CN208744536U - A kind of thinned pad of diamond glass - Google Patents

A kind of thinned pad of diamond glass Download PDF

Info

Publication number
CN208744536U
CN208744536U CN201821480922.7U CN201821480922U CN208744536U CN 208744536 U CN208744536 U CN 208744536U CN 201821480922 U CN201821480922 U CN 201821480922U CN 208744536 U CN208744536 U CN 208744536U
Authority
CN
China
Prior art keywords
thinned
pad
substrate
diamond glass
glass according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201821480922.7U
Other languages
Chinese (zh)
Inventor
颜杰钦
郭东勇
李泽辉
颜均城
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Roc Grinding Far Away Science And Technology Ltd Of Taishan City
Original Assignee
Roc Grinding Far Away Science And Technology Ltd Of Taishan City
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Roc Grinding Far Away Science And Technology Ltd Of Taishan City filed Critical Roc Grinding Far Away Science And Technology Ltd Of Taishan City
Priority to CN201821480922.7U priority Critical patent/CN208744536U/en
Application granted granted Critical
Publication of CN208744536U publication Critical patent/CN208744536U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Polishing Bodies And Polishing Tools (AREA)

Abstract

Pad is thinned in a kind of diamond glass of the utility model, including substrate and grinding layer, the top surface of the substrate is arranged in the grinding layer, the grinding layer is provided with interlaced chip space, the grinding table of protrusion is formed between the chip space, the grinding table surface is provided with lug boss, and the lug boss is hemispherical;It is provided with a plurality of radiating groove in the substrate, is interconnected between the radiating groove;The surface of the substrate is provided with mounting ear.A kind of thinned mat structure of diamond glass of the utility model is simple, good heat dissipation, and shape is relatively stable.

Description

A kind of thinned pad of diamond glass
Technical field
The utility model relates to a kind of diamond glass, and pad is thinned.
Background technique
The polishing grinding material of the sheet-like flexibles matrixes such as common sand paper is typically only capable to since shape is not fixed to manual throwing Light or to hand-operated tools polishing operation, cannot be used in machinery equipment, therefore not using this common polishing grinding material It can improve efficiency, and it is bad to radiate, the heat for the generation that rubs may or cause to polish product and burn to change colour and influence whole throw Light effect.
Utility model content
In order to overcome the disadvantages and deficiencies of the prior art, pad, including substrate is thinned in a kind of diamond glass of the utility model And the top surface of the substrate is arranged in grinding layer, the grinding layer, the grinding layer is provided with interlaced chip space, described The grinding table of protrusion is formed between chip space, the grinding table surface is provided with lug boss, and the lug boss is hemispherical;Institute It states and is provided with a plurality of radiating groove in substrate, the radiating groove includes vertical slot and translot, and the vertical slot is placed in the vertical direction, institute Translot is stated to cross the substrate and be connected to a plurality of vertical slot;The surface of the substrate is provided with mounting ear.
The cross section of the chip space is rectangle as a further improvement of the utility model,.
The width of the chip space is 0.7mm, depth 0.4mm as a further improvement of the utility model,.
The cross section of the grinding table is triangle as a further improvement of the utility model,.
The mounting ear includes mounting base as a further improvement of the utility model, and the mounting base is provided with screw thread Through-hole.
The installation seating face is provided with guide post as a further improvement of the utility model,.
The end of the guide post is taper as a further improvement of the utility model,.
The substrate is made of hard glass as a further improvement of the utility model,.
A kind of thinned mat structure of diamond glass of the utility model is simple, good heat dissipation, and shape is relatively stable.
In order to better understand and implement, according to the present invention will be described in detail below with reference to the accompanying drawings.
Detailed description of the invention
Fig. 1 is the front section view of the utility model.
Fig. 2 is the top view of the utility model.
Specific embodiment
Fig. 1 and 2 is please referred to, the utility model discloses a kind of diamond glass, and pad, including substrate 10 and grinding layer is thinned 20, the top surface of the substrate 10 is arranged in the grinding layer 20, and the grinding layer 20 is provided with interlaced chip space 21, institute The grinding table 22 that protrusion is formed between chip space 21 is stated, 22 surface of grinding table is provided with lug boss 23, the lug boss 23 be hemispherical;It is provided with a plurality of radiating groove in the substrate 10, is interconnected between the radiating groove;The table of the substrate 10 Face is provided with mounting ear.The substrate 10 is made of hard glass.The radiating groove includes vertical slot 12 and translot 11, the vertical slot 12 are placed in the vertical direction, and the translot 11 crosses the substrate 10 and is connected to a plurality of vertical slot 12.
The cross section of the chip space 21 is rectangle.The width of the chip space 21 is 0.7mm, depth 0.4mm.Institute The cross section for stating grinding table 22 is triangle.
The mounting ear includes mounting base 13, and the mounting base 13 is provided with tapped through hole 14.13 surface of mounting base It is provided with guide post 15.The end of the guide post 15 is taper.
Discharge of the chip space 21 for clast in process of lapping.Grinding table 22 is set as triangle, so that clast It is discharged more smooth and smooth.The translot 11 and vertical slot 12 of the radiating groove can be ground with external lapping liquid by what is constantly recycled Grinding fluid takes away heat, keeps the stabilization of process of lapping.Convex hemispherical protrusion 23 is arranged in the surface of the grinding table 22, ground Cheng Zhong, hemispheric lug boss 23 can increase friction by slight squeeze, and the round and smooth surface of convex hemispherical protrusion 23 can be with It avoids that workpiece surface is caused to scratch.
The mounting ear is uniformly arranged on the surrounding side of the substrate 10, and the guide post 15 is for being inserted into engine In the connector of structure, then the connector of power mechanism and the tapped through hole 14 of mounting base 13 are passed through with screw, facilitate and this is thinned Pad is fixed with power mechanism.End is that the guide post 15 of taper is conveniently inserted into the connector of power mechanism.
A kind of thinned mat structure of diamond glass of the utility model is simple, good heat dissipation, and shape is relatively stable.
The utility model is not limited to above embodiment, if the various changes or deformation to the utility model do not take off Spirit and scope from the utility model, if these changes and deformation belong to the claims and equivalents of the utility model Within the scope of, then the utility model is also intended to encompass these changes and deformation.

Claims (8)

1. pad is thinned in a kind of diamond glass, it is characterised in that: including substrate and grinding layer, the grinding layer is arranged in the base The top surface of material, the grinding layer are provided with interlaced chip space, and the grinding table of protrusion, institute are formed between the chip space It states grinding table surface and is provided with lug boss, the lug boss is hemispherical;A plurality of radiating groove is provided in the substrate;It is described to dissipate Heat channel includes vertical slot and translot, and the vertical slot is placed in the vertical direction, and the translot crosses the substrate and will be a plurality of described The surface that vertical slot is connected to the substrate is provided with mounting ear.
2. pad is thinned in a kind of diamond glass according to claim 1, it is characterised in that: the cross section of the chip space is Rectangle.
3. pad is thinned in a kind of diamond glass according to claim 2, it is characterised in that: the width of the chip space is 0.7mm, depth 0.4mm.
4. pad is thinned in a kind of diamond glass according to claim 1, it is characterised in that: the cross section of the grinding table is Triangle.
5. pad is thinned in a kind of diamond glass according to claim 1, it is characterised in that: the mounting ear includes installation Seat, the mounting base are provided with tapped through hole.
6. pad is thinned in a kind of diamond glass according to claim 5, it is characterised in that: the installation seating face is provided with Guide post.
7. pad is thinned in a kind of diamond glass according to claim 6, it is characterised in that: the end of the guide post is cone Shape.
8. pad is thinned in a kind of diamond glass according to claim 1, it is characterised in that: the substrate is by hard glass system At.
CN201821480922.7U 2018-09-10 2018-09-10 A kind of thinned pad of diamond glass Active CN208744536U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821480922.7U CN208744536U (en) 2018-09-10 2018-09-10 A kind of thinned pad of diamond glass

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821480922.7U CN208744536U (en) 2018-09-10 2018-09-10 A kind of thinned pad of diamond glass

Publications (1)

Publication Number Publication Date
CN208744536U true CN208744536U (en) 2019-04-16

Family

ID=66083292

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821480922.7U Active CN208744536U (en) 2018-09-10 2018-09-10 A kind of thinned pad of diamond glass

Country Status (1)

Country Link
CN (1) CN208744536U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108908096A (en) * 2018-09-10 2018-11-30 台山市远鹏研磨科技有限公司 A kind of thinned pad of diamond glass

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108908096A (en) * 2018-09-10 2018-11-30 台山市远鹏研磨科技有限公司 A kind of thinned pad of diamond glass

Similar Documents

Publication Publication Date Title
TWI421148B (en) Heat sink having grinding heat-contacting plane and method and apparatus of making the same
CN208744536U (en) A kind of thinned pad of diamond glass
CN105122428B (en) Polydisc chemical mechanical polishing pad adjuster and method
CN107309785A (en) A kind of Circular back-plate for carrying flexible abrasive material structure
TWI580524B (en) Chemical mechanical polishing conditioner with high performance and method for manufacturing the same
US20080003935A1 (en) Polishing pad having surface texture
CN208744535U (en) A kind of thinned pad of Diamond Ceramics
CN108908096A (en) A kind of thinned pad of diamond glass
CN207489846U (en) A kind of semiconductor package part
CN210335528U (en) Flattening device for pasting polishing pad of CMP (chemical mechanical polishing) equipment
CN205734440U (en) A kind of polishing clamp for wafer
CN108453176A (en) A kind of hardware dies fixing device
CN101987430A (en) Fixing ring for chemically and mechanically grinding
CN112542373B (en) Method for improving grinding yield of warped sapphire wafer
CN202656075U (en) Heat dissipation type grinding abrasive paper
CN201049442Y (en) Modified soft rubbing cushion
CN204108855U (en) A kind of Novel diamond emery wheel
CN203062535U (en) Grinding wheel
CN204094590U (en) A kind of lenses polishing device
CN109202696A (en) A kind of thinned pad of Diamond Ceramics
CN208057597U (en) A kind of one-time formed copper meson
CN205057827U (en) Grinding wheel
TWM588351U (en) Chemical mechanical polishing machine table for wafers
CN202825583U (en) Cutting abrasion wheel
CN202852505U (en) Light-emitting diode (LED) module capable of preventing screws from falling off

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant