TWI666965B - Heater, fixing device including the same, image forming device and heating device, and method for manufacturing heater - Google Patents

Heater, fixing device including the same, image forming device and heating device, and method for manufacturing heater Download PDF

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TWI666965B
TWI666965B TW104109388A TW104109388A TWI666965B TW I666965 B TWI666965 B TW I666965B TW 104109388 A TW104109388 A TW 104109388A TW 104109388 A TW104109388 A TW 104109388A TW I666965 B TWI666965 B TW I666965B
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heater
heating
wiring
power supply
resistance heating
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TW104109388A
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TW201538027A (en
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梅村裕司
今井智晴
青山智克
森田智博
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日商美鈴工業股份有限公司
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/20Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03GELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00Apparatus for electrographic processes using a charge pattern
    • G03G15/20Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat
    • G03G15/2003Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat
    • G03G15/2014Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat using contact heat
    • G03G15/2053Structural details of heat elements, e.g. structure of roller or belt, eddy current, induction heating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/0095Heating devices in the form of rollers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/02Details
    • H05B3/06Heater elements structurally combined with coupling elements or holders
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/20Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/262Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an insulated metal plate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002Heaters using a particular layout for the resistive material or resistive elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/003Heaters using a particular layout for the resistive material or resistive elements using serpentine layout
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/004Heaters using a particular layout for the resistive material or resistive elements using zigzag layout
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/005Heaters using a particular layout for the resistive material or resistive elements using multiple resistive elements or resistive zones isolated from each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/007Heaters using a particular layout for the resistive material or resistive elements using multiple electrically connected resistive elements or resistive zones
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013Heaters using resistive films or coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017Manufacturing methods or apparatus for heaters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/02Heaters using heating elements having a positive temperature coefficient

Abstract

提供具備藉由通電而發熱的複數電阻發熱配 線且各電阻發熱配線的電阻值被補正的加熱器及具備其之定著裝置、畫像形成裝置及加熱裝置、以及加熱器之製造方法。 Provides multiple resistance heating elements with heat generated by energization A heater having a resistance value corrected for each of the resistance heating wires and a fixing device, an image forming device, a heating device, and a method for manufacturing the heater.

本發明之加熱器係具備有被配設在基體 (11)上的複數發熱部(10)的加熱器,其具備有:2個供電用配線(13a、13b),其係按每個發熱部予以分離而且相互分離而設之由導電材料所成;電阻發熱配線(12),其係在各發熱部中,以使用電阻發熱材料,將各供電用配線相連的方式予以配線;補正跨橋(14),其係針對各發熱部,若在所被測定出的電阻發熱配線的電阻值超出預定範圍時,藉由導電材料,將電阻發熱配線的2點間、及電阻發熱配線的1點與供電用配線之間之中的至少1個相連接;及供電用跨橋(15),其係藉由導電材料,將各發熱部的其中一方供電用配線彼此及另一方供電用配線彼此相連接。 The heater of the present invention is provided with a heater The heater of the plurality of heating portions (10) in (11) is provided with: two power supply wirings (13a, 13b), which are separated by each heating portion and separated from each other and are made of a conductive material ; Resistance heating wiring (12), which is connected to each heating section, using a resistance heating material to connect the power supply wiring; wiring bridge (14), which is for each heating section, When the resistance value of the measured resistance heating wire exceeds a predetermined range, at least one of the two points of the resistance heating wire and between the point of the resistance heating wire and the power supply wiring is connected by a conductive material. ; And a power supply bridge (15), which connects one of the power supply wirings and the other power supply wiring of each heat generating part to each other through a conductive material.

Description

加熱器及具備其之定著裝置、畫像形成裝置及加熱裝置、以及加熱器之製造方法 Heater, fixing device including the same, image forming device and heating device, and method for manufacturing heater

本發明係關於加熱器及具備其之定著裝置、畫像形成裝置及加熱裝置、以及加熱器之製造方法。詳言之係關於具備有藉由通電而發熱的複數電阻發熱配線,各電阻發熱配線的電阻值被補正的加熱器及具備其之定著裝置、畫像形成裝置及加熱裝置、以及加熱器之製造方法。 The present invention relates to a heater, a fixing device having the same, an image forming device and a heating device, and a method for manufacturing a heater. Specifically, it relates to a heater including a plurality of resistance heating wires that generate heat by being energized, and the resistance value of each resistance heating wire is corrected, and a fixing device, an image forming device, a heating device, and a heater having the same method.

以用以進行對象物的熱處理的加熱手段而言,已知一種在不銹鋼板或陶瓷板的表面配設有電阻發熱配線的加熱器。如上所示之加熱器係可薄型且精簡地形成,因此在例如被組入在影印機或印表機等而將碳粉或墨水等定著在記錄媒體的目的下被使用,或在被組入在乾燥機而使面板等被處理體均一地加熱乾燥的目的下被使用。在該等用途中,已知一種藉由將加熱器的發熱面分割成複數發熱部(單元(cell)),使成為加熱對象的面內的溫度分布儘可能成為均一的加熱器(參照例如專利文獻1)。 As a heating means for heat-treating an object, there is known a heater in which a resistance heating wire is provided on the surface of a stainless steel plate or a ceramic plate. The heater shown above can be thin and compact. Therefore, for example, the heater is incorporated in a photocopier or printer, and toner or ink is used for the purpose of recording media. It is used for the purpose of uniformly heating and drying an object to be processed, such as a panel, in a dryer. Among these uses, a heater is known in which a heating surface of a heater is divided into a plurality of heating portions (cells), and a temperature distribution in a surface to be heated is made as uniform as possible (see, for example, a patent). Reference 1).

另一方面,在如上所述之加熱器的製造中,由於在所 形成的電阻發熱體的電阻值等產生差異,因此為了形成為高品質的加熱器,必須調整其電阻值(參照例如專利文獻2)。 On the other hand, in the manufacture of the heater as described above, There is a difference in the resistance value and the like of the formed resistance heating element. Therefore, in order to form a high-quality heater, the resistance value must be adjusted (see, for example, Patent Document 2).

[先前技術文獻] [Prior technical literature] [專利文獻] [Patent Literature]

[專利文獻1]WO2014/034744號公報 [Patent Document 1] WO2014 / 034744

[專利文獻2]日本特開2001-313154號公報 [Patent Document 2] Japanese Patent Laid-Open No. 2001-313154

在前述專利文獻1中記載一種加熱器,其係具備有複數個使用電阻值取決於溫度而改變的導電材料所被舖設的電阻發熱配線(單元圖案(cell pattern)),將該各電阻發熱配線進行電性並聯連接所構成。藉由該加熱器,各電阻發熱配線係具有實質上相同的發熱特性,因此藉由各自的單元圖案部(發熱部)所致之發熱成為大致相同,可使被加熱物進行大致均一地加熱。 The aforementioned Patent Document 1 describes a heater including a plurality of resistance heating wires (cell patterns) laid using a conductive material whose resistance value changes depending on temperature, and each of the resistance heating wires is provided. It is constituted by electrical parallel connection. With this heater, each resistance heating wiring system has substantially the same heating characteristics. Therefore, the heat generated by the respective unit pattern portions (heating portions) becomes substantially the same, and the object to be heated can be heated substantially uniformly.

但是,在如上所述之加熱器的製造中,由於難以均一形成各發熱部的電阻發熱配線,因此在遍及發熱區域全體來使發熱特性形成為均一時,必須調整各電阻發熱配線的電阻值。在前述專利文獻2中係記載一種藉由將導電層積層形成在電阻體圖案上,來調整電阻值的發明。但是,在如前所述之配設有複數發熱部的加熱器等中,電阻發熱配 線的配線圖案係更為細密化。另一方面,伴隨加熱器的形狀或尺寸的多樣化,藉由印刷等,將電阻發熱配線遍及發熱區域全體精度佳地形成係日益困難。例如,若加熱器的發熱區域為曲面,可利用所謂圓筒印刷技術等來形成電阻發熱配線,但是要遍及發熱區域全面形成精度佳的電阻發熱配線,乃極為困難。因此,圖求一種可藉由更為生產性優異且簡單的工程來製造,而且複數發熱部的發熱特性更加均一化的加熱器。 However, in the manufacture of the heater as described above, it is difficult to uniformly form the resistance heating wiring of each heating portion. Therefore, when the heating characteristics are made uniform throughout the entire heating region, the resistance value of each resistance heating wiring must be adjusted. The aforementioned Patent Document 2 describes an invention in which a resistance value is adjusted by forming a conductive laminate on a resistor pattern. However, in the heater or the like provided with a plurality of heat generating portions as described above, the resistance heat generation The wiring pattern of the lines is more refined. On the other hand, with the diversification of the shape and size of the heater, it is increasingly difficult to form the resistor heating wiring with high accuracy throughout the entire heating region by printing or the like. For example, if the heating area of the heater is a curved surface, the so-called cylinder printing technology can be used to form the resistance heating wiring, but it is extremely difficult to form a highly accurate resistance heating wiring across the heating area. Therefore, there is a need for a heater that can be manufactured by a more excellent and simple process, and that the heat generation characteristics of the plurality of heat generating portions are more uniform.

本發明係鑑於上述實際情形完成的,目的在提供在發熱面設有複數發熱部,將按每個發熱部所舖設的電阻發熱配線進行並聯連接所構成的加熱器中,各電阻發熱配線的發熱特性被高精度地補正的加熱器及具備其之定著裝置、畫像形成裝置及加熱裝置、以及加熱器之製造方法。 The present invention has been made in view of the above-mentioned actual situation, and an object thereof is to provide a heater in which a plurality of heating portions are provided on a heating surface and resistance heating wirings laid for each heating portion are connected in parallel. A heater whose characteristics are corrected with high accuracy, a fixing device having the same, an image forming device and a heating device, and a manufacturing method of the heater.

本發明係如以下所示。 The present invention is as follows.

請求項1所記載之加熱器之要旨為:其係具備有被配設在基體上的複數發熱部的加熱器,其特徵為:具備有:2個供電用配線,其係按每個前述發熱部予以分離而且相互分離而設之由導電材料所成;電阻發熱配線,其係在各前述發熱部中,以使用電阻發熱材料,將各前述供電用配線相連的方式予以配線;1以上的補正跨橋,其係針對各前述發熱部,若在前述配線後被測定出的前述電阻發熱配 線的兩端間的電阻值超出預定範圍時,藉由導電材料,將前述電阻發熱配線的2點間、及前述電阻發熱配線的1點與前述供電用配線之間之中的至少1個相連接;及供電用跨橋,其係藉由導電材料,將各前述發熱部的其中一方前述供電用配線彼此及另一方前述供電用配線彼此相連接。 The gist of the heater described in claim 1 is that the heater is provided with a plurality of heat generating portions arranged on a base, and is characterized in that it includes: two power supply wirings that generate heat for each of the foregoing The parts are separated and separated from each other and are made of conductive materials. Resistive heating wires are connected to each of the aforementioned heating parts, and each of the aforementioned power supply wirings is connected by using a resistive heating material; 1 or more corrections The bridge is for each of the aforementioned heating parts, and if the above-mentioned resistance heating configuration is measured after the wiring, When the resistance value between the two ends of the wire exceeds a predetermined range, at least one of the two points of the resistance heating wiring and the one point of the resistance heating wiring and the power supply wiring is connected with a conductive material. And a power supply bridge that connects one of the power supply wirings and the other power supply wiring of each of the heat generating portions to each other through a conductive material.

請求項2所記載之加熱器之要旨為:在請求項1中,至少1個前述補正跨橋係將前述電阻發熱配線的線間相連結而形成。 The gist of the heater described in claim 2 is that in claim 1, at least one of the correction bridges is formed by connecting the wires of the resistance heating wiring.

請求項3所記載之加熱器之要旨為:在請求項1或2中,至少1個前述補正跨橋係在前述電阻發熱配線的線上重疊形成。 The gist of the heater described in claim 3 is that, in claim 1 or 2, at least one of the correction bridges is formed on the resistance heating wiring line.

請求項4所記載之加熱器之要旨為:在請求項1至3之任一者中,至少2個前述補正跨橋係將由前述電阻發熱配線的各端為相同長度的點、及各端側的前述供電用配線分別相連接。 The gist of the heater described in claim 4 is that, in any one of claims 1 to 3, at least two points of the aforementioned correction span bridge system will have the same length at each end of the resistance heating wiring and each end side. The aforementioned power supply wirings are respectively connected.

請求項5所記載之加熱器之要旨為:在請求項1至4之任一者中,為在與被加熱物相對面的狀態下,使前述被加熱物及本加熱器之中的至少一方朝預定的掃描方向掃描,而將前述被加熱物加熱的加熱器,各前述發熱部係以與前述掃描方向呈正交方向排列配設,在各前述發熱部中,前述電阻發熱配線係具備有相對於前述正交方向,以預定範圍內的角度而設的複數主圖案部。 The gist of the heater described in claim 5 is that, in any one of claims 1 to 4, at least one of the heated object and the heater is in a state facing the heated object. A heater that scans in a predetermined scanning direction and heats the object to be heated. Each of the heating portions is arranged in a direction orthogonal to the scanning direction. In each of the heating portions, the resistance heating wiring is provided. A plurality of main pattern portions provided at an angle within a predetermined range with respect to the aforementioned orthogonal direction.

請求項6所記載之加熱器之要旨為:在請求項5中,前述基體的前述掃描方向的剖面形狀係以與前述掃描方向 呈正交的軸為中心而在與前述被加熱物的對面側呈凸狀的圓弧形狀,各前述發熱部係被配設在前述凸狀的面上或其相反側的面上。 The gist of the heater described in claim 6 is that in the claim 5, the cross-sectional shape of the substrate in the scanning direction is the same as that in the scanning direction. Each of the heat generating portions is disposed on the convex surface or a surface on the opposite side of the arc-shaped surface having an orthogonal axis as a center and a convex shape on the side opposite to the object to be heated.

請求項7所記載之加熱器之要旨為:在請求項1至7之任一者中,前述電阻發熱材料係電阻值取決於溫度而改變的導電材料,前述補正跨橋及前述供電用跨橋所使用的導電材料係導電性糊膏。 The gist of the heater described in claim 7 is that in any one of claims 1 to 7, the resistance heating material is a conductive material whose resistance value changes depending on temperature, the correction bridge and the power supply bridge The conductive material used is a conductive paste.

請求項8所記載之定著裝置之要旨為:具備有如請求項1至7之任一者之加熱器。 The gist of the fixing device described in claim 8 is to include a heater as in any of claims 1 to 7.

請求項9所記載之畫像形成裝置之要旨為:具備有如請求項1至7中任一者之加熱器。 The gist of the image forming apparatus described in claim 9 is to include a heater as in any of claims 1 to 7.

請求項10所記載之加熱裝置之要旨為:具備有如請求項1至7中任一者之加熱器。 The gist of the heating device described in claim 10 is to include a heater as in any one of claims 1 to 7.

請求項11所記載之加熱器之製造方法之要旨為:其係具備有被配設在基體上的複數發熱部的加熱器之製造方法,其特徵為:具備有:供電用配線形成工程,其係使用導電材料,形成按每個前述發熱部予以分離而且相互分離的2個供電用配線;電阻發熱配線形成工程,其係以在各前述發熱部中,使用電阻發熱材料,將各前述供電用配線相連的方式形成電阻發熱配線;測定工程,其係在形成前述供電用配線及前述電阻發熱配線之後,藉由電阻值測定手段,針對各前述發熱部,測定各前述供電用配線間的電阻值;運算工程,其係藉由運算手段,針對各前述發熱部,將藉由前述測定工程所被測定到的前述電阻值與 預定範圍進行比較,若前述電阻值超過前述預定範圍時,求出為了將該電阻值補正為前述預定範圍而將該電阻發熱配線實質上縮短的長度作為補正長;補正跨橋形成工程,其係以將前述電阻發熱配線的長度縮短前述補正長的部分的方式,形成藉由導電材料,將前述電阻發熱配線的2點間、及前述電阻發熱配線的1點與前述供電用配線之間之中的至少1個相連接的1以上的補正跨橋;及供電用跨橋形成工程,其係形成藉由導電材料,將各前述發熱部的其中一方前述供電用配線彼此及另一方前述供電用配線彼此相連接的供電用跨橋。 The gist of the method for manufacturing a heater according to claim 11 is: a method for manufacturing a heater having a plurality of heat generating portions arranged on a base, and the method is characterized by including: a wiring forming process for power supply; The conductive material is used to form two power supply wirings that are separated and separated from each other. The resistance heating wiring formation process is based on the use of a resistance heating material in each of the heating portions. The resistance heating wiring is formed by wiring connection. The measurement process is to measure the resistance value between the power supply wirings for each of the heating parts by using a resistance value measuring means after forming the power supply wiring and the resistance heating wiring. ; Computing engineering, which uses computing means for each of the aforementioned heating parts, the resistance value and Compare the predetermined range. If the resistance value exceeds the predetermined range, find the length that the resistance heating wiring is substantially shortened to correct the resistance value to the predetermined range. In order to shorten the length of the resistance heating wiring by the length of the correction length, a conductive material is formed between two points of the resistance heating wiring and between one point of the resistance heating wiring and the power supply wiring. At least one connected span bridge of 1 or more; and a span bridge forming project for power supply, which forms one of the aforementioned power supply wirings of each of the aforementioned heat generating portions with each other and the other aforementioned power supply wiring by using a conductive material. Cross bridges for power supply connected to each other.

請求項12所記載之加熱器之製造方法之要旨為:在請求項11中,藉由前述補正跨橋形成工程,至少1個前述補正跨橋係將前述電阻發熱配線的線間相連結而形成。 The gist of the method for manufacturing the heater described in claim 12 is that in claim 11, the at least one correction span bridge system is formed by connecting the lines of the resistance heating wiring by the aforementioned correction span bridge formation process. .

請求項13所記載之加熱器之製造方法之要旨為:在請求項11或12中,藉由前述補正跨橋形成工程,至少1個前述補正跨橋係在前述電阻發熱配線的線上重疊形成。 The gist of the method for manufacturing a heater described in claim 13 is that in claim 11 or 12, by the aforementioned correction span bridge formation process, at least one of the correction span bridge systems is formed by overlapping on the line of the resistance heating wiring.

請求項14所記載之加熱器之製造方法之要旨為:在請求項11至13之任一者,藉由前述補正跨橋形成工程,至少2個前述補正跨橋係以將由前述電阻發熱配線的各端為相同長度的點、及各端側的前述供電用配線分別相連接的方式形成。 The gist of the method for manufacturing the heater described in claim 14 is that, in any one of claims 11 to 13, by the aforementioned correction bridge forming process, at least two of the aforementioned correction bridge systems are used to wire the heat generated by the resistor. Each end is formed by dots having the same length and the power supply wiring on each end side is connected to each other.

請求項15所記載之加熱器之製造方法之要旨為:在請求項11至14之任一者中,為在與被加熱物相對面的狀態下,使前述被加熱物及本加熱器之中的至少一方朝預定 的掃描方向掃描,將前述被加熱物加熱之加熱器之製造方法,各前述發熱部係以與前述掃描方向呈正交方向排列配設,藉由前述電阻發熱配線形成工程,在各前述發熱部中,前述電阻發熱配線係具備有相對於前述正交方向,以預定範圍內的角度而設的複數主圖案部而形成。 The gist of the method for manufacturing a heater according to claim 15 is that, in any one of claims 11 to 14, the object to be heated and the heater are placed in a state facing the object to be heated. At least one of the The method of manufacturing a heater for heating the object to be heated by scanning in the scanning direction, each of the heating parts is arranged in a direction orthogonal to the scanning direction, and the heating part is formed by the resistance heating wiring. In the above, the resistance heating wiring is formed by including a plurality of main pattern portions provided at an angle within a predetermined range with respect to the orthogonal direction.

請求項16所記載之加熱器之製造方法之要旨為:在請求項11至15之任一者中,前述基體的前述掃描方向的剖面形狀係以與前述掃描方向呈正交的軸為中心而在與前述被加熱物的對面側呈凸狀的圓弧形狀,各前述發熱部係被配設在前述凸狀的面上或其相反側的面上。 The gist of the method for manufacturing a heater according to claim 16 is that, in any one of claims 11 to 15, the cross-sectional shape of the substrate in the scanning direction is centered on an axis orthogonal to the scanning direction. Each of the heat generating portions is arranged in a circular arc shape that is convex to the side opposite to the object to be heated, and is disposed on the convex surface or a surface opposite to the convex surface.

請求項17所記載之加熱器之製造方法之要旨為:在請求項11至16之任一者中,前述電阻發熱材料係電阻值取決於溫度而改變的導電材料,前述補正跨橋及前述供電用跨橋所使用的導電材料係導電性糊膏。 The gist of the method for manufacturing a heater according to claim 17 is that, in any one of claims 11 to 16, the resistance heating material is a conductive material whose resistance value changes depending on temperature, the correction bridge and the power supply. The conductive material used for the bridge is a conductive paste.

藉由請求項1所記載之加熱器,按每個發熱部所被舖設的電阻發熱配線的電阻值藉由補正跨橋予以補正,因此可以高精度將全部發熱部的發熱特性均一化,且可將被加熱物均一加熱。此外,僅設置補正跨橋,俾以進行電阻值的補正,因此無關於加熱器的形狀,均可藉由簡單的工程製造。在加熱器製品的製造中,即使在難以精度佳地形成發熱部的電阻值的情形下,若至少以全部發熱部的電阻值超出所規定的值的方式形成電阻發熱配線,則藉 由按每個發熱部藉由補正跨橋進行補正,可使製品的品質及良率大幅提升。 With the heater described in claim 1, the resistance value of the resistance heating wiring laid for each heating portion is corrected by a correction bridge, so that the heating characteristics of all heating portions can be uniformized with high accuracy, and can be The object to be heated is uniformly heated. In addition, only the correction span bridge is provided to correct the resistance value, so regardless of the shape of the heater, it can be manufactured by simple engineering. In the manufacture of heater products, even when it is difficult to form the resistance value of the heating portion with high accuracy, if the resistance heating wiring is formed at least so that the resistance values of all the heating portions exceed a predetermined value, the By correcting the crossover bridge for each heating part, the quality and yield of the product can be greatly improved.

藉由請求項2至4之任一者所記載之加熱器,可按照各發熱部的配線圖案、電阻值的補正量、加熱器的形狀等,在適當部位設置補正跨橋。 With the heater described in any one of claims 2 to 4, a correction bridge can be provided at an appropriate position in accordance with the wiring pattern of each heating portion, the correction amount of the resistance value, the shape of the heater, and the like.

藉由請求項5所記載之加熱器,無關於被加熱物的尺寸,可將加熱器與相對被掃描的被加熱物均一加熱。此外,電阻發熱配線的主圖案部係以與掃描方向呈正交方向或接近其的方向而設,因此可有效率地將被加熱物加熱。 With the heater described in claim 5, the heater and the object to be scanned can be uniformly heated regardless of the size of the object to be heated. In addition, since the main pattern portion of the resistance heating wiring is provided in a direction orthogonal to or close to the scanning direction, the object to be heated can be efficiently heated.

藉由請求項6所記載之加熱器,在藉由滾軸使被加熱物掃描而加熱的用途中,可形成為適於組入在滾軸的加熱器。 The heater according to claim 6 can be formed as a heater suitable for being incorporated in a roller for applications in which a heated object is scanned and heated by a roller.

藉由請求項7所記載之加熱器,可得遍及各發熱部及發熱部間,發熱狀態被自律性均一化的效果。此外,補正跨橋及供電用跨橋係可藉由簡單的方法來製造。 With the heater described in claim 7, it is possible to obtain the effect that the heat generation state is uniformized autonomously throughout each heat generation section and between the heat generation sections. In addition, the correction span bridge and the span bridge system for power supply can be manufactured by a simple method.

藉由請求項11所記載之加熱器之製造方法,即使在所形成的各電阻發熱配線的電阻值產生差異,亦若電阻值超過預定範圍時,藉由設置補正跨橋來補正電阻值,因此可製造可將全部發熱部的發熱特性高精度地均一化,且將被加熱物均一加熱的加熱器。此外,僅測定電阻值而求出補正長,且以縮短該補正長的部分的方式設置補正跨橋,因此無關於加熱器的形狀,均可採用簡單的製造方法而廉價地製造加熱器。 With the manufacturing method of the heater described in claim 11, even if there is a difference in the resistance value of each resistance heating wire formed, if the resistance value exceeds a predetermined range, the resistance value is corrected by setting a correction bridge. Therefore, A heater capable of uniformizing the heating characteristics of all the heating portions with high accuracy and heating the object to be heated uniformly can be manufactured. In addition, since the correction length is obtained by measuring only the resistance value, and the correction bridge is provided so as to shorten the portion of the correction length, the heater can be manufactured inexpensively by a simple manufacturing method regardless of the shape of the heater.

藉由請求項12至14之任一者所記載之加熱器之製造 方法,可按照各發熱部的配線圖案、電阻值的補正量、加熱器的形狀等,在適當部位設置補正跨橋。 Manufacture of a heater described in any one of claims 12 to 14 In the method, a correction bridge can be provided at an appropriate position in accordance with the wiring pattern of each heating portion, the amount of resistance value correction, and the shape of the heater.

藉由請求項15所記載之加熱器之製造方法,無關於被加熱物的尺寸,可製造可將加熱器及相對被掃描的被加熱物均一加熱的加熱器。此外,電阻發熱配線的主圖案部係以與掃描方向呈正交方向或接近其的方向而設,因此可製造可有效率地將被加熱物加熱的加熱器。 By the method for manufacturing a heater described in claim 15, regardless of the size of the object to be heated, a heater capable of uniformly heating the heater and the object to be scanned can be manufactured. In addition, since the main pattern portion of the resistance heating wiring is provided in a direction orthogonal to or close to the scanning direction, a heater capable of efficiently heating an object to be heated can be manufactured.

藉由請求項16所記載之加熱器之製造方法,在藉由滾軸使被加熱物掃描而加熱的用途中,可製造適於組入在滾軸的加熱器。由於加熱器的發熱區域為曲面,因此即使難以遍及發熱區域全面,高精度地形成各電阻發熱配線,亦可藉由適當形成補正跨橋,來製造發熱特性均一的加熱器。 According to the manufacturing method of the heater described in claim 16, the heater suitable for being incorporated in the roller can be manufactured for use in which the object to be heated is scanned and heated by the roller. Since the heating area of the heater is a curved surface, even if it is difficult to form all the resistance heating wiring across the entire heating area with high accuracy, it is possible to manufacture a heater with uniform heating characteristics by appropriately forming a correction bridge.

藉由請求項17所記載之加熱器之製造方法,可製造可遍及各發熱部及發熱部間,發熱狀態被自律性均一化的加熱器。此外,可藉由簡單的方法,來設置補正跨橋及供電用跨橋。 According to the method for manufacturing a heater described in claim 17, it is possible to manufacture a heater that can uniformly generate heat in a self-regulating manner throughout each of the heat generating sections and between the heat generating sections. In addition, a simple method can be used to set a correction span bridge and a span bridge for power supply.

1‧‧‧加熱器 1‧‧‧ heater

10‧‧‧發熱部 10‧‧‧Fever

11‧‧‧基體 11‧‧‧ Matrix

12‧‧‧電阻發熱配線 12‧‧‧ resistance heating wiring

121‧‧‧主圖案部 121‧‧‧Main pattern department

122‧‧‧連接圖案部 122‧‧‧Connection pattern department

13、13a、13b‧‧‧供電用配線 13, 13a, 13b‧‧‧ Power supply wiring

131、131a、131b‧‧‧供電端子 131, 131a, 131b‧‧‧ Power supply terminal

14、141、142、143、144‧‧‧補正跨橋 14, 141, 142, 143, 144‧‧‧

15、15a、15b‧‧‧供電用跨橋 15, 15a, 15b‧‧‧ Power supply bridge

2‧‧‧被加熱物 2‧‧‧ Object to be heated

4‧‧‧畫像形成裝置 4‧‧‧Image forming device

41‧‧‧雷射掃描器 41‧‧‧laser scanner

42‧‧‧鏡 42‧‧‧Mirror

43‧‧‧帶電裝置 43‧‧‧ charged device

44‧‧‧感光鼓 44‧‧‧photosensitive drum

45‧‧‧顯影器 45‧‧‧Developer

46‧‧‧轉印鼓 46‧‧‧ transfer drum

47‧‧‧轉印用滾筒 47‧‧‧ transfer roller

5‧‧‧定著裝置(定著手段) 5‧‧‧ fixed device (fixed means)

51‧‧‧定著用滾筒 51‧‧‧ fixed roller

52‧‧‧加壓用滾筒 52‧‧‧Pressure roller

53‧‧‧加熱器保持具 53‧‧‧heater holder

54‧‧‧加壓用滾筒 54‧‧‧Pressure roller

P‧‧‧記錄用媒體 P‧‧‧Recording Media

圖1係表示本發明之加熱器的構成的模式平面圖。 Fig. 1 is a schematic plan view showing the structure of a heater according to the present invention.

圖2係表示在加熱器的基體上施以供電用配線及電阻發熱配線的狀態的模式平面圖。 FIG. 2 is a schematic plan view showing a state in which a power supply wiring and a resistance heating wiring are applied to a base of a heater.

圖3係用以說明補正跨橋的配設方法的模式平面圖。 FIG. 3 is a schematic plan view for explaining a method of arranging a correction span bridge.

圖4係表示在全部發熱部配設補正跨橋之例的模式平面圖。 Fig. 4 is a schematic plan view showing an example in which correction bridges are provided in all the heat generating portions.

圖5係加熱器之一例的模式平面圖。 Fig. 5 is a schematic plan view of an example of a heater.

圖6係加熱器之其他例的模式平面圖。 Fig. 6 is a schematic plan view of another example of the heater.

圖7係加熱器之其他例的模式平面圖。 Fig. 7 is a schematic plan view of another example of the heater.

圖8係用以說明使被加熱物朝1個掃描方向掃描來進行加熱的加熱器的圖。 FIG. 8 is a diagram for explaining a heater that scans an object to be heated in one scanning direction to perform heating.

圖9係用以說明電阻發熱配線的配線圖案的模式平面圖。 FIG. 9 is a schematic plan view for explaining a wiring pattern of the resistance heating wiring.

圖10係表示在剖面為圓弧狀的加熱器的凸狀的面上設置發熱部之例的概略斜視圖(a)及剖面圖(b)。 Fig. 10 is a schematic perspective view (a) and a cross-sectional view (b) showing an example in which a heating portion is provided on a convex surface of a heater having a circular arc shape in cross section.

圖11係表示在剖面為圓弧狀的加熱器的凹狀的面上設置發熱部之例的概略斜視圖(a)及剖面圖(b)。 11 is a schematic perspective view (a) and a cross-sectional view (b) showing an example in which a heat generating portion is provided on a concave surface of a heater having a circular arc shape in cross section.

圖12係表示在加熱器的基體上所配備的供電用端子的配設例的模式平面圖。 FIG. 12 is a schematic plan view showing an example of the arrangement of power supply terminals provided on the base of the heater.

圖13係表示使用本加熱器之定著裝置之一例的概略斜視圖。 Fig. 13 is a schematic perspective view showing an example of a fixing device using the heater.

圖14係表示使用本加熱器之定著裝置之其他例的概略斜視圖。 FIG. 14 is a schematic perspective view showing another example of a fixing device using the heater.

圖15係表示使用本加熱器之畫像形成裝置之一例的概略圖。 FIG. 15 is a schematic diagram showing an example of an image forming apparatus using the heater.

圖16係用以說明本發明之加熱器之製造方法的模式平面圖,(a)係表示供電用配線的形成,(b)係表示電阻發熱配線的形成,(c)係表示補正跨橋的形成,(d)係表示供 電用跨橋的形成。 Fig. 16 is a schematic plan view for explaining a method of manufacturing the heater of the present invention, (a) shows formation of power supply wiring, (b) shows formation of resistance heating wiring, and (c) shows formation of correction bridge. , (D) represents the confession Formation of electrical bridges.

圖17係實施例之加熱器的平面圖。 Fig. 17 is a plan view of the heater of the embodiment.

圖18係顯示實施例之加熱器之依基體上的位置所致之溫度分布的圖表。 FIG. 18 is a graph showing the temperature distribution due to the position on the substrate of the heater of the example.

以下一面參照圖示,一面詳加說明本發明。 The present invention will be described in detail below with reference to the drawings.

〔1〕加熱器 [1] heater

如圖1所示,本實施形態之加熱器(1)係具備有被配設在基體(11)上的複數發熱部(10)的加熱器,其特徵為具備有:按每個發熱部(10)予以分離而且相互分離設置之由導電材料所成的2個供電用配線(13(13a、13b));在各發熱部(10)中,以使用電阻發熱材料,將各供電用配線(13a、13b)相連的方式進行配線的電阻發熱配線(12);針對各發熱部(10),若在前述配線後所被測定出的電阻發熱配線(12)的兩端間的電阻值超出預定範圍時,藉由導電材料,將電阻發熱配線(12)的2點間、及電阻發熱配線(12)的1點與供電用配線(13)之間之中的至少1個相連接的1以上的補正跨橋(14);及藉由導電材料,將各發熱部(10)的其中一方供電用配線(13a)彼此及另一方供電用配線(13b)彼此相連接的供電用跨橋(15)。 As shown in FIG. 1, the heater (1) of this embodiment is a heater having a plurality of heat generating portions (10) arranged on a base (11), and is characterized in that: 10) Two power-supply wirings (13 (13a, 13b)) made of a conductive material that are separated and provided separately from each other; in each heating portion (10), each power-supply wiring ( 13a, 13b) The resistance heating wiring (12) which is wired in a connected manner; for each heating part (10), if the resistance value between the ends of the resistance heating wiring (12) measured after the aforementioned wiring exceeds a predetermined value In the range, at least one of two points between the resistance heating wire (12) and one point between the resistance heating wire (12) and the power supply wiring (13) is connected by a conductive material. Bridge (14); and a power supply bridge (15) that connects one of the power supply wirings (13a) and the other power supply wiring (13b) of each heating part (10) with each other through a conductive material. ).

此外,在基體(11)上係可具備有用以由外部對加熱器1供給電源的供電用端子(131(131a、131b))等。此外,為保護上述各配線及各跨橋,可積層設置由絕緣材料所成之保護層或上塗層。 The base body (11) may be provided with power supply terminals (131 (131a, 131b)) and the like for supplying power to the heater 1 from the outside. In addition, in order to protect the above-mentioned wirings and bridges, a protective layer or an overcoat layer made of an insulating material may be laminated.

前述「基體(11)」係支持由電阻發熱配線12、供電用配線13、補正跨橋14、供電用跨橋15、及供電用端子131等所構成的加熱器1的電路的基板。 The aforementioned "substrate (11)" is a substrate supporting a circuit of the heater 1 composed of the resistance heating wiring 12, the power supply wiring 13, the correction bridge 14, the power supply bridge 15, and the power supply terminal 131.

前述「發熱部(10)」係指具備有1個電阻發熱配線12及與其各端相連接的2個供電用配線13(13a、13b)的電路、或配設該電路的基體11上的區劃。例如,圖1所示之加熱器1的發熱面(發熱區域)係具備有6個發熱部10,按每個發熱部10配備有前述電路。發熱部10的數量或區劃方法並未特別限定。在圖1中,各發熱部10係以相對於基體11的長邊方向呈傾斜的方式予以區劃,但是亦可相對於長邊方向呈正交方向予以區劃。此外,在本例中,複數發熱部10係以基體11的橫向配置成1列,但是亦可配置成2列以上,亦可以縱橫配置成矩陣狀。 The aforementioned "heating part (10)" refers to a circuit provided with one resistance heating wire 12 and two power supply wires 13 (13a, 13b) connected to each end thereof, or a division on a substrate 11 on which the circuit is arranged . For example, the heating surface (heating area) of the heater 1 shown in FIG. 1 is provided with six heating portions 10, and the aforementioned circuit is provided for each heating portion 10. The number or division method of the heat generating portions 10 is not particularly limited. In FIG. 1, each heat generating portion 10 is divided so as to be inclined with respect to the longitudinal direction of the base 11, but may be divided into orthogonal directions with respect to the longitudinal direction. In addition, in this example, the plurality of heat generating portions 10 are arranged in one row in the lateral direction of the base body 11, but they may also be arranged in two or more rows, or may be arranged in a matrix form in the vertical and horizontal directions.

基體11的尺寸或形狀並未特別限定,其厚度較佳為例如按照基體11的材質或尺寸等而形成為0.1~20mm。 The size or shape of the base 11 is not particularly limited, and its thickness is preferably, for example, 0.1 to 20 mm according to the material or size of the base 11.

基體11的材質若可在其表面上支持用以使加熱器1發熱所形成的電路即可,並未特別限定。以基體11而言,可利用例如金屬、陶瓷及該等之複合材料等。若使用金屬等導電材時,基體11係可在其導電材上設置絕緣層 (未圖示)而構成,前述電路係形成在其絕緣層上。 The material of the substrate 11 is not particularly limited as long as it can support a circuit formed by the heater 1 to generate heat on its surface. For the substrate 11, for example, a metal, a ceramic, and a composite material thereof can be used. If a conductive material such as metal is used, the base 11 can be provided with an insulating layer on the conductive material. (Not shown), and the circuit is formed on the insulating layer.

以基體11所使用的金屬而言,係可列舉鋼等,其中亦可適當使用不銹鋼。不銹鋼的種類並未特別限定,以肥粒鐵系不銹鋼(Ferritic Stainless Steel)及/或沃斯田鐵系不銹鋼(Austenitic stainless steel)為佳。此外,在該等不銹鋼之中亦尤其以耐熱性及/或抗氧化性優異的品種為佳。列舉例如SUS430、SUS436、SUS444、SUS316L等。該等係可僅使用1種,亦可併用2種以上。 Examples of the metal used for the substrate 11 include steel and the like, and stainless steel may be used as appropriate. The type of stainless steel is not particularly limited, and ferritic stainless steel and / or austenitic stainless steel are preferred. Among these stainless steels, those having excellent heat resistance and / or oxidation resistance are particularly preferred. Examples include SUS430, SUS436, SUS444, and SUS316L. These systems can be used alone or in combination of two or more.

此外,以構成基體11的金屬而言,可使用鋁、鎂、銅及該等金屬的合金。該等係可僅使用1種,亦可併用2種以上。其中,由於鋁、鎂、及該等的合金(鋁合金、鎂合金、Al-Mg合金等)的比重小,因此藉由採用該等,可達成本加熱器的輕量化。此外,銅及其合金由於熱傳導性優異,因此藉由採用該等,可達成本加熱器的均熱性的提升。 In addition, as the metal constituting the base body 11, aluminum, magnesium, copper, and alloys of these metals can be used. These systems can be used alone or in combination of two or more. Among them, since the specific gravity of aluminum, magnesium, and alloys thereof (aluminum alloy, magnesium alloy, Al-Mg alloy, etc.) is small, the use of these materials can reduce the weight of the cost heater. In addition, copper and its alloys are excellent in thermal conductivity, so by adopting these, it is possible to improve the uniformity of the heater.

如前所述,若使用導電材作為基板材料時,藉由在該導電材上設置絕緣層來構成基體11。絕緣層的材料若可達到在導電材與被設在基體11上的電路之間、及該電路的配線間的電性絕緣即可,並未特別限定。若使用金屬(不銹鋼等)作為基板材料時,絕緣層的材料若由其熱膨脹平衡的觀點來看,以玻璃為佳,以結晶化玻璃及半結晶化玻璃為較佳。具體而言,以SiO2-Al2O3-MO系玻璃為佳。在此,MO為鹼土類金屬的氧化物(MgO、CaO、BaO、SrO等)。絕緣層的厚度並未特別限定,以60~ 120μm為佳。 As described above, when a conductive material is used as the substrate material, the base 11 is formed by providing an insulating layer on the conductive material. The material of the insulating layer is not particularly limited as long as it can achieve electrical insulation between the conductive material and a circuit provided on the base 11 and between wirings of the circuit. When a metal (stainless steel, etc.) is used as the substrate material, from the viewpoint of thermal expansion balance of the material of the insulating layer, glass is preferred, and crystallized glass and semi-crystallized glass are more preferred. Specifically, SiO 2 -Al 2 O 3 -MO-based glass is preferred. Here, MO is an oxide of an alkaline earth metal (MgO, CaO, BaO, SrO, etc.). The thickness of the insulating layer is not particularly limited, but is preferably 60 to 120 μm.

此外,若使用陶瓷來構成基體11時,在高溫下,以可維持與被設在基體11上的電路之間、及該電路的配線間的電性絕緣者為佳。以如上所示之陶瓷而言,列舉例如氧化鋁、氮化鋁、氧化鋯、矽石、模來石(Mullite)、尖晶石(Spinel)、菫青石(Cordierite)、氮化矽等。該等係可僅使用1種,亦可併用2種以上。該等之中,以氧化鋁及氮化鋁為佳。此外,以金屬與陶瓷的複合材料而言,係列舉SiC/C、或SiC/Al等。該等係可僅使用1種,亦可併用2種以上。 When the substrate 11 is formed of ceramics, it is preferable to maintain electrical insulation between the circuit provided on the substrate 11 and the wiring between the circuits at a high temperature. The ceramics shown above include, for example, alumina, aluminum nitride, zirconia, silica, mullite, spinel, cordierite, and silicon nitride. These systems can be used alone or in combination of two or more. Among these, alumina and aluminum nitride are preferred. In addition, for a composite material of metal and ceramic, a series of examples include SiC / C, SiC / Al, and the like. These systems can be used alone or in combination of two or more.

前述「供電用配線(13)」係為了對被舖設在各發熱部10的電阻發熱配線(12)供給電源,使用導電材料所形成的2個(13a、13b)的配線或島部(land)。各供電用配線13的形狀或尺寸並未特別限制。2個供電用配線(13a、13b)係按每個發熱部10作電性分離設置。此外,2個供電用配線(13a、13b)係相互分離設置,在兩者之間供給電源。 The aforementioned "power supply wiring (13)" refers to two (13a, 13b) wirings or islands formed by using a conductive material in order to supply power to the resistance heating wiring (12) laid on each heating portion 10 . The shape or size of each power supply wiring 13 is not particularly limited. The two power supply wirings (13a, 13b) are electrically separated for each heating portion 10. In addition, the two power supply wirings (13a, 13b) are provided separately from each other, and power is supplied between the two.

設置供電用配線13的基體11上的部位、或供電用配線13的配線圖案係只要可對各發熱部10所配備的電阻發熱配線(12)的兩端供給電源,則未特別限定。例如圖1所示,在各發熱部10中,供電用配線的其中一方13a係可被配設在基體11上的其中一方端部,供電用配線的另一方13b係可被配設在基體11上的另一方端部。此外,在基體11上將複數發熱部10配置為2列以上的情形、或配 置成矩陣狀的情形等下,供電用配線13係可對應發熱部10的配置作適當設置。 The portion on the base 11 on which the power supply wiring 13 is provided, or the wiring pattern of the power supply wiring 13 is not particularly limited as long as power can be supplied to both ends of the resistance heating wiring (12) provided in each heating unit 10. For example, as shown in FIG. 1, in each heating portion 10, one of the power supply wirings 13 a may be disposed on one end of the base 11, and the other power supply wiring 13 b may be disposed on the base 11. On the other end. In addition, when the plurality of heat generating portions 10 are arranged in two or more rows on the base 11, or In the case of a matrix, etc., the power supply wiring 13 can be appropriately set in accordance with the arrangement of the heat generating section 10.

前述「電阻發熱配線(12)」係以將2個供電用配線13(13a、13b)相連的方式使用電阻發熱材料所形成的配線,可藉由通電,按照其電阻值來使其發熱。電阻發熱配線12所使用的電阻發熱材料的種類未特別限定。以電阻發熱材料而言,列舉例如銀、銅、金、白金、鈀、銠、鎢、及鉬等。該等係可僅使用1種,亦可併用2種以上。在併用2種以上的情形下,係可形成為合金。更具體而言,可利用銀-鈀合金、銀-白金合金、白金-銠合金、銀、銅及金等。 The aforementioned "resistive heating wiring (12)" is a wiring formed by using a resistance heating material so that two power supply wirings 13 (13a, 13b) are connected, and it can be heated by applying resistance according to the resistance value. The type of the resistance heating material used for the resistance heating wiring 12 is not particularly limited. Examples of the resistance heating material include silver, copper, gold, platinum, palladium, rhodium, tungsten, and molybdenum. These systems can be used alone or in combination of two or more. When two or more types are used in combination, the alloy can be formed. More specifically, silver-palladium alloy, silver-platinum alloy, platinum-rhodium alloy, silver, copper, gold, and the like can be used.

此外,構成電阻發熱配線12的電阻發熱材料係在各發熱部10,而且在複數發熱部10之間,為了發揮自我溫度均衡作用(自我溫度互補作用),以具有正的電阻溫度係數為佳。例如,0~1000℃中的電阻溫度係數以500~4400ppm/℃為佳。尤其若將Ag或Ag-Pd形成為電阻發熱材料時,0~600℃中的電阻溫度係數以500~4000ppm/℃為佳。此外,若將Mo及/或W形成為電阻發熱材料時,0~1000℃中的電阻溫度係數以2000~4000ppm/℃為佳。 In addition, the resistance heating material constituting the resistance heating wiring 12 is located in each heating portion 10, and it is preferable that the plurality of heating portions 10 have a positive temperature coefficient of resistance in order to exert a self-temperature equalizing effect (self-temperature complementary effect). For example, the temperature coefficient of resistance at 0 to 1000 ° C is preferably 500 to 4400 ppm / ° C. In particular, when Ag or Ag-Pd is formed as a resistance heating material, the temperature coefficient of resistance at 0 to 600 ° C is preferably 500 to 4000 ppm / ° C. In addition, when Mo and / or W is formed as a resistance heating material, the temperature coefficient of resistance at 0 to 1000 ° C is preferably 2000 to 4000 ppm / ° C.

如前所述,若電阻發熱配線12使用電阻溫度依存性的材料而形成時,係可在各個發熱部10,而且在複數發熱部10之間,達成自我溫度均衡的作用。 As described above, when the resistance heating wiring 12 is formed using a resistance-temperature-dependent material, it can achieve self-temperature equalization between each heating portion 10 and between the plurality of heating portions 10.

例如,若1個發熱部10的溫度降低時,該發熱部10 的電阻發熱配線12的電阻值亦會降低。複數發熱部10係作電性並聯連接,因此若1個發熱部10的電阻發熱配線12的電阻值降低,流至該電阻發熱配線12的電流量會增加,因此該發熱部10的發熱量會增加。如上所示,複數發熱部10係各自個別地朝向定常狀態作自我均衡。 For example, when the temperature of one heating portion 10 decreases, the heating portion 10 The resistance value of the resistance heating wiring 12 will also decrease. The plurality of heating portions 10 are electrically connected in parallel. Therefore, if the resistance value of the resistance heating wiring 12 of one heating portion 10 decreases, the amount of current flowing to the resistance heating wiring 12 increases, so the amount of heat generated by the heating portion 10 will be increased. increase. As described above, each of the plurality of heat generating portions 10 is self-balanced toward the steady state individually.

此外,例如若被第1發熱部10與第3發熱部10所夾而有第2發熱部10時,若第2發熱部10的溫度降低,熱即由周圍的第1及第3發熱部10所補充。如此一來,對溫度降低的第1發熱部10及第3發熱部10的電流增加,發揮欲自律性恢復因所被奪取的熱所造成的溫度降低的作用。亦即,第2發熱部10的周圍的發熱部10以將第2發熱部10的溫度降低進行互補的方式進行動作。 In addition, for example, if the second heat generating portion 10 is sandwiched between the first heat generating portion 10 and the third heat generating portion 10, if the temperature of the second heat generating portion 10 decreases, the heat is transferred from the surrounding first and third heat generating portions 10 Added. In this way, the electric current to the first heat generating portion 10 and the third heat generating portion 10 whose temperature is decreased increases, and the effect of reducing the temperature due to the captured heat is to be recovered autonomously. That is, the heat-generating portion 10 around the second heat-generating portion 10 operates to complement the temperature reduction of the second heat-generating portion 10.

如上所示,本加熱器係以遍及複數發熱部10的全體均一地發熱的方式被自律性控制。若由該作用來看,基體11較佳為由連同耐熱撞擊性,連熱傳導性亦優異的金屬所構成。 As described above, this heater is controlled autonomously so that the entire heat generation portion 10 generates heat uniformly. From this point of view, the base 11 is preferably composed of a metal excellent in thermal shock resistance and excellent in thermal conductivity.

電阻發熱配線12的尺寸(配線的寬度、長度、厚度)或形狀(配線圖案)並未特別限定,若可按照所使用的電阻發熱材料的電阻率及所被要求的電阻值來適當決定即可。 The size (width, length, thickness) or shape (wiring pattern) of the resistance heating wiring 12 is not particularly limited, and may be appropriately determined according to the resistivity of the resistance heating material used and the required resistance value. .

若欲將各發熱部10形成為實質上相同的發熱量時,若以各發熱部10中的電阻發熱配線12成為實質上相同的電阻值的方式形成即可。此時,如圖1所示,各發熱部10的電阻發熱配線12係可以相同的線長、線寬及厚度, 藉由相同的配線圖案形成。圖2係表示如上所示之電阻發熱配線12連同供電用配線13一起形成在基體11上的狀態。其中,具有實質上相同的發熱量意指各發熱部10在相同測定條件下,具有實質上相同的電阻溫度係數與電阻值。例如,可形成為在發熱部間的電阻溫度係數的差異在±20%以內,而且在發熱部間的電阻值的差異為±10%以內。 When the heat generating portions 10 are to be formed to have substantially the same amount of heat generation, the resistance heating lines 12 in each heat generating portion 10 may be formed so as to have substantially the same resistance value. At this time, as shown in FIG. 1, the resistance heating wires 12 of each heating portion 10 may have the same line length, line width, and thickness. It is formed by the same wiring pattern. FIG. 2 shows a state where the resistance heating wiring 12 as described above is formed on the base 11 together with the power supply wiring 13. Here, having substantially the same calorific value means that each heat generating portion 10 has substantially the same resistance temperature coefficient and resistance value under the same measurement conditions. For example, it may be formed such that the difference in the temperature coefficient of resistance between the heating portions is within ± 20%, and the difference in the resistance value between the heating portions may be within ± 10%.

此外,電阻發熱配線12係即使採用依發熱部10而異的配線圖案,亦可將各發熱部10的發熱量(電阻值)形成為實質上相同。此外,即使使用依發熱部10內的部位而異的電阻發熱材料、或採用不同的線寬/線長或配線圖案,亦可使發熱部10的發熱量(電阻值)形成為實質上相同。 In addition, even if the resistance heating wiring 12 is a wiring pattern that varies depending on the heating portion 10, the heat generation (resistance value) of each heating portion 10 can be made substantially the same. In addition, even if a resistance heating material that is different depending on the location inside the heating portion 10 is used, or different line widths, lengths, or wiring patterns are used, the heat generation (resistance value) of the heating portion 10 can be made substantially the same.

此外,即使為意圖使各發熱部10形成為不同的發熱量的情形下,亦與上述相同地,電阻發熱配線12的電阻發熱材料、尺寸、配線圖案等係可按照所希望的發熱量作適當選擇。 In addition, even when it is intended that the heat generating portions 10 have different heat generation amounts, the resistance heating material, size, wiring pattern, and the like of the resistance heating wiring 12 can be appropriately adjusted according to the desired heat generation amount, as described above. select.

電阻發熱配線12係可藉由任意圖案進行配線。在圖1中,各發熱部10中的電阻發熱配線12的配線圖案係具有:與基體11的長邊呈平行被舖設的複數主圖案部、及以將各主圖案部作串聯連接的方式被舖設的連接圖案部。該配線圖案係可作各種變形。例如,主圖案部係可與基體11的邊未呈平行,各主圖案部亦可不相互平行。此外,亦可全部或部分的主圖案部作並聯連接。此 外,連接圖案部並非如本例侷限於直線狀,亦可為曲線狀。此外,亦可採用各主圖案部被鋸齒狀連接的配線圖案。 The resistance heating wiring 12 can be wired with an arbitrary pattern. In FIG. 1, the wiring pattern of the resistance heating wiring 12 in each heating portion 10 includes a plurality of main pattern portions laid in parallel with the long side of the base 11 and is connected in series to each main pattern portion Laying connection pattern section. This wiring pattern can be variously modified. For example, the main pattern portions may not be parallel to the sides of the base 11, and the main pattern portions may not be parallel to each other. In addition, all or part of the main pattern portions may be connected in parallel. this In addition, the connection pattern portion is not limited to a linear shape as in this example, and may be a curved shape. Alternatively, a wiring pattern in which the main pattern portions are connected in a zigzag manner may be used.

前述「補正跨橋(14)」係在各發熱部10中,若被配線在2個供電用配線13之間的電阻發熱配線12的兩端間(亦即供電用配線13a與13b之間)的電阻值超出預定範圍時,用以將其電阻值減至預定範圍內而設的短路用配線。電阻值係可藉由使電阻發熱配線12的長度實質上變短來減小。將該變短的長度稱為「補正長」(L)。前述「預定範圍」係可任意設定(後述)。當然,若電阻發熱配線12的電阻值在預定範圍內時,並不需要設置補正跨橋14。 The aforementioned “correction bridge (14)” is in each heating portion 10, and if it is wired between two ends of the resistance heating wiring 12 between the two power supply wirings 13 (that is, between the power supply wirings 13a and 13b) When the resistance value exceeds the predetermined range, the short-circuit wiring is used to reduce the resistance value within the predetermined range. The resistance value can be reduced by substantially shortening the length of the resistance heating wiring 12. This shortened length is called "corrected length" (L). The "predetermined range" can be arbitrarily set (described later). Of course, if the resistance value of the resistance heating wire 12 is within a predetermined range, it is not necessary to provide a correction bridge 14.

以補正跨橋14而言,係使用導電材料。導電材料可為金屬,只要可使補正長度份短路,則亦可為其他導電材料(例如與電阻發熱配線12為相同的材料)。較佳為可使用銀糊等導電糊膏作為補正跨橋14。導電糊膏並非侷限於銀,亦可為含有金、銅、鎳、鉬、鎢等者。 In the case of the correction bridge 14, a conductive material is used. The conductive material may be metal, and other conductive materials (for example, the same material as the resistance heating wiring 12) may be used as long as the correction length can be short-circuited. A conductive paste such as a silver paste is preferably used as the correction bridge 14. The conductive paste is not limited to silver, and may include gold, copper, nickel, molybdenum, tungsten, and the like.

補正跨橋14的數量或設置其的部位在各發熱部10中,以全體而言,只要電阻發熱配線12的實質長度縮短補正長L的部分,則不拘。 The number of correction bridges 14 or the locations where they are provided in each heating portion 10 is not limited as long as the substantial length of the resistance heating wiring 12 is shortened by the correction length L.

圖3係表示補正跨橋14的配設例。補正跨橋14係以縮短電阻發熱配線12的實質長度的方式,將電阻發熱配線12的2點間、及/或電阻發熱配線12的1點與供電用配線13之間,藉由1個以上的補正跨橋進行連接(短路) 的方式而設。 FIG. 3 shows an arrangement example of the correction bridge 14. The correction bridge 14 shortens the substantial length of the resistance heating wiring 12 by connecting one or more points between the resistance heating wiring 12 and / or one point of the resistance heating wiring 12 and the power supply wiring 13. Connection (short circuit) By the way.

在該圖(a)中,至少1個補正跨橋141係以連結電阻發熱配線12的1點與供電用配線13b之間的方式而設。藉此,由電阻發熱配線的一端為一定的長度的區間被短路。 In the figure (a), at least one correction bridge 141 is provided so as to connect one point of the resistance heating wiring 12 and the power supply wiring 13b. Thereby, the section where one end of the resistance heating wire has a certain length is short-circuited.

在該圖(b)中,至少1個補正跨橋143係以將電阻發熱配線12的線間相連結的方式而設。藉此,藉由補正跨橋143所被連結的電阻發熱配線12的2點間被短路。 In the figure (b), at least one correction bridge 143 is provided so as to connect the lines of the resistance heating wiring 12. Thereby, the two points of the resistance heating wire 12 connected by the correction bridge 143 are short-circuited.

在該圖(c)中,至少1個補正跨橋144係以在電阻發熱配線12的線上相重疊的方式而設。藉此,補正跨橋144的兩端的2點間的電阻發熱配線12即被短路。 In the figure (c), at least one correction bridge 144 is provided so as to overlap on the line of the resistance heating wire 12. Thereby, the resistance heating wiring 12 between two points of both ends of the correction bridge 144 is short-circuited.

在該圖(d)中,至少2個補正跨橋142係以將由電阻發熱配線12的各端為相同長度的點與各端側的供電用配線(13a、13b)分別相連結的方式而設。藉此,由電阻發熱配線12的各端為一定的長度的區間分別被短路。圖4係表示在各發熱部10設置2個補正跨橋14(142)之例。 In the figure (d), at least two correction bridges 142 are provided so that points having the same length at each end of the resistance heating wiring 12 are connected to power supply wirings (13a, 13b) on each end side. . Thereby, the sections in which each end of the resistance heating wire 12 has a certain length are short-circuited. FIG. 4 shows an example in which two correction bridges 14 (142) are provided in each heat generating section 10.

藉由適當設置如以上所示之補正跨橋14,可將電阻發熱配線12的長度實質上合計縮短補正長L的部分。 By appropriately setting the correction bridge 14 as described above, the length of the resistance heating wiring 12 can be substantially reduced by a total portion of the correction length L.

前述「供電用跨橋(15)」係使用低電阻的導電材料,將各發熱部10的其中一方供電用配線13a彼此及另一方前述供電用配線13b彼此相連接的電源連接用配線。藉由在各發熱部10之間形成供電用跨橋15,全部發熱部10(電阻發熱配線12)係作電性並聯連接。在供電用跨橋15的材料係可使用銀糊等與前述為相同的導電糊膏。 The “power supply bridge (15)” is a power connection wiring that connects one of the power supply wirings 13a and the other power supply wiring 13b to each other using a low-resistance conductive material. By forming a power supply bridge 15 between the heat generating portions 10, all the heat generating portions 10 (resistive heat generating wirings 12) are electrically connected in parallel. As the material of the power supply bridge 15, a silver paste or the like can be used as the conductive paste.

補正跨橋14及供電用跨橋15係可積層形成在供電用配線13或電阻發熱配線12上。 The correction bridge 14 and the power supply bridge 15 are laminated on the power supply wiring 13 or the resistance heating wiring 12.

圖5~7係表示藉由各種配線圖案設置電阻發熱配線12的加熱器1之例。任何圖均表示藉由供電用跨橋15,全部發熱部10作並聯連接的狀態的電路。 5 to 7 show examples of the heater 1 in which the resistance heating wiring 12 is provided by various wiring patterns. Any of the figures shows a circuit in which all the heating units 10 are connected in parallel by the power supply bridge 15.

圖5的加熱器1係藉由與圖1為相同的發熱部10的配線圖案所構成。 The heater 1 of FIG. 5 is configured by a wiring pattern of the heat generating portion 10 which is the same as that of FIG. 1.

圖6的加熱器1係各發熱部10朝與基體11的長邊呈垂直設置,與基體11的長邊呈平行的配線圖案的主圖案部係作串聯連接。 The heater 1 shown in FIG. 6 is such that each heat generating portion 10 is arranged perpendicular to the long side of the base 11 and the main pattern portion of the wiring pattern parallel to the long side of the base 11 is connected in series.

圖7的加熱器1係在各發熱部10中,與基體11的長邊呈平行的配線圖案的主圖案部作並聯連接。 The heater 1 of FIG. 7 is connected in parallel to the main pattern portion of each heat generating portion 10 in a wiring pattern parallel to the long side of the base 11.

上述配線圖案的構成係可作適當變形。 The structure of the wiring pattern can be appropriately modified.

圖8係說明在加熱器1的發熱面與被加熱物2相對面的狀態下,使被加熱物2及加熱器1之中的至少一方朝預定的掃描方向D掃描,將被加熱物2加熱的加熱器的圖。此時,被加熱物2係在加熱器1上相對地朝D的方向被掃描。加熱器1上的發熱部10的構成或電阻發熱配線12的配線圖案若適當選擇即可,可構成為例如圖5~7等所表示。在如上所示所使用的加熱器1中,各發熱部10係以朝與掃描方向D呈正交方向排列配設為佳。藉此,無關於被加熱物2的寬度或位置,由於有效地作用前述自我溫度均衡作用,因此可均一地加熱被加熱物2。 FIG. 8 illustrates that at least one of the heated object 2 and the heater 1 is scanned in a predetermined scanning direction D in a state where the heating surface of the heater 1 and the heated object 2 face each other, and the heated object 2 is heated. Illustration of heater. At this time, the object to be heated 2 is scanned relative to the direction D on the heater 1. The configuration of the heating portion 10 on the heater 1 or the wiring pattern of the resistance heating wiring 12 may be appropriately selected, and may be configured as shown in, for example, FIGS. 5 to 7. In the heater 1 used as described above, each of the heat generating portions 10 is preferably arranged in a direction orthogonal to the scanning direction D. Thereby, regardless of the width or position of the object 2 to be heated, since the aforementioned self-temperature equalizing effect is effectively performed, the object 2 to be heated can be uniformly heated.

此外,若被加熱物2相對朝D的方向被掃描 時,在各發熱部10中,以電阻發熱配線12的主圖案部與掃描方向D呈大致正交方向的方式而設為佳。圖9係表示如上所示之電阻發熱配線12的配線圖案之例。如該圖(a)所示,電阻發熱配線12係可利用具有:相對於前述正交方向,以預定範圍內的角度θ設置的複數主圖案部121、及以連接各主圖案部121的方式設置的連接圖案部122的圖案來進行配線。上述預定範圍內的角度θ係可形成為例如-30°~30°,較佳為形成為-15°~15°。以角度θ=0°,亦即將主圖案部121朝與掃描方向D呈正交方向設置為最佳。各主圖案部121亦可非為相互平行,連接圖案部122並非侷限於直線狀,亦可為曲線狀。此外,各主圖案部121係可作電性串聯連接,亦可全部或部分的主圖案部121作電性並聯連接。此外,如該圖(b)所示,電阻發熱配線12亦可形成為主圖案部121被鋸齒狀連接的配線圖案。 In addition, if the object to be heated 2 is scanned in the direction of D, In this case, in each of the heat generating portions 10, it is preferable that the main pattern portion of the resistance heat generating wiring 12 and the scanning direction D are substantially orthogonal to each other. FIG. 9 shows an example of a wiring pattern of the resistance heating wiring 12 as described above. As shown in (a) of this figure, the resistive heating wiring 12 can have a plurality of main pattern portions 121 provided at an angle θ within a predetermined range with respect to the orthogonal direction, and a method of connecting the main pattern portions 121. The pattern of the connection pattern portion 122 is provided for wiring. The angle θ within the predetermined range may be formed, for example, from -30 ° to 30 °, and preferably from -15 ° to 15 °. With the angle θ = 0 °, that is, the main pattern portion 121 is optimally set in a direction orthogonal to the scanning direction D. Each of the main pattern portions 121 may not be parallel to each other, and the connection pattern portion 122 is not limited to a linear shape, and may be a curved shape. In addition, each of the main pattern portions 121 may be electrically connected in series, or all or part of the main pattern portions 121 may be electrically connected in parallel. In addition, as shown in the figure (b), the resistance heating wiring 12 may be formed as a wiring pattern in which the main pattern portion 121 is connected in a zigzag manner.

如上所述,將電阻發熱配線12的主圖案部,相對於與掃描方向D呈正交方向、或相對於其正交方向,設為預定範圍內的角度θ,藉此可將所被掃描的被加熱物2有效率地加熱。 As described above, the main pattern portion of the resistance heating wiring 12 is set at an angle θ within a predetermined range with respect to the direction orthogonal to the scanning direction D or the direction orthogonal to the scanning direction D, thereby making it possible to scan the The object to be heated 2 is efficiently heated.

其中,在各發熱部10中,供電用配線的其中一方(13a)可被配設在基體11上的前述正交方向的其中一方側,且供電用配線的另一方(13b)可被配設在基體11上的前述正交方向的另一方側。 Among them, in each heating portion 10, one of the power supply wirings (13a) may be disposed on one side of the aforementioned orthogonal direction on the base 11, and the other power supply wiring (13b) may be disposed. On the other side of the aforementioned orthogonal direction on the base body 11.

如前所述,若為在加熱器1的發熱面與被加 熱物2相對面的狀態下,使被加熱物2與加熱器1相對地朝預定的掃描方向D掃描來將被加熱物2加熱的加熱器1時,基體11的掃描方向D的剖面形狀係可形成為將與掃描方向D呈正交的軸為中心而在與被加熱物2的對面側呈凸狀的圓弧形狀(亦即將圓柱或圓筒,在與中心軸呈平行的平面進行切取的形狀)。接著,各發熱部10係如圖10所示,可被配設在前述凸狀的面上。此外,如圖11所示,亦可配設在其相反側的面(凹狀的面)上。藉由形成為如上所示之形狀,將加熱器1安裝在圓筒狀滾筒,藉由使滾筒旋轉,可將在滾筒上被掃描的被加熱物2有效率地加熱(參照圖14)。 As mentioned above, if the heating surface of the heater 1 and In the state where the hot object 2 is facing, the heated object 2 and the heater 1 are scanned in a predetermined scanning direction D to scan the heater 1 to heat the heated object 2, and the cross-sectional shape of the scanning direction D of the base 11 is It can be formed into a circular arc shape with the axis orthogonal to the scanning direction D as the center and a convex shape on the opposite side to the object 2 (that is, a cylinder or a cylinder is cut out in a plane parallel to the center axis shape). Next, as shown in FIG. 10, each heat generating part 10 can be arrange | positioned on the said convex surface. Moreover, as shown in FIG. 11, it may be arrange | positioned on the surface (concave surface) on the opposite side. By forming the heater 1 into a cylindrical drum as described above, and rotating the drum, the object to be heated 2 scanned on the drum can be efficiently heated (see FIG. 14).

此外,在加熱器1的基體11上係可具備用以由外部連接電源的供電用端子131(131a、131b)。其中一方供電用端子131a係與前述供電用配線13a相連接,另一方供電用端子131b係與供電用配線13b相連接。藉由前述供電用跨橋15,全部發熱部10的供電用配線13被連接,因此供電用端子131若與至少1個發熱部10的供電用配線13相連接即可。在基體11上,供電用端子131的配設部位並未特別限定,可設在例如圖12(a)~(c)所示部位。 The base 11 of the heater 1 may be provided with power supply terminals 131 (131a, 131b) for externally connecting a power source. One of the power supply terminals 131a is connected to the power supply wiring 13a, and the other power supply terminal 131b is connected to the power supply wiring 13b. Since the power supply wirings 13 of all the heating portions 10 are connected by the power supply bridge 15 described above, the power supply terminals 131 may be connected to the power supply wirings 13 of at least one of the heating portions 10. The placement location of the power supply terminal 131 on the base 11 is not particularly limited, and it may be provided at, for example, the locations shown in FIGS. 12 (a) to (c).

本加熱器1係被組入在印刷機、影印機、傳真機等畫像形成裝置或定著裝置等,可作為在記錄媒體定著碳粉或墨水等的定著用加熱器加以利用。此外,可作為被組入在加熱機,將面板等被處理體均一加熱(乾燥或燒 成等)的加熱裝置加以利用。此外,可適當進行金屬製品的熱處理、被形成在各種形狀的基體的塗膜、被膜的熱處理等。具體而言,可利用在平板顯示器用塗膜(過濾器構成材料)的熱處理、所被塗裝的金屬製品、汽車相關製品、木工製品等的塗裝乾燥、靜電植毛接著乾燥、塑膠加工製品的熱處理、印刷基板的焊料迴焊、厚膜積體電路的印刷乾燥等。 The heater 1 is incorporated in an image forming apparatus or a fixing device such as a printer, a photocopier, and a facsimile, and can be used as a fixing heater for fixing toner or ink on a recording medium. In addition, it can be incorporated into a heating machine to uniformly heat the object to be processed such as a panel (dry or burned). Cheng et al.). In addition, heat treatment of a metal product, heat treatment of a coating film formed on a substrate having various shapes, and a film can be appropriately performed. Specifically, it can be used for heat treatment of coating films (filter constituent materials) for flat panel displays, coating and drying of coated metal products, automobile-related products, woodwork products, etc., electrostatic flocking followed by drying, and plastic processing products. Heat treatment, solder reflow of printed circuit boards, printing drying of thick film integrated circuits, etc.

〔2〕定著裝置 (2) Fixing device

具備本加熱器的定著裝置係可形成為藉由加熱對象或定著手段等作適當選擇的構成。例如,具備伴隨壓接的定著手段,當使碳粉等定著在紙等記錄用媒體時、或黏貼複數構件時,係可形成為具備有具加熱器的加熱部、及加壓部的定著裝置。當然,亦可形成為未伴隨壓接的定著手段。在本發明中,較佳為使包含形成在紙、薄膜等記錄用媒體的表面的碳粉的未定著畫像定著在記錄用媒體的定著裝置5。 The fixing device provided with the heater can be configured to be appropriately selected by a heating target, a fixing means, or the like. For example, a fixing means with pressure bonding is provided. When toner or the like is fixed on a recording medium such as paper, or when a plurality of members are pasted, it can be formed with a heating section with a heater and a pressure section. Hold the device. Of course, it can also be set as a fixing means without accompanying crimping | compression-bonding. In the present invention, it is preferable that an unfixed image including toner formed on the surface of a recording medium such as paper or film is fixed to the fixing device 5 of the recording medium.

圖13係顯示被配設在電子照相方式的畫像形成裝置的定著裝置5的主要部位。定著裝置5係具備有:可旋轉的定著用滾筒51、及可旋轉的加壓用滾筒54,加熱器1係被配設在定著用滾筒51的內部。加熱器1較佳為以近接定著用滾筒51的內表面的方式作配設。 FIG. 13 shows the main parts of the fixing device 5 arranged in the electrophotographic image forming apparatus. The fixing device 5 includes a rotatable fixing roller 51 and a rotatable pressure roller 54. The heater 1 is arranged inside the fixing roller 51. The heater 1 is preferably disposed so as to be close to the inner surface of the roller 51.

加熱器1亦可形成為例如圖15所示之定著手段5般,被固定在由可傳導加熱器1所發出的熱的材料所成之 加熱器保持具53的內部,將加熱器1的發熱,由定著用滾筒51的內側傳至外表面的構造。 The heater 1 may be formed, for example, as the fixing means 5 shown in FIG. 15, and may be fixed to a material made of a material that can conduct heat emitted from the heater 1. The inside of the heater holder 53 is a structure that transmits the heat of the heater 1 from the inside to the outer surface of the fixing drum 51.

圖14亦另外顯示被配設在電子照相方式的畫像形成裝置的定著裝置5的主要部位。定著裝置5係具備有:可旋轉的定著用滾筒51、及可旋轉的加壓用滾筒54,在定著用滾筒51的內部配設有將熱傳至定著用滾筒51的加熱器1、及連同加壓用滾筒54一起壓接記錄用媒體的加壓用滾筒52。加熱器1係以沿著定著用滾筒51的圓筒面的方式作配設。 FIG. 14 also shows a main part of the fixing device 5 provided in the electrophotographic image forming apparatus. The fixing device 5 includes a rotatable fixing roller 51 and a rotatable pressure roller 54. A heater for transferring heat to the fixing roller 51 is disposed inside the fixing roller 51. 1. A pressure roller 52 for pressure-contacting the recording medium together with the pressure roller 54. The heater 1 is arranged along the cylindrical surface of the fixing drum 51.

在圖13或圖14所示之定著裝置5中,由未圖示之電源裝置施加電壓,藉此使加熱器1發熱,且該熱被傳至定著用滾筒51。接著,若在表面具有未定著的碳粉畫像的記錄用媒體被供給至定著用滾筒51與加壓用滾筒54之間時,在定著用滾筒51及加壓用滾筒54的壓接部,碳粉熔融而形成定著畫像。由於具有定著用滾筒51及加壓用滾筒54的壓接部,因此一起旋轉。如前所述,加熱器1係抑制使用較小的記錄用媒體時容易發生的局部溫度上升,因此不易發生定著用滾筒51中的溫度不均,可均一地進行定著。 In the fixing device 5 shown in FIG. 13 or FIG. 14, a voltage is applied from a power supply device (not shown), thereby heating the heater 1, and the heat is transmitted to the fixing roller 51. Next, when a recording medium having an unfixed toner image on its surface is supplied between the fixing roller 51 and the pressure roller 54, the crimping portion of the fixing roller 51 and the pressure roller 54 is provided. The toner melts to form a standing portrait. Since the fixing roller 51 and the pressure roller 54 have crimping portions, they rotate together. As described above, since the heater 1 suppresses a local temperature rise that is likely to occur when a small recording medium is used, the temperature unevenness in the fixing roller 51 is unlikely to occur, and the fixing can be performed uniformly.

以具備本加熱器1之定著裝置的其他態樣而言,可形成為具備上模及下模的模具,在上模及下模的至少一方的內部配設有加熱器的態樣。 In other aspects including the fixing device of the heater 1, it may be formed as a mold having an upper mold and a lower mold, and a heater is disposed in at least one of the upper mold and the lower mold.

具備本加熱器1的定著裝置係以電子照相方式的印刷機、影印機等畫像形成裝置為首,裝設在家庭用電氣製 品、業務用、實驗用精密機器等而適於作為加熱、保溫等熱源。 The fixing device provided with the heater 1 is an image forming device such as an electrophotographic printing machine or a photocopier, and is installed in a household electric device. It is suitable as a heat source for heating, heat preservation, etc.

〔3〕畫像形成裝置 [3] Image forming device

具備本加熱器的畫像形成裝置係可形成為依加熱對象或加熱目的等作適當選擇的構成。在本發明中,如圖15所示,較佳為具備:在紙、薄膜等記錄用媒體的表面形成未定著畫像的成像手段、及使未定著畫像定著在記錄用媒體的定著手段5,定著手段5具備本加熱器1的畫像形成裝置4。畫像形成裝置4係除了上述手段以外,可構成為具備有:記錄用媒體搬送手段、或用以控制各手段的控制手段。 The image forming apparatus provided with the heater can be formed into a structure appropriately selected depending on the heating target, the heating purpose, and the like. In the present invention, as shown in FIG. 15, it is preferable to include imaging means for forming an unfixed image on the surface of a recording medium such as paper or film, and fixing means 5 for immobilizing the unfixed image on the recording medium. The fixing means 5 includes an image forming apparatus 4 of the heater 1. The image forming apparatus 4 may be configured to include a recording medium transporting means or a control means for controlling each means in addition to the above means.

圖15係顯示電子照相方式之畫像形成裝置4的主要部位的概略圖。以成像手段而言,係可為具備轉印鼓的方式、及不具備轉印鼓的方式的任一者,圖15係具備轉印鼓的態樣。 FIG. 15 is a schematic view showing a main part of an image forming apparatus 4 of an electrophotographic method. The imaging means may be any of a method including a transfer drum and a method without a transfer drum, and FIG. 15 shows a state with a transfer drum.

在成像手段中,在一面旋轉一面藉由帶電裝置43而被帶電處理成預定電位的感光鼓44的帶電處理面,被照射由雷射掃描器41所被輸出的雷射,藉由由顯影器45所被供給的碳粉,形成靜電潛像。接著,利用電位差,在與感光鼓44連動的轉印鼓46的表面被轉印碳粉畫像。之後,在被供給至轉印鼓46及轉印用滾筒47之間的記錄用媒體的表面,被轉印碳粉畫像,獲得具有未定著畫像的記錄用媒體。碳粉係含有黏結樹脂、著色劑、及添加劑的粒 子,黏結樹脂的熔融溫度通常為90℃~220℃。其中,在感光鼓44及轉印鼓46的表面係可具備用以去除不溶性碳粉等的清掃裝置。 In the imaging means, the charged processing surface of the photoconductor drum 44 which is charged to a predetermined potential by the charging device 43 while rotating is irradiated with the laser output from the laser scanner 41, and the developing device 45 of the supplied toner forms an electrostatic latent image. Next, a toner image is transferred onto the surface of the transfer drum 46 linked to the photoreceptor drum 44 using the potential difference. Thereafter, a toner image is transferred on the surface of the recording medium supplied between the transfer drum 46 and the transfer drum 47 to obtain a recording medium having an undefined image. Toner is a particle containing a binder resin, a colorant, and additives. The melting temperature of the bonding resin is usually 90 ℃ ~ 220 ℃. Among them, a cleaning device may be provided on the surface of the photoreceptor drum 44 and the transfer drum 46 to remove insoluble toner and the like.

定著手段5係可形成為與前述定著裝置5為相同的構成,具備有:加壓用滾筒54、及在內部具備有保持通紙方向通電型之加熱器1的加熱器保持具53且與加壓用滾筒54連動的定著用滾筒51。具有來自成像手段的未定著畫像的記錄用媒體係被供給至定著用滾筒51及加壓用滾筒54之間。定著用滾筒51的熱將記錄用媒體的碳粉畫像熔融,此外,經熔融的碳粉在定著用滾筒51與加壓用滾筒54的壓接部被加壓,碳粉畫像被定著在記錄用媒體。在圖15的定著手段5中,亦可為具備將加熱器1近接配置的定著用帶件(belt)的態樣,來取代定著用滾筒51。 The fixing means 5 can be formed in the same configuration as the above-mentioned fixing device 5, and includes a pressure roller 54 and a heater holder 53 provided with a heater 1 for holding the paper-feeding-direction heater 1 therein. The fixing roller 51 is interlocked with the pressure roller 54. A recording medium having an unfixed image from an image forming means is supplied between the fixing roller 51 and the pressure roller 54. The toner image of the recording medium is fused by the heat of the stationary roller 51. The molten toner is pressed at the pressure contact portion between the stationary roller 51 and the pressing roller 54, and the toner image is fixed. Recording media. Instead of the fixing roller 51, the fixing means 5 of FIG. 15 may be equipped with the fixing belt which arrange | positions the heater 1 close.

一般而言,定著用滾筒51的溫度形成為不均一,若被供予至碳粉的熱量過小時,碳粉會從記錄用媒體被剝下,另一方面,若熱量過大時,碳粉會附著在定著用滾筒51,會有定著用滾筒51繞一周而再附著在記錄用媒體的情形。藉由具備本發明之加熱器的定著手段5,被迅速調整成預定溫度,因此可抑制不良情形。 Generally, the temperature of the fixing roller 51 is uneven, and if the amount of heat supplied to the toner is too small, the toner is peeled off from the recording medium. On the other hand, if the amount of heat is excessive, the toner is peeled. It may be attached to the fixing roller 51, and the fixing roller 51 may be wound once and then attached to the recording medium. Since the fixing means 5 provided with the heater of the present invention is quickly adjusted to a predetermined temperature, it is possible to suppress a defect.

本發明之畫像形成裝置係在使用時被抑制非通紙區域的過度升溫,適於作為電子照相方式的印刷機、影印機等。 The image forming apparatus of the present invention is used to suppress excessive temperature rise in a non-paper-passing area during use, and is suitable as an electrophotographic printing machine, a photocopier, and the like.

〔4〕加熱裝置 〔4〕 Heating device

具備本加熱器的加熱裝置係可形成為藉由加熱對象的大小或形狀等來作適當選擇的構成。在本發明中,構成為例如具備有:框體部、用以進行被熱處理物之取出放入等所配設之可密閉窗部、及被配設在框體部的內部之可移動的加熱器部。視需要,可在框體部的內部配備:配置被熱處理物的被熱處理物設置部;若藉由被熱處理物的加熱被排出氣體時,則將該氣體排出的排氣部;及調整框體部的內部壓力的真空泵等壓力調整部等。此外,加熱係可在固定被熱處理物及加熱器部的狀態下進行,亦可一面使任一者移動一面進行。 The heating device provided with this heater can be formed into a structure suitably selected by the size, shape, etc. of a heating target. In the present invention, for example, it is configured to include a frame body portion, a closable window portion provided for taking out and placing a heat-treated object, and movable heating provided inside the frame body portion.器 部。 The department. If necessary, the inside of the frame body can be equipped with: a heat-treated object setting part for arranging the heat-treated object; if the gas is exhausted by heating the heat-treated object, an exhaust part that exhausts the gas; A pressure adjustment unit such as a vacuum pump such as the internal pressure of the unit. The heating system may be performed while the object to be heat-treated and the heater portion are fixed, or may be performed while moving either one.

本加熱裝置係適於作為以所希望的溫度進行含有水、有機溶劑等的被熱處理物的乾燥的裝置。接著,可作為真空乾燥機(減壓乾燥機)、加壓乾燥機、除濕乾燥機、熱風乾燥機、防爆型乾燥機等來使用。此外,適於作為以所希望的溫度進行LCD面板、有機EL面板等未燒成物的燒成的裝置。接著,可作為減壓燒成機、加壓燒成機等來使用。 This heating device is suitable as a device for drying a heat-treated object containing water, an organic solvent, and the like at a desired temperature. Next, it can be used as a vacuum dryer (decompression dryer), a pressure dryer, a dehumidifier dryer, a hot-air dryer, an explosion-proof dryer, and the like. In addition, it is suitable as a device for firing unfired materials such as LCD panels and organic EL panels at a desired temperature. Next, it can be used as a reduced pressure baking machine, a pressure baking machine, and the like.

〔5〕加熱器之製造方法 [5] Manufacturing method of heater

如以上所示之具備被配設在基體(11)上的複數發熱部(10)的加熱器(1)之製造方法係可構成為具備有:供電用配線形成工程,其係使用導電材料,形成按每個發熱部(10)予以分離而且相互分離的2個供電用配線 (13(13a、13b));電阻發熱配線形成工程,其係在各發熱部(10)中,以使用電阻發熱材料,將各供電用配線(13a、13b)相連的方式形成電阻發熱配線(12);測定工程,其係在形成供電用配線(13)及電阻發熱配線(12)之後,藉由電阻值測定手段,針對各發熱部(10),測定各供電用配線(13a、13b)間的電阻值;運算工程,其係藉由運算手段,針對各發熱部(10),將藉由前述測定工程所被測定到的前述電阻值與預定範圍進行比較,若前述電阻值超出前述預定範圍時,求出為了將該電阻值補正為前述預定範圍而將該電阻發熱配線(12)實質上縮短的長度作為補正長;補正跨橋形成工程,其係以將電阻發熱配線(12)的長度縮短前述補正長的部分的方式,形成藉由導電材料,將電阻發熱配線(12)的2點間、及電阻發熱配線(12)的1點與供電用配線(13)之間之中的至少1個相連接之1以上的補正跨橋(14);及供電用跨橋形成工程,其係形成藉由導電材料,將各發熱部(10)的其中一方供電用配線(13a)彼此及另一方供電用配線(13b)彼此相連接的供電用跨橋(15)。 As described above, the manufacturing method of the heater (1) provided with the plurality of heat generating portions (10) arranged on the base body (11) can be configured to include a power supply wiring forming process using a conductive material, Form two power supply wirings that are separated for each heating part (10) and separated from each other (13 (13a, 13b)); a resistance heating wiring formation process, which is formed in each heating section (10), using a resistance heating material to connect the power supply wirings (13a, 13b) ( 12); measurement process, after forming the power supply wiring (13) and the resistance heating wiring (12), measuring the power supply wiring (13a, 13b) for each heating portion (10) by means of resistance value measurement means Resistance value; calculation engineering, which uses calculation means to compare the resistance value measured by the measurement process with a predetermined range for each heating part (10), if the resistance value exceeds the predetermined value In the range, the length of the resistance heating wiring (12) that is substantially shortened in order to correct the resistance value to the aforementioned predetermined range is determined as the correction length; the bridge formation process is to correct the resistance heating wiring (12). The method of shortening the length of the aforementioned length is to form a conductive material between the two points of the resistance heating wiring (12) and the one point of the resistance heating wiring (12) and the power supply wiring (13). At least 1 correction span connected to at least 1 Bridge (14); and a bridge forming process for power supply, which is formed by connecting one of the power supply wirings (13a) and the other power supply wiring (13b) of each heating portion (10) to each other through a conductive material. Power supply bridge (15).

以下參照圖16,說明前述各工程。其中,在以下說明中,關於加熱器1及其各部的詳細內容,由於與前述〔1〕的內容相同,故省略。 Hereinafter, each of the aforementioned processes will be described with reference to FIG. 16. However, in the following description, the details of the heater 1 and its respective parts are the same as those of the above-mentioned [1], and are therefore omitted.

(1)供電用配線形成工程 (1) Wiring formation process for power supply

在基體11上,使用導電材料,形成如圖16(a)所示之全部發熱部10的供電用配線13(13a、13b)的圖案。供電用配線13的圖案不拘,例如圖1所示,在各發熱部10中,供電用配線的其中一方13a係可形成在基體11上的其中一方端部,供電用配線的另一方13b係可形成在基體11上的另一方端部。關於所使用的導電材料,係如前所述。將該導電材料印刷在基體11上進行燒成,藉此可形成前述圖案。在供電用配線13,係可視需要配備用以在之後測定各發熱部10的電阻值的島部。 A pattern of the power supply wirings 13 (13a, 13b) of all the heat generating portions 10 shown in FIG. 16 (a) is formed on the base 11 using a conductive material. The pattern of the power supply wiring 13 is not limited. For example, as shown in FIG. 1, in each heating portion 10, one of the power supply wirings 13 a may be formed on one end portion of the base 11, and the other power supply wiring 13 b may be formed. The other end portion is formed on the base body 11. The conductive materials used are as described above. The conductive material is printed on the substrate 11 and fired, whereby the aforementioned pattern can be formed. The power supply wiring 13 may be provided with an island portion for measuring the resistance value of each of the heat generating portions 10 later as necessary.

(2)電阻發熱配線形成工程 (2) Resistive heating wiring formation process

在基體11上,使用電阻發熱材料,形成圖16(b)所示之全部發熱部10的電阻發熱配線12的圖案。所使用的電阻發熱材料係可選擇電阻值取決溫度而改變的導電材料。將該電阻發熱材料印刷在基體11上,且進行燒成,藉此可形成前述圖案。電阻發熱配線12的厚度若由面積固有電阻的觀點來看,以3~20μm為佳。 On the base body 11, a pattern of the resistance heating wires 12 of all the heating portions 10 shown in FIG. 16 (b) is formed using a resistance heating material. The resistance heating material used is a conductive material whose resistance value can be changed depending on the temperature. The resistive heat-generating material is printed on the substrate 11 and fired, whereby the aforementioned pattern can be formed. From the viewpoint of area specific resistance, the thickness of the resistance heating wire 12 is preferably 3 to 20 μm.

電阻發熱配線形成工程與供電用配線形成工程係可任一者先進行。在先形成的配線與後形成的配線作積層的部分,電阻發熱配線12與前述供電用配線13作電性連接。 Either the resistance heating wiring formation process or the power supply wiring formation process may be performed first. In a portion where the wiring formed first and the wiring formed later are laminated, the resistance heating wiring 12 is electrically connected to the aforementioned power supply wiring 13.

(3)測定工程 (3) Measurement Engineering

在形成供電用配線13及電阻發熱配線12之後,在測 定工程中,藉由測定電阻值的電阻值測定手段,按每個發熱部10,測定2個供電用配線(13a、13b)間的電阻值。電阻值及電阻溫度係數係可形成為依據JIS C2526進行測定者。電阻值測定手段的具體構成不拘。所被測定出的電阻值係被傳送至接下來的運算手段。 After forming the power supply wiring 13 and the resistance heating wiring 12, In the predetermined process, the resistance value between the two power supply wirings (13a, 13b) is measured for each heating portion 10 by a resistance value measuring means for measuring the resistance value. The resistance value and the temperature coefficient of resistance can be formed to be measured in accordance with JIS C2526. The specific configuration of the resistance value measuring means is not limited. The measured resistance value is transmitted to the next calculation means.

(4)運算工程 (4) Computing Engineering

運算工程係藉由運算手段,針對各發熱部10,將藉由前述測定工程所被測定到的電阻發熱配線12的電阻值與預定範圍進行比較,若前述電阻值超出前述預定範圍時,為了將該電阻值補正為前述預定範圍,求出將該電阻發熱配線12實質上縮短的長度(補正長L)的工程。運算手段係可使用電腦來構成。運算手段係可構成為輸入在前述測定工程中所被計測的全部發熱部10的電阻值。 The calculation engineering compares the resistance value of the resistance heating wire 12 measured by the measurement process with a predetermined range for each heating portion 10 by a calculation means. If the resistance value exceeds the predetermined range, in order to This resistance value correction is performed within the aforementioned predetermined range, and a process for calculating a substantially shortened length (correction length L) of the resistance heating wire 12 is obtained. The computing means can be constructed using a computer. The calculation means may be configured so as to input the resistance values of all the heating parts 10 measured in the aforementioned measurement process.

前述「預定範圍」係可任意設定。例如可將預先規定的電阻值作為基準,形成為一定的比率(例如0.95~1.05)的範圍。此外,在針對全部發熱部10所被計測到的電阻值之中,亦可以最小的電阻值為基準,形成為一定的比率的範圍(例如1.00~1.05)等。針對被測定到超出如上所示之預定範圍(例如超出成為基準的電阻值的1.05倍)的電阻值的發熱部10,為了相對於被形成為前述基準的電阻值,形成為預定比率(例如1.00~1.05)內的電阻值,可藉由運算來求出將電阻發熱配線12實質上縮短的長度L作為補正長。運算方法並未特別限定,例如可根 據電阻發熱材料的電阻率與配線的寬度及厚度,來算出補正長L。若電阻發熱配線12的電阻值在預定範圍內時,針對該發熱部10,係可以未設置補正跨橋14的方式進行設定。 The aforementioned "predetermined range" can be arbitrarily set. For example, a predetermined resistance value can be used as a reference to form a range of a certain ratio (for example, 0.95 to 1.05). In addition, among the resistance values measured for all the heating parts 10, the minimum resistance value may be used as a reference, and may be formed in a range of a certain ratio (for example, 1.00 to 1.05). The heating portion 10 having a resistance value measured outside a predetermined range (for example, 1.05 times the resistance value as a reference) is measured at a predetermined ratio (for example, 1.00) to the resistance value formed as the reference. The resistance value within ~ 1.05) can be calculated by calculating the length L in which the resistance heating wire 12 is substantially shortened. The calculation method is not particularly limited, such as Cogan The correction length L is calculated from the resistivity of the resistance heating material and the width and thickness of the wiring. If the resistance value of the resistance heating wire 12 is within a predetermined range, the heating section 10 may be set without a correction bridge 14.

此外,運算手段係可構成為:針對各發熱部10,根據所被算出的補正長L、及電阻發熱配線12的配線圖案,以電阻發熱配線12的長度實質上縮短補正長L的部分的方式,算出形成1個以上的補正跨橋14的位置。 In addition, the calculation means may be configured such that the length of the resistance heating wiring 12 is substantially shortened by the length of the resistance heating wiring 12 based on the calculated correction length L and the wiring pattern of the resistance heating wiring 12 for each heating unit 10. , The position where one or more correction bridges 14 are formed is calculated.

此外,運算手段係可構成為將按每個發熱部10所算出的補正長L、或應被設置的補正跨橋14的位置等資料,傳送至接下來的補正跨橋形成工程。 In addition, the calculation means may be configured to transmit data such as the correction length L calculated for each heating unit 10 or the position of the correction bridge 14 to be set to the subsequent correction bridge formation process.

(5)補正跨橋形成工程 (5) Correction of bridge formation project

補正跨橋形成工程係針對各發熱部10,根據藉由運算工程所被求出的補正長L等資料,以電阻發熱配線12的長度縮短補正長L的部分的方式,形成1以上的補正跨橋14的工程。補正跨橋14係將電阻發熱配線12的2點間、及電阻發熱配線12的1點與供電用配線13之間之中的至少1個相連接。補正跨橋14係使用導電材料所形成,因此,藉由補正跨橋14所連接的前述區間係作電性短路。補正跨橋14係可形成複數,若配合因各補正跨橋14所致之連接區間,電阻發熱配線12的長度縮短補正長L的部分即可。 The correction bridge formation engineering system is to form a correction span of 1 or more for each heating part 10 by shortening the length of the resistance heating wire 12 by the length of the resistance heating wiring 12 based on the data such as the correction length L obtained through computational engineering. Construction of bridge 14. The correction bridge 14 connects at least one of two points between the resistance heating wire 12 and one point between the resistance heating wire 12 and the power supply wiring 13. The correction bridge 14 is formed using a conductive material. Therefore, the aforementioned section connected by the correction bridge 14 is electrically short-circuited. The correction span bridge 14 can form a complex number. If the connection interval caused by each correction span bridge 14 is matched, the length of the resistance heating wiring 12 can be shortened by the length of the correction length L.

設置補正跨橋14的部位並未特別限定。例如圖4(a)所示,至少1個補正跨橋141係可以將電阻發熱配線12的1點與供電用配線13b之間相連結的方式而設。此外,如該圖(b)所示,至少1個補正跨橋143係可以將電阻發熱配線12的線間相連結的方式而設。此外,如該圖(c)所示,至少1個補正跨橋144係可以在電阻發熱配線12的線上相重疊的方式而設。此外,如該圖(d)所示,至少2個補正跨橋142係可以將由電阻發熱配線12的各端為相同長度的點、及各端側的供電用配線(13a、13b)分別相連結的方式而設。 The location where the correction bridge 14 is provided is not particularly limited. For example, as shown in FIG. 4 (a), at least one correction bridge 141 may be provided so as to connect one point of the resistance heating wiring 12 and the power supply wiring 13 b. In addition, as shown in the figure (b), at least one correction bridge 143 can be provided so as to connect the lines of the resistance heating wiring 12. In addition, as shown in the figure (c), at least one correction bridge 144 may be provided so as to overlap on the line of the resistance heating wire 12. In addition, as shown in the figure (d), at least two correction bridges 142 can connect the points having the same length at each end of the resistance heating wire 12 and the power supply wirings (13a, 13b) on each end side. By the way.

如圖16(c)所示,在形成有電阻發熱配線12及供電用配線13的基體11上,按每個發熱部10在前述所被設定的部位形成補正跨橋14。所使用的導電材料係以使用銀等的導電性糊膏為佳。將該導電材料,以積層在電阻發熱配線12及供電用配線13上的方式進行印刷、燒成,藉此設置補正跨橋14。 As shown in FIG. 16 (c), on the base 11 on which the resistance heating wiring 12 and the power supply wiring 13 are formed, a correction bridge 14 is formed in each of the heating portions 10 at the positions set as described above. The conductive material used is preferably a conductive paste such as silver. This conductive material is printed and fired so as to be laminated on the resistance heating wiring 12 and the power supply wiring 13, thereby providing a correction bridge 14.

(6)供電用跨橋形成工程 (6) Cross-bridge formation project for power supply

在供電用跨橋形成工程中,形成藉由導電材料,將各發熱部10的其中一方供電用配線13a彼此及另一方供電用配線13b彼此相連接的供電用跨橋15。 In the power supply bridge forming process, a power supply bridge 15 is formed in which one of the power supply wirings 13 a and the other power supply wiring 13 b of each of the heat generating portions 10 are connected to each other by a conductive material.

如圖16(d)所示,在形成有電阻發熱配線12、供電用配線13、及補正跨橋14的基體11上,形成供電用跨橋15。所使用的導電材料較佳為使用銀等的導電性糊膏。將 該導電材料,以積層在形成有電阻發熱配線12、供電用配線13及補正跨橋14的基體11上的方式進行印刷,且進行燒成,藉此設置供電用跨橋15。 As shown in FIG. 16 (d), a power-supply bridge 15 is formed on the base 11 on which the resistance heating wiring 12, the power-supply wiring 13, and the correction bridge 14 are formed. The conductive material used is preferably a conductive paste such as silver. will This conductive material is printed on the base body 11 on which the resistance heating wiring 12, the power supply wiring 13, and the correction bridge 14 are formed, and is fired to provide a power supply bridge 15.

其中,供電用跨橋15亦可與補正跨橋14同時形成。 Among them, the power supply bridge 15 may be formed simultaneously with the correction bridge 14.

如圖8所示,加熱器1係有以在與被加熱物2相對面的狀態下,使被加熱物2及本加熱器1之中的至少一者朝預定的掃描方向D掃描而將被加熱物2加熱的方式被使用的情形。在如上所示之加熱器1中,各發熱部10係以朝與掃描方向D呈正交方向排列配設為佳。接著,藉由電阻發熱配線形成工程,在各發熱部10中,電阻發熱配線12係可形成為具備有相對於前述正交方向,以預定範圍內的角度θ而設的複數主圖案部。 As shown in FIG. 8, the heater 1 is configured to scan at least one of the heated object 2 and the heater 1 in a predetermined scanning direction D in a state facing the heated object 2 to be heated. When the heating means 2 is used. In the heater 1 as described above, each of the heat generating portions 10 is preferably arranged in a direction orthogonal to the scanning direction D. Next, through the resistance heating wiring formation process, in each heating portion 10, the resistance heating wiring 12 can be formed to include a plurality of main pattern portions provided at an angle θ within a predetermined range with respect to the aforementioned orthogonal direction.

此外,如上所述所使用的加熱器1較佳為將基體11的掃描方向D的剖面形狀,形成為以與掃描方向D呈正交的軸為中心而將在與被加熱物2的對面側呈凸狀的圓弧形狀(參照圖10、11)。接著,各發熱部10較佳為被配設在前述凸狀的面上或其相反側的面上。但是,若如上所示將加熱器1的發熱面形成為作為圓筒的一部分的曲面時,若藉由一般的印刷技術,會在電阻發熱配線12的厚度或線寬產生不均一,因此要遍及加熱器1的全體高精度地形成電阻發熱配線12會較為困難。藉由本加熱器之製造方法,在形成電阻發熱配線12之後,僅以補正其電阻值的方式設置補正跨橋14,即可遍及加熱器1的發熱面全體獲得均一的發熱特性。 In addition, the heater 1 used as described above is preferably formed so that the cross-sectional shape of the base body 11 in the scanning direction D is centered on an axis orthogonal to the scanning direction D and placed on the side opposite to the object 2 to be heated. A convex arc shape (see FIGS. 10 and 11). Next, each heat-generating part 10 is preferably disposed on the convex surface or a surface on the opposite side thereof. However, if the heating surface of the heater 1 is formed as a curved surface that is a part of a cylinder as described above, the thickness or line width of the resistance heating wiring 12 will be uneven by general printing techniques. It is difficult to form the resistance heating wiring 12 in the entire heater 1 with high accuracy. With the method of manufacturing the heater, after the resistance heating wiring 12 is formed, only the correction bridge 14 is provided to correct the resistance value, and uniform heating characteristics can be obtained throughout the heating surface of the heater 1.

〔6〕本加熱器的效果 [6] Effects of this heater

以實施例而言,藉由以上說明之製造方法,作成圖17所示之加熱器1。加熱器1的基體11為不銹鋼(SUS430)製,大小為縱20mm、橫420mm。在基體11表面係設有使用結晶化玻璃的膜厚85μm的絕緣層。在該基體11上設有縱15mm、橫315mm的發熱區域100,在發熱區域100係藉由如圖1及5所示之配線圖案,以橫向配設有20個發熱部10。 In the embodiment, the heater 1 shown in FIG. 17 is manufactured by the manufacturing method described above. The base 11 of the heater 1 is made of stainless steel (SUS430), and has a size of 20 mm in length and 420 mm in width. An insulating layer having a film thickness of 85 μm using crystallized glass was provided on the surface of the substrate 11. The base body 11 is provided with a heat generating area 100 having a length of 15 mm and a width of 315 mm. The heat generating area 100 is provided with 20 heat generating portions 10 in a horizontal direction by a wiring pattern as shown in FIGS. 1 and 5.

各發熱部10的電阻發熱配線係藉由使用未含有鉛、鎘、鎳而含有銀-鈀的糊膏,對前述圖案的配線進行印刷,以850℃進行燒成而形成。電阻發熱配線係將線寬0.8mm、厚度10μm作為基準而予以印刷。 The resistance heating wiring of each heating portion 10 is formed by printing the wiring of the aforementioned pattern using a paste containing silver-palladium without containing lead, cadmium, and nickel, and firing it at 850 ° C. The resistance heating wiring is printed with a line width of 0.8 mm and a thickness of 10 μm as a reference.

此外,各發熱部10的供電用配線係藉由在使用銀糊進行印刷後,以850℃進行燒成而形成。 In addition, the power supply wiring of each heat generating portion 10 is formed by printing using a silver paste and then firing at 850 ° C.

在形成電阻發熱配線及供電用配線之後,測定各發熱部10的電阻發熱配線的電阻值。接著,針對電阻值超過一定的值的發熱部,為了將電阻值形成為前述一定的值,圖求使電阻發熱配線實質上縮短的長度(補正長),在電阻發熱配線的兩端側,設定在與供電用配線之間設置補正跨橋的位置。補正跨橋係藉由按每個發熱部而在前述所設定的位置,使用銀糊進行印刷之後,以850℃進行燒成而形成。 After the resistance heating wiring and the power supply wiring are formed, the resistance value of the resistance heating wiring of each heating section 10 is measured. Next, for the heating part whose resistance value exceeds a certain value, in order to form the resistance value to the above-mentioned constant value, the length of the resistance heating wiring is substantially shortened (corrected length), and set at both ends of the resistance heating wiring. The position of the correction bridge is provided between the power supply wiring and the power supply wiring. The correction bridge system is formed by printing with a silver paste at the previously set position for each heating part, and firing at 850 ° C.

接著,將各發熱部的供電用配線彼此相連接 的供電用跨橋係藉由在使用銀糊進行印刷後,以850℃進行燒成所形成。 Next, the power supply wirings of the heating sections are connected to each other. The bridge system for power supply is formed by printing at 850 ° C after printing with silver paste.

在以上工程之後,設置以覆蓋基體上的配線部全體的方式使用結晶化玻璃的保護層、及另外使用非晶質玻璃的上塗層,獲得實施例的加熱器1。 After the above processes, a protective layer using crystallized glass to cover the entire wiring portion on the substrate and an overcoat layer using amorphous glass were provided to obtain the heater 1 of the example.

此外,形成為比較例的加熱器係除了未設有前述補正跨橋以外,藉由與上述相同的製造工程所作成。 In addition, the heater formed as a comparative example was manufactured by the same manufacturing process as above except that the above-mentioned correction bridge was not provided.

在圖18中,針對(a)實施例的加熱器1(供給電壓約30V)、(b)比較例的加熱器(供給電壓約28V),顯示發熱區域100的溫度實測值。圖表的縱軸為溫度,橫軸x係對應圖17所示之發熱區域的橫向位置。 In FIG. 18, (a) the heater 1 of the example (supply voltage: about 30 V), and (b) the heater of the comparative example (supply voltage: about 28 V). The vertical axis of the graph is temperature, and the horizontal axis x corresponds to the lateral position of the heat generating region shown in FIG. 17.

比較例的加熱器並未進行電阻值的補正,因此如該圖(b)所示,發熱區域100的橫向的溫度分布改變。相對於此,在實施例的加熱器1中係設有補正各發熱部10的電阻值的補正跨橋,因此由該圖(a)可知,發熱區域100的橫向溫度分布被均一化。 The heater of the comparative example does not correct the resistance value, and therefore, as shown in (b) of this figure, the temperature distribution in the lateral direction of the heat generating region 100 changes. On the other hand, the heater 1 of the embodiment is provided with a correction bridge that corrects the resistance value of each heating portion 10. Therefore, it can be seen from the figure (a) that the lateral temperature distribution of the heating region 100 is uniformized.

其中,在本發明中,並非侷限於上述具體實施形態所示者,可形成為按照目的、用途,在本發明之範圍內作各種變更的實施形態。 However, the present invention is not limited to those shown in the specific embodiments described above, and various modifications can be made within the scope of the present invention in accordance with the purpose and application.

Claims (13)

一種加熱器,其係具備有被配設在基體上的複數發熱部的加熱器,其特徵為:具備有:2個供電用配線,其係按每個前述發熱部予以分離而且相互分離而設之由導電材料所成;1個電阻發熱配線,其係在各前述發熱部中,具有:複數主圖案部、及將各前述主圖案部作串聯連接的連接圖案部,以使用電阻發熱材料,將各前述供電用配線相連的方式予以配線;1以上的補正跨橋,其係針對各前述發熱部,若在前述配線後被測定出的前述電阻發熱配線的兩端間的電阻值超出預定範圍時,藉由導電材料,將前述電阻發熱配線的1點與前述供電用配線之間相連接;及供電用跨橋,其係藉由導電材料,將各前述發熱部的其中一方之前述供電用配線彼此相連接,並且藉由導電材料,將另一方之前述供電用配線彼此相連接。A heater comprising a plurality of heat generating portions arranged on a base body, the heater comprising: two power supply wirings, which are provided for each of the heat generating portions and separated from each other. It is made of a conductive material; a resistance heating wire is provided in each of the foregoing heating portions, and includes a plurality of main pattern portions and a connection pattern portion in which each of the main pattern portions is connected in series to use a resistance heating material, Connect each of the aforementioned power supply wirings in a manner of being connected; 1 or more of the correction span bridge is for each of the aforementioned heating portions, and if the resistance value between the two ends of the aforementioned resistance heating wiring measured after the aforementioned wiring exceeds a predetermined range At that time, one point of the resistance heating wiring and the power supply wiring are connected by a conductive material; and a power supply bridge is a conductive material that connects one of the heating portions to the power supply by a conductive material. The wirings are connected to each other, and the other aforementioned power supply wirings are connected to each other through a conductive material. 如申請專利範圍第1項之加熱器,其中,至少2個前述補正跨橋係將由前述電阻發熱配線的各端為相同長度的點、及各端側的前述供電用配線分別相連接。For example, in the heater of the first scope of the patent application, at least two of the aforementioned correction span bridge systems are connected to each other by a point having the same length at each end of the resistance heating wiring and the power supply wiring at each end side. 如申請專利範圍第1項或第2項之加熱器,其中,為在與被加熱物相對面的狀態下,使前述被加熱物及本加熱器之中的至少一方朝預定的掃描方向掃描,而將前述被加熱物加熱的加熱器,各前述發熱部係以與前述掃描方向呈正交方向排列配設,在各前述發熱部中,前述電阻發熱配線係具備有相對於前述正交方向,以預定範圍內的角度而設的複數主圖案部。For example, if the heater of the first or the second item of the patent application scope is to scan at least one of the object to be heated and the heater in a predetermined scanning direction in a state facing the object to be heated, In the heater for heating the object to be heated, each of the heat generating sections is arranged in a direction orthogonal to the scanning direction. In each of the heat generating sections, the resistance heating wiring is provided with respect to the orthogonal direction. A plurality of main pattern portions provided at angles within a predetermined range. 如申請專利範圍第3項之加熱器,其中,前述基體之沿著前述掃描方向的剖面形狀係以與前述掃描方向呈正交的軸為中心而在與前述被加熱物的對面側呈凸狀的圓弧形狀,各前述發熱部係被配設在前述凸狀的面上或其相反側的面上。For example, the heater of claim 3, wherein the cross-sectional shape of the substrate along the scanning direction is centered on an axis orthogonal to the scanning direction, and is convex on the side opposite to the object to be heated. Each of the heating portions is arranged on the convex surface or a surface opposite to the convex surface. 如申請專利範圍第1項或第2項之加熱器,其中,前述電阻發熱材料係電阻值取決於溫度而改變的導電材料,前述補正跨橋及前述供電用跨橋所使用的導電材料係導電性糊膏。For example, the heater of the first or second item of the patent application scope, wherein the aforementioned resistance heating material is a conductive material whose resistance value changes depending on the temperature, and the conductive material used for the aforementioned correction bridge and the aforementioned power supply bridge is electrically conductive. Sexual paste. 一種定著裝置,其特徵為:具備有如申請專利範圍第1項或第2項之加熱器。A fixing device is characterized in that it is provided with a heater as in item 1 or item 2 of the scope of patent application. 一種畫像形成裝置,其特徵為:具備有如申請專利範圍第1項或第2項之加熱器。A device for forming an image, which is characterized by being provided with a heater such as the first or second item in the scope of patent application. 一種加熱裝置,其特徵為:具備有如申請專利範圍第1項或第2項之加熱器。A heating device is characterized in that it is provided with a heater such as item 1 or item 2 of the scope of patent application. 一種加熱器之製造方法,其係具備有被配設在基體上的複數發熱部的加熱器之製造方法,其特徵為:具備有:供電用配線形成工程,其係使用導電材料,形成按每個前述發熱部予以分離而且相互分離的2個供電用配線;電阻發熱配線形成工程,其係以在各前述發熱部中,具有:複數主圖案部、及將各前述主圖案部作串聯連接的連接圖案部,使用電阻發熱材料,將各前述供電用配線相連的方式形成1個電阻發熱配線;測定工程,其係在形成前述供電用配線及前述電阻發熱配線之後,藉由電阻值測定手段,針對各前述發熱部,測定各前述供電用配線間的電阻值;運算工程,其係藉由運算手段,針對各前述發熱部,將藉由前述測定工程所被測定到的前述電阻值與預定範圍進行比較,若前述電阻值超過前述預定範圍時,求出為了將該電阻值補正為前述預定範圍而將該電阻發熱配線實質上縮短的長度作為補正長;補正跨橋形成工程,其係以將前述電阻發熱配線的長度縮短前述補正長的部分的方式,形成藉由導電材料,將前述電阻發熱配線的1點與前述供電用配線之間相連接的1以上的補正跨橋;及供電用跨橋形成工程,其係形成藉由導電材料,將各前述發熱部的其中一方前述供電用配線彼此相連接,並且藉由導電材料,將另一方前述供電用配線彼此相連接的供電用跨橋。A manufacturing method of a heater, which is a manufacturing method of a heater having a plurality of heat generating portions arranged on a base, and is characterized in that it includes: a wiring forming process for power supply, which uses a conductive material, Two heating wires for power supply which are separated from each other and separated from each other; a resistance heating wiring forming process, wherein each of the heating sections includes a plurality of main pattern sections, and each of the main pattern sections is connected in series; The connection pattern part uses resistance heating materials to form a resistance heating wiring by connecting the power supply wirings. The measurement process is after forming the power supply wiring and the resistance heating wiring, and then using resistance measurement methods, For each of the heat-generating parts, the resistance value between the power-supply wirings is measured. For the calculation process, for each of the heat-generating parts, the resistance value and the predetermined range measured by the measurement process are calculated for the heat-generating parts. For comparison, if the resistance value exceeds the predetermined range, determine whether to correct the resistance value to the predetermined range. The substantially shortened length of the resistance heating wiring is used as a correction length. The correction bridge forming process is to shorten the length of the resistance heating wiring by a portion of the correction length, and form a conductive material to heat the resistance. One or more correction bridges connected between one point of the wiring and the power supply wiring; and a power supply bridge formation process that forms one of the power supply wirings of one of the heat generating sections with each other by using a conductive material. A power supply bridge that is connected to each other and connects the other power supply wirings to each other through a conductive material. 如申請專利範圍第9項之加熱器之製造方法,其中,藉由前述補正跨橋形成工程,至少2個前述補正跨橋係以將由前述電阻發熱配線的各端為相同長度的點、及各端側的前述供電用配線分別相連接的方式形成。For example, the method for manufacturing a heater in the ninth scope of the patent application, in which, by the aforementioned bridge forming process for correction, at least two points of the correction bridge are formed so that each end of the heating wire heated by the resistor is a point of the same length, and each The end-side power supply wirings are formed so as to be connected to each other. 如申請專利範圍第9項或第10項之加熱器之製造方法,其中,為在與被加熱物相對面的狀態下,使前述被加熱物及本加熱器之中的至少一方朝預定的掃描方向掃描,將前述被加熱物加熱之加熱器之製造方法,各前述發熱部係以與前述掃描方向呈正交方向排列配設,藉由前述電阻發熱配線形成工程,在各前述發熱部中,前述電阻發熱配線係具備有相對於前述正交方向,以預定範圍內的角度而設的複數主圖案部而形成。For example, in the method for manufacturing a heater in the ninth or tenth of the scope of application for a patent, in a state in which the object to be heated faces the object, at least one of the object to be heated and the heater is scanned toward a predetermined scan. Directional scanning, a method of manufacturing a heater for heating the object to be heated, each of the heating parts is arranged in a direction orthogonal to the scanning direction, and through the resistance heating wiring forming process, in each of the heating parts, The resistance heating wiring is formed by including a plurality of main pattern portions provided at an angle within a predetermined range with respect to the orthogonal direction. 如申請專利範圍第11項之加熱器之製造方法,其中,前述基體之沿著前述掃描方向的剖面形狀係以與前述掃描方向呈正交的軸為中心而在與前述被加熱物的對面側呈凸狀的圓弧形狀,各前述發熱部係被配設在前述凸狀的面上或其相反側的面上。For example, the method for manufacturing a heater according to item 11 of the patent application, wherein the cross-sectional shape of the substrate along the scanning direction is centered on an axis orthogonal to the scanning direction and on the side opposite to the object to be heated. Each of the heat generating portions has a convex arc shape and is disposed on the convex surface or a surface on the opposite side thereof. 如申請專利範圍第9項或第10項之加熱器之製造方法,其中,前述電阻發熱材料係電阻值取決於溫度而改變的導電材料,前述補正跨橋及前述供電用跨橋所使用的導電材料係導電性糊膏。For example, the method for manufacturing a heater of the 9th or 10th in the scope of patent application, wherein the aforementioned resistance heating material is a conductive material whose resistance value changes depending on the temperature, and the conduction used in the aforementioned correction bridge and the aforementioned power supply bridge The material is a conductive paste.
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Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016062024A (en) * 2014-09-19 2016-04-25 キヤノン株式会社 Heater and fixing device
WO2017090692A1 (en) * 2015-11-27 2017-06-01 株式会社美鈴工業 Heater, fixing device, image-forming device, and heating device
DE102016211081A1 (en) * 2016-06-21 2017-12-21 E.G.O. Elektro-Gerätebau GmbH Method for producing a heating device and heating device
JP6666809B2 (en) 2016-08-08 2020-03-18 新光電気工業株式会社 Substrate fixing device and method of manufacturing the same
CN110494970B (en) * 2017-04-10 2023-03-07 日本特殊陶业株式会社 Holding device
CN109407490B (en) * 2017-08-18 2022-03-29 京瓷办公信息系统株式会社 Heater, fixing device, and image forming apparatus
ES2920133T3 (en) * 2018-02-05 2022-08-01 Ngk Spark Plug Co ceramic heater
WO2020022520A1 (en) * 2018-07-27 2020-01-30 株式会社ニフコ Planar heat generating body and vehicle windshield device
US11143991B2 (en) * 2019-08-08 2021-10-12 Ricoh Company, Ltd. Image forming apparatus including a cooler and a heater
US11163264B2 (en) 2019-08-08 2021-11-02 Ricoh Company, Ltd. Image forming apparatus
JP2021131475A (en) * 2020-02-20 2021-09-09 株式会社リコー Heater member, heating device, fixing device, and image forming apparatus
JP2022109781A (en) * 2021-01-15 2022-07-28 東芝ライテック株式会社 Heater, and image forming apparatus

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09161959A (en) * 1995-12-12 1997-06-20 Matsushita Electric Ind Co Ltd Planar heating body
JP2001313154A (en) * 2000-04-28 2001-11-09 Misuzu Kogyo:Kk Method of adjusting electric resistance, heater and its manufacturing method
JP2002031972A (en) * 2000-05-10 2002-01-31 Sumitomo Electric Ind Ltd Ceramic heater for toner fixing device and method for manufacturing the same
WO2013073276A1 (en) * 2011-11-15 2013-05-23 株式会社美鈴工業 Heater, and fixing device and drying device provided with same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2783682Y (en) * 2005-04-15 2006-05-24 深圳市振华微电子有限公司 Ceramic PTC electric heating element capable of reparing and adjusting
JP5447933B2 (en) * 2009-07-28 2014-03-19 東芝ライテック株式会社 Ceramic heater, heating device, image forming device
CN201805562U (en) * 2010-07-16 2011-04-20 杨旭光 Thick film heater
CN104380838B (en) * 2012-08-31 2016-06-22 株式会社美铃工业 Heater and possess the fixing device of this heater, image processing system and heater

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09161959A (en) * 1995-12-12 1997-06-20 Matsushita Electric Ind Co Ltd Planar heating body
JP2001313154A (en) * 2000-04-28 2001-11-09 Misuzu Kogyo:Kk Method of adjusting electric resistance, heater and its manufacturing method
JP2002031972A (en) * 2000-05-10 2002-01-31 Sumitomo Electric Ind Ltd Ceramic heater for toner fixing device and method for manufacturing the same
WO2013073276A1 (en) * 2011-11-15 2013-05-23 株式会社美鈴工業 Heater, and fixing device and drying device provided with same

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