CN209408266U - A kind of diamond segment, emery wheel and abrading block that chip removal effect is good - Google Patents
A kind of diamond segment, emery wheel and abrading block that chip removal effect is good Download PDFInfo
- Publication number
- CN209408266U CN209408266U CN201822149042.8U CN201822149042U CN209408266U CN 209408266 U CN209408266 U CN 209408266U CN 201822149042 U CN201822149042 U CN 201822149042U CN 209408266 U CN209408266 U CN 209408266U
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- diamond
- good
- diamond segment
- chip removal
- removal effect
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Abstract
The utility model relates to a kind of diamond segment, emery wheel and abrading blocks that chip removal effect is good, the working face of the diamond segment is equipped with multiple diamond particles, the diamond segment is evenly distributed with multiple protrusions, multiple protrusions form plum blossom-shaped or starlike, two neighboring protrusion forms chip space by arc transition, and the working face of each protrusion of diamond segment is equipped with radiating groove.The diamond particles quantity of the utility model is few, reduces cost, and when polishing is not easy to plug, and good heat dissipation, chip removal is unobstructed, and polishing velocity is fast, and sanding and polishing effect is good, long service life.
Description
Technical field
The utility model relates to grinding apparatus technical fields, and in particular to a kind of diamond segment that chip removal effect is good, mill
Wheel and abrading block.
Background technique
Currently, needing to carry out polishing operation by cooling water mostly when diamond segment operation, but quick in present industrial
Under the overall situation of development, worker can not many times provide the condition of cooling water in high-efficient homework in many cases, to lead
Cause diamond segment natural heat dissipation slow, polishing a period of time can be because of overheat so that polishing work can not carry out, to reduce polishing
Efficiency.In addition, when angle grinder/machine for laying floor is when running at high speed, since the object of polishing is mostly the material of different hardness quality
Material composition, and material surface is usually uneven, and emery wheel/abrading block is easy to that fierce collision occurs with material during the grinding process
And friction, gravel and dust of generation of polishing etc. cannot exclude in time again, cutter head further be damaged, to reduce material removal matter
Amount and cutter head service life.
Utility model content
Purpose of the utility model is to overcome the above-mentioned shortcomings and provide a kind of diamond segments that chip removal effect is good, mill
Wheel and abrading block, the quantity of diamond particles is few, reduces cost, and when polishing is not easy to plug, and good heat dissipation, chip removal is unobstructed, polishing velocity
Fastly, sanding and polishing effect is good, long service life.
Purpose of the utility model is realized as follows:
The working face of a kind of diamond segment that chip removal effect is good, the diamond segment is equipped with multiple diamond particles,
The diamond segment is evenly distributed with multiple protrusions, and multiple protrusions form plum blossom-shaped or starlike, two neighboring protrusion
Chip space is formed by arc transition, the working face of each protrusion of diamond segment is equipped with radiating groove.
Preferably, multiple radiating grooves intersect at the center of diamond segment.
Preferably, the diamond segment is equipped with multiple.
Preferably, the protrusion is equipped with 3-8.
A kind of diamond-impregnated wheel that chip removal effect is good, using above-mentioned cutter head, including abrasive wheel substrate, the diamond segment is set
It sets in abrasive wheel substrate bottom.
Preferably, multiple heat release holes are also evenly equipped on the abrasive wheel substrate.
Preferably, the abrasive wheel substrate bottom is planar annular.
A kind of diamond grinding block that chip removal effect is good, using above-mentioned cutter head, the diamond segment is arranged in abrading block matrix
On.
The beneficial effects of the utility model are:
The diamond particles quantity of the utility model is few, reduces cost, and when polishing is not easy to plug, and good heat dissipation, chip removal is unobstructed,
Polishing velocity is fast, and sanding and polishing effect is good, long service life.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model.
Fig. 2 is the structural schematic diagram of embodiment 1.
Fig. 3 is the main view of embodiment 1.
Fig. 4 is the bottom view of embodiment 1.
Fig. 5 is the structural schematic diagram of embodiment 2.
Wherein: abrasive wheel substrate 1;Planar annular 2;Diamond segment 3;Protrusion 3.1;Chip space 3.2;Radiating groove 3.3;Gold
Hard rock particle 4;Heat release hole 5;Abrading block matrix 6.
Specific embodiment
Referring to Fig. 1, the utility model relates to a kind of diamond segment that chip removal effect is good, the works of the diamond segment 3
Make face equipped with multiple diamond particles 4, the diamond segment 3 is evenly distributed with multiple protrusions 3.1, multiple protrusions 3.1
Plum blossom-shaped or starlike is formed, two neighboring protrusion 3.1 forms chip space 3.2 by arc transition, is conducive to chip removal when polishing
It is unobstructed;The working face of each protrusion 3.1 of the diamond segment 3 is equipped with radiating groove 3.3, and heat dissipation effect is more preferable.
Multiple radiating grooves 3.3 intersect at the center of diamond segment 3, and when polishing is not easy to plug and radiates faster.
The diamond segment 3 is equipped with multiple.
The protrusion 3.1 is equipped with 3-8.
Embodiment 1:
- Fig. 4 referring to fig. 2, a kind of diamond-impregnated wheel that chip removal effect is good, including abrasive wheel substrate 1, the diamond segment 3
The bottom of abrasive wheel substrate 1 is set, multiple heat release holes 5 are also evenly equipped on the abrasive wheel substrate 1, accelerates heat dissipation;The emery wheel base
1 bottom of body is planar annular 2.
Embodiment 2:
Referring to Fig. 5, a kind of diamond grinding block that chip removal effect is good, including abrading block matrix 6, the diamond segment 3 are arranged
On abrading block matrix 6.
In addition to the implementation, the utility model further includes having other embodiments, all to use equivalents or equivalent
The technical solution that alternative is formed, should all fall within the protection scope of the utility model claims.
Claims (8)
1. the working face of a kind of diamond segment that chip removal effect is good, the diamond segment (3) is equipped with multiple diamond particles
(4), it is characterised in that: the diamond segment (3) is evenly distributed with multiple protrusions (3.1), and multiple protrusions (3.1) are formed
Plum blossom-shaped, two neighboring protrusion (3.1) form chip space (3.2) by arc transition, and the diamond segment (3) is each convex
The working face of portion (3.1) is equipped with radiating groove (3.3) out.
2. a kind of good diamond segment of chip removal effect according to claim 1, it is characterised in that: multiple radiating grooves
(3.3) center of diamond segment (3) is intersected at.
3. a kind of good diamond segment of chip removal effect according to claim 1, it is characterised in that: the diamond segment
(3) it is equipped with multiple.
4. a kind of good diamond segment of chip removal effect according to claim 1, it is characterised in that: the protrusion
(3.1) 3-8 are equipped with.
5. a kind of diamond-impregnated wheel that chip removal effect is good, it is characterised in that: using cutter head described in one of claim 1-4, packet
It includes abrasive wheel substrate (1), the diamond segment (3) is arranged in abrasive wheel substrate (1) bottom.
6. a kind of good diamond-impregnated wheel of chip removal effect according to claim 5, it is characterised in that: the abrasive wheel substrate
(1) multiple heat release holes (5) are also evenly equipped on.
7. a kind of good diamond-impregnated wheel of chip removal effect according to claim 5, it is characterised in that: the abrasive wheel substrate
(1) bottom is planar annular (2).
8. a kind of diamond grinding block that chip removal effect is good, it is characterised in that: using diamond segment described in one of claim 1-4
(3) it is arranged on abrading block matrix (6).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201822149042.8U CN209408266U (en) | 2018-12-21 | 2018-12-21 | A kind of diamond segment, emery wheel and abrading block that chip removal effect is good |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201822149042.8U CN209408266U (en) | 2018-12-21 | 2018-12-21 | A kind of diamond segment, emery wheel and abrading block that chip removal effect is good |
Publications (1)
Publication Number | Publication Date |
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CN209408266U true CN209408266U (en) | 2019-09-20 |
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ID=67939015
Family Applications (1)
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CN201822149042.8U Active CN209408266U (en) | 2018-12-21 | 2018-12-21 | A kind of diamond segment, emery wheel and abrading block that chip removal effect is good |
Country Status (1)
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CN (1) | CN209408266U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111531465A (en) * | 2020-04-29 | 2020-08-14 | 泉州金硕金刚石工具有限公司 | Wear-resistant Brad grinding block |
-
2018
- 2018-12-21 CN CN201822149042.8U patent/CN209408266U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111531465A (en) * | 2020-04-29 | 2020-08-14 | 泉州金硕金刚石工具有限公司 | Wear-resistant Brad grinding block |
CN111531465B (en) * | 2020-04-29 | 2021-08-17 | 泉州金硕金刚石工具有限公司 | Wear-resistant Brad grinding block |
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