WO2019123921A1

WO2019123921A1 - Abrasive member

Info

Publication number: WO2019123921A1
Application number: PCT/JP2018/042367
Authority: WO
Inventors: 聡一郎中根; 友樹岩永
Original assignee: バンドー化学株式会社
Priority date: 2017-12-19
Filing date: 2018-11-15
Publication date: 2019-06-27
Also published as: JPWO2019123921A1; JP6605761B1; CN110177654A; US20200376628A1; EP3730245A1; EP3730245A4; CN110177654B

Abstract

The purpose of the present invention is to provide an abrasive member in which it is possible to increase the thickness of an abrasive part while preventing a reduction in the abrasion rate. This abrasive member (1) comprises a base material (10) and an abrasive layer (20) that includes abrasive grains (21) and a binder (22), the abrasive layer (20) being laminated on the obverse side of the base material (10), wherein the abrasive layer (20) has a plurality of columnar abrasive parts (20a), the plurality of abrasive parts (20a) are disposed in a zigzag pattern, the average thickness of the abrasive parts (20a) is 300 μm or greater, the area of the top surface of the abrasive parts (20a) is 6 mm² or greater, and the average thickness of the base material (10) is 300-3000 μm (inclusive).

Description

Abrasive material

The present invention relates to an abrasive.

For example, in the processing of a glass substrate used in an electronic device such as a hard disk, an abrasive of fixed abrasive is generally used. As such an abrasive, there is known an abrasive comprising a polishing layer containing abrasive grains and a binder laminated on the surface of a substrate (see, for example, Japanese Patent No. 6091704). In the above-mentioned conventional abrasives, the polishing layer is composed of a plurality of regions (grinding parts) whose surfaces are divided by grooves, and the maximum peak height of the surface of the grinding part is controlled to achieve high processing efficiency and high finish flatness. It is compatible with the level.

The above-mentioned conventional abrasive is a fixed abrasive type, and the polishing layer gradually wears by polishing, and the lifetime of the polishing layer is abraded. Therefore, in order to extend the life of the above-mentioned conventional abrasives, it is necessary to increase the thickness of the abrasive layer, that is, the height of the individual abrasives.

However, if the height of the polishing portion is increased as it is, the aspect ratio of the polishing portion is increased, and the polishing portion tends to fall down during grinding. For this reason, the polishing material tends to have a lifetime due to the fact that the polishing portion falls down. If the aspect ratio of the polishing portion is lowered to make the polishing portion difficult to fall down, the area of each polishing portion increases. When the area of each polishing portion is large, warpage of the base material is likely to occur as the polishing layer cures and shrinks when producing the polishing layer by printing or the like. For this reason, there is a possibility that it may become difficult to perform uniform polish by curvature of this base material. By increasing the average thickness of the substrate, the warping of the substrate is alleviated, but there is a limit to its relaxation. In addition, when the base material becomes thick, the flexibility and ductility of the base material decrease, and it becomes difficult for the abrasive to follow the surface shape of the workpiece. Therefore, the polishing rate may be reduced.

Patent No. 6091704

The present invention has been made in view of such problems, and it is an object of the present invention to provide an abrasive that can thicken the polishing portion while suppressing a decrease in the polishing rate.

In addition to adjusting the thickness of the substrate, the inventors of the present invention conducted intensive studies on an abrasive which hardly causes warping of the substrate even if the thickness of the polishing portion is increased while suppressing a decrease in the polishing rate. By finding the arrangement of parts in a staggered manner, it was found that the warping of the substrate was dramatically improved, and the present invention was completed. The reason why the warping of the base material is dramatically improved by arranging the polishing portions in a zigzag arrangement is not clear, but the warpage generated in the polishing portions arranged alternately by arranging the polishing portions in a zigzag manner is not clear. It is presumed that is because it is easy to cancel each other.

That is, the invention made in order to solve the above-mentioned subject is an abrasives provided with a substrate, and an abrasive layer laminated on the surface side of this substrate and containing an abrasive grain and a binder, and the above-mentioned abrasive layer is plural. The plurality of polishing portions are arranged in a zigzag, the average thickness of the polishing portions is 300 μm or more, the area of the top surface of the polishing portion is 6 mm ² or more, and The average thickness of these is 300 μm or more and 3000 μm or less.

Since the surface area of the top surface of the polishing portion is equal to or more than the lower limit, the polishing portion is unlikely to fall during grinding even if the average thickness of the polishing portion is equal to or more than the lower limit. Moreover, since the said abrasive | polishing material makes the average thickness of the said base material more than the said lower limit, and makes a some polishing part a zigzag arrangement, even if the average thickness of a grinding | polishing part is more than the said lower limit, it warps to a base material Is hard to occur. Furthermore, since the said abrasives make the average thickness of a base material below the said upper limit, it is easy to follow the surface shape of a to-be-cut body, and a polishing rate can be raised. Therefore, the said abrasives can thicken a grinding | polishing part, suppressing the fall of a grinding | polishing rate.

As a ratio of the average thickness of the said grinding | polishing part with respect to the average thickness of the said base material, 0.7 or more and 4 or less are preferable. By setting the ratio of the average thickness of the polishing portion to the average thickness of the base material to be the lower limit or more, it is possible to make the polishing portion thicker while suppressing a decrease in the polishing rate. Moreover, generation | occurrence | production of the curvature of a base material can be suppressed by making ratio of the average thickness of the said grinding | polishing part with respect to the average thickness of the said base material below an upper limit.

The value of the area of the top surface was divided by the average thickness of the abrasive portion, 0.015 mm ² / [mu] m or more 0.04 mm ² / [mu] m or less. By setting the value obtained by dividing the area of the top surface of the polishing portion by the average thickness within the above range, it is possible to make the polishing portion thicker while suppressing the occurrence of warpage of the substrate.

The area of the top surface of the polishing portion is preferably 100 mm ² or less, and the average thickness of the polishing portion is preferably 5000 μm or less. By setting the area of the top surface of the polishing portion to the upper limit or less, it is possible to suppress the occurrence of warpage of the base material. Moreover, it can be made hard to fall down a grinding part by making average thickness of the above-mentioned grinding part below the above-mentioned maximum.

It is preferable that the binder contains a thermosetting resin as a main component. By using the thermosetting resin as the main component of the binder, for example, it is possible to suppress the occurrence of glass breakage at the time of polishing of the glass material.

“The plurality of polishing portions are arranged in a staggered arrangement” means that the polishing portions are arranged at equal intervals in a plurality of parallel rows, pass through the center of the polishing portions included in one row, and This arrangement means that the centers of the polishing portions of the row adjacent to this one row are not positioned in the orthogonal direction. Further, "main component" means a component with the highest content, preferably a component with a content of 50% by mass or more, more preferably 90% by mass or more.

As described above, in the abrasive of the present invention, the thickness of the polishing portion can be increased while suppressing the decrease in the polishing rate. Therefore, the abrasive of the present invention has a long life.

It is a typical fragmentary plan view showing the abrasives concerning one embodiment of the present invention. It is a typical fragmentary sectional view in the AA line of FIG. FIG. 3 is a schematic partial cross-sectional view showing an abrasive according to an embodiment different from FIG. 2;

Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

The abrasive 1 shown in FIGS. 1 and 2 includes a base 10, an abrasive layer 20 laminated on the front side of the base 10, and an adhesive layer 30 laminated on the back side of the base 10. The polishing layer 20 also has a plurality of polishing portions 20a and grooves 20b disposed between the polishing portions 20a.

The said abrasives 1 are used suitably, for example as a fixed abrasive abrasives for surface grinding | polishing of a glass material, especially surface grinding of the aluminosilicate glass substrate used for a cover glass, a hard disk, etc.

<Base material>
The substrate 10 is a plate-like or sheet-like member for supporting the polishing layer 20.

The main component of the substrate 10 is not particularly limited, but polyethylene terephthalate (PET), polycarbonate (PC), polypropylene (PP), polyethylene (PE), polyimide (PI), polyethylene naphthalate (PEN), aramid, aluminum , Copper and the like. Among them, PET, PC and aluminum, which have good adhesion to the polishing layer 20, are preferable. In addition, the surface of the substrate 10 may be subjected to a treatment such as a chemical treatment, a corona treatment, a primer treatment, or the like to improve adhesion.

Also, the substrate 10 may have flexibility or ductility. As described above, when the base material 10 has flexibility or ductility, the abrasive material 1 follows the surface shape of the workpiece, and the contact area between the polishing surface and the workpiece becomes large, so that the polishing rate is reduced. It will increase further. As a material of the base material 10 which has such flexibility, PET, PC, etc. can be mentioned, for example. Moreover, as a material of the base material 10 which has ductility, aluminum, copper, etc. can be mentioned.

The shape and size of the substrate 10 are not particularly limited, and for example, a square shape having one side of 140 mm to 160 mm, a disk of 200 mm to 2022 mm in diameter, an outer diameter of 200 mm to 2022 mm, and an inner diameter of 100 mm to 658 mm It can be annular or the like. In addition, the plurality of substrates 10 juxtaposed on a plane may be supported by a single support.

The lower limit of the average thickness of the substrate 10 is 300 μm, more preferably 500 μm. On the other hand, the upper limit of the average thickness of the substrate 10 is 3000 μm, and 1000 μm is more preferable. If the average thickness of the substrate 10 is less than the above lower limit, the substrate 10 may be easily warped. Conversely, when the average thickness of the substrate 10 exceeds the above upper limit, the flexibility of the substrate 10 may be insufficient, and the effect of improving the polishing rate may be insufficient.

<Abrasive layer>
The polishing layer 20 includes a plurality of abrasive grains 21 and a binder 22 in the polishing portion 20 a.

(Abrasive)
Examples of the abrasive grains 21 include diamond abrasive grains, alumina abrasive grains, silica abrasive grains, ceria abrasive grains, silicon carbide abrasive grains and the like. Among them, diamond abrasives which are harder than other abrasives are preferable. By making the said abrasive grain 21 into a diamond abrasive grain, polishing power can be improved and a polishing rate can further be improved.

In addition, as a diamond of a diamond abrasive grain, a single crystal or a polycrystal may be sufficient, and the diamond by which Ni coating etc. were processed may be sufficient. Among them, single crystal diamond and polycrystalline diamond are preferable. Single crystal diamond is harder and more abrasive than other diamonds. In addition, polycrystalline diamond is apt to be easily cleaved in a microcrystalline unit constituting a polycrystalline, and it is difficult for the eye to crush to progress, so that the reduction in polishing rate is small even if polishing is performed for a long time.

The average particle size of the abrasive grains 21 is appropriately selected from the viewpoint of the polishing rate and the surface roughness of the object after polishing. The lower limit of the average particle size of the abrasive grains 21 is preferably 2 μm, more preferably 10 μm, and still more preferably 15 μm. On the other hand, as an upper limit of the average particle diameter of the abrasive grain 21, 150 micrometers is preferable, 125 micrometers is more preferable, and 100 micrometers is more preferable. If the average particle diameter of the abrasive grains 21 is less than the above lower limit, the polishing force of the polishing material 1 may be insufficient, and the polishing rate may be reduced. Conversely, if the average particle size of the abrasive grains 21 exceeds the above upper limit, the polishing accuracy may be reduced. Here, the "average particle size" refers to the 50% value (50% particle size, D50) of the volume-based cumulative particle size distribution curve measured by a laser diffraction method or the like.

As a minimum of content of abrasive grain 21 in polish part 20a, 0.5 volume% is preferred, 2 volume% is more preferred, and 4 volume% is still more preferred. On the other hand, the upper limit of the content of the abrasive grains 21 is preferably 55% by volume, more preferably 45% by volume, and still more preferably 35% by volume. If the content of the abrasive grains 21 is less than the lower limit, the polishing power of the polishing layer 20 may be insufficient. Conversely, when the content of the abrasive grains 21 exceeds the upper limit, the abrasive layer 20 may not be able to hold the abrasive grains 21.

(binder)
Although it does not specifically limit as a main component of the binder 22, Resin or an inorganic substance is mentioned. Among them, a resin, particularly a thermosetting resin, is preferable because it is difficult to cause glass cracking when polishing a glass material and is suitable for polishing a glass.

Examples of the resin include polyurethane, phenol resin, epoxy, polyester, cellulose, ethylene copolymer, polyvinyl acetal, polyacrylic acid and salts thereof, polyacrylic acid ester, polyvinyl alcohol, polyvinyl chloride, polyvinyl acetate, polyamide and the like. Resin can be mentioned. Among them, polyacrylic acid ester, epoxy, polyester and polyurethane are preferable because it is easy to ensure good adhesion to the substrate 10, and epoxy having thermosetting property is more preferable. The resin may be at least partially crosslinked.

Moreover, a silicate, a phosphate, a polyhydric-metal alkoxide etc. can be mentioned as said inorganic substance. Among them, silicates having high abrasive retention are preferred. Examples of such silicates include sodium silicate and potassium silicate.

The binder 22 may appropriately contain various assistants and additives such as a dispersant, a coupling agent, a surfactant, a lubricant, an antifoamer, and a colorant according to the purpose.

(Others)
In addition, the polishing layer 20 may include a filler in the polishing portion 20a. Examples of such fillers include oxides such as alumina, silica, cerium oxide, magnesium oxide, zirconia, and titanium oxide, and composite oxides such as silica-alumina, silica-zirconia, and silica-magnesia. You may use these individually or in combination of 2 or more types as needed. Among them, alumina is preferable because high polishing power can be obtained.

The average particle size of the filler depends on the average particle size of the abrasive grains 21, but the lower limit of the average particle size of the filler is preferably 0.01 μm, more preferably 2 μm. On the other hand, the upper limit of the average particle size of the filler is preferably 40 μm, more preferably 20 μm, and still more preferably 15 μm. If the average particle diameter of the filler is less than the above lower limit, the polishing rate may be lowered due to the insufficient effect of the filler on the elastic modulus improvement of the binder 22. On the other hand, when the average particle diameter of the filler exceeds the upper limit, the filler may inhibit the polishing force of the abrasive grains 21.

The average particle size of the filler may be smaller than the average particle size of the abrasive grains 21. The lower limit of the ratio of the average particle size of the filler to the average particle size of the abrasive grains 21 is preferably 0.01, more preferably 0.05, and still more preferably 0.1. On the other hand, the upper limit of the ratio of the average particle size of the filler to the average particle size of the abrasive grains 21 is preferably 0.8, and more preferably 0.6. If the ratio of the average particle size of the filler to the average particle size of the abrasive grains 21 is less than the lower limit, the polishing rate may be reduced due to the insufficient effect of the filler on the elastic modulus of the binder 22. Conversely, if the ratio of the average particle size of the filler to the average particle size of the abrasive grains 21 exceeds the upper limit, the filler may inhibit the polishing force of the abrasive grains 21.

Although the content of the filler to the polishing portion 20a depends on the content of the abrasive grains 21, the lower limit of the content of the filler to the polishing portion 20a is preferably 15% by volume, and more preferably 30% by volume. preferable. On the other hand, as a maximum of content of the above-mentioned filler, 75 volume% is preferred, and 72 volume% is more preferred. If the content of the filler is less than the lower limit, the polishing rate may be reduced due to the insufficient effect of the filler on the elastic modulus improvement of the binder 22. Conversely, if the content of the filler exceeds the upper limit, the filler may inhibit the polishing force of the abrasive grains 21.

(Polishing section)
The polishing portion 20a is columnar. That is, the area of the bottom surface of the polishing portion 20a is 0.9 times to 1.5 times the area of the top surface of the polishing portion 20a, preferably 0.93 times to 1.2 times, more preferably 0.95. It is twice or more and 1.05 or less.

The plurality of polishing units 20a are arranged in a zigzag in the same shape. The shape of the top surface of the polishing portion 20a can be a circular shape as shown in FIG. 1, a square shape, a polygonal shape or the like. From the viewpoint of the effect of reducing the warpage of the substrate 10, a circular shape or a square shape having a relatively low anisotropy is preferable, and a circular shape is particularly preferable.

The plurality of polishing units 20a are arranged in a plurality of parallel rows. The intervals (distance between centers, pitch) of the polishing portions 20a arranged in one row are equal. The intervals between the polishing portions 20a are the same among the plurality of rows. Further, the spacing between the plurality of rows (the distance between the straight lines connecting the centers of the polishing portions 20a in each row) is equal to the spacing of the polishing portions 20a. Furthermore, the center of the polishing portion 20a in a row adjacent to this one row is located in the direction orthogonal to the one row from the midpoint of the straight line connecting the centers of the adjacent polishing portions 20a in one row. That is, the positions of the polishing portions 20a in the adjacent rows are offset by half a pitch from the position of the polishing portions 20a in one row. Therefore, as arrangement | positioning of several grinding | polishing part 20a, the same pattern is repeated for every two lines of several lines. By arranging the plurality of polishing parts 20 a in this manner, the warp of the base material 10 can be effectively reduced.

The lower limit of the average pitch of the polishing portions 20a arranged in one row is preferably 3 mm, and more preferably 5 mm. On the other hand, as an upper limit of the above-mentioned average pitch, 15 mm is preferred and 10 mm is more preferred. If the average pitch is less than the lower limit, the average area of the top surface of the polishing portion 20a can not be increased, and the polishing portion 20a may be prone to fall during polishing. On the other hand, when the average pitch exceeds the upper limit, the width of the groove 20b between the adjacent polishing portions 20a becomes large, and there is a possibility that the base 10 is easily warped.

The lower limit of the average area of the top surface of the polishing portion 20 a is 6 mm ² , and more preferably 15 mm ² . On the other hand, as an upper limit of the average area of the top surface of the grinding | polishing part 20a, 100 mm < ² > is preferable and 30 mm < ² > is more preferable. If the average area of the top surface of the polishing portion 20a is less than the above-described lower limit, the polishing portion 20a may be prone to fall down during polishing. Conversely, when the average area of the top surface of the polishing portion 20a exceeds the above-described upper limit, warpage may easily occur in the base material 10.

The lower limit of the area occupancy ratio of the plurality of polishing portions 20a to the entire polishing layer 20 is preferably 5%, more preferably 20%, and still more preferably 30%. On the other hand, the upper limit of the area occupancy of the polishing portion 20a is preferably 60%, and more preferably 55%. If the area occupancy rate of the polishing portion 20a is less than the above lower limit, the pressure applied at the time of polishing is too concentrated on the narrow polishing portion 20a, and the polishing portion 20a may be peeled off from the base material 10. On the contrary, when the area occupancy of the polishing portion 20a exceeds the upper limit, the contact area of the polishing layer 20 to the workpiece at the time of polishing becomes large, and the polishing rate may be reduced due to the frictional resistance. In addition, "the area of the whole grinding | polishing layer" is the concept also including the area of the groove | channel of a grinding layer.

The lower limit of the average thickness of the polishing portion 20a is 300 μm, and more preferably 1000 μm. On the other hand, as a maximum of average thickness of polish part 20a, 5000 micrometers is preferred and 3000 micrometers is more preferred. If the average thickness of the polishing portion 20a is less than the above lower limit, the life may be short. On the contrary, when the average thickness of the polishing portion 20a exceeds the above upper limit, the polishing portion 20a may be easily fallen at the time of polishing.

The lower limit of the ratio of the average thickness of the polishing portion 20a to the average thickness of the substrate 10 is preferably 0.7, and more preferably 1. On the other hand, the upper limit of the ratio of the average thickness of the polished portion 20a is preferably 4 and more preferably 2.5. The reduction effect of the curvature by the thickness of the base material 10 is not fully obtained with respect to the fall of the polishing rate by the base material 10 becoming thick as ratio of the average thickness of the said grinding | polishing part 20a is less than the said minimum. There is a fear. Conversely, when the ratio of the average thickness of the polishing portion 20a exceeds the upper limit, warpage may easily occur in the base material 10.

The lower limit of the value of the area of the top surface is divided by the average thickness of the polishing portion 20a (the area / thickness ratio) is preferably from ^{^{0.015mm 2 / μm, 0.02mm 2 /}} μm is more preferable. On the other hand, the upper limit of the area / thickness ratio is preferably ^{^{0.04mm 2 / μm, 0.03mm 2 /}} μm is more preferable. If the area / thickness ratio is less than the lower limit, the polishing portion 20a may be easily fallen at the time of polishing. Conversely, when the area / thickness ratio exceeds the upper limit, warpage may easily occur in the base material 10.

(groove)
The bottom surface of the groove 20 b is constituted by the surface of the base material 10.

The average width of the grooves 20b is determined by the area and the area occupancy of the top surface of the polishing portion 20a, but the lower limit of the average width of the grooves 20b is preferably 0.3 mm and more preferably 0.5 mm. On the other hand, the upper limit of the average width of the grooves 20b is preferably 10 mm, more preferably 8 mm. If the average width of the grooves 20b is less than the above-mentioned lower limit, there is a possibility that abrasive powder generated by polishing may clog the grooves 20b. Conversely, if the average width of the grooves 20b exceeds the above-described upper limit, the workpiece tends to fall into the grooves 20b at the time of polishing, and therefore, the workpiece may be damaged. The “average groove width” means the length (D in FIG. 1) of a portion where a straight line L connecting the centers M of adjacent polishing portions 20a in one row passes the groove 20b as shown in FIG. Point to.

<Adhesive layer>
The adhesive layer 30 is a layer for supporting the abrasive 1 and fixing the abrasive 1 to a support for mounting the abrasive 1 on a polishing apparatus.

The adhesive used for the adhesive layer 30 is not particularly limited, and examples thereof include reactive adhesives, instant adhesives, hot melt adhesives, and adhesives that can be replaced.

As an adhesive used for this adhesive layer 30, an adhesive is preferable. By using a pressure-sensitive adhesive as the adhesive used for the adhesive layer 30, the abrasive 1 can be peeled off and replaced from the support, and reuse of the abrasive 1 and the support becomes easy. Such an adhesive is not particularly limited, but, for example, acrylic adhesive, acrylic-rubber adhesive, natural rubber adhesive, synthetic rubber adhesive such as butyl rubber, silicone adhesive, polyurethane adhesive Agents and the like.

As a lower limit of the average thickness of adhesion layer 30, 0.05 mm is preferred and 0.1 mm is more preferred. On the other hand, as an upper limit of the average thickness of adhesion layer 30, 0.3 mm is preferred and 0.2 mm is more preferred. If the average thickness of the adhesive layer 30 is less than the above lower limit, the adhesive strength may be insufficient, and the abrasive 1 may be peeled off from the support. Conversely, if the average thickness of the adhesive layer 30 exceeds the above upper limit, there is a possibility that the workability may be deteriorated, for example, when the abrasive material 1 is cut into a desired shape due to the thickness of the adhesive layer 30 .

<Method of manufacturing abrasive>
The said abrasives 1 can be manufactured by the manufacturing method mainly provided, for example with a preparation process, a grinding layer formation process, and an adhesion layer sticking process.

(Preparation process)
In the preparation step, a composition for an abrasive layer containing abrasive grains 21 and a binder 22 is prepared.

Specifically, a composition for an abrasive layer containing materials for forming the abrasive grains 21 and the binder 22 is prepared as a coating liquid. In addition, since content of the abrasive grain 21 in solid content turns into content of the abrasive grain 21 of the grinding | polishing part 20a after manufacture, the quantity of solid content is carried out so that content in the grinding | polishing part 20a may become a desired value. Determine as appropriate.

Moreover, in order to control the viscosity and fluidity of the coating liquid, a diluent such as water or alcohol is added. By this dilution, a part of the abrasive grains 21 contained in the polishing portion 20 a can be made to project from the surface of the binder 22. That is, by adding the diluent, when the composition for polishing layer is dried in the polishing layer forming step, the thickness of the binder 22 can be reduced, and the protrusion amount of the abrasive grains 21 can be increased. Therefore, this dilution makes it possible to develop a high polishing rate from the beginning of polishing.

(Abrasive layer formation process)
In the polishing layer forming step, the polishing layer 20 is formed by printing the polishing layer composition prepared in the preparation step. The polishing layer forming step includes a coating step and a drying step.

[Coating process]
In the coating step, the composition for a polishing layer is coated on the surface of the substrate 10.

Specifically, using the coating liquid prepared in the preparation step, a polishing layer 20 having a plurality of polishing portions 20a and grooves 20b disposed between the polishing portions 20a is formed on the surface of the substrate 10 by printing. Do. In order to form the groove 20b, a mask having a shape corresponding to the shape of the groove 20b is prepared, and the coating liquid is printed through the mask. As this printing method, for example, screen printing, metal mask printing, etc. can be used.

As a mask for the said printing, the mask made from SUS or a fluorine resin is preferable. Since a mask made of SUS or a fluorine resin mask can be thickened, the polishing portion 20a having a large average thickness can be easily manufactured.

The thickness of the polishing portion 20a can be adjusted mainly by the thickness of the mask and the coating amount. Therefore, it is good to adjust the amount of application of the above-mentioned constituent for polish layers so that average thickness of polish part 20a may be made into a desired value at this coating process.

[Drying process]
In the drying step, the coating liquid (composition for polishing layer) after the coating step is dried by heating. The coating liquid is cured by the heat drying to form the polishing layer 20. This drying step is performed with the mask removed.

As a minimum of heating temperature in a drying process, 80 ° C is preferred and 100 ° C is more preferred. On the other hand, as an upper limit of the above-mentioned heating temperature, 300 ° C is preferred and 200 ° C is more preferred. If the heating temperature is less than the above lower limit, the composition for polishing layer may not be sufficiently cured, the amount of wear may be increased, and the life of the abrasive 1 may be shortened. Conversely, if the heating temperature exceeds the upper limit, the polished portion 20a may be degraded by heat.

The heating time in the drying step depends on the heating temperature, but the lower limit of the heating time is preferably 2 hours, more preferably 2.5 hours. On the other hand, as an upper limit of the said heating time, 40 hours are preferable, 32 hours are more preferable, and 20 hours are further more preferable. If the heating time is less than the above lower limit, the composition for polishing layer may not be sufficiently cured, the amount of wear may be increased, and the life of the abrasive 1 may be shortened. Conversely, if the heating time exceeds the upper limit, the manufacturing efficiency may be reduced.

(Adhesive layer sticking process)
In the adhesive layer attaching step, the adhesive layer 30 is laminated on the back surface side of the substrate 10. Specifically, for example, a tape-shaped adhesive layer 30 formed in advance is attached to the back surface of the substrate 10.

<Advantage>
Since the area of the top surface of the polishing portion 20a is 6 mm ² or more, the polishing portion 20a is unlikely to fall down during grinding even if the average thickness of the polishing portion 20a is 300 μm or more. Moreover, since the said abrasives 1 make the average thickness of the base material 10 300 micrometers or more, and make the some grinding | polishing part 20a staggered, even if the average thickness of the grinding | polishing part 20a is 300 micrometers or more, the base material 10 It is hard to generate warpage. Furthermore, since the average thickness of the base material 10 is 3000 μm or less, the abrasive material 1 can easily follow the surface shape of the workpiece, and the polishing rate can be increased. Therefore, the said abrasives 1 can thicken the grinding | polishing part 20a, suppressing the fall of a grinding | polishing rate.

Other Embodiments
The present invention is not limited to the above embodiment, and can be implemented in various modifications and improvements in addition to the above embodiment.

Although the above-mentioned embodiment explained the case where the interval between the rows of a plurality of polishers was made equal to the interval between the polishers in one row, the interval between the rows is the interval between the polishers in one row It may be different from For example, even if a plurality of polishing portions are arranged in one row of polishing portions and in a row adjacent to the polishing portions, the two closest polishing portions from the polishing portion are arranged to form an equilateral triangle. Good. When the spacing between the rows is different from the spacing between the polishing portions in one row, the spacing between the rows is preferably 3 mm or more and 15 mm or less. If the distance between the rows is less than the above lower limit, the average area of the top surface of the polishing portion can not be increased, and the polishing portion may be prone to fall during polishing. On the contrary, when the distance between the rows exceeds the upper limit, the width of the groove between the adjacent rows becomes large, and the substrate may be easily warped.

In the above embodiment, the case where the position of the polishing portion in the adjacent row is shifted by half a pitch from the position of the polishing portion in one row has been described, but the shift of the position is not limited to the half pitch. It may be / 3 pitch. In this case, the same pattern is repeated every three rows as the arrangement of the plurality of polishing units.

Although the above-mentioned embodiment explained the case where an abrasives has an adhesion layer, an adhesion layer is not an essential component and can be omitted. When the abrasive does not have the adhesive layer, the adhesive layer attaching step of the method of manufacturing the abrasive is omitted.

Alternatively, as shown in FIG. 3, the abrasive 2 may be provided with a support 40 laminated via the adhesive layer 30 on the back surface side and a second adhesive layer 31 laminated on the back surface side of the support 40. . When the abrasive 2 includes the support 40, the abrasive 2 can be easily handled.

Examples of the main component of the support 40 include thermoplastic resins such as polypropylene, polyethylene, polytetrafluoroethylene and polyvinyl chloride, and engineering plastics such as polycarbonate, polyamide and polyethylene terephthalate. By using such a material as the main component of the support 40, the support 40 has flexibility, the abrasive 2 follows the surface shape of the object to be cut, and the polishing surface and the object to be cut are in contact with each other. The polishing rate is further improved because it is easy to do.

The average thickness of the support 40 can be, for example, 0.5 mm or more and 3 mm or less. If the average thickness of the support 40 is less than the above lower limit, the strength of the abrasive 2 may be insufficient. On the other hand, when the average thickness of the support 40 exceeds the above-mentioned upper limit, there is a possibility that the support 40 may not be easily attached to the polishing apparatus, or the flexibility of the support 40 may be insufficient.

The second adhesive layer 31 can use the same adhesive as the adhesive layer 30. Further, the second adhesive layer 31 can have the same average thickness as the adhesive layer 30.

Hereinafter, the present invention will be described in more detail by way of examples and comparative examples, but the present invention is not limited to the following examples.

Example 1
Diamond abrasive grains (“SCMD-C12-22” from Sino Crystal Diamond, average particle diameter 16 μm), alumina as filler (Al ₂ O ₃ , “LA 4000” from Pacific Random Co., Ltd., average particle diameter 4 μm), An epoxy resin ("JER 828" from Mitsubishi Chemical Corporation) as a binder is mixed, and adjusted so that the content of the diamond abrasive in the solid content is 3 vol% and the content of the filler is 75 vol%, A coating liquid was obtained.

As a substrate, a substrate (average thickness 500 μm) mainly comprising polycarbonate which is a thermosetting resin was prepared, and was coated on the surface of the substrate by printing using the above-mentioned coating liquid. As a printing pattern, a metal mask having an opening with a circular shape (average area 11.95 mm ² ) with a diameter of 3.9 mm in plan view with an area occupancy of 9% and an average thickness of 350 μm was used. . In addition, the said opening part is a zigzag form. Moreover, the coating amount was adjusted so that the average thickness of a grinding | polishing part might be 350 micrometers. The coating liquid was cured by drying in an oven at 120 ° C. for 16 hours. Thus, the abrasive of Example 1 was obtained.

Example 2
An aluminum sheet (A1050, average thickness 300 μm) was prepared as a substrate, and the same coating liquid as in Example 1 was used to print on the surface of the substrate. As a printing pattern, use is made of a metal mask that has square openings (average area of 6.76 mm ² ) with an area occupancy of 44% and an average thickness of 350 μm with a square shape (average area of 6.76 mm ² ) of 2.6 mm per side in plan view It was. In addition, the said opening part is a zigzag form. Moreover, the coating amount was adjusted so that the average thickness of a grinding | polishing part might be 350 micrometers. The coating liquid was cured by drying in an oven at 120 ° C. for 16 hours. Thus, the abrasive of Example 2 was obtained.

[Example 3]
An aluminum sheet (average thickness: 300 μm) was prepared as a substrate, and was coated on the surface of the substrate using the same coating liquid as in Example 1 by printing. As a printing pattern, a fluorine resin mask having an opening with a circular shape (average area of 28.27 mm ² ) with a diameter of 6 mm in plan view with an area occupancy of 44% and an average thickness of 1000 μm was used. In addition, the said opening part is a zigzag form. Moreover, the coating amount was adjusted so that the average thickness of a grinding | polishing part might be 1000 micrometers. The coating liquid was cured by drying in an oven at 120 ° C. for 16 hours. Thus, the abrasive of Example 3 was obtained.

Example 4
The abrasives of Example 4 were obtained in the same manner as in Example 3 except that a base material having a polycarbonate as a main component (average thickness: 500 μm) was used as the base material.

[Example 5]
A substrate (average thickness: 500 μm) containing polycarbonate as a main component was prepared as a substrate, and the same coating liquid as in Example 1 was used to print on the surface of the substrate. As a printing pattern, a fluorine resin mask having an opening with a square shape (average area 6.76 mm ² ) of 2.6 mm on a side in a plan view with an area occupancy of 44% and an average thickness of 350 μm Using. In addition, the said opening part is a zigzag form. Moreover, the coating amount was adjusted so that the average thickness of a grinding | polishing part might be 350 micrometers. The coating liquid was cured by drying in an oven at 120 ° C. for 16 hours. Thus, the abrasive of Example 5 was obtained.

Comparative Example 1
Prepare a base material mainly composed of polyethylene terephthalate (“Melinex S” manufactured by Teijin DuPont Film Co., Ltd., average thickness 75 μm) as a base material, and using the same coating liquid as in Example 1 The surface was coated by printing. As a printing pattern, use is made of a metal mask having an opening with a square shape (average area: 2.25 mm ² ) with an area occupancy of 36% and an average thickness of 350 μm in plan view. It was. The openings are in the form of regularly arranged block patterns. Moreover, the coating amount was adjusted so that the average thickness of a grinding | polishing part might be 350 micrometers. The coating liquid was cured by drying in an oven at 120 ° C. for 16 hours. Thus, the abrasive of Comparative Example 1 was obtained.

Comparative Example 2
An abrasive of Comparative Example 2 was obtained in the same manner as Comparative Example 1 except that an aluminum sheet (average thickness: 300 μm) was used as a substrate.

Comparative Example 3
A substrate (average thickness: 100 μm) containing polycarbonate as a main component was prepared as a substrate, and the same coating liquid as in Example 1 was used to print on the surface of the substrate. As a printing pattern, a fluorine resin mask having an opening with a circular shape (average area of 28.27 mm ² ) with a diameter of 6 mm in plan view with an area occupancy of 44% and an average thickness of 1000 μm was used. In addition, the said opening part is a zigzag form. Moreover, the coating amount was adjusted so that the average thickness of a grinding | polishing part might be 1000 micrometers. The coating liquid was cured by drying in an oven at 120 ° C. for 16 hours. Thus, the abrasive of Comparative Example 3 was obtained.

Comparative Example 4
A substrate (average thickness: 500 μm) containing polycarbonate as a main component was prepared as a substrate, and the same coating liquid as in Example 1 was used to print on the surface of the substrate. As a printing pattern, a fluorine resin mask having an area occupancy of 34% and having a square shape (average area of 16 mm ² ) having a square shape (average area of 16 mm ² ) having a side of 4 mm in plan view was used. The openings are in the form of regularly arranged block patterns. Moreover, the coating amount was adjusted so that the average thickness of a grinding | polishing part might be 350 micrometers. The coating liquid was cured by drying in an oven at 120 ° C. for 16 hours. Thus, the abrasive of Comparative Example 4 was obtained.

[Evaluation]
With respect to the abrasives of Examples 1 to 5 and Comparative Examples 1 to 4, evaluations were made based on the following judgment criteria with respect to the curvature of the abrasive, the life of the abrasive, and the difficulty of falling the abraded part. The results are shown in Table 1.

<Curve of Abrasive Material>
The warpage of the abrasive was visually determined according to the following judgment criteria.
A: There is no deformation on the back side of the substrate (the side opposite to the side on which the polishing layer is formed), and no warping is observed.
B: Deformation is observed on the back side of the substrate, but when the abrasive is allowed to stand on the flat surface, it follows the flat surface.
C: Deformation is observed on the back side of the substrate, and warping is observed even if it is allowed to stand on a flat surface.

<Abrasive Life>
The life of the abrasive is considered to be determined by the average thickness of the polishing portion. Therefore, the following judgment criteria were used.
A: The average thickness of the polished portion is 1000 μm or more, and the life is high.
B: The average thickness of the polished portion is 300 μm or more and less than 1000 μm, and the life is slightly short.
C: The average thickness of the polished portion is less than 300 μm, and the life is short.

<It is hard to fall down the polishing part>
It is considered that the difficulty of falling of the polishing portion is determined by the ratio of the height to the area of the top surface of the polishing portion. Specifically, it is considered that the larger the value (area / thickness ratio) obtained by dividing the area of the top surface of the polishing portion by the average thickness, the more difficult it is to fall down. Therefore, the area / thickness ratio was calculated, and the value was used as the following judgment standard.
A: The area / thickness ratio is 0.02 mm ² / μm or more, and the polished portion hardly falls down.
B: area / a thickness ratio 0.015 mm ² / [mu] m or more 0.02mm less than ² / [mu] m, the polishing unit is relatively difficult fall.
C: The area / thickness ratio is less than 0.015 mm ² / μm, and the polished portion tends to fall down.

In Table 1, "PC" is polycarbonate, "PET" is polyethylene terephthalate, and "Al" is an aluminum sheet.

From Table 1, it can be seen that in the abrasives of Examples 1 to 5, it is difficult for the polishing portion to fall down, and the warpage of the base material is suppressed while having a thick and long life of the abrasive layer. On the other hand, in the abrasives of Comparative Example 1 and Comparative Example 3, since the average thickness of the substrate is less than 300 μm, warpage of the substrate occurs. In the abrasive of Comparative Example 2, since the area of the top surface of the polishing portion is less than 6 mm ² , the polishing portion tends to fall down. In the abrasive of Comparative Example 4, since the polishing portions are not arranged in a zigzag manner, the warp of the base occurs.

From the above results, warpage of the base material and polishing part can be achieved by arranging a plurality of polishing parts of the abrasive material in a zigzag manner, setting the area of the top surface of the polishing part to 6 mm ² or more, and setting the average thickness of the substrate to 300 μm or more. It is understood that the ease of falling down is suppressed, and an abrasive having an average thickness of 300 μm or more and a long life and an excellent polishing rate can be obtained.

The polishing material of the present invention can thicken the polishing portion while suppressing the decrease in the polishing rate. Therefore, the abrasive of the present invention has a long life.

1, 2 Abrasive material 10 Substrate 20 Abrasive layer 20a Abrasive portion 20b Groove 21 Abrasive particle 22 Binder 30 Adhesive layer 31 Second adhesive layer 40 Support

Claims

An abrasive comprising: a substrate; and an abrasive layer laminated on the surface side of the substrate and containing an abrasive and a binder,
The polishing layer has a plurality of columnar polishing portions,
The plurality of polishing parts are arranged in a staggered manner,
The average thickness of the polishing portion is 300 μm or more,
The area of the top surface of the polishing portion is 6 mm 2 or more,
The abrasives whose average thickness of the above-mentioned substrate is 300 micrometers or more and 3000 micrometers or less.
The abrasive according to claim 1, wherein the ratio of the average thickness of the polishing portion to the average thickness of the substrate is 0.7 or more and 4 or less.
Abrasive material according to claim 1 or claim 2 the area of the top surface value obtained by dividing the average thickness is 0.015 mm 2 / [mu] m or more 0.04 mm 2 / [mu] m or less of the polishing unit.
The area of the top surface of the polishing portion is 100 mm 2 or less,
The abrasive according to any one of claims 1 to 3, wherein an average thickness of the polishing portion is 5000 μm or less.
The abrasive according to any one of claims 1 to 4, wherein the binder contains a thermosetting resin as a main component.