CN208744535U - A kind of thinned pad of Diamond Ceramics - Google Patents
A kind of thinned pad of Diamond Ceramics Download PDFInfo
- Publication number
- CN208744535U CN208744535U CN201821477390.1U CN201821477390U CN208744535U CN 208744535 U CN208744535 U CN 208744535U CN 201821477390 U CN201821477390 U CN 201821477390U CN 208744535 U CN208744535 U CN 208744535U
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- Prior art keywords
- substrate
- thinned
- pad
- chip
- circulating line
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Abstract
The utility model discloses a kind of Diamond Ceramics, and pad is thinned, including substrate and grinding layer, the top surface of the substrate is arranged in the grinding layer, the grinding layer is provided with interlaced chip space, the grinding table of protrusion is formed between the chip space, the grinding table surface is provided with lug boss, and the lug boss is round table-like;The substrate is provided with the chip-removal hole for running through the substrate and grinding layer along the vertical direction, and the chip-removal hole is connected to the chip space;Heat dissipation channel is provided in the substrate, the heat dissipation channel includes water inlet line, outlet conduit and a plurality of circulating line composition, the center of circle of a plurality of circulating line is identical, and the water inlet line is connected to a plurality of circulating line, and the outlet conduit is connected to a plurality of circulating line.
Description
Technical field
The utility model relates to a kind of Diamond Ceramics, and pad is thinned.
Background technique
The polishing grinding material of the sheet-like flexibles matrixes such as common sand paper is typically only capable to since shape is not fixed to manual throwing
Light or to hand-operated tools polishing operation, cannot be used in machinery equipment, therefore not using this common polishing grinding material
It can improve efficiency, and it is bad to radiate, the heat for the generation that rubs may or cause to polish product and burn to change colour and influence whole throw
Light effect.
Utility model content
In order to overcome the disadvantages and deficiencies of the prior art, the utility model discloses a kind of Diamond Ceramics, and pad, packet is thinned
Substrate and grinding layer are included, the top surface of the substrate is arranged in the grinding layer, and the grinding layer is provided with interlaced chip removal
Slot is formed with the grinding table of protrusion between the chip space, and the grinding table surface is provided with lug boss, and the lug boss is circle
Mesa-shaped;The substrate is provided with the chip-removal hole for running through the substrate and grinding layer along the vertical direction, and the chip-removal hole is connected to institute
State chip space;Heat dissipation channel is provided in the substrate, the heat dissipation channel includes water inlet line, outlet conduit and a plurality of annular
Pipeline composition, the center of circle of a plurality of circulating line is identical, and the water inlet line is connected to a plurality of circulating line, described
Outlet conduit is connected to a plurality of circulating line.
The cross section of the circulating line is circle as a further improvement of the utility model,.
It is provided with three circulating lines altogether as a further improvement of the utility model,.
It is provided with 15 chip-removal holes altogether as a further improvement of the utility model,.
The chip-removal hole is uniformly arranged in the substrate and grinding layer as a further improvement of the utility model,.
The shape of the grinding table is cylinder as a further improvement of the utility model,.
The lug boss is made of silicon nitride ceramics as a further improvement of the utility model,.
A kind of thinned mat structure of Diamond Ceramics of the utility model is simple, perfect heat-dissipating.
In order to better understand and implement, according to the present invention will be described in detail below with reference to the accompanying drawings.
Detailed description of the invention
Fig. 1 is the utility model front schematic view.
Fig. 2 is the top view of the utility model.
Fig. 3 is the schematic diagram of heat dissipation channel in the utility model substrate.
Specific embodiment
Fig. 1-3 is please referred to, the utility model discloses a kind of Diamond Ceramics, and pad, including substrate 10 and grinding layer is thinned
20, the top surface of the substrate 10 is arranged in the grinding layer 20, and the grinding layer 20 is provided with interlaced chip space 21, institute
The grinding table 22 that protrusion is formed between chip space 21 is stated, 22 surface of grinding table is provided with lug boss 23, the lug boss
23 be round table-like;The substrate 10 is provided with the chip-removal hole 11 for running through the substrate 10 and grinding layer 20 along the vertical direction, described
Chip-removal hole 11 is connected to the chip space 21;Heat dissipation channel is provided in the substrate 10, the heat dissipation channel includes water inlet pipe
Road 31, outlet conduit 32 and a plurality of circulating line 33 form, and the center of circle of a plurality of circulating line 33 is identical, the water inlet line
31 are connected to a plurality of circulating line 33, and the outlet conduit 32 is connected to a plurality of circulating line 33.
The cross section of the circulating line 33 is circle.It is provided with three circulating lines 33 altogether.It is provided with 15 altogether
A chip-removal hole 11.The chip-removal hole 11 is uniformly arranged in the substrate 10 and grinding layer 20.The shape of the grinding table 22
Shape is cylinder.The lug boss 23 is made of silicon nitride ceramics.
The water inlet line 31 and the outlet conduit 32 extend in Xiang Suoshu substrate 10 since 10 lateral surface of substrate
And the circulating line 33 is passed through, cooling water source is accessed from the water inlet line 31, and coolant liquid is flowed through from the circulating line 33
It is flowed out later from the outlet conduit 32.The contact surface of the lug boss 23 and workpiece is smooth, does not easily cause secondary scuffing.Clast
Can be mobile from chip space 21, and be discharged through the chip-removal hole 11.It is preferable that the grinding table 22 is set as cylindrical stability.
A kind of thinned mat structure of Diamond Ceramics of the utility model is simple, perfect heat-dissipating.
The utility model is not limited to above embodiment, if the various changes or deformation to the utility model do not take off
Spirit and scope from the utility model, if these changes and deformation belong to the claims and equivalents of the utility model
Within the scope of, then the utility model is also intended to encompass these changes and deformation.
Claims (7)
1. pad is thinned in a kind of Diamond Ceramics, it is characterised in that: including substrate and grinding layer, the grinding layer is arranged in the base
The top surface of material, the grinding layer are provided with interlaced chip space, and the grinding table of protrusion, institute are formed between the chip space
It states grinding table surface and is provided with lug boss, the lug boss is round table-like;The substrate is provided with along the vertical direction through described
The chip-removal hole of substrate and grinding layer, the chip-removal hole are connected to the chip space;Heat dissipation channel is provided in the substrate, it is described
Heat dissipation channel includes water inlet line, outlet conduit and a plurality of circulating line composition, and the center of circle of a plurality of circulating line is identical, institute
It states water inlet line to be connected to a plurality of circulating line, the outlet conduit is connected to a plurality of circulating line.
2. pad is thinned in a kind of Diamond Ceramics according to claim 1, it is characterised in that: the cross section of the circulating line
For circle.
3. pad is thinned in a kind of Diamond Ceramics according to claim 1, it is characterised in that: be provided with three annulars altogether
Pipeline.
4. pad is thinned in a kind of Diamond Ceramics according to claim 1, it is characterised in that: be provided with 15 rows altogether
Consider hole to be worth doing.
5. pad is thinned in a kind of Diamond Ceramics according to claim 4, it is characterised in that: the chip-removal hole is uniformly arranged on
In the substrate and grinding layer.
6. pad is thinned in a kind of Diamond Ceramics according to claim 1, it is characterised in that: the shape of the grinding table is circle
Cylindricality.
7. pad is thinned in a kind of Diamond Ceramics according to claim 1, it is characterised in that: the lug boss is made pottery by silicon nitride
Porcelain is made.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821477390.1U CN208744535U (en) | 2018-09-10 | 2018-09-10 | A kind of thinned pad of Diamond Ceramics |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821477390.1U CN208744535U (en) | 2018-09-10 | 2018-09-10 | A kind of thinned pad of Diamond Ceramics |
Publications (1)
Publication Number | Publication Date |
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CN208744535U true CN208744535U (en) | 2019-04-16 |
Family
ID=66084054
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201821477390.1U Active CN208744535U (en) | 2018-09-10 | 2018-09-10 | A kind of thinned pad of Diamond Ceramics |
Country Status (1)
Country | Link |
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CN (1) | CN208744535U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109202696A (en) * | 2018-09-10 | 2019-01-15 | 台山市远鹏研磨科技有限公司 | A kind of thinned pad of Diamond Ceramics |
CN110465898A (en) * | 2019-07-24 | 2019-11-19 | 广州市三研磨材有限公司 | The manufacturing method of piece is thinned in a kind of diamond |
-
2018
- 2018-09-10 CN CN201821477390.1U patent/CN208744535U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109202696A (en) * | 2018-09-10 | 2019-01-15 | 台山市远鹏研磨科技有限公司 | A kind of thinned pad of Diamond Ceramics |
CN110465898A (en) * | 2019-07-24 | 2019-11-19 | 广州市三研磨材有限公司 | The manufacturing method of piece is thinned in a kind of diamond |
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