JP2011031361A - Polishing tool, polishing method, and method for manufacturing polishing tool - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide polishing tools such as polishing belts, polishing tapes, and polishing disks, which can suppress the occurrence of scratches and can effectively remove deposits having mutually different properties in polishing or cleaning work for removing deposits having mutually different properties deposited on the surface of a glass substrate or the like, and to provide a method for manufacturing the same. <P>SOLUTION: A polishing belt 10 comprises a sheet-like base material 14 and a polishing layer provided on a surface of the base material 14. The polishing layer has a number of convexed polishing layer blocks that are divided by a groove portion 13 having a bottom face constituted by the surface of the base material 14 and have a predetermined pattern. The polishing layer blocks are characterized by being formed of two types of different polishing layer blocks comprising first polishing blocks 11 and second polishing blocks 12 that are different from each other in material constituting the polishing layer blocks. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention includes materials such as glass, metal, ceramics, and single crystals, magnetic hard disk substrates, magnetic head sliders, flat panel displays (liquid crystal, glass panels for PDPs, etc.), surface polishing of semiconductor substrates, cleaning, vehicles, etc. The present invention relates to a polishing tool used for surface finishing polishing and the like, and a method for manufacturing the same, and particularly to a polishing tool, a polishing method, and a method for manufacturing a polishing tool that can remove deposits having different properties while suppressing generation of scratches during polishing. Is.

  Conventionally, as a polishing tool for polishing and cleaning, a polishing sheet, a polishing belt, a polishing pad, and a roll formed by forming a polishing layer of a resin binder containing abrasive particles on the surface of a synthetic resin sheet, a cloth sheet or a metal sheet There have been selected and used depending on the material of the object to be polished and the purpose of the polishing process.

  For example, in the manufacturing process of a liquid crystal panel, foreign matter such as glass cullet or resin that is processed dust may adhere to the surface of the glass substrate of the liquid crystal panel. Since this causes display defects, cleaning with a polishing belt or polishing tape, cleaning with ultrasonic waves or a brush, and the like have been performed.

  However, depending on the above cleaning, washing, etc., it is not possible to sufficiently remove deposits such as glass cullet and resin that are firmly attached to the surface of the glass substrate. Scratches such as scratches are generated on the surface of the substrate.

  On the surface of the glass substrate of the liquid crystal panel, relatively hard deposits such as glass cullet and protrusions, and relatively soft such as resin, oily dust, and film were firmly attached in the process from raw material to commercialization. There are many cases where deposits with different properties coexist. A polishing tool for individually removing such deposits can be easily selected, but it has been difficult to select a polishing tool that can handle the removal of the entire deposit having different properties.

  For example, a polishing belt is used in which a block aggregate composed of a number of convex-shaped polishing layers is provided on the surface of a sheet-like substrate (for example, Patent Documents 1 to 4). When a glass substrate or the like is polished using a polishing belt provided with such a convex polishing layer, glass cullet and protrusions can be easily removed, but deposits such as resin, oily dust or coating If the polishing is performed until the surface is removed, there is a problem that scratches such as scratches are generated on the surface of an object to be polished such as a glass substrate.

  On the other hand, an abrasive belt in which an abrasive layer is formed of an elastic material such as polyurethane foam, woven fabric, nonwoven fabric, or rubber is also used (for example, Patent Documents 5 to 7). When a glass substrate is polished using a polishing belt provided with such an elastic polishing layer, it can be polished without generating scratches on the surface, but it takes a long time to remove all deposits. Not only the problem but also the problem of wearing the polishing belt has occurred.

  For this reason, it is necessary to perform polishing or cleaning by selecting and exchanging a polishing tool according to the nature and adhesion state of the deposit, which makes the work complicated and inefficient.

JP 59-39168 A Special table 2002-542057 gazette JP 2005-59159 A JP 2006-136773 A JP-A-5-229071 JP 2004-98218 A JP 2004-142066 A

  The present invention has different properties attached to the surface of materials such as glass, metal, ceramics, single crystal, magnetic hard disk substrate, magnetic head slider, flat panel display (liquid crystal, glass panel for PDP, etc.), semiconductor substrate, vehicle, etc. An object of the present invention is to provide a polishing tool, a polishing method, and a manufacturing method thereof that can suppress the occurrence of scratches and efficiently remove deposits having different properties in polishing or cleaning for removing the deposit.

  In order to solve the above problems, the present invention provides a polishing tool having a sheet-like base material and a polishing layer formed on the surface of the base material, wherein the polishing layer is the base material. A plurality of convex-shaped polishing layer blocks that are divided by grooves having a surface as a bottom surface to form a predetermined pattern. The polishing layer block is made of a material of the polishing layer that constitutes the polishing layer block. A polishing tool comprising two or more different types of different polishing layer blocks.

  Since two or more different polishing layer blocks of different materials are formed as a pattern in this way, the generation of scratches can be suppressed by providing each of the polishing layer blocks of a material that can be removed according to the nature of the deposit. Thus, it is possible to provide a polishing tool capable of efficiently removing deposits.

  As a material for forming two or more different polishing layer blocks, it is strongly attached to the surface of hard synthetic resin for the purpose of removing deposits such as glass cullet and protrusions, resin, oily dust, film, etc. Foam resin, fiber, rubber, etc. can be used as an elastic material for the purpose of removing the deposits.

  Further, the polishing layer block has a convex shape whose surface has a predetermined shape, and the surface can be made into a polygon such as a circle, an ellipse, a rhombus, and a quadrangle.

  Furthermore, the present invention provides a polishing tool having a sheet-like base material and a polishing layer formed on the surface of the base material, wherein the polishing layer has the surface of the base material as a bottom surface. The first polishing layer block includes a plurality of convex-shaped polishing layer blocks that are divided by the groove portions to form a predetermined pattern, and the polishing layer block is made of a material of the polishing layer that constitutes the polishing layer block. A polishing tool comprising two types of polishing layer blocks, a polishing layer block and a second polishing layer block.

  Further, the first polishing layer block has a Shore D hardness value measured in accordance with JIS K6253 in the range of 65 to 90, and a tensile elongation at break measured in accordance with JIS K7311b is 200. %, The second polishing layer block is formed of a foam resin, fiber or rubber having a lower hardness than the first polishing layer block. By using the polishing layer, the first polishing layer block effectively acts to remove relatively hard deposits such as processing dust (cullet) and protrusions, and the second polishing layer block is made of resin, oily dust. In addition, it can effectively act to remove deposits of different properties that are relatively soft but firmly adhered, such as a coating.

  The ratio of the area of the first polishing layer block to the area of the second polishing block in the unit region of the pattern on the substrate is in the range of 1: 1 to 1:10. It is preferable. When the area of the first polishing layer block is larger than that of the second polishing layer block, scratches are likely to occur on the surface of the object to be polished, and the area of the second polishing block is 10 than that of the first polishing block. If it exceeds twice, relatively hard deposits such as processing dust (cullet) and protrusions cannot be effectively removed.

  The unit area of the pattern refers to a basic structural unit of a repetitive pattern formed by the first polishing layer block and the second polishing layer block including the groove portion.

  In addition, abrasive grains can be included in at least one of the first polishing layer block and the second polishing layer block. By including the abrasive grains, the deposits can be effectively removed. When neither the first polishing layer block nor the second polishing layer block contains abrasive grains, polishing and cleaning can be performed by supplying a slurry containing abrasive grains.

  Moreover, it is preferable that the cross section of the said 1st polishing layer block which becomes perpendicular | vertical to the surface of the said base material is a rectangle. If the cross section is rectangular, relatively hard deposits such as processing dust (cullet) and protrusions can be effectively removed by the edge of the polishing layer.

  Furthermore, the base material can be formed integrally with the first polishing layer block from the same material. The step of sticking the first polishing layer block to the substrate becomes unnecessary, and the first polishing layer block is effectively prevented from being peeled off.

  The polishing tool of the present invention can be a polishing tape, a polishing belt formed in an endless belt shape, or a polishing disk formed in a disk shape.

  When the polishing tape or the polishing belt is used, it is preferable to provide the recessed groove portion with an inclination with respect to the longitudinal direction. Through this inclined groove portion, the polishing waste can be easily discharged together with the slurry.

  The concave groove is preferably provided parallel to one diameter of the polishing disk or radially from the center of the polishing disk.

  Furthermore, it is preferable that a backing layer is formed on the back surface of the substrate. The backing layer can be made of cloth as a slip stopper or made of metal as strength reinforcement.

  In order to solve the above problems, the present invention further provides a polishing method using any of the polishing tools described above, wherein the polishing tool is polished on the surface to be polished of the object to be polished. The polishing method is characterized by pressing the surface and supplying water, an aqueous solution or a slurry for polishing.

  Furthermore, the present invention provides a sheet-like base material and a polishing layer formed on the surface of the base material, and the polishing layer is divided by a groove on the base material, and has a predetermined pattern. The first polishing layer block is different from the first polishing layer block in that the polishing layer block is made of a material different from that of the first polishing layer block. A manufacturing method for manufacturing a polishing tool comprising two types of polishing layer blocks and a polishing layer block, wherein the first manufacturing step for manufacturing the first polishing layer block and the second polishing layer block are manufactured. A second manufacturing step, a plurality of the first polishing layer blocks manufactured in the first manufacturing step, and a plurality of the second polishing layer blocks manufactured in the second polishing layer block manufacturing step And forming a predetermined pattern on the surface of the substrate The first manufacturing step includes mixing a resin solution and a curing agent, manufacturing a non-foamed mixed solution by stirring and degassing under reduced pressure, and the non-foamed mixed solution. And cutting the molded non-foamed resin into a predetermined shape to form the first polishing layer block, and the second manufacturing step includes a plate-like elastic member. And a step of cutting into a predetermined shape to form the second polishing layer block.

  In the method for manufacturing a polishing tool, the base material and the plurality of first polishing layer blocks can be manufactured integrally from the same material.

  Further, in order to include abrasive grains in at least one of the first polishing layer block or the second polishing layer block, abrasive grains are mixed in the non-foamed mixed liquid, or the coating solution containing abrasive grains is used as the plate-like liquid. It can apply | coat to the surface of this elastic member.

  As the elastic member, a member made of an elastic material such as foam resin, woven fabric, non-woven fabric, flocking, or rubber can be used.

  According to the present invention, materials such as glass, metal, ceramics, and single crystals, magnetic hard disk substrates, magnetic head sliders, flat panel displays (such as liquid crystal and glass panels for PDP), semiconductor substrates, and the property of adhering to the surface of vehicles, etc. It is possible to provide a polishing tool capable of suppressing the occurrence of scratches and efficiently removing deposits having different properties in polishing or cleaning for removing different deposits, a polishing method using the polishing tool, and a method for manufacturing the same. .

FIG. 1 (a) is a schematic plan view showing a first embodiment of a polishing tool according to the present invention, FIG. 1 (b) is a schematic cross-sectional view taken along the line AA of FIG. 1 (a), and FIG. ) Is a schematic cross-sectional view showing a modification of the first embodiment. FIG. 2A is a schematic plan view showing a second embodiment of the polishing tool according to the present invention, and FIG. 2B is a schematic front view thereof. FIG. 3 (a) is a schematic plan view showing a third embodiment of the polishing tool according to the present invention, FIG. 3 (b) is a schematic front view thereof, and FIG. 3 (c) is a schematic diagram of FIG. 3 (a). It is BB sectional drawing. FIG. 4A is a schematic plan view showing a fourth embodiment of the polishing tool according to the present invention, and FIG. 4B is a cross-sectional view taken along the line C-C in FIG. FIG. 5A is a schematic plan view showing a fifth embodiment of the polishing tool according to the present invention, and FIG. 5B is a cross-sectional view taken along DD in FIG. FIG. 6A is a schematic plan view showing a sixth embodiment of a polishing tool according to the present invention, FIG. 6B is an EE cross-sectional view of FIG. 6A, and FIG. These are the cross-sectional schematic diagrams which show the modification of 6th Embodiment. FIG. 7 (a) is an explanatory plan view showing a seventh embodiment according to the present invention, FIG. 7 (b) is a fragmentary plan view, and FIG. 7 (c) is a schematic front view of FIG. 7 (b). FIG. 7D is a fragmentary plan view showing a modification of the seventh embodiment. FIG. 8A is a schematic plan view of a liquid crystal panel polishing apparatus using the polishing tool according to the present invention, FIG. 8B is a cross-sectional view taken along line FF in FIG. c) is a GG cross-sectional view of FIG. FIG. 9A is a schematic plan view of a polishing belt showing a first comparative example, and FIG. 9B is a cross-sectional view taken along the line P-P in FIG. 9A. FIG. 10A is a schematic plan view of a polishing belt showing a second comparative example, and FIG. 10B is an RR cross-sectional view of FIG. FIG. 11 is a schematic plan view of another liquid crystal panel polishing apparatus using the polishing tool according to the present invention. FIG. 12 is a flowchart showing each step in the method for manufacturing a polishing tool according to the present invention.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

  The polishing tool according to the present invention has a polishing layer comprising a plurality of convex-shaped polishing layer blocks which are divided on the surface of a sheet-like base material by grooves having the base surface as the bottom surface and form a predetermined pattern. It is formed.

  The polishing layer block is composed of two or more different polishing layer blocks that are different in the material constituting the polishing layer block.

  As the two or more different polishing layer blocks having different materials, for example, a first polishing layer block formed of a relatively hard resin for the purpose of removing deposits such as glass cullet and protrusions, a resin, It is possible to provide a second polishing layer block formed of foam resin, fiber, rubber, or the like, which is an elastic material for the purpose of removing deposits strongly adhered to the surface such as oily dust or coating.

The polishing tool according to the present invention is used as, for example, a polishing belt, a polishing tape, or a polishing disk having a shape corresponding to an object to be polished. The concavo-convex pattern of the polishing layer can be changed according to the type and nature of the object to be polished and the deposit.
<First embodiment>
As shown to Fig.1 (a), 1st Embodiment of the grinding | polishing tool which concerns on this invention is used as the grinding | polishing belt 10 which is an endless belt. In addition, it is not limited to an abrasive belt, It can also be used as an abrasive tape or an abrasive sheet.

  The polishing belt 10 is a sheet-like annular polishing tool, and a first polishing layer block 11 having a predetermined width inclined on the one surface (surface) of the base material 14 by a predetermined angle with respect to the longitudinal direction, The second polishing layer blocks 12 having a predetermined width provided in parallel with the first polishing layer block 11 are alternately arranged with the groove portions 13 interposed therebetween to form an inclined striped pattern. . The inclination angle with respect to the longitudinal direction is not particularly limited, and can be appropriately selected depending on the polishing object, the polishing method, and the like.

  The width W1 of the first polishing layer 11 and the width W2 of the second polishing layer 12 shown in FIG. 1B are in the range of 1 mm to 100 mm, and the ratio of the widths (W1: W2) is 1: A range of 1-1: 10 is preferred.

  If the width W1 of the first polishing layer 11 is wider than the width W2 of the second polishing layer 12, it is effective for removing cullet and protrusions, but scratches are likely to occur on the surface of the object to be polished. . Further, if the width W2 of the second polishing layer 12 is 10 times or more than the width W1 of the first polishing layer 11, there is a remaining cullet removal, and a long time polishing is required for complete removal. As a result, the life of the polishing belt is shortened, which is not economical, and there is a problem that clogging occurs frequently.

  The width ratio (W1: W2) is the ratio between the area of the aggregate of the first polishing layer block 11 and the area of the aggregate of the second polishing layer block 12 in the unit region of the pattern on the substrate 14. However, it is determined on the basis that the range of 1: 1 to 1:10 is suitable.

  The unit region of the pattern on the base material 14 in the present embodiment is a unit constituting an inclined striped pattern, the first polishing layer block 11, the second polishing layer block 12, and between these This is a region constituted by each one of the groove portions 13 located in the region.

  The thickness (t) of the polishing layer is not particularly limited, but is preferably in the range of 0.05 mm to 1 mm. Furthermore, the width of the groove 13 between the first polishing layer block 11 and the second polishing layer block 12 is preferably 0.1 mm to 2 mm.

  When the width of the groove 13 is 0.1 mm or less, the discharge efficiency of polishing waste and waste liquid is deteriorated, and the frequency of occurrence of clogging is increased. This clogging causes a decrease in polishing and cleaning efficiency and causes deterioration in the quality of the processed surface. If the width of the groove 13 is 2 mm or more, the contact area between the surface to be polished and the polishing layer block becomes small, so that the polishing efficiency is lowered and a uniform polished surface cannot be obtained.

  The first polishing layer block 11 and the second polishing layer block 12 are manufactured separately and cut into a required shape, and the width d of the groove portion 13 is provided on the base material 14 and attached with an adhesive. May be formed.

  As a material of the substrate 14, a resin sheet, a cloth, a metal sheet, or the like can be selected depending on the application.

  In addition, when using as the grinding | polishing belt 10, as shown in FIG.1 (c), it is preferable to affix the cloth of the backing layer 15 on the other surface (back surface) of the base material sheet 14 for slipping prevention.

  Further, two types of backing layers 15 may be provided on the back surface of the base material 14. As the first backing layer, an elastic body may be provided to alleviate the impact during polishing, and a cloth may be provided as the second backing layer for preventing slipping. In order to increase the mechanical strength, a metal sheet can be used as the first backing layer, and a cloth can be used as the second backing layer. Further, the first backing layer and the second backing layer described above may be provided in reverse.

  Although the thickness of the base material sheet 14 is not specifically limited, It is desirable to exist in the range of 0.01 mm or more and 0.5 mm or less. This is because if it is less than 0.01 mm, the mechanical strength as a substrate cannot be obtained. Moreover, when using it in a tape form or a belt form, 0.05 mm or more and 0.5 mm or less are preferable from functional viewpoints, such as a softness | flexibility, in addition to mechanical strength.

  The first polishing layer block 11 is preferably formed of a relatively hard resin and has a rectangular cross section perpendicular to the base material 14. By making the cross section rectangular, the glass cullet and protrusions on the glass substrate can be easily removed at the edge portion. Furthermore, by mixing abrasive grains that are abrasive particles, the effect of removing foreign matter on the surface of the polishing layer is improved, and the hardness is increased, whereby glass cullet and protrusions can be efficiently removed.

  As the resin for forming the first polishing layer block 11, a thermosetting resin or a thermoplastic resin can be used. Examples of thermosetting resins include urethane resins, epoxy resins, phenolic resins, acrylic resins, and mixtures thereof. Examples of thermoplastic resins include polyurethane resins, polyester resins, and polyamide resins.

  The Shore D hardness of the resin material is preferably in the range of 65 to 90 in terms of a value measured in accordance with JIS standard (JIS K 6253). Further, the tensile elongation at break is a range of 200% or less, preferably 200% or less, preferably 5% or more, as measured according to JIS standard (JIS K 7311).

  If the hardness is less than 65 and the tensile elongation at break exceeds 200%, the grinding force at the edge portion becomes weak, and the glass cullet and protrusions cannot be removed sufficiently. Further, when the hardness is 90 or more, the edge portion becomes brittle, and scratches on the surface to be polished increase due to the fragments. In particular, when used as an abrasive belt, the structure integrated with the base material 14 (see FIG. 2 of the second embodiment described later) reduces the flexibility of the belt. Further, the lower the tensile elongation at break, the lower the holding power of the resin abrasive grains.

As abrasive grains which are abrasive particles, alumina (Al ₂ O ₃ ), cerium oxide (CeO ₂ ), silica (SiO ₂ ), diamond, silicon carbide (SiC), murom oxide (Cr ₂ O ₃ ), zirconia (ZrO) ₂ ) Particles having high hardness such as cubic boron nitride (cBN) (new Mohs hardness of 7 or more) are preferable for removing glass cullet and protrusions.

  The average particle size is preferably in the range of 0.1 μm to 20 μm. If it is less than 0.1 μm, the effect of adding abrasive grains cannot be obtained, and if it exceeds 20 μm, an increase in scratches is caused.

  The content of abrasive grains in the first polishing layer block 11 is sufficient in the range of 10% by weight to 70% by weight, which is less than that of a general polishing tape. The effect of addition is not seen at 10% by weight or less. On the other hand, if it exceeds 70% by weight, the number of abrasive grains appearing on the surface of the polishing layer is increased more than necessary, and polishing marks and scratches are generated. Further, when used as a polishing belt, if the content of abrasive grains exceeds 70% by weight, the polishing belt becomes inflexible and polishing by uniform contact with the surface of the workpiece becomes impossible.

  The second polishing layer block 12 is an elastic member such as foam resin, cloth (woven fabric (pile), non-woven fabric, flocking) which is a relatively soft foam member, and processes these commercially available products into a predetermined shape. Can be used. The surface of an elastic member such as a foam resin is impregnated with abrasive grains mixed with a binder, or the abrasive grains are attached to the surface of the fiber.

As abrasive grains, alumina (Al ₂ O ₃ ), cerium oxide (CeO ₂ ), silica (SiO ₂ ), diamond, silicon carbide (SiC), chromium oxide (Cr ₂ O ₃ ), zirconia (ZrO ₂ ), cubic In addition to crystalline boron nitride (cBN), aluminum hydroxide (Al (OH) ₃ ), calcium carbonate (CaCO ₃ ), magnesium carbonate (MgCO ₃ ), porous alumina, silica, etc. have relatively low hardness, Alternatively, an abrasive that is reactive with an object to be polished is preferable.

  The average grain size of the abrasive grains is preferably in the range of 0.1 μm to 30 μm. When the thickness is 0.1 μm or less, the polishing power is low and polishing for a long time is required, but there are cases where deposits that cannot be removed still remain. When the average grain size of the abrasive grains exceeds 30 μm, scratches generated on the polished surface increase.

  The second polishing layer block 12 is intended to remove resin and thin film residues firmly attached to the surface of the glass substrate without causing polishing scratches on the glass substrate.

  Here, the groove portion 13 provided between the first polishing layer block 11 and the second polishing layer block 12 easily discharges polishing debris therefrom, so that clogging is prevented and high polishing power is achieved. Can be maintained for a long time.

  As described above, the first polishing layer block 11 has a polishing layer that can remove the glass cullet and protrusions on the surface of an object to be polished such as a glass substrate at the edge portion of the polishing layer, and the second polishing layer block 12 Since it has a polishing layer that can gradually remove the resin, oily material and film from the surface of the object to be polished, the polishing belt 10 in which both polishing layers are alternately arranged simultaneously exhibits the effect of removing deposits by each polishing layer. Can act as possible.

  It is preferable that the area of the second polishing layer block 12 is equal to or greater than the area of the first polishing layer block 11 in the unit region of the uneven pattern formed on the surface of the polishing belt 10. Since the glass cullet and protrusions can be removed in a relatively short time on the surface of the object to be polished, they can be removed at the initial stage of polishing, but the resin, oily dust, and coating are removed from the surface for a relatively long time. Therefore, the area of the second polishing layer block 12 is made larger than the area of the first polishing layer block 11, the ratio is adjusted, and various deposits are efficiently produced in a short time while suppressing the occurrence of scratches. Can be removed.

As a polishing apparatus to which the polishing belt of this embodiment is attached and used, for example, polishing apparatuses described in JP-A-2005-81297 and JP-A-2005-334684 can be used.
Second Embodiment
As shown in FIG. 2A and FIG. 2B, the second embodiment of the polishing tool according to the present invention is used as the polishing belt 10 which is an endless belt, as in the first embodiment. . The present invention is not limited to an abrasive belt, and can also be used as an abrasive tape or an abrasive sheet.

  The difference from the first embodiment is that the polishing belt 10 in this embodiment is formed by integrally forming the base material 14 and the first polishing layer block 11 with the same material, and the first polishing layer block 11. The pattern on the polishing belt 10 formed with the second polishing layer block 12 is repeatedly formed as a rectangular pattern, and further, grooves are added in the vertical and horizontal directions to thereby form the first polishing layer block 11. Is a point that is subdivided into a plurality of convex blocks (as shown in FIG. 2A), the first polishing layer block 11 is subdivided into 10 convex blocks. ).

  By integrally forming the base material 14 and the first polishing layer block 11 with the same material, the step of attaching the first polishing layer block 11 to the base material 14 can be omitted. Bonding with the polishing layer block 11 becomes strong, and peeling during polishing is prevented. Further, dividing the first polishing layer into a plurality of rectangular convex portions can form a large number of edges, thereby increasing the point of action for removing deposits and contributing to speeding up the polishing process.

  As shown in FIG. 2A, the first polishing layer 11 shown in the present embodiment has a structure in which a plurality of rectangular protrusions are arranged. The shape of the plurality of protrusions is a trapezoid, A cylindrical shape, a rhombus, etc. may be sufficient.

Also, one or two types of backing layers can be provided on the back of the substrate 14. When two types of backing layers are provided, for example, in the case of an abrasive belt, the first backing layer is made of an elastic material for reducing the impact during polishing, and the second backing layer is used as an anti-slip material. A cloth may be used as the layer. Further, in order to increase the mechanical strength, a metal can be used as the first backing layer and a cloth can be used as the second backing layer. In some cases, the first backing layer and the second backing layer may be reversed.
<Third Embodiment>
As shown in FIG. 3A, FIG. 3B, and FIG. 3C, the third embodiment of the polishing tool according to the present invention is an endless belt as the polishing belt 10, as in the first embodiment. It is what is used. In addition, it can be used as an abrasive tape or an abrasive sheet as in other embodiments.

  The difference from the first embodiment is that the polishing belt 10 in the present embodiment is formed by integrally forming the base material 14 and the first polishing layer block 11 with the same material, and the two first embodiments. The polishing belt 10a (first polishing layer block 11a, second polishing layer block, groove 13a) and 10b (first polishing layer block 11b, second polishing layer block 12b, groove 13b) are arranged with the longitudinal direction as an axis. The side surfaces are bonded to each other so as to be symmetrical with each other and bonded to the backing layer 15.

As shown in FIG. 3 (a), the polishing belt 10 of the present embodiment is formed by repeatedly forming a V-shaped pattern on the surface. With such a shape, the polishing belt is moved in the direction of the arrow P. In the case of running, the polishing debris can be discharged to the groove portions 13a and 13b on both sides, and the clogging of the polishing belt during processing is further reduced and the processing efficiency is improved.
<Fourth embodiment>
As shown in FIGS. 4A and 4B, the fourth embodiment of the polishing tool according to the present invention is used as a disc-shaped polishing disk.

  The polishing disk 20 is a disk-shaped sheet-like base material 24 and first polishing layers provided on the base material 24 alternately and in parallel with grooves 13 having a certain width. The block 11 and the second polishing layer block 12 are formed.

  The polishing disk 20 is used by being attached to a rotating tool or a rotating surface plate of a disk polishing machine, and an attachment hole 26 is formed in the center of the polishing disk 20 when necessary for attachment.

  The material of the disk-shaped sheet-like base material 24 is variously selected depending on the purpose of polishing and the configuration of the polishing machine, such as flexible resin, rubber, metal and the like.

  As for the fixing method to the disk polishing machine, there are cases where fixing is performed with a double-sided adhesive sheet with an adhesive, and cases where the substrate is magnetized using a magnetized metal. Determine the material of the material or backing layer.

  When the base material 24 is formed of a flexible resin, it can be formed of a thermosetting resin, a thermoplastic resin, or a radiation curable resin.

  A urethane resin, an epoxy resin, a phenol resin, an acrylic resin, or a mixture thereof can be used as the thermosetting resin, and a polyester resin or a polyamide resin can be used as the thermoplastic resin. As the radiation curable resin, acrylic-modified epoxy, unsaturated polyester, polyurethane and the like can be used. The acrylic-modified epoxy is synthesized by a reaction between an epoxy resin and acrylic acid, and the acrylic-modified unsaturated polyester is synthesized by condensation polymerization of a polyol, acrylic acid, and a polybasic acid. As the elastic resin, a foam or rubber can be used.

  As the magnetized metal, iron or nickel alloys can be used. For example, SC material and stainless steel can be used as the steel material. In general, the magnetic properties and mechanical properties of steel materials are determined by the added alloying elements.

  Stainless steel is suitable as a material with excellent corrosion resistance during polishing. Stainless steel is a generic name for alloys containing at least 10.5% chromium or chromium and nickel (SUS: “Steel Use Stainless”) for the purpose of improving corrosion resistance, and is austenitic and martensitic. Ferritic stainless steels are martensitic (SUS430, 410, 440) and ferrite (SUS444). However, even austenite-based materials have magnetism depending on heat treatment and processing conditions (SUS301, 302).

  The first polishing layer block 21 can be formed of the resin mentioned as the material of the base material 24 described above. The second polishing layer block 22 can be formed of an elastic material such as foam resin, fiber, or rubber mentioned in the first embodiment.

  In the case of surface plate polishing, loose abrasive grains are used, so that the first polishing layer block 21 and the second polishing layer block 24 do not need to contain any abrasive grains. When the abrasive grains are contained in the first polishing layer block 21, polishing can be performed only with water, an aqueous solution or a lubricating liquid instead of the slurry containing the abrasive grains.

As a polishing apparatus to which the polishing disk of this embodiment is mounted and used, for example, a polishing apparatus disclosed in Japanese Patent Application Laid-Open No. 2006-130437 can be used.
<Fifth Embodiment>
As shown in FIGS. 5 (a) and 5 (b), the fifth embodiment of the polishing tool according to the present invention is used as a disc-shaped polishing disk, as in the fourth embodiment.

  As shown in FIG. 1 in the first embodiment, the polishing disk 20 of the present embodiment is a stripe in which the first polishing layer block, the second polishing layer block, and the groove portion 21 are inclined at a predetermined angle with respect to the longitudinal direction. As shown in FIG. 5B, the first polishing layer block 21c and the second polishing layer are provided in parallel with the polishing layer portions 20a, 20b, 20c, and 20d. Layer blocks 22c are alternately formed with grooves 23c therebetween. As shown in FIG. 5A, the polishing disk 20 as a whole is bonded to the surface of a disk-shaped base material 24 with an adhesive so as to form a crank-shaped pattern.

According to the present embodiment, during the rotation of the polishing disk 20, polishing debris is easily discharged through the grooves 23a, 23b, 23c, and 23d forming the crank shape, so that clogging is prevented and high polishing power is achieved. Can be maintained for a long time.
<Sixth Embodiment>
As shown in FIGS. 6 (a), 6 (b) and 6 (c), the sixth embodiment of the polishing tool according to the present invention is used as a disc-shaped polishing disk, as in the fourth embodiment. It is what is done.

  The difference from the fourth embodiment is that, in the polishing disk 20 of the present embodiment, the fan-shaped first polishing layer block 21, the second polishing layer block 22, and the groove portion 23 provided therebetween are provided. These are points formed radially on the surface of the base material 24 from the mounting holes 26 provided in the center.

  According to the present embodiment, during the rotation of the polishing disk 20, the polishing debris is easily discharged through the plurality of fan-shaped groove portions 23 that are radially arranged at the end, so that clogging is prevented and high polishing is achieved. The power can be maintained for a long time.

  Note that the mounting hole 26 provided in the central portion of the polishing disk 20 can be omitted when the structure of the polishing apparatus is not necessary.

As shown in FIG. 6C, a backing layer 25 may be provided on the back surface of the base material 24 in order to reduce the impact during polishing or to increase the mechanical strength.
<Seventh embodiment>
As shown in FIGS. 7A, 7B, 7C, and 7D, the seventh embodiment of the polishing tool according to the present invention is a disc as in the fourth embodiment. It is used as a shaped abrasive disc.

  The difference from the fourth embodiment is that the polishing disk 20 itself of this embodiment is divided into eight fan-shaped polishing disk pieces 20a to 20h arranged radially.

  As shown in FIGS. 7 (b) and 7 (c), one polishing disc piece 20a has a first polishing layer block 21, a second polishing layer block 22, and a groove on the surface of a fan-shaped substrate 24a. 23 a are alternately formed so as to be orthogonal to the radial direction of the polishing disk 20. FIG. 7B shows the polishing disk piece 20a, but the other polishing disk pieces 24b to 24h have the same configuration.

  As shown in FIG. 7 (a), these fan-shaped polishing disc pieces 20a to 20h are pasted on the disc-shaped backing layer 25 with a predetermined gap (becomes a radial groove 23). Thus, the polishing disk 20 is formed.

  A modification of the abrasive disc piece is shown in FIG. As shown in FIG. 7D, the polishing disc piece 200a includes a first polishing layer block 21, a second polishing layer block 22, and a groove 23a that are a predetermined angle with respect to the radial direction of the polishing disc 20. Inclined. The other polishing disc pieces 20b to 20h have the same configuration.

The shape of the abrasive disc piece can be selected according to requirements such as the type of object to be polished and the type of deposit.
<Manufacturing method of polishing tool>
Next, an embodiment of a method for manufacturing a polishing tool will be described with reference to FIG. 12 which is a flowchart showing each step of the method for manufacturing a polishing tool according to the present invention.

  As shown in FIG. 12, the first polishing layer block is manufactured by mixing a resin solution and abrasive grains, further stirring and vacuum degassing to obtain an abrasive dispersion, adding a curing agent, stirring and vacuuming Defoaming is performed to produce a non-foamed mixed liquid (S11).

  The resin solution used is made of one or more resins selected from polyurethane, polystyrene, polyethylene, polyvinyl chloride, and acrylic resins. For example, abrasive grains are added to a hexamethylene diisocyanate (HDI) prepolymer, and a polyether polyol that has been separately depressurized and degassed is added to the stirred and depressurized abrasive dispersion. A foam-free liquid mixture can be produced.

  The non-foamed mixed solution thus obtained is formed into a sheet shape, a plate shape, or a roll tape shape by a press molding method, an extrusion molding method, an injection molding method, or the like (S12).

  Moreover, a non-foamed liquid mixture can be hardened | cured using a long shaping | molding die, and it can take out from a shaping | molding die as a predetermined sheet-like thing.

  The molded sheet is preferably in the range of 0.2 mm or more and 1 mm or less. The reason for this range is to make the dispersion of the abrasive grains in the thickness direction after forming uniform. Both sides of this sheet are ground and finished so as to have a thickness of 0.1 mm to 0.5 mm, and a large number of blocks are cut by cutting into a shape suitable for each embodiment such as a rectangle, a parallelogram, or a fan shape. Manufacture (S13). These blocks are affixed to a sheet-like substrate as a first polishing layer block (S17).

  Next, the manufacturing process of the second polishing layer block will be described.

  First, a coating solution in which abrasive grains are dispersed in a water-soluble urethane resin is prepared (S14).

  This resin coating solution containing abrasive grains is applied to the surface of the foamed polyurethane to form a layer containing abrasive grains (S15). When using woven fabric, non-woven fabric, flocking or the like instead of polyurethane foam, the coating liquid is impregnated from the surface toward the inside, and the abrasive grains are fixed.

  As the foamed polyurethane, woven fabric, nonwoven fabric, flocking, rubber, etc., commercially available products having a predetermined shape can be used.

  The foamed polyurethane coated with the coating solution is cut and ground by a mechanical device and a grinding tool to produce a large number of blocks having a predetermined shape (S16).

  A number of blocks manufactured in a predetermined shape according to each embodiment such as a rectangular shape, a parallelogram shape, a sector shape, etc. are formed on the surface of the sheet-like substrate together with the first polishing layer block. It is stuck with an adhesive as a block. The base material to which the first and second polishing layer blocks are adhered is further processed into a predetermined polishing tool (a polishing belt, a polishing tape, a polishing disk, etc.) (see FIGS. 1, 4, 5, and 6). (S18).

  In the manufacturing method of the polishing tool of this embodiment described above, both the first polishing block layer and the second polishing layer block are manufactured including abrasive grains, but depending on the type of the object to be polished and the deposits, etc. Abrasive grains may be included in only one of the first polishing block layer and the second polishing layer block, or none may be included in any of them.

  Furthermore, a backing layer made of cloth, metal, or the like can be attached to the back surface of the base material of the predetermined polishing tool (abrasive belt, polishing tape, polishing disk, etc.).

  Further, as shown in FIGS. 2 and 3, the first polishing layer block and the sheet-like base material may be integrally formed. When the first abrasive layer block and the sheet-like base material are integrally molded, a thick sheet molded by a molding die or the like is cut into a predetermined shape, and further, the first abrasive layer block and the sheet are ground by a grinding process. It is formed into an integral body with a substrate.

  And many blocks manufactured by the manufacturing process of the above-mentioned 2nd grinding | polishing layer block are stuck on the surface of the base material shape | molded integrally with the 1st grinding | polishing layer block as a 2nd grinding | polishing layer block. Further, it is further processed into a predetermined polishing tool (a polishing belt, a polishing tape, a polishing disk, etc.), and a backing layer is attached to the back surface of the substrate as necessary.

  Further, in the manufacturing method of the polishing disk 20 shown in FIG. 7 which is the seventh embodiment, first, a number of blocks manufactured in the manufacturing process of the first and second polishing layer blocks shown in FIG. As the polishing layer block 21 and the second polishing layer block 22, the polishing disc pieces 20 a to 20 h are manufactured by sticking to the surfaces of the fan-shaped base materials 24 a to 24 h (FIG. 7 b) and FIG. 7 (c). The sector-shaped polishing disc piece 20a shown in FIG.

  The sector-shaped polishing disc pieces 20a to 20h are respectively attached to the surface of the disc-shaped backing layer 25 with a gap serving as the groove 23, thereby forming the polishing disc of the seventh embodiment. The material of the disc-shaped backing layer 25 is selected according to the use such as metal or cloth.

Next, material tests, examples, and comparative examples of the polishing tool and the manufacturing method thereof according to the present invention will be described below.
<Selection test of resin used for first polishing layer block>
The selection test of the resin used for the first polishing layer block and the test results are shown below.

  The resin to be tested was selected from urethane resin. The average particle diameter of 3 μm of alumina was used as the abrasive grains, and the filling amount was 50% by weight of the total including the resin.

  As shown in FIG. 9, a polishing belt having a pattern inclined with respect to the longitudinal direction similar to that of the first embodiment was produced using only the resin forming the first polishing layer block. Table 1 shows the names and mechanical properties of the resins used.

  The resin used was a urethane resin manufactured by Mitsui Chemicals. Resins 1 to 4 have a Shore hardness D in the range of 65 to 90 and a tensile elongation at break of 200% or less. On the other hand, Resins 5 to 7 have a Shore hardness D value of less than 65 and a tensile elongation at break exceeding 200%.

After heating 100 parts by weight of various urethane powders shown in Table 1 to 80 ° C. and adding 200 parts by weight of sufficiently dried alumina (Al ₂ O ₃ ) having an average particle diameter of 3 μm, the mixture was sufficiently stirred and then depressurized. The mixture was degassed to produce a mixture. To this was added 30 parts by weight of a curing agent (manufactured by DuPont, trade name: MOCA) heated to 110 ° C., and the mixture was stirred using a stirrer in a short time and decompressed to sufficiently degas.

  Next, this mixed solution is filled in a mold and held at 120 ° C. for 10 minutes to form a plate-like (thickness: 1 mm) non-foamed body, which is taken out from the mold and is kept at a constant temperature bath at 100 ° C. For 12 hours and then cooled naturally.

  The plate-like non-foamed polyurethane is cut to a width of 100 mm, ground to a predetermined thickness, and further polished to an average surface roughness (Ra) of 1 μm using a known surface correction tool. Finishing to 8 mm, seven types of sheets shown in Table 1 were produced.

  Next, in order to obtain the shape shown in FIGS. 9A and 9B (the narrow polishing layer 111 and the wide polishing layer 112 are alternately formed with the groove in between), the groove processing is performed. Then, the end portions were joined in a ring shape to produce a polishing belt having a width of 40 mm and a length of 1.2 m. The width (W111) of the narrow polishing layer 111 was 5 mm, the width (W112) of the wide polishing layer 112 was 15 mm, the width of each space (groove) was 1 mm, and the depth was 0.4 mm.

* The resin name is the product number of Mitsui Chemicals, Inc.
(Evaluation criteria in Table 1)
(Foreign matter removal) ○: No polishing residue, △: Small amount of polishing residue, ×: Polishing residue (scratch) ○: None, △: Small amount, ×: <Polishing test method>
Next, the result of the polishing test of the liquid crystal panel, which was performed using the polishing belt manufactured from the above resins 1 to 7, will be described.

  As a liquid crystal panel polishing (including cleaning) apparatus using a polishing belt, for example, an apparatus disclosed in JP-A-2005-81297 can be used.

  An outline of the liquid crystal panel polishing apparatus is shown in FIG.

  FIG. 8A is a plan view schematically showing a liquid crystal panel polishing apparatus 30 using a polishing belt, FIG. 8B is a cross-sectional view taken along line FF in FIG. 8A, and FIG. It is GG sectional drawing of Fig.8 (a).

  The liquid crystal panel polishing apparatus 30 transports the liquid crystal panel 31 with a plurality of upper and lower transport rollers, and molds and processes the resin 1 to resin 7 in Table 1 to produce two polishing belts (polishing belts 101 and 102), respectively. Both sides are polished simultaneously.

  The liquid crystal panel 31 is fed in a predetermined direction by the lower conveyance roller 32a and the upper conveyance roller 33a on the carry-in side, and the polishing belts (the upper polishing belt 101 and the lower polishing belt 102) are moved upward in a direction perpendicular to the traveling direction of the liquid crystal panel surface. Both surfaces are polished by sliding on the lower surface, and the liquid crystal panel 31 is sandwiched between the lower roller 32b and the upper discharge roller 33b on the carry-out side.

  The upper polishing belt 101 and the lower polishing belt 102 are tensioned by rotary pulleys 37 and 38, respectively, and slide on the upper and lower surfaces (both sides) of the liquid crystal panel 31 by drive pulleys 35 and 36 connected to a motor. Remove foreign material.

  The pressure at which the polishing belt contacts the liquid crystal panel is such that air is blown from above and below the polishing belts 101 and 102 by the air blower 40 shown in FIGS. The pressing pressure with respect to 31 is adjusted.

Further, in this liquid crystal panel polishing apparatus 30, pure water is sprayed onto the upper and lower surfaces of the liquid crystal panel sent by the transport rollers by the shower 39, and the sent liquid crystal panel is moistened to advance the polishing belts 101, 102. In order to remove foreign matters, the wet polishing is continuously performed.
<Polishing conditions>
1) Liquid crystal panel used: 37 inches 2) Polishing belt speed: 600 rpm
3) Abrasive belt pressing pressure: 0.3 MPa
4) Liquid crystal panel feed rate: 20 m / min 5) Spray liquid: pure water shower, 10 L / min After cleaning, a deflection plate was attached and a visual inspection was performed to observe the presence or absence of foreign matter and scratches.
<Polishing result>
The state of removing foreign substances and the occurrence of scratches on the liquid crystal panel polished by the polishing apparatus were observed. In resin 1 to resin 4, cullet and resin were sufficiently removed. Scratches were found to occur in small quantities.

  On the other hand, in the resins 5 to 7, almost no scratches were observed, but cullet and resin polishing residue were observed.

  According to Test 1 which is a selection test of the resin used for the first polishing layer block, a result that the effect of removing the foreign matter is deteriorated when the Shore D hardness of the resin is lower than 65 and larger than the tensile elongation at break 200 is obtained. It was.

From the above results, although some scratches are observed, it is preferable for the removal of glass cullet and resin that the Shore D hardness is in the range of 65 to 90 and the tensile elongation at break is in the range of 200% or less.
<Test 1>
As test 1, a polishing test of the polishing belt of the example of the polishing tool according to the present invention and the polishing belt of the comparative example was performed using a liquid crystal panel polishing apparatus shown in FIG.

  As Example 1 of the polishing tool according to the present invention, the polishing belt of the first embodiment shown in FIG. 1 was manufactured.

Urethane resin was used for manufacturing the first polishing layer block. 200 parts by weight of sufficiently dried alumina (Al ₂ O ₃ ) having an average particle diameter of 3 μm was added to 100 parts by weight of urethane polymer (Hyprene L-315, manufactured by Mitsui Chemicals), which was heated at 80 ° C. After sufficiently stirring, the mixture was degassed under reduced pressure to produce a mixed solution.

  After adding 30 parts by weight of a curing agent (manufactured by DuPont, trade name: MOCA) heated to 110 ° C. to this mixed solution, the mixture was stirred for a short time using a stirrer, depressurized and sufficiently defoamed, The mixed solution was filled in a mold and held at 120 ° C. for 10 minutes to form a plate-like (thickness: 1 mm) non-foamed body, which was taken out from the mold.

  This plate-like non-foamed polyurethane was held in a thermostatic bath at 100 ° C. for 12 hours and then naturally cooled.

  Further, the plate-like non-foamed polyurethane is cut to a width of 100 mm, ground to a predetermined thickness, polished to an average surface roughness (Ra) of 1 μm using a known surface correction tool, and a thickness of 0 A plate of .8 mm was finished, cut into a predetermined shape, and used as a first polishing layer block.

  As the second polishing layer block, a foamed polyurethane base (BT4101 manufactured by Fuji Spinning Co., Ltd., PET 24 μm) on which a PET film having a layer thickness of about 400 μm was laminated was used.

  460 parts by weight of water-soluble urethane resin (manufactured by DIC, HW-333) and alumina having an average particle diameter of 16 μm as abrasive grains (manufactured by Fujimi, WA1000) are mixed and stirred at a ratio of 500 parts by weight, and a coating solution containing abrasive grains Manufactured.

  This abrasive-coated coating solution was applied to the surface of the urethane foam base with a roll coater so as not to be embedded in the foamed portion (hole) of the urethane base. After that, the coater is dried at a maximum temperature of 120 ° C., left to stand for 24 hours after coating, and then subjected to after-curing at 40 ° C. for 72 hours or more, which is cut into a predetermined shape and used as the second polishing layer block. did.

  As shown in FIG. 1A and FIG. 1B, the first polishing layer block and the second polishing layer block described above are formed on the surface of the base material 14 at 40 degrees with respect to the longitudinal direction. They were attached with an adhesive so as to be parallel to each other at an inclination angle.

  An acrylic resin was used as the adhesive. As an acrylic resin adhesive, a product obtained by mixing Nissei PE121 manufactured by Nippon Carbide Industries Co., Ltd. and a curing agent Coronate L55 (two-component adhesive) at a ratio of 100: 1.5 parts by weight is used. Was applied in a range of 10 μm ± 3 μm. After coating, the respective polishing layer blocks were bonded together and cured at 40 ° C. for 72 hours or longer in a thermostatic bath.

  The first polishing layer block is cut into a width (W1) of 3 mm and a thickness (t) of 0.8 mm shown in FIG. 1B, and the second polishing layer block has a width (W2) of 9 mm and a thickness. (T) Cutting to 0.9 mm. These were stuck on the surface of the base material alternately with a width (d) of 1 mm between the grooves.

The width ratio of the first polishing layer block and the second polishing layer block was 1: 3. Here, the reason why the thickness of the second polishing layer block is 0.1 mm thicker than the thickness of the first polishing layer block is that the second polishing layer block is softer than the first polishing layer block. This takes into account the amount of elasticity that sinks when a load is applied to the polishing layer block. The ratio between the first and second polishing layer blocks shown in the following examples and comparative examples is a ratio where the width of 3 mm of the first polishing layer block is 1.
<Example 2>
In Example 2, the ratio of the width (W1: W2) between the first polishing layer block and the second polishing layer block was 1: 5. The other configuration is the same as that of the first embodiment.
<Example 3>
In Example 2, the width ratio of the first polishing layer block to the second polishing layer block was 1: 8. The other configuration is the same as that of the first embodiment.
<Comparative Example 1>
As the polishing belt of Comparative Example 1, the material of the first polishing layer block 11 manufactured in Example 1 was used, and a polishing belt made of the same material having the shape shown in FIG. 9 was used. .

The polishing belt 101 shown in FIG. 9 is formed by alternately forming narrow polishing layers 111 and wide polishing layers 112 made of the same material (the material from which the first polishing layer block is manufactured), with the groove portions 13 therebetween. It is a thing.
<Comparative Example 2>
As the polishing belt of Comparative Example 2, the same material as the second polishing layer block 12 manufactured in Example 1 was used. As shown in FIG. A polishing belt having the same dimensions was prepared and used.

The polishing belt 102 shown in FIG. 10 has narrow polishing layers 121 and wide polishing layers 122 made of the same material (the material from which the second polishing layer block is manufactured) alternately with the groove portions 13 therebetween. To form)
<Comparative Example 3>
In Comparative Example 3, the width ratio (W1: W2) of the first polishing layer block and the second polishing layer block was 3: 1. The other configuration is the same as that of the first embodiment.
<Comparative example 4>
In Comparative Example 4, the width ratio (W1: W2) of the first polishing layer block and the second polishing layer block was 5: 1. The other configuration is the same as that of the first embodiment.
<Comparison result 1>
Table 1 below shows the comparison result 1 of the polishing test according to Examples 1 to 3 and Comparative Examples 1 to 4.

  As shown in Table 2 above, the polishing effect of the polishing belts of Examples 1 to 3 according to the present invention is higher than that of Comparative Examples 1 to 4, and the occurrence of scratches and foreign matter after polishing for a certain period of time. The removal has become remarkable.

  In particular, as compared with the polishing belts of Comparative Examples 1 and 2 made of a single material, the polishing effect of the polishing belt according to the present invention (no scratches and foreign matter remaining) is remarkable.

Furthermore, compared with Comparative Example 3 and Comparative Example 4, the removal effect of the adhered foreign matter is excellent by increasing the width, that is, the area of the second polishing layer block, relative to the width of the first polishing layer block. It was confirmed.
<Test 2>
As Test 2, a comparative test in cleaning of a small liquid crystal panel was performed using a polishing disk which is a polishing tool according to the present invention.

  As a cleaning device, a small liquid crystal panel cleaning device (NMMF-6D) (manufactured by Nippon Micro Coating Co., Ltd.) was used.

  FIG. 11 shows a schematic plan view of the small liquid crystal cleaning device. This apparatus cleans both sides of the panel (that is, the A side and the B side behind the A side), and is suitable for cleaning a panel having a size of 10 mm × 10 mm to 50 mm × 50 mm.

  A panel cleaning apparatus 50 shown in FIG. 11 mainly includes a panel transport unit for transporting the panel P, a panel cleaning unit for cleaning the A and B surfaces of the panel P, and the A and B surfaces of the panel P. It comprises a panel cleaning / drying means for cleaning and drying.

  The panel transport means rotates while holding the panel P, and the first panel rotary transport body 51, the second panel rotary transport body 52, the third panel rotary transport body 53, and the second panel transport the panel P. The panel transfer means 54 for transferring the panel P between the first panel rotary transport body 51 and the second panel rotary transport body 52, and the second panel rotary transport body 52 and the third panel rotary transport body 53. It is comprised from the 2nd panel transfer means 55 which transfers the panel P between.

  The first panel rotation conveyance body 51 is a mechanism that rotates about the first rotation axis X1 (clockwise direction). And in order to hold | maintain panel P, the 1st panel rotation conveyance body 51 has the 1st holding means 56 which adsorb | sucks the B surface of panel P and hold | maintains panel P on the outer peripheral surface. . Four first panel holding plates 59 are arranged at intervals of 90 ° on the outer periphery of the first panel rotary transport body 51.

  The second panel rotation transport body 52 is a mechanism that rotates about a second rotation axis X2 that is parallel to the first rotation axis X1 (clockwise direction). And in order to hold | maintain panel P, the 2nd panel rotation conveyance body 52 has the 2nd holding means 57 which adsorb | sucks the A surface of panel P and hold | maintains panel P on the outer peripheral surface. . Four second panel holding plates 60 are arranged on the outer periphery of the second panel rotation conveyance body 52 at intervals of 90 °.

  The third panel rotation conveyance body 53 is a mechanism that rotates about a third rotation axis X3 that is parallel to the first rotation axis X1 (clockwise direction). And in order to hold | maintain the panel P, the 3rd panel rotation conveyance body 53 has the panel clamping means 58 which hold | maintains the panel P on the outer peripheral surface on both sides of the panel P which opposes.

  The third panel rotation conveyance body 53 has four arm portions 61 in a direction radiating at an interval of 90 degrees from the third rotation axis X3, and holds the panel P at the tip of the arm portion 61. Each holding mechanism 62 is provided.

  The panel cleaning means includes a first cleaning means 63 for cleaning the A surface of the panel P held by the first holding means 56 and a B surface of the panel P held by the second holding means 57. The second cleaning means 64 is used for cleaning.

  In the first cleaning means 63, a polishing head 67 is arranged toward the A surface of the panel held on the first panel holding plate. The polishing disk 65 is affixed to the surface of the disk holding plate 66 of the polishing head 67 and is polished by pressing the polishing disk 65 against the A surface of the panel P while being rotated by the motor 45.

  In the second cleaning means 64 having the same mechanism, the B surface of the inverted panel P is polished by the polishing disk 68. In this way, the foreign matter adhering to both surfaces (A surface and B surface) of the panel P can be removed while sequentially feeding the panel P.

  In the polishing test, a small liquid crystal panel having a panel size of 50 mm × 50 mm and a thickness of 1 mm was used.

  As the polishing tool of Example 4, the polishing disk of FIG. 4 showing the fourth embodiment was used. The width of the first polishing layer block was 5 mm, and the width of the second polishing layer block was 25 mm (configuration ratio 1: 5). However, the central hole 26 is not provided.

  As Comparative Example 5, a polishing disk having a polishing layer having the same shape as that of Example 4 and formed only of the resin used in Comparative Example 1 was used. Further, as Comparative Example 6, a polishing disk having the same shape as that of Example 4 as a polishing layer and formed only from nylon taffeta with abrasive grains used in Comparative Example 2 was used.

  Polishing was performed under the following conditions.

1) Number of rotations of polishing disk: 200 rpm
2) Pressing pressure: 400g
3) Polishing liquid: pure water, 5L / min
4) Polishing time (single side): 4 seconds <Comparison result 2>
In the polishing disk of Example 4, foreign matters could be completely removed without causing scratches. On the other hand, the scratches on the polishing disk of Comparative Example 5 were observed. Further, in the polishing disk of Comparative Example 6, no scratches were generated, but glass cullet and resin residue were observed.

DESCRIPTION OF SYMBOLS 10 Polishing belt 11 1st polishing layer block 12 2nd polishing layer block 13 Groove part 14 Base material 15 Backing layer 20 Polishing disk

Claims (16)

A polishing tool having a sheet-like substrate and a polishing layer formed on the surface of the substrate,
The polishing layer is divided by a groove having the surface of the substrate as the bottom, and has a plurality of convex-shaped polishing layer blocks forming a predetermined pattern,
The polishing tool is characterized in that the polishing layer block comprises two or more different polishing layer blocks in which the material of the polishing layer constituting the polishing layer block is different. A polishing tool having a sheet-like substrate and a polishing layer formed on the surface of the substrate,
The polishing layer is divided by a groove having the surface of the substrate as the bottom, and has a plurality of convex-shaped polishing layer blocks forming a predetermined pattern,
The polishing layer block is composed of two types of polishing layer blocks, a first polishing layer block and a second polishing layer block, which are different in the material of the polishing layer constituting the polishing layer block. Polishing tool. The first polishing layer block has a Shore D hardness value measured in accordance with JIS K6253 in the range of 65 to 90, and a tensile elongation at break measured in accordance with JIS K7311b is 200% or less. Is a polishing layer formed of a resin material in the range of
The polishing tool according to claim 2, wherein the second polishing layer block is a polishing layer formed of a foam resin, fiber, or rubber having a lower hardness than the first polishing layer block. .   The ratio of the area of the first polishing layer block and the area of the second polishing block in the unit region of the pattern on the substrate is in the range of 1: 1 to 1:10. The polishing tool according to claim 2 or 3, characterized in that   The polishing tool according to any one of claims 2 to 4, wherein at least one of the first polishing layer block and the second polishing layer block contains abrasive grains.   The polishing tool according to any one of claims 2 to 5, wherein a cross section of the first polishing layer block perpendicular to the surface of the substrate is rectangular.   The polishing tool according to claim 3, wherein the base material is formed integrally with the first polishing layer block by using the same material.   The polishing tool according to any one of claims 1 to 7, wherein the polishing tool is a polishing tape or a polishing belt formed in an endless belt shape.   The polishing tool according to claim 1, wherein the polishing tool is a polishing disk formed in a disk shape.   The polishing tool according to claim 8, wherein the recess-shaped groove is provided so as to be inclined with respect to a longitudinal direction of the polishing tape or the polishing belt.   10. The polishing tool according to claim 9, wherein the concave groove is provided in parallel to one diameter of the polishing disk or radially from the center of the polishing disk.   The polishing tool according to any one of claims 8 to 11, wherein a backing layer is formed on the back surface of the base material. A polishing method using the polishing tool according to any one of claims 1 to 12,
A polishing method, wherein the polishing surface of the polishing tool is pressed against the surface to be polished of an object to be polished, and water, an aqueous solution or a slurry is supplied for polishing. A sheet-like base material, and a polishing layer formed on the surface of the base material, the polishing layer being divided by grooves on the base material to form a plurality of convex-like shapes forming a predetermined pattern The polishing layer block includes two types of polishing, a first polishing layer block and a second polishing layer block, which are different in the material of the polishing layer constituting the polishing layer block. A manufacturing method for manufacturing a polishing tool comprising a layer block,
A first manufacturing process for manufacturing the first polishing layer block;
A second manufacturing process for manufacturing the second polishing layer block;
A plurality of the first polishing layer blocks manufactured in the first manufacturing process and a plurality of the second polishing layer blocks manufactured in the second polishing layer block manufacturing process are formed on the surface of the base material. A pasting step of pasting so as to form a predetermined pattern,
The first manufacturing step includes mixing a resin solution and a curing agent, manufacturing a non-foamed mixed solution by stirring and degassing under reduced pressure, molding the non-foamed mixed solution into a predetermined shape, and forming a non-foamed shape. Cutting the resin into a predetermined shape in order to make resin the first polishing layer block,
The second manufacturing step includes a step of cutting a plate-like elastic member into a predetermined shape to make the second polishing layer block,
A method for producing a polishing tool, comprising: A sheet-like base material, and a polishing layer formed on the surface of the base material, the polishing layer being divided by grooves on the base material to form a plurality of convex-like shapes forming a predetermined pattern The polishing layer block includes two types of polishing, a first polishing layer block and a second polishing layer block, which are different in the material of the polishing layer constituting the polishing layer block. A manufacturing method for manufacturing a polishing tool comprising a layer block,
A first manufacturing step of integrally manufacturing the base material and the plurality of first polishing layer blocks from the same material;
A second manufacturing process for manufacturing the second polishing layer block;
On the base material manufactured in the first manufacturing process, a plurality of the second polishing blocks manufactured in the second manufacturing process are formed in a predetermined pattern with the first polishing layer block. And a sticking process to stick,
The first manufacturing step includes mixing a resin solution and a curing agent, manufacturing a non-foamed mixed solution by stirring and degassing under reduced pressure, molding the non-foamed mixed solution into a predetermined shape, and forming a non-foamed shape. Cutting the resin into a predetermined shape in which the base material and the plurality of first polishing layer blocks are integrated, and
The second manufacturing step includes a step of cutting a plate-like elastic member into a predetermined shape to make the second polishing layer block,
A method for producing a polishing tool, comprising:   In order to include abrasive grains in at least one of the first polishing layer block or the second polishing layer block, abrasive grains are mixed into the non-foamed mixed liquid, or the coating liquid containing abrasive grains is foamed into the plate shape. The method for manufacturing a polishing tool according to claim 14, wherein the polishing tool is applied to a surface of a body member.

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