WO2017119339A1 - Abrasive material - Google Patents
Abrasive material Download PDFInfo
- Publication number
- WO2017119339A1 WO2017119339A1 PCT/JP2016/088702 JP2016088702W WO2017119339A1 WO 2017119339 A1 WO2017119339 A1 WO 2017119339A1 JP 2016088702 W JP2016088702 W JP 2016088702W WO 2017119339 A1 WO2017119339 A1 WO 2017119339A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polishing
- abrasive
- region
- regions
- layer
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/04—Zonally-graded surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Definitions
- the present invention relates to an abrasive.
- This conventional loose abrasive polishing and semi-fixed abrasive polishing achieves highly efficient polishing by using diamond as the abrasive.
- this conventional loose abrasive polishing and semi-fixed abrasive polishing it is necessary to constantly supply abrasive grains to the abrasive and the polishing cost is high.
- the present invention has been made in view of such inconveniences, and an object of the present invention is to provide an abrasive having high polishing accuracy, less likely to reduce polishing efficiency, and relatively low polishing cost.
- the invention made to solve the above problems is an abrasive comprising a base material and a polishing layer laminated on the surface side of the base material and containing abrasive grains and a binder thereof, wherein the polishing layer is A pair of the above-mentioned regions which have a plurality of regions along the polishing direction and have a plurality of types of regions having a plurality of polishing parts divided on the surface by grooves and having different occupation area ratios of the plurality of polishing units.
- the difference between the occupied area ratios of the plurality of polishing portions is 3% or more and 21% or less.
- the difference in the occupied area ratios of the plurality of polishing portions in a pair of the adjacent regions along the polishing direction is within the above range.
- polishing has a small occupied area rate is moderately large. Due to this polishing pressure difference, the region with a smaller occupied area ratio is worn first, so that the abrasive produces an appropriate level difference between adjacent regions. Accordingly, the workpiece is polished while moving from a small region to a large region or vice versa during polishing.
- the gripping force of the abrasive is improved by the resistance to overcoming when moving in this region, and the surface pressure is further increased in a region where the height is high, that is, the occupied area ratio is large.
- the abrasive can more effectively utilize the surface pressure during polishing, and therefore has a high polishing rate and flattening accuracy, and the polishing rate is unlikely to decrease over a relatively long period of time due to the grip force. Accordingly, since the abrasive does not need to be dressed frequently, the running cost can be reduced, the process management can be simplified, and the polishing accuracy and the polishing efficiency are excellent. Further, since it is not necessary to supply new abrasive grains at the time of polishing, polishing using the abrasive is lower in polishing cost than polishing using free abrasive grains.
- each of the regions has a size capable of including a circle having a diameter of 5 cm in plan view. In this way, by making each of the above regions a size that can include a circle having a diameter of 5 cm in plan view, it is possible to more reliably obtain the effect of improving the grip force due to the resistance to overcoming.
- the occupation area ratio of the plurality of polishing portions in one region is preferably 4.5% or more and 9% or less.
- the occupation area ratio of the plurality of polishing portions in the other region is preferably 9% or more and 16% or less.
- the above abrasive grains are preferably diamond abrasive grains.
- the polishing force can be improved, so that the surface pressure during polishing can be more effectively utilized, and the effect of improving the grip force by the resistance to overcoming can be obtained more reliably.
- the main component of the binder is preferably an inorganic substance.
- the retention strength of an abrasive grain can be improved and the degranulation of an abrasive grain can be suppressed. For this reason, it becomes difficult to further reduce the polishing rate.
- the binder preferably contains a filler mainly composed of an oxide.
- a filler which has an oxide as a main component in the said binder. Therefore, it becomes easy to control abrasion of a polishing layer. Therefore, it becomes easy to make an appropriate level difference in the adjacent region of the abrasive during polishing, and the effect of improving the grip force due to the resistance to overcoming can be obtained more reliably.
- the abrasive is suitably used for planar polishing of substrates such as glass substrates.
- the “region” of the polishing layer means a region where the deviation of the area of each polishing portion and the deviation of the groove width are within 3%.
- the “groove width” means the shortest distance between a pair of adjacent polishing portions.
- main component means a component having the highest content, for example, a component having a content of 50% by mass or more.
- the abrasive of the present invention is excellent in polishing accuracy, is difficult to reduce polishing efficiency, and has a low polishing cost. Therefore, the said abrasive
- polishing material can be used suitably for grinding
- substrates such as a glass substrate used for an electronic device etc., and sapphire and silicon carbide.
- FIG. 1B is a schematic cross-sectional view taken along line AA of the abrasive in FIG. 1A.
- FIG. It is typical sectional drawing which shows the abrasive
- the abrasive 1 shown in FIGS. 1A and 1B has a disc shape, and mainly includes a base material 10 and a polishing layer 20 laminated on the surface side of the base material 10.
- the abrasive 1 includes an adhesive layer 30 that is laminated on the back side of the substrate 10.
- the abrasive 1 is disposed on a polishing surface plate of a known polishing apparatus, and is polished by being rotated while being in contact with a workpiece by the polishing apparatus. That is, the polishing direction of the abrasive 1 is the circumferential direction of the substrate 10.
- the substrate 10 is a plate-like member for supporting the polishing layer 20.
- a polyethylene terephthalate (PET), a polypropylene (PP), a polyethylene (PE), a polyimide (PI), a polyethylene naphthalate (PEN), an aramid, aluminum, copper etc. are mentioned. It is done. Among these, aluminum having good adhesion to the polishing layer 20 is preferable. Moreover, the process which improves adhesiveness, such as a chemical process, a corona process, and a primer process, may be performed on the surface of the base material 10.
- the base material 10 may have flexibility or ductility.
- the abrasive 1 follows the surface shape of the workpiece, and the contact area between the polishing surface and the workpiece is increased. Further increase.
- the material of the flexible base material 10 include PET and PI.
- aluminum, copper, etc. can be mentioned as a material of the base material 10 which has ductility.
- the size of the substrate 10 is not particularly limited, but can be, for example, an outer diameter of 200 mm to 2022 mm and an inner diameter of 100 mm to 658 mm.
- the average thickness of the substrate 10 is not particularly limited, but can be, for example, 75 ⁇ m or more and 1 mm or less.
- the average thickness of the base material 10 is less than the lower limit, the strength and flatness of the abrasive 1 may be insufficient.
- the average thickness of the base material 10 exceeds the upper limit, the abrasive 1 becomes unnecessarily thick and may be difficult to handle.
- the polishing layer 20 includes abrasive grains 21 and a binder 22 thereof.
- the polishing layer 20 includes a plurality of polishing portions 24 divided by grooves 23 on the surface thereof.
- the polishing layer 20 includes four regions of the first region X1, the second region X2, the third region X3, and the fourth region X4 in this order along the polishing direction, that is, the circumferential direction of the base material 10. Have.
- the average thickness of the polishing layer 20 (average thickness of the polishing portion 24) is not particularly limited, but is preferably 25 ⁇ m, more preferably 30 ⁇ m, and even more preferably 200 ⁇ m.
- the upper limit of the average thickness of the polishing layer 20 is preferably 4000 ⁇ m, more preferably 3000 ⁇ m, and further preferably 2500 ⁇ m.
- the average thickness of the polishing layer 20 is less than the lower limit, the polishing layer 20 is quickly worn out, and the durability of the abrasive 1 may be insufficient.
- the average thickness of the polishing layer 20 exceeds the upper limit, the abrasive 1 is unnecessarily thick and may be difficult to handle.
- abrasive grains examples include particles such as diamond, alumina, and silica. Among these, diamond abrasive grains that can provide high polishing power are preferable. Thus, by making the said abrasive grain 21 into a diamond abrasive grain, since polishing power can be improved, the surface pressure at the time of grinding
- the lower limit of the average particle diameter of the abrasive grains 21 is preferably 2 ⁇ m and more preferably 10 ⁇ m. Moreover, as an upper limit of the average particle diameter of the said abrasive grain 21, 50 micrometers is preferable and 45 micrometers is more preferable. When the average particle diameter of the abrasive grains 21 is less than the lower limit, the polishing rate may be insufficient. On the other hand, when the average particle diameter of the abrasive grains 21 exceeds the upper limit, the workpiece may be damaged.
- the “average particle size” refers to a 50% value (50% particle size, D50) of a volume-based cumulative particle size distribution curve measured by a laser diffraction method or the like.
- the lower limit of the content of the abrasive grains 21 with respect to the polishing layer 20 is preferably 3% by volume, and more preferably 5% by volume. Moreover, as an upper limit of content with respect to the polishing layer 20 of the said abrasive grain 21, 55 volume% is preferable, 45 volume% is more preferable, and 35 volume% is further more preferable.
- the polishing power of the polishing layer 20 may be insufficient.
- the holding power of the abrasive grains 21 of the polishing layer 20 may be insufficient.
- binder examples of the main component of the binder 22 include resins and inorganic substances.
- the resin examples include acrylic resin, urethane resin, epoxy resin, cellulose resin, vinyl resin, phenoxy resin, phenol resin, and polyester.
- the inorganic substance examples include silicate, phosphate, and polyvalent metal alkoxide.
- the main component of the binder 22 is preferably an inorganic substance.
- the holding power of the abrasive grains 21 of the polishing layer 20 can be increased, and degreasing of the abrasive grains 21 can be suppressed. For this reason, it becomes difficult to further reduce the polishing rate.
- a silicate having a high holding power for the abrasive grains 21 of the polishing layer 20 is preferable.
- the binder 22 may contain a filler mainly composed of an oxide.
- the filler which has an oxide as a main component in the said binder 22 since the elasticity modulus of the said binder 22 can be improved, it becomes easy to control abrasion of the polishing layer 20.
- FIG. Therefore, since it becomes easy to make an appropriate level
- the filler examples include oxides such as alumina, silica, cerium oxide, magnesium oxide, zirconia, and titanium oxide, and composite oxides such as silica-alumina, silica-zirconia, and silica-magnesia. You may use these individually or in combination of 2 or more types as needed. Among these, alumina that can provide high polishing power is preferable.
- the lower limit of the average particle diameter of the filler is preferably 0.01 ⁇ m and more preferably 2 ⁇ m.
- the upper limit of the average particle diameter of the filler is preferably 20 ⁇ m, and more preferably 15 ⁇ m.
- the average particle diameter of the filler is less than the lower limit, there is a risk that the wear control of the polishing layer 20 may be insufficient due to insufficient effect of improving the elastic modulus of the binder 22 by the filler.
- the average particle diameter of the filler exceeds the upper limit, the filler may hinder the polishing power of the abrasive grains 21.
- the average particle diameter of the filler is preferably smaller than the average particle diameter of the abrasive grains 21.
- the lower limit of the ratio of the average particle diameter of the filler to the average particle diameter of the abrasive grains 21 is preferably 0.1, and more preferably 0.2.
- the upper limit of the ratio of the average particle diameter of the filler to the average particle diameter of the abrasive grains 21 is preferably 0.8, and more preferably 0.6.
- the content of the filler with respect to the polishing layer 20 depends on the content of the abrasive grains 21, but the lower limit of the content of the filler with respect to the polishing layer 20 is preferably 15% by volume, more preferably 30% by volume. preferable.
- the upper limit of the content of the filler with respect to the polishing layer 20 is preferably 75% by volume, more preferably 72% by volume.
- the wear control of the polishing layer 20 may be insufficient due to insufficient effect of improving the elastic modulus of the binder 22 by the filler.
- the filler may hinder the polishing power of the abrasive grains 21.
- the binder 22 may appropriately contain various auxiliary agents and additives such as a dispersant, a coupling agent, a surfactant, a lubricant, an antifoaming agent, and a colorant depending on the purpose.
- the resin of the binder 22 may be at least partially crosslinked.
- the grooves 23 are formed in a lattice pattern at equal intervals on the surface side of the polishing layer 20.
- the bottom surface of the groove 23 is formed by the surface of the substrate 10.
- the width of the groove 23 in each region is substantially equal. That is, the plurality of polishing portions 24 have the same square shape in a plan view in one region, and are arranged with substantially equal density. Further, the width of the groove 23 is smaller in a first region X1 and a third region X3 described later than in the second region X2 and the fourth region X4. The width of the groove 23 in the first region X1 and the width of the groove 23 in the third region X3 are substantially the same, and the width of the groove 23 in the second region X2 and the width of the groove 23 in the fourth region X4 are approximately. Are the same.
- the groove 23 is disposed on the boundary dividing the adjacent area.
- the step generated between the regions by polishing becomes opposed to the groove 23, so that the groove 23 becomes a buffer area and the edge of the work piece is chipped. And cracking can be suppressed.
- the width and interval of the groove 23 are set so that adjacent regions (first region X1 and second region X2, second region X2 and third region X3, third region X3 and fourth region X4, and fourth region X4 and first region
- the difference in the occupation area ratio of the polishing portion 24 in the region X1) is determined as appropriate within a predetermined range.
- the lower limit of the width of the groove 23 is preferably 0.3 mm, and more preferably 0.5 mm.
- the upper limit of the width of the groove 23 is preferably 15 mm, and more preferably 10 mm.
- the width of the groove 23 is less than the lower limit, the polishing powder generated by polishing may be clogged in the groove 23.
- the width of the groove 23 exceeds the upper limit, the work body is likely to fall into the groove 23, so that the work body may be damaged during polishing.
- the lower limit of the interval between the grooves 23 is preferably 2 mm, and more preferably 3 mm.
- the upper limit of the interval between the grooves 23 is preferably 20 mm, and more preferably 10 mm.
- the interval between the grooves 23 is less than the above lower limit, in order to make the occupation area ratio of the polishing portion 24 within a desired range, it is necessary to reduce the area of the polishing portion 24, and the polishing portion 24 is peeled off from the base material 10. There is a risk.
- the interval between the grooves 23 exceeds the above upper limit, in order to make the occupation area ratio of the polishing portion 24 within a desired range, it is necessary to increase the width of the grooves 23, and the work piece is removed during the polishing. There is a risk that the workpiece will be damaged.
- the “groove interval” refers to the lattice interval, that is, the pitch of the parallel grooves constituting the vertical or horizontal direction of the lattice.
- the lower limit of the area of each polishing section 24 is preferably 0.5 mm 2, 1 mm 2 is more preferable.
- the upper limit of the area of the polishing unit 24 is preferably 13 mm 2, 7 mm 2 is more preferable.
- the area of the polishing portion 24 is less than the lower limit, the abrasion of the polishing layer 20 is accelerated, and the durability of the abrasive 1 may be insufficient. Further, the polishing unit 24 may be peeled off from the base material 10.
- the area of the polishing portion 24 exceeds the upper limit, the polishing layer 20 is less likely to be worn and an appropriate level difference may not be easily generated. For this reason, at the time of polishing, the contact area of the polishing portion 24 with the work body becomes too large, and the polishing rate may be reduced due to frictional resistance.
- the polishing layer 20 has a first region X1, a second region X2, a third region X3, and a fourth region X4 that are divided by two straight lines that pass through the center of the surface of the substrate 10 and are orthogonal to each other. That is, the first region X1, the second region X2, the third region X3, and the fourth region X4 are disposed at substantially equal angular intervals. Further, since the grooves are formed as described above, the occupied area ratios of the first region X1 and the third region X3 are substantially the same, and the occupied area ratios of the second region X2 and the fourth region X4 are substantially the same. is there.
- the occupied area ratio of the polishing portion 24 in the first region X1 and the third region X3 is larger than the occupied area ratio of the polishing portion 24 in the second region X2 and the fourth region X4. Accordingly, the polishing layer 20 has two types of regions having different occupation area ratios of the polishing portion 24 alternately at substantially equal angular intervals. In this way, the polishing layer 20 has two kinds of regions having different occupation area ratios of the polishing portion 24 alternately at substantially equal angular intervals, so that the work piece periodically moves between the regions, so that even higher planarization is achieved. The accuracy and the effect of suppressing the reduction of the polishing rate can be obtained.
- the lower limit of the occupied area ratio of the first area X1 and the third area X3 where the occupied area ratio of the polishing portion 24 is large is preferably 9%, and more preferably 11%.
- the upper limit of the occupied area ratio of the first region X1 and the third region X3 is preferably 16%, and more preferably 13%.
- the difference in occupied area ratio between the second area X2 and the fourth area X4 having a small occupied area ratio is within a predetermined range. For this, it is necessary to make the occupation area ratio of the second region X2 and the fourth region X4 relatively small.
- the durability of the abrasive 1 may be insufficient.
- the occupation area ratio of the first region X1 and the third region X3 exceeds the upper limit, the first region X1 and the third region X3 are hardly worn during polishing, and the second region X2 and the fourth region X4.
- the step between the two becomes larger.
- the overcoming resistance becomes too large, and there is a risk that the chipping or cracking of the workpiece will occur.
- the lower limit of the occupied area ratio of the second area X2 and the fourth area X4 where the occupied area ratio of the polishing unit 24 is small is preferably 4.5%, and more preferably 6%.
- the upper limit of the occupation area ratio of the second region X2 and the fourth region X4 is preferably 9%, and more preferably 8%.
- the second region X2 and the fourth region X4 are less likely to be worn during polishing, and the first region X1 and the third region X3.
- an appropriate level difference is hardly generated between the second region X2 and the fourth region X4. For this reason, there is a possibility that the polishing rate is likely to decrease.
- the lower limit is 3%, and 4% is more preferable.
- the upper limit of the difference in the occupied area ratio is 21%, and more preferably 12%.
- the polishing rate is likely to decrease.
- the difference in the occupied area ratio exceeds the upper limit, the level difference between the first region X1 and the third region X3 and the second region X2 and the fourth region X4 during polishing becomes large. As a result, the overcoming resistance becomes too large, and there is a risk that the chipping or cracking of the workpiece will occur.
- the area of each region is determined by the number of divisions of the region and the size of the substrate 10, but the lower limit of the area of each region is preferably 2000 mm 2 and preferably 3000 mm 2 . On the other hand, the upper limit of the area of each region is preferably 20000 mm 2, 15000 2 is more preferable. If the area of each region is less than the lower limit, the trailing edge of the workpiece is located in another adjacent region even when the leading edge of the workpiece moves in the region, and the resistance to overcoming is insufficient. There is a possibility that the effect of improving the grip strength is insufficient.
- each region is preferably larger than the size of the substrate which is a workpiece, and specifically, each region preferably has a size capable of including a circle having a diameter of 5 cm in plan view.
- the size of each region is equal to or less than the size of the substrate that is the workpiece, the trailing edge of the workpiece is located in another adjacent region even when the leading edge of the workpiece moves in the region, Since the resistance to overcoming is insufficient, the effect of improving the grip strength may be insufficient.
- the adhesive layer 30 is a layer that supports the abrasive 1 and fixes the abrasive 1 to a support for mounting on the polishing apparatus.
- the adhesive used for the adhesive layer 30 is not particularly limited, and examples thereof include a reactive adhesive, an instantaneous adhesive, a hot melt adhesive, and an adhesive.
- a pressure-sensitive adhesive is preferable.
- a pressure-sensitive adhesive As the adhesive used for the adhesive layer 30, a pressure-sensitive adhesive is preferable.
- a pressure-sensitive adhesive As the adhesive used for the adhesive layer 30, the abrasive 1 can be peeled off from the support and can be replaced, so that the abrasive 1 and the support can be easily reused.
- Such an adhesive is not particularly limited.
- the lower limit of the average thickness of the adhesive layer 30 is preferably 0.05 mm, more preferably 0.1 mm. Moreover, as an upper limit of the average thickness of the contact bonding layer 30, 0.3 mm is preferable and 0.2 mm is more preferable. When the average thickness of the adhesive layer 30 is less than the above lower limit, the adhesive force is insufficient, and the abrasive 1 may be peeled off from the support. On the other hand, when the average thickness of the adhesive layer 30 exceeds the above upper limit, there is a risk that workability may be deteriorated, for example, when the abrasive 1 is cut into a desired shape.
- the abrasive 1 is suitably used for single-side or double-side polishing of flat substrates including glass substrates.
- the lower limit of the ratio of the polishing rate at the fifth polishing (polishing rate maintenance ratio) to the polishing rate in the first polishing of the abrasive 1 is preferably 60%, more preferably 75%, and still more preferably 90%. .
- the polishing rate maintenance rate is less than the lower limit, the polishing efficiency may be reduced due to a decrease in the polishing rate.
- the upper limit of the polishing rate maintenance rate is not particularly limited, and the higher the better.
- the polishing rate is 5.08 cm in diameter, 3.97 in specific gravity, c-plane sapphire substrate polishing pressure 200 g / cm 2 , upper surface plate rotation speed ⁇ 25 rpm, lower surface plate rotation speed 50 rpm, and SUN gear rotation speed 8 rpm.
- the polishing rate is obtained by dividing the weight change (g) of the sapphire substrate before and after polishing by the surface area of the substrate ( ⁇ m 2 ), the specific gravity of the substrate (g / ⁇ m 3 ), and the polishing time (minutes). It can be calculated.
- the lower limit of the polishing rate in the first polishing of the abrasive 1 is preferably 10 ⁇ m / min, more preferably 12 ⁇ m / min, and further preferably 15 ⁇ m / min.
- the upper limit of the polishing rate is not particularly limited.
- the abrasive 1 can be produced by a step of preparing a polishing layer composition, a step of printing the polishing layer composition on the surface side of the substrate 10, and a step of applying an adhesive layer 30.
- polishing layer composition preparation step First, in the polishing layer composition preparing step, a polishing layer composition containing a binder 22 forming material mainly composed of an inorganic substance, a filler, and abrasive grains 21 is prepared as a coating liquid. Moreover, in order to control the viscosity and fluidity
- the coating liquid prepared in the polishing layer composition preparation step is used, and the surface of the base material 10 is configured by a plurality of polishing portions 24 divided by grooves 23 by a printing method.
- a polishing layer 20 is formed.
- the polishing layer 20 has two types of regions each having two different area ratios of the polishing unit 24. Specifically, for the four regions divided by two straight lines passing through the center of the surface of the base material 10, these two types of regions are alternately arranged along the polishing direction.
- the polishing layer 20 is formed by preparing a mask corresponding to the two types of regions and printing the polishing layer composition through the mask. In order to form the groove
- this printing method for example, screen printing, metal mask printing or the like can be used.
- the polishing layer 20 is formed by heat-dehydrating and heat-curing the coating liquid. Specifically, for example, the coating liquid is dried at room temperature (25 ° C.), heated and dehydrated at a temperature of 70 ° C. to 90 ° C., and then heated at 140 ° C. to 310 ° C. for 2 hours to 4 hours. By curing within the range, the binder 22 is formed.
- Adhesive layer application process Finally, in the adhesive layer sticking step, the adhesive layer 30 is stuck on the back surface of the substrate 10 to obtain the abrasive 1.
- the difference in the occupied area ratio between the plurality of polishing portions 24 in a pair of the adjacent regions along the polishing direction is within the above range.
- polishing has a small occupied area rate is moderately large. Due to this polishing pressure difference, the region having a smaller occupation area ratio is worn first, and thus the abrasive 1 has an appropriate level difference between adjacent regions. Accordingly, the workpiece is polished while moving from a small region to a large region or vice versa during polishing.
- the gripping force of the abrasive 1 is improved by the resistance to overcoming when moving in this region, and the surface pressure is further increased in a region where the height is high, that is, the occupied area ratio is large.
- the abrasive 1 can more effectively utilize the surface pressure during polishing, and therefore has a high polishing rate and flattening accuracy, and the polishing rate is unlikely to decrease over a relatively long period of time due to the grip force. Therefore, since the abrasive 1 does not need to be dressed frequently, the running cost can be reduced, the process management can be simplified, and the polishing accuracy and the polishing efficiency are excellent. Furthermore, since it is not necessary to supply new abrasive grains during polishing, polishing using the abrasive 1 is lower in polishing cost than polishing using loose abrasive grains.
- the abrasive 2 shown in FIG. 2 has a disk shape, and mainly includes a base material 11 and a polishing layer 20 laminated on the surface side of the base material 11. Further, the abrasive 2 includes an adhesive layer 30 laminated on the back surface side of the base material 11. Further, the abrasive 2 includes a support 40 stacked via the adhesive layer 30 and a support adhesive layer 41 stacked on the back side of the support 40.
- the same component as 1st Embodiment attaches
- the substrate 11 is a plate-like member for supporting the polishing layer 20.
- the base material 11 is divided into a first region X1, a second region X2, a third region X3, and a fourth region X4 along the polishing direction. That is, the bottom surface of the groove located at the boundary between adjacent regions is formed by the surface of the support 40.
- the abrasive 2 can be configured by bonding a plurality of base materials 11 each having a polishing layer 20 having a different occupation area ratio of the polishing portion 24. Compared with the case where regions having different occupation area ratios are formed on one base material, the abrasive 2 can be easily manufactured.
- the material, size, and average thickness of the substrate 11 can be the same as those of the substrate 10 of the first embodiment.
- the support 40 is a plate-like member for supporting the base material 11 and fixing the abrasive 2 to a polishing apparatus.
- the material of the support 40 examples include thermoplastic resins such as polypropylene, polyethylene, polytetrafluoroethylene, and polyvinyl chloride, and engineering plastics such as polycarbonate, polyamide, and polyethylene terephthalate.
- thermoplastic resins such as polypropylene, polyethylene, polytetrafluoroethylene, and polyvinyl chloride
- engineering plastics such as polycarbonate, polyamide, and polyethylene terephthalate.
- the average thickness of the support 40 can be, for example, 0.5 mm or more and 3 mm or less.
- the strength of the support 40 may be insufficient.
- the average thickness of the support 40 exceeds the upper limit, it may be difficult to attach the support 40 to a polishing apparatus or the flexibility of the support 40 may be insufficient.
- the support adhesive layer 41 is a layer for mounting the support 40 to the polishing apparatus.
- the kind and average thickness of the adhesive of the support adhesive layer 41 can be the same as those of the adhesive layer 30.
- the abrasive 2 includes a step of preparing a composition for a polishing layer, a step of printing the composition for a polishing layer on the surface side of the substrate 11, a step of fixing the substrate 11 to the support 40, and a support adhesive layer. It can be manufactured by a process of attaching 41.
- polishing layer composition preparation step Since the polishing layer composition preparation step is the same as the polishing layer composition preparation step in the first embodiment, a description thereof will be omitted.
- two base materials 11 are prepared for two types of regions having different occupation area ratios of the polishing portion 24 of the abrasive 2.
- a mask corresponding to the substrate 11 is prepared, and the polishing layer composition is printed through the mask.
- the said mask has a shape corresponding to the shape of the groove
- the printing method can be the same as in the first embodiment.
- the base material 11 on which the polishing layer 20 is formed is cut so as to match the shape of each region of the abrasive 2 and bonded to the support 40 via the adhesive layer 30.
- the abrasive 2 includes the support 40, the abrasive 2 can be easily handled.
- the present invention is not limited to the above-described embodiment, and can be implemented in a mode in which various changes and improvements are made in addition to the above-described mode.
- the shape of the abrasive is not limited to a disk-like shape.
- the abrasive can be square.
- the size of the abrasive in a square shape is not particularly limited.
- the size can be a square shape having a side of 140 mm or more and 160 mm or less.
- the grooves have a lattice shape, that is, the planar shape of the polishing portion is a square shape.
- the planar shape of the polishing portion may not be a square shape, for example, a shape in which a polygon other than a rectangle is repeated, a circular shape, etc. It may be.
- the depth of a groove part is smaller than the average thickness of an abrasive layer, and a groove part does not reach the surface of a base material, Good.
- the depth of the groove can be 50% or more of the average thickness of the polishing layer.
- the occupied area ratio of the two types of regions differs depending on the groove width.
- the occupied area ratio depends on other parameters such as the groove shape (the shape of the polishing portion), the interval or number of grooves, and the like. May be changed.
- the abrasive material composed of two types of regions having different occupation area ratios has been described.
- the number of regions having different occupation area ratios is not limited to two types, and the number of regions having different occupation area ratios is three types. It may be the above.
- the number of divisions is not limited to four, and may be two divisions, three divisions, five divisions or more.
- segmentation number 4 is preferable.
- the number of divisions is less than the above lower limit, the number of times per unit time that the work piece gets over the region having different occupation area ratios during polishing decreases, and thus the effect of improving the gripping force due to overcoming resistance may be insufficient.
- the adhesive layer is not an essential component and can be omitted.
- the adhesive layer may be on the support side, or may be fixed to the support using other fixing means such as screwing.
- the filling portion preferably contains a resin or an inorganic substance as a main component and does not substantially contain abrasive grains.
- the “filled portion substantially free of abrasive grains” means that the content of abrasive grains is less than 0.001% by volume, preferably less than 0.0001% by volume.
- the lower limit of the ratio of the average thickness of the filler to the average thickness of the polishing layer is preferably 0.1, more preferably 0.5, still more preferably 0.8, 0.95 is particularly preferred.
- the upper limit of the ratio of the average thickness of the filling portion is preferably 1, and more preferably 0.98.
- the polishing layer may not sufficiently contact the work body at the start of polishing, or the polishing pressure is dispersed in the filling layer and applied to the polishing layer.
- the polishing pressure may be insufficient.
- the “average thickness of the filling portion” means the average distance between the surface of the base material and the surface of the filling portion.
- Example 1 Diamond abrasive grains were prepared, and the average particle diameter was measured using “Microtrac MT3300EXII” manufactured by Nikkiso Co., Ltd. The average particle diameter of the diamond abrasive grains was 44 ⁇ m. The type of diamond in this abrasive grain is treated diamond coated with 55% by mass nickel.
- Sodium silicate No. 3 sodium silicate
- the above-mentioned diamond abrasive grains, and alumina Al 2 O 3 , average particle diameter of 12 ⁇ m
- the coating liquid was prepared so that 5 volume% and the content of the filler with respect to the polishing layer were 71 volume%.
- a disk-shaped aluminum plate having an average thickness of 300 ⁇ m, an outer diameter of 386 mm, and an inner diameter of 148 mm was prepared as a substrate.
- the eight regions are divided by four straight lines that pass through the center of the surface of the base material and form an angle of 45 degrees with the adjacent straight line, and two types of regions having different occupation area ratios are alternately arranged along the circumferential direction.
- a polishing layer was formed so as to be disposed on the surface.
- channel was formed in the grinding
- the coating solution was dried at room temperature (25 ° C.), heated and dehydrated at a temperature of 60 ° C. to 100 ° C., and then cured at 300 ° C. for 2 hours to 4 hours.
- a hard vinyl chloride resin plate having an average thickness of 1 mm is used as a support that supports the substrate and is fixed to the polishing apparatus, and the back surface of the substrate and the surface of the support are bonded with an adhesive having an average thickness of 130 ⁇ m. Combined. A double-sided tape was used as the adhesive. In this way, an abrasive of Example 1 was obtained.
- Example 2 A polishing layer having a square shape with a side of 1.5 mm and a groove width of 3.5 mm is formed in a region having a small occupied area ratio, and the polishing portion has a plan view shape with a diameter of 1 A polishing layer having a square shape of 0.5 mm and a groove width of 2.346 mm was formed in a region having a large occupied area ratio. Except for the above, the abrasive of Example 2 was obtained in the same manner as Example 1.
- Example 3 The area is a square with a side of 5 mm, the planar shape of the polishing part is a square with a diameter of 1.69 mm, and the polishing layer with a groove width of 3.31 mm is formed in a region with a small occupied area ratio, A polishing layer in which the shape of the polishing portion in plan view was a square shape having a diameter of 1.2 mm and the groove width was 3.8 mm was formed in a region having a large occupied area ratio. Except for the above, the abrasive of Example 3 was obtained in the same manner as Example 1.
- Example 4 An abrasive material of Example 4 was obtained in the same manner as in Example 3 except that the region was a square shape having a side of 25 mm.
- Comparative Example 1 An aluminum plate whose base material is a polishing layer in which the polishing layer does not have regions with different occupation area ratios, the polishing portion has a square shape with a diameter of 1.5 mm in plan view, and a groove width of 3.5 mm A polishing material of Comparative Example 1 was obtained in the same manner as in Example 1 except that it was formed on the entire surface of
- Comparative Example 2 The polishing material of Comparative Example 2 was obtained in the same manner as Comparative Example 1 except that a polishing layer having a square shape with a diameter of 1.5 mm and a groove width of 3.8 mm was formed. It was.
- Comparative Example 3 A polishing material of Comparative Example 3 was obtained in the same manner as Comparative Example 1 except that a polishing layer having a square shape with a diameter of 1.5 mm and a groove width of 2.346 mm was formed. It was.
- the sapphire substrate was polished using the abrasives obtained in Examples 1 to 4 and Comparative Examples 1 to 3.
- a sapphire substrate having a diameter of 5.08 cm, a specific gravity of 3.97, and a c-plane (already processed) was used.
- a commercially available double-side polishing machine was used for the polishing.
- the carrier of the double-side polishing machine is 0.4 mm thick epoxy glass. Polishing was performed 5 times for 10 minutes using a polishing pressure of 200 g / cm 2 and conditions of an upper surface plate rotation of ⁇ 25 rpm, a lower surface plate rotation of 50 rpm, and a SUN gear rotation of 8 rpm. At that time, 30 cc of “Daffney Cut GS50K” manufactured by Idemitsu Kosan Co., Ltd. was supplied as a coolant.
- polishing rate a sapphire substrate subjected to the first polishing for 10 minutes was used.
- the polishing rate was calculated by dividing the change in weight (g) of the substrate before and after polishing by the surface area (cm 2 ) of the substrate, the specific gravity (g / cm 3 ) of the substrate, and the polishing time (minutes). The results are shown in Table 2.
- ⁇ Maintenance rate> The maintenance rate of the polishing rate was calculated by dividing the polishing rate at the fifth polishing by the polishing rate at the first polishing. The results are shown in Table 2.
- the polishing materials of Examples 1 to 4 have the same polishing rate as the polishing materials of Comparative Examples 1 to 3, and the polishing rate is difficult to decrease.
- the abrasives of Comparative Examples 1 to 3 do not have regions with different occupation area ratios. Therefore, it is considered that the effect of improving the grip force due to the resistance to overcoming is not obtained, and the maintenance rate of the polishing rate is lowered. From this, it can be seen that the polishing materials of Examples 1 to 4 are excellent in the polishing rate and the polishing rate maintenance property because they have two types of regions with different occupied area ratios of the polishing portion.
- Examples 1-2 are compared with Examples 3-4, the polishing rate is less likely to decrease in Examples 1-2. From this, it can be seen that the polishing rate maintainability is further improved when the region has a size capable of including a circle having a diameter of 5 cm in plan view.
- the abrasive of the present invention is excellent in polishing accuracy, hardly reduces the polishing efficiency, and has a low polishing cost. Therefore, the said abrasive
- polishing material can be used suitably for grinding
- substrates such as a glass substrate used for an electronic device etc., and sapphire and silicon carbide.
Abstract
Description
以下、本発明の第1の実施形態を適宜図面を参照しつつ詳説する。 [First Embodiment]
Hereinafter, a first embodiment of the present invention will be described in detail with reference to the drawings as appropriate.
図1A及び図1Bに示す当該研磨材1は、円盤状であり、基材10と、この基材10の表面側に積層される研磨層20とを主に備える。また、当該研磨材1は、基材10の裏面側に積層される接着層30を備える。当該研磨材1は、公知の研磨装置の研磨定盤に配設され、研磨装置により被削体に接触しつつ回転させられることで、研磨を行う。つまり、当該研磨材1の研磨方向は、基材10の円周方向である。 <Abrasive>
The abrasive 1 shown in FIGS. 1A and 1B has a disc shape, and mainly includes a
上記基材10は、研磨層20を支持するための板状の部材である。 (Base material)
The
研磨層20は、砥粒21及びそのバインダー22を含む。また、上記研磨層20は、その表面に溝23により区分された複数の研磨部24を備える。 (Polishing layer)
The
上記砥粒21としては、ダイヤモンド、アルミナ、シリカ等の粒子が挙げられる。中でも高い研磨力が得られるダイヤモンド砥粒が好ましい。このように上記砥粒21をダイヤモンド砥粒とすることで、研磨力を向上できるので、研磨時の面圧がさらに有効に活用できると共に、乗り越え抵抗によるグリップ力向上効果がより確実に得られる。 (Abrasive grains)
Examples of the abrasive 21 include particles such as diamond, alumina, and silica. Among these, diamond abrasive grains that can provide high polishing power are preferable. Thus, by making the said
上記バインダー22の主成分としては、樹脂又は無機物を挙げることができる。上記樹脂としては、例えばアクリル樹脂、ウレタン樹脂、エポキシ樹脂、セルロース樹脂、ビニル樹脂、フェノキシ樹脂、フェノール樹脂、ポリエステル等を挙げることができる。また、上記無機物としては、ケイ酸塩、リン酸塩、多価金属アルコキシド等を挙げることができる。 (binder)
Examples of the main component of the
上記溝23は、研磨層20の表面側に等間隔の格子状に構成される。また、上記溝23の底面は、基材10の表面で構成される。 (groove)
The
上記研磨層20は、基材10表面の中心を通り直交する2つの直線により分割した第1領域X1、第2領域X2、第3領域X3、及び第4領域X4を有する。つまり、上記第1領域X1、第2領域X2、第3領域X3及び第4領域X4は略等角度間隔に配設されている。また、上述のように溝が構成されているので、第1領域X1及び第3領域X3の占有面積率が略同一であり、第2領域X2及び第4領域X4の占有面積率は略同一である。また、第1領域X1及び第3領域X3の研磨部24の占有面積率は、第2領域X2及び第4領域X4の研磨部24の占有面積率よりも大きい。従って、上記研磨層20は、研磨部24の占有面積率が異なる2種の領域を略等角度間隔に交互に有する。このように研磨層20が研磨部24の占有面積率が異なる2種の領域を略等角度間隔に交互に有することで、被削体が領域間を周期的に移動するので、さらに高い平坦化精度と研磨レートの低下の抑止効果とが得られる。 (Abrasive layer area)
The
接着層30は、当該研磨材1を支持し研磨装置に装着するための支持体に当該研磨材1を固定する層である。 (Adhesive layer)
The
当該研磨材1はガラス基板をはじめとする平面基板の片面又は両面研磨に好適に用いられる。 <Polishing flat substrates>
The abrasive 1 is suitably used for single-side or double-side polishing of flat substrates including glass substrates.
当該研磨材1は、研磨層用組成物を準備する工程、研磨層用組成物を基材10の表面側に印刷する工程、及び接着層30を貼付する工程により製造できる。 <Abrasive manufacturing method>
The abrasive 1 can be produced by a step of preparing a polishing layer composition, a step of printing the polishing layer composition on the surface side of the
まず、研磨層用組成物準備工程において、無機物を主成分とするバインダー22の形成材料、充填剤及び砥粒21を含む研磨層用組成物を塗工液として準備する。また、塗工液の粘度や流動性を制御するために、水、アルコール等の希釈剤等を添加する。 (Polishing layer composition preparation step)
First, in the polishing layer composition preparing step, a polishing layer composition containing a
最後に、接着層貼付工程において、上記基材10の裏面に接着層30を貼付し、当該研磨材1を得ることができる。 (Adhesive layer application process)
Finally, in the adhesive layer sticking step, the
当該研磨材1は、研磨方向に沿って隣接する一対の上記領域の複数の研磨部24の占有面積率の差が上記範囲内である。このため、当該研磨材1では研磨中に受ける研磨圧力が占有面積率の小さい領域の方が適度に大きい。この研磨圧力差により占有面積率の小さい領域の方が先に摩耗するため、当該研磨材1は隣接する領域間に適度な段差を生じる。従って、研磨時に被削体が高さの小さい領域から大きい領域へ、又はその逆方向へ移動しながら研磨される。この領域を移動する際の乗り越え抵抗により当該研磨材1のグリップ力が向上し、かつ高さの大きい、すなわち占有面積率が大きい領域において面圧がさらに高まる。これにより当該研磨材1は、研磨時の面圧をより有効に活用できるので、高い研磨レートと平坦化精度を有し、かつグリップ力により比較的長期間に渡り研磨レートが低下し難い。従って、当該研磨材1はドレスを頻繁に行う必要がないため、ランニングコストの低減や工程管理の簡易化ができ、かつ研磨精度及び研磨効率に優れる。さらに、研磨時に砥粒を新たに供給する必要がないため、当該研磨材1を用いた研磨は遊離砥粒を用いた研磨に比べて研磨コストが低い。 <Advantages>
In the abrasive 1, the difference in the occupied area ratio between the plurality of polishing
以下、本発明の第2の実施形態を適宜図面を参照しつつ詳説する。 [Second Embodiment]
Hereinafter, a second embodiment of the present invention will be described in detail with reference to the drawings as appropriate.
上記基材11は、研磨層20を支持するための板状の部材である。基材11は、その研磨方向に沿って第1領域X1、第2領域X2、第3領域X3、及び第4領域X4に分断されている。つまり、隣接する領域の境界に位置する溝の底面は、支持体40の表面で構成される。基材11を各領域に分断することで、それぞれ研磨部24の占有面積率の異なる研磨層20を形成した複数の基材11の貼り合わせにより当該研磨材2が構成できるので、研磨部24の占有面積率の異なる領域を1の基材に形成する場合に比べ、当該研磨材2の製造が容易である。 (Base material)
The
支持体40は、基材11を支持し、また当該研磨材2を研磨装置に固定するための板状の部材である。 (Support)
The
支持体接着層41は、支持体40を研磨装置に装着するための層である。 (Support adhesive layer)
The
当該研磨材2は、研磨層用組成物を準備する工程、研磨層用組成物を基材11の表面側に印刷する工程、上記基材11を支持体40に固定する工程及び支持体接着層41を貼付する工程により製造できる。 <Abrasive manufacturing method>
The abrasive 2 includes a step of preparing a composition for a polishing layer, a step of printing the composition for a polishing layer on the surface side of the
研磨層用組成物準備工程は、第1実施形態における研磨層用組成物準備工程と同様であるので、説明を省略する。 (Polishing layer composition preparation step)
Since the polishing layer composition preparation step is the same as the polishing layer composition preparation step in the first embodiment, a description thereof will be omitted.
次に、印刷工程において、上記研磨層用組成物準備工程で準備した塗工液を用い、基材11に上記研磨層用組成物を印刷する。 (Printing process)
Next, in the printing step, the polishing layer composition is printed on the
次に、基材貼付工程において、研磨層20を形成した上記基材11を当該研磨材2の各領域の形状に合うように切断し、接着層30を介して支持体40にそれぞれ接着する。 (Substrate pasting process)
Next, in the base material sticking step, the
最後に、支持体接着層貼付工程において、上記支持体40の裏面に支持体接着層41を貼付し、当該研磨材2を得ることができる。 (Support adhesive layer application process)
Finally, in the support adhesive layer sticking step, the
当該研磨材2が支持体40を備えることで、当該研磨材2の取り扱いが容易となる。 <Advantages>
Since the abrasive 2 includes the
本発明は上記実施形態に限定されるものではなく、上記態様の他、種々の変更、改良を施した態様で実施することができる。 [Other Embodiments]
The present invention is not limited to the above-described embodiment, and can be implemented in a mode in which various changes and improvements are made in addition to the above-described mode.
ダイヤモンド砥粒を用意し、日機装株式会社の「MicrotracMT3300EXII」を用いて平均粒子径を計測した。このダイヤモンド砥粒の平均粒子径は44μmであった。なお、この砥粒のダイヤモンドの種類は55質量%ニッケルコーティングされた処理ダイヤモンドである。 [Example 1]
Diamond abrasive grains were prepared, and the average particle diameter was measured using “Microtrac MT3300EXII” manufactured by Nikkiso Co., Ltd. The average particle diameter of the diamond abrasive grains was 44 μm. The type of diamond in this abrasive grain is treated diamond coated with 55% by mass nickel.
研磨部の平面視形状が1辺1.5mmの正方形状であり、かつ溝の幅が3.5mmである研磨層を占有面積率の小さい領域に形成し、研磨部の平面視形状が直径1.5mmの正方形状であり、かつ溝の幅が2.346mmである研磨層を占有面積率の大きい領域に形成した。上記以外は、実施例1と同様にして実施例2の研磨材を得た。 [Example 2]
A polishing layer having a square shape with a side of 1.5 mm and a groove width of 3.5 mm is formed in a region having a small occupied area ratio, and the polishing portion has a plan view shape with a diameter of 1 A polishing layer having a square shape of 0.5 mm and a groove width of 2.346 mm was formed in a region having a large occupied area ratio. Except for the above, the abrasive of Example 2 was obtained in the same manner as Example 1.
領域を1辺5mmの正方形状とし、研磨部の平面視形状が直径1.69mmの正方形状であり、かつ溝の幅が3.31mmである研磨層を占有面積率の小さい領域に形成し、研磨部の平面視形状が直径1.2mmの正方形状であり、かつ溝の幅が3.8mmである研磨層を占有面積率の大きい領域に形成した。上記以外は、実施例1と同様にして実施例3の研磨材を得た。 [Example 3]
The area is a square with a side of 5 mm, the planar shape of the polishing part is a square with a diameter of 1.69 mm, and the polishing layer with a groove width of 3.31 mm is formed in a region with a small occupied area ratio, A polishing layer in which the shape of the polishing portion in plan view was a square shape having a diameter of 1.2 mm and the groove width was 3.8 mm was formed in a region having a large occupied area ratio. Except for the above, the abrasive of Example 3 was obtained in the same manner as Example 1.
領域を1辺25mmの正方形状とした以外は、実施例3と同様にして実施例4の研磨材を得た。 [Example 4]
An abrasive material of Example 4 was obtained in the same manner as in Example 3 except that the region was a square shape having a side of 25 mm.
研磨層が占有面積率の異なる領域を有さず、研磨部の平面視形状が直径1.5mmの正方形状であり、かつ溝の幅が3.5mmである研磨層を基材であるアルミニウム板の表面全面に形成した以外は、実施例1と同様にして比較例1の研磨材を得た。 [Comparative Example 1]
An aluminum plate whose base material is a polishing layer in which the polishing layer does not have regions with different occupation area ratios, the polishing portion has a square shape with a diameter of 1.5 mm in plan view, and a groove width of 3.5 mm A polishing material of Comparative Example 1 was obtained in the same manner as in Example 1 except that it was formed on the entire surface of
研磨部の平面視形状が直径1.5mmの正方形状であり、かつ溝の幅が3.8mmである研磨層を形成した以外は、比較例1と同様にして比較例2の研磨材を得た。 [Comparative Example 2]
The polishing material of Comparative Example 2 was obtained in the same manner as Comparative Example 1 except that a polishing layer having a square shape with a diameter of 1.5 mm and a groove width of 3.8 mm was formed. It was.
研磨部の平面視形状が直径1.5mmの正方形状であり、かつ溝の幅が2.346mmである研磨層を形成した以外は、比較例1と同様にして比較例3の研磨材を得た。 [Comparative Example 3]
A polishing material of Comparative Example 3 was obtained in the same manner as Comparative Example 1 except that a polishing layer having a square shape with a diameter of 1.5 mm and a groove width of 2.346 mm was formed. It was.
上記実施例1~4及び比較例1~3で得られた研磨材を用いて、サファイア基板の研磨を行った。上記サファイア基板には、直径5.08cm、比重3.97、c面のサファイア基板(アズラップ処理済)を用いた。上記研磨には、市販の両面研磨機を用いた。両面研磨機のキャリアは、厚さ0.4mmのエポキシガラスである。研磨は、研磨圧力を200g/cm2とし、上定盤回転数-25rpm、下定盤回転数50rpm及びSUNギア回転数8rpmの条件を用いて10分間ずつ5回行った。その際、クーラントとして、出光興産株式会社の「ダフニーカットGS50K」を毎分30cc供給した。 [Polishing conditions]
The sapphire substrate was polished using the abrasives obtained in Examples 1 to 4 and Comparative Examples 1 to 3. As the sapphire substrate, a sapphire substrate having a diameter of 5.08 cm, a specific gravity of 3.97, and a c-plane (already processed) was used. A commercially available double-side polishing machine was used for the polishing. The carrier of the double-side polishing machine is 0.4 mm thick epoxy glass. Polishing was performed 5 times for 10 minutes using a polishing pressure of 200 g / cm 2 and conditions of an upper surface plate rotation of −25 rpm, a lower surface plate rotation of 50 rpm, and a SUN gear rotation of 8 rpm. At that time, 30 cc of “Daffney Cut GS50K” manufactured by Idemitsu Kosan Co., Ltd. was supplied as a coolant.
研磨レートの算出には、1回目の研磨を10分間行ったサファイア基板を用いた。研磨レートは、研磨前後の基板の重量変化(g)を、基板の表面積(cm2)、基板の比重(g/cm3)及び研磨時間(分)で除し、算出した。結果を表2に示す。 <Polishing rate>
For the calculation of the polishing rate, a sapphire substrate subjected to the first polishing for 10 minutes was used. The polishing rate was calculated by dividing the change in weight (g) of the substrate before and after polishing by the surface area (cm 2 ) of the substrate, the specific gravity (g / cm 3 ) of the substrate, and the polishing time (minutes). The results are shown in Table 2.
研磨レートの維持率は、5回目の研磨時の研磨レートを1回目の研磨時の研磨レートで除して算出した。結果を表2に示す。 <Maintenance rate>
The maintenance rate of the polishing rate was calculated by dividing the polishing rate at the fifth polishing by the polishing rate at the first polishing. The results are shown in Table 2.
10、11 基材
20 研磨層
21 砥粒
22 バインダー
23 溝
24 研磨部
30 接着層
40 支持体
41 支持体接着層
X1 第1領域
X2 第2領域
X3 第3領域
X4 第4領域 DESCRIPTION OF
Claims (7)
- 基材と、この基材の表面側に積層され、砥粒及びそのバインダーを含む研磨層とを備える研磨材であって、
上記研磨層が、その表面に溝により区分された複数の研磨部を備え、かつ上記複数の研磨部の占有面積率が異なる複数種の領域を研磨方向に沿って有し、
研磨方向に沿って隣接する一対の上記領域の複数の研磨部の占有面積率の差が3%以上21%以下であることを特徴とする研磨材。 A polishing material comprising a base material and a polishing layer laminated on the surface side of the base material and containing abrasive grains and a binder thereof,
The polishing layer includes a plurality of regions along the polishing direction, the surface including a plurality of polishing parts divided by grooves on the surface, and the occupation area ratio of the plurality of polishing parts is different.
A polishing material characterized in that a difference in occupation area ratio between a plurality of polishing portions of a pair of adjacent regions along the polishing direction is 3% or more and 21% or less. - 上記各領域が平面視で直径5cmの円を包含可能な大きさを有する請求項1に記載の研磨材。 The abrasive according to claim 1, wherein each of the regions has a size capable of including a circle having a diameter of 5 cm in plan view.
- 研磨方向に沿って隣接する一対の領域のうち、一方の領域における複数の研磨部の占有面積率が4.5%以上9%以下であり、
他方の領域における複数の研磨部の占有面積率が9%以上16%以下である請求項1又は請求項2に記載の研磨材。 Of the pair of regions adjacent along the polishing direction, the occupation area ratio of the plurality of polishing portions in one region is 4.5% or more and 9% or less,
The abrasive according to claim 1 or 2, wherein an area ratio occupied by a plurality of polishing portions in the other region is 9% or more and 16% or less. - 上記砥粒がダイヤモンド砥粒である請求項1、請求項2又は請求項3に記載の研磨材。 The abrasive according to claim 1, 2, or 3, wherein the abrasive grains are diamond abrasive grains.
- 上記バインダーの主成分が無機物である請求項1から請求項4のいずれか1項に記載の研磨材。 The abrasive according to any one of claims 1 to 4, wherein a main component of the binder is an inorganic substance.
- 上記バインダーが酸化物を主成分とする充填剤を含有する請求項5に記載の研磨材。 The abrasive according to claim 5, wherein the binder contains a filler mainly composed of an oxide.
- 基板の平面研磨に用いられる請求項1から請求項6のいずれか1項に記載の研磨材。 The abrasive according to any one of claims 1 to 6, which is used for planar polishing of a substrate.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016575710A JP6316460B2 (en) | 2016-01-08 | 2016-12-26 | Abrasive |
KR1020187017975A KR102040144B1 (en) | 2016-01-08 | 2016-12-26 | Abrasive |
CN201680077666.4A CN108472789B (en) | 2016-01-08 | 2016-12-26 | Grinding material |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016003037 | 2016-01-08 | ||
JP2016-003037 | 2016-01-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2017119339A1 true WO2017119339A1 (en) | 2017-07-13 |
Family
ID=59274199
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2016/088702 WO2017119339A1 (en) | 2016-01-08 | 2016-12-26 | Abrasive material |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6316460B2 (en) |
KR (1) | KR102040144B1 (en) |
CN (1) | CN108472789B (en) |
TW (1) | TWI707746B (en) |
WO (1) | WO2017119339A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021095639A1 (en) * | 2019-11-13 | 2021-05-20 | バンドー化学株式会社 | Polishing pad |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109202696A (en) * | 2018-09-10 | 2019-01-15 | 台山市远鹏研磨科技有限公司 | A kind of thinned pad of Diamond Ceramics |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004154908A (en) * | 2002-11-07 | 2004-06-03 | Noritake Super Abrasive:Kk | Grinding wheel |
JP2008246615A (en) * | 2007-03-29 | 2008-10-16 | Noritake Super Abrasive:Kk | Electrodeposition wheel |
JP2011031361A (en) * | 2009-08-05 | 2011-02-17 | Nihon Micro Coating Co Ltd | Polishing tool, polishing method, and method for manufacturing polishing tool |
US20140290147A1 (en) * | 2013-03-29 | 2014-10-02 | Saint-Gobain Abrasifs | Abrasive Particles having Particular Shapes and Methods of Forming such Particles |
WO2015143278A1 (en) * | 2014-03-21 | 2015-09-24 | Entegris, Inc. | Chemical mechanical planarization pad conditioner with elongated cutting edges |
WO2015194278A1 (en) * | 2014-06-17 | 2015-12-23 | バンドー化学株式会社 | Polishing pad and method for producing polishing pad |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3009565B2 (en) * | 1993-08-18 | 2000-02-14 | 洋 橋本 | Grinding tool |
JP3069831B2 (en) * | 1994-12-16 | 2000-07-24 | 株式会社利根 | Casting cutter |
IT1288922B1 (en) * | 1996-06-13 | 1998-09-25 | Danieli Off Mecc | IN-LINE GRINDING DEVICE FOR LAMINATION CYLINDERS AND / OR DRIVE ROLLS |
DE60039054D1 (en) * | 1999-03-30 | 2008-07-10 | Nikon Corp | GT POLISHING BODY, POLISHING DEVICE, POLISHING METHOD AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE (2002/23) |
US6458018B1 (en) | 1999-04-23 | 2002-10-01 | 3M Innovative Properties Company | Abrasive article suitable for abrading glass and glass ceramic workpieces |
JP2002086350A (en) | 2000-09-08 | 2002-03-26 | Noritake Diamond Ind Co Ltd | Polishing fluid for electrophoretic polishing and polishing method |
US6632129B2 (en) * | 2001-02-15 | 2003-10-14 | 3M Innovative Properties Company | Fixed abrasive article for use in modifying a semiconductor wafer |
JP4601317B2 (en) * | 2004-04-15 | 2010-12-22 | 株式会社リコー | Polishing tool and manufacturing method thereof |
US7491251B2 (en) * | 2005-10-05 | 2009-02-17 | 3M Innovative Properties Company | Method of making a structured abrasive article |
TWM446063U (en) * | 2012-08-08 | 2013-02-01 | Ritedia Corp | Chemical mechanical polishing pad dresser |
JP2014100766A (en) | 2012-11-20 | 2014-06-05 | Sharp Corp | Sapphire substrate |
-
2016
- 2016-12-26 KR KR1020187017975A patent/KR102040144B1/en active IP Right Grant
- 2016-12-26 WO PCT/JP2016/088702 patent/WO2017119339A1/en active Application Filing
- 2016-12-26 CN CN201680077666.4A patent/CN108472789B/en active Active
- 2016-12-26 JP JP2016575710A patent/JP6316460B2/en active Active
-
2017
- 2017-01-05 TW TW106100221A patent/TWI707746B/en active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004154908A (en) * | 2002-11-07 | 2004-06-03 | Noritake Super Abrasive:Kk | Grinding wheel |
JP2008246615A (en) * | 2007-03-29 | 2008-10-16 | Noritake Super Abrasive:Kk | Electrodeposition wheel |
JP2011031361A (en) * | 2009-08-05 | 2011-02-17 | Nihon Micro Coating Co Ltd | Polishing tool, polishing method, and method for manufacturing polishing tool |
US20140290147A1 (en) * | 2013-03-29 | 2014-10-02 | Saint-Gobain Abrasifs | Abrasive Particles having Particular Shapes and Methods of Forming such Particles |
WO2015143278A1 (en) * | 2014-03-21 | 2015-09-24 | Entegris, Inc. | Chemical mechanical planarization pad conditioner with elongated cutting edges |
WO2015194278A1 (en) * | 2014-06-17 | 2015-12-23 | バンドー化学株式会社 | Polishing pad and method for producing polishing pad |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021095639A1 (en) * | 2019-11-13 | 2021-05-20 | バンドー化学株式会社 | Polishing pad |
Also Published As
Publication number | Publication date |
---|---|
KR102040144B1 (en) | 2019-11-04 |
CN108472789A (en) | 2018-08-31 |
JPWO2017119339A1 (en) | 2018-01-18 |
TW201736047A (en) | 2017-10-16 |
JP6316460B2 (en) | 2018-04-25 |
KR20180087350A (en) | 2018-08-01 |
CN108472789B (en) | 2020-06-05 |
TWI707746B (en) | 2020-10-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6091704B2 (en) | Abrasive material and method for producing abrasive material | |
JP6046865B1 (en) | Polishing pad and polishing pad manufacturing method | |
JP6316460B2 (en) | Abrasive | |
JP6085723B1 (en) | Abrasive material and method for producing abrasive material | |
KR102039587B1 (en) | Abrasive | |
JP6836532B2 (en) | Abrasive | |
JP6605761B1 (en) | Abrasive | |
JP6340142B2 (en) | Abrasive | |
WO2018008551A1 (en) | Abrasive material | |
JP2022098876A (en) | Polishing pad |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ENP | Entry into the national phase |
Ref document number: 2016575710 Country of ref document: JP Kind code of ref document: A |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 16883838 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 20187017975 Country of ref document: KR Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020187017975 Country of ref document: KR |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 16883838 Country of ref document: EP Kind code of ref document: A1 |