CN109311141A - Grind material - Google Patents
Grind material Download PDFInfo
- Publication number
- CN109311141A CN109311141A CN201780035886.5A CN201780035886A CN109311141A CN 109311141 A CN109311141 A CN 109311141A CN 201780035886 A CN201780035886 A CN 201780035886A CN 109311141 A CN109311141 A CN 109311141A
- Authority
- CN
- China
- Prior art keywords
- grinding
- abrasive areas
- abrasive
- abrasion loss
- areas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000463 material Substances 0.000 title claims abstract description 130
- 238000000227 grinding Methods 0.000 claims abstract description 318
- 239000000758 substrate Substances 0.000 claims abstract description 98
- 238000005299 abrasion Methods 0.000 claims abstract description 95
- 239000006061 abrasive grain Substances 0.000 claims abstract description 56
- 239000000853 adhesive Substances 0.000 claims abstract description 31
- 230000001070 adhesive effect Effects 0.000 claims abstract description 31
- 238000012360 testing method Methods 0.000 claims abstract description 23
- 241000218691 Cupressaceae Species 0.000 claims abstract description 19
- 239000000945 filler Substances 0.000 claims description 57
- 238000003801 milling Methods 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 229910052809 inorganic oxide Inorganic materials 0.000 claims description 2
- 238000000576 coating method Methods 0.000 description 31
- 239000007788 liquid Substances 0.000 description 31
- 239000011248 coating agent Substances 0.000 description 30
- 239000010432 diamond Substances 0.000 description 29
- 229910003460 diamond Inorganic materials 0.000 description 29
- 238000000034 method Methods 0.000 description 28
- 230000008569 process Effects 0.000 description 26
- 239000000203 mixture Substances 0.000 description 24
- 230000000052 comparative effect Effects 0.000 description 22
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 21
- 230000000694 effects Effects 0.000 description 19
- 230000006872 improvement Effects 0.000 description 16
- 238000011049 filling Methods 0.000 description 14
- -1 polyethylene terephthalate Polymers 0.000 description 13
- 238000003825 pressing Methods 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 229910052594 sapphire Inorganic materials 0.000 description 12
- 239000010980 sapphire Substances 0.000 description 12
- 239000011521 glass Substances 0.000 description 11
- 238000012545 processing Methods 0.000 description 10
- 230000008859 change Effects 0.000 description 9
- 230000007812 deficiency Effects 0.000 description 9
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 7
- 230000011218 segmentation Effects 0.000 description 7
- 230000002829 reductive effect Effects 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 239000004698 Polyethylene Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 230000009467 reduction Effects 0.000 description 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 5
- 229910010271 silicon carbide Inorganic materials 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 4
- 239000004115 Sodium Silicate Substances 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 235000019795 sodium metasilicate Nutrition 0.000 description 4
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 4
- 229910052911 sodium silicate Inorganic materials 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 208000005156 Dehydration Diseases 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 3
- 239000002826 coolant Substances 0.000 description 3
- 230000018044 dehydration Effects 0.000 description 3
- 238000006297 dehydration reaction Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical class OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 230000002401 inhibitory effect Effects 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000036961 partial effect Effects 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 241000531908 Aramides Species 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- 238000002050 diffraction method Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 150000002168 ethanoic acid esters Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000005713 exacerbation Effects 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000006193 liquid solution Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/04—Zonally-graded surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Grinding material of the invention has substrate sheets and is laminated in the surface side of the substrate sheets and the grinding layer containing abrasive grains and its adhesive, and the grinding layer is passed through to be divided along grinding direction, with the different a variety of abrasive areas of the abrasion loss in tower cypress abrasion test, the ratio of the abrasion loss of the big abrasive areas of abrasion loss described in the adjacent a pair abrasive areas abrasive areas small relative to the abrasion loss is 1.1 or more and 7 or less.The abrasive areas is two kinds, can be alternately arranged along grinding direction.Each abrasive areas can have the size that can be included in the circle that the lower diameter of vertical view is 5cm.
Description
Technical field
The present invention relates to a kind of grinding materials.
Background technique
In recent years, as the sophisticated electronics such as hard disk (hard disk), light emitting diode (Light Emitting
Diode, LED), the substrate of power component (power device) etc., to the difficult processing substrate such as glass, sapphire, silicon carbide
It needs to increase.Grinding for such difficult processing substrate, it is desirable that damage few planarization precision and high grinding rate.
For the requirement, the grinding material (ginseng for having with the grind section for being dispersed with diamond lap grain and filler is proposed
According to Japanese patent special table 2002-542057 bulletin).In grinding material before described, carried out with to the surface for being ground body
Grinding falls off diamond lap grain in the surface of grind section protrusion by filler self-grind portion.Grinding material before described
Planarization precision is maintained by the protrusion of the diamond lap grain, and improves grinding rate.
If lapping rejects is in grind section and is ground between body slow however, the grinding material before such continues to grind
It is slow to accumulate, grind the abrasive grains of material be ground body and be difficult to contact and be easy to produce so-called blocking.Therefore, grinding before described
It grinds in material, grinding rate is easy to reduce with the time, and grinding efficiency reduces.
Existing technical literature
Patent document
Patent document 1: Japanese patent special table 2002-542057 bulletin
Summary of the invention
Problem to be solved by the invention
The present invention is formed in view of such undesirable condition, its purpose is to provide a kind of grinding rate with higher and
Grinding efficiency is not easy reduced grinding material.
Technical means to solve problem
Invention is a kind of grinding material made of in order to solve the problem, has substrate sheets and is laminated in the substrate
The surface side of piece and grinding layer containing abrasive grains and its adhesive, and the grinding layer is passed through and is divided along grinding direction, tool
The a variety of abrasive areas for having the abrasion loss in tower cypress (Taber) abrasion test different, institute in adjacent a pair abrasive areas
The ratio for stating the abrasion loss of the big abrasive areas of the abrasion loss abrasive areas small relative to the abrasion loss is 1.1 or more and 7
Below.
A variety of abrasive areas that the grinding material has the abrasion loss in the abrasion test of tower cypress different, if therefore being ground using described
Mill material is ground, then the big abrasive areas of abrasion loss is first worn away in adjacent a pair of of abrasive areas.In addition, about the grinding
Material, the big abrasive areas of the abrasion loss described in the adjacent a pair abrasive areas milling zone small relative to the abrasion loss
The ratio of the abrasion loss in domain is the lower limit or more, therefore self-grind started in the short period, in adjacent a pair of of milling zone
Appropriate scale is generated between domain, surface pressing (surface pressure) is promoted in the small abrasive areas of abrasion loss.As a result,
The grinding material can more effectively application grinding when surface pressing, therefore grinding rate is higher.In addition, about the grinding material,
The ratio of the abrasion loss is the upper limit hereinafter, therefore the scale will not become excessive, and warp is divided along grinding direction, therefore
It is ground body to be not damaged on one side across scale, be ground on one side.When being ground body across the scale, ground
Mill body by be pressed into scale it is so-called across resistance and grasping (grip) power of the grinding material improves, and it is big in height
In region surface pressing improve, can effectively application grinding when surface pressing, therefore it is described grinding material grinding rate be not easy to drop
It is low.
The abrasive areas is two kinds, can be alternately arranged along grinding direction.By the way that two kinds are so alternately arranged like that
Abrasive areas, the inhibitory effect that the improvement effect of grinding rate and grinding efficiency can be maintained to reduce, and inhibit to grind the system of material
Cause this increase.
Each abrasive areas can have the size that can be included in the circle that the lower diameter of vertical view is 5cm.By so like that
Each abrasive areas is set as to be included in the size for overlooking the circle that lower diameter is 5cm, and is more reliably obtained by crossing over
The resulting grip improvement effect of resistance.
Described adhesive contains the filler using inorganic oxide as principal component, and the average grain diameter of the filler can be small
In the average grain diameter of the abrasive grains.There is the filler using oxide as principal component by such described adhesive like that,
The coefficient of elasticity that described adhesive can be improved is easy to control the abrasion of grinding layer.In addition, the average grain by making the filler
Diameter is smaller than the average grain diameter of the abrasive grains, and the abrasive power of abrasive grains is not easily susceptible to hinder.Therefore, mentioning for grinding rate can be maintained
High effect.
Herein, so-called " grinding direction " is the grinding material direction mobile in grinding, such as if discoid grinding material
Then refer to circumferencial direction.In addition, " abrasion loss in tower cypress abrasion test " is the value obtained as follows: prepare test film,
Using tower cypress abrasiometer, so that the test film is rotated 320 turns to wear away the condition of wheel H-18, weight bearing 4.9N (500gf), survey
The test film of fixed 320 turns of front and backs it is of poor quality after, resulting value area is scaled the of poor quality of the test film of diameter 104mm and
At.In addition, " abrasive areas " that so-called grinding layer has, refer to the abrasion loss in tower cypress abrasion test deviation be 3% with
Interior range divides each region when grinding layer.
In addition, so-called " principal component ", refers to the most ingredient of content, for example, refer to content be 50 mass % or more at
Point.In addition, so-called " average grain diameter ", refers to the cumulative particle sizes distribution curve of the volume reference measured by laser diffractometry etc.
50% value (50% partial size, D50).
The effect of invention
As mentioned above, grinding material grinding rate with higher of the invention and grinding efficiency is not easy to reduce.Cause
This, the grinding material can be preferably used as the grinding of the difficult processing substrate such as glass, sapphire, silicon carbide.
Detailed description of the invention
The schematic plan view of the grinding material of [Figure 1A] embodiments of the present invention.
Schematic cross sectional view at the line A-A of the grinding material of [Figure 1B] Figure 1A.
The schematic cross sectional view of the grinding material of embodiments [Fig. 2] different from Figure 1B.
Specific embodiment
[first embodiment]
It is described in detail hereinafter, suitably referring to attached drawing one on one side in face of first embodiment of the invention.
<grinding material>
The grinding material 1 shown in Figure 1A and Figure 1B be it is discoid, mainly have substrate sheets 10 and be laminated in the substrate
The grinding layer 20 of the surface side of piece 10.In addition, the grinding material 1 has the following layer 30 for the back side for being laminated in substrate sheets 10.
For the grinding material 1, it is disposed on the grinding platen of well known grinding device, makes it by grinding device and be ground
Body is contacted while being rotated, and is thus ground.That is, the grinding direction of the grinding material 1 is the circumferencial direction of substrate sheets 10.
(substrate sheets)
The substrate sheets 10 are the component to support grinding layer 20.The material of the substrate sheets 10 is not particularly limited,
It can enumerate: polyethylene terephthalate (Polyethylene terephthalate, PET), polypropylene
(Polypropylene, PP), polyethylene (Polyethylene, PE), polyimides (Polyimide, PI), poly- naphthalenedicarboxylic acid
Second diester (Polyethylene naphthalate, PEN), aromatic polyamides (aramide), aluminium, copper etc..Wherein, preferably
With the good aluminium of followability of grinding layer 20.In addition, can also be chemically treated to the surface of substrate sheets 10, sided corona treatment, bottom
Paint processing etc. improves the processing of followability.
In addition, substrate sheets 10 can have flexible or ductility.Have flexible by such substrate sheets 10 like that or prolongs
Malleability, the grinding material 1 follow the surface shape for being ground body, and abradant surface increases with the contact area for being ground body, therefore grinds
Mill rate is further promoted.Such material with flexible substrate sheets 10 can for example enumerate PET or PI etc..In addition, having
The material of the substrate sheets 10 of ductility can enumerate aluminium or copper etc..
In addition, there is no particular restriction for the size of the substrate sheets 10, for example, can be set as outer diameter 200mm or more and 2022mm with
Lower and internal diameter 100mm or more and 658mm or less.
There is no particular restriction for the average thickness of the substrate sheets 10, such as can be set as 50 μm or more and 1mm or less.If described
The average thickness of substrate sheets 10 is less than the lower limit, then has the intensity of the grinding material 1 or the problem of flatness deficiency.Another party
Face has the grinding material 1 unnecessarily to thicken and handles change and be stranded if the average thickness of the substrate sheets 10 is more than the upper limit
Difficult problem.
(grinding layer)
Grinding layer 20 contains abrasive grains 21 and its adhesive 22.In addition, the grinding layer 20 has on its surface passes through slot
The 23 multiple grind sections 24 divided.
In addition, the grinding layer 20 is ground direction along it, i.e. the circumferencial direction of substrate sheets 10 divides, there is tower cypress mill
The different two kinds of abrasive areas of abrasion loss in consumption test.Specifically, the grinding layer 20 is whole by passing through 10 table of substrate sheets
Two straight lines (dotted line of Figure 1A) at the center in face and be divided into four abrasive areas, the first abrasive areas X and the second milling zone
Alternately there are two regions for arranging respectively along grinding direction by domain Y.In addition, dividing in the first abrasive areas X and the second abrasive areas Y
It is not equipped the multiple grind sections 24 divided by the outer rim of slot 23 and substrate sheets 10.Furthermore so-called " grinding layer is whole ", is removed
It is the concept of the outer rim comprising the slot and substrate sheets when grinding layer has slotted situation other than the grind section.
There is no particular restriction for the average thickness (average thickness of grind section 24) of the grinding layer 20, and preferably 25 μm, more
Preferably 30 μm, and then preferably 200 μm.On the other hand, the upper limit of the average thickness of the grinding layer 20 is preferably 4000 μm,
More preferably 3000 μm, and then preferably 2500 μm.When the average thickness of the grinding layer 20 is less than the situation of the lower limit,
The obliterated of grinding layer 20 becomes faster, therefore has the problem of the durability deficiency of the grinding material 1.On the other hand, in the grinding layer 20
Average thickness be more than the upper limit situation when, there is the grinding material 1 unnecessarily to thicken and handle the problem of becoming difficult.
(abrasive grains)
The abrasive grains 21 can enumerate the various of diamond lap grain, alumina lap grain, Silica abrasive grain etc. and grind
Abrasive grain.Wherein, preferably diamond lap grain.By the way that the abrasive grains 21 are so set as diamond lap grain like that, can obtain
Higher than other type abrasive grains abrasive power, therefore can more effectively application grinding when surface pressing, and more reliably obtain
It obtains by crossing over the resulting grip improvement effect of resistance.
It, in addition can also be for through processing such as Ni coatings furthermore the diamond of diamond lap grain can be that monocrystalline is also polycrystalline
Diamond.Wherein, preferably single-crystal diamond and polycrystalline diamond.Single-crystal diamond is hard and abrasive power in a diamond
It is high.In addition, polycrystalline diamond is easy to constitute polycrystalline crystallite unit and rive and be not easy to be passivated, therefore the reduction of grinding rate is small.
The lower limit of the average grain diameter of the abrasive grains 21 is preferably 2 μm, and more preferably 10 μm.In addition, the abrasive grains 21
The upper limit of average grain diameter be preferably 50 μm, more preferably 45 μm.If the average grain diameter of the abrasive grains 21 is less than the lower limit,
Then there is the problem of grinding rate becomes inadequate.On the other hand, if the average grain diameter of the abrasive grains 21 is more than the upper limit,
It is ground the problem of body is damaged.
The lower limit of the content of the abrasive grains 21 in grinding layer 20 is preferably 2 volume %, more preferably 3 volume %.Separately
Outside, the upper limit of the content of the abrasive grains 21 is preferably 55 volume %, more preferably 45 volume %, and then preferably 35 bodies
Product %.If the content of the abrasive grains 21 is less than the lower limit, there is the problem that grinding rate is insufficient.On the other hand, if institute
The content for stating abrasive grains 21 is more than the upper limit, then has the hypodynamic problem of holding of the abrasive grains 21 of grinding layer 20.
Furthermore it can also be in the content of the first abrasive areas X and the second abrasive areas Y change abrasive grains 21.In the situation
When, the content of the abrasive grains 21 of the second abrasive areas Y is preferably less than the content of the abrasive grains 21 of the first abrasive areas X, and second
The content of the abrasive grains 21 of abrasive areas Y can also be 0 volume %.The grinding material 1 is in the first small abrasive areas X of abrasion loss
Surface pressing is promoted, therefore the first abrasive areas X is high compared to grinding efficiency for the second abrasive areas Y.Therefore, second is reduced to grind
It is ground for situation of the content compared to the content for the abrasive grains 21 for reducing by the first abrasive areas X of the abrasive grains 21 of mill region Y
Efficiency is not easy to reduce.Therefore, by making the content of the abrasive grains 21 of the second abrasive areas Y be less than the grinding of the first abrasive areas X
The content of grain 21, can inhibit smaller by the reduction of grinding efficiency, and reduce the manufacturing cost of the grinding material 1.
In addition, the type or average grain diameter of abrasive grains 21 can also be changed in the first abrasive areas X and the second abrasive areas Y,
But for the viewpoint of the controlling of the wear resistance ratio of the first abrasive areas X and the second abrasive areas Y, preferably by abrasive grains 21
Type or average grain diameter are set as identical.
(adhesive)
The principal component of adhesive 22 is not particularly limited, such as can enumerate resin or inorganic matter.
The resin can be enumerated: polyacrylic acid, polyurethanes, epoxy resin (epoxy), cellulose, polyethylene, more
The resins such as phenol, polyester, phenoxy resin.Furthermore the resin can also be crosslinked at least partially.
In addition, the inorganic matter can be enumerated: silicate, phosphate, polyvalent metal alkoxide etc..
When being ground the situation that body is the hard brittle materials substrate such as sapphire, silicon carbide, described adhesive 22 it is main at
Divide preferably inorganic matter.Inorganic bond hardness compared with resin binder is high, therefore the abrasive power of the grinding material 1 improves, and holds
Easy processing hard brittle material substrate.In inorganic matter, the high silicate of the retentivity of the preferably abrasive grains 21 of grinding layer 20.
When being ground the situation that body is the brittle material substrates such as glass, the principal component of described adhesive 22 is preferably set
Rouge.Resin binder hardness compared with inorganic bond is low, therefore can prevent from being ground body and be damaged.
Furthermore the principal component of adhesive 22 can also be changed in the first abrasive areas X and the second abrasive areas Y, but with regard to first
For the viewpoint of the controlling of the wear resistance ratio of abrasive areas X and the second abrasive areas Y, preferably the principal component of adhesive 22 is set
It is identical.
In addition, described adhesive 22 contains the filler using oxide as principal component.It is described by so making
Contain the filler using oxide as principal component in adhesive 22, the coefficient of elasticity of described adhesive 22 can be improved, therefore can hold
The abrasion of grinding layer 20 easy to control.Therefore, appropriate rank is easy to produce in the region of the adjoining of the grinding material 1 in grinding
Difference, therefore more reliably obtain the improvement effect of grinding rate and the inhibitory effect of grinding efficiency reduction.
The filler can for example be enumerated: the oxygen such as aluminium oxide, silica, cerium oxide, magnesia, zirconium oxide, titanium oxide
The composite oxides such as compound and silica-alumina, silica-zirconium oxide, silica-magnesia.These fillers
It can be used alone or be optionally applied in combination two or more.Wherein, it preferably can get the aluminium oxide of high abrasive power.
The average grain diameter of the filler also depends on the average grain diameter of abrasive grains 21, but the average grain diameter of the filler
Lower limit be preferably 0.01 μm, more preferably 1 μm, and then preferably 2 μm.On the other hand, the average grain diameter of the filler
The upper limit is preferably 20 μm, and more preferably 15 μm.If the average grain diameter of the filler is less than the lower limit, has and filled out described in reason
The coefficient of elasticity improvement effect for filling the resulting adhesive 22 of agent is insufficient and what the control of the abrasion of grinding layer 20 became inadequate ask
Topic.On the other hand, if the average grain diameter of the filler is more than the upper limit, filler interferes the abrasive power of abrasive grains 21
The problem of.
In addition, the average grain diameter of the filler is preferably less than the average grain diameter of abrasive grains 21.The filler is put down
Equal partial size is preferably 0.1 relative to the lower limit of the ratio of the average grain diameter of abrasive grains 21, and more preferably 0.2.On the other hand, described to fill out
Filling the average grain diameter of agent relative to the upper limit of the ratio of the average grain diameter of abrasive grains 21 is preferably 0.8, and more preferably 0.6.If described
The average grain diameter of filler is less than the lower limit relative to the ratio of the average grain diameter of abrasive grains 21, then has the institute of filler described in reason
Adhesive 22 coefficient of elasticity improvement effect is insufficient and the problem of the control of the abrasion of grinding layer 20 becomes inadequate.Instead
It has filler if the average grain diameter of the filler is more than the upper limit relative to the ratio of the average grain diameter of abrasive grains 21
The problem of interfering the abrasive power of abrasive grains 21.
The content of the filler in grinding layer 20 also depends on the content of abrasive grains 21, but the content of the filler
Lower limit be preferably 15 volume %, more preferably 30 volume %.On the other hand, the upper limit of the content of the filler is preferably 85
Volume %, more preferably 75 volume %.If the content of the filler is less than the lower limit, have obtained by filler described in reason
Adhesive 22 coefficient of elasticity improvement effect is insufficient and the problem of the control of the abrasion of grinding layer 20 becomes inadequate.Conversely,
If the content of the filler is more than the upper limit, there is the problem of abrasive power of filler obstruction abrasive grains 21.
Furthermore it can also be in the content of the first abrasive areas X and the second abrasive areas Y change filler.In the situation,
The content of the filler of second abrasive areas Y is preferably greater than the content of the filler of the first abrasive areas X.It is filled out if usually increasing
The content of agent is filled, then grinding layer 20 is easy abrasion.Therefore, by grinding the content of the filler of the second abrasive areas Y than first
The content for grinding the filler of region X is big, can more reliably control the wear resistance ratio of the first abrasive areas X and the second abrasive areas Y.The
The lower limit of the difference of the content of the filler of one abrasive areas X and the second abrasive areas Y is preferably 3 volume %, more preferably 5 bodies
Product %.On the other hand, the upper limit of the difference of the content is preferably 15 volume %, more preferably 12 volume %.If the content
Difference is less than the lower limit, then has the first abrasive areas X and the wear resistance ratio of the second abrasive areas Y to become too small, the first abrasive areas X
Scale between the second abrasive areas Y becomes smaller, and by the problem across the resulting grip improvement effect deficiency of resistance.Instead
It, if the difference of the content is more than the upper limit, the wear resistance ratio of the first abrasive areas X and the second abrasive areas Y become excessive,
Scale between first abrasive areas X and the second abrasive areas Y becomes larger.Become excessive across resistance as a result, therefore there is generation to be ground
The problem of edge crumbling of mill body or rupture.
In addition, the type of filler can also be changed in the first abrasive areas X and the second abrasive areas Y, but ground with regard to first
For the viewpoint of the controlling of the wear resistance ratio of region X and the second abrasive areas Y, the type of filler is preferably set as identical.
In addition, can also be in the average grain diameter of the first abrasive areas X and the second abrasive areas Y change filler.The average grain diameter of filler
It is bigger, the easier exacerbation of the abrasion of grinding layer 20, but compared with changing the situation of content of the filler in grinding layer 20, abrasion
The variation of amount is small.Therefore, by controlling abrasion loss using the content of filler, and change the average grain diameter of filler, can make
The control precision of abrasion loss improves.
In described adhesive 22, can also according to purpose and suitably containing dispersing agent, coupling agent, interfacial agent, lubricant,
Various assistants and additives such as defoaming agent, colorant etc..In addition, the resin of described adhesive 22 can also be crosslinked at least partially.
(slot)
Slot 23 is to be constituted in the surface side of grinding layer 20 with equally spaced clathrate.In addition, the bottom surface of the slot 23 is
It is made of the surface of substrate sheets 10.In addition, the width of slot 23 is substantially wide.That is, multiple grind sections 24 are in a region
It is identical square shape under vertical view, is arranged with substantially isodensity.
In addition, slot 23 can be equipped on the boundary for the region segmentation that will abut against.By being so arranged on boundary like that
Slot 23, due to grinding the scale of interregional generation across slot 23 it is opposite to, therefore slot 23 become buffer area and can inhibit by
The edge crumbling of abrasive body or the generation of rupture.
The lower limit of the width of the slot 23 is preferably 0.3mm, more preferably 0.5mm.In addition, the width of the slot 23 is upper
Limit is preferably 15mm, more preferably 10mm.If the width of the slot 23 is less than the lower limit, there is the grinding generated by grinding
Powder blocks the problem of slot 23.On the other hand, it if the width of the slot 23 is more than the upper limit, is ground body and is easy to fall into slot
In 23, therefore has and be ground body in grinding and lead to the problem of damage.
The lower limit of the area of each grind section 24 is preferably 0.5mm2, more preferably 1mm2.On the other hand, the grind section 24
The upper limit of area be preferably 13mm2, more preferably 7mm2.If the area of the grind section 24 is less than the lower limit, there is grinding
The problem of portion 24 is removed from substrate sheets 10.Conversely, if the area of the grind section 24 be more than the upper limit, grinding when and quilt
The number of the grind section 24 of abrasive body contact tails off.Such as it is located at situation in grind section 24 at the edge for being ground body and is located at
When situation on slot 23, the contact area for being ground body and grind section 24 sometimes generates difference, if grinding be ground that body contacts
The number in mill portion 24 tails off, then the difference tends to get bigger.Therefore, in grinding, there is the grinding pressure for being applied to each abrasive grains 21
Power be easy to happen variation and grinding precision reduce the problem of.
(abrasive areas)
There are four abrasive areas, the first abrasive areas X and the second abrasive areas Y along grinding direction for the tool of grinding layer 20
Region there are two being alternately arranged respectively.
The lower limit of the abrasion loss of the first abrasive areas X in tower cypress abrasion test is preferably 0.05g, more preferably
0.08g.On the other hand, the upper limit of the abrasion loss of the first abrasive areas X is preferably 0.25g, more preferably 0.2g.If described
The abrasion loss of first abrasive areas X is less than the lower limit, then abrasive grains 21 are not easily to fall off.Therefore, there is the table of the first abrasive areas X
The abrasive grains 21 that face is exposed be easy to happen passivation and grinding rate reduce the problem of.Conversely, if the first abrasive areas X
The problem of abrasion loss is more than the upper limit, then has the service life of the grinding material 1 to shorten.Furthermore the first abrasive areas X or second is ground
The abrasion loss of mill region Y can be controlled by the content of filler, the content of abrasive grains 21, type of adhesive 22 etc..
The lower limit of the abrasion loss of the second abrasive areas Y in tower cypress abrasion test is preferably 0.1g, more preferably
0.15g.On the other hand, the upper limit of the abrasion loss of the second abrasive areas Y is preferably 0.8g, more preferably 0.5g.If described
The abrasion loss of second abrasive areas Y is less than the lower limit, then has and generate between the first abrasive areas X and the second abrasive areas Y
Scale becomes too small and by the leap resulting grip improvement effect deficiency of resistance problem.Conversely, if second milling zone
The problem of abrasion loss of domain Y is more than the upper limit, then has the service life of the grinding material 1 to shorten.
The ratio of the abrasion loss of the first the second big abrasive areas Y of abrasion loss small relative to abrasion loss abrasive areas X
Lower limit be 1.1, more preferably 1.5, and then preferably 2.On the other hand, the upper limit of the ratio of the abrasion loss is 7, more preferably
6, and then preferably 4.If the ratio of the abrasion loss be less than the lower limit, have the first abrasive areas X and the second abrasive areas Y it
Between the scale that generates become too small and by the problem across the resulting grip improvement effect deficiency of resistance.Conversely, if the mill
The ratio of consumption is more than the upper limit, then the scale between the first abrasive areas X and the second abrasive areas Y becomes larger and becomes across resistance
It is too much, therefore have and lead to the problem of the edge crumbling for being ground body or rupture.
The area in each region is determined, the lower limit of the area in each region by the segmentation number in region and the size of substrate sheets 10
Preferably 2000mm2, preferably 3000mm2.On the other hand, the upper limit of the area in each region is preferably 20000mm2, more preferably
15000mm2.It is ground if the area in each region is less than the lower limit when the leading edge for being ground body moves in region
The posterior border position of body becomes inadequate in other neighboring regions across resistance.Therefore, have by crossing over the resulting grasping of resistance
The problem of power improvement effect deficiency.Conversely, having whole from body is ground in grinding if the area in each region is more than the upper limit
It is elongated that body enters in the same area the distance risen until the leading edge for being ground body moves in region.Therefore, it is ground
Body is reduced in the number per unit time of interregional leap, therefore is had by insufficient across the resulting grip improvement effect of resistance
Problem.
In addition, each region is preferably sized to greater than the size as the substrate for being ground body, specifically, each area
Domain is preferably to have that the size for overlooking the circle that lower diameter is 5cm can be included in.If the size in each region is to be used as to be ground body
Substrate size hereinafter, then when the leading edge for being ground body moves in region, be ground the posterior border position of body in other
Neighboring region in, become inadequate across resistance.Therefore, have by being asked across the resulting grip improvement effect of resistance is insufficient
Topic.
Each area of multiple first abrasive areas X can be roughly equal.In addition, multiple second abrasive areas
Each area of Y can be roughly equal.In turn, each region of the area in each region of the first abrasive areas X and the second abrasive areas Y
Area is roughly equal.That is, the grinding layer 20 is divided by orthogonal two straight line at the center by 10 surface of substrate sheets, institute
Stating the first abrasive areas X and the second abrasive areas Y can substantially equiangularly spaced arranging.Such grinding layer 20 is with substantially angularly
Two kinds of abrasive areas for being spaced and alternately having the abrasion loss in the abrasion test of tower cypress different, are thus ground body in abrasive areas
Between be periodically moved, therefore can further obtain high grinding rate and inhibit grinding efficiency reduce effect.Herein, so-called " each
The area in region is roughly equal ", refer to that the area in each region relative to the difference of the average area of multiple regions is 10% or less.
In addition, the gross area of small the first abrasive areas X of the abrasion loss second abrasive areas Y's big relative to abrasion loss is total
The lower limit of the ratio of area is preferably 0.7, and more preferably 0.9.On the other hand, the upper limit of the gross area ratio is preferably 1.3, more excellent
It is selected as 1.1.If the gross area ratio is less than the lower limit, it is ground body and passes through the first high abrasive areas X's of surface pressing
The ratio of time is reduced, therefore has the problem of grinding rate reduction.Conversely, if gross area ratio is more than the upper limit, relatively
In the weight bearing of same size, the surface pressing for being applied to the first abrasive areas X is reduced, therefore has the problem of grinding rate reduction.
(following layer)
Following layer 30 is the branch being fixed on the grinding material 1 to support the grinding material 1 and be installed on grinding device
Hold the layer of body.
Solid used in the following layer 30 is not particularly limited, such as can be enumerated: response type solid, moment connect
Agent, hot melt solid, sticker etc..
Solid used in the following layer 30 is preferably sticker.By using sticker as institute in following layer 30
Solid, can self-supporting body remove the grinding material 1 and attach again, therefore be easy the recycling grinding material 1 and support
Body.Such sticker is not particularly limited, such as can be enumerated: acrylic acid series sticker, acrylic acid-rubber series sticker, natural
The synthetic rubber system such as rubber series sticker, butyl rubber system sticker, silicone-based sticker, polyurethanes system sticker
Deng.
The lower limit of the average thickness of following layer 30 is preferably 0.05mm, more preferably 0.1mm.In addition, following layer 30 is flat
The upper limit of equal thickness is preferably 0.3mm, more preferably 0.2mm.If the average thickness of following layer 30 is less than the lower limit, connect
The problem of putting forth effort deficiency, grinding the removing of 1 self-supporting body of material.On the other hand, if the average thickness of following layer 30 is more than the upper limit,
Then have and causes obstacle etc. when the grinding material 1 is cut into required shape and operability the problem of reducing.
<grindings of planar substrates>
The grinding material 1 can be preferably used as the glass substrate as fragile material, the sapphire as hard brittle material
Or the single or double grinding of the planar substrates such as silicon carbide.
The ratio of grinding rate of the grinding rate relative to first time grinding when the 5th grinding of the grinding material 1
The lower limit of (grinding rate sustainment rate) is preferably 75%, and more preferably 80%, and then preferably 90%.It is tieed up in the grinding rate
When holdup is less than the situation of the lower limit, there is the problem of grinding efficiency reduces due to grinding rate reduces.On the other hand, described to grind
The upper limit of mill rate sustainment rate is not particularly limited, more bigger better.So-called grinding rate herein refers to diameter 5.08cm, ratio
The sapphire substrate in the 3.97, face c is weighed in grinding pressure 200g/cm2, upper platen revolving speed -25rpm, push disk rotating speed 50rpm and too
The grinding rate each time when grinding in 10 minutes is repeated under conditions of positive gear (SUN gear) revolving speed 8rpm.It is specific and
Speech, grinding rate can by the weight change (g) of the sapphire substrate before and after grind divided by substrate surface area (μm2), base
(g/ μm of the specific gravity of plate3) and milling time (minute) and calculate.
<manufacturing method of grinding material>
The grinding material 1 can by the process printed to the first abrasive areas with composition, to the second abrasive areas
The process printed with composition and the process of following layer 30 is attached in the back side of substrate sheets 10 and is manufactured.
(the first abrasive areas composition printing process)
In the first abrasive areas in composition printing process, formed by the printing of the first abrasive areas composition
First abrasive areas X.
Firstly, preparing the grinding as the first abrasive areas X of the first abrasive areas composition in the form of coating liquid
Solution obtained by grain 21, the forming material of adhesive 22 and filler are scattered in solvent.As long as the solvent makes adhesive 22
Forming material be it is solvable, then be not particularly limited.Specifically, methyl ethyl ketone (Methyl Ethyl can be used
Ketone, MEK), isophorone, terpineol, N-Methyl pyrrolidone, cyclohexanone, propylene carbonate etc..In order to control coating liquid
Viscosity or mobility, diluents such as water, alcohol, ketone, acetic acid esters, aromatic compound etc. can also be added.
Then, using the coating liquid, the first abrasive areas X is formed on the surface of substrate sheets 10 by print process.Tool
For body, prepare the mask with shape corresponding with the rotated shape of the first abrasive areas X, be spaced the mask and
Print the coating liquid.Screen painting, metal mask printing etc. for example can be used in the mode of printing.
After printing, make coating liquid thermal dehydration and heat hardening, the first abrasive areas X of grinding layer 20 is consequently formed.Tool
For body, if such as the principal component of adhesive 22 is inorganic matter, keep coating liquid dry under room temperature (25 DEG C), at 70 DEG C or more
And after 90 DEG C or less thermal dehydrations, is hardened at 140 DEG C or more and 310 DEG C or less, thus can form adhesive 22.In addition, if viscous
The principal component of mixture 22 is resin, then makes coating liquid in 100 DEG C or more and 150 DEG C or less hardening 15 hours or more, be consequently formed
Adhesive 22.
(the second abrasive areas composition printing process)
In the second abrasive areas in composition printing process, formed by the printing of the second abrasive areas composition
Second abrasive areas Y.
Firstly, being prepared in the form of coating liquid in the same manner as the coating liquid of the first abrasive areas composition printing process
Solution obtained by being scattered in the second abrasive areas in solvent with composition.Then, it is printed with the first abrasive areas with composition
Process similarly, forms the second abrasive areas Y of grinding layer 20 using the coating liquid.
Furthermore second abrasive areas can also be printed in first abrasive areas with composition with composition printing process
It is carried out simultaneously before dataller's sequence or with the first abrasive areas with composition printing process.
(following layer attached process)
Finally, following layer 30 can be attached at the back side of the substrate sheets 10 in following layer attached process, and described in obtaining
Grind material 1.
<advantage>
Two kinds of abrasive areas that the grinding material 1 has the abrasion loss in the abrasion test of tower cypress different, if therefore described in use
Grinding material 1 is ground, then the second big abrasive areas Y of abrasion loss is first worn away in adjacent a pair of of abrasive areas.In addition, about
The grinding material 1, the second big abrasive areas Y of abrasion loss described in adjacent a pair abrasive areas is relative to the abrasion
The ratio for measuring the abrasion loss of the first small abrasive areas X is 1.1 or more, therefore in short period for having started of self-grind, it abuts
A pair of of abrasive areas between generate scale appropriate, in the first small abrasive areas X of abrasion loss surface pressing improve.Institute as a result,
State grinding material 1 can more effectively application grinding when surface pressing, therefore grinding rate is higher.In addition, the grinding material 1 is described
The ratio of abrasion loss is 7 hereinafter, the event scale will not become excessive, and warp is divided along grinding direction, therefore is ground body not
It will receive damage and ground while across scale.When being ground body across the scale, be ground body by by
The grip for being depressed into the so-called grinding material 1 described across resistance of scale improves, and the surface pressing in the big region of height
Improve, can effectively application grinding when surface pressing, therefore it is described grinding material 1 grinding efficiency be not easy to reduce.
[second embodiment]
It is described in detail hereinafter, suitably referring to attached drawing one on one side in face of second embodiment of the present invention.
The grinding material 2 shown in Fig. 2 be it is discoid, mainly have substrate sheets 11 and be laminated in the substrate sheets 11
The grinding layer 20 of surface side.In addition, the grinding material 2 has the following layer 30 for the back side for being laminated in substrate sheets 11.In turn, institute
State the support that grinding material 2 has the support 40 being laminated via following layer 30 and the back side for being laminated in the support 40
Following layer 41.Furthermore it about component parts same as the first embodiment, marks identical symbol and omits the description.
(substrate sheets)
The substrate sheets 11 are the component to support grinding layer 20.Substrate sheets 11 are to grind direction along it and overlook
Under in roughly the same mode of the first abrasive areas X and the second abrasive areas Y be broken into four.That is, being located at adjacent grinding
The bottom surface of the slot 23 on the boundary in region is made of the surface of support 40.By so like that by 11 disjunction of substrate sheets at each
Abrasive areas can constitute the grinding and being bonded multiple substrate sheets 11 for being formed with the different grinding layer 20 of abrasion loss respectively
Material 2, therefore compared with the situation for forming the different abrasive areas of abrasion loss in a substrate sheets 11, it can the grinding easy to manufacture
Material 2.
Material, size and the average thickness of substrate sheets 11 can be identical as the substrate sheets 10 of first embodiment.
(support)
Support 40 is in addition structure that the grinding material 2 is fixed on to the plate of grinding device to support substrate sheets 11
Part.
The material of the support 40 can be enumerated: polypropylene, polyethylene, polytetrafluoroethylene (PTFE), polyvinyl chloride etc. have thermoplastic
Engineering plastics such as the resin of property or polycarbonate, polyamide, polyethylene terephthalate etc..By in the support 40
Using such material, the support 40 has pliability, and the grinding material 2 follows the surface shape for being ground body, grinds
Face is easy to contact with body is ground, therefore grinding efficiency improves.
The average thickness of the support 40 can for example be set as 0.5mm or more and 3mm or less.If the support 40 is flat
Equal thickness is less than the lower limit, then has the problem of the intensity deficiency of support 40.On the other hand, if the support 40 is averaged
Thickness is more than the upper limit, then have be difficult to the problem of support 40 is installed on grinding device or the support 40 can
Flexible insufficient problem.
(support following layer)
Support following layer 41 is the layer support 40 to be installed on to grinding device.The support following layer 41
The type and average thickness of solid can be identical as following layer 30.
<manufacturing method of grinding material>
The grinding material 2 can be used for by being printed grinding layer with composition to substrate sheets 11 process in two kinds of regions,
The substrate sheets 11 are fixed on the process of support 40 and attaches the process of support following layer 41 and manufactures.
(printing process)
In printing process, grinding layer composition is printed to be used for two kinds of regions, prepares to be formed with the first grinding respectively
The substrate sheets 11 of the grinding layer 20 of region X and be formed with the second abrasive areas Y grinding layer 20 substrate sheets 11.
In the printing process, prepare to make first in the form of coating liquid respectively first in the same manner as first embodiment
Solution obtained by abrasive areas is scattered in solvent with composition and make the second abrasive areas be scattered in solvent with composition and
The solution obtained.
Then, using these coating liquid, the grinding layer composition is printed for two kinds of regions.Specifically,
Prepare two panels substrate sheets 11 to be used for each region.In addition, preparing mask corresponding with the substrate sheets 11, it is spaced the mask
And the first abrasive areas composition and the second abrasive areas are printed with composition to each substrate sheets 11.Furthermore in order to be formed
Slot 23, the mask have shape corresponding with the shape of slot 23.In addition, printing process can be identical with first embodiment.
(substrate sheets attached process)
In substrate sheets attached process, by the substrate sheets 11 for being formed with grinding layer 20 with each with the grinding material 2
The consistent mode of the shape in region is cut off, via following layer 30 respectively then in support 40.
(support following layer attached process)
Finally, support following layer can be attached at the back side of the support 40 in support following layer attached process
41, obtain the grinding material 2.
<advantage>
The grinding material 2 has support 40, and thus the processing transfiguration of the grinding material 2 is easy.
[other embodiments]
The present invention is not limited to the embodiments, other than the scheme, can with implement it is various change, improvement
Scheme and implement.
It is that discoid situation is illustrated, but the shape for grinding material is not limited to grinding material in the embodiment
In discoid.Such as grinding material can be set as square shape.The size for grinding the situation that material is set as square shape is had no into special limit
It is fixed, such as can be set as on one side as 140mm or more and 160mm square shape below.
In the embodiment, slot is set as clathrate, that is, the flat shape of grind section is set as square shape, but is ground
The flat shape in mill portion can not also be square shape, may be, for example, the duplicate shape of polygon, the round other than quadrangle
Deng.
In addition, the grinding material can also be the structure without slot.
In the embodiment, to the grinding material comprising two kinds of different abrasive areas of the abrasion loss in tower cypress abrasion test
It is illustrated, but the different abrasive areas number of the abrasion loss is not limited to two kinds, the different abrasive areas of the abrasion loss
Number can also be three kinds or more.
When abrasive areas number is three kinds or more of situation, multiple combinations are may be present in adjacent a pair of of abrasive areas, as long as
For a pair of of abrasive areas of at least described one group of adjoining, the ratio of the abrasion loss is 1.1 or more and 7 or less.In addition, phase
The arranging sequence in the grinding direction of abrasive areas is not particularly limited.For example, being arranged in abrasive areas with the ascending order of abrasion loss
When arranging and being the situation of three kinds of the first abrasive areas (A), the second abrasive areas (B) and third abrasive areas (C), it can be set as such as A-
B-C-A-B-C is like that in the duplicate arrangement of minimum unit, the gently changed repetition as A-B-C-B-A-B-C-B-A
Arrangement etc..In addition, repeated arrangement can also be not set to, and a variety of abrasive areas are arranged with irregular sequence.
In the embodiment, shows and divides substrate sheets for four situations as each abrasive areas in circumferencial direction one,
But the segmentation number is not limited to 4, can also be divided into two, one dividing into three or one point are five or more.Furthermore the segmentation number
Lower limit is preferably 4.If the segmentation number is less than the lower limit, it is ground the body milling zone different across abrasion loss in grinding
The number per unit time in domain is reduced, therefore is had by the problem across the resulting grip improvement effect deficiency of resistance.
In the first embodiment, there is the situation of following layer to be illustrated grinding material, but following layer not must
The constitutive requirements needed, can omit.Such as following layer may be alternatively located at and support side, screw fixation etc. in addition can also be used, and other are fixed
Method and be fixed on support.
In the embodiment, the situation that slot is space is illustrated, but grind material to have filling to described
Filling part in slot.The filling part is substantially free of abrasive grains preferably using resin or inorganic matter as principal component.Again
Person, it is so-called " filling part for being substantially free of abrasive grains ", refer to the content of abrasive grains less than 0.001 volume %, preferably less than
0.0001 volume %.
When the grinding material has the situation of filling part, average thickness being averaged relative to grinding layer of the filling part
The lower limit of the ratio of thickness is preferably 0.1, and more preferably 0.5, and then preferably 0.8, particularly preferably 0.95.On the other hand, institute
The upper limit for stating the ratio of the average thickness of filling part is preferably 1, and more preferably 0.98.If the ratio of the average thickness of the filling part is small
In the lower limit, then has and inhibit to be ground the problem of effect that body is fallen into slot becomes inadequate in grinding.Conversely, if institute
The ratio for stating the average thickness of filling part is more than the upper limit, then have grind start when grinding layer not sufficiently be ground body and contact
The problem of or grinding pressure be also dispersed to filling part and be applied to the problem of grinding pressure of grinding layer becomes inadequate.Herein
So-called " average thickness of filling part ", refers to the average value at a distance from the surface of substrate and the surface of filling part.
Embodiment
The present invention is described in more detail hereinafter, enumerating Examples and Comparative Examples, but the invention be not limited to it is following
Embodiment.
[embodiment 1]
Prepare diamond abrasive grains, uses " Mike's surprise (Microtrac) of Ji Zhuan limited liability company
MT3300EXII " measures average grain diameter.The average grain diameter of the diamond lap grain is 44 μm.Furthermore the gold of the abrasive grains
The type of hard rock is the processing diamond being coated with through 55 mass % nickel.
It will be as the sodium metasilicate of adhesive (No. 3 sodium metasilicate), the diamond lap grain and as the aluminium oxide of filler
(Al2O3, 12 μm of average grain diameter) and it mixes, the content with diamond lap grain relative to grinding layer becomes 5 volume % and filler phase
The content of grinding layer is prepared as the mode of 71 volume %, obtains the first abrasive areas coating liquid.
In addition, diamond lap grain is not deployed, it will be as the sodium metasilicate of adhesive (No. 3 sodium metasilicate) and as filler
Aluminium oxide (14 μm of average grain diameter) mixing, by filler relative to grinding layer content become 67 volume % in a manner of prepare,
Obtain the second abrasive areas coating liquid.
Prepare the discoid aluminium sheet of 300 μm of average thickness, outer diameter 386mm, internal diameter 148mm as substrate sheets.By passing through
The center of the substrate surface and with adjacent straight line at four straight lines of 45 degree of angle and by the surface segmentation of substrate sheets at
Eight regions, circumferentially to replace two kinds of different abrasive areas of the abrasion loss being equipped in tower cypress abrasion test
Mode forms grinding layer.Specifically, forming grinding layer as described below.Firstly, being applied using second abrasive areas
Liquid simultaneously forms four the second abrasive areas by printing.Printing uses the rotary having with the grind section of the second abrasive areas
The mask of the corresponding pattern of shape.About each grind section, plan view shape is the square shape of one side 1.5mm and the width of slot is
3.5mm.In addition, the average thickness of grind section is set as 500 μm.The grind section is set to the square pattern regularly arranged
Shape.Furthermore the abrasive areas, which has, can be included in the size for overlooking the circle that lower diameter is 8.5cm.The coating liquid is set to exist
It is dry under room temperature (25 DEG C), at 80 DEG C after thermal dehydration, at 300 DEG C with 2 hours or more and 4 hours time below it is hard
Change.Then, it in the same manner as the second abrasive areas, using the first abrasive areas coating liquid, is ground by printing second
Grind four the first abrasive areas of interregional formation.
In addition, using the hard vinyl chloride resin plate of average thickness 1mm as support substrate sheets and being fixed on grinding device
Support, the back side of the substrate sheets is bonded with the surface of the support using 130 μm of average thickness of stickers.Make
Use double faced adhesive tape as the sticker.So obtain the grinding material of embodiment 1.
[embodiment 2]
Diamond lap grain is added in the second abrasive areas coating liquid of embodiment 1, it is opposite with diamond lap grain
Becoming 5 volume % and filler in the content of grinding layer becomes relative to the content of grinding layer the mode system of 75 volume %
It is standby, obtain the grinding material of embodiment 2 similarly to Example 1 in addition to this.
[embodiment 3]
Prepare to use the identical coating liquid of coating liquid as the second abrasive areas with the first abrasive areas of embodiment 1 and apply
Liquid.In addition, prepare to mix acetic acid (reagent level-one) with ion exchange water and by the pH at 20 DEG C as preparing in a manner of 1.6 and
At acid water.After forming four the second abrasive areas using the coating liquid and by printing, the first milling zone is being formed
Impregnate the second abrasive areas 1 in 70 DEG C of the acid water.Other than described, obtain similarly to Example 1
Obtain the grinding material of embodiment 3.
[embodiment 4]
Content with diamond lap grain relative to grinding layer becomes the content of 5 volume % and filler relative to grinding layer
Mode as 81 volume % prepares the second abrasive areas coating liquid of embodiment 2, obtains similarly to Example 2 in addition to this
Obtain the grinding material of embodiment 4.
[embodiment 5]
The second abrasive areas of embodiment 1 is prepared in such a way that filler becomes 85 volume % relative to the content of grinding layer
With coating liquid, the grinding material of embodiment 5 is obtained similarly to Example 1 in addition to this.
[embodiment 6]
It will be as the epoxy resin of adhesive, diamond lap grain (9 μm of average grain diameter, monocrystalline) and as filler
Aluminium oxide (2.0 μm of average grain diameter) mixing, the content with diamond lap grain relative to grinding layer become 5 volume % and filler
Content relative to grinding layer is prepared as the mode of 55 volume %, obtains the first abrasive areas coating liquid.
It will mix with the identical epoxy resin of the first abrasive areas, diamond lap grain and aluminium oxide, be ground with diamond
Abrasive grain, which becomes 5 volume % and filler relative to the content of grinding layer, becomes relative to the content of grinding layer the mode of 60 volume %
Preparation obtains the second abrasive areas coating liquid.
Prepare the discoid PET film of 75 μm of average thickness, outer diameter 290mm, internal diameter 103mm as substrate sheets.By passing through
The center of the substrate surface and with adjacent straight line at two straight lines of 90 degree of angle and by the surface segmentation of substrate sheets at
Four regions, circumferentially to replace two kinds of different abrasive areas of the abrasion loss being equipped in tower cypress abrasion test
Mode forms grinding layer.Specifically, forming grinding layer similarly to Example 1.Furthermore about each grind section, plan view shape
For the square shape of one side 2.5mm and the width of slot is 5mm.In addition, making the coating liquid heat hardening at 120 DEG C respectively.
In addition, will indicate substrate sheets similarly to Example 1 and be fixed on the support of grinding device to be bonded, and obtain real
Apply the grinding material of example 6.
[comparative example 1]
Using coating liquid identical with coating liquid with the first abrasive areas of embodiment 1, the entire surface in substrate sheets is formed
Grinding layer obtains the grinding material of comparative example 1 similarly to Example 1 in addition to this.That is, the grinding material about comparative example 1, grinding
Layer does not have the different region of abrasion loss.
[comparative example 2]
Content with diamond lap grain relative to grinding layer becomes the content of 5 volume % and filler relative to grinding layer
Mode as 84 volume % prepares the second abrasive areas coating liquid of embodiment 2, obtains similarly to Example 2 in addition to this
Obtain the grinding material of comparative example 2.
[comparative example 3]
Using coating liquid identical with coating liquid with the first abrasive areas of embodiment 6, the entire surface in substrate sheets is formed
Grinding layer obtains the grinding material of comparative example 3 similarly to Example 6 in addition to this.That is, the grinding material about comparative example 3, grinding
Layer does not have the different region of abrasion loss.
[grinding condition]
Using material is ground obtained in the 1~embodiment of embodiment 5 and 1~comparative example of comparative example 2, process for sapphire-based is carried out
The grinding of plate.In addition, carrying out the grinding of glass substrate using grinding material in embodiment 6 and comparative example 3.Each grinding described below
Condition.
<grinding condition of sapphire substrate>
For sapphire substrate, using diameter 5.08cm, specific gravity 3.97, the face c sapphire substrate (only through being ground (as-
Lap it) handles).In the grinding, commercially available twin grinder is used.The carrier of twin grinder is the epoxy glass of thickness 0.4mm
Glass.About grinding, grinding pressure is set as 200g/cm2, using upper platen revolving speed -25rpm, push disk rotating speed 50rpm and the sun
The condition of gear rotational speed 8rpm carries out 5 grindings as unit of 10 minutes.At this point, being supplied per minute as coolant (coolant)
To " Duff Ni Kate (Daphne Cut) GS50K " of the Chu Guangxingchan limited liability company of 30cc.
<grinding condition of glass substrate>
For glass substrate, diameter 5.08cm, the synthetic quartz glass of specific gravity 2.19 are used.In the grinding, city is used
The twin grinder sold.The carrier of twin grinder is the vinyl chloride resin plate of thickness 0.6mm.About grinding, by grinding pressure
It is set as 100g/cm2, using upper platen revolving speed 40rpm, the condition of disk rotating speed 60rpm and sun gear revolving speed 30rpm is pushed with 10
Minute is that unit carries out 5 grindings.At this point, supply 120cc per minute utilizes water to the then limited public affairs of military share as coolant
" GC-50P " for taking charge of (Noritake Company Limited) carries out 30 times of dilutions and obtains person.
[evaluation method]
Mill by tower cypress abrasion test is carried out to the grinding material of 1~embodiment of embodiment 6 and 1~comparative example of comparative example 3
The measurement of grinding rate and sustainment rate when these grinding material grinding base plates of the measurement and use of consumption.Show the result in table 1
In.
<measurement of abrasion loss>
In measurement by the abrasion loss of tower cypress abrasion test, respectively prepare with the 1~embodiment of embodiment 6 and compared with
(average diameter is the first abrasive areas and the corresponding test film of the second abrasive areas of the grinding material of 1~comparative example of example 3
104mm, average thickness are 300 μm).Using tower cypress abrasiometer (tower cypress instrument (Taber Instrument) company
" MODEL174 "), make the test film rotation 320 transfer to make its mill to wear away the condition of wheel H-18, weight bearing 4.9N (500gf)
Consumption.Measure it is described 320 turns front and back test film [g] of poor quality and as abrasion loss [g].In addition, wear resistance ratio is ground second
The abrasion loss in mill region is calculated divided by the abrasion loss of the first abrasive areas.
<grinding rate>
When calculating grinding rate, the sapphire substrate or glass substrate for having carried out grinding for the first time in 10 minutes are used.It grinds
Mill rate is will to grind the weight change (g) of the substrate of front and back divided by the surface area (cm of substrate2), the specific gravity (g/cm of substrate3) and
Milling time (minute) and calculate.
<sustainment rate>
Grinding rate when grinding rate when the sustainment rate of grinding rate is by the 5th grinding is ground divided by first time
And it calculates.
[table 1]
In table 1, the "-" in one column of the second abrasive areas and wear resistance ratio refers to that grinding material does not have the different grinding of abrasion loss
Region.In addition, the "-" in one column of result refers to the edge crumbling for generating substrate or rupture, and the survey of grinding rate can not be carried out
It is fixed.
According to the result of table 1, the grinding material of 1~embodiment of embodiment 6 is compared with the grinding material of 1~comparative example of comparative example 3,
Grinding rate is not easy to reduce.In contrast, in the grinding material of comparative example 1, comparative example 3, without the different milling zone of abrasion loss
Domain, therefore think not obtaining by crossing over the resulting grip improvement effect of resistance, grinding rate reduces.In addition, comparative example 2 is ground
It grinds in material, wear resistance ratio is more than 7, therefore thinks that the scale between the first abrasive areas and the second abrasive areas becomes larger and becomes across resistance
It is too much, generate edge crumbling or the rupture for being ground body.
In addition, if 2~embodiment of embodiment 4 that the substrate of the same identical type of the content of abrasive grains is ground with
Comparative example 1 is compared, then in the grinding material of embodiment 2, embodiment 3, grinding rate is excellent, in the grinding material of embodiment 4, is ground
It is same for grinding rate.Herein, the grinding material of comparative example 1 is by having the grind section of diamond lap grain and filler dispersion
And improve the grinding material before grinding rate.It follows that the grinding material about 2~embodiment of embodiment 4, grinding rate compared with
It is high.
According to learning above: a variety of abrasive areas that grinding layer has abrasion loss different make adjacent a pair grinding
The ratio of the abrasion loss of the big abrasive areas of abrasion loss described in the region abrasive areas small relative to the abrasion loss is 1.1
Above and 7 hereinafter, thus the maintenance of grinding material grinding rate with higher and grinding rate is excellent.
Industrial availability
Grinding material grinding rate with higher and grinding efficiency of the invention is not easy to reduce.Therefore, the grinding material
It can be preferably used as the grinding of the difficult processing substrate such as glass, sapphire, silicon carbide.
The explanation of symbol
1,2: grinding material
10,11: substrate sheets
20: grinding layer
21: abrasive grains
22: adhesive
23: slot
24: grind section
30: following layer
40: support
41: support following layer
X: the first abrasive areas
Y: the second abrasive areas
Claims (4)
1. a kind of grinding material comprising substrate sheets and be laminated in the surface side of the substrate sheets and containing abrasive grains and its bonding
The grinding layer of agent, and
The grinding layer is passed through to be divided along grinding direction, with the different a variety of milling zones of the abrasion loss in the abrasion test of tower cypress
Domain,
The big abrasive areas of abrasion loss described in the adjacent a pair abrasive areas milling zone small relative to the abrasion loss
The ratio of the abrasion loss in domain is 1.1 or more and 7 or less.
2. grinding material according to claim 1 wherein the abrasive areas is two kinds, and is alternately matched along grinding direction
If.
3. grinding material according to claim 1 or 2, wherein each abrasive areas is straight under vertical view with that can be included in
Diameter is the size of the circle of 5cm.
4. grinding material according to claim 1,2 or 3, wherein described adhesive contains using inorganic oxide as principal component
Filler, and
The average grain diameter of the filler is less than the average grain diameter of the abrasive grains.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016116976 | 2016-06-13 | ||
| JP2016-116976 | 2016-06-13 | ||
| PCT/JP2017/015617 WO2017217108A1 (en) | 2016-06-13 | 2017-04-18 | Abrasive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109311141A true CN109311141A (en) | 2019-02-05 |
| CN109311141B CN109311141B (en) | 2021-01-05 |
Family
ID=60663160
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780035886.5A Expired - Fee Related CN109311141B (en) | 2016-06-13 | 2017-04-18 | Grinding material |
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| Country | Link |
|---|---|
| JP (1) | JP6340142B2 (en) |
| CN (1) | CN109311141B (en) |
| TW (1) | TWI719210B (en) |
| WO (1) | WO2017217108A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112135711A (en) * | 2018-05-16 | 2020-12-25 | 3M创新有限公司 | Grinding wheel |
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| JP5244478B2 (en) | 2008-07-09 | 2013-07-24 | 日立オムロンターミナルソリューションズ株式会社 | Banknote deposit and withdrawal machine |
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- 2017-04-18 CN CN201780035886.5A patent/CN109311141B/en not_active Expired - Fee Related
- 2017-04-18 WO PCT/JP2017/015617 patent/WO2017217108A1/en active Application Filing
- 2017-04-18 JP JP2017521601A patent/JP6340142B2/en not_active Expired - Fee Related
- 2017-05-22 TW TW106116877A patent/TWI719210B/en active
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201742709A (en) | 2017-12-16 |
| JPWO2017217108A1 (en) | 2018-07-05 |
| CN109311141B (en) | 2021-01-05 |
| JP6340142B2 (en) | 2018-06-06 |
| WO2017217108A1 (en) | 2017-12-21 |
| TWI719210B (en) | 2021-02-21 |
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