CN109968187A - Grind the manufacturing method and grinding material of material - Google Patents
Grind the manufacturing method and grinding material of material Download PDFInfo
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- CN109968187A CN109968187A CN201811589757.3A CN201811589757A CN109968187A CN 109968187 A CN109968187 A CN 109968187A CN 201811589757 A CN201811589757 A CN 201811589757A CN 109968187 A CN109968187 A CN 109968187A
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- grinding
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- grinding layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
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Abstract
The purpose of the present invention is to provide a kind of manufacturing method for grinding material and grinding materials, even if the grinding material thickens grinding layer, the homogenieity on thickness direction is also guaranteed, and can improve the service life while the excellent grinding rate of maintenance and planarization precision.The present invention is a kind of manufacturing method for grinding material, and the grinding material includes substrate；And the surface side laminated on the substrate and grinding layer comprising abrasive grains, filler and adhesive, the manufacturing method of the grinding material includes: preparation step, and preparation includes the grinding layer composition of abrasive grains, filler and adhesive；Grinding layer is coated on the surface of substrate by applying step with composition；And heating stepses, the grinding layer after applying step is heated with composition, in preparation step, total content of abrasive grains and filler in the solid component of grinding layer composition is set as 60 volume % or more and 85 volume % or less.
Description
Technical field
The present invention relates to a kind of manufacturing method for grinding material and grinding materials.
Background technique
In recent years, the precise treatment of the electronic equipments such as hard disk (hard disk) is being promoted.For the base of such electronic equipment
Plate material, it is contemplated that the rigidity, impact resistance and heat resistance of miniaturization or slimming can be corresponded to, glass, sapphire etc. can be used.
Usually using the grinding material of fixed abrasive grains in the processing of such substrate.
Grinding rate is required to the grinding material and damages few planarization precision.As grinding rate and planarization precision
Excellent grinding material, such as propose the grinding material (International Publication No. with the grinding layer for being dispersed with abrasive grains and filler
No. 2016/203914 bulletin).The existing grinding material is by utilizing abrasive grains and filler to the hardness and abrasion loss of grinding layer
Be adjusted and reached excellent grinding rate and planarization precision and deposit.
In addition, it is expected long lifetime to grinding material.In the existing grinding material, grinding layer can be worn away, therefore the longevity
Life is mainly determined by the thickness of grinding layer.Therefore, the method for thickening grinding layer is considered in order to extend the service life of grinding material.?
In the existing grinding material, grinding layer can for example be made by print process.In its making step, can be by that will print in
The mask used is set as the thick mask of SUS to thicken grinding layer.
But in the grinding layer thickened in this way, the homogenieity on thickness direction is reduced, in the thickness side of grinding layer
The part for being easy abrasion is generated upwards, it is difficult to obtain the desired service life.In addition, due to the inhomogeneity on the thickness direction,
Also it is easy to produce such as abrasion speed is in the central portion of grinding layer and end difference inhomogeneity in face.Therefore, in grinding layer
Face in easy abrasion part generate recess portion, glass substrate etc. be ground body planarization precision be deteriorated.In order to inhibit this
It planarizes precision to be deteriorated, frequent progress is needed to modify (dress) operation.So as, if thickening grinding layer, planarize precision or
Grinding efficiency is easily reduced, and therefore, it is difficult to the thickness of grinding layer is set as 1000 μm or more.
[existing technical literature]
[patent document]
No. 2016/203914 bulletin of [patent document 1] International Publication No.
Summary of the invention
[problem to be solved by the invention]
The present invention is formed in view of such unfavorable condition, and its purpose is to provide a kind of manufacturing methods and grinding for grinding material
Material, even if the grinding material thickens grinding layer, the homogenieity on thickness direction is also guaranteed, and can maintain excellent grinding speed
The service life is improved while rate and planarization precision.
[technical means to solve problem]
The present inventor et al. has carried out the inhomogeneity of the grinding layer generated when thickening grinding layer to make great efforts research, as a result sentences
Bright, the reason of generating the inhomogeneity, is: because making heat drying when grinding layer, grinding layer composition by print process
Contained in abrasive grains or filler be biased to exist in a thickness direction.Moreover, the inventors of the present invention people has found, the abrasive grains or fill out
Fill agent deviation in a thickness direction exist can by extend at normal temperature to grinding layer with the time that composition is dried come
Inhibit, so as to complete the present invention.
That is, in order to solve the problem and make invention be it is a kind of grind material manufacturing method, the grinding material includes base
Material；And the surface side laminated on the substrate and grinding layer comprising abrasive grains, filler and adhesive, the system of the grinding material
The method of making includes: preparation step, and preparation includes the grinding layer composition of abrasive grains, filler and adhesive；Applying step, will
The grinding layer is coated on the surface of the substrate with composition；And heating stepses, to the grinding layer after the applying step
It is heated with composition, in the preparation step, by the abrasive grains and filling in the solid component of grinding layer composition
Total content of agent is set as 60 volume % or more and 85 volume % hereinafter, the heating stepses include pre-drying step, with room temperature
Grinding layer is dried with composition for lower 30 minutes or more conditions；Thermal dehydration step is right after the pre-drying step
The moisture of grinding layer composition carries out thermal dehydration；And heat hardening step, to grinding after the thermal dehydration step
Layer carries out heat hardening with composition.
The manufacturing method of the grinding material has pre-drying step, and the pre-drying step is in heating stepses, initially normal
Total content of abrasive grains and filler in solid component is carried out for upper limit grinding layer below with composition under temperature
Lower limit predrying more than time.By the pre-drying step, abrasive grains or filler can inhibit in the thickness of grinding layer
It is biased to exist on direction.In addition, by by total content of abrasive grains and filler in solid component be set as the lower limit with
On, grinding layer is moderately worn away.The abrasive grains that passivation is produced because of the abrasion are removed because falling off, and new abrasive grains are ground certainly
It grinds in layer and exposes to the surface of grinding layer, therefore excellent grinding rate can be maintained.Therefore, by using the manufacture of the grinding material
Method can manufacture following grinding material: even if thickening grinding layer, the homogenieity on thickness direction is also guaranteed, and is remaining excellent
The service life is improved while different grinding rate and planarization precision.
In the applying step, the average thickness of grinding layer can be made to become 1000 μm or more of mode to the grinding
The coating amount of layer composition is adjusted.By to make the average thickness of grinding layer become the mode of the lower limit or more to painting
Deposited amount is adjusted, and can further improve the service life of grinding material.In addition, passing through the manufacturing method of the grinding material, ground even if thickening
Layer is ground, the homogenieity on thickness direction is also guaranteed, therefore can maintain excellent grinding rate and planarization precision.
In the preparation step, the abrasion loss of the Taber abrasion test of the grinding layer can be made to become 0.03g or more
And 0.15g is hereinafter, make on the thickness direction of grinding layer obtained by the every 500 μm of measurements, abrasion loss of Taber abrasion test most
The difference of big value and minimum value becomes 0.080g mode below, is adjusted to the content of abrasive grains and filler.By that will grind
The abrasion loss of mill layer is set as in the range, and grinding rate and planarization precision can be improved.In addition, by will be in the thickness of grinding layer
Obtained by the every 500 μm of measurements, difference of the maxima and minima of abrasion loss is set as the upper limit hereinafter, thickness direction on degree direction
On homogenieity further increase, therefore stable grinding can be carried out without continually carrying out dressing operation.
The abrasive grains can be diamond (diamond) abrasive grains.Diamond lap grain and other abrasive grains are comparably firmly
Matter.Therefore, abrasive power improves and the abrasive grains are set as diamond lap grain, can further improve grinding rate.
Another invention made in order to solve the problem is a kind of grinding material, including substrate；And laminated on the substrate
Surface side and include abrasive grains, filler and adhesive grinding layer, wherein abrasive grains and filler in the grinding layer
Total content be 60 volume % or more and 85 volume % hereinafter, the average thickness of the grinding layer is 1000 μm or more, it is described
The abrasion loss of the Taber abrasion test of grinding layer be 0.03g or more and 0.15g hereinafter, on the thickness direction of grinding layer every 500 μ
Obtained by the m measurement, difference of the maxima and minima of the abrasion loss of Taber abrasion test is 0.080g or less.
Total content of abrasive grains and filler in the grinding layer is set as the lower limit or more by the grinding material, and will
The abrasion loss of grinding layer is set as in the range, therefore grinding rate and planarization precision are excellent.In addition, the grinding material will be described
Total content of abrasive grains and filler in grinding layer is set as the upper limit hereinafter, and will be every on the thickness direction of grinding layer
Obtained by the 500 μm of measurements, difference of the maxima and minima of abrasion loss is set as the upper limit hereinafter, the therefore homogenieity of grinding layer
Height, and then the average thickness of grinding layer is the lower limit or more, therefore the service life is long.
Herein, so-called " room temperature " is to say the especially not cold also not temperature of extreme heat, refers to 5 DEG C or more and 35 DEG C of temperature below
Degree, preferably 15 DEG C or more and 30 DEG C of temperature below.In addition, " abrasion loss in Taber abrasion test " is to obtain as follows
The value obtained: preparing test film, using taber abrader, is made with the condition of abrasion wheel H-18, loading 4.9N (500gf) described
Test film rotates 320 turns, measures the of poor quality of the test film of 320 turns of front and backs, and resulting value area is scaled diameter 104mm
The of poor quality of test film form.Furthermore it is so-called " on the thickness direction of grinding layer it is every 500 μm measurement obtained by, Taber Abrasion
The abrasion loss of test " refers to abrasion loss obtained by measurement as follows: grinding from surface in a thickness direction to grinding layer
500 μm, 1000 μm, 1500 μm ..., the Taber abrasion test is carried out on the ground position and be measured and
?.
[The effect of invention]
As described above, it the manufacturing method of grinding material through the invention and the grinding material that manufactures and of the invention grinds
It grinds in material, the homogenieity on the thickness direction of grinding layer is guaranteed, therefore can maintain excellent grinding rate and planarization
The service life is improved while precision.
Detailed description of the invention
Fig. 1 is the schematic partial plan view for indicating the grinding material of one embodiment of the present invention.
Fig. 2 is the schematic partial cross-sectional view at the line A-A of Fig. 1.
Fig. 3 is the flow chart for indicating the manufacturing method of grinding material of one embodiment of the present invention.
Fig. 4 is the flow chart for indicating the heating stepses of Fig. 3.
Fig. 5 is the schematic partial cross-sectional view for indicating the grinding material of the embodiment different from Fig. 2.
[explanation of symbol]
1,2: grinding material
10: substrate
20: grinding layer
21: abrasive grains
22: filler
23: adhesive
24: slot
25: convex shaped part
30: following layer
31: the 2 following layers
40: support
Specific embodiment
Hereinafter, suitably referring to attached drawing one embodiment of the present invention to be described in detail.
[grinding material]
Fig. 1 and grinding material 1 shown in Fig. 2 include: substrate 10；Grinding layer 20, laminated on the surface side of the substrate 10；And
Following layer 30, laminated on the back side of the substrate 10.The grinding material 1 is for example as the fixed grinding to carry out substrate processing
Grain grinding material come using.
< substrate >
Substrate 10 is to support the plate of grinding layer 20 or the component of sheet.
The principal component of substrate 10 is not particularly limited, and can be enumerated: polyethylene terephthalate (polyethylene
Terephthalate, PET), polypropylene (polypropylene, PP), polyethylene (polyethylene, PE), polyimides
(polyimide, PI), polyethylene naphthalate (polyethylene naphthalate, PEN), aromatic polyamides, aluminium,
Copper etc..Wherein it is preferred that the good PET of followability and aluminium with grinding layer 20.In addition, can also be carried out to the surface of substrate 10
Chemical treatment, sided corona treatment, primary coat processing etc. improve the processing of followability.Furthermore so-called " principal component " refers to that content is most
Ingredient, and refer to that content is preferably the ingredient of 50 mass % or more, more preferably 90 mass % or more.
In addition, substrate 10 can have flexible or ductility.There is flexible or ductility, the grinding by substrate 10 as so
Material 1 follows the surface shape for being ground body, and abradant surface increases with the contact area for being ground body, therefore grinding rate is further
It improves.As such material with flexible substrate 10, such as PET or PI can be enumerated etc..In addition, as with ductility
The material of substrate 10 can enumerate aluminium or copper etc..
The form and dimension of the substrate 10 is not particularly limited, such as can be set as a line is 140mm or more and 160mm
It is below square or outer diameter is 200mm or more and 2022mm or less and internal diameter is 100mm or more and 658mm circle below
It is cyclic annular.In addition, can also be that the multiple substrates 10 being juxtaposed in plane are made of what single support was supported.
The average thickness of the substrate 10 is not particularly limited, such as can be set as 75 μm or more and 3mm or less.If the base
The average thickness of material 10 is less than the lower limit, then has the intensity of the grinding material 1 or the anxiety of flatness deficiency.On the contrary, if the base
The average thickness of material 10 is more than the upper limit, then has the grinding material 1 to become blocked up and be difficult to the anxiety operated.
< grinding layer >
Grinding layer 20 includes abrasive grains 21, filler 22 and adhesive 23.Grinding layer 20 is made of single layer.That is, grinding layer
The 20 not multiple layers of lamination and winners in a thickness direction, therefore the boundary of layer is not present, grinding layer 20 will not be due to layer boundary
Discontinuously.Therefore, the homogeneity of grinding layer 20 improves.
(abrasive grains)
As abrasive grains 21, can enumerate: diamond lap grain, alumina lap grain, Silica abrasive grain, cerium oxide are ground
Abrasive grain, silicon carbide abrasive grains etc..Wherein it is preferred that than other abrasive grains more hard diamond lap grain.By being ground described
Abrasive grain 21 is set as diamond lap grain and abrasive power improves, and can further improve grinding rate.
It can be monocrystalline be also polycrystalline furthermore as the diamond of diamond lap grain, it in addition can also be for through Ni coating etc.
The diamond of processing.Wherein it is preferred that single-crystal diamond and polycrystalline diamond.Single-crystal diamond more hard than other diamonds
And grinding force is high.In addition, polycrystalline diamond is easy to constitute polycrystalline crystallite unit and rive and be difficult to happen passivation, so even
It is ground for a long time, the reduction of grinding rate is also small.
The average grain diameter of abrasive grains 21 is the viewpoint according to the surface roughness for being ground body after grinding rate and grinding
And it suitably selects.The lower limit of the average grain diameter of abrasive grains 21 is preferably 2 μm, and more preferably 10 μm, and then preferably 15 μm.It is another
Aspect, the upper limit of the average grain diameter of abrasive grains 21 are preferably 50 μm, and more preferably 45 μm, and then preferably 30 μm.If abrasive grains
21 average grain diameter is less than the lower limit, then has the abrasive power of the grinding material 1 insufficient, the anxiety of grinding rate reduction.On the contrary, if grinding
The average grain diameter of abrasive grain 21 is more than the upper limit, then has the anxiety of grinding precision reduction.Herein, so-called " average grain diameter " refers to utilization
50% value (50% partial size, D50) of the cumulative grain-size distribution curve of volume reference obtained by the measurement such as laser diffractometry.
The lower limit of the content of abrasive grains 21 in grinding layer 20 is preferably 3 volume %, more preferably 4 volume %, Jin Eryou
It is selected as 8 volume %.On the other hand, the upper limit of the content of the abrasive grains 21 is preferably 55 volume %, more preferably 45 volume %,
And then preferably 35 volume %.If the content of the abrasive grains 21 is less than the lower limit, there is the abrasive power of grinding layer 20 insufficient
Anxiety.On the contrary, thering is grinding layer 20 to cannot keep the anxiety of abrasive grains 21 if the content of abrasive grains 21 is more than the upper limit.
(filler)
Filler 22 improves the elasticity modulus of adhesive 23, therefore can easily control the abrasion of grinding layer 20.Pass through control
The abrasion of grinding layer 20 processed can make the passivation of abrasive grains 21 and falling off with timing (timing) production of relative close for abrasive grains 21
It is raw.The abrasive grains 21 for producing passivation as a result, are removed because falling off, and are exposed in new 21 self-grind layer 20 of abrasive grains to grinding
The surface of layer 20, thus can inhibit the reduction of grinding rate.
It as filler 22, such as can enumerate: aluminium oxide, silica, cerium oxide, magnesia, zirconium oxide, titanium oxide etc.
The composite oxides such as oxide and silica-alumina, silica-zirconium oxide, silica-magnesia.They can be single
Solely uses or be optionally applied in combination two or more.Wherein it is preferred that can get the aluminium oxide of high abrasive power.
The average grain diameter of filler 22 also depends on the average grain diameter of abrasive grains 21, but under the average grain diameter of filler 22
Preferably 0.01 μm, more preferably 2 μm of limit.On the other hand, the upper limit of the average grain diameter of filler 22 is preferably 20 μm, more preferably
It is 15 μm.If the average grain diameter of filler 22 is less than the lower limit, there is the springform of adhesive 23 brought by filler 22
Amount increases the insufficient anxiety of effect.On the other hand, if the average grain diameter of filler 22 is more than the upper limit, there is the harm of filler 22
Hinder the anxiety of the abrasive power of abrasive grains 21.
The content of filler 22 in grinding layer 20 also depends on the content of abrasive grains 21, but under the content of filler 22
Limit is preferably 15 volume %, more preferably 30 volume %.On the other hand, the upper limit of the content of filler 22 is preferably 75 bodies
Product %, more preferably 60 volume %.If the content of filler 22 is less than the lower limit, there is adhesive brought by filler 22
23 elasticity modulus increases the insufficient anxiety of effect.On the contrary, having filler 22 if the content of filler 22 is more than the upper limit
Interfere the anxiety of the abrasive power of abrasive grains 21.
The lower limit of total content of abrasive grains 21 and filler 22 in grinding layer 20 is preferably 60 volume %, more preferably
70 volume %, and then preferably 77 volume %.On the other hand, the upper limit of total content is preferably 85 volume %, more preferably
For 80 volume %.If total content is less than the lower limit, using adhesive 23, abrasive grains 21 and filler 22 are firm
Admittedly it is fixed, grinding layer 20 is hardly worn away.Therefore, the abrasive grains 21 for producing passivation can not be removed because falling off,
There is the anxiety that grinding rate is easily reduced.On the contrary, being difficult to inhibit abrasive grains 21, filling out if total content is more than the upper limit
It fills deviation of the agent 22 on the thickness direction of grinding layer 20 to exist, there is grinding layer 20 to become inhomogenous anxiety.
(adhesive)
The principal component of the adhesive 23 of grinding layer 20 is not particularly limited, and can enumerate resin or inorganic matter.
It as the resin, can enumerate: polyurethanes, polyphenol, epoxy resin, polyester, cellulose, ethylene copolymer
Object, polyvinyl acetal, polyacrylic acid and its salt, polyacrylate, polyvinyl alcohol, polyvinyl chloride, polyvinyl acetate, polyamides
The resins such as amine.Wherein it is preferred that it is easy to ensure that the polyacrylate of the good adhesion of substrate 10, epoxy resin, polyester and
Polyurethanes.Furthermore the resin can also be crosslinked at least partially.
In addition, can be enumerated as the inorganic matter: silicate, phosphate, polyvalent metal alkoxide etc..It is wherein preferred
It is the high silicate of abrasive grains retentivity.As such silicate, sodium metasilicate or potassium silicate etc. can be enumerated.
The principal component of adhesive 23 can be inorganic matter.It, can by the way that the principal component of adhesive 23 is set as inorganic matter as so
The retentivity of abrasive grains 21 is improved, abrasive grains 21 is inhibited to fall off before passivation.Therefore, grinding force is further improved.
Furthermore in adhesive 23, dispersing agent, coupling agent, surfactant, lubrication can also be contained according to purpose and suitably
Various assistants and additives such as agent, defoaming agent, colorant etc..
In addition, grinding layer 20 has the multiple convex shaped parts 25 divided by slot 24 on its surface.Slot 24 is in grinding layer 20
Surface, which is matched, is set as equally spaced clathrate.That is, the shape of the multiple convex shaped part 25 is the square pattern-like of systematicness arrangement.Separately
It outside, by the bottom surface for the slot 24 that convex shaped part 25 is divided is made of the surface of substrate 10.
The lower limit of the mean breadth of slot 24 is preferably 0.3mm, more preferably 0.5mm.On the other hand, the mean breadth of slot 24
The upper limit be preferably 10mm, more preferably 8mm.If the mean breadth of slot 24 is less than the lower limit, has and ground caused by grinding
The anxiety of milling blocking in slot 24.On the contrary, being ground body when grinding if the mean breadth of slot 24 is more than the upper limit and being easy to fall
Enter in slot 24, therefore is ground the anxiety for generating damage on body.
The lower limit of the average area of convex shaped part 25 is preferably 1mm2, more preferably 2mm2.On the other hand, convex shaped part 25 is flat
The upper limit of equal area is preferably 150mm2, more preferably 130mm2.If the average area of convex shaped part 25 is less than the lower limit, have
Anxiety of the convex shaped part 25 from 10 removing of substrate.On the contrary, being ground if the average area of convex shaped part 25 is more than the upper limit in grinding
20 pairs of contact area for being ground body of layer become larger, therefore have the anxiety of grinding rate reduction due to frictional resistance.
The lower limit of multiple convex shaped parts 25 area ratio/occupancy ratio whole relative to grinding layer 20 is preferably 5%, more preferably
10%.On the other hand, the upper limit of the area ratio/occupancy ratio of the convex shaped part 25 is preferably 60%, and more preferably 55%.If described convex
The area ratio/occupancy ratio in shape portion 25 is less than the lower limit, then the pressure concentrations applied when grinding in narrow convex shaped part 25, because
This has anxiety of the convex shaped part 25 from 10 removing of substrate.On the contrary, if the area ratio/occupancy ratio of the convex shaped part 25 is more than the upper limit,
Grinding layer 20 becomes larger to the contact area for being ground body when grinding, therefore has the anxiety of grinding rate reduction due to frictional resistance.Again
Person, in the case where grinding layer has slot, " area of grinding layer entirety " is the concept of the also area including the slot.
The lower limit of the average thickness (the only average thickness of 25 part of convex shaped part) of grinding layer 20 is 1000 μm, more preferably
1500 μm, and then preferably 2000 μm.On the other hand, the upper limit of the average thickness of grinding layer 20 is preferably 4000 μm, more preferably
It is 3500 μm, and then preferably 3200 μm.If the average thickness of grinding layer 20 is less than the lower limit, the durability of grinding layer 20
Deficiency, the anxiety for thering is the service life of the grinding material 1 to shorten.On the contrary, having if the average thickness of grinding layer 20 is more than the upper limit because grinding
The torque generated when mill be applied to the load at the interface of grinding layer 20 and substrate 10 and grinding layer 20 is easy the anxiety collapsed, or has
The anxiety of the manufacturing cost increase of the grinding material 1.
The lower limit of the abrasion loss of the Taber abrasion test of grinding layer 20 is 0.03g, more preferably 0.06g.On the other hand, institute
The upper limit for stating abrasion loss is 0.15g, more preferably 0.12g.If the abrasion loss is less than the lower limit, grinding for passivation is produced
Abrasive grain 21 can not be removed because falling off, the anxiety for having grinding rate to be easily reduced.On the contrary, if the abrasion loss is more than on described
Limit, then the abrasion of grinding layer 20 are too fast, the anxiety for having the service life of the grinding material 1 to shorten.
Obtained by the every 500 μm of measurements, maximum value of the abrasion loss of Taber abrasion test on the thickness direction of grinding layer 20
The upper limit with the difference of minimum value is 0.080g, more preferably 0.060g.If the abrasion loss difference is more than the upper limit, this expression
There are inhomogenous parts in grinding layer 20, upon grinding, are being easy abrasion in the face of the grinding layer 20 of the grinding material 1
Part generates recess portion, there is the anxiety for the planarization precision variation for being ground body.On the other hand, the lower limit of the abrasion loss difference has no spy
It does not limit, can be 0g, but the abrasion loss difference is usually 0.001g or more.
< following layer >
Following layer 30 is to fix the grinding material on the support being installed on grinding device to support the grinding material 1
1 layer.
Solid used in the following layer 30 is not particularly limited, such as can be enumerated: response type solid, moment connect
Agent, hot melt solid, as sticker for the solid that can be pasted again etc..
Solid used in the following layer 30 is preferably sticker.By using sticker as in following layer 30
Used solid, can self-supporting body peel the grinding material 1 and paste again, therefore the grinding material 1 easy to accomplish and support
Recycling.Such sticker is not particularly limited, such as can be enumerated: acrylic acid series sticker, acrylic acid-rubber series adhesion
Synthetic rubber system sticker, silicone-based sticker, the polyurethanes systems such as agent, natural rubber system sticker, butyl rubber system
Sticker etc..
The lower limit of the average thickness of following layer 30 is preferably 0.05mm, more preferably 0.1mm.On the other hand, following layer 30
The upper limit of average thickness be preferably 0.3mm, more preferably 0.2mm.If the average thickness of following layer 30 is less than the lower limit,
There are adhesion deficiency, the anxiety of the 1 self-supporting body removing of grinding material.On the contrary, if the average thickness of following layer 30 is more than the upper limit,
Then there is the workability such as causing obstacle when the grinding material 1 is cut into required shape because of the thickness of following layer 30 to reduce it
Anxiety.
< advantage >
Total content of abrasive grains 21 and filler 22 in grinding layer 20 is set as 60 volume % or more by the grinding material 1,
And the abrasion loss of grinding layer 20 is set as 0.03g or more and 0.15g hereinafter, therefore grinding rate and planarization precision are excellent.Separately
Outside, which by total content of abrasive grains 21 and filler 22 in grinding layer 20 is set as 85 volume % hereinafter, and will be
On the thickness direction of grinding layer 20 obtained by the every 500 μm of measurements, difference of the maxima and minima of abrasion loss be set as 0.080g with
Under, therefore the homogenieity of grinding layer 20 is high, and then the average thickness of grinding layer 20 is 1000 μm or more, therefore the service life is long.
[manufacturing method of grinding material]
It is shown in Fig. 3 grinding material manufacturing method mainly include preparation step S1, applying step S2, heating stepses S3, with
And following layer attaches step S4.By using the manufacturing method of the grinding material, such as following grinding material 1: the grinding can be manufactured
Material 1 includes Fig. 1 and substrate shown in Fig. 2 10；And laminated on the substrate 10 surface side and include abrasive grains 21, filler 22
And the grinding layer 20 of adhesive 23.
< preparation step >
In preparation step S1, preparation includes the grinding layer composition of abrasive grains 21, filler 22 and adhesive 23.Tool
For body, prepare to use composition as coating comprising the grinding layer of abrasive grains 21, the forming material of filler 22 and adhesive 23
Liquid.In addition, in preparation step S1, by the conjunction of abrasive grains 21 and filler 22 in the solid component of grinding layer composition
Furthermore meter content be set as 60 volume % or more and 85 volume % hereinafter, abrasive grains 21 and filler 22 in solid component contain
Amount respectively becomes the abrasive grains 21 of the grinding layer 20 after manufacture and the content of filler 22.
In addition, diluent is not added in coating liquid preferably in the manufacturing method of the grinding material.By so as
Diluent is not added in coating liquid, it can be ensured that certain viscosity, therefore can inhibit that in the coating of grinding layer 20 quality is big to grind
Abrasive grain 21 and filler 22 are easy the case where being stranded in lower section.Therefore, the homogeneity of grinding layer 20 improves.
In addition, the abrasion loss of the Taber abrasion test of grinding layer 20 and every 500 μm of surveys on the thickness direction of grinding layer 20
The difference of obtained by the fixed, maxima and minima of the abrasion loss of Taber abrasion test mainly can be by the abrasive grains in coating liquid
21 and the content of filler 22 could be adjusted to control.Therefore, in preparation step S1, the abrasion loss and described can be made
The mode that abrasion loss difference becomes in desired range is adjusted the content of abrasive grains 21 and filler 22.
The lower limit of the adjusting range of the abrasion loss in preparation step S1 is preferably 0.03g, more preferably 0.06g.Separately
On the one hand, the upper limit of the adjusting range of the abrasion loss is preferably 0.15g, more preferably 0.12g.By by the mill of grinding layer 20
Consumption is set as in the range, and grinding rate and planarization precision can be improved.
The upper limit of the adjusting range of abrasion loss difference in preparation step S1 is preferably 0.080g, more preferably
0.060g.By making obtained by the every 500 μm of measurements, maxima and minima of abrasion loss on the thickness direction of grinding layer 20
Difference becomes the upper limit hereinafter, the homogenieity on thickness direction further increases, therefore can carry out stable grinding without frequency
Dressing operation is carried out numerously.On the other hand, the lower limit of the adjusting range of the abrasion loss difference is not particularly limited, and can be 0g, but
The abrasion loss difference is usually 0.001g or more.
< applying step >
In applying step S2, the grinding layer is coated on to the surface of substrate 10 with composition.Specifically, using
The coating liquid prepared in preparation step S1 is formed more including being divided by slot 24 on the surface of substrate 10 using print process
The grinding layer 20 of a convex shaped part 25.In order to form the slot 24, preparation has the mask of shape corresponding with the shape of slot 24, every
The mask print the coating liquid.As the mode of printing, such as screen painting, metal mask printing can be used etc..
The mask of the printing is preferably the mask of SUS.The mask of SUS can thicken mask, therefore can be easily
Make the big grinding layer 20 of average thickness.
The thickness of grinding layer 20 can mainly be adjusted using coating amount.Therefore, in applying step S2, can make to grind
The average thickness of layer 20 becomes the mode pair of 1000 μm or more, more preferably 1500 μm or more and then preferably 2000 μm or more
The coating amount of grinding layer composition is adjusted.By so that the average thickness of grinding layer 20 becomes the lower limit or more
Mode coating amount is adjusted, can further improve grinding material 1 service life.In addition, pass through the manufacturing method of the grinding material,
Even if thickening grinding layer 20, the homogenieity on thickness direction is also guaranteed, therefore can maintain excellent grinding rate and flat
Change precision.On the other hand, the upper limit of the average thickness of the grinding layer 20 adjusted using applying step S2 is not particularly limited, just
For the viewpoint of manufacturing cost, preferably 4000 μm, more preferably 3500 μm, and then preferably 3200 μm.
< heating stepses >
In heating stepses S3, the grinding layer after applying step S2 is heated with composition.Heating stepses S3 such as Fig. 4
It is shown, there is pre-drying step S31, thermal dehydration step S32 and heat hardening step S33.
(pre-drying step)
In pre-drying step S31, at normal temperature, i.e. especially not cold also grinding layer is not combined at a temperature of extreme heat
Object is dried.The present inventor et al. knows in pre-drying step S31, by carrying out the predrying of appropriate time, grinding
Layer is ensured with the uniform dispersion of abrasive grains 21 in composition and filler 22, even if being heated thereafter, is also ensured that
The homogeneity of grinding layer 20.
The drying temperature of pre-drying step S31 is not particularly limited as long as room temperature, but pre-drying step S31's is dry
The lower limit of dry temperature is 5 DEG C, more preferably 15 DEG C.On the other hand, the upper limit of the drying temperature of pre-drying step S31 is 35 DEG C,
More preferably 30 DEG C.If the drying temperature of pre-drying step S31 is less than the lower limit, grinding layer is not sufficiently dry with composition
It is dry, there is the anxiety of the homogeneity reduction of grinding layer 20.On the contrary, if the drying temperature of pre-drying step S31 is more than the upper limit, because
Convection current caused by heat etc. and abrasive grains 21 and filler 22 are easy to be biased to exist in grinding layer composition, therefore have grinding
The anxiety of the homogeneity reduction of layer 20.
The lower limit of the drying time of pre-drying step S31 is 30 minutes, more preferably 60 minutes, and then preferably 90 points
Clock.On the other hand, the upper limit of the drying time of pre-drying step S31 is not particularly limited, and preferably 200 minutes, more preferably
150 minutes.If the drying time of pre-drying step S31 is less than the lower limit, grinding layer is not sufficiently dry with composition, grinds
Grind the anxiety of the homogeneity reduction of layer 20.On the contrary, thering is manufacture to imitate if the drying time of pre-drying step S31 is more than the upper limit
The anxiety of rate reduction.
(thermal dehydration step)
In thermal dehydration step S32, heating is carried out to the moisture of grinding layer composition after pre-drying step S31 and is taken off
Water.It, can heat hardening step after this by removing moisture removal with composition using the thermal dehydration step S32 self-grind layer
Harden while maintaining the homogenieity of grinding layer 20 grinding layer 20 in S33.
The lower limit of the heating temperature of thermal dehydration step S32 is preferably 70 DEG C, and more preferably 75 DEG C.On the other hand, it heats
The upper limit of the heating temperature of dehydration S32 is preferably 90 DEG C, and more preferably 85 DEG C.If the heating temperature of thermal dehydration step S32
Degree is less than the lower limit, then the dehydration of self-grind layer composition is insufficient, there is the anxiety of the homogeneity reduction of grinding layer 20.Phase
Instead, if the heating temperature of thermal dehydration step S32 is more than the upper limit, in grinding layer group due tos convection current caused by the heat etc.
It closes abrasive grains 21 and filler 22 in object to be easy to be biased to exist, therefore has the anxiety of the homogeneity reduction of grinding layer 20.
The lower limit of the heating time of thermal dehydration step S32 is preferably 30 minutes, and more preferably 60 minutes.If thermal dehydration
The heating time of step S32 is less than the lower limit, then the dehydration of self-grind layer composition is insufficient, there is the uniform of grinding layer 20
The anxiety of property reduction.On the other hand, the upper limit of the heating time of thermal dehydration step S32 is not particularly limited, with regard to manufacture efficiency
For viewpoint, the heating time of thermal dehydration step S32 is typically set to 2 hours or less.
(heat hardening step)
In heat hardening step S33, heat hardening is carried out with composition to grinding layer after thermal dehydration step S32.
Grinding layer 20 is formed by the heat hardening.
The lower limit of the heating temperature of heat hardening step S33 is preferably 120 DEG C, and more preferably 140 DEG C.On the other hand, add
The upper limit of the heating temperature of thermal cure stage S33 is preferably 300 DEG C, and more preferably 200 DEG C.If heat hardening step S33's adds
Hot temperature is less than the lower limit, then grinding layer is not sufficiently hardened with composition, and abrasion loss increases, and has the service life of grinding material 1 to shorten
Anxiety.On the contrary, if the heating temperature of heat hardening step S33 is more than the upper limit, the anxiety for having grinding layer 20 to go bad by heat.
The lower limit of the heating time of heat hardening step S33 is preferably 2 hours, and more preferably 2.5 hours.On the other hand,
The upper limit of the heating time of heat hardening step S33 is preferably 4 hours, and more preferably 3.5 hours.If heat hardening step S33
Heating time be less than the lower limit, then grinding layer is not sufficiently hardened with composition, abrasion loss increase, have grinding material 1 service life
The anxiety to shorten.On the contrary, having the anxiety of manufacture efficiency reduction if the heating time of heat hardening step S33 is more than the upper limit.
< following layer attaches step >
It is attached in step S4 in following layer, in the back side lamination following layer 30 of substrate 10.Specifically, for example will be preparatory
The following layer 30 of the tape shape of formation is attached at the back side of substrate 10.
< advantage >
The manufacturing method of the grinding material have pre-drying step S31, the pre-drying step S31 in heating stepses S3,
With initially at normal temperature, 30 minutes or more conditions to total content of abrasive grains 21 and filler 22 in solid component for 85
Volume % grinding layer below carries out predrying with composition.By pre-drying step S31, abrasive grains 21 or filling can inhibit
Agent 22 is biased to exist on the thickness direction of grinding layer 20.In addition, by by the abrasive grains 21 and filler 22 in solid component
Total content be set as 65 volume % or more, grinding layer 20 is moderately worn away.The abrasive grains 21 of passivation are produced because of the abrasion
It is removed, exposes in new 21 self-grind layer 20 of abrasive grains to the surface of grinding layer 20, therefore can maintain excellent because falling off
Grinding rate.Therefore, by using the manufacturing method of the grinding material, following grinding material can be manufactured: even if thickening grinding layer 20,
Homogenieity on thickness direction is also guaranteed, and improves the longevity while the excellent grinding rate of maintenance and planarization precision
Life.
[other embodiments]
The present invention is not limited to the embodiments, other than the mode, it is possible to implement various changes, improvement
Mode and implement.
In said embodiment, slot is configured to equally spaced clathrate, but the interval of grid and flat shape are not
It is defined in the embodiment.In addition, in said embodiment, the bottom surface of slot is set as the composition on the surface of substrate, but
The average thickness of grinding layer can be less than for the depth of slot, slot does not reach the surface of substrate.
The flat shape of slot can not also be clathrate, such as can also be the duplicate shape of polygonal other than quadrangle, circle
Shape, shape with plurality of parallel lines etc. can also be concentric circles.In addition, the flat shape of slot can also be only to be disposed in one
Striated on direction.
In addition, grinding layer can also be the structure without slot.
In said embodiment, Fig. 1 and grinding material shown in Fig. 2 are manufactured to the manufacturing method of the grinding material is used
Situation is illustrated, but the manufacturing method of the grinding material can be used to be not limited to shown in Fig. 1 and Fig. 2 come the grinding material manufactured
Grinding material, such as grinding material etc. of the average thickness of grinding layer less than 1000 μm can also be manufactured.
In said embodiment, there is the case where following layer to be illustrated grinding material, but following layer and nonessential
Constitutive requirements, can omit.In the case where grinding material without following layer, the following layer patch of the manufacturing method of grinding material is omitted
Attached step.
Alternatively, as shown in figure 5, the grinding material 2 may also comprise: across back side following layer 30 and the support of lamination
40 and the back side laminated on the support 40 the 2nd following layer 31.Include support 40 by the grinding material 2, and is easy
Carry out the operation of the grinding material 2.
It as the principal component of the support 40, can enumerate: the tool such as polypropylene, polyethylene, polytetrafluoroethylene (PTFE), polyvinyl chloride
There are the engineering plastics such as thermoplastic resin or polycarbonate, polyamide, polyethylene terephthalate.By to the support
The principal component of body 40 uses such material, and the support 40 has pliability, which follows the surface shape for being ground body
Shape, abradant surface is easy to contact with body is ground, therefore grinding rate further increases.
The average thickness of the support 40 can for example be set as 0.5mm or more and 3mm or less.If the support 40 is flat
Equal thickness is less than the lower limit, then has the anxiety of the intensity deficiency of the grinding material 2.On the other hand, if the support 40 is averaged
Thickness is more than the upper limit, then has the flexible of the anxiety or the support 40 for being difficult to that the support 40 is installed on to grinding device
The anxiety of property deficiency.
Solid same as following layer 30 can be used in 2nd following layer 31.In addition, the 2nd following layer 31 can be set as with
The same average thickness of following layer 30.
[embodiment]
Hereinafter, enumerate Examples and Comparative Examples come the present invention is described in more detail, but the invention be not limited to
Under embodiment.
[embodiment 1]
Prepare diamond abrasive grains (" LS605FN " of Lance (Lans) company), uses Ji Zhuan limited liability company
" Mai Qike (Microtrac) MT3300EXII " measures average grain diameter.The average grain diameter of the diamond lap grain is 7.5 μm.
Furthermore the type of the diamond of the abrasive grains is the processing diamond being coated with through 55 mass % nickel.
By the diamond lap grain, as the aluminium oxide (Al of filler2O3, Pacific Ocean indigo plant steps on (Pacific Rundum)
" LA1200 " of limited liability company, 12 μm of average grain diameter) and (Fuji's chemistry share is limited as the sodium metasilicate of adhesive
" No. 3 sodium metasilicate " of company) mixed, and with the content of the diamond lap grain in solid component become 5 volume % and
The content of filler is adjusted as the mode of 72.7 volume %, obtains coating liquid.
The aluminium sheet for preparing 300 μm of average thickness utilizes print using the coating liquid as substrate on the surface of the substrate
Brush is applied.As the pattern of printing, use is corresponding with the slot in a manner of it can form the grinding layer of the slot with clathrate
Mask.The shape of specific grinding layer be overlook the square that lower a line is 3mm convex shaped part be regularly arranged made of
Square pattern-like, and the area ratio/occupancy ratio by multiple convex shaped parts relative to grinding layer entirety is set as 36%.Furthermore mask SUS
System adjusts coating amount in such a way that the average thickness of grinding layer becomes 3000 μm.
For coating liquid, after predrying in 120 minutes is carried out under room temperature (25 DEG C), sequentially carry out 80 DEG C at, 1 hour with
On thermal dehydration and 150 DEG C at, 2 hours or more, heat hardening below in 4 hours.
It the use of average thickness is 1mm's in addition, being fixed on the support on grinding device as being supported substrate
Hard vinyl chloride resin plate, by between the back side of the substrate and the surface of the support and back side of the support
Between the platen of aftermentioned grinder, it is bonded respectively with the sticker that average thickness is 130 μm.The sticker uses double-sided adhesive
Band (" #5605HGD " of ponding chemistry limited liability company).
The grinding material of embodiment 1 is obtained in this way.
[embodiment 2]
As filler, using by 3.7 μm of average grain diameter of the aluminium oxide (" DAM- of electrochemical (Denka) limited liability company
03 ") it is mixed in the volume ratio of 1:1 in the aluminium oxide of 12 μm of average grain diameter same as Example 1 and winner, and using to consolidate
The content of diamond lap grain in body ingredient becomes total content of 5 volume % and two kinds of fillers as 72.7 volume %'s
The coating liquid that mode is adjusted obtains the grinding material of embodiment 2 in addition to this in the same manner as example 1.
[embodiment 3]
The predrying condition of coating liquid is set as room temperature (25 DEG C) lower 60 minutes, in addition to this, with same as Example 2
Mode obtains the grinding material of embodiment 3.
[embodiment 4]
Become 71 volume % with the content that the content of the diamond lap grain in solid component becomes 5 volume % and filler
Mode be adjusted and obtain coating liquid, in addition to this, in the same manner as example 1 obtain embodiment 4 grinding material.
[comparative example 1]
The predrying condition of coating liquid is set as room temperature (25 DEG C) lower 15 minutes, in addition to this, with same as Example 1
Mode obtains the grinding material of comparative example 1.
[comparative example 2]
Become 74.8 bodies with the content that the content of the diamond lap grain in solid component becomes 15 volume % and filler
The mode of product % is adjusted and obtains coating liquid, in addition to this, obtains grinding for comparative example 2 in the same manner as example 1
Grind material.
[comparative example 3]
Become 50 volume % with the content that the content of the diamond lap grain in solid component becomes 5 volume % and filler
Mode be adjusted and obtain coating liquid, in addition to this, in the same manner as example 1 obtain comparative example 3 grinding material.
[reference example 1]
Coating amount is adjusted in such a way that the average thickness of grinding layer becomes 1000 μm, in addition to this, with same as Example 1
Mode obtain the grinding material of reference example 1.
[grinding condition]
Using the grinding material obtained in the 1~embodiment of embodiment 4,1~comparative example of comparative example 3 and reference example 1, carry out
The grinding of glass substrate.For the glass substrate, the three pieces soda lime glass that diameter is 6.25cm, specific gravity is 2.4 is used.?
In the grinding, well known twin grinder is used.The carrier of twin grinder is the glass epoxy of thickness 0.4mm.It grinds
Mill is that grinding pressure is set as 150g/cm2, upper platen revolving speed be 60rpm, push disk rotating speed be 90rpm and sun gear turn
Speed is carried out continuously grinding in 5 times 15 minutes under conditions of being 10rpm.At this point, as coolant (coolant), with per minute
120cc supplies " LAP-P-32 " of chemical (Palace Chemical) limited liability company in palace.
[evaluation method]
About the grinding material of the 1~embodiment of embodiment 4,1~comparative example of comparative example 3 and reference example 1, grinding layer is measured
Taber abrasion test abrasion loss, on the thickness direction of grinding layer obtained by every 500 μm of measurements, the mill of Taber abrasion test
The grinding layer after the abrasion speed of grinding layer, the grinding when difference of the maxima and minima of consumption, 100 μm of grinding every to substrate
Flatness.Furthermore each measurement is carried out using following methods.
< abrasion loss >
The abrasion loss of the Taber abrasion test of grinding layer is found out using following measuring method.Firstly, from each grinding material
Cut out the test film of diameter 104mm.Using taber abrader (Taibo instrument (Taber Instrument) company
" MODEL174 "), make test film rotation 320 transfer to make its abrasion to wear away the condition of wheel H-18, loading 4.9N (500gf).
Measurement abrasion front and back test film [g] of poor quality and as abrasion loss.Show the result in " abrasion loss " column of table 1.
< abrasion loss difference >
On the thickness direction of grinding layer obtained by the every 500 μm of measurements, maximum value of the abrasion loss of Taber abrasion test with
The difference of minimum value is found out using following measuring method.For the test film for determining abrasion loss, the sand of #80 is used
Grinding layer is gradually ground 500 μm by paper, measures the abrasion loss of the Taber abrasion test.Specifically, being averaged in grinding layer
With a thickness of in 3000 μm of 1~embodiments of embodiment 4,1~comparative example of comparative example 3,2500 μm, 2000 μ are become to average thickness
M, 1500 μm, 1000 μm, 500 μm of position finding abrasion loss, grinding layer average thickness be 1000 μm reference example 1 in,
Become 500 μm of position finding abrasion loss to average thickness.About each grinding material, finding out will be described in the grinding layer surface measurements
The difference that abrasion loss is added to the maxima and minima in the abrasion loss after the measurement result is poor [g] as abrasion loss.It will
As a result " abrasion loss is poor " column shown in table 1.
< wears away speed >
As the abrasion speed of grinding layer, the thickness of grinding layer when finding out according to following below scheme by 100 μm of substrate grinding
Reduction amount.
In the grinding each time of glass substrate, the variation [g] of the substrate quality of measurement grinding front and back, to the variable quantity,
Use the surface area [cm of glass substrate2], the specific gravity [g/cm of glass substrate3] come find out grinding front and back glass substrate grinding
It measures [μm].
The reduction amount [μm] of the thickness of grinding layer when grinding each time of glass substrate is inline by using ultrahigh speed
Profile (inline profile) analyzer (" LJ-V702 " of Keyemce (Keyence) limited liability company) grinds to measure
The height of the grinding layer of front and back and find out.
Amount of grinding and increase by 100 times of the reduction amount of the thickness of grinding layer when by grinding each time divided by glass substrate
And the reduction amount of the thickness of grinding layer when calculating 100 μm of substrate grinding, the average value that five times are ground is set as abrasion speed.
In turn, the average thickness of grinding layer be 3000 μm 1~embodiment of embodiment 4, in 1~comparative example of comparative example 3,
Become 3000 μm, 2500 μm, 2000 μm, 1500 μm, 1000 μm, 500 μm of position in average thickness, with the grinding condition into
Row grinds and calculates the abrasion speed, and its average value is set as abrasion speed.Show the result in " the abrasion speed " one of table 1
Column.The numerical value of the abrasion speed is bigger, indicates that the service life of grinding layer is shorter.Furthermore the adjustment of the average thickness of grinding layer be with
The measurement of abrasion loss difference grinds grinding layer using the sand paper of #80 to carry out in the same manner.Furthermore about being averaged for grinding layer
With a thickness of 1000 μm of reference example 1, it is not measured.
< flatness >
When the measurement of the flatness of grinding layer after grinding, the embodiment 1 for being 3000 μm in the average thickness of grinding layer
In~embodiment 4, grinding is carried out to grinding layer using the sand paper of #80 until average thickness becomes the thickness of 1500 μm, i.e. grinding layer
Until degree becomes median, then the grinding material ground with the condition is calculated.Calculation process is as follows.
Glass substrate is placed directly in the pressing disc side of microlite platen, with left and right ends and dial gauge (dial
Gauge the mode of pressing) across 3 points of mountings places flatness gauge (flatness gauge) (Japanese base beauty (Kemet
Japan) limited liability company manufactures), and it is directed at the zero point of the dial gauge.
Then, on the grinding material of pressing disc side after grinding, to be located at the side with same position when progress zero point adjustment
Formula places glass substrate, and loads flatness gauge on it.The value of flatness gauge at this time is read, and is set as " in X-direction
Flatness [μm] ".It is rotated by 90 ° glass substrate when carrying out the measurement in X-direction, is measured in an identical manner, it will
The value of flatness gauge at this time is set as " flatness [μm] in Y-direction ".It will be in the flatness and Y-direction in the X-direction
The average value of flatness is set as the flatness [μm] of grinding layer.Show the result in " flatness " column of table 1.Furthermore flat
In degree, negative numerical value is expressed as spill, and positive numerical value is expressed as convex.In addition, the average thickness about grinding layer is 1000 μm
Reference example 1, be not measured.
[table 1]
In table 1, the "-" of comparative example 3 indicates that glass substrate is not almost ground, therefore can not because grinding rate is extremely low
It is measured.
According to the result of table 1 it is found that if by the grinding of the grinding material and comparative example 1, comparative example 2 of 1~embodiment of embodiment 4
Material is compared, then 1~embodiment of embodiment 4 grinding material on the thickness direction of grinding layer it is every 500 μm measurement obtained by,
The difference of the maxima and minima of abrasion loss is small, and the flatness of the grinding layer after grinding is excellent, therefore grinds to glass substrate
Planarization precision when mill is excellent.In addition we know, the grinding material of 1~embodiment of embodiment 4 is due to the abrasion speed of grinding layer is small
Service life is long.In turn, if the grinding material of 1~embodiment of embodiment 4 and the grinding material of comparative example 3 are compared, embodiment 1~
The grinding rate of the grinding material of embodiment 4 is excellent.
In contrast, knowing that the drying time of the grinding material of comparative example 1 at normal temperature is short, therefore in the thickness side of grinding layer
The difference of the maxima and minima of obtained by every 500 μm of measurements, abrasion loss is big upwards, and grinding layer is inhomogenous in a thickness direction.
It is thus regarded that the abrasion speed and flatness of the grinding material of comparative example 1 are poor.
The abrasive grains of grinding material and total content of filler of comparative example 2 are more than 85 volume %, therefore the mill of grinding layer
Consumption is big, in addition obtained by the every 500 μm of measurements, difference of the maxima and minima of abrasion loss on the thickness direction of grinding layer
Greatly.It is thus regarded that the abrasion speed and flatness of the grinding material of comparative example 2 are poor.
The abrasive grains of the grinding material of comparative example 3 and total content of filler are less than 60 volume %, therefore the mill of grinding layer
Consumption is small.It is thus regarded that the abrasive grains for producing passivation can not be removed because falling off in the grinding material of comparative example 3, grinding speed
Rate reduces.
In addition, if the grinding material and grinding layer of the 1~embodiment of embodiment 4 for being 3000 μm by the average thickness of grinding layer
Average thickness is that 1000 μm of reference example 1 is compared, then obtained by the every 500 μm of measurements, mill on the thickness direction of grinding layer
The difference of the maxima and minima of consumption is identical.I.e., it is known that the grinding layer of the grinding material about 1~embodiment of embodiment 4, even if
The average thickness of grinding layer is thick, in a thickness direction also than more uniform.
According to the above it is found that using by the conjunction of abrasive grains and filler in the solid component of grinding layer composition
Meter content be set as 60 volume % or more and 85 volume % or less and have with room temperature lower 30 minutes or more conditions to grinding layer use
The manufacturing method for the pre-drying step that composition is dried can manufacture following grinding material: even if the grinding material thickens grinding
Layer, the homogenieity on thickness direction is also guaranteed, and can improve while the excellent grinding rate of maintenance and planarization precision
Service life.
In turn, if referring in detail to 1~embodiment of embodiment 4, grinding material and the embodiment 4 of 1~embodiment of embodiment 3
Grinding material is compared, and wears away speed and planarization is excellent.According to the situation it is found that passing through so that the Taber abrasion test of grinding layer
Abrasion loss becomes 0.03g or more and 0.15g hereinafter, making obtained by every 500 μm of measurements, the Taibo mill on the thickness direction of grinding layer
The difference for consuming the maxima and minima of the abrasion loss of test becomes 0.080g mode below, to the content of abrasive grains and filler
It is adjusted, the planarization precision of glass substrate grinding can be improved and grinds the service life of material.
[industrial availability]
In the manufacturing method for grinding material through the invention in the grinding material manufactured and grinding material of the invention, grinding layer
Thickness direction on homogenieity be guaranteed, therefore can be improved while maintaining excellent grinding rate and planarization precision
Service life.Thus, which may be suitably used to the plane lapping of the substrates such as glass or sapphire.
Claims (5)
1. a kind of manufacturing method for grinding material, the grinding material includes substrate；And surface side and packet laminated on the substrate
Grinding layer containing abrasive grains, filler and adhesive, the manufacturing method for grinding material include:
Preparation step, preparation include the grinding layer composition of the abrasive grains, the filler and described adhesive；
The grinding layer is coated on the surface of the substrate by applying step with composition；And
Heating stepses heat the grinding layer after the applying step with composition,
In the preparation step, by the solid component of the grinding layer composition the abrasive grains and the filler
Total content be set as 60 volume % or more and 85 volume % hereinafter,
The heating stepses include
The grinding layer is dried with composition with room temperature lower 30 minutes or more conditions for pre-drying step；
Thermal dehydration step carries out thermal dehydration to the moisture of grinding layer composition after the pre-drying step；With
And
Heat hardening step carries out heat hardening with composition to the grinding layer after the thermal dehydration step.
2. the manufacturing method of grinding material according to claim 1, wherein in the applying step, so that the grinding
The average thickness of layer is adjusted the coating amount of grinding layer composition as 1000 μm or more of mode.
3. the manufacturing method of grinding material according to claim 2, wherein in the preparation step, so that the grinding
The abrasion loss of the Taber abrasion test of layer becomes 0.03g or more and 0.15g hereinafter, making every on the thickness direction of the grinding layer
Obtained by the 500 μm of measurements, difference of the maxima and minima of the abrasion loss of Taber abrasion test becomes 0.080g mode below,
The content of the abrasive grains and the filler is adjusted.
4. the manufacturing method of grinding material according to claim 1,2 or 3, wherein the abrasive grains are diamond lap grain.
5. a kind of grinding material, including substrate；And laminated on the substrate surface side and include abrasive grains, filler and bonding
The grinding layer of agent,
Total content of the abrasive grains and the filler in the grinding layer be 60 volume % or more and 85 volume % with
Under,
The average thickness of the grinding layer is 1000 μm or more,
The abrasion loss of the Taber abrasion test of the grinding layer be 0.03g or more and 0.15g hereinafter,
On the thickness direction of the grinding layer obtained by the every 500 μm of measurements, maximum value of the abrasion loss of Taber abrasion test with
The difference of minimum value is 0.080g or less.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-252188 | 2017-12-27 | ||
| JP2017252188A JP2019115966A (en) | 2017-12-27 | 2017-12-27 | Method for production of polishing agent, and the polishing agent |
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| Publication Number | Publication Date |
|---|---|
| CN109968187A true CN109968187A (en) | 2019-07-05 |
Family
ID=67076372
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| CN201811589757.3A Withdrawn CN109968187A (en) | 2017-12-27 | 2018-12-25 | Grind the manufacturing method and grinding material of material |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0617374A (en) * | 1992-06-26 | 1994-01-25 | Fuji Spinning Co Ltd | Production of base fabric for polishing |
| JP2005050893A (en) * | 2003-07-30 | 2005-02-24 | Mitsui Chemicals Inc | Retainer ring and method for polishing substrate using the same |
| CN102015812A (en) * | 2008-04-25 | 2011-04-13 | 东洋高分子股份有限公司 | Polyurethane foam and polishing pad |
| WO2016203914A1 (en) * | 2015-06-19 | 2016-12-22 | バンドー化学株式会社 | Polishing material and polishing material manufacturing method |
| WO2017119342A1 (en) * | 2016-01-06 | 2017-07-13 | バンドー化学株式会社 | Polishing material |
-
2017
- 2017-12-27 JP JP2017252188A patent/JP2019115966A/en active Pending
-
2018
- 2018-12-25 CN CN201811589757.3A patent/CN109968187A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0617374A (en) * | 1992-06-26 | 1994-01-25 | Fuji Spinning Co Ltd | Production of base fabric for polishing |
| JP2005050893A (en) * | 2003-07-30 | 2005-02-24 | Mitsui Chemicals Inc | Retainer ring and method for polishing substrate using the same |
| CN102015812A (en) * | 2008-04-25 | 2011-04-13 | 东洋高分子股份有限公司 | Polyurethane foam and polishing pad |
| WO2016203914A1 (en) * | 2015-06-19 | 2016-12-22 | バンドー化学株式会社 | Polishing material and polishing material manufacturing method |
| WO2017119342A1 (en) * | 2016-01-06 | 2017-07-13 | バンドー化学株式会社 | Polishing material |
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|---|---|
| JP2019115966A (en) | 2019-07-18 |
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Application publication date: 20190705 |