CN205799271U - A kind of plated diamond grinding wheel - Google Patents
A kind of plated diamond grinding wheel Download PDFInfo
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- CN205799271U CN205799271U CN201620708611.6U CN201620708611U CN205799271U CN 205799271 U CN205799271 U CN 205799271U CN 201620708611 U CN201620708611 U CN 201620708611U CN 205799271 U CN205799271 U CN 205799271U
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- China
- Prior art keywords
- working lining
- emery wheel
- annular protrusion
- grinding wheel
- matrix
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Abstract
A kind of plated diamond grinding wheel, including matrix, is provided with a working lining around this matrix, and described working lining is electroplate with one layer of diamond abrasive, and described working lining is along the circumferential direction uniformly provided with multiple annular protrusion, and between each annular protrusion, spacing is equal.This utility model have employed annular protrusion structure at the working lining of emery wheel, effectively irregular area to abnormal workpieces can be processed polishing;The impact that the quality of workpiece is produced by the Integrated Chip of grinding generation can be prevented effectively from the course of processing, make machining accuracy higher;This emery wheel is also provided with several lightening recesses on grinding wheel base body, can save material, reduce the cost of emery wheel itself while not affecting the intensity that emery wheel is overall.
Description
Technical field
The present invention relates to a kind of emery wheel, especially a kind of plated diamond grinding wheel.
Background technology
Emery wheel is as the important component part of grinding, the most common, and the quality of emery wheel directly affects and added
The quality of multiplexer part.There are two kinds of emery wheels on the market: a kind of is the emery wheel processed with electric discharge machine, has cycle process time
Grow, be easily deformed, need the maintenance in later stage and anti-revisionist, high cost shortcoming;Another kind is the side by plating monolithic stack combinations
The emery wheel that formula processes, has the shortcomings such as process-cycle length, dimensional accuracy is low, cost is high.The most conventional silicon chloride
Wheel hardness is not high enough, the problem arising that serious wear in use for some time, the size of its device processed
Instability, in order to ensure the quality of product, it is necessary to frequently adjusts emery wheel position, poor to the crudy of special-shaped product, has
A lot of irregular region processings less than, and the abrasive particle adhesiveness on existing emery wheel is strong not, can compare in grinding process
Being easier to generation come off, make stone layer uneven, the most existing emery wheel there will be the feelings of Integrated Chip in bruting process
Condition, leverages the crudy of work.So in the urgent need to a kind of irregular area that can be worked into special-shaped product,
Machining accuracy is high, the cycle is short, working lining hardness is big, can effectively alleviate the grinding wheel of the impact of Integrated Chip in the course of processing.
Utility model content
For solving an above existing difficult problem, the utility model discloses a kind of plated diamond grinding wheel.
For realizing the purpose of this utility model, use following scheme:
A kind of plated diamond grinding wheel, including matrix, is provided with a working lining around this matrix, and described working lining is electroplate with one
Layer diamond abrasive, described working lining is along the circumferential direction uniformly provided with multiple annular protrusion, and between each annular protrusion, spacing is equal.
Further, the cross section of described annular protrusion annularly radial direction is semicircle, the radius of this semicircle 0.5~
Between 2.0 millimeters.Such height of projection is moderate, makes the working lining of emery wheel be unlikely to the thickest, saves material, also can guarantee that processing
Quality.
Further, between described annular protrusion spacing between 0.2~0.7 millimeter.It is right that such spacing may adapt to
The processing of the irregular area of most of workpiece, moreover it is possible to effectively alleviate the impact of Integrated Chip in the course of processing, it is ensured that machining accuracy,
The too big then processing effect of spacing is the best, and spacing is the least, does not ensures stone layer intensity.
Further, described matrix along the circumferential direction two sides is provided with some lightening recesses symmetrically and evenly.So can reduce
The use of material.
Further, described matrix material is rustless steel.Stainless steel material is not easy to get rusty, even density, and hardness is relatively big,
Ensure to hurt sb.'s feelings at course of processing medium plain emery wheel not easy fracture, it is ensured that safety.
Beneficial effect:
This utility model have employed annular protrusion structure at the working lining of emery wheel, can effective irregular to abnormal workpieces
Region is processed polishing;The shadow that the quality of workpiece is produced by the Integrated Chip of grinding generation can be prevented effectively from the course of processing
Ring, make machining accuracy higher;This emery wheel is also provided with several lightening recesses on grinding wheel base body, can not affect emery wheel entirety
Intensity while save material, reduce the cost of emery wheel itself.
Accompanying drawing explanation
Fig. 1 is this utility model structural representation;
Fig. 2 is this utility model A-A cross-sectional view.
Wherein: 1 is matrix, 2 is working lining, and 3 is lightening recesses, and 4 is annular protrusion.
Detailed description of the invention
In conjunction with accompanying drawing, plated diamond grinding wheel is described in further details:
A kind of plated diamond grinding wheel, including matrix 1, is provided with a working lining 2 around this matrix 1, and described working lining 2 is electroplated
Have one layer of diamond abrasive, described working lining 2 to be along the circumferential direction uniformly provided with multiple annular protrusion 4, between each annular protrusion 4 between
Away from equal.The cross section of described annular protrusion 4 annularly radial direction is semicircle, the radius of this semicircle 0.5~2.0 millimeter it
Between, such height of projection is moderate, makes the working lining 2 of emery wheel be unlikely to the thickest, saves material, also can guarantee that crudy;Institute
Stating 4 spacing of annular protrusion between 0.2~0.7 millimeter, it is irregular that such spacing may adapt to most of workpiece
The processing in region, moreover it is possible to effectively alleviate the impact of Integrated Chip in the course of processing, it is ensured that machining accuracy, the too big then processing effect of spacing
The best, spacing is the least, does not ensures stone layer 2 intensity;If described matrix 1 along the circumferential direction two sides is provided with symmetrically and evenly
Dry lightening recesses 3, so can reduce the use of material;Described matrix 1 material is rustless steel, and stainless steel material is not easy raw
Rust, even density, hardness is bigger, it is ensured that hurt sb.'s feelings at course of processing medium plain emery wheel not easy fracture, it is ensured that safety.
Embodiment: during use, is arranged on plated diamond grinding wheel matrix 1 on polisher, drives this emery wheel by matrix 1
Working lining 2 high speed rotating, on matrix 1, lightening recesses 3 makes emery wheel quality alleviate evenly distributedly, when greatly reducing emery wheel rotation
Centrifugal force, make emery wheel overall structure more firm, during with this grinder buffing device, annular protrusion 4 extension on emery wheel uses cuts
Face is semicircular annular protrusion 4, can be processed the irregular area of abnormal workpieces, and 4 shapes of each annular protrusion
The gap become is conducive to discharging the Integrated Chip produced when polishing, and effectively reduces because the polishing precision of Integrated Chip blocking generation is low and buffed surface
Rough problem.
This utility model have employed annular protrusion 4 structure at the working lining 2 of emery wheel, can effective not advising abnormal workpieces
Then region is processed polishing;The shadow that the quality of workpiece is produced by the Integrated Chip of grinding generation can be prevented effectively from the course of processing
Ring, make machining accuracy higher;This emery wheel is also provided with several lightening recesses 3 on grinding wheel base body 1, can be not affect emery wheel whole
Save material while the intensity of body, reduce the cost of emery wheel itself.
Of the present utility model ultimate principle and principal character and of the present utility model advantage, one's own profession have more than been shown and described
Skilled person will appreciate that of industry, this utility model is not restricted to the described embodiments, described in above-described embodiment and description
Principle of the present utility model is simply described, on the premise of without departing from this utility model spirit and scope, this utility model is also
Have various changes and modifications, in the range of these changes and improvements both fall within claimed this utility model, this utility model
Claimed scope is defined by appending claims and equivalent thereof.
Claims (5)
1. a plated diamond grinding wheel, including matrix (1), is provided with a working lining (2), described working lining around this matrix (1)
(2) one layer of diamond abrasive it is electroplate with, it is characterised in that described working lining (2) is along the circumferential direction uniformly provided with multiple convex annular
Rising (4), between each annular protrusion (4), spacing is equal.
A kind of plated diamond grinding wheel the most according to claim 1, it is characterised in that described annular protrusion (4) is annularly
The cross section of radial direction is semicircle, and the radius of this semicircle is between 0.5~2.0 millimeter.
A kind of plated diamond grinding wheel the most according to claim 1, it is characterised in that spacing between described annular protrusion (4)
Between 0.2~0.7 millimeter.
A kind of plated diamond grinding wheel the most according to claim 1, it is characterised in that described matrix (1) is along the circumferential direction
Two sides is provided with some lightening recesses (3) symmetrically and evenly.
A kind of plated diamond grinding wheel the most according to claim 1, it is characterised in that described matrix (1) material is high-quality
Steel.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620708611.6U CN205799271U (en) | 2016-07-07 | 2016-07-07 | A kind of plated diamond grinding wheel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620708611.6U CN205799271U (en) | 2016-07-07 | 2016-07-07 | A kind of plated diamond grinding wheel |
Publications (1)
Publication Number | Publication Date |
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CN205799271U true CN205799271U (en) | 2016-12-14 |
Family
ID=58139646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201620708611.6U Expired - Fee Related CN205799271U (en) | 2016-07-07 | 2016-07-07 | A kind of plated diamond grinding wheel |
Country Status (1)
Country | Link |
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CN (1) | CN205799271U (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108818336A (en) * | 2018-08-23 | 2018-11-16 | 武汉华美高新材料有限公司 | A kind of tungsten electrode grinding wheel for grinding and preparation method thereof |
CN108857939A (en) * | 2018-06-29 | 2018-11-23 | 宁波大学 | A kind of easily-disassembled plated diamond grinding wheel and its manufacturing method |
CN110774180A (en) * | 2019-11-18 | 2020-02-11 | 杨金全 | Reusable silicon wafer chamfering and edging grinding wheel and manufacturing method thereof |
CN114055301A (en) * | 2021-11-30 | 2022-02-18 | 陈军 | Air cushion boosting double-side grinding narrow slit polisher |
-
2016
- 2016-07-07 CN CN201620708611.6U patent/CN205799271U/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108857939A (en) * | 2018-06-29 | 2018-11-23 | 宁波大学 | A kind of easily-disassembled plated diamond grinding wheel and its manufacturing method |
CN108818336A (en) * | 2018-08-23 | 2018-11-16 | 武汉华美高新材料有限公司 | A kind of tungsten electrode grinding wheel for grinding and preparation method thereof |
CN108818336B (en) * | 2018-08-23 | 2023-10-03 | 武汉华美高新材料有限公司 | Grinding wheel for grinding tungsten electrode and preparation method thereof |
CN110774180A (en) * | 2019-11-18 | 2020-02-11 | 杨金全 | Reusable silicon wafer chamfering and edging grinding wheel and manufacturing method thereof |
CN114055301A (en) * | 2021-11-30 | 2022-02-18 | 陈军 | Air cushion boosting double-side grinding narrow slit polisher |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161214 Termination date: 20200707 |
|
CF01 | Termination of patent right due to non-payment of annual fee |