KR102037827B1 - Heater, and fixing device and drying device provided with same - Google Patents

Heater, and fixing device and drying device provided with same Download PDF

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Publication number
KR102037827B1
KR102037827B1 KR1020147015146A KR20147015146A KR102037827B1 KR 102037827 B1 KR102037827 B1 KR 102037827B1 KR 1020147015146 A KR1020147015146 A KR 1020147015146A KR 20147015146 A KR20147015146 A KR 20147015146A KR 102037827 B1 KR102037827 B1 KR 102037827B1
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South Korea
Prior art keywords
heater
resistance heating
base
heating wiring
wiring
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KR1020147015146A
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Korean (ko)
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KR20140089419A (en
Inventor
후미까쯔 스즈끼
유지 우메무라
도모요시 아오야마
요시미 이와따
도모하루 이마이
Original Assignee
가부시키가이샤 미스즈 코우쿄우
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Publication of KR20140089419A publication Critical patent/KR20140089419A/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/20Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/262Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an insulated metal plate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/20Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/003Heaters using a particular layout for the resistive material or resistive elements using serpentine layout
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013Heaters using resistive films or coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/016Heaters using particular connecting means

Abstract

The heater of the present invention has a resistive heat generation having an elongated base portion 11 and a plurality of parallel wirings for conducting heat generation formed on the surface side or inside of the base portion 11 in an electrically insulated state with respect to the base portion. It is a wiring part 15 and at least two power supply terminal parts, and one terminal part 17 and the other terminal part 17 through the resistance heating wiring part 15 in order to supply electric power to the resistance heating wiring part 15. ), The resistance heating wiring section 15 includes a material having a resistance temperature coefficient of 500 to 4,400 ppm / 占 폚, and the parallel wiring is an inclined rectangle. Contains a pattern.

Description

Heater and fixing apparatus and drying apparatus provided with the same {HEATER, AND FIXING DEVICE AND DRYING DEVICE PROVIDED WITH SAME}

The present invention relates to an elongated heater having a resistive heating wiring portion that generates heat by energization, a fixing apparatus and a drying apparatus having the same.

As a heating means for heat treatment, a stainless steel heater, a ceramic heater, etc. which have a resistance heating wiring part are known. And the apparatus provided with such a heater is used for a wide use, and the stable heat processing is performed at desired temperature. For example, in order to form an image on the surface of a recording medium such as a paper or a film using an image forming apparatus such as an electrophotographic printing machine or a copying machine, an elongated ceramic heater is disposed on the image forming apparatus. , Toner, ink and the like are fixed. In a specific image forming method, a recording medium having an unfixed toner image on its surface is supplied between a fixing roll having a heater and a pressing roll, and fixed by passing through both pressure welding portions. At this time, it is common to perform the recording medium while moving in the width direction (perpendicular to the longitudinal direction of the heater) of the elongate heater. For this reason, the examination of the heater which can suppress a temperature nonuniformity and can perform stable heat processing irrespective of the magnitude | size of a recording medium is made. As a reason for this examination, the conventional fixing heater considers the case of notifying the paper of the maximum length (width) which can be notified about the total length, or the paper of a smaller size than that. Has a different heating element, and switches the energization according to the notification size. In this case, when paper of a length (width) equivalent to the total length of the fixing heater is notified, there is a problem that the temperature of the entire heating element decreases. Moreover, when paper of a small size having a length (width) shorter than the entire length of the fixing heater is notified, the temperature of the unnotified area rises locally, making it difficult to control the temperature in the notification area. There is a problem that the fixing efficiency in the paper under notice also decreases. Then, there was a problem such as damaging other peripheral parts.

In order to suppress the said problem, the following technique is known.

Patent document 1 is provided with the heat generating body which generate | occur | produces by electricity supply to the surface of an insulated substrate, and arrange | positions the some heat generating body which differs along the longitudinal direction on the insulated substrate, and insulates the board | substrate of the advancing direction of recording media, such as paper. A heater in which a narrow heating element is arranged on the upstream side in the width direction is disclosed.

Patent Literature 2 discloses an insulated substrate having a long flat plate shape having high thermal conductivity such as aluminum nitride, a heat generating resistor formed on one surface of the insulated substrate, an electrode portion for feeding formed to supply electric power to the heat generating resistor, and a heat generating resistor. A heat dissipation pattern formed of a material having a higher thermal conductivity than the insulating substrate on the back surface of the overcoat layer disposed so as to cover the insulating substrate and the insulating substrate in a portion that generates heat higher than other portions of the heat generating resistor, when electric power is supplied from the electrode portion for feeding. A fixing heater having a is disclosed.

Patent document 3 is arranged so as to cover a long plate-shaped substrate formed of a heat-resistant and insulating material, a heat generating resistor formed on one surface of the substrate, an electrode portion for feeding formed to supply electric power to the heat generating resistor, and a heat generating resistor. The heat generating resistor is provided with the overcoat layer formed, and the value of the 2nd specific resistance smaller than the 1st heat generating resistor which has the value of the 1st specific resistance formed in the center in the longitudinal direction, and the 1st specific resistance connected to both ends of the 1st heat generating resistor A fixing heater is disclosed in which a second heat generating resistor having a series is connected in series.

By the way, in image forming apparatuses, such as an electrophotographic copying machine and a printer, on demand as one of the image heating fixing apparatuses which thermally fix an unfixed toner image formed and supported on to-be-recorded materials, such as a transfer material and a photosensitive paper, as a permanent fixed image. The apparatus of the film heating system is known.

This has a heater and a film on which one side slides with this heater and the other surface moves in contact with the recording material, and thermally fixs the unfixed toner image to the recording material by heat from the heater via the film. It is to let.

In such a film heating apparatus, since the heater and the film as a member which conducts the heat of the heater to the recording material can be reduced in heat capacity, on-demand, power saving and shortening of the weight time (quick start property) Is possible. That is, the time for raising the temperature to a predetermined temperature in the cold state ends in a short time, and there is no need to conduct energization heating of the heater in the air. In addition, even if it is notified immediately after the power is supplied to the image forming apparatus, the heater can be sufficiently heated up to a predetermined temperature until the recording material reaches the fixing portion, thereby reducing the power consumption and reducing the temperature rise of the image forming apparatus. It is possible.

It is known that a ceramic heater is suitable as a member for heating which has a low heat capacity and imparts a high temperature raising rate. This heater is, for example, a ceramic substrate (for example, an alumina substrate) having electrical insulation, heat resistance, or good thermal conductivity, and a resistance heating element that generates heat by receiving a supply of electric power, which is formed by printing, firing, etc. on the substrate. For example, it has a primary circuit containing silver-palladium (hereinafter referred to as an AC line), and supplies power to a resistance heating element to generate heat. In addition, the heater is provided with a secondary system circuit (hereinafter, referred to as a DC line) including a temperature measuring element (for example, a thermistor), and the heater is provided with a predetermined temperature control system connected to the DC line. The power supply to the resistive heating element is controlled so that the temperature is adjusted to the set temperature.

As a safety measure in a device having such a heater, a safety element such as a thermal fuse is placed in series with the AC line and placed in contact with or in proximity to the heater, thereby operating the safety element during thermal runaway of the heater. Emergency power supply to the resistance heating element is to be cut off.

In addition, as a heater for which safety measures have been taken, a resistor substrate and a resistor having a conductor substrate made of SUS430 or the like, an insulating glass layer having a glass transition point T1 formed on the conductor substrate, and a glass transition point T2 formed on the insulating glass layer The heater pattern has a conductor pattern for feeding power to a pattern and an insulating glass layer having a glass transition point T3 formed on the resistor pattern and the conductor pattern, and the relationship between the glass transition points of each layer formed on the conductor substrate is T1>. A heater in which T3? T2 to T1> T2? T3 is known, and is said to be suitable for a transfer electrophotographic process (see Patent Document 4).

Moreover, as a dryer provided with a heat generating resistor, the dryer provided with the self-regulated electric resistance heating body disclosed by patent document 5, for example is known. This self-regulating electrical resistance heating element is attached to a non-conductive substrate, adjacent to a first metal oxide having a resistance of a positive or negative temperature coefficient below a predetermined operating temperature, and attached to the substrate, the first metal oxide being attached to the substrate, A second metal oxide, a first and a second electrical contact having a resistance of a temperature coefficient opposite to the first metal oxide, the first being positioned to allow current to flow between the contacts through the first and second metal oxides; And a second electrical contact, wherein the first and second metal oxides are in combination a heating element that provides a very significant increase in resistance above the operating temperature and a substantially constant synthetic resistance from ambient temperature to a predetermined operating temperature.

Japanese Patent Laid-Open No. 2001-194936 Japanese Patent Laid-Open No. 2007-121955 Japanese Patent Publication No. 2007-232819 Japanese Patent Laid-Open No. 2002-25752 Japanese Patent Publication No. 2011-523174

As described above, the phenomenon in which the temperature of the heater rises in the region where the recording medium is not notified is not actually solved completely, but a member or an apparatus which further suppresses this problem is required.

The present invention provides a heater and a fixing apparatus including the heater capable of performing a stable heat treatment while suppressing a temperature unevenness regardless of the size of the localized temperature rise of the resistive heating wiring portion during use and suppressing the temperature unevenness. And a drying device.

In addition, in an image forming apparatus such as a fixing apparatus, an electrophotographic copying machine, a printer, or the like that includes resistance heating wiring, when thermal runaway occurs, the resistance heating wiring portion reaches a high temperature, for example, 800 ° C. It is known.

An object of the present invention is to provide a heater which stops electric power supply to a resistive heating wiring portion when a heat generating resistive wiring portion becomes higher than a predetermined temperature due to thermal runaway, or the like, and a fixing apparatus and a drying apparatus having the same.

The present invention is described below.

1. A resistive heat generating unit having an elongated base portion and a resistive heat generating portion formed on the surface side or inside of the base portion in an electrically insulated state with respect to the base portion, and having a plurality of parallel wires generated by energization. A power supply terminal portion formed on a surface of the wiring portion and the surface side or inside of the foundation portion in an electrically insulated state with respect to the foundation portion, wherein the number of the terminal portions for power feeding is at least two, In the heater having a power supply terminal portion for electrically connecting one terminal portion and the other terminal portion via the resistance heating wiring portion to supply power, the resistance heating wiring portion has a resistance value temperature coefficient of 500 to 4,400 ppm. And a material of < RTI ID = 0.0 > C < / RTI > and wherein the parallel wiring comprises an inclined rectangular pattern.

2. The number of the terminal parts for power supply is two, and the conductor wiring part is formed in the surface side or inside of the said base part in the state electrically insulated with respect to the said base part, and the number of the said conductor wiring parts is two And a conductor wiring portion for electrically connecting one end side and the other end side of the resistance heating wiring portion and the two power supply terminal portions separately, a portion of the resistance heating wiring portion and a portion of the conductor wiring portion at least one upper layer side. When the resistance heating wiring part is at or above a predetermined temperature as an insulating part for forming a disconnection part formed by contacting a surface or a lower layer side surface with a line width of the resistance heating wiring part or a length equal to or greater than that of the conductor wiring part. And a material reacting with at least one selected from a material m1 constituting the resistance heating wiring portion and a material m2 constituting the conductor wiring portion. And comprising a heater according to the item 1, which comprising a disconnection unit for forming isolated to form the electrically isolated by the reaction, and the resistance heating wire unit or parts of the conductor wiring disconnection.

3. The said base part contains the base layer which consists of stainless steel, aluminum, or an aluminum alloy, and the electrical insulation layer formed in the surface of the said base layer, The said resistance heating wiring part is formed in the surface of the said electrical insulation layer. The heater described in 2.

4. Said heater is a laminated heater provided with the said resistance heating wiring part and the said conductor wiring part in this order on the surface of the said electrical insulation layer of the said base part, A part of the said resistance heating wiring part and the said insulation part for disconnection part formation are provided. The heater according to the above 3, wherein at least a part and a part of the conductor wiring part are provided with a part which is sequentially in surface contact.

5. The said heater of 2 whose said base part contains insulating ceramics and the said resistance heating wiring part is formed in the surface of the said base part.

6. Said heater is a laminated heater provided with the said resistive heating wiring part and the said conductor wiring part in this order on the surface of the said base part, a part of the said resistive heating wiring part, the at least part of the insulation part for forming disconnection part, and the said conductor The heater according to the above 5, wherein a part of the wiring portion is provided with a portion which is sequentially in surface contact.

7. The base portion includes a base layer comprising stainless steel, aluminum or an aluminum alloy, and an electrical insulation layer formed on the surface of the base layer;

The heater according to the above 2, wherein the conductor wiring portion is formed on a surface of the electrical insulation layer.

8. Said heater is a laminated heater provided with the said conductor wiring part and the said resistance heating wiring part in this order on the surface of the said electrically insulating layer of the said base part, A part of the said conductor wiring part, At least the said insulation part for disconnection part formation The heater according to the above 7, wherein a part and a part of the resistive heating wiring part are provided with a part which is sequentially in surface contact.

9. The said base part contains insulating ceramics,

The heater according to the above 2, wherein the conductor wiring portion is formed on a surface of the base portion.

10. The heater is a stacked heater having the conductor wiring portion and the resistance heating wiring portion in this order on the surface of the base portion, wherein the portion of the conductor wiring portion, at least a portion of the insulation portion for forming the disconnection portion, and the resistance heat generation. The heater according to the above 9, wherein a part of the wiring portion is provided with a portion which is sequentially in surface contact.

11. The heater according to any one of 2 to 10, wherein the resistance heat generating wiring portion contains a silver alloy.

12. The heater according to any one of 2 to 11, wherein the conductor wiring portion contains silver.

13. The heater according to any one of 2 to 12, wherein the insulation portion for forming a disconnection portion includes at least one kind selected from bismuth-based glass and lead-based glass.

14. The base portion includes a base layer made of stainless steel, aluminum or an aluminum alloy, and an electrical insulation layer formed on the surface of the base layer, wherein the resistance heating wiring portion and the power supply terminal portion are formed of the electrical insulation layer. The heater according to the above 1, which is formed on the surface.

15. The heater according to the above 14, wherein the resistance heat generating wiring portion contains a silver alloy.

16. The said heater of 1 whose said base part contains insulating ceramics, and the said resistance heating wiring part and the said power supply terminal part are formed in the surface of the said base part.

17. The said heater of 1 whose said base part contains insulating ceramics and the said resistance heating wiring part is formed in the inside of the said base part.

18. The heater according to the above 16 or 17, wherein the resistance heat generating wiring portion contains tungsten or molybdenum.

19. An elongated base portion, a resistive heat generating portion formed on the surface side or inside of the base portion in an electrically insulated state with respect to the base portion, comprising: a resistance heating wiring portion that generates heat by energization; Two power supply terminal portions formed on the surface side or inside of the portion in an electrically insulated state with respect to the base portion, and formed on the surface side or inside of the base portion in an electrically insulated state with respect to the base portion. As the conductor wiring part, the number of the said conductor wiring parts is two, the conductor wiring part which electrically connects the one end side and the other end side of the said resistance heating wiring part, and the said two power supply terminal parts separately, and the said resistance Line width of the resistance heating wiring section or the conductor wiring on at least one of an upper layer side surface or a lower layer side surface of a portion of the heating wiring portion and a portion of the conductor wiring portion. An insulating portion for forming a disconnected portion formed in contact with a length equal to or greater than a negative wire width, wherein the resistance heating wiring portion and the material m1 constituting the resistance heating wiring portion when the resistance heating wiring portion is equal to or higher than a predetermined temperature. A material which reacts with at least one selected from the constituent material m2, and includes an insulation portion for forming a disconnection portion for forming an electrical insulation portion by the reaction and disconnecting the resistance heating wiring portion or the conductor wiring portion. Heater characterized by the above-mentioned.

20. Fixing apparatus provided with the heater as described in any one of said 1-19.

21. The drying apparatus provided with the heater as described in any one of said 1-19.

According to the heater of this invention, local temperature rise of the resistive heating wiring part at the time of use can be suppressed, and stable heat processing can be performed, suppressing temperature nonuniformity, regardless of the magnitude | size of the heat-treatment to-be-processed. In addition, since the resistance heating wiring portion includes an inclined rectangular pattern, the desired effect can be obtained even if the width of the heater is reduced.

The heater of the present invention not only heat-treats in a state where both the heater and the heat-treatment object are fixed, but also moves the heater in the width direction (the direction perpendicular to the longitudinal direction of the heater) in a state where the heat-treatment object is fixed. When heat-processing and in a state in which the heater is fixed, it is suitable for heat-treatment while moving the heat-treatment object in the vertical direction with respect to the elongate heater. In particular, in the case where the heat treatment is performed while moving the heater in the fixed state and the heat treatment is performed while moving the heat treatment object in the fixed state, the width of the long heater is When it moves so that it may cross in a direction, a stable heat processing can be performed, suppressing temperature nonuniformity, regardless of the magnitude | size of the to-be-heat-processed material.

Moreover, even when heat-treatment objects to which thermal properties differ from each other are heat-treated at the same temperature, a stable treatment can be performed at a predetermined temperature without causing abnormal heat generation.

In the present invention, when the size of the heat-treated material is smaller than the total length of the resistance heat-generating wiring portion in the longitudinal direction of the heater, the heat-treatment is performed by the uniform heat generation of the adjacent resistance-heating wiring portion depending on the size of the heat-treatment object. The local temperature rise in the resistance heating wiring portion which is not in proximity is suppressed, and no damage is caused to other peripheral components. Therefore, heat treatment can be performed stably at a desired temperature, for example, a set temperature in the range of -40 ° C to 1,000 ° C, without depending on the size of the heat-treated material.

By arranging the heater of the present invention in a heat treatment apparatus, fixing of toner, ink and the like, joining a plurality of members together, heat treatment of a coating film or film, heat treatment of a metal product or a resin product, drying, solder reflow, and the like, save power. Can be performed efficiently. Moreover, since it can be set as the heater whose width was reduced as mentioned above, it is suitable for arrangement | positioning to a small heat processing apparatus.

When the rectangular pattern shown in Fig. 1A is applied to the resistive heating wiring portion in Fig. 4, and the toner, ink, and the like are fixed, there is a non-forming portion of the wiring in the width direction of the heater. Although there is a fear that the fixing failure may occur, the problem is solved by using the heater of the present invention.

In particular, when the heat-treatment object is paper, film or the like and is provided to printing or the like, the heater of the present invention is suitable as a fixing heater in an image forming apparatus or a fixing apparatus such as a printer, a copier, a facsimile.

The fixing apparatus of the present invention is suitable for fixing toner, ink, etc., joining of a plurality of members, and the like using heat by a heater. In particular, by using a crimping means together, an integrated product can be obtained efficiently. For example, a fixing device including a fixing roll including an elongated heater and a pressing roll, wherein a recording medium having an unfixed toner image on its surface is supplied between the fixing roll and the pressing roll. By moving the recording medium in the width direction of the heater and passing the pressure contact portions of the fixing roll and the pressurizing roll, the local temperature rise of the resistive heating wiring portion is suppressed, and the size of the paper, film, and the like is suppressed. Toner, ink and the like can be efficiently fixed to the recording medium.

According to the drying apparatus of this invention, drying in a desired atmosphere can be advanced efficiently. And it can be used as a vacuum drier (pressure reduction drier), a pressure drier, a dehumidification drier, a hot air drier, an explosion-proof drier, etc.

In addition, according to the heater of the present invention having the insulation portion for forming a disconnection portion, the overheating of the resistance heating wiring portion starts due to the thermal runaway, and when the temperature exceeds the predetermined temperature, the resistance heating wiring portion and / or the conductor wiring portion, and disconnection In the contact portion (coated portion) of the insulator forming portion, the respective constituent materials react to form an electrical insulator, smoothly disconnect the resistance heating wiring portion or the conductor wiring portion, and stop operation.

Therefore, also in the fixing apparatus and drying apparatus which use this type of heater, when a heater becomes more than predetermined temperature, it can self-disconnect in a resistance heating wiring part or a conductor wiring part, and can ensure safety.

1A is a schematic diagram showing a conventionally known rectangular pattern, and (B) is a schematic diagram showing an inclined rectangular pattern.
2 is a schematic diagram showing another example of an inclined rectangular pattern.
3 is a schematic diagram showing another example of an inclined rectangular pattern.
4 is a schematic plan view showing an example of one type of heater;
FIG. 5 is a schematic diagram showing a cross-sectional view along line XX in FIG. 4. FIG.
6 is a schematic plan view showing another example of one type of heater;
7 is a schematic plan view showing another example of one type of heater;
8 is a schematic cross-sectional view showing another example of one type of heater.
9 is a schematic cross-sectional view showing another example of one type of heater.
Fig. 10 is a schematic plan view showing an example of another type of heater in which the insulation portion forming insulation portion is coated on the surface of the conductor wiring portion.
Fig. 11 is a schematic plan view showing another example of another type of heater in which an insulation portion forming insulation portion is formed on a surface of a resistance heating wiring portion.
Fig. 12 is a schematic cross-sectional view showing another type of heater in which an insulation portion forming insulation portion is coated on the surface of a conductor wiring portion.
Fig. 13 is a schematic cross-sectional view showing that the heater wiring of Fig. 12 is thermally runaway so that an electrical insulation portion is formed in a portion of the conductor wiring portion so that the conductor wiring portion is broken.
Fig. 14 is a schematic cross-sectional view showing an example of another type of heater in which the insulation portion forming insulation portion is formed on the surface of the resistance heating wiring portion.
Fig. 15 is a schematic cross-sectional view showing another example of another type of heater in which the insulation portion forming insulation portion is formed on the surface of the resistance heating wiring portion.
Fig. 16 is a schematic plan view showing another example of another type of heater in which the insulation portion forming insulation portion is formed on the surface of the conductor wiring portion.
FIG. 17 is a schematic cross-sectional view showing another example of another type of heater in which the insulation portion forming portion is formed so as to be surrounded by the overcoat layer in the surface side of the conductor wiring portion and in the overcoat layer. FIG.
Fig. 18 is a schematic cross-sectional view showing an example of another type of heater in which an insulation portion for forming a disconnection portion is formed facing the base portion side of the conductor wiring portion and the surface side of the resistance heating wiring portion.
Fig. 19 is a schematic cross-sectional view showing an example of another type of heater in which an insulation portion forming insulation portion is formed between the base portion and the resistance heating wiring portion so as to be surrounded by the first insulation layer in the first insulation layer.
20 is a schematic cross-sectional view showing an example of another type of heater having two insulation portions for forming a disconnection portion.
FIG. 21 is a schematic cross-sectional view showing that the heater of FIG. 18 is thermally runaway, and an electrical insulation portion is formed in a portion of the conductor wiring portion and the resistance heating wiring portion to disconnect the conductor wiring portion and the resistance heating wiring portion. FIG.
FIG. 22 is a schematic cross-sectional view showing that the heater of FIG. 20 is thermally runaway, and an electrical insulation portion is formed in a portion of the conductor wiring portion and the resistance heating wiring portion so that the conductor wiring portion and the resistance heating wiring portion are disconnected. FIG.
Fig. 23 is a schematic cross-sectional view showing another example of another type of heater in which the insulation portion forming portion is formed so as to be surrounded by the overcoat layer in the surface side of the resistance heating wiring portion and in the overcoat layer.
Fig. 24 is a schematic cross-sectional view showing another example of another type of heater in which the insulation portion for forming a disconnection portion is formed facing the base portion side of the resistance heating wiring portion and the surface side of the conductor wiring portion.
FIG. 25 is a schematic cross-sectional view showing another example of another type of heater in which an insulation portion forming insulation portion is formed between the base portion and the conductor wiring portion so as to be surrounded by the first insulation layer in the first insulation layer. FIG.
FIG. 26 is a schematic cross-sectional view showing another example of another type of heater having two disconnecting portion forming insulation portions. FIG.
Fig. 27 is a schematic cross-sectional view showing another example of another type of heater in which the insulation portion forming insulation portion is formed on the surface of the conductor wiring portion.
FIG. 28 is a schematic cross-sectional view showing another example of another type of heater in which an insulation portion for forming a disconnection portion is formed on the surface side of a conductor wiring portion and surrounded by an overcoat layer in an overcoat layer. FIG.
Fig. 29 is a schematic cross-sectional view showing another example of another type of heater in which the insulation portion for forming a disconnection portion is formed facing the base portion side of the conductor wiring portion and the surface side of the resistance heating wiring portion.
30 is a schematic cross-sectional view showing another example of another type of heater having two disconnecting portion forming insulation portions.
Fig. 31 is a schematic cross-sectional view showing another example of another type of heater in which the insulation portion forming portion is formed so as to be surrounded by the overcoat layer in the surface side of the resistance heating wiring portion and in the overcoat layer.
Fig. 32 is a schematic cross-sectional view showing another example of another type of heater in which the insulation portion forming portion is formed facing the base portion side of the resistance heating wiring portion and the surface side of the conductor wiring portion.
33 is a schematic cross-sectional view showing another example of another type of heater having two disconnecting portion-forming insulating portions.
34 is a schematic cross-sectional view showing another example of another type of heater in which an insulation portion for forming a disconnection portion is formed on a surface of a conductor wiring portion.
Fig. 35 is a schematic cross-sectional view showing another example of another type of heater in which the insulation portion forming portion is formed on the surface of the conductor wiring portion.
36 (A1) and (A2) are plan views showing the insulation portion forming portion of the disconnection portion covering the resistance heating wiring portion or the conductor wiring portion, and (B1) and (B2) are the insulation portion forming portion of the insulation portion forming resistance heating wiring. The top view which shows what is covered by the part or conductor wiring part.
37 is a schematic perspective view showing an example of the fixing apparatus of the present invention.
38 is a schematic perspective view showing another example of the fixing apparatus of the present invention.
39 is a schematic diagram showing an example of an image forming apparatus having a heater according to the present invention.
40 is a plan view of the heater manufactured in Example 1;
FIG. 41 is a schematic perspective view showing a heat sink for evaluation E1 of a heater; FIG.
42 is a schematic plan view showing a device for evaluation E1 of a heater;
FIG. 43 is a graph showing test results (evaluation E1) in a heater of Example 1. FIG.
44 is a plan view showing a heater manufactured in Example 2;
45 is a graph showing test results (evaluation E1) in the heater of Example 2. FIG.
46 is a plan view of a heater manufactured in Comparative Example 1;
FIG. 47 is a schematic diagram showing a cross-section taken along line YY in FIG. 46; FIG.
48 is a graph showing test results (evaluation E1) in a heater of Comparative Example 1;
49 is a schematic plan view showing a heater used in Comparative Example 2. FIG.
50 is a graph showing test results (evaluation E1) in a heater of Comparative Example 2. FIG.
FIG. 51 is a plan view showing a heater manufactured in Example 3. FIG.
52 is a schematic plan view showing a device for evaluation E2 of a heater;
53 is a graph showing the test results (evaluation E2) in the heater of Example 3. FIG.
54 is a plan view showing a heater manufactured in Example 4;
55 is a graph showing test results (evaluation E2) in the heater of Example 4. FIG.

The heater of one embodiment in the present invention is a resistive heat generating portion which is formed in an elongated base portion and the surface side or inside of the base portion in an electrically insulated state with respect to the base portion, and a plurality of heat generated by energization. And a resistance heating wiring portion having parallel wirings, and a power supply terminal portion formed on the surface side or inside of the foundation portion in an electrically insulated state with respect to the foundation portion, wherein the number of the terminal portions for power feeding is at least two, In order to supply electric power to a wiring part, the terminal part for electric power feeding which electrically connects one terminal part and the other terminal part through a resistance heating wiring part is provided, The resistance heating wiring part has a resistance value temperature coefficient of 500-4,400 ppm / degreeC. Phosphorus material is included, and parallel wiring is characterized by including an inclined rectangular pattern. The resistance heating wiring portion and the power feeding terminal portion may be connected by a conductor wiring portion.

The heater of the other form in this invention is a resistance heating part formed in the elongate base part and the surface side or inside of the base part in the state electrically insulated with respect to the base part, and is the resistance generate | occur | produces by electricity supply. The heat generating wiring portion, the two power supply terminal portions formed on the surface side or inside of the base portion in an electrically insulated state with respect to the base portion, and electrically insulated from the base portion on the surface side or inside of the base portion. The conductor wiring part formed in the state, and the number of conductor wiring parts is two, The conductor wiring part which electrically connects the one end side and the other end side, and the two power supply terminal parts of a resistance heating wiring part separately, and a resistance On at least one of the upper surface or lower layer surface of a portion of the heating wiring portion and a portion of the conductor wiring portion, the line width of the resistance heating wiring portion or the line width of the conductor wiring portion is the same or the same. At least one selected from a material m1 constituting the resistance heating wiring portion and a material m2 constituting the conductor wiring portion when the resistance heating wiring portion is an insulating portion for contact formation formed in contact with the length of the phase and the resistance heating wiring portion is at a predetermined temperature or more. It is characterized by including the material which reacts with a kind, and providing the electrical insulation part by this reaction, and the insulation part for disconnection part formation which disconnects a resistance heating wiring part or a conductor wiring part.

In one embodiment of the present invention, a heater includes an elongated base 11 (base 11 including base layer 12 and electrical insulating layer 13) and a surface of base 11. A resistive heat generating portion 15 and a base portion 11 which are formed on the side or inside in a state of being electrically insulated from the base portion 11 and have a plurality of parallel wires generated by energization. ) Is a terminal portion for power feeding formed on the surface side or inside of the base 11 in an electrically insulated state with respect to the base portion 11, the number of terminal portions for power feeding is at least two, and electric power is supplied to the resistance heating wiring portion 15. In order to supply, the power supply terminal part 17 which electrically connects one terminal part and the other terminal part through the resistance heating wiring part 15 is provided.

Moreover, the heater of the other form in this invention is the base part 11 (base part 11 containing the base layer 12 and the electrical insulation layer 13) of elongate shape, and the base part 11 Is a resistance heating portion that is formed on the surface side or inside of the substrate 11 in an electrically insulated state with respect to the base portion 11, and includes a resistance heating wiring portion 15 that generates heat by energization, and a surface side of the base portion 11. Or inside the two power supply terminal portions 17, which are formed in an electrically insulated state with respect to the base portion 11, and on the surface side or inside of the base portion 11, with respect to the base portion 11; It is a conductor wiring part formed in the electrically insulated state, The number of conductor wiring parts is two, The one end side and the other end side of the resistance heating wiring part 15, and the two power supply terminal parts 17 are separately, At least one of the conductor wiring portion 19 to be electrically connected, a part of the resistance heating wiring portion 15 and a part of the conductor wiring portion 19. An insulation portion for forming a disconnection portion formed in contact with a line width of the resistance heating wiring portion 15 or a length equal to or greater than that of the conductor heating portion 19 on the layer side surface or the lower layer side surface. In the case where the temperature (15) is higher than or equal to a predetermined temperature, a material reacting with at least one selected from the material (m1) constituting the resistance heating wiring portion 15 and the material (m2) constituting the conductor wiring portion 19 And an insulation portion 32 for forming a disconnection portion for disconnecting the resistance heating wiring portion 15 or the conductor wiring portion 19 by forming an electrical insulation portion by this reaction.

In both forms, the cross-sectional structure of a heater is shown, for example in FIG. 5, FIG. 8, and FIG. These drawings include a conductor wiring portion 19 which connects the resistance heating wiring portion 15 and the terminal portion 17 for feeding, and includes the resistance heating wiring portion 15, the terminal portion 17 for feeding and the conductor wiring portion ( 19 has shown the form formed in the surface of the base part 11 in the state electrically insulated with respect to the base part 11.

In the present invention, the shape of the heater usually depends on the shape of the base portion or the base layer. The shape of the base portion or the base layer is usually flat, and may be provided with a recess, a convex portion, a hollow portion and the like. In addition, the shape of a base part or a base layer may be curved board shape.

In the present invention, the components such as the resistive heating wiring portion, the power supply terminal portion, the conductor wiring portion and the like can be formed not only on the surface (one side or both sides) of the base portion, but also on the inside thereof. The shape of the base portion in the latter case can be a hollow body or the like.

In the following description, the base material, such as "formation (arrangement) on the surface of the foundation portion or the surface side of the foundation portion", or the like, is, for example, the surface of the base portion in the shape of a plate, or the surface side (another layer formed on the surface of the foundation portion). Surface) is formed (arranged). When a base part consists of a hollow body, it means that it is formed (arranged) with respect to the inner surface of a hollow part.

Although the thickness of the base part 11 is suitably selected according to the objective, a use, etc., it is 0.4-20 mm normally.

Moreover, the length of the base part 11 is 20 mm or more normally, Preferably it is 200-350 mm.

The constituent material of the base or base layer is preferably stainless steel, aluminum, aluminum alloy or insulating ceramics.

Stainless steel is preferably a ferritic heat resistant steel, particularly preferably SUS430, SUS444 and SUS436.

Moreover, since stainless steel, aluminum, or an aluminum alloy has low electric resistance value, components, such as the resistance heating wiring part 15, the power supply terminal part 17, and the conductor wiring part 19, can be directly formed in the surface. Can't. Therefore, the base part 11 which consists of the base layer 12 which consists of stainless steel, aluminum, or an aluminum alloy, and the electrically insulating layer 13 joined to this base layer is used. As described above, components such as the resistance heating wiring part 15, the terminal part 17 for power supply, the conductor wiring part 19 and the like may be formed on both sides of the base part 11, and in this case, the base layer A base 11 having an electrical insulating layer 13 formed on both sides of the 12 is used.

In the present invention, the constituent material of the base layer 12 is preferably stainless steel, and the constituent material of the electrical insulating layer 13 is preferably crystallized glass and semi-crystallized glass from the viewpoint of thermal expansion balance with stainless steel. SiO 2 -Al 2 O 3 -MO glass having a softening point of 600 ° C. or higher is preferable. However, MO is an alkaline earth metal oxide (MgO, CaO, BaO, SrO, etc.). The thickness of the electrical insulation layer 13 becomes like this. Preferably it is 60-120 micrometers, More preferably, it is 70-110 micrometers, More preferably, it is 75-100 micrometers.

The insulating ceramic is preferably an inorganic compound having an electrical resistance value of 10 7 Ω · cm or more, and examples thereof include aluminum oxide, aluminum nitride, zirconia, silica, mullite, spinel, cordierite, and silicon nitride. Among these, aluminum oxide and aluminum nitride are preferable.

In the present invention, the structure of the heater depends on the constituent material of the base 11, and as a plan view, for example, as a sectional view of Figs. 4, 6, 7, 7, 10, 11 and the like, for example 5, 8, 9, 12, 13, 14, 15 and the like.

When the constituent material of the base part 11 contains stainless steel as the base layer 12, components, such as the resistance heating wiring part 15, the power supply terminal part 17, and the conductor wiring part 19, are the bases. It is formed in the surface of the electrical insulation layer 13 (henceforth also called "the 1st insulation layer 13") so that it may not directly contact the stainless steel part of the layer 12 (FIG. 4, FIG. 5, FIG. 6, 7, 10, 11, 12, 13, 14, etc.).

The thickness of the 1st insulating layer 13 becomes like this. Preferably it is 60-120 micrometers, More preferably, it is 70-110 micrometers, More preferably, it is 75-100 micrometers.

In addition, when the constituent material of the base portion is insulating ceramics, components such as the resistance heating wiring portion 15, the power supply terminal portion 17, the conductor wiring portion 19, and the like are shown in FIG. It may be arrange | positioned on the surface of 11), and may be formed so that it may contact the part which consists of an electrically insulating material which is not shown in figure.

In the heater of one embodiment of the present invention, the resistance heating wiring section 15, which is a main part of the heater, has a resistance value temperature coefficient of 500 to 4,400 ppm / in that the temperature followability is excellent with respect to the change in the resistance value. It includes a material that is ℃. Specific examples include silver alloys such as silver-palladium and silver-platinum; silver; Molybdenum: tungsten and the like. These materials may be used independently and may be used in combination of 2 or more type. Preferable materials are appropriately selected depending on the cross-sectional structure of the heater, the constituent materials of the foundation, and the like. In addition, the line thickness of the resistive heating wiring portion 15 is preferably 3 to 27 µm.

In addition, the "inclined rectangular pattern" is the pattern 20 which has a shape shown to FIG. 1B, FIG. 2, and FIG. That is, the pattern of the shape in which the rising part of the conventionally well-known rectangular pattern shown by FIG. 1 (A) inclines at the angle of (theta) is made into the "inclined rectangular pattern." Angle (theta) becomes like this. Preferably it is 10-80 degree | times, More preferably, it is 20-70 degree | times. In addition, adjacent rectangles may be the same shape mutually, and may be another shape. In addition, the wiring does not need to be a straight line in each position, but may have a curve partially.

The resistance heating wiring portion 15 is a resistance heating portion that is formed on the surface side or inside of the elongated base portion 11 in an electrically insulated state with respect to the base portion 11. A plurality of wirings connecting the at least two power supply terminal portions 17 in electrical parallel are included. The power supply terminal portion 17 is also formed on the surface side or inside of the elongated base portion 11 in an electrically insulated state from the base portion 11.

The form of parallel wiring is not specifically limited. One parallel wiring may be formed in the longitudinal direction of a heater, may be formed in the width direction of a heater, and may be formed obliquely in the width direction of a heater.

In the present invention, the heater including the resistive heating wiring portion 15 having the inclined rectangular pattern is preferably shown in Figs. 4, 6 and 7. 4 and 7 show an example in which the resistive heating wiring unit 15 includes parallel wirings in the width direction by a refolding pattern in the longitudinal direction of the heater 1. 6 is an example in which the resistance heating wiring unit 15 includes parallel wirings in the width direction by the refolding pattern of the heater 1 in the width direction. 4, 6, and 7 are preferable forms from the viewpoint of temperature complementarity in the longitudinal direction of the heater 1, and are provided with two terminal portions 17 for power supply on both ends in the longitudinal direction of the heater 1. FIG. 4 and FIG. 7 including two power supply terminal portions 17 on one end side in the longitudinal direction of the heater 1 are particularly preferred embodiments. In addition, in these figures, there is the non-formed part 14 inclined with respect to the width direction of the heater 1 in the clearance gap of the resistance heating wiring part 15 (refer FIG. 4). That is, the form which the part which comprises parallel wiring is oblique with respect to the longitudinal direction or the width direction of the heater 1 is also preferable from the viewpoint of the temperature complementarity in the longitudinal direction of the heater 1.

4 and 7 are forms in which the inclined rectangular pattern shown in FIG. 1B is arranged obliquely with respect to the width direction of the heater 1, and FIG. 6 is shown in FIG. 1B. The inclined rectangular pattern is arranged horizontally with respect to the longitudinal direction of the heater 1.

In the case of these forms, since the non-formed part 14 of the wiring is oblique with respect to the longitudinal direction or the width direction of the heater, as a result of providing the inclined rectangular pattern, the heater 1 When heat treatment is performed while moving in the width direction, and when the heat-treatment object is heat-treated while moving in the vertical direction with respect to the elongated heater 1 in a state where the heater 1 is fixed, Stable heat treatment can be performed without causing a local temperature rise in the resistive heating wiring portion.

4, 6, 7, 10, and 11 are heaters provided with a base portion 11 including a base layer 12 and an electrical insulating layer 13 made of stainless steel (hereinafter, "heater I ) Is also a plan view illustrating the " FIG. 5 is a schematic diagram showing an X-X ray cross section in FIG. 4. FIG.

The heater 1 of FIGS. 4, 5, 6, 7, 10, and 11 includes an elongated base layer 12, an electrical insulating layer 13 formed on the surface of the base layer 12, and Is formed on the surface of the electrical insulation layer 13 and is formed on the surface of the electrical insulation layer 13 and the resistive heating wiring portion 15 having a plurality of parallel wirings that generate heat by energization. Two power supply terminal units 17 for supplying power to the unit 15 are provided. Moreover, these heaters equip the surface of the electrical insulation layer 13 with the conductor wiring part 19 electrically connected to the terminal part 17 for each power supply, and branch this conductor wiring part 19, and have parallel wiring. It is set as the form connected to the some resistance heating wiring part 15. FIG. In order to efficiently construct parallel wirings, it is preferable to provide a conductor wiring section 19. In addition, the electrical insulation layer 13 is electrically insulated between the base layer 12 and the resistive heating wiring portion 15, and is electrically isolated between the base layer 12 and the power supply terminal portion 17. It is insulated. The electrical insulation layer 13 is also electrically insulated between the base layer 12 and the conductor wiring portion 19.

In the heater I, it is preferable that the constituent material of the resistance heating wiring part 15 contains a silver alloy, such as silver-palladium, whose resistance value temperature coefficient is 1,000-3,000 ppm / degreeC.

In addition, the line thickness of the resistive heating wiring portion 15 is preferably 3 to 27 µm, more preferably 4 to 20 µm, still more preferably 5 to 17 µm, particularly preferably in terms of area specific resistance. Is 8 to 12 µm.

In the heater I, the constituent materials of the power supply terminal portion 17 and the conductor wiring portion 19 may be silver, silver-palladium, silver-platinum, copper, gold, platinum-rhodium, or the like. In addition, the material, line width, and the like of the power supply terminal portion 17 or the conductor wiring portion 19 are selected so that the resistance value per unit area is lower than that of the resistance heating wiring portion 15.

In the heater I, the constituent material of the base layer 12 is preferably a ferritic heat resistant steel. Particularly preferred materials are SUS430, SUS444, and SUS436.

The thickness of the base part 11 becomes like this. Preferably it is 0.4-20 mm, More preferably, it is 0.6-5 mm.

In addition, as a constituent material of the electrical insulation layer 13, from the viewpoint of thermal expansion balance with stainless steel, SiO 2 -Al 2 O 3 -MO glass is preferable. However, MO is an alkaline earth metal oxide (MgO, CaO, BaO, SrO, etc.).

The thickness of the electrical insulation layer 13 becomes like this. Preferably it is 60-120 micrometers, More preferably, it is 70-110 micrometers, More preferably, it is 75-100 micrometers.

4, 5, 6, and 7, the electrical insulation layer 13 is formed so as to contact the regions of the resistance heating wiring section 15, the power supply terminal section 17, and the conductor wiring section 19. Although it is arrange | positioned at the majority of the surface of the part 11, it is not limited to this form. For example, it has the same area | region as the pattern of the resistive heating wiring part 15, the terminal part 17 for electric power feeding, and the conductor wiring part 19, and may be formed in each of these lower sides.

Although not shown in FIG. 5 and the like, the heater I may include a protective layer covering the resistance heating wiring portion 15, the power supply terminal portion 17, and the conductor wiring portion 19. This protective layer has the same area | region as the pattern of the resistance heating wiring part 15, the power supply terminal part 17, and the conductor wiring part 19, and may be formed above each of these, and the base part 11 ( It may be formed on the entire surface of the base layer 12 or the electrical insulating layer 13.

The protective layer is preferably made of an electrically insulating material, and may be made of the same material as the electrically insulating layer 13.

The heater I shown in FIGS. 4, 5, 6, and 7 includes, for example, a step of forming an electrical insulating film on the surface of an elongated stainless steel plate, and a resistance temperature coefficient of 500 on the surface of the electrical insulating film. A step of forming a resistive heating wiring portion comprising a material of 4 to 400 ppm / 占 폚, and further comprising an inclined rectangular pattern, the surface of the electrical insulating film, and at least two electric power feeders at both ends of the stainless steel plate in the longitudinal direction thereof or at its periphery thereof. It can obtain by the manufacturing method provided with the process of forming a terminal part. Moreover, the process of forming a conductor wiring part, the process of forming a protective layer, etc. can be provided.

When forming an electrical insulating film and a protective layer, the method of heat-processing the film formed using the composition etc. which contain the precursor of an electrical insulation material, etc. can be applied.

A printing method in the case of forming the resistance heating wiring portion, the terminal portion for feeding and the conductor wiring portion; Dipping method; Physical vapor growth methods such as vapor deposition and the like can be applied.

As shown in FIGS. 10 and 11, when the heater I has a problem such as thermal runaway, and the resistance heating wiring unit 15 that generates heat overheats and reaches a predetermined temperature or more, The insulation part 32 for disconnection part formation which disconnects the resistance heating wiring part 15 or the conductor wiring part 19 may be provided. Specifically, the insulation portion 32 for forming a disconnection portion includes at least one of the resistance heating wiring portion 15 and the conductor wiring portion 19 when the resistance heating wiring portion 15 that generates heat is equal to or higher than a predetermined temperature. It has an effect of forming and converting a contact portion of one side and the insulation portion 32 for forming a disconnected portion into the electrical insulation portion 34. That is, as shown below, the insulating part 32 for disconnection part formation is the upper surface side or the lower layer side of at least one of a part of the resistance heating wiring part 15, and a part of the conductor wiring part 19. As shown in FIG. Contact is formed on the surface of the resistance heating wiring section 15 so as to cross the resistance heating wiring section 15 or the conductor wiring section 19 with a length equal to or greater than the line width of the resistance heating wiring section 15 or the conductor wiring section 19. It is. Therefore, when the resistance heating wiring section 15 is overheated to reach a predetermined temperature or more, the constituent material of the disconnecting portion forming insulating section 32, the constituent material m1 of the resistance heating wiring section 15, and the conductor wiring At least one selected from the constituent material m2 of the section 19 reacts, and an electrical insulation section 34 made of an electrical insulation material is formed, and in this electrical insulation section 34, the resistive heating wiring section 15 ) Or the conductor wiring portion 19 is disconnected. The insulation part 32 for disconnection part formation may be arrange | positioned at one place in one heater, and may be arrange | positioned at two or more places. FIG. 12: shows the form which has the insulation part 32 for disconnection part formation in the surface of one part of the conductor wiring part 19, and FIG. 13 shows the conductor wiring part in this insulation part formation for disconnection part formation. 19 is disconnected and the form in which the electrical insulation part 34 was formed is shown.

The arrangement form of the insulation part 32 for disconnection part formation is shown in FIG. FIG. 36 is an enlarged view of a main part of the heater, for example, seen from above, for example. In FIG. It is a form arrange | positioned on the surface of one part 19 in the width direction exceeding line width, and covering these, (A2), The insulation part for disconnection part formation of the resistance heating wiring part 15 It is a form arrange | positioned on the surface of one part or a part of conductor wiring part 19 in the same length as the line width, without exceeding the line width. In addition, (B1) is a resistive heating wiring on the surface of the disconnection part formation insulating part 32 arrange | positioned in the length exceeding the line width of one part of the resistance heating wiring part 15 or the part of the conductor wiring part 19. A part of the part 15 or the conductor wiring part 19 is arrange | positioned, and (B2) is arrange | positioned in the same length as the line width of the part of the resistance heating wiring part 15 or the part of the conductor wiring part 19. A portion of the resistance heating wiring portion 15 or a portion of the conductor wiring portion 19 is disposed on the surface of the insulating portion 32 for forming a disconnected portion. In these figures, although the shape of the insulation part 32 for disconnection part formation is made into the surface, it is not limited to this, The line width of the resistance heating wiring part 15 or the line of the conductor wiring part 19 is not limited to this. Arbitrary shapes (lines, etc.) of length equal to or more than width may be sufficient.

The form in which the insulation part 32 for disconnection part formation is arrange | positioned at the surface of the conductor wiring part 19 is shown, for example in FIG. 10 and FIG. In addition, the form in which the insulation part 32 for disconnection part formation is arrange | positioned on the surface of the resistive heating wiring part 15 is shown, for example in FIG. 11, FIG. 14, and FIG.

When the insulation part 32 for disconnection part formation is set as the heater which contacted the resistance heating wiring part 15, as shown in FIG. 11, the insulation part 32 for disconnection part formation in all the parallel wiring parts is shown. It is necessary to make contact with.

In addition, when the insulation part 32 for disconnection part formation is set as the heater which contacted the conductor wiring part 19, as shown in FIG. 10, the parallel wiring part which comprises the resistance heating wiring part 15 is carried out to all. In the main wiring of the conductor wiring portion 19 to be energized, preferably, the insulation portion 32 for forming a disconnection portion needs to be in contact with each other at a position close to the terminal portion 17 for feeding. This can be two group days.

Since the thickness of the insulation part 32 for disconnection part formation is reliably disconnected in the resistance heating wiring part 15 or the conductor wiring part 19, Preferably it is 5-100 micrometers, More preferably, it is 10-10 60 micrometers, More preferably, it is 15-40 micrometers.

The constituent material of the insulation part 32 for disconnection part formation reacts with the constituent material m1 of the resistance heating wiring part 15 or the constituent material m2 of the conductor wiring part 19 to be an electrically insulating material. If it is, it will not specifically limit. Preferred materials are glass, and either crystallized glass or amorphous glass may be used. In the present invention, it is preferable that the constituent material m1 of the resistance heating wiring part 15 and the constituent material m2 of the conductor wiring part 19 contain silver or a silver alloy. The constituent materials of the insulator 32 for bismuth are bismuth type glass and lead type glass, and especially preferable constituent materials are bismuth type glass and lead type glass whose softening point is 370 degreeC-550 degreeC. When the insulation part 32 for disconnection part formation contains bismuth type glass or lead type glass, when the resistance heating wiring part 15 becomes 600 degreeC or more, for example, bismuth type glass or lead type glass will soften, and Alternatively, the electrical insulation portion 34 may be formed to react with the silver alloy, and the resistance heating wiring portion 15 or the conductor wiring portion 19 may be disconnected.

As the bismuth-based glass, and the like Bi 2 O 3 -ZnO-B 2 O 3 based glass. Further, as the lead-based glass, and the like PbO-B 2 O 3 based glass.

As described above, when the resistive heating wiring portion 15 becomes above a predetermined temperature due to thermal runaway or the like, the insulation portion 32 for forming a disconnection portion forms the electrical insulation portion 34. This phenomenon is demonstrated using FIG. 12 and FIG. 12 is provided with the insulation part 32 for contact formation of the disconnection part formed in the upper surface of one part of the conductor wiring part 19 by the length equal to or more than the line width of the conductor wiring part 19, It is a schematic diagram of the heater which does not show the resistance heating wiring part 15, and when the resistance heating wiring part 15 becomes more than predetermined temperature, as shown in FIG. 13, the structure of the insulation part 32 for disconnection part formation is formed. The material and the constituent material of the conductor wiring portion 19 react to form an electrical insulation portion 34 to disconnect the conductor wiring portion 19.

In the heater of FIG. 14 having an insulation portion 32 for forming a disconnection portion formed in contact with an upper layer side surface of the resistance heating wiring portion 15 having parallel wirings, when the resistance heating wiring portion 15 is equal to or higher than a predetermined temperature. The constituent material of the insulation portion 32 for disconnection forming and the constituent material of the resistive heating wiring part 15 react to form an electrical insulation portion 34 (not shown) to form the resistive heating wiring part 15. To disconnect.

When the heater I having the insulation portion 32 for disconnection forming is operated, the entirety of the base portion 11 (or the base layer 12) becomes a heat source centering on the resistance heating wiring portion 15. Even if the electric insulator 34 is formed and the power supply is interrupted, the temperature of the heater may not immediately decrease. In this invention, the heater (refer FIG. 11 and FIG. 14) by which the insulation part 32 for disconnection part formation was formed in contact with the resistance heating wiring part 15, or the insulation part 32 for disconnection part formation is a conductor. It is a heater contacted and formed in the wiring part 19, and the conductor wiring part 19 is extended and formed interruptively between the dense wiring (resistance heating wiring part 15), and a disconnection part is formed in a part of it. By making the formation insulating part 32 into the contact-formed heater (refer FIG. 16), the heat retention temperature of the resistance heating wiring part 15 can be lowered earlier.

Since the heater I includes the base portion 11 including the base layer 12 and the electrical insulating layer 13 made of stainless steel, the fine particles from the constituent members are not produced at the time of use. It is suitable for use in clean rooms, precision machines, heat treatment apparatuses with reduced pressure or pressure, fixing devices and the like.

8 is sectional drawing which shows the heater (henceforth "heater II") provided with the resistance heating wiring part 15 etc. on the surface of the base part 11 made of insulating ceramic. In this heater II, the component of the surface of the base part 11 made of insulating ceramic is the surface of the electrical insulation layer 13 in the heater I shown in FIG. 4, FIG. 6, and FIG. Like the component of

The heater shown by FIG. 8 is formed in the elongate base part 11, the resistance heating wiring part 15 which is formed in the surface of the base part 11, and has several parallel wiring which generate | occur | produces electricity by electricity, It is formed on the surface of the base part 11, and is provided with the two power supply terminal parts 17 which supply electric power to the resistance heating wiring part 15 through the conductor wiring part 19. As shown in FIG. In addition, this heater II can be equipped with the protective layer which is not shown in figure. In addition, it is also possible to include the insulation part 32 for disconnection part formation in the same form as the heater I (refer FIG. 15).

9 is sectional drawing which shows the heater (henceforth "the heater (III)") provided with the resistance heating wiring part 15 etc. in the inside of the base part 11 made of insulating ceramic. In this heater (III), the component inside the base part 11 made of insulating ceramic is the component of the surface of the electrical insulation layer 13 in the heater I shown in FIG. 4 and FIG. You can do as Moreover, it can also be set as the form which does not have a conductor wiring part, In this case, the resistance heating wiring part 15 is connected between the terminal parts 17 for electric power feeding. However, in this heater III, the protective layer in the heater I is not normally arrange | positioned.

The heater III shown by the sectional drawing of FIG. 9 is the resistive heating wiring which has the elongate base part 11 and the some parallel wiring embedded in the inside of the base part 11, and generate | occur | produces heat by electricity supply. The part 15 and a part of the base part 11 are connected to the resistance heating wiring part 15, and a part of the part 15 is exposed to the surface of the base part 11, and the resistance heating wiring part 15 is exposed to the resistance heating wiring part 15. Two power supply terminal portions 17 for supplying electric power are provided. In addition, this heater III can be provided with the conductor wiring part 19 which is not shown in FIG. 9 as mentioned above.

In the heaters (II) and (III), the constituent material of the resistive heating wiring section 15 includes silver, molybdenum, tungsten, silver-palladium, silver-platinum, etc., each having a resistance value temperature coefficient of 500 to 4,400 ppm / ° C. It is preferable to include.

In addition, the line thickness of the resistive heating wiring portion 15 is preferably 3 to 20 µm, more preferably 5 to 17 µm, and still more preferably 8 to 12 µm from the viewpoint of area specific resistance.

In the heaters (II) and (III), the constituent material of the power supply terminal portion 17 and the constituent material of the conductor wiring portion 19 are silver, silver-palladium, silver-platinum, copper, gold, platinum- Rhodium or the like.

In the heaters (II) and (III), aluminum oxide and aluminum nitride are preferable as constituent materials of the base portion 11.

The thickness of the base part 11 in the heater II becomes like this. Preferably it is 0.2-5 mm, More preferably, it is 0.4-2 mm.

Moreover, the thickness of the base part 11 in the heater III becomes like this. Preferably it is 0.2-5 mm, More preferably, it is 0.4-2 mm.

In FIG. 9 showing the heater III, the power supply terminal 17 is connected to the resistance heating wiring 15 and the inside of the base 11, but is not limited to this embodiment. The dedicated terminal part 17 may be arrange | positioned at each end surface of the both ends side in the longitudinal direction of a heater. Although the conductor wiring part 19 is not shown in FIG. 9, even when it comprises the conductor wiring part 19 which conducts with the resistance heating wiring part 15, in each end surface, the conductor wiring part 19 is carried out. May be arranged.

The heater II is a step of producing an elongated plate containing insulating ceramics, and includes a material having a resistance temperature coefficient of 500 to 4,400 ppm / 占 폚 on the surface of the ceramic plate, and has an inclined rectangular pattern. It is obtained by the manufacturing method which includes the process of forming the resistance heating wiring part containing the surface, and the surface of the ceramic plate, and the process of forming at least two terminal parts for electric power feeding in the both ends of the longitudinal direction of a board, or the peripheral part. Moreover, the process of forming a conductor wiring part can be provided.

The method of manufacturing a ceramic plate is illustrated below.

(1) A method of producing a green sheet using a ceramic slurry containing powder of insulating ceramics and heat-treating it

To the ceramic slurry, sintering aids such as silicon oxide, calcium oxide, titanium oxide, magnesium oxide, zirconium oxide, dispersant, plasticizer, organic solvent and the like can be added.

(2) A method of heat-treating a molded body having a predetermined shape produced by providing a mixture of powder of insulating ceramic, a sintering aid, and the like by pressure molding.

In addition, the heater II has a resistance value temperature coefficient of 500 to 4,400 ppm / ° C for the resistive heating wiring portion at a predetermined position on the surface of the elongated green sheet containing the powder of insulating ceramics prepared as described above. The process of disposing a paste made of a phosphorus material or a metal foil made of the material, a paste made of a material for a terminal portion or a conductor wiring part, or a metal foil made of the material is arranged at a predetermined position on the surface of the green sheet. It can obtain by the manufacturing method provided with the process of doing and the process of heat-processing in these lamination | stacking states.

Also in all the cases in the manufacturing method of the heater (II) shown above, the process of forming a protective layer, etc. can also be provided.

The heater III is, for example, a step of producing two elongated green sheets containing powder of insulating ceramics, and a resistance value temperature coefficient for a resistive heating wiring portion at a predetermined position on the surface of one green sheet. Is a paste made of a material having a content of 500 to 4,400 ppm / ° C, or a step of disposing a metal foil made of the material, a paste made of a material for a terminal portion or a conductor wiring portion at a predetermined position on the surface of the green sheet, or It can obtain by the manufacturing method provided with the process of arrange | positioning the metal foil which consists of this material, and the process of arrange | positioning another green sheet and heat-processing so that the surface of these laminated bodies may be interposed.

In the present invention, the positions of the power supply terminal portion 17, the conductor wiring portion 19, and the like specifically shown are not limited to the positions shown in Figs.

In addition, although the form provided with one circuit in the one base part 11 was shown in FIGS. 4-7, it is not limited to this, It can be set as the form provided with several circuit.

Even in the heaters II or (III) having the insulation portion 32 for disconnection forming, the entire base 11 becomes a heat source at the time of its operation, centering on the resistance heating wiring portion 15. The electrical insulation portion 34 is formed due to thermal runaway, so that even if the power supply is interrupted, the temperature of the heater may not decrease immediately. In the present invention, the heater (see Fig. 15) in which the disconnection portion forming insulation portion 32 is formed in contact with the resistance heating wiring portion 15, or the insulation portion formation portion for the disconnection portion forming the conductor wiring portion ( It is a heater which is formed in contact with 19, and the conductor wiring part 19 is extended and formed interruptively between the wiring (resistance heating wiring part 15) which is crowded, and the insulation for forming a disconnection part is formed in a part of it. By making the part 32 into the contact-formed heater (not shown), the extra heat temperature of the resistance heating wiring part 15 can be lowered earlier.

The heater of one embodiment in the present invention can generate heat by connecting to a conventionally well-known power supply device in the terminal portion 17 for power supply. The exothermic temperature in the heaters I and II is preferably 50 ° C to 600 ° C, more preferably 120 ° C to 500 ° C. In the heater (III), the temperature is preferably 50 ° C to 1,000 ° C.

In the heater of one embodiment of the present invention, the resistance heating wiring portion 15, the terminal portion 17 for feeding, the conductor wiring portion 19 and the like do not need to be formed directly on the surface of the base portion.

Hereinafter, it is a heater provided with the insulation part 32 for disconnection part formation, At least 1 of the resistance heating wiring part 15, the power supply terminal part 17, and the conductor wiring part 19 is the surface of the base part 11. The form directly formed at will be described.

The heaters of FIGS. 18, 20, 29, and 30 are stacked heaters provided with a resistance heating wiring portion 15 and a conductor wiring portion 19 in this order on one side of the base portion 11, In the case of seeing them from the base portion 11, a portion of the resistance heating wiring portion 15, at least a portion of the insulation portion 32 for forming a disconnection portion, and a portion of the conductor wiring portion 19 are in surface contact with each other. It is a heater having a part.

18 shows a first insulating layer 13 which is an electrical insulating layer, a resistance heating wiring section 15, and a second insulating layer 16 which is an electrical insulating layer on the surface of the base layer 12 made of stainless steel or the like. ) And an insulation portion 32 for forming a disconnection portion disposed to be surrounded by the second insulation layer 16 in the second insulation layer 16, and forming the second insulation layer 16 and the disconnection portion. And a conductor wiring portion 19 formed on the surface of the insulating insulation portion 32 and deposited from the left end of the resistance heating wiring portion 15 toward the surface side, and the surface of the conductor wiring portion 19. It is an aspect provided with the overcoat layer 21 which consists of insulating materials formed in the. 20 shows the first insulating layer 13, which is an electrical insulating layer, the resistive heating wiring section 15, and the second insulating layer, which is an electrical insulating layer, on the surface of the base layer 12 made of stainless steel or the like. (16) and the insulating part 32 for disconnection part formation arrange | positioned so that the 2nd insulating layer 16 may be enclosed in this 2nd insulating layer 16, These 2nd insulating layer 16 and a disconnection line are provided. The conductor wiring portion 19 formed on the surface of the insulator forming portion 32 and deposited from the left end of the resistance heating wiring portion 15 toward the surface side, and the surface of the conductor wiring portion 19. It is provided with the overcoat layer 21 which consists of an insulating material, and is provided with the insulation part 32 for disconnection part formation arrange | positioned so that the overcoat layer 21 may be enclosed in the overcoat layer 21. As shown in FIG.

29 shows a resistive heating wiring section 15, a second insulating layer 16 which is an electrical insulating layer, and the second insulating layer 16 on the surface of the base 11 containing insulating ceramics. And an insulation portion 32 for disconnection part formation disposed to be surrounded by the second insulation layer 16, and formed on the surfaces of these second insulation layer 16 and the insulation part 32 for disconnection part formation. Moreover, the overcoat layer 21 which consists of an insulating material provided with the conductor wiring part 19 formed by accumulating toward the surface side from the left end of the resistance heating wiring part 15, and was formed in the surface of this conductor wiring part 19. FIG. ). 30 shows a resistive heating wiring section 15, a second insulating layer 16 which is an electrical insulating layer, and the second insulating layer 16 on the surface of the base 11 containing insulating ceramics. And an insulation portion 32 for disconnection part formation disposed to be surrounded by the second insulation layer 16, and formed on the surfaces of these second insulation layer 16 and the insulation part 32 for disconnection part formation. Furthermore, the conductor wiring part 19 formed by accumulating toward the surface side from the left end part of the resistance heating wiring part 15, and the overcoat layer 21 which consists of the insulating material formed in the surface of this conductor wiring part 19 are carried out. It is a form provided with the insulation part 32 for disconnection part formation arrange | positioned so that the overcoat layer 21 may be enclosed in the overcoat layer 21.

In the heaters of FIGS. 18 and 29, when the resistive heating wiring part 15 reaches a predetermined temperature or more, as shown in FIG. 21, the constituent material of the disconnecting part forming insulating portion 32 is the resistive heating wiring part. By reacting with both the constituent material of (15) and the constituent material of the conductor wiring part 19, the electrical insulation part 34 is formed and the resistance heating wiring part 15 and the conductor wiring part 19 are disconnected.

In addition, in the heaters of FIGS. 20 and 30, when the resistance heating wiring part 15 reaches a predetermined temperature or more, as shown in FIG. 22, the constituent material of the insulation part 32 for forming a disconnection part generates resistance heating. Reacts with both the constituent material of the wiring portion 15 and the constituent material of the conductor wiring portion 19, and the constituent material of the insulation portion 32 for forming the disconnection portion is formed from the constituent material of the conductor wiring portion 19. In response, the electrical insulation part 34 is formed and the resistance heating wiring part 15 and the conductor wiring part 19 are disconnected.

24, 26, 32, and 33 are the laminated heaters provided with the conductor wiring part 19 and the resistance heating wiring part 15 in this order in the one surface side of the base part 11, In the case of viewing them from the base portion 11, a portion of the conductor wiring portion 19, at least a portion of the insulation portion 32 for forming a disconnection portion, and a portion of the resistance heating wiring portion 15 are in surface contact with each other. It is a heater having a part.

FIG. 24 shows the first insulating layer 13, which is an electrical insulating layer, the conductor wiring portion 19, and the second insulating layer 16, which is an electrical insulating layer, on the surface of the base layer 12 made of stainless steel or the like. And the insulation part 32 for disconnection part formation arrange | positioned so that the 2nd insulation layer 16 may be enclosed in the 2nd insulation layer 16, and these 2nd insulation layer 16 and for disconnection part formation A resistance heating wiring section 15 formed on the surface of the insulating section 32 and connected to the conductor wiring section 19 formed from the left end of the conductor wiring section 19 toward the surface side, and the resistance heating circuit; It is an aspect provided with the overcoat layer 21 which consists of an insulating material formed in the surface of the wiring part 15. As shown in FIG. 26 shows the first insulating layer 13, which is an electrical insulating layer, the conductor wiring portion 19, and the second insulating layer, which is an electrical insulating layer, on the surface of the base layer 12 made of stainless steel or the like. 16 and an insulation portion 32 for forming a disconnection portion disposed to be surrounded by the second insulation layer 16 in the second insulation layer 16, and the second insulation layer 16 and the disconnection portion A resistance heating wiring portion 15 formed on the surface of the forming insulation portion 32 and connected to the conductor wiring portion 19 formed from the left end of the conductor wiring portion 19 toward the surface side; An insulation portion for forming a disconnection portion provided with an overcoat layer 21 made of an insulating material formed on the surface of the resistive heating wiring portion 15 and surrounded by the overcoat layer 21 in the overcoat layer 21 ( 32).

32 shows the conductor wiring portion 19, the second insulating layer 16 which is an electrical insulating layer, and the second insulating layer 16 on the surface of the base 11 containing insulating ceramics. And an insulation portion 32 for disconnection part formation disposed to be surrounded by the second insulation layer 16, and formed on the surfaces of the second insulation layer 16 and the insulation part formation for disconnection part 32, Moreover, the insulation heating wiring part 15 connected to the conductor wiring part 19 deposited toward the surface side from the left end part of the conductor wiring part 19, and the insulation formed in the surface of this resistance heating wiring part 15 is carried out. It is a form provided with the overcoat layer 21 which consists of materials. 33 shows the conductor wiring portion 19, the second insulating layer 16 which is an electrical insulating layer, and the second insulating layer 16 on the surface of the base 11 containing insulating ceramics. And an insulation portion 32 for disconnection part formation disposed to be surrounded by the second insulation layer 16, and formed on the surfaces of the second insulation layer 16 and the insulation part formation for disconnection part 32, Moreover, the insulation heating wiring part 15 connected to the conductor wiring part 19 deposited toward the surface side from the left end part of the conductor wiring part 19, and the insulation formed in the surface of this resistance heating wiring part 15 is carried out. The overcoat layer 21 which consists of a material is provided, and in this overcoat layer 21, the insulation part 32 for disconnection part formation arrange | positioned so that it may be surrounded by the overcoat layer 21 is provided.

In the heaters of FIGS. 24 and 26, even when the resistance heat generating wiring portion 15 becomes above a predetermined temperature, a part of the conductor wiring portion 19, at least a part of the insulating portion 32 for forming a disconnection portion, and a resistance In a part where the heat generating wiring portion 15 is in surface contact with each other, at least an electrical insulating portion 34 is formed (not shown).

18, 20, 24, 26, 29, 30, 32, and 33, the insulation portion 32 for forming a disconnection portion includes a resistance heating wiring portion 15 and a conductor wiring portion 19. In FIG. It is in contact with both sides. In the heater of one embodiment of the present invention, the insulation portion 32 for forming a disconnection portion can be formed in contact with either the resistance heating wiring portion 15 or the conductor wiring portion 19 (FIG. 17, 19, 23, 25, 28, 31, 34 and 35).

The material constituting the second insulating layer 16 or the third insulating layer 23 shown in FIGS. 17 to 33 is selected from crystallized glass and semi-crystallized glass, which are constituent materials of the first insulating layer 13. such, may be equal to or higher than a softening point of 600 ℃, such as SiO 2 -Al 2 O 3 -MO-based glass is preferred. However, MO is an alkaline earth metal oxide (MgO, CaO, BaO, SrO, etc.).

In addition, the overcoat layers 21, 21A, and 22B shown in FIGS. 17-35 are arrange | positioned for protection of the resistance heating wiring part 15, the conductor wiring part 19, etc. Specifically, a heater It is provided with the effect which suppresses oxidation deterioration etc. of the resistance heating wiring part 15 and the conductor wiring part 19, etc. when it is operating. The constituent material of the overcoat layer is preferably SiO 2 -Al 2 O 3 -MO glass or the like.

It is preferable that the softening point of the constituent material of the overcoat layer is higher than the softening point of the constituent material of the insulation part 32 for disconnection part formation. The temperature difference between them is preferably 100 ° C or more, and more preferably 150 ° C or more.

Next, in the heater of another form in this invention, the structural material of the resistance heating wiring part 15, its wiring form, and the number of electrode parts for electric power feeding are not specifically limited.

The constituent material of the resistive heating wiring section 15 preferably has a resistance temperature coefficient of 500 to 4,400 ppm / 占 폚, but is not limited thereto. Although the wiring of the resistance heating wiring part 15 is preferably parallel wiring, it is not limited to this, A series wiring may be sufficient. In addition, when providing a rectangular pattern, the inclined rectangular pattern 20 shown in FIG.1 (B), FIG.2, and FIG.3 is preferable, but the pattern shown in FIG.1 (A) may be sufficient. In addition, the line thickness of the resistive heating wiring portion 15 is preferably 5 to 27 µm, more preferably 7 to 24 µm, still more preferably 8 to 13 µm.

In the heater of the other aspect in this invention, the terminal part for electric power feeding can be made into three or more places as needed (not shown).

The thickness of the terminal portion for conductors and the conductor wiring portion is preferably 5 to 27 µm, more preferably 7 to 24 µm, still more preferably 9 to 12 µm.

As another type of heater in this invention, Preferably, FIG. 12, 14, 15, 17, 18, 19, 20, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34 and 35 are shown. Description in these drawings is the same as above except for the wiring form, and the description about all the components is applied.

The heater of another form in this invention can generate heat by connecting to the power supply apparatus conventionally well-known in the terminal part 17 for electric power feeding. The exothermic temperature is preferably 50 ° C to 1,000 ° C.

When the heater of the present invention is used, any of organic materials, inorganic materials, and composites in which these are heat treated can be subjected to stable heat treatment while suppressing temperature unevenness, regardless of the size thereof. Although the method of heat processing is selected according to the objective, a use, etc., you may carry out, moving a heater and a to-be-heat-treated material, and may fix it, fixing one side, and moving the other.

The fixing device of the present invention includes the heater of the present invention. That is, the fixing apparatus of this invention is an apparatus which heats a heater and joins two articles.

The structure of the fixing apparatus of this invention can be suitably selected according to the use of a product obtained, a fixing means, etc. For example, it is a case where it is provided with the fixing means accompanying a crimping | compression-bonding, When a toner etc. are fixed to a recording medium, such as paper, and when joining a some member, the heating part provided with a heater, and pressurization It can be set as the fixing apparatus provided with a part. Of course, it can also be set as a fixing means which does not involve pressing. In the present invention, as shown in Figs. 37 and 38, it is preferable that the fixing device 5 fixes an unfixed image containing toner formed on the surface of a recording medium such as paper or film to the recording medium. Do.

Hereinafter, the fixing apparatus of this invention is demonstrated based on FIG. 37 and FIG.

FIG. 37 is a schematic view showing a main part of the fixing device 5 disposed in the electrophotographic image forming apparatus, and includes a rotatable fixing roll 51 and a rotatable pressing roll 54. (1) is an aspect arrange | positioned inside the fixing roll 51. The heater 1 is preferably arranged to be close to the inner surface of the fixing roll 51.

In the fixing device 5 of FIG. 37, the heater 1 is driven by application of a voltage from a power supply device (not shown), and the heat detected by the temperature measuring device (not shown) is a roll for fixing ( 51). Then, when a recording medium having an unfixed toner image on the surface is supplied between the fixing roll 51 and the pressure roll 54, the pressure contact of the fixing roll 51 and the pressure roll 54 is performed. In the unit, the toner is melted to form a fixed image.

In addition, in FIG. 37, since it has the pressure contact part of the fixing roll 51 and the pressurizing roll 54, the fixing roll 51 and the pressurizing roll 54 are rotated together in the drive of a fixing apparatus. . As described above, since the local temperature rise, which tends to occur when a small recording medium is used, is suppressed, temperature nonuniformity in the fixing roll 51 is less likely to occur, so that the fixing proceeds smoothly. You can. In addition, damage to the member disposed around the heater 1 can be suppressed.

38 is also a schematic diagram showing a main part of the fixing device 5 disposed in the electrophotographic image forming apparatus, and includes a rotatable fixing roll 51 and a rotatable pressing roll 54. And a pressurizing roll 52 for pressing the recording medium together with the heater 1 and the pressurizing roll 54 which transfers heat to the fixing roll 51 in the fixing roll 51. Form. The heater 1 is preferably arranged to follow the inner surface of the fixing roll 51.

In the fixing apparatus 5 of FIG. 38, the heater 1 is driven by application of a voltage from a power supply device (not shown), and the heat detected by the temperature measuring device (not shown) is a fixing roll ( 51). Then, when the recording medium having an unfixed toner image on the surface is supplied between the fixing roll 51 and the pressing roll 54, the fixing roll 51 pressurized by the pressing roll 52. In the contact portion of the press roll 54, the toner is melted to form a fixed image.

In addition, also in FIG. 38, since it has a press contact part of the fixing roll 51 and the pressurizing roll 54, the fixing roll 51 and the pressurizing roll 54 are rotated together in the drive of a fixing apparatus. do. As described above, since the local temperature rise, which tends to occur when a small recording medium is used, is suppressed, the temperature unevenness in the fixing roll 51 is also less likely to occur, so that the fixing proceeds smoothly. You can. In addition, damage to the member disposed around the heater 1 can be suppressed.

As another form in the fixing apparatus of this invention, it is a metal mold provided with an upper mold | type and a lower mold | type, and it can be set as the form which arrange | positioned the heater in at least one inside of an upper mold | type and a lower mold | type.

The drying apparatus of this invention is provided with the heater part containing the heater of the said invention.

The structure of the drying apparatus of this invention can be suitably selected according to the shape, size, etc. of the to-be-heat-processed material. In this invention, it can be set as the form provided with the housing part, the sealable window part arrange | positioned for dispensing, etc. of the to-be-heat-processed material, and the movable heater part arrange | positioned inside the housing part, for example. If necessary, the pressure inside the housing portion to adjust the pressure inside the housing portion, the exhaust portion for disposing the heat treated substance, the exhaust portion for discharging the gas when the gas is discharged by drying the heat treated substance, And a pressure regulator such as a vacuum pump.

Drying may be performed in the state which fixed the to-be-heat-processed material and a heater part, and you may carry out moving either one.

The heater of this invention is suitable as a structural member of an image forming apparatus.

The structure of an image forming apparatus can be suitably selected according to the use of the product obtained, the purpose of heating, etc. For example, as shown in FIG. 39, image production means for forming an unfixed image on the surface of a recording medium such as paper or film, and fixing means 5 for fixing the unfixed image to the recording medium are shown. It can be set as the image forming apparatus 4 with which the fixing means 5 is equipped with the heater of the said invention.

Hereinafter, the image forming apparatus will be described based on FIG. 39.

Fig. 39 is a schematic diagram showing the main part of the electrophotographic image forming apparatus 4.

As the image forming means, any of a system having a transfer drum and a system without a transfer drum may be used, but FIG. 39 is a form including a transfer drum.

In the image forming means, the laser output from the laser scanner 41 is irradiated to the charging process surface of the photosensitive drum 44 charged to a predetermined potential by the charging device 43 while rotating, and the developing device 45 is provided. Electrostatic latent images corresponding to desired image information are formed by the toner supplied from the toner. Then, the toner image is transferred onto the surface of the transfer drum 46 that cooperates with the photosensitive drum 44 by using the potential difference. Thereafter, the toner image is transferred to the surface of the recording medium supplied between the transfer drum 46 and the transfer roll 47, and a recording medium having an unfixed image is obtained.

In addition, although the image production means may be provided with the cleaning apparatus for removing insoluble toner etc. on the surface of the photosensitive drum 44 and the transfer drum 46, it is not shown in FIG.

In addition, a toner is particle | grains containing a binder resin, a coloring agent, and an additive, and melting temperature of a binder resin is 90 degreeC-220 degreeC normally.

Subsequently, the fixing means 5 can have the same structure as the fixing apparatus in the present invention, and includes a heater holder 53 having a pressurizing roll 54 and a notification direction conduction type heater 1. It is provided in the and is provided with the fixing roll 51 which cooperates with the pressure roll 54. The recording medium having an unfixed image from the image forming means is supplied between the fixing roll 51 and the pressing roll 54 to obtain a recording medium on which an image is fixed. That is, the heat of the fixing roll 51 melts the toner image of the recording medium, and the melted toner is pressurized by the pressure-contacting portions of the fixing roll 51 and the pressing roll 54, thereby toner The image is fixed to the recording medium.

In general, when the temperature of the fixing roll 51 becomes uneven and the amount of heat applied to the toner is too small, the toner is peeled from the recording medium, while when the amount of heat is too large, the toner is fixed to the fixing roll 51 Is fixed to the recording medium, and the fixing roll 51 may be re-attached to the recording medium. However, according to the fixing means 5 provided with the heater of the present invention, adjustment to a predetermined temperature is rapid, The problem can be suppressed.

Although the fixing means 5 of FIG. 39 was made into the form provided with the fixing roll 51 and the pressurizing roll 54, the image forming apparatus replaced the heater 1 with the fixing roll 51 instead. It may be a form provided with the fixing belt arrange | positioned closely.

In the image forming apparatus 4 of FIG. 39, other means, not shown, may include recording medium conveying means, recording medium conveying means, and control means for controlling the respective means.

EXAMPLE

Although an Example is given to the following and this invention is demonstrated to it in more detail, this invention is not limited to these Examples, unless the meaning of this invention is exceeded.

Example 1

(1) Manufacture of stainless steel heater

In the following way, the stainless steel heater 1A shown in FIG. 40 was manufactured.

After the surface of the substrate (270㎜ length, width and thickness 24㎜ 0.6㎜) containing SUS430 smooth processing, the components are a material for SiO 2 -Al 2 O 3 -RO of crystallized glass is formed, after the drying treatment 100㎛ It applied to the whole surface of the board | substrate so that it might become. Then, the coating film was baked at 850 degreeC, and the insulating layer containing the crystallized glass with a film thickness of 85 micrometers was obtained.

Then, using a paste containing no powder containing lead, cadmium and nickel and containing a silver-palladium alloy (resistance temperature coefficient 1500 ppm / ° C), the surface of the insulating layer 13 is shown in Fig. 40. The circuit pattern which was inclined in the longitudinal direction of the stainless steel board | substrate was printed including the inclined rectangular pattern for making the resistance heating wiring part 15 shown in the figure. Subsequently, this printing part was baked at 850 degreeC, and the resistance heating wiring part 15 was formed. In addition, the line width of the resistive heating wiring section 15 is 0.5 mm, and the line thickness is 13 µm. In addition, using a paste containing silver powder, a pattern for forming the terminal portion 17 and the conductor wiring portion 19 for supplying electric power to the resistance heating wiring portion 15 at a predetermined position is printed. It was. And this printing part is baked at 850 degreeC, and through the resistance heating wiring part 15 and conductor wiring part 19 which have a some parallel wiring, the terminal part 17 for power supply from the other power supply terminal part 17 ( 17) (see FIG. 40).

Next, for forming crystallized glass used in the formation of the insulating layer 13 on the entire surface of the substrate including the surfaces of the obtained resistance heating wiring portion 15, the terminal portion 17 for feeding and the conductor wiring portion 19. Using the material, the first protective layer having a thickness of 50 µm was formed. And it was applied to a glass material for the amorphous form made of a SiO 2 -Al 2 O 3 -B 2 O 3 -RO on the surface of the first protective layer. Thereafter, the coating film was baked at 750 ° C. to form a second protective layer having a thickness of 25 μm, thereby obtaining a stainless steel heater 1A (see FIG. 40, and the first protective layer and the second protective layer are shown in FIG. Not).

(2) evaluation of heaters

This evaluation (hereinafter referred to as "evaluation E1") is used in image forming apparatuses such as a printing machine, a copier, a facsimile, etc. employing an electrophotographic method, and the like by heating an unfixed toner image supported on a recording medium such as paper. In the apparatus for fixing a toner image, when fixing to a moving recording medium, the heat sink 3A attached to the recording medium which takes heat away is brought into contact with the rear surface of the stainless steel heater 1A to heat the heat sink 3A. The temperature of the contact part which contacts the stainless steel heater 1A, and the temperature in the non-contact part which the heat sink 3A does not contact the stainless steel heater 1A are observed over time. The heat sink 3A is made of aluminum and, as shown in Fig. 41, is an integrated product in which eight fins (16 mm x 100 mm) are arranged in parallel with a gap of 5 mm.

42 is a schematic view of the apparatus for evaluation E1. In this evaluation apparatus, 1 A of stainless steel heaters are arrange | positioned holding the both ends in the state which made the resistance heating wiring part etc. upward. A thermocouple (type K) is connected to the center of the heater 1A, and an alternating voltage (100V) is supplied from the temperature controller "E5EN" manufactured by Omron Corporation to the terminal portion 17 for power supply on both ends of the stainless steel heater 1A. The stainless steel heater is operated by PID control to generate heat at a predetermined temperature. And the temperature of the heater changed by the contact of 3 A of heat sinks was measured by the thermotracer "TH9100MR / WRI" made from NEC company provided above 1 A of stainless steel heaters. In addition, the thermocouple and the temperature measuring device are not shown in FIG.

In this evaluation experiment, while the temperature of the stainless steel heater 1A was maintained at 200 ° C., three predetermined positions shown in FIG. 42 were changed while changing the contact positions of the heat sink 3A and the back surface of the stainless steel heater 1A. In (P), (Q), and (R), temperature was measured continuously. In addition, (P), (Q), and (R) are all the centers of the width direction of the stainless steel heater 1A, (Q) is the center of the stainless steel heater 1A, (P) and (R) are centered from the center. 75 mm apart. In addition, the area of a temperature measurement point is all about 0.8 mm <2>.

The usage method of the heat sink 3A is as follows. That is, after making the heat sink 3A contact for 2 minutes at the position P in the stainless steel heater 1A maintained at 200 degreeC, the heat sink 3A is removed and the temperature of the stainless steel heater 1A is Wait for the recovery to 200 ° C. Subsequently, after making the heat sink 3A contact for 2 minutes at the position Q of the stainless steel heater 1A, the heat sink 3A is removed and it waits for the temperature of the stainless steel heater 1A to recover to 200 degreeC. . Thereafter, the heat sink 3A is brought into contact with the stainless steel heater 1A at the position R for 2 minutes, and then the heat sink 3A is removed, and in three places P, Q, and R, The experiment ends when the temperature becomes almost constant.

The experimental result of the evaluation E1 is shown in FIG. According to FIG. 43, when the heat sink 3A was in contact with the position P and (R) in the stainless steel heater 1A, the temperature fall in each position was about 30 degreeC-40 degreeC. When the heat sink 3A was in contact with the position Q, the temperature rise in the positions P and R was about 40 ° C to 50 ° C.

Example 2

As a paste for forming the resistive heating wiring section 15, a paste containing powder containing no lead, cadmium or nickel and containing a silver-palladium alloy (resistance temperature coefficient of 1,000 ppm / 占 폚) is used. The stainless steel heater 1A shown in FIG. 44 was produced like Example 1 except having formed the resistance heating wiring part 15 which has a pattern shown in 44, and the same evaluation as Example 1 is performed. It was.

The experimental result of the evaluation E1 is shown in FIG. According to FIG. 45, when the heat sink 3A contacted the position P and R in the stainless steel heater 1A, the temperature fall in each position was about 30 degreeC-40 degreeC. When the heat sink 3A was in contact with the position Q, the temperature rise in the positions P and R was about 60 ° C to 70 ° C.

Comparative Example 1

As a paste for forming the resistive heating wiring section 15, a paste containing powder containing no lead, cadmium or nickel and containing a silver-palladium alloy (resistance temperature coefficient of 1,000 ppm / 占 폚) is used. A stainless steel heater shown in FIGS. 46 and 47 was produced in the same manner as in Example 1 except that the resistive heating wiring section 15 having the pattern shown in 46 was produced, and the same evaluation as in Example 1 was performed. It was.

The experimental result of the evaluation E1 is shown in FIG. According to FIG. 48, when the heat sink 3A is in contact with the position P and R in a heater, the temperature fall in each position was about 20 degreeC-80 degreeC, but the position Q ), When the heat sink 3A is in contact with each other, the temperature rise in the positions P and R was about 80 ° C to 90 ° C.

Comparative Example 2

Evaluation similar to Example 1 was performed using the commercially available ceramic heater provided with the resistance heating wiring part which has the pattern shown in FIG. The material of the base portion is Al 2 O 3 .

The experimental result of the evaluation E1 is shown in FIG. According to FIG. 50, when the heat sink 3A contacted the position P and R in a heater, the temperature fall in each position was about 50 degreeC-60 degreeC, but the position Q ) And the heat sink 3A were in contact with each other, and the temperature rise in the positions P and R was about 90 ° C to 110 ° C.

Example 3

(1) Manufacture of stainless steel heater

In the following way, the stainless steel heater 1B shown in FIG. 51 was manufactured.

A substrate including a SUS430 (270㎜ length, width and thickness 24㎜ 0.6㎜) after smoothing the surface, the component is a material for forming a crystallized glass SiO 2 -Al 2 O 3 -RO, after the drying treatment of 39㎛ It applied to the whole surface of the board | substrate so that it might become. Subsequently, the coating film was baked at 850 ° C. to form a crystallized glass film having a film thickness of 25 μm. This application | coating and baking were repeated twice also, and the insulating layer of 75 micrometers in thickness was obtained.

Thereafter, using a paste containing a powder containing a silver-palladium alloy (resistance temperature coefficient of 1500 ppm / ° C), the surface of the insulating layer is used for the resistive heating wiring section 15 shown in FIG. 51. The inclination rectangular pattern was printed and the circuit-shaped pattern folded back in the longitudinal direction of the stainless steel substrate was printed. Subsequently, this printing part was baked at 850 degreeC, and the resistance heating wiring part 15 was formed. In addition, the line width of the resistive heating wiring section 15 is 0.5 mm, and the line thickness is 13 µm. In addition, using a paste containing silver powder, a pattern for forming the terminal portion 17 and the conductor wiring portion 19 for supplying electric power to the resistance heating wiring portion 15 at a predetermined position is printed. It was. And this printing part is baked at 850 degreeC, and through the resistance heating wiring part 15 and conductor wiring part 19 which have a some parallel wiring, the terminal part 17 for power supply from the other power supply terminal part 17 ( 17) (see FIG. 51).

Next, for forming crystallized glass used in the formation of the insulating layer 13 on the entire surface of the substrate including the surfaces of the obtained resistance heating wiring portion 15, the terminal portion 17 for feeding and the conductor wiring portion 19. Using the material, application and baking were repeated twice, to form a first protective layer having a film thickness of 44 μm. And it was applied to a material for forming an amorphous glass made of SiO 2 -Al 2 O 3 -B 2 O 3 -RO on the surface of the first protective layer. Thereafter, the coating film was baked at 750 ° C. to form a second protective layer having a thickness of 20 μm, thereby obtaining a stainless steel heater 1B (see FIG. 51, and the first protective layer and the second protective layer are shown in FIG. Not).

(2) evaluation of heaters

Evaluation was performed using the apparatus shown in FIG. 52 for the same purpose as Example 1 and 2 (hereinafter, referred to as "evaluation E2"). In addition, instead of the heat sink 3A used in Example 1, etc., the aluminum plate 3B (width 100mm x length 300mm x thickness 1mm) based on the heat sink 3A shown in FIG. 41 is used as a heat sink. Loaded. The test was performed by making the space | interval of this aluminum plate 3B and the back surface of a heater into about 1 mm.

In the apparatus for evaluation E2 shown in FIG. 52, the stainless steel heater 1B is arrange | positioned by supporting both ends, in the state which made the resistance heating wiring part etc. upward. A thermocouple (K type) is connected to the center of the stainless steel heater 1B, and an alternating voltage (100 V) is supplied from the temperature controller "E5EN" made by Omron Corporation to the terminal portion 17 for power feeding on both ends of the stainless steel heater 1B. The heater is operated by PID control to generate heat at a predetermined temperature. And the temperature of the heater changed by installation of the aluminum plate 3B was measured by the thermotracer "TH9100MR / WRI" made from NEC company provided above the stainless steel heater 1B. In addition, the thermocouple and the temperature measuring device are not shown in FIG.

In this evaluation experiment, in the state where the temperature of the stainless steel heater 1B was maintained at 200 degreeC, the loading point of the aluminum plate 3B is made into the position Q ', and predetermined | prescribed three places (P) shown in FIG. Temperature was measured continuously in '), (Q'), and (R '). In addition, (P '), (Q'), and (R ') are all the center of the width direction of the stainless steel heater 1B, and (Q') is the center of a heater, (P ') and (R') are the centers. Position 75 mm apart. In addition, the area of a temperature measurement point is all about 0.8 mm <2>.

The test method using the aluminum plate 3B is as follows. That is, after loading the aluminum plate 3B in the position Q 'in the stainless steel heater 1B maintained at 200 degreeC for 2 minutes, the aluminum plate 3B is removed and the temperature of the stainless steel heater 1B is removed. Waits for the temperature to return to 200 degreeC, and an experiment is complete | finished when the temperature in three places (P '), (Q'), and (R ') becomes substantially constant.

The experimental result of the evaluation E2 is shown in FIG. According to FIG. 53, when the aluminum plate 3B was in position Q ', the temperature rise in positions P' and (R ') was about 25 degreeC-30 degreeC.

Example 4

In the following method, the stainless steel heater 1B shown in FIG. 54 was manufactured, and it carried out similarly to Example 3, and performed evaluation E2.

A substrate including a SUS430 (270㎜ length, width and thickness 24㎜ 0.6㎜) after smoothing the surface, the component is a material for forming a crystallized glass SiO 2 -Al 2 O 3 -RO, after the drying treatment of 39㎛ It applied to the whole surface of the board | substrate so that it might become. Subsequently, the coating film was baked at 850 ° C. to form a crystallized glass film having a film thickness of 25 μm. This application | coating and baking were repeated twice also, and the insulating layer of 75 micrometers in thickness was obtained.

Thereafter, using a paste containing a powder containing a silver-palladium alloy (resistance temperature coefficient of 1,000 ppm / 占 폚), the surface of the insulating layer is used for the resistive heating wiring section 15 shown in FIG. 54. The inclination rectangular pattern was printed and the circuit-shaped pattern folded back in the longitudinal direction of the stainless steel substrate was printed. Subsequently, this printing part was baked at 850 degreeC, and the resistance heating wiring part 15 was formed. In addition, the line width of the resistive heating wiring section 15 is 0.5 mm, and the line thickness is 13 µm. In addition, using a paste containing silver powder, a pattern for forming the terminal portion 17 and the conductor wiring portion 19 for supplying electric power to the resistance heating wiring portion 15 at a predetermined position is printed. It was. And this printing part is baked at 850 degreeC, and through the resistance heating wiring part 15 and conductor wiring part 19 which have a some parallel wiring, the terminal part 17 for power supply from the other power supply terminal part 17 ( 17) (see FIG. 54).

Next, for forming crystallized glass used in the formation of the insulating layer 13 on the entire surface of the substrate including the surfaces of the obtained resistance heating wiring portion 15, the terminal portion 17 for feeding and the conductor wiring portion 19. Using the material, application and baking were repeated twice, to form a first protective layer having a film thickness of 44 μm. And it was applied to a material for forming an amorphous glass made of SiO 2 -Al 2 O 3 -B 2 O 3 -RO on the surface of the first protective layer. Thereafter, the coating film was baked at 750 ° C. to form a second protective layer having a thickness of 20 μm, thereby obtaining a stainless steel heater 1B (see FIG. 54, and the first protective layer and the second protective layer are shown in FIG. Not).

The experimental result of the evaluation E2 is shown in FIG. According to FIG. 55, when the aluminum plate 3B was in position Q ', the temperature rise in positions P' and (R ') was about 25 degreeC-30 degreeC.

Example 5

In the following method, the stainless steel heater shown to FIG. 10 and FIG. 12 which is schematic is all manufactured.

After smoothing the surface of the substrate (270㎜ × 24㎜ × 0.6㎜) containing the SUS430, the components are SiO 2 -Al 2 O 3 -RO (softening point: 740 degrees) in the material for forming crystallized glass, drying treatment After that, it was applied to the surface of the substrate to 100㎛. Then, the coating film was baked at 850 degreeC, and the 1st insulating layer 13 containing the crystallized glass of 85 micrometers in thickness was obtained.

Thereafter, using a paste containing no powder containing lead, cadmium and nickel and containing a silver-palladium alloy (resistance temperature coefficient 1500 ppm / ° C), on the surface of the first insulating layer 13, The inclination rectangular pattern for setting it as the resistance heating wiring part 15 shown in FIG. 10 was printed, and the circuit-shaped pattern folded back in the width direction of the stainless steel substrate was printed. Subsequently, this printing part was baked at 850 degreeC, and the resistance heating wiring part 15 was formed. In addition, the line width of the resistive heating wiring portion 15 is 0.5 mm, and the line thickness is 10 μm. Moreover, using the paste containing silver powder, each pattern for setting the power supply terminal part 17 and the conductor wiring part 19 for supplying electric power to this resistance heating wiring part 15 at a predetermined position is used. Printed. And this printing part is baked at 850 degreeC, and through the resistance heating wiring part 15 and conductor wiring part 19 which have a some parallel wiring, the terminal part 17 for power supply from the other power supply terminal part 17 ( 17) to allow conduction (see FIG. 10).

Subsequently, 2nd insulation of a film thickness of 40 micrometers is used on the surface of the resistance heating wiring part 15 and the conductor wiring part 19 using the crystallization glass formation material used at the time of formation of the said 1st insulating layer 13. A layer was formed. At this time, the part shown as "32" in FIG. 10 for the crystallized glass forming material (part which becomes the insulation part for disconnection part formation. Size: 2 mm x 4 mm) becomes unprinted, and also this part And printed so as to exceed the line width of the conductor wiring portion 19. And after the 2nd insulating layer was formed, the recessed part was formed and a part of conductor wiring part 19 shown by "32" was exposed.

Thereafter, using the same screen mask, SiO 2 -Al 2 O 3 -B 2 O 3 -RO (softening point: 580 ° C) containing the exposed portion of the conductor wiring portion 19 indicated by "32" was left. An amorphous glass forming material was applied to the surface of the second insulating layer. And the coating film was baked at 750 degreeC, and the overcoat layer with a film thickness of 20 micrometers was formed. Subsequently, the concave portion before the formation of “32” was filled with an amorphous glass forming material containing PbO-B 2 O 3 (softening point: 375 ° C.), and fired at 450 ° C. to form an insulation part for disconnection part formation. (32) was formed and the stainless steel heater was obtained (the 2nd insulating layer and the overcoat layer are not shown in FIG. 10. In addition, in FIG. 12, the resistance heating wiring part 15 and the 2nd insulating layer are shown. And the overcoat layer is not shown.).

A voltage of 100 V AC is applied to each of the two power supply terminal portions 17 in the stainless steel heater obtained as described above to generate the resistance heating wiring portion 15 to generate a temperature of about 570 ° C. (NEC / Avio Tracer "TH9100MR / WRI" manufactured by Avio. After 15 seconds of applying the voltage, it was confirmed that the conductor wiring portion 19 that was in contact with the insulating portion 32 for disconnection portion formation was disconnected (see FIG. 4).

In the fifth embodiment, as shown in FIG. 10, a heater in which one insulation portion forming portion 32 is formed is shown on the right side of the drawing, but for example, one disconnection is formed at a symmetrical position on the left side of the drawing. It can be set as the heater provided with the insulation part for forming a part.

Example 6

In the following method, the stainless steel heater shown to FIG. 11 and FIG. 14 which is schematic is all manufactured.

After smoothing the surface of the substrate including SUS430, a material for forming a crystallized glass having a component of SiO 2 -Al 2 O 3 -RO (softening point: 740 ° C.) was applied to the surface of the substrate so as to be 100 μm after the drying treatment. It was. Then, the coating film was baked at 850 degreeC, and the 1st insulating layer 13 containing the crystallized glass of 85 micrometers in thickness was obtained.

Thereafter, using a paste containing no powder containing lead, cadmium and nickel and containing a silver-palladium alloy (resistance temperature coefficient 1500 ppm / ° C), on the surface of the first insulating layer 13, The circuit pattern which was inclined in the width direction of the stainless steel board | substrate was printed including the inclined rectangular pattern for setting it as the resistance heating wiring part 15 shown in FIG. Subsequently, this printing part was baked at 850 degreeC, and the resistance heating wiring part 15 was formed. In addition, the line width of the resistive heating wiring section 15 is 0.5 mm, and the line thickness is 12 µm. Moreover, using the paste containing silver powder, each pattern for setting the power supply terminal part 17 and the conductor wiring part 19 for supplying electric power to this resistance heating wiring part 15 in a predetermined position is used. Printed. And this printing part is baked at 850 degreeC, and through the resistance heating wiring part 15 and conductor wiring part 19 which have a some parallel wiring, the terminal part 17 for power supply from the other power supply terminal part 17 ( 17) to allow conduction (see FIG. 11).

Subsequently, 2nd insulation of a film thickness of 40 micrometers is used on the surface of the resistance heating wiring part 15 and the conductor wiring part 19 using the crystallization glass formation material used at the time of formation of the said 1st insulating layer 13. A layer was formed. At this time, the material for forming the crystallized glass is shown in FIG. 11 so that the portion (part that becomes the insulating portion for forming the disconnection portion. Size: 1.7 mm x 2.5 mm) is unprinted. It printed so that the line width of the resistance heating wiring part 15 might be exceeded. After the second insulating layer was formed, a recess was formed, and part of the resistive heating wiring portion 15 indicated by "32" was exposed.

Subsequently, SiO 2 -Al 2 O 3 -B 2 O 3 -RO (softening point: 580 degrees) was included, using the same screen mask, leaving the exposed portion of the resistive heating wiring portion 15 indicated by "32". An amorphous glass forming material was applied to the surface of the second insulating layer. And the coating film was baked at 750 degreeC, and the overcoat layer with a film thickness of 20 micrometers was formed. Subsequently, the recessed portion before the formation of “32” was filled with an amorphous glass forming material containing PbO-B 2 O 3 (softening point: 375 degrees), and fired at 450 ° C. to form an insulation part for disconnection part formation. (32) was formed and the stainless steel heater was obtained (in FIG. 11, the 2nd insulating layer and the overcoat layer are not shown. In addition, in FIG. 14, the resistance heating wiring part 15 and the 2nd insulating layer). And the overcoat layer is not shown).

A voltage of 100 V AC is applied to each of the two power supply terminal portions 17 in the stainless steel heater obtained as described above to generate the resistance heating wiring portion 15 to generate a temperature of about 570 ° C. (NEC / Avio Tracer "TH9100MR / WRI" manufactured by Avio. After 10 seconds from applying the voltage, it was confirmed that the resistance heating wiring portion 15 that was in contact with the insulation portion 32 for disconnection portion formation was disconnected.

Example 7

Instead of SUS430 having the first insulating layer 13, the resistive heating wiring section 15, the power supply terminal section 17, and the conductor wiring section 19 were used in the same manner as in Example 6 with respect to the substrate using aluminum nitride. Etc. were formed and the ceramic heater shown in FIG. 15 which is schematic is manufactured.

Thereafter, a voltage of 100 V AC is applied to each of the two power supply terminal portions 17 in the obtained ceramic heater to generate the resistance heating wiring portion 15 to generate a temperature of about 570 ° C. (NEC / Avio Tracer "TH9100MR / WRI" manufactured by Avio. After 10 seconds from applying the voltage, it was confirmed that the resistance heating wiring portion 15 that was in contact with the insulation portion 32 for disconnection portion formation was disconnected.

In these Examples 5 to 7, an amorphous glass forming material containing SiO 2 -Al 2 O 3 -B 2 O 3 -RO (softening point: 580 ° C) was applied to the surface of the second insulating layer to form an overcoat layer. However, instead of the amorphous glass forming material, the concave portion was formed by using an amorphous glass forming material containing PbO-B 2 O 3 (softening point: 375 ° C.) used to form the insulating portion 32 for disconnection forming. In addition to filling, a coating film is also formed on the surface of the second insulating layer to form an overcoat layer made of an insulating material. In this case, since the insulation part 32 for disconnection part formation is in contact with the resistance heating wiring part 15, the overcoat layer of the same composition as the insulation part formation for disconnection part formation has the trouble of disconnection at the time of thermal runaway. There is nothing to be done.

Example 8

In the following manner, the first insulating layer 13, the resistance heating wiring portion 15, the insulating portion 32 (second insulating layer) for forming the disconnection portion, and the conductor wiring are formed on the base portion 11 made of stainless steel. The part 19 was provided sequentially and the laminated stainless steel heater shown in FIG. 18 which is schematic is manufactured.

After smoothing the surface of the substrate including SUS430, a material for forming a crystallized glass having a component of SiO 2 -Al 2 O 3 -RO (softening point: 740 ° C.) was applied to the surface of the substrate so as to be 100 μm after the drying treatment. It was. Then, the coating film was baked at 850 degreeC, and the 1st insulating layer 13 containing the crystallized glass of 85 micrometers in thickness was obtained.

Thereafter, a predetermined position is obtained by using a paste containing a powder containing no silver, lead, cadmium, nickel and a silver-palladium alloy (resistance temperature coefficient of 1500 ppm / ° C) and a paste containing silver powder. Each pattern of the resistance heating wiring part 15 and the terminal part 17A for power feeding was printed, and it baked at 850 degreeC. This obtained the resistance heating wiring part 15 which has a rectangular pattern and has a series wiring which is folded back in the width direction of a stainless steel board | substrate.

Subsequently, the second insulating layer 16 having a thickness of 55 μm was formed on the surface of the resistive heating wiring portion 15 using the crystallization glass forming material used at the time of forming the first insulating layer 13. . At this time, the material for forming the crystallized glass is shown in FIG. 18 so that the portion indicated by "32" (the part which becomes the insulation part for disconnection part formation. Size: 1.7 mm x 2.5 mm) is unprinted, It printed so that the line width of the resistance heating wiring part 15 might be exceeded. And after the 2nd insulating layer 16 was formed, the recessed part was formed and a part of resistance heating wiring part 15 shown by "32" was exposed.

Then, in the recess prior to "32" is formed, Bi 2 O 3 -Zn-B 2 O 3 ( softening point: 506 ℃) by filling a material for forming an amorphous glass containing and calcined at 550 ℃, disconnection An insulator 32 for forming a part was formed.

Subsequently, using the paste containing silver powder, each pattern of the conductor wiring part 19 and the power supply terminal part 17B is printed so as to cover the exposed insulation part 32 for disconnection part formation, and this printing part It baked at 500 degreeC, and formed the conductor wiring part 19 and the terminal part 17B for electric power feeding. Moreover, the wire width of the conductor wiring part 19 is 1 mm, the line thickness is 10 micrometers, and it confirmed that the insulation part 32 for disconnection part formation located in the lower layer side is longer than the wire width of the conductor wiring part 19. Moreover, as shown in FIG. It was. Thereafter, an amorphous glass forming material containing Bi 2 O 3 -Zn-B 2 O 3 (softening point: 506 ° C) was applied to the surface of the conductor wiring portion 19. And the coating film was baked at 500 degreeC, the overcoat layer 21 with a film thickness of 20 micrometers was formed, and the stainless steel heater was obtained.

Thereafter, a voltage of 100 V AC is applied to each of the two power supply terminal portions 17A and 17B in the obtained stainless steel heater to generate the resistance heating wiring portion 15 to generate a temperature of about 650 ° C (NEC). / By a thermo tracer "TH9100MR / WRI" manufactured by Avio. After 12 seconds of applying the voltage, it was confirmed that the resistance heating wiring part 15 and the conductor wiring part 19 which were in contact with the insulating part 32 for disconnection part formation were disconnected.

Example 9

Instead of SUS430 provided with the first insulating layer 13, the resistive heating wiring section 15, the power supply terminal sections 17A and 17B, and the conductor wiring section were used in the same manner as in Example 8 with respect to the substrate using aluminum nitride. 19) and the like, and a ceramic heater shown in FIG. 29 which is a schematic diagram was manufactured.

After that, a voltage of 100 V AC is applied to each of the two power supply terminal portions 17A and 17B in the obtained ceramic heater to generate the resistance heating wiring portion 15 to generate a temperature of about 650 ° C. ( It was measured by a thermotracer "TH9100MR / WRI" made by NEC / Avio. After 13 seconds from applying the voltage, it was confirmed that the resistance heating wiring section 15 and the conductor wiring section 19 were disconnected.

Example 10

By the following method, the base part 11 which consists of stainless steel contains the 1st insulating layer 13, the conductor wiring part 19, the insulation part 32 (second insulation layer) for forming a disconnection part, and resistance heating wiring. The part 15 was provided in order, and the laminated stainless steel heater shown in FIG. 24 which is schematic is manufactured.

After smoothing the surface of the substrate including SUS430, a material for forming a crystallized glass having a component of SiO 2 -Al 2 O 3 -RO (softening point: 740 degrees) is applied to the surface of the substrate so as to be 100 μm after the drying treatment. It was. Then, the coating film was baked at 850 degreeC, and the 1st insulating layer 13 containing the crystallized glass of 85 micrometers in thickness was obtained.

Thereafter, using a paste containing silver powder, each pattern of the power supply terminal portion 17A and the conductor wiring portion 19 for supplying electric power to the resistive heating wiring portion 15 is printed at a predetermined position. It baked at 850 degreeC.

Next, the second insulating layer 16 having a thickness of 55 μm was formed on the surface of the conductor wiring portion 19 using the material for forming the crystallized glass used in the formation of the first insulating layer 13. At this time, the material for forming the crystallized glass is shown in FIG. 24 so that the portion indicated by “32” (the portion which becomes the insulating portion for forming a disconnection portion. Size: 1.7 mm × 2.5 mm) is unprinted, And printed so as to exceed the line width of the conductor wiring portion 19. And after the 2nd insulating layer 16 was formed, the recessed part was formed and a part of conductor wiring part 19 shown by "32" was exposed.

Thereafter, the recessed portion before the formation of "32" was filled with an amorphous glass forming material containing SiO 2 -Al 2 O 3 -B 2 O 3 -RO (softening point: 580 ° C), and fired at 750 ° C. Thus, the insulating portion 32 for forming a disconnected portion was formed.

Subsequently, the disconnection portion exposed using a paste (softening point of the material: 550 ° C.) containing a powder containing no lead, cadmium, nickel and containing a silver-palladium alloy (resistance temperature coefficient 1500 ppm / ° C.) The circuit-shaped pattern which was inclined in the width direction of the stainless steel substrate was printed including the inclined rectangular pattern for making the resistance heating wiring part 15 shown in FIG. 24 so that the formation insulation part 32 may be coat | covered. . Subsequently, this printed part was baked at 550 degreeC, and the resistance heating wiring part 15 which has series wiring was formed. In addition, the wire width of the resistive heating wiring portion 15 is 1 mm, the line thickness is 10 μm, and the insulation portion 32 for forming a disconnection portion located on the lower layer side is longer than the wire width of the resistive heating wiring portion 15. It was confirmed. Thereafter, using a paste containing a silver powder (softening point of the material: 550 ° C.), a pattern of the power supply terminal portion 17B for supplying power to the resistance heating wiring portion 15 is printed at a predetermined position. It was. Subsequently, an amorphous glass forming material containing Bi 2 O 3 -Zn-B 2 O 3 (softening point: 506 ° C.) was applied to the surface of the resistance heating wiring portion 15. And the coating film was baked at 550 degreeC, the overcoat layer 21 with a film thickness of 20 micrometers was formed, and the stainless steel heater was obtained.

Thereafter, a voltage of 100 V AC is applied to each of the two power supply terminal portions 17A and 17B in the obtained stainless steel heater to generate the resistance heating wiring portion 15 to generate a temperature of about 650 ° C (NEC). / By a thermo tracer "TH9100MR / WRI" manufactured by Avio. After 12 seconds of applying the voltage, it was confirmed that the resistance heating wiring part 15 and the conductor wiring part 19 which were in contact with the insulating part 32 for disconnection part formation were disconnected.

In these Examples 8 to 10, the conductor heating portion 19, the insulating portion 32 for forming a disconnection portion, and the resistive heating wiring portion 15 are formed in the vertical direction from the substrate with the resistance heating wiring portion 15 in series wiring. Although the heaters contacted each other, the resistance heating wiring part 15 is a parallel wiring, and the position where the three members contact each other is, for example, for the formation of the disconnection part at the position of “32” shown in FIG. 10. It can be set as the heater which provided the insulation part.

Example 11

By the following method, the resistance heating wiring part 15 is provided on one side of the base part 11 containing stainless steel, and the conductor wiring part 19 and the insulation part for disconnection part formation are formed on the other side. The laminated stainless steel heater shown by FIG. 27 which is provided in order and is schematic was manufactured.

After smoothing both surfaces of the substrate including SUS430, the material for forming the crystallized glass having the component SiO 2 -Al 2 O 3 -RO (softening point: 740 ° C.) was formed on both surfaces of the substrate so as to be 100 μm after drying. Applied. Subsequently, the coating film was baked at 850 ° C. to obtain a first insulating layer 13 and a third insulating layer 23 each containing crystallized glass having a thickness of 85 μm.

Thereafter, using a paste containing a powder containing silver, palladium alloy (resistance temperature coefficient of 1,500 ppm / ° C) without containing lead, cadmium, or nickel on the surface of the first insulating layer 13, The circuit-shaped pattern which was inclined in the width direction of the stainless board | substrate was printed including the inclined rectangular pattern for making the resistance heating wiring part 15 as shown in FIG. And this printed part was baked at 850 degreeC, and the resistance heating wiring part 15 was formed. In addition, the line width of the resistive heating wiring section 15 is 0.5 mm, and the line thickness is 11 μm.

Subsequently, the power supply terminal portion 17A for supplying electric power to the resistive heating wiring portion 15 at a predetermined position on the surface of the first insulating layer 13 using a paste containing silver powder and Each pattern for making the conductor wiring part (terminal part) 25 is printed, while the power supply terminal part 17B and the conductor wiring part 19 are placed at a predetermined position on the surface of the third insulating layer 23. Each pattern for printing was printed. And these printed parts were baked at 850 degreeC, the resistance heating wiring part 15 which has a some parallel wiring on one surface side, and the conductor wiring part 19 was formed in the other surface side.

Then, using the material for crystallized glass formation used at the time of formation of the said 1st insulating layer 13 and the 3rd insulating layer 23 on the surface of the resistance heating wiring part 15 and the conductor wiring part 19, The first overcoat layer 21A and the second overcoat layer 21B each having a film thickness of 55 µm were formed. At this time, the material for forming the crystallized glass is shown in FIG. 27 so that the portion indicated by “32” (the part which becomes the insulating portion for forming the disconnection portion. Size: 1.7 mm × 2.5 mm) is unprinted, And printed so as to exceed the line width of the conductor wiring portion 19. And after the 2nd overcoat layer 21B was formed, the recessed part was formed and a part of 2nd overcoat layer 21B shown as "32" was exposed.

Subsequently, the concave portion before the formation of “32” was filled with an amorphous glass forming material containing PbO-B 2 O 3 (softening point: 375 ° C.), and fired at 450 ° C. to form an insulation part for disconnection part formation. (32) was formed and the stainless steel heater was obtained. Moreover, in this stainless steel heater, the left end of the conductor wiring part (terminal part) 25 of the side (upper side) in which the resistance heating wiring part 15 was formed, and the lower side of the conductor wiring part 19 is a connector and a socket. The connection member 27 is made to conduct with electricity by the connecting member 27 such as the back.

Example 12

Instead of SUS430 provided with the first insulating layer 13 and the third insulating layer 23, the resistive heating wiring portion 15 and the terminal portion 17A for power supply in the same manner as in Example 11 with respect to the substrate using aluminum nitride. And 17B), the conductor wiring portion (terminal portion) 25, the conductor wiring portion 19 and the like were formed to manufacture a ceramic heater shown in FIG. 34 which is a schematic diagram.

Example 13

The ceramic heater shown in FIG. 35 which is schematic is produced using the board | substrate which consists of aluminum nitride, and has the through-hole (cross section shape: circular shape, internal diameter: 0.3 mm) opened up and down at the one end side in the following ways. It was.

Fig. 10 using a paste containing powder containing silver-palladium alloy (resistance temperature coefficient of 1500 ppm / ° C) without containing lead, cadmium, or nickel at a predetermined position on one surface side surface of this substrate. The circuit-shaped pattern which was inclined in the width direction of the stainless steel board | substrate was printed including the inclined rectangular pattern for making the resistance heating wiring part 15 as shown in FIG. And this printed part was baked at 850 degreeC, and the resistance heating wiring part 15 was formed. In addition, the line width of the resistive heating wiring portion 15 is 0.5 mm, and the line thickness is 10 μm.

Subsequently, using a paste containing silver powder, the respective patterns for forming the power supply terminal portion 17B and the conductor wiring portion 19 are printed at predetermined positions on the other surface-side surface of the substrate, and the through holes are provided. Was charged. On the other hand, at a predetermined position on the surface of the resistive heating wiring section 15, each pattern for printing the terminal section 17A for power supply for supplying electric power to the resistive heating wiring section 15 is printed, and the conductor wiring section 19 and continuity were to be obtained. And these printed parts were baked at 950 degreeC, and the wiring which the resistance heating wiring part 15 and conductor wiring part 19 which have a some parallel wiring between the terminal parts 17A and 17B for power supply was connected was formed.

Subsequently, on the surfaces of the resistive heating wiring portion 15 and the conductor wiring portion 19, a component is formed using a material for forming crystallized glass having a SiO 2 -Al 2 O 3 -RO (softening point: 740 ° C.). The overcoat layer 21A and the second overcoat layer 21B were formed. At this time, the material for forming the crystallized glass is shown in FIG. 35 so that the part indicated by "32" (the part which becomes the insulation part for disconnection part formation. Size: 1.7 mm x 2.5 mm) is unprinted, and also this part And printed so as to exceed the line width of the conductor wiring portion 19. And after the 2nd overcoat layer 21B was formed, the recessed part was formed and a part of 2nd overcoat layer 21B shown as "32" was exposed.

Subsequently, the concave portion before the formation of “32” was filled with an amorphous glass forming material containing PbO-B 2 O 3 (softening point: 375 ° C.), and fired at 450 ° C. to form an insulation part for disconnection part formation. (32) was formed and the ceramic heater was obtained.

Industrial availability

By arranging the heater of the present invention in a heat treatment apparatus, it is possible to save power by fixing toner and ink, bonding a plurality of members, heat treatment of a coating film or film, heat treatment of a metal product or a resin product, drying, solder reflow, and the like. Can be performed efficiently. Moreover, in this invention, since it can be set as the heater whose width was reduced, it is suitable for arrangement | positioning to a small heat processing apparatus.

The fixing apparatus of this invention is attached to image forming apparatuses, such as an electrophotographic printing machine and a copying machine, and is suitable as a heat source, such as heating and heat insulation, attached to household electrical appliances, business use, laboratory precision instruments, etc.

The drying apparatus of this invention is suitable as an apparatus which performs drying of the to-be-heat-processed material containing water, an organic solvent, etc. at desired temperature. And it can be used as a vacuum drier (pressure reduction drier), a pressure drier, a dehumidification drier, a hot air drier, an explosion-proof drier, etc.

1, 1A, 1B: Heater
11: Foundation
12: foundation layer
13: electrical insulation layer (first insulation layer)
15: resistance heating wiring
16: second insulating layer
17, 17A, 17B: terminal part for power supply
19: conductor wiring part
20: oblique rectangular pattern
21, 21A, 21B: overcoat layer
23: third insulating layer
24: first protective layer
25: second protective layer
32: insulation for forming disconnection part
34: electrical insulation
3A, 3B: Heat Sink
4: image forming apparatus
41: laser scanner
42 mirror
43: charging device
44: photosensitive drum
45: developer
46: transfer drum
47: transfer roll
5: fixing device (fixing means)
51: fixing roll
52: pressure roll
53: heater holder
54: roll for pressure
6: support of heater
7: temperature controller
P: recording medium

Claims (21)

The base of the long shape,
A resistance heating portion formed on a surface side or inside of the foundation portion in an electrically insulated state with respect to the foundation portion, the plurality of resistance heating wiring portions that generate heat by energization;
At least two power supply terminal portions formed on the surface side or inside of the foundation portion in an electrically insulated state from the foundation portion;
Two conductor wiring sections formed on the surface side or inside of the foundation section in an electrically insulated state with respect to the foundation section.
In the heater having:
Each of the resistance heating wiring portions is electrically connected in parallel by two of the conductor wiring portions;
The resistance heating wiring part includes a material having a resistance value temperature coefficient of 500 to 4,400 ppm / ° C.
Each of the resistance heating wiring portions includes an inclined rectangular pattern,
The inclined rectangular pattern has a zigzag shape in which horizontal wires formed in the longitudinal direction of the base portion and vertical wires formed shorter than the horizontal wires in the width direction of the base portion are connected.
And a non-formed portion that is oblique to the width direction of the heater in a portion of the gap between the adjacent resistive heating wiring portions.
The method of claim 1,
An insulation portion for forming a disconnection portion formed by contacting an upper surface or a lower layer surface of a part of the resistance heating wiring portion with a length equal to or greater than the line width of the resistance heating wiring portion, wherein the resistance heating wiring portion is not less than a predetermined temperature. And a material reacting with the material (m1) constituting the resistance heating wiring portion, wherein the heater comprises an insulation portion for forming a disconnection portion for forming an electrical insulation portion by the reaction and disconnecting the resistance heating wiring portion.
The method of claim 1,
The base portion includes a base layer comprising stainless steel, aluminum or an aluminum alloy, and an electrical insulation layer formed on the surface of the base layer,
The heater in which the said resistance heating wiring part is formed in the surface of the said electrical insulation layer.
delete The method of claim 1,
The base portion includes insulating ceramics,
The heater in which the said resistance heating wiring part is formed in the surface of the said base part.
delete The method of claim 1,
The base portion includes a base layer comprising stainless steel, aluminum or an aluminum alloy, and an electrical insulation layer formed on the surface of the base layer,
The heater in which the said conductor wiring part is formed in the surface of the said electrical insulation layer.
delete The method of claim 1,
The base portion includes insulating ceramics,
The heater in which the said conductor wiring part is formed in the surface of the said base part.
delete The method of claim 1,
The base portion includes a base layer comprising stainless steel, aluminum or an aluminum alloy, and an electrical insulation layer formed on the surface of the base layer,
And the resistance heating wiring portion and the power supply terminal portion are formed on a surface of the electrical insulation layer.
The method of claim 1,
The base portion includes insulating ceramics,
The heater in which the said resistive heating wiring part and the said power supply terminal part are formed in the surface of the said base part.
The method of claim 1,
The base portion includes insulating ceramics,
The heater in which the said resistance heating wiring part is formed in the said base part.
The base of the long shape,
A resistive heat generating portion which is formed on the surface side or inside of the base portion in an electrically insulated state with respect to the base portion, the resistive heat generating wiring portion generating heat by energization;
Two terminal parts for electric power feeding which are formed on the surface side or inside of said base portion in an electrically insulated state with respect to said base portion;
A conductor wiring portion which is formed on the surface side or inside of the foundation portion in an electrically insulated state with respect to the foundation portion, wherein the number of the conductor wiring portions is two, one end side and the other end side of the resistance heating wiring portion, and the Conductor wiring part which electrically connects two power supply terminal parts separately,
Single-line formed in contact with at least one of the upper surface or lower layer surface of at least one of the portion of the resistance heating wiring portion and the portion of the conductor wiring portion with a length equal to or greater than the line width of the resistance heating wiring portion or the line width of the conductor wiring portion. As the insulating portion for forming a portion, when the resistance heating wiring portion reaches a predetermined temperature or more, it reacts with at least one selected from a material m1 constituting the resistance heating wiring portion and a material m2 constituting the conductor wiring portion. A heater comprising a material, comprising an insulation portion forming portion for forming an electrical insulation portion by the reaction and disconnecting the resistance heating wiring portion or the conductor wiring portion.
The method of claim 14,
The base portion includes a base layer comprising stainless steel, aluminum or an aluminum alloy, and an electrical insulation layer formed on the surface of the base layer,
The heater in which the said resistance heating wiring part is formed in the surface of the said electrical insulation layer.
The method of claim 14,
The base portion includes insulating ceramics,
The heater in which the said resistance heating wiring part is formed in the surface of the said base part.
The method of claim 14,
The base portion includes a base layer comprising stainless steel, aluminum or an aluminum alloy, and an electrical insulation layer formed on the surface of the base layer,
The heater in which the said conductor wiring part is formed in the surface of the said electrical insulation layer.
The method of claim 14,
The base portion includes insulating ceramics,
The heater in which the said conductor wiring part is formed in the surface of the said base part.
The fixing apparatus provided with the heater as described in any one of Claims 1-3, 5, 7, 9, 11-11. The drying apparatus provided with the heater in any one of Claims 1-3, 5, 7, 9, 11-11. delete
KR1020147015146A 2011-11-15 2012-09-12 Heater, and fixing device and drying device provided with same KR102037827B1 (en)

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