embodiment different from that of FIG. 1B.

[First Embodiment]

EMBODIMENT OF THE INVENTION Hereinafter, 1st Embodiment of this invention is described in detail, referring drawings suitably.

〈Abrasive materials〉

The abrasive 1 shown in FIGS. 1A and 1B is disk-shaped, and includes a base 10 and a polishing layer 20 laminated mainly on the surface side of the base 10. Moreover, the said abrasive 1 is equipped with the contact bonding layer 30 laminated | stacked on the back surface side of the base material 10. As shown in FIG. The said abrasive 1 is arrange | positioned at the grinding | polishing plate of a well-known grinding | polishing apparatus, and grind | polishes by rotating, contacting a to-be-processed object with a grinding | polishing apparatus. That is, the polishing direction of the abrasive 1 is the circumferential direction of the substrate 10.

(materials)

The base material 10 is a plate-like member for supporting the polishing layer 20.

Although it does not specifically limit as a material of the said base material 10, Polyethylene terephthalate (PET), polypropylene (PP), polyethylene (PE), polyimide (PI), polyethylene naphthalate (PEN), aramid, aluminum, copper Etc. can be mentioned. Especially, aluminum with favorable adhesiveness with the polishing layer 20 is preferable. Moreover, you may give the surface of the base material 10 the process which improves adhesiveness, such as a chemical treatment, a corona treatment, and a primer treatment.

In addition, the base material 10 may be provided with flexibility or ductility. Thus, since the base material 10 is flexible or ductile, since the said abrasive 1 follows the surface shape of a to-be-processed object, the contact area of a polishing surface and a to-be-processed object becomes large, and a polishing rate becomes higher. As a material of the base material 10 provided with such flexibility, PET, PI, etc. are mentioned, for example. Moreover, aluminum, copper, etc. are mentioned as a material of the base material 10 provided with ductility.

The size of the base material 10 is not particularly limited, but may be, for example, an outer diameter of 200 mm or more and 2022 mm or less and an inner diameter of 100 mm or more and 658 mm or less.

Although it does not restrict | limit especially as an average thickness of the said base material 10, For example, it can be 75 micrometers or more and 1 mm or less. When the average thickness of the said base material 10 is less than the said minimum, there exists a possibility that the intensity | strength and flatness of the said abrasive 1 may run short. On the other hand, when the average thickness of the said base material 10 exceeds the said upper limit, there exists a possibility that the said abrasive 1 may become unnecessary thick and handling becomes difficult.

(Polishing layer)

The polishing layer 20 includes an abrasive grain 21 and a binder 22 thereof. In addition, the polishing layer 20 includes a plurality of polishing portions 24 separated by grooves 23 on the surface thereof.

In addition, the polishing layer 20 has a first region X1, a second region X2, a third region X3, and a fourth region X4 along the polishing direction, that is, the circumferential direction of the substrate 10. Four areas of are continuously provided in this order.

Although the average thickness (average thickness of the polishing part 24) of the said polishing layer 20 is not specifically limited, 25 micrometers is preferable, 30 micrometers is more preferable, 200 micrometers is more preferable. On the other hand, as an upper limit of the average thickness of the said polishing layer 20, 4000 micrometers is preferable, 3000 micrometers is more preferable, 2500 micrometers is more preferable. When the average thickness of the said abrasive layer 20 is less than the said minimum, since the abrasion of the abrasive layer 20 becomes fast, there exists a possibility that the durability of the said abrasive 1 may become insufficient. On the other hand, when the average thickness of the said abrasive layer 20 exceeds the said upper limit, there exists a possibility that the said abrasive 1 may become unnecessary thick, and handling becomes difficult.

(Grip)

Examples of the abrasive grains 21 include particles such as diamond, alumina and silica. Especially, the diamond abrasive grain which can obtain a high grinding | polishing power is preferable. Thus, since the abrasive force can be improved by making the abrasive grain 21 into a diamond abrasive grain, the surface pressure at the time of grinding | polishing can be utilized more effectively, and the grip force by the resistance generate | occur | produces according to a step | step difference The effect of improving grip is more reliably obtained.

As a minimum of the average particle diameter of the said abrasive grain 21, 2 micrometers is preferable and 10 micrometers is more preferable. Moreover, as an upper limit of the average particle diameter of the said abrasive grain 21, 50 micrometers is preferable and 45 micrometers is more preferable. When the average particle diameter of the said abrasive grains 21 is less than the said minimum, there exists a possibility that a polishing rate may become inadequate. On the other hand, when the average particle diameter of the said abrasive grain 21 exceeds the said upper limit, there exists a possibility that a workpiece may be damaged. Here, an "average particle diameter" means the 50% value (50% particle diameter, D50) of the cumulative particle size distribution curve of the volume reference | standard measured by the laser diffraction method.

As a minimum of content with respect to the abrasive | polishing layer 20 of the said abrasive grain 21, 3 volume% is preferable and 5 volume% is more preferable. Moreover, as an upper limit of content with respect to the abrasive | polishing layer 20 of the said abrasive grain 21, 55 volume% is preferable, 45 volume% is more preferable, 35 volume% is further more preferable. When content of the abrasive grains 21 with respect to the polishing layer 20 is less than the said minimum, there exists a possibility that the polishing force of the polishing layer 20 may run short. On the other hand, when content of the abrasive grains 21 with respect to the polishing layer 20 exceeds the said upper limit, there exists a possibility that the bearing capacity of the abrasive grains 21 in the polishing layer 20 may run out.

(bookbinder)

Resin or an inorganic substance is mentioned as a main component of the said binder 22. As said resin, an acrylic resin, a urethane resin, an epoxy resin, a cellulose resin, a vinyl resin, a phenoxy resin, a phenol resin, polyester, etc. are mentioned, for example. Moreover, a silicate, a phosphate, a polyvalent metal alkoxide, etc. are mentioned as said inorganic substance.

The main component of the binder 22 is preferably an inorganic substance. Thus, by making the main component of the said binder 22 into an inorganic substance, the holding force of the abrasive grain 21 in the polishing layer 20 can be raised, and the detachment of the abrasive grain 21 can be suppressed. For this reason, a polishing rate becomes hard to fall further. Among the inorganic substances, silicates having a high supporting force of the abrasive grains 21 in the polishing layer 20 are preferable.

In addition, when the main component of the binder 22 is an inorganic substance, the binder 22 may contain a filler containing oxide as a main component. Thus, since the elastic modulus of the said binder 22 can be improved by containing the filler which has an oxide as a main component in the said binder 22, it becomes easy to control the abrasion of the polishing layer 20. FIG. Therefore, since it becomes easy to produce an appropriate step | step in the adjacent area | region in the said abrasive | polishing material 1 at the time of grinding | polishing, the improvement effect of the grip force by the resistance according to a step | step can be reliably obtained.

Examples of the filler include oxides such as alumina, silica, cerium oxide, magnesium oxide, zirconia and titanium oxide, and composite oxides such as silica-alumina, silica-zirconia and silica-magnesia. You may use these individually or in combination of 2 or more types as needed. Especially, the alumina which can obtain a high grinding | polishing power is preferable.

Although the average particle diameter of the said filler depends also on the average particle diameter of the abrasive grain 21, As a minimum of the average particle diameter of the said filler, 0.01 micrometer is preferable and 2 micrometers is more preferable. On the other hand, as an upper limit of the average particle diameter of the said filler, 20 micrometers is preferable and 15 micrometers is more preferable. When the average particle diameter of the filler is less than the lower limit, the effect of improving the modulus of elasticity of the binder 22 by the filler is insufficient, so that the control of wear of the polishing layer 20 may be insufficient. On the other hand, when the average particle diameter of the said filler exceeds the said upper limit, there exists a possibility that a filler may inhibit the abrasive force of the abrasive grain 21.

The average particle diameter of the filler may be smaller than the average particle diameter of the abrasive grains 21. As a minimum of the ratio of the average particle diameter of the said filler with respect to the average particle diameter of the abrasive grain 21, 0.1 is preferable and 0.2 is more preferable. On the other hand, as an upper limit of the ratio of the average particle diameter of the said filler with respect to the average particle diameter of the abrasive grain 21, 0.8 is preferable and 0.6 is more preferable. When the ratio of the average particle diameter of the filler to the average particle diameter of the abrasive grains 21 is less than the lower limit, the effect of improving the elastic modulus of the binder 22 by the filler is insufficient, so that the control of wear of the abrasive layer 20 is insufficient. There is a risk of doing so. On the contrary, when the ratio of the average particle diameter of the said filler with respect to the average particle diameter of the abrasive grain 21 exceeds the said upper limit, there exists a possibility that a filler may inhibit the abrasive force of the abrasive grain 21.

Although the content with respect to the abrasive layer 20 of the said filler depends also on content of the abrasive grain 21, As a minimum of content with respect to the abrasive layer 20 of the said filler, 15 volume% is preferable and 30 volume% is furthermore. desirable. On the other hand, as an upper limit of content with respect to the polishing layer 20 of the said filler, 75 volume% is preferable and 72 volume% is more preferable. When the content of the filler to the abrasive layer 20 is less than the lower limit, the effect of improving the modulus of elasticity of the binder 22 by the filler is insufficient, so that the control of wear of the abrasive layer 20 may be insufficient. have. In contrast, when the content of the filler to the abrasive layer 20 exceeds the upper limit, the filler may hinder the abrasive force of the abrasive grains 21.

In the binder 22, various preparations and additives such as a dispersant, a coupling agent, a surfactant, a lubricant, an antifoaming agent, and a coloring agent may be appropriately contained according to the purpose. In addition, at least one part of resin of the said binder 22 may be bridge | crosslinked.

(home)

The grooves 23 are formed in a lattice shape at equal intervals on the surface side of the polishing layer 20. Moreover, the bottom face of the said groove 23 is comprised by the surface of the base material 10. As shown in FIG.

The width of the grooves 23 in each area is approximately the same. That is, the several grinding | polishing part 24 is the same square shape in planar view in one area | region, and is arrange | positioned at substantially equal density. In addition, the width | variety of the said groove | channel 23 is narrower than 1st area | region X1 and 3rd area | region X3 mentioned later than 2nd area | region X2 and 4th area | region X4. In addition, the width of the groove 23 of the first region X1 and the width of the groove 23 of the third region X3 are substantially the same, and the width of the groove 23 of the second region X2 and the fourth region are substantially the same. The width | variety of the groove | channel 23 of (X4) is substantially the same.

In addition, the grooves 23 may be disposed on the boundary for dividing adjacent areas. By arranging the grooves 23 on the boundary in this manner, the steps generated between the regions are caused to face each other with the grooves 23 interposed therebetween, so that the grooves 23 serve as buffer zones. It is possible to suppress the occurrence of scratches and cracks at the edges.

The width and the spacing of the grooves 23 are adjacent to each other (first region X1 and second region X2, second region X2 and third region X3, third region X3 and third region). It is suitably determined so that the difference of the occupancy area ratio of the grinding | polishing part 24 in 4 area | region X4 and 4th area | region X4 and 1st area | region X1 may be in a predetermined range.

Specifically, the lower limit of the width of the groove 23 is preferably 0.3 mm, more preferably 0.5 mm. Moreover, as an upper limit of the width | variety of the said groove | channel 23, 15 mm is preferable and 10 mm is more preferable. When the width | variety of the said groove | channel 23 is less than the said minimum, there exists a possibility that the groove | channel 23 may be clogged by the grinding | polishing powder which arises by grinding | polishing. On the other hand, when the width | variety of the said groove | channel 23 exceeds the said upper limit, since a to-be-processed object will fall easily into the groove | channel 23, there exists a possibility that damage may occur to a to-be-processed object at the time of grinding | polishing.

As a minimum of the space | interval of the groove | channel 23, 2 mm is preferable and 3 mm is more preferable. On the other hand, as an upper limit of the space | interval of the groove | channel 23, 20 mm is preferable and 10 mm is more preferable. When the space | interval of the groove | channel 23 is less than the said minimum, in order to make the occupancy area ratio of the grinding | polishing part 24 into a desired range, it is necessary to make the area of the grinding | polishing part 24 small, and the grinding | polishing part 24 is a base material 10 ), There is a risk of peeling. On the contrary, when the space | interval of the groove | channel 23 exceeds the said upper limit, in order to make the area area ratio of the grinding | polishing part 24 into a desired range, the width | variety of the groove | channel 23 needs to be enlarged, and a to-be-processed object may be 23) may cause damage to the workpiece. Here, the "gap spacing" refers to the spacing of the grids, that is, the pitch of the grooves that are parallel to and constitute the longitudinal or horizontal of the grids.

As a minimum of the area of each polishing part 24, 0.5 mm <2> is preferable and 1 mm <2> is more preferable. On the other hand, as an upper limit of the area of the said grinding | polishing part 24, 13 mm <2> is preferable and 7 mm <2> is more preferable. When the area of the polishing portion 24 is less than the lower limit, the wear of the polishing layer 20 is accelerated, so that the durability of the abrasive 1 may be insufficient. In addition, the polishing part 24 may be peeled off from the base material 10. On the contrary, when the area of the polishing portion 24 exceeds the upper limit, the polishing layer 20 may be less likely to be worn, thereby making it difficult to produce an appropriate step. For this reason, the contact area with respect to the to-be-processed object of the grinding | polishing part 24 becomes large too much at the time of grinding | polishing, and there exists a possibility that a grinding | polishing rate may fall by frictional resistance.

(Area of polishing layer)

The polishing layer 20 may include a first region X1, a second region X2, a third region X3, and a fourth region divided by two straight lines passing through the center of the surface of the substrate 10. (X4) is provided. In other words, the first region X1, the second region X2, the third region X3 and the fourth region X4 are arranged at substantially equiangular intervals. In addition, since the groove is formed as described above, the occupancy ratios of the first region X1 and the third region X3 are substantially the same, and the occupancy ratios of the second region X2 and the fourth region X4 are About the same. Further, the occupancy area ratio of the polishing portion 24 in the first region X1 and the third region X3 is higher than the occupancy area ratio of the polishing portion 24 in the second region X2 and the fourth region X4. Therefore, the polishing layer 20 alternately includes two kinds of regions having different areas of occupancy of the polishing portion 24 at substantially equiangular intervals. In this way, the polishing layer 20 alternately includes two kinds of regions having different areas of occupancy of the polishing portion 24 at approximately equiangular intervals, whereby the workpiece periodically moves between the regions, resulting in higher flattening accuracy and The effect of suppressing the reduction of the polishing rate can be obtained.

As a minimum of the occupied area ratio of the 1st area | region X1 and the 3rd area | region X3 with high occupied area ratio of the grinding | polishing part 24, 9% is preferable and 11% is more preferable. On the other hand, as an upper limit of the occupancy area ratio of the said 1st area | region X1 and the 3rd area | region X3, 16% is preferable and 13% is more preferable. When the occupied area ratio of the first region X1 and the third region X3 is less than the lower limit, the difference between the occupied area ratio between the second region X2 and the fourth region X4 having a low occupied area ratio is determined. In order to be in a range, it is necessary to make the occupancy area ratio of 2nd area | region X2 and 4th area | region X4 comparatively low. For this reason, the abrasion of the abrasive | polishing layer 20 of the 2nd area | region X2 and the 4th area | region X4 becomes early, and there exists a possibility that the durability of the said abrasive 1 may run short. On the contrary, when the occupied area ratio of the first region X1 and the third region X3 exceeds the upper limit, the first region X1 and the third region X3 become difficult to wear during polishing, and thus the second region The step between the area X2 and the fourth area X4 becomes large. Thereby, since the resistance by a step becomes large too much, there exists a possibility that the edge flaw and a crack of a to-be-processed object may arise.

As a minimum of the occupied area ratio of the 2nd area | region X2 and the 4th area | region X4 with low occupied area ratio of the grinding | polishing part 24, 4.5% is preferable and 6% is more preferable. On the other hand, as an upper limit of the occupancy area ratio of the said 2nd area | region X2 and the 4th area | region X4, 9% is preferable and 8% is more preferable. When the occupied area ratios of the second region X2 and the fourth region X4 are less than the lower limit, wear of the abrasive layer 20 is accelerated, so that the durability of the abrasive 1 may be insufficient. On the contrary, when the occupied area ratio of the second region X2 and the fourth region X4 exceeds the upper limit, the second region X2 and the fourth region X4 become difficult to wear during polishing, and thus the first region There is a possibility that it is difficult to generate an appropriate step between the region X1 and the third region X3 and the second region X2 and the fourth region X4. For this reason, there exists a possibility that the fall of a polishing rate may arise easily.

The occupancy ratio of the first area X1 and the third region X3 having a high occupancy area of the polishing part 24, and the second region X2 and the fourth area X4 having a low occupancy area of the polishing part 24. As a minimum of the difference with the occupied area ratio of), it is 3% and 4% is more preferable. On the other hand, as an upper limit of the difference of the said occupancy area ratio, it is 21% and 12% is more preferable. When the difference in the occupied area ratio is less than the lower limit, an appropriate step is generated between the first region X1 and the third region X3 and the second region X2 and the fourth region X4 during polishing. There is a risk of becoming difficult. For this reason, there exists a possibility that the fall of a polishing rate may arise easily. On the contrary, when the difference of the occupied area ratio exceeds the upper limit, a step occurs between the first region X1 and the third region X3 and the second region X2 and the fourth region X4 during polishing. Becomes large. Thereby, since the resistance by a step becomes large too much, there exists a possibility that the edge flaw and a crack of a to-be-processed object may arise.

Although the area of each area | region is determined according to the division number of the area | region, and the magnitude | size of the base material 10, As a minimum of the area of each area | region, 2000 mm <2> is preferable and 3000 mm <2> is preferable. On the other hand, as an upper limit of the area of each area | region, 20000 mm <2> is preferable and 15000 mm <2> is more preferable. When the area of each region is less than the lower limit, even when the front edge of the workpiece moves in the region, the rear edge of the workpiece is located in another adjacent region, so that the resistance due to the step becomes insufficient, thereby improving the grip force. There is a risk of becoming short. On the contrary, when the area of each area exceeds the upper limit, the distance from the entire workpiece to the same area during the polishing and the front edge of the workpiece to move the area is long, thereby improving the grip force due to the resistance due to the step difference. There is a fear that it will be insufficient.

Moreover, it is preferable that the magnitude | size of each area | region is larger than the size of the board | substrate which is a to-be-processed object, and it is preferable to have the size which can include the circle | round | yen of diameter 5cm specifically, when each said area is planarly viewed. When the size of each region is less than or equal to the size of the substrate as the workpiece, the grip edge is insufficient because the rear edge of the workpiece is located in another adjacent region even when the front edge of the workpiece moves the region, resulting in insufficient resistance due to the step. There is a possibility that the improvement effect of the product may be insufficient.

(Adhesive layer)

The adhesive layer 30 is a layer which supports the abrasive 1 and fixes the abrasive 1 to a support for mounting on the polishing apparatus.

Although it does not specifically limit as an adhesive agent used for this adhesive layer 30, For example, a reactive adhesive agent, an instant adhesive agent, a hot melt adhesive agent, an adhesive agent, etc. are mentioned.

As an adhesive agent used for this adhesive layer 30, an adhesive is preferable. By using the adhesive as the adhesive used for the adhesive layer 30, the abrasive 1 can be detached from the support and reattached, so that the abrasive 1 and the support are easily reused. Although it does not specifically limit as such an adhesive, For example, synthetic rubber adhesives, such as an acryl-type adhesive, an acryl- rubber type | system | group adhesive, a natural rubber type | system | group adhesive, a butyl rubber type | system | group, a silicone type adhesive, a polyurethane type adhesive, etc. are mentioned.

As a minimum of the average thickness of the contact bonding layer 30, 0.05 mm is preferable and 0.1 mm is more preferable. Moreover, as an upper limit of the average thickness of the contact bonding layer 30, 0.3 mm is preferable and 0.2 mm is more preferable. When the average thickness of the contact bonding layer 30 is less than the said lower limit, there exists a possibility that adhesive force may peel and the abrasive 1 may peel from a support body. On the other hand, when the average thickness of the contact bonding layer 30 exceeds the said upper limit, workability may fall, such as causing trouble when cutting the said abrasive 1 to a desired shape.

〈Polishing of Flat Boards〉

The abrasive 1 is suitably used for single sided or double side polishing of flat substrates including glass substrates.

As a minimum of the ratio (polishing rate retention) of the polishing rate at the time of the 5th polishing with respect to the polishing rate in the 1st polishing of the said abrasive 1, 60% is preferable, 75% is more preferable, 90 % Is more preferable. In the case where the polishing rate retention rate is less than the lower limit, there is a fear that the polishing efficiency is lowered as the polishing rate is lowered. On the other hand, the upper limit of the said polishing rate retention rate is not specifically limited, The higher it is, the better. Here, the polishing rate is a sapphire substrate having a diameter of 5.08 cm, a specific gravity of 3.97, and a C surface, for 10 minutes under conditions of polishing pressure of 200 g / cm 2, top plate rotation speed 25rpm, bottom plate rotation speed 50rpm, and SUN gear rotation speed 8rpm. The polishing rate per one when repeatedly performed is indicated. Specifically, the polishing rate was calculated by dividing the weight change g of the sapphire substrate before and after polishing by the surface area of the substrate (µm ² ), the specific gravity of the substrate (g / µm ³ ) and the polishing time (minutes).

As a minimum of the polishing rate in the 1st grinding | polishing of the said abrasive | polishing material 1, 10 micrometers / min is preferable, 12 micrometers / min is more preferable, 15 micrometers / min is still more preferable. When the polishing rate is less than the lower limit, the polishing efficiency may be lowered. On the other hand, the upper limit of the polishing rate is not particularly limited.

<Manufacturing method of abrasive materials>

The said abrasive 1 can be manufactured by the process of preparing the composition for polishing layers, the process of printing the composition for polishing layers on the surface side of the base material 10, and the process of sticking the adhesive layer 30. FIG.

(Preparation process of composition for polishing layer)

First, in the composition preparation process for an abrasive layer, the composition for abrasive layers containing the formation material of the binder 22 which consists of inorganic substances, a filler, and the abrasive grains 21 is prepared as a coating liquid. Moreover, in order to control the viscosity and fluidity of a coating liquid, diluents, such as water and alcohol, are added.

(Polishing layer forming process)

Next, in the polishing layer forming step, using the coating liquid prepared in the polishing layer composition preparation step, the surface of the substrate 10 is composed of a plurality of polishing portions 24 divided into grooves 23 by a printing method. The polishing layer 20 is formed. The polishing layer 20 is provided with two kinds of two regions each having a different area ratio of the polishing portion 24. Specifically, these two types of regions are alternately arranged along the polishing direction with respect to four regions divided by two straight lines that cross orthogonal across the center of the substrate 10 surface. The polishing layer 20 is formed by preparing a mask corresponding to these two kinds of regions, and printing the composition for polishing layer through the mask. The mask has a shape corresponding to the shape of the groove 23 in each region in order to form the groove 23. As this printing method, screen printing, metal mask printing, etc. can be used, for example.

After printing, the polishing layer 20 is formed by subjecting the coating liquid to heat dehydration and heat curing. Specifically, for example, the coating liquid is dried at room temperature (25 ° C.), heated and dehydrated at a temperature of 70 ° C. or more and 90 ° C. or less, and then in a range of 2 hours or more and 4 hours or less with heat of 140 ° C. or more and 310 ° C. or less. By hardening, the binder 22 is formed.

(Adhesive layer attaching process)

Finally, in the adhesive layer pasting step, the adhesive layer 30 is affixed on the back surface of the base material 10 to obtain the abrasive 1.

<advantage>

As for the said abrasive | polishing material 1, the difference of the occupancy area ratio of the some abrasive | polishing part 24 in a pair of said area | region which adjoins along a polishing direction exists in the said range. For this reason, in the said abrasive | polishing material 1, the grinding | polishing pressure received during grinding | polishing in the area | region where the occupancy area is low is moderately large. Because of this polishing pressure difference, the region having the lower occupation area ratio is worn out first, so that the abrasive 1 generates an appropriate step between adjacent regions. Therefore, at the time of grinding, the workpiece is polished while moving from the low height area to the high area or in the reverse direction. The grip force of the abrasive 1 is improved by the resistance according to the step when moving the region, and the surface pressure is higher in the region of high height, that is, high occupancy area ratio. Thereby, since the said abrasive | polishing material 1 can utilize the surface pressure at the time of grinding | polishing more effectively, it has a high polishing rate and flattening precision, and it is hard to reduce a polishing rate over a comparatively long time by a grip force. Therefore, since the abrasive 1 does not need to be frequently dressed, the operating cost can be reduced and the process management can be simplified, and the polishing precision and polishing efficiency are excellent. In addition, since it is not necessary to supply new abrasive grains at the time of polishing, polishing using the abrasive 1 has a lower polishing cost than polishing using free abrasive grains.

Second Embodiment

EMBODIMENT OF THE INVENTION Hereinafter, the 2nd Embodiment of this invention is described in detail, referring drawings suitably.

The abrasive 2 shown in FIG. 2 is disk-shaped and mainly includes a base 11 and an abrasive layer 20 laminated on the surface side of the base 11. Moreover, the said abrasive 2 is equipped with the contact bonding layer 30 laminated | stacked on the back surface side of the base material 11. As shown in FIG. Moreover, the said abrasive 2 is equipped with the support body 40 laminated | stacked through the contact bonding layer 30, and the support body adhesive layer 41 laminated | stacked on the back surface side of this support body 40. As shown in FIG. In addition, the same component as 1st Embodiment attaches | subjects the same code | symbol, and abbreviate | omits description.

(materials)

The base material 11 is a plate-like member for supporting the polishing layer 20. The base material 11 is cut into the 1st area | region X1, the 2nd area | region X2, the 3rd area | region X3, and the 4th area | region X4 along the grinding direction. That is, the bottom surface of the groove located in the boundary of the adjacent area | region is comprised by the surface of the support body 40. As shown in FIG. Since the base material 11 is cut into each area | region, the said abrasive 2 is comprised by the joining of the some base material 11 in which the grinding | polishing layer 20 in which the area of occupancy of the grinding | polishing part 24 differs is formed, respectively, The production of the abrasive 2 is easier than in the case where a region having a different occupancy area of the abrasive portion 24 is formed on one substrate.

The material, size, and average thickness of the base material 11 can be the same as the base material 10 of the first embodiment.

(Support)

The support body 40 is a plate-shaped member for supporting the base material 11 and for fixing the abrasive 2 to the polishing apparatus.

Examples of the material of the support 40 include resins having thermoplastics such as polypropylene, polyethylene, polytetrafluoroethylene, and polyvinyl chloride, and engineering plastics such as polycarbonate, polyamide, and polyethylene terephthalate. By using such a material for the support body 40, the support body 40 is flexible, and the abrasive 2 follows the surface shape of the workpiece, so that the abrasive surface and the workpiece easily come into contact with each other. , Polishing efficiency is improved.

As average thickness of the said support body 40, it can be 0.5 mm or more and 3 mm or less, for example. When the average thickness of the support body 40 is less than the lower limit, there is a fear that the strength of the support body 40 is insufficient. On the other hand, when the average thickness of the support body 40 exceeds the upper limit, the support body 40 may become difficult to adhere to the polishing apparatus, or the flexibility of the support body 40 may be insufficient.

(Support adhesive layer)

The support bonding layer 41 is a layer for attaching the support 40 to the polishing apparatus.

The kind and average thickness of the adhesive agent of the support body adhesion layer 41 can be made the same as the adhesion layer 30. FIG.

<Manufacturing method of abrasive materials>

The abrasive 2 includes a step of preparing a composition for polishing layer, a step of printing the composition for polishing layer on the surface side of the substrate 11, a step of fixing the substrate 11 to the support 40, and a support adhesive layer 41. Can be manufactured by the process of affixing ().

(Preparation process of composition for polishing layer)

Since the composition preparation process for polishing layers is the same as the composition preparation process for polishing layers in 1st Embodiment, description is abbreviate | omitted.

(Printing process)

Next, in the printing step, the polishing layer composition is printed on the substrate 11 using the coating liquid prepared in the polishing layer composition preparation step.

Specifically, two substrates 11 are prepared for two kinds of regions having different occupancy areas of the abrasive portion 24 of the abrasive 2. The mask corresponding to this base material 11 is prepared, and the said composition for polishing layers is printed through this mask. In addition, the mask has a shape corresponding to the shape of the groove 23 in each region in order to form the groove 23. The printing method can be the same as in the first embodiment.

(Base material attachment process)

Next, in the substrate attaching step, the substrate 11 having the abrasive layer 20 formed thereon is cut to match the shape of each region of the abrasive 2, and the support 40 is sandwiched between the adhesive layers 30. Adhere to each.

(Support adhesive layer attaching step)

Finally, in a support body adhesion layer sticking process, the support body adhesive layer 41 is affixed on the back surface of the said support body 40, and the said abrasive 2 can be obtained.

<advantage>

When the said abrasive 2 is equipped with the support body 40, handling of the said abrasive 2 becomes easy.

[Other Embodiments]

This invention is not limited to the said embodiment, In addition to the said aspect, various changes and improvement can be implemented in the aspect which carried out.

In the above embodiment, the case where the abrasive is discotic has been described, but the shape of the abrasive is not limited to the disc. For example, the abrasive can be square. Although it does not specifically limit as a magnitude | size at the time of making an abrasive material square, For example, it can be set as the square shape whose one side is 140 mm or more and 160 mm or less.

In the said embodiment, although the groove | channel was made into the grid | lattice form, ie, the planar shape of the grinding | polishing part, square shape may be sufficient as the planar shape of the grinding | polishing part, for example, the shape in which polygons other than a square are repeated, circular shape, etc. may be sufficient.

Moreover, in the said embodiment, although the bottom face of the said some groove part was made into the surface of a base material, the depth of a groove part is lower than the average thickness of a grinding | polishing layer, and a groove part may not reach | attain the surface of a base material. In this case, the depth of the groove portion can be 50% or more of the average thickness of the polishing layer. When the depth of the groove portion is less than the above lower limit, there is a fear that the groove portion disappears due to abrasion, and the durability may be inferior in the abrasive.

In the above embodiment, the case where the occupied area ratio of the two kinds of regions is different depending on the width of the groove is described. However, the occupied area ratio is changed according to other parameters, for example, the shape of the groove (shape of the polishing part), the spacing or the number of grooves, and the like. You may have to.

In the said embodiment, although the abrasive which consists of two types of area | region which differs in occupying area ratio was demonstrated, the number of the area | region which differs in occupying area ratio is not limited to two types, The number of the area | region which differs in occupancy area ratio may be three or more types.

Moreover, in the said embodiment, although the case where the several kind of area | region was alternately arrange | positioned along the grinding | polishing direction was demonstrated, the arrangement | positioning of the said several kind of area | region does not need to be alternately.

In the said embodiment, although the case where the base material is divided | segmented into each area | region was shown, this division | segmentation number is not limited to 4, It may be 2 divisions, 3 divisions, or 5 divisions or more. Moreover, as a minimum of the said dividing water, 4 is preferable. When the number of divisions is less than the lower limit, the number of times per unit time during which the workpiece rides on a region having a different occupancy area decreases, so that the effect of improving the grip force due to the resistance due to the step may be insufficient.

In the first embodiment, the case where the abrasive includes the adhesive layer has been described, but the adhesive layer is not an essential constituent requirement and can be omitted. For example, the adhesive layer may be on the support side, or may be fixed to the support using other fixing means such as bis fixing.

In the said embodiment, although the case where the groove | channel is space was demonstrated, you may be provided with the filling part in which an abrasive material is filled in the said groove | channel. It is preferable that the said filling part has resin or an inorganic substance as a main component, and does not contain abrasive grain substantially. In addition, "the charging part which does not contain an abrasive grain substantially" means that content of an abrasive grain is less than 0.001 volume%, Preferably it is less than 0.0001 volume%.

In the case where the abrasive includes the filler, the lower limit of the ratio to the average thickness of the abrasive layer of the average thickness of the filler is preferably 0.1, more preferably 0.5, still more preferably 0.8, and particularly preferably 0.95. On the other hand, as an upper limit of the ratio of the average thickness of the said charging part, 1 is preferable and 0.98 is more preferable. When the ratio of the average thickness of the said filling part is less than the said minimum, there exists a possibility that the effect which suppresses falling of a to-be-processed object in a groove at the time of grinding | polishing may become inadequate. On the contrary, when the average thickness ratio of the said filling part exceeds the said upper limit, there exists a possibility that a grinding | polishing layer may not contact enough to a to-be-processed object at the start of grinding | polishing, but grinding | polishing pressure is disperse | distributed to a packed layer, and the grinding | polishing pressure applied to an abrasive layer is insufficient There is a risk of doing so. Here, "the average thickness of a charging part" means the average of the distance of the surface of a base material and the surface of a charging part.

Example

Hereinafter, although an Example and a comparative example are given and this invention is demonstrated in detail, this invention is not limited to a following example.

Example 1

Diamond abrasive grains were prepared and the average particle diameter was measured using "Microtrac MT3300 EXII" by Nikkiso Co., Ltd .. The average particle diameter of this diamond abrasive grain was 44 micrometers. In addition, the diamond of this abrasive grain is a 55 mass% nickel coating process.

Sodium silicate (sodium silicate No. 3) as a binder, the diamond abrasive grains, and alumina (Al ₂ O ₃ , an average particle diameter of 12 μm) as a filler were mixed, and the content of the abrasive grains of the diamond abrasive grains was 5% by volume and the filler was the abrasive layer. It prepared so that content with respect to 71 volume% might be obtained, and the coating liquid was obtained.

As a base material, a disk-shaped aluminum plate having an average thickness of 300 µm, an outer diameter of 386 mm, and an inner diameter of 148 mm was prepared. The polishing layer is divided into eight regions by four straight lines passing through the center of the surface of the substrate and forming an angle of 45 degrees with an adjacent straight line, and the polishing layer is alternately arranged so that two kinds of regions having different occupancy ratios are alternately arranged along the circumferential direction. Formed. Specifically, an abrasive layer having a square shape of 1.5 mm on one side and a groove width of 3.5 mm on one side of the polishing portion is formed in a region having low occupancy area, and the shape of the polishing portion is viewed in diameter. An abrasive layer having a circular shape of 1.2 mm and a groove width of 3.8 mm was formed in a region having a high occupancy area ratio. In addition, grooves were formed in the polishing layer by using a mask corresponding to the grooves as a printing pattern. Moreover, the said grinding | polishing part was made into the shape of the block pattern arranged regularly. The occupying area ratios of the two types of regions and their differences are shown in Table 1. The region also has a size that can include a circle of 8.5 cm in diameter when viewed in plan.

The said coating liquid was dried at room temperature (25 degreeC), and after heat-dehydrating at the temperature of 60 degreeC or more and 100 degrees C or less, it hardened | cured at 300 degreeC for 2 hours or more and 4 hours or less.

As a support for holding the substrate and fixing it to the polishing apparatus, a hard vinyl chloride resin plate having an average thickness of 1 mm was used, and the back surface of the substrate and the surface of the support were bonded with an adhesive having an average thickness of 130 µm. As the pressure-sensitive adhesive, a double-sided tape was used. Thus, the abrasive of Example 1 was obtained.

Example 2

A polishing layer having a 1.5 mm square side and a groove width of 3.5 mm is formed in an area with low occupancy area, and the shape of the polishing portion is 1.5 mm in diameter when viewed from the plane of the polishing portion. An abrasive layer having an image and a groove width of 2.346 mm was formed in a region having a high occupancy area ratio. In the same manner as in Example 1 except for the above, the abrasive of Example 2 was obtained.

Example 3

An area of 5 mm square is used, and a polishing layer having a diameter of 1.69 mm and a groove width of 3.31 mm in a plan view of the polishing part is formed in an area having a low occupancy area, and the plane of the polishing part is formed. An abrasive layer having a square shape having a diameter of 1.2 mm and a groove width of 3.8 mm as seen in the above was formed in a region having a high occupancy area ratio. In the same manner as in Example 1 except for the above, the abrasive of Example 3 was obtained.

Example 4

The abrasive of Example 4 was obtained in the same manner as in Example 3, except that the region was made into a square shape having a side of 25 mm.

Comparative Example 1

The polishing layer does not have regions having different occupied area ratios, and when viewed in the plane of the polishing portion, a polishing layer having a diameter of 1.5 mm and a groove width of 3.5 mm is formed on the entire surface of the aluminum plate. Except having formed, it carried out similarly to Example 1, and obtained the abrasive of the comparative example 1.

Comparative Example 2

The abrasive of Comparative Example 2 was obtained in the same manner as in Comparative Example 1 except that a polishing layer having a diameter of 1.5 mm in diameter and a groove width of 3.8 mm in a planar view of the polishing part was formed.

Comparative Example 3

The abrasive of Comparative Example 3 was obtained in the same manner as in Comparative Example 1 except that a polishing layer having a diameter of 1.5 mm in diameter and a groove width of 2.346 mm in a planar view of the polishing part was formed.

[Polishing condition]

The sapphire substrate was polished using the abrasives obtained in Examples 1 to 4 and Comparative Examples 1 to 3. As the sapphire substrate, a sapphire substrate (wrapped) having a diameter of 5.08 cm, a specific gravity of 3.97, and a C surface was used. For the polishing, a commercially available double-sided polishing machine was used. The carrier of a double-sided polishing machine is an epoxy glass whose thickness is 0.4 mm. The polishing was performed at 10 g / cm &lt; 2 &gt;, five times for 10 minutes under conditions of an upper plate rotation speed of 25 rpm, a lower plate rotation speed of 50 rpm, and a SUN gear rotation speed of 8 rpm. At that time, 30cc of "Daphne Cut GS50K" of Idemitsu Kosan Co., Ltd. was supplied as a coolant every minute.

<Polishing rate>

In calculating the polishing rate, a sapphire substrate subjected to the first polishing for 10 minutes was used. The polishing rate was calculated by dividing the weight change (g) of the substrate before and after polishing by the surface area (cm 2) of the substrate, the specific gravity (g / cm 3) of the substrate, and the polishing time (minutes). The results are shown in Table 2.

<Retention rate>

The retention rate of the polishing rate was calculated by dividing the polishing rate at the time of the fifth polishing by the polishing rate at the time of the first polishing. The results are shown in Table 2.

From the results of Table 2, the abrasives of Examples 1 to 4 are equivalent in polishing rate to those of Comparative Examples 1 to 3, and the polishing rate is less likely to decrease. On the other hand, the abrasives of Comparative Examples 1 to 3 do not have regions having different occupied area ratios, and thus, it is considered that the improvement of the grip force due to the resistance due to the step cannot be obtained and the retention rate of the polishing rate is lowered. From this, it is understood that the abrasives of Examples 1 to 4 include two kinds of regions having different areas of occupancy in the polishing portion, and thus are excellent in polishing rate and polishing rate retention.

In addition, when Examples 1-2 are compared with Examples 3-4, the polishing rate of Examples 1-2 is hard to fall. From this, it can be seen that the polishing rate retention is further excellent by providing a size that can include a circle having a diameter of 5 cm when the region is viewed in plan.

(Industry availability)

The abrasive of the present invention is excellent in polishing accuracy, hardly deteriorates in polishing efficiency, and has low polishing cost. Therefore, the said abrasive can be used suitably for the grinding of the glass substrate used for an electronic device, etc., a hard board | substrate called sapphire or silicon carbide.

1, 2: abrasive
10, 11: description
20: polishing layer
21: abrasive
22: binder
23: home
24: grinding part
30: adhesive layer
40: support
41: support layer
X1: first area
X2: second area
X3: Third area
X4: 4th area

Claims (7)

As an abrasive provided with a base material and an abrasive layer laminated on the surface side of this base material and containing an abrasive grain and its binder,
The polishing layer includes a plurality of polishing portions, each of which is divided by a groove on the surface thereof, and a plurality of kinds of regions having different areas of occupancy of the plurality of polishing portions along the polishing direction,
The difference of the occupancy area ratio of several grinding | polishing parts in a pair of said said area | region adjacent along a grinding | polishing direction is 3% or more and 21% or less,
An abrasive material, characterized in that the plurality of abrasive parts have the same shape in plan view in one region.
The method of claim 1,
An abrasive having a size that each of the regions can comprise a circle of 5 cm in diameter when viewed in plan.
The method according to claim 1 or 2,
Among the pair of regions adjacent along the polishing direction, the occupancy ratio of the plurality of polishing portions in one region is 4.5% or more and 9% or less,
The abrasive | polishing material whose occupancy area ratio of the some grinding | polishing part in an other area | region is 9% or more and 16% or less.
The method according to claim 1 or 2,
The abrasive is a diamond abrasive grain.
The method according to claim 1 or 2,
An abrasive material in which the main component of the binder is an inorganic substance.
The method of claim 5,
The abrasive containing the filler whose oxide is a main component.
The method according to claim 1 or 2,
An abrasive used for planar polishing of a substrate.

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