CN109202696A - A kind of thinned pad of Diamond Ceramics - Google Patents
A kind of thinned pad of Diamond Ceramics Download PDFInfo
- Publication number
- CN109202696A CN109202696A CN201811053065.7A CN201811053065A CN109202696A CN 109202696 A CN109202696 A CN 109202696A CN 201811053065 A CN201811053065 A CN 201811053065A CN 109202696 A CN109202696 A CN 109202696A
- Authority
- CN
- China
- Prior art keywords
- substrate
- thinned
- pad
- chip
- circulating line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 17
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 15
- 239000010432 diamond Substances 0.000 title claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 230000017525 heat dissipation Effects 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 229910052573 porcelain Inorganic materials 0.000 claims 1
- 238000005498 polishing Methods 0.000 description 3
- BVPWJMCABCPUQY-UHFFFAOYSA-N 4-amino-5-chloro-2-methoxy-N-[1-(phenylmethyl)-4-piperidinyl]benzamide Chemical compound COC1=CC(N)=C(Cl)C=C1C(=O)NC1CCN(CC=2C=CC=CC=2)CC1 BVPWJMCABCPUQY-UHFFFAOYSA-N 0.000 description 1
- 244000137852 Petrea volubilis Species 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000009975 flexible effect Effects 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
Abstract
The invention discloses a kind of Diamond Ceramics, and pad is thinned, including substrate and grinding layer, the top surface of the substrate is arranged in the grinding layer, the grinding layer is provided with interlaced chip space, the grinding table of protrusion is formed between the chip space, the grinding table surface is provided with lug boss, and the lug boss is round table-like；The substrate is provided with the chip-removal hole for running through the substrate and grinding layer along the vertical direction, and the chip-removal hole is connected to the chip space；Heat dissipation channel is provided in the substrate, the heat dissipation channel includes water inlet line, outlet conduit and a plurality of circulating line composition, the center of circle of a plurality of circulating line is identical, and the water inlet line is connected to a plurality of circulating line, and the outlet conduit is connected to a plurality of circulating line.
Description
Technical field
The present invention relates to a kind of Diamond Ceramics, and pad is thinned.
Background technique
The polishing grinding material of the sheet-like flexibles matrixes such as common sand paper is typically only capable to since shape is not fixed to manual throwing
Light or to hand-operated tools polishing operation, cannot be used in machinery equipment, therefore not using this common polishing grinding material
It can improve efficiency, and it is bad to radiate, the heat for the generation that rubs may or cause to polish product and burn to change colour and influence whole throw
Light effect.
Summary of the invention
In order to overcome the disadvantages and deficiencies of the prior art, the invention discloses a kind of Diamond Ceramics, and pad, including base is thinned
The top surface of the substrate is arranged in material and grinding layer, the grinding layer, and the grinding layer is provided with interlaced chip space, institute
The grinding table that protrusion is formed between chip space is stated, the grinding table surface is provided with lug boss, and the lug boss is round table-like；
The substrate is provided with the chip-removal hole for running through the substrate and grinding layer along the vertical direction, and the chip-removal hole is connected to the chip removal
Slot；Heat dissipation channel is provided in the substrate, the heat dissipation channel includes water inlet line, outlet conduit and a plurality of circulating line group
At the center of circle of a plurality of circulating line is identical, and the water inlet line is connected to a plurality of circulating line, the outlet pipe
Road is connected to a plurality of circulating line.
As a further improvement of the present invention, the cross section of the circulating line is circle.
As a further improvement of the present invention, it is provided with three circulating lines altogether.
As a further improvement of the present invention, it is provided with 15 chip-removal holes altogether.
As a further improvement of the present invention, the chip-removal hole is uniformly arranged in the substrate and grinding layer.
As a further improvement of the present invention, the shape of the grinding table is cylinder.
As a further improvement of the present invention, the lug boss is made of silicon nitride ceramics.
A kind of thinned mat structure of Diamond Ceramics of the invention is simple, perfect heat-dissipating.
In order to better understand and implement, the invention will now be described in detail with reference to the accompanying drawings.
Detailed description of the invention
Fig. 1 is front schematic view of the present invention.
Fig. 2 is top view of the invention.
Fig. 3 is the schematic diagram of heat dissipation channel in substrate of the present invention.
Specific embodiment
Fig. 1-3 is please referred to, the invention discloses a kind of Diamond Ceramics, and pad, including substrate 10 and grinding layer 20, institute is thinned
The top surface that the substrate 10 is arranged in grinding layer 20 is stated, the grinding layer 20 is provided with interlaced chip space 21, the row
The grinding table 22 of protrusion is formed between bits slot 21,22 surface of grinding table is provided with lug boss 23, and the lug boss 23 is
It is round table-like；The substrate 10 is provided with the chip-removal hole 11 for running through the substrate 10 and grinding layer 20 along the vertical direction, the chip removal
Hole 11 is connected to the chip space 21；Be provided with heat dissipation channel in the substrate 10, the heat dissipation channel include water inlet line 31,
Outlet conduit 32 and a plurality of circulating line 33 form, and the center of circle of a plurality of circulating line 33 is identical, and the water inlet line 31 is
It is connected to a plurality of circulating line 33, the outlet conduit 32 is connected to a plurality of circulating line 33.
The cross section of the circulating line 33 is circle.It is provided with three circulating lines 33 altogether.It is provided with 15 altogether
A chip-removal hole 11.The chip-removal hole 11 is uniformly arranged in the substrate 10 and grinding layer 20.The shape of the grinding table 22
Shape is cylinder.The lug boss 23 is made of silicon nitride ceramics.
The water inlet line 31 and the outlet conduit 32 extend since 10 lateral surface of substrate into the substrate 10
And the circulating line 33 is passed through, cooling water source is accessed from the water inlet line 31, and coolant liquid is flowed through from the circulating line 33
It is flowed out later from the outlet conduit 32.The contact surface of the lug boss 23 and workpiece is smooth, does not easily cause secondary scuffing.Clast
Can be mobile from chip space 21, and be discharged through the chip-removal hole 11.It is preferable that the grinding table 22 is set as cylindrical stability.
A kind of thinned mat structure of Diamond Ceramics of the invention is simple, perfect heat-dissipating.
The invention is not limited to above embodiment, if not departing from the present invention to various changes or deformation of the invention
Spirit and scope, if these changes and deformation belong within the scope of claim and equivalent technologies of the invention, then this hair
It is bright to be also intended to encompass these changes and deformation.
Claims (7)
1. pad is thinned in a kind of Diamond Ceramics, it is characterised in that: including substrate and grinding layer, the grinding layer is arranged in the base
The top surface of material, the grinding layer are provided with interlaced chip space, and the grinding table of protrusion, institute are formed between the chip space
It states grinding table surface and is provided with lug boss, the lug boss is round table-like；The substrate is provided with along the vertical direction through described
The chip-removal hole of substrate and grinding layer, the chip-removal hole are connected to the chip space；Heat dissipation channel is provided in the substrate, it is described
Heat dissipation channel includes water inlet line, outlet conduit and a plurality of circulating line composition, and the center of circle of a plurality of circulating line is identical, institute
It states water inlet line to be connected to a plurality of circulating line, the outlet conduit is connected to a plurality of circulating line.
2. pad is thinned in a kind of Diamond Ceramics according to claim 1, it is characterised in that: the cross section of the circulating line
For circle.
3. pad is thinned in a kind of Diamond Ceramics according to claim 1, it is characterised in that: be provided with three annulars altogether
Pipeline.
4. pad is thinned in a kind of Diamond Ceramics according to claim 1, it is characterised in that: be provided with 15 rows altogether
Consider hole to be worth doing.
5. pad is thinned in a kind of Diamond Ceramics according to claim 4, it is characterised in that: the chip-removal hole is uniformly arranged on
In the substrate and grinding layer.
6. pad is thinned in a kind of Diamond Ceramics according to claim 1, it is characterised in that: the shape of the grinding table is circle
Cylindricality.
7. pad is thinned in a kind of Diamond Ceramics according to claim 1, it is characterised in that: the lug boss is made pottery by silicon nitride
Porcelain is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811053065.7A CN109202696A (en) | 2018-09-10 | 2018-09-10 | A kind of thinned pad of Diamond Ceramics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811053065.7A CN109202696A (en) | 2018-09-10 | 2018-09-10 | A kind of thinned pad of Diamond Ceramics |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109202696A true CN109202696A (en) | 2019-01-15 |
Family
ID=64987393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811053065.7A Pending CN109202696A (en) | 2018-09-10 | 2018-09-10 | A kind of thinned pad of Diamond Ceramics |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109202696A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202726714U (en) * | 2012-07-06 | 2013-02-13 | 元亮科技有限公司 | Grinding polishing disk with circulation water cooling device |
| CN204277743U (en) * | 2014-10-29 | 2015-04-22 | 安阳方圆研磨材料有限责任公司 | Hard polishing pad |
| US20150283671A1 (en) * | 2014-04-08 | 2015-10-08 | Kinik Company | Chemical mechanical polishing conditioner |
| CN105328560A (en) * | 2015-09-22 | 2016-02-17 | 广东长盈精密技术有限公司 | Two-sided grinding process |
| CN107073688A (en) * | 2014-10-28 | 2017-08-18 | 阪东化学株式会社 | Grind material and grind the manufacture method of material |
| CN206717685U (en) * | 2014-09-26 | 2017-12-08 | 阪东化学株式会社 | Grinding pad |
| CN108188921A (en) * | 2018-03-09 | 2018-06-22 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Water circle device and grinding device |
| CN108430701A (en) * | 2016-01-06 | 2018-08-21 | 阪东化学株式会社 | Grind material |
| CN108472789A (en) * | 2016-01-08 | 2018-08-31 | 阪东化学株式会社 | Grind material |
| CN208744535U (en) * | 2018-09-10 | 2019-04-16 | 台山市远鹏研磨科技有限公司 | A kind of thinned pad of Diamond Ceramics |
-
2018
- 2018-09-10 CN CN201811053065.7A patent/CN109202696A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202726714U (en) * | 2012-07-06 | 2013-02-13 | 元亮科技有限公司 | Grinding polishing disk with circulation water cooling device |
| US20150283671A1 (en) * | 2014-04-08 | 2015-10-08 | Kinik Company | Chemical mechanical polishing conditioner |
| CN206717685U (en) * | 2014-09-26 | 2017-12-08 | 阪东化学株式会社 | Grinding pad |
| CN107073688A (en) * | 2014-10-28 | 2017-08-18 | 阪东化学株式会社 | Grind material and grind the manufacture method of material |
| CN204277743U (en) * | 2014-10-29 | 2015-04-22 | 安阳方圆研磨材料有限责任公司 | Hard polishing pad |
| CN105328560A (en) * | 2015-09-22 | 2016-02-17 | 广东长盈精密技术有限公司 | Two-sided grinding process |
| CN108430701A (en) * | 2016-01-06 | 2018-08-21 | 阪东化学株式会社 | Grind material |
| CN108472789A (en) * | 2016-01-08 | 2018-08-31 | 阪东化学株式会社 | Grind material |
| CN108188921A (en) * | 2018-03-09 | 2018-06-22 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Water circle device and grinding device |
| CN208744535U (en) * | 2018-09-10 | 2019-04-16 | 台山市远鹏研磨科技有限公司 | A kind of thinned pad of Diamond Ceramics |
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| PB01 | Publication | ||
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