JP6530088B2 - Heater, fixing device including the same, image forming apparatus and heating device - Google Patents

Description

  The present invention relates to a heater, a fixing device including the same, an image forming apparatus, and a heating device. More particularly, the present invention relates to a heater excellent in temperature uniformity, a fixing device including the same, an image forming apparatus, and a heating device.

  As a heating means for performing heat treatment of an object, there is known a heater which is used for a thinly formed substrate and on one surface of which a heat generating layer for generating electric current and heat is provided. Such a heater can be formed compactly, and for example, it is incorporated in a copying machine, a printer, etc. and used for the purpose of fixing toner, ink, etc. on a recording medium, or incorporated in a drier to be processed such as panels. It is used for the purpose of heating and drying the body uniformly. Such a heater is disclosed in Patent Document 1 below.

International Publication No. 2013/073276 brochure

  With such a heater, by using a thinly formed substrate, it is possible to obtain quick rising characteristics while saving power. On the other hand, when a thinly formed substrate is used, there is a problem that, for example, the heat unevenness caused by the pattern shape and the like of the heat generating layer provided on the one surface tends to appear on the heating surface. Furthermore, in recent years, a heater that is more compact than in the past is required, and in particular, a heater that is narrower in the sweep direction is desired. Such narrowing in the sweep direction leads to more remarkable reflection of the heat unevenness caused by the pattern of the heat generating layer on the heating surface, and a countermeasure therefor is required.

  The present invention has been made in view of the above problems, and it is difficult for heat unevenness caused by the heat generating layer to be reflected on the heating surface, and a heater excellent in heat uniformity, a fixing device including the same, an image forming apparatus and heating It aims at providing an apparatus.

The present invention is as follows.
The heater according to claim 1 is a heater which sweeps at least one of the heating target and the main heater to heat the heating target while facing the heating target.
A thin plate-like substrate made of metal,
A heat generating layer disposed on one side of the substrate;
A heat equalizing layer which is disposed on at least one of the layer between the base and the heat generating layer, and the other side of the base and which is formed of a material having a thermal conductivity higher than that of the material constituting the base ,
An insulating layer comprising a glass glaze layer formed between the heat generating layer and the substrate or the heat equalizing layer;
A glass glaze layer formed on the front side and the back side of the substrate ,
The heat equalizing layer has a metal porous portion in which metal particles are formed in a row, and a nonmetal portion disposed in a gap between the metal porous portions, and the nonmetal portion is formed of a glass component. As the abstract.
According to a second aspect of the present invention, in the heater according to the first aspect, the heat equalizing layer has a direct-stacking heat equalizing layer directly stacked on the substrate.
The heater according to claim 3 is, in the heater according to claim 1 or 2 , further comprising an indirect laminated type heat equalizing layer laminated as a heat equalizing layer between the substrate and the substrate via a glass glaze layer. Make it a gist.
The heater according to claim 4 is the heater according to any one of claims 1 to 3 , wherein the heat spreader has a cutout including a notch or a through hole penetrating to the front and back. ,
A gist is that a layer adjacent to one surface side of the heat spreader layer and a layer adjacent to the other surface side of the heat spreader layer are joined via the missing portion.
The heater according to claim 5 is a heater which sweeps at least one of the heating target and the main heater to heat the heating target while facing the heating target.
A thin plate-like substrate made of metal,
A heat generating layer disposed on one side of the substrate;
A heat equalizing layer which is disposed on at least one of the layer between the base and the heat generating layer, and the other side of the base and which is formed of a material having a thermal conductivity higher than that of the material constituting the base ,
An insulating layer comprising a glass glaze layer formed between the heat generating layer and the substrate or the heat equalizing layer;
A glass glaze layer formed on the front side and the back side of the substrate,
The gist of the invention is that the heat equalizing layer has an indirectly laminated heat equalizing layer laminated via the glass glaze layer with the substrate.
The heater according to claim 6 is the heater according to claim 5, wherein the heat equalizing layer includes a metal porous portion formed by connecting metal particles in a row, and a non-metal portion disposed in a gap between the metal porous portions. And the non-metal part is formed of a glass component.
A heater according to claim 7 is characterized in that, in the heater according to claim 5 or 6, as the heat equalizing layer, the heat equalizing layer of direct lamination type directly laminated on the substrate is provided.
The heater according to any one of claims 5 to 7, wherein the heat spreader layer has a cutout including a notch or a through hole penetrating from the front to the back. And
A gist is that a layer adjacent to one surface side of the heat spreader layer and a layer adjacent to the other surface side of the heat spreader layer are joined via the missing portion.
The heater according to claim 9 is a heater which sweeps at least one of the heating target and the main heater to heat the heating target while facing the heating target.
A thin plate-like substrate made of metal,
A heat generating layer disposed on one side of the substrate;
A heat equalizing layer which is disposed on at least one of the layer between the base and the heat generating layer, and the other side of the base and which is formed of a material having a thermal conductivity higher than that of the material constituting the base ,
An insulating layer comprising a glass glaze layer formed between the heat generating layer and the substrate or the heat equalizing layer;
A glass glaze layer formed on the front side and the back side of the substrate,
The heat equalizing layer has a notch including a notch or a through hole penetrating from the front to the back;
The layer adjacent to the one surface side of the heat equalizing layer and the layer adjacent to the other surface side of the heat equalizing layer are joined via the missing portion.
The heater according to claim 10 is the heater according to claim 9, wherein the heat equalizing layer is a metal porous portion formed by connecting metal particles in a row, and a non-metal portion disposed in a gap between the metal porous portions. And the non-metal portion is formed of a glass component.
The heater according to claim 11 is a heater according to claim 9 or 10, characterized in that the heat equalizing layer has a direct-stacking heat equalizing layer directly stacked on the substrate.
The heater according to claim 12 is a heater according to any one of claims 9 to 11, in which an indirect lamination type is laminated as the heat equalizing layer via a glass glaze layer with the substrate. It has a gist to have a heat equalizing layer.
The heater according to claim 13 is the heater according to any one of claims 1 to 12 , wherein the plurality of heat generating layers are arranged in a direction perpendicular to the sweep direction and electrically connected in parallel. Equipped with a resistive heating cell,
In each of the resistance heating cells, a plurality of horizontal wiring portions disposed substantially perpendicular to the sweep direction and vertical wiring portions connecting the horizontal wiring portions are connected to form a serpentine resistance. Has a heating wire,
A gist is to have a non-formed portion where the resistive heating wire is not formed between the resistive heating cells adjacent to each other.
The heater according to claim 14 is the heater according to any one of claims 1 to 13 , wherein the heat spreader layer has a thickness of 3 μm to 60 μm.
A fixing device according to a fifteenth aspect of the present invention is provided with the heater according to any one of the first to fourteenth aspects.
An image forming apparatus according to a sixteenth aspect of the present invention includes the heater according to any one of the first to fourteenth aspects.
The gist of the heating device according to claim 17 includes the heater according to any one of claims 1 to 14 .
For reference, the present specification includes the following description regarding the heater, the fixing device, the image forming apparatus, and the heating device.
[1] A heater which sweeps at least one of the object to be heated and the main heater to heat the object to be heated while facing the object to be heated,
A substrate,
A heat generating layer disposed on one side of the substrate;
A heat equalizing layer which is disposed on at least one of the layer between the base and the heat generating layer, and the other side of the base and which is formed of a material having a thermal conductivity higher than that of the material constituting the base And a heater.
[2] The heater according to the above [1], which has a direct lamination type heat equalizing layer laminated directly on the substrate as the heat equalizing layer.
[3] The heater according to the above [1] or [2], which has an indirect laminated type heat equalizing layer laminated as a heat equalizing layer between the substrate and a glass glaze layer.
[4] The heat spreader has a cutout including a notch or a through hole penetrating to the front and back,
Any of the above [1] to [3] in which a layer adjacent to one surface side of the heat spreader layer and a layer adjacent to the other surface side of the heat spreader layer are joined via the missing portion Heater described in.
[5] The heat equalizing layer according to the above [1] to [4], which includes a metal porous portion formed by connecting a plurality of metal particles and a non-metal portion disposed in a gap between the metal porous portions. The heater according to any of the above.
[6] The heat generating layer includes a plurality of resistance heat generating cells electrically connected in parallel,
In each of the resistance heating cells, a plurality of horizontal wiring portions disposed substantially perpendicular to the sweep direction and vertical wiring portions connecting the horizontal wiring portions are connected to form a serpentine resistance. Has a heating wire,
The heater according to any one of the above [1] to [5], which has a non-formation portion in which the resistance heating wire is not formed between the resistance heating cells adjacent to each other.
[7] A fixing device comprising the heater according to any one of the above [1] to [6].
[8] An image forming apparatus comprising the heater according to any one of the above [1] to [6].
[9] A heating apparatus comprising the heater according to any one of the above [1] to [6].

According to the heater of the present invention, the unevenness of heat caused by the heat generating layer is not easily reflected on the heating surface, and the heater can be made excellent in heat uniformity.
When the heat equalizing layer has a direct laminated heat equalizing layer laminated directly on the substrate, better heat uniformity can be obtained as compared with the case where the heat equalizing layer is not provided.
In the case of having an indirect laminated type soaking layer laminated via a glass glaze layer with a substrate as the soaking layer, better heat uniformity is obtained compared to the case where this soaking layer is not provided. be able to.

It is a typical sectional view showing an example (example 1) of a form of this heater. It is a typical sectional view showing other examples (example 2) of a form of this heater. It is a typical sectional view showing other examples (example 3) of a form of this heater. It is a typical sectional view showing other examples (example 4) of a form of this heater. It is a typical sectional view showing other examples (example 7) of a form of this heater. It is a typical sectional view showing other examples (example 8) of a form of this heater. It is a typical sectional view showing other examples of a form of this heater. It is a schematic plan view which illustrates the correlation with the exothermic layer and soaking layer in this heater. It is an explanatory view explaining a missing part of an example of a heat spreader in this heater. FIG. 2 is a schematic perspective view illustrating an example of a fixing device using the present heater. FIG. 14 is a schematic perspective view illustrating another example of a fixing device using the present heater. It is a schematic diagram showing an example of the image formation device which uses this heater. It is a graph which shows the soaking effect by the heater which concerns on Examples 1-4. It is a graph which shows the soaking effect by the heater which concerns on Examples 5-9. It is a typical sectional view showing the conventional heater (comparative example 1). It is explanatory drawing which shows typically the metal porous part and the nonmetal part in a soaking layer. It is explanatory drawing which shows the variation of the planar shape of a soaking layer. It is a graph which shows the soaking effect by the heater which concerns on Examples 5-14.

Hereinafter, the present invention will be described in detail with reference to the drawings.
[1] Heater The main heater (1) is a heater which sweeps at least one of the object to be heated and the main heater (1) to heat the object in a state of facing the object to be heated.
Further, the heater (1) comprises a substrate (11), a heat generating layer (12) disposed on one side (11a) of the substrate (11), an interlayer between the substrate (11) and the heat generating layer (12), And a heat equalizing layer (13) disposed on at least one of the other surfaces (11b) of the base and formed of a material having a thermal conductivity higher than that of the material constituting the base (FIG. 1) ~ See Figure 4).

<1> Substrate The above-mentioned "substrate (11)" is a substrate for indicating a heat generating layer. The substrate 11 is generally in the form of a thin plate, and the main surfaces on the front and back sides are herein referred to as one surface (11a) and the other surface (11b). That is, the one surface 11a and the other surface 11b are opposite to each other.
The material which comprises the base | substrate 11 is not specifically limited, What is necessary is just to be able to heat-generate a heat-generating layer on the surface, and it is not specifically limited. For example, metals, ceramics, composite materials of these, and the like can be used. In the case of using a conductive material such as metal, the base can be configured by providing an insulating layer on the conductive material.

Among the materials constituting the substrate, examples of the metal include steel. Among them, stainless steel can be preferably used in the present invention. The type of stainless steel is not particularly limited, and ferritic stainless steel and austenitic stainless steel are preferable. Further, among these stainless steels, a type excellent in heat resistance and oxidation resistance is particularly preferable. For example, SUS430, SUS436, SUS444, SUS316L and the like can be mentioned. These may use only 1 type and may use 2 or more types together.
Furthermore, aluminum, magnesium, copper and alloys of these metals can be used as the metal constituting the substrate. These may be used alone or in combination of two or more. Among them, aluminum, magnesium, and their alloys (aluminum alloy, magnesium alloy, Al-Mg alloy, etc.) have small specific gravities, and by adopting these, it is possible to reduce the weight of the heater. Moreover, since copper and its alloy are excellent in thermal conductivity, the adoption of these makes it possible to improve the thermal uniformity of the present heater.

  Among the materials constituting the substrate, as the ceramics, aluminum oxide, aluminum nitride, zirconia, silica, mullite, spinel, cordierite, silicon nitride and the like can be mentioned. These may use only 1 type and may use 2 or more types together. Among these, aluminum oxide and aluminum nitride are preferable. Moreover, as a composite material of a metal and a ceramic, SiC / C, SiC / Al, etc. may be mentioned. These may use only 1 type and may use 2 or more types together.

The dimensions and shape of the substrate 11 are not particularly limited, but the thickness can be 50 μm or more and 700 μm or less. Within this range, it is possible to obtain early rising characteristics, particularly while saving power. The thickness is further preferably 100 μm to 600 μm, more preferably 150 μm to 500 μm, still more preferably 180 μm to 450 μm, and particularly preferably 200 μm to 400 μm.
Further, the shape of the substrate is preferably a shape in which the length in the width direction (D ₂ ) is longer than the length in the sweep direction (D ₁ ). This makes it easy to obtain the effects of the configuration of the present invention. Specifically, for example, assuming that the length in the sweep direction (D ₁ ) of the substrate is L _D1 and the length in the width direction (D ₂ ) of the substrate is L _D2 , the ratio of lengths (L _D1 / L _D2 ) can be 0.001 or more and 0.25 or less. The ratio is further preferably 0.005 or more and 0.2 or less, and more preferably 0.01 or more and 0.15 or less.

<2> Heat Generation Layer The above-mentioned “heat generation layer (12)” is a layer that generates heat by energization, and is disposed on one surface 11 a side of the base 11. The heat generating layer 12 is usually disposed only on the side of the one surface 11 a of the base 11, but may be provided on the other surface 11 b side.
The specific shape or the like of the heat generating layer 12 is not particularly limited. For example, the entire surface may be a heat generating sheet having a uniform thickness, or a resistive heat generating wiring having a series of predetermined pattern shapes. In the present invention, it is more preferable to be a resistance heating wiring provided with a plurality of resistance heating cells electrically connected in parallel than the heating layer of the above-described embodiment.
More specifically, each resistance heating cell is a vertical wiring portion connecting between a plurality of horizontal wiring portions (122) disposed substantially perpendicular to the sweep direction (D ₁ ) and the horizontal wiring portion (122). It is preferable that (123) and (123) be a resistance heating wire (121) formed in a zigzag shape by bonding (see FIG. 8).

In the case of the resistance heating wire 121 patterned in such a zigzag shape, the horizontal wiring portion 122 may be shorter than the vertical wiring portion 123, but it is preferable that the horizontal wiring portion 122 is longer than the vertical wiring portion 123. This makes it easy to obtain the effects of the configuration of the present invention. That is, in the case of a plurality of resistance heating cells electrically connected in parallel, heat may fall between the resistance heating cells, and it is useful to be able to equalize heat. Similarly, also in the case where the vertical wiring portion 123 is disposed along the sweep direction (D ₁ ), the heat integration by the vertical wiring portion 123 tends to be large, and it is useful that heat equalization can be performed.
From such a point of view, in the case where the vertical wiring portion 123 is provided, the vertical wiring 123 is preferably inclined with respect to the sweep direction (D ₁ ). By the inclination, the heat integration by one vertical wiring portion 123 can be diffused, and the soaking effect can be obtained. Specifically, assuming that the case where the sensor is disposed at 0 degree with respect to the sweep direction (D ₁ ) is not inclined, in the case where it is inclined, −80 degrees or more with respect to the sweep direction (D ₁ ) It can be in the range of degrees or less, preferably -60 degrees or more and 60 degrees or less, and more preferably -50 degrees or more and 50 degrees or less.

  In the resistance heating wiring including the plurality of resistance heating cells 124 electrically connected in parallel, the resistance heating wiring is provided between the adjacent resistance heating cells 124 due to the drop of heat between the above-described resistance heating cells. This is noticeable when there is a non-formed portion 125 (in particular, a non-formed portion intersecting with the sweep direction). In the resistance heating wiring having such a non-formed portion 125, it is possible to more effectively obtain the soaking action by providing the soaking layer 13. As a form of the resistance heating cell 124 (resistance heating wiring 121), and a form of the non-formation part 125, Fig.8 (a)-(d) is illustrated.

  Moreover, the resistance heat-generating material which comprises a heat-generating layer should just be a material which can generate heat according to the resistance value by electricity supply, and the kind in particular is not limited. For example, silver, copper, gold, platinum, palladium, rhodium, tungsten, molybdenum, rhenium (Re) and ruthenium (Ru) can be used. These may use only 1 type and may use 2 or more types together. When using 2 or more types together, it can be an alloy. More specifically, silver-palladium alloy, silver-platinum alloy, platinum-rhodium alloy, silver-ruthenium, silver, copper, gold and the like can be used.

  In addition, as described above, in the case of having the resistive heating wire provided with a plurality of resistive heating cells electrically connected in parallel, each resistive heating wire constituting each resistive heating cell has any resistance heating characteristics. Although it may be provided, it is preferable that the self-temperature balancing action (self-temperature complementing action) can be exhibited between the resistance heating cells. From that point of view, it is preferable that the resistance heating wire that constitutes the resistance heating cell be formed of a resistance heating material having a positive resistance heating coefficient. Specifically, a resistance heating material having a resistance temperature coefficient of 100 ppm / ° C. to 4400 ppm / ° C. in a temperature range of −200 ° C. to 1000 ° C. is preferable, and further a resistance of 300 ppm / ° C. to 3700 ppm / ° C. A heat generating material is more preferable, and a resistance heat generating material having 500 ppm / ° C. or more and 3000 ppm / ° C. or less is particularly preferable. Examples of such resistance heating materials include silver alloys such as silver-palladium alloys.

  As described above, when the resistance heating wire formed using the resistance heating material having a positive temperature coefficient of resistance forms a resistance heating cell and is connected in parallel, the plurality of resistance heating cells are self-aligned. It plays the role of temperature balance. That is, for example, when there is a second resistance heating cell sandwiched between the first resistance heating cell and the third resistance heating cell, the second resistance heating is generated when the temperature of the second resistance heating cell decreases. The resistance of the cell will be reduced. Then, the current flowing to the second resistance heating cell is increased and the wattage is increased, and the second resistance heating cell can autonomously act to compensate for the temperature decrease.

In the case where the respective resistance heating cells have substantially the same calorific value, the resistance heating cells may be formed so as to have substantially the same resistance value. In that case, the resistive heating cell can be formed as the same pattern of the resistive heating wiring with the same line length, the same line width, and the same thickness. The thickness of the resistance heating wiring can be, for example, 3 μm or more and 40 μm or less from the viewpoint of area specific resistance.
In addition, having substantially the same calorific value means that each resistance heating cell has substantially the same resistance temperature coefficient and resistance value under the same measurement conditions. For example, the difference in resistance temperature coefficient between resistance heating cells can be within ± 20%, and the difference in resistance value between resistance heating cells can be within ± 10%.

<3> Insulating Layer As described above, when a conductive material is used as the base 11, it is necessary to insulate between the base 11 and the heat generating layer 12. That is, the insulating layer (14) can be provided. The insulating layer 14 only needs to exhibit insulation that can insulate the base 11 formed of a conductive material and the heat generating layer 12, and the specific material, shape, and the like are not limited.
A glass glaze layer or a ceramic layer can be used as the insulating layer 14. Among these, a glass glaze layer is preferable from the viewpoint of processability. The glass constituting the glass glaze layer may be amorphous glass, crystallized glass, or semi-crystallized glass. Specific examples _include SiO ₂ -Al ₂ O 3 -MO-based glass. Here, MO is an oxide of an alkaline earth metal (MgO, CaO, BaO, SrO, etc.).
In addition, the insulating layer 14 may include, for example, only one layer between the base 11 and the heat generating layer 12 or may include two or more layers. As the case of providing two or more layers, the case of providing the insulating layer 14 of different materials can be mentioned.
Furthermore, the thickness of the insulating layer 14 is not particularly limited, but can be, for example, 10 μm or more and 400 μm or less. In particular, when the substrate 11 is formed of a conductive material (stainless steel or the like), the insulating layer 14 serves to insulate the substrate 11 from the heat generating layer 12. In this case, the thickness of the insulating layer 14 disposed between the base 11 and the heat generating layer 12 ((If two or more insulating layers 14 of different materials are interposed, the total thickness of these insulating layers 14 is 20) to 300 μm is preferable, 30 to 200 μm is more preferable, and 40 to 100 μm is particularly preferable.

For example, in FIG. 1, the insulating layer 14 disposed between the base 11 and the heat generating layer 12 is the insulating layer 141. Thus, the thickness described above can be applied to the thickness of the insulating layer 141.
On the other hand, in the use as a glass glaze layer not intended for insulation, the thickness of the glass glaze layer (the thickness of the entire glass glaze layer integrated by firing without interposing other layers) is, for example, 1 μm to 500 μm. The following can be made. The thickness is preferably 2 μm or more and 400 μm or less, more preferably 3 μm or more and 300 μm or less, and particularly preferably 4 μm or more and 200 μm or less. Specifically, for example, in FIG. 1, the glass glaze layers 142 and 143 disposed closer to the first surface 1 a of the heater than the heat generating layer 12 are glass glaze layers not intended for insulation. Further, in FIG. 1, the glass glaze layers 141, 142 and 143 disposed closer to the other surface 1 b of the heater than the heat equalizing layer 13 are glass glaze layers not intended for insulation.

<4> Soaking layer The above “heating layer (13)” is a layer disposed on at least one of the layer between the base 11 and the heat generating layer 12 and the other side 11 b of the base, It is a layer formed of a material having a thermal conductivity higher than that of the material constituting the substrate 11.
The heat equalizing layer 13 has a function of leveling the unevenness of the heat formed in the heat generating layer 12. That is, if there is a drop in the heating temperature, the temperature can be raised to the same temperature as the surroundings, and if there is a projection of the heating temperature, the temperature is lowered to the same temperature as the surroundings to cause the heat undulation. Can be leveled. In particular, when the heat generating layer 12 is formed using a resistance heating wire having a predetermined pattern shape, it is suitable for equalizing the heat unevenness caused by the pattern shape. That is, by having the pattern shape, a portion where the resistance heating wire exists and a portion where it does not exist is generated, and a portion where the resistance heating wire exists has a thermal undulation that the temperature is higher than the portion where it does not exist Be done. Such heat unevenness can be leveled by passing through the heat equalizing layer 13 to reduce the temperature difference. From such a point of view, providing the heat equalizing layer 13 is effective in a heater provided with a plurality of resistance heating cells 121 electrically connected in parallel as the heating layer 12.
Therefore, the heat equalizing layer 13 is disposed at least on at least one of the layer between the base 11 and the heat generating layer 12 and the other surface 11 b side (surface side to be in contact with the object to be heated) of the base 11. . That is, the heat generating layer 12 is disposed closer to the heating surface (the surface to be in contact with the object to be heated) than the heat generating layer 12. As a matter of course, the heat generating layer 12 can also be disposed on the side closer to the non-heating surface (the surface not in contact with the object to be heated).

The heat equalizing layer 13 may be formed of a material having a thermal conductivity larger than that of the material constituting the substrate 11. Specifically, for example, when stainless steel having a low thermal conductivity of 50 W / mK or less is used as the base 11, a material having a thermal conductivity of 100 W / mK or more is used as the material of the heat equalizing layer 13. Is preferred. Specifically, silver, copper, gold, aluminum, tungsten, nickel or the like, or an alloy containing at least one of these metals can be used as the thermally conductive metal. These heat conductive metals may be used alone or in combination of two or more. Among these, silver, copper, aluminum and an alloy containing at least one of these are preferable.
Also, for example, even when a ceramic such as alumina having a low thermal conductivity of 50 W / mK or less is used as the substrate 11, a material having a thermal conductivity of 100 W / mK or more is used as the material of the heat equalizing layer 13. It is preferred to use. Specifically, not only thermally conductive ceramics such as aluminum nitride can be used, but also various thermally conductive metals described above can be used.

  The heat equalizing layer 13 may be formed in any manner. Specifically, the heat equalizing layer 13 can be provided as a plating layer (electroless plating layer, electrolytic plating layer, composite plating layer thereof, or the like). Moreover, after the paste containing a thermally conductive material is printed, the heat equalizing layer 13 can be formed by baking the printed coating film. For example, a printing paste containing metal particles (metal powder) as a heat conductive material can be used. In this case, the printing paste may contain, in addition to the metal particles, a vehicle for forming a paste, and a glass component or ceramic component as a co-dough.

  The heat equalizing layer 13 obtained by baking such a printing paste is, for example, a metal porous portion 135a formed by connecting a plurality of metal particles as shown in FIGS. 16 (a) and 16 (b); The heat equalizing layer 13 having the nonmetal portion 135b disposed in the gap of the porous portion 135a is obtained. Further, FIG. 16 (a) shows the metal porous portion 135a in which a plurality of metal particles are in contact with each other in a row in FIG. 16, and FIG. 16 (b) shows that the plurality of metal particles are mutually fused by baking. The metal porous portion 135a connected in series is shown. In the heater 1 of the present invention, the heat equalizing layer 13 may take the form of FIG. 16 (a) or the form of FIG. 16 (b), and is a form having both of these forms in combination. Although it may be, it is preferable to have the form of FIG.16 (b). That is, it is preferable that the heat equalizing layer 13 have a metal porous portion 135a in which a plurality of metal particles are fused and connected to one another. In this form, higher heat transfer can be obtained.

On the other hand, the nonmetal portion 135b is formed of a glass component or a ceramic component (including ceramic and glass ceramic). That is, when the heat equalizing layer 13 in the heater 1 of the present invention has the nonmetal portion 135b, the nonmetal portion 135b can be made of only glass or glass and ceramic.
In the case where the metal porous portion 135a and the nonmetal portion 135b are provided, when the total thereof is 100% by mass (in particular, when the metal porous portion 135a is silver and the nonmetal portion 135b is glass), the nonmetal The proportion of the portion 135b is not particularly limited, but is preferably 0.1% by mass or more. By having such a nonmetal portion 135b, excellent thermal uniformity can be achieved while improving the bonding between the adjacent layer on the one surface side and the adjacent layer on the other surface side with the heat spreader layer 13 interposed therebetween. You can get it. In addition, it is preferable that the nonmetal portion 135b is usually 20% by mass or less. Furthermore, 0.2 mass% or more and 15 mass% or less are more preferable, and 0.5 mass% or more and 12 mass% or less are still more preferable.

As described above, the heat equalizing layer 13 may be disposed in at least one of the layer between the base 11 and the heat generating layer 12 and the other side 11 b of the base. Therefore, as the heat equalizing layer 13, for example, two forms of the direct laminated heat equalizing layer (131) of the following (1) and the indirect laminated heat equalizing layer (132) of the following (2) are available. It can be mentioned.
(1) The direct lamination type heat equalizing layer 131 is the heat equalizing layer 13 directly laminated on the substrate 11. The direct lamination type soaking layer 131 is laminated between the base 11 and the soaking layer 13 without interposing another layer such as the insulating layer 14 or the like.
(2) The indirect lamination type heat equalizing layer 132 is laminated between the substrate 11 and the heat equalizing layer 13 via another layer. Specifically, a glass glaze layer (insulation layer 14) is mentioned as another layer.
The direct lamination type heat equalizing layer 131 and the indirect lamination type heat equalizing layer 132 may have either one or both of them in one heater.

In the case of directly laminating type heat equalizing layer 131, the embodiment is provided only on one surface (11a) of substrate 11, the embodiment is provided only on the other surface (11b) of substrate 11, one surface (11a) of substrate 11 and the other surface (11 11b) may be provided. Among these, the form provided only on one side (11a) of the substrate 11 or the form provided on both sides of the one side (11a) and the other side (11b) of the base 11 is preferable.
This not directly thickness of the multilayer of the soaking layer 131 is not particularly limited, the thickness of Hitoshinetsuso (13, 131) and _{D 1,} if the thickness of the substrate 11 was set to _{D 2,} and _{D 1} the ratio _D 1 / _{D 2} and D ₂ is preferably 0.6 or less. The ratio is more preferably 0.001 or more and 0.6 or less, further preferably 0.005 or more and 0.57 or less, and still more preferably 0.008 or more and 0.53 or less, and 0.01 or more and 0.50 or less. The following are particularly preferred. More specifically, the layer thickness of the direct lamination type heat equalizing layer 131 is preferably 1 μm to 250 μm, more preferably 1 μm to 150 μm, still more preferably 2 μm to 120 μm, still more preferably 3 μm to 60 μm. 3 μm or more and 40 μm or less is particularly preferable, and 3 μm or more and 30 μm or less is particularly preferable.
Moreover, in the form provided in both surfaces among the above, each direct lamination | stacking type heat-equalizing layer 131 may be respectively the same thickness, and may be different thickness. Furthermore, they may have the same shape (pattern shape or the like) or may have different shapes.

On the other hand, in the case of including the indirect lamination type heat equalizing layer 132, the embodiment is provided only on one surface (11a) side of the substrate 11, the embodiment provided only on the other surface (11b) side of the substrate 11, one surface (11a) of the substrate 11 The form provided in the both sides by the side and the other side (11b) side is mentioned. Among these, the form provided only in one surface (11a) of the base | substrate 11 is preferable. This is because the indirect lamination type heat equalizing layer 132 is lower in heat equalizing effect to the entire heater 1 by being provided on the other surface (11b) of the base 11 as compared with the direct lamination type heat equalizing layer 131.
This indirect laminated thickness of the heat equalizing layer 132 is not particularly limited, the thickness of Hitoshinetsuso (13,132) and _{D 1,} if the thickness of the substrate 11 was set to _{D 2,} and _{D 1} the ratio _D 1 / _{D 2} and D ₂ is preferably 0.6 or less. The ratio is more preferably 0.001 or more and 0.6 or less, further preferably 0.005 or more and 0.57 or less, and still more preferably 0.008 or more and 0.53 or less, and 0.01 or more and 0.50 or less. The following are particularly preferred. More specifically, the thickness of the heat transfer layer 132 of the indirect lamination type is preferably 1 μm to 250 μm, more preferably 1 μm to 150 μm, still more preferably 2 μm to 120 μm, still more preferably 3 μm to 60 μm. 3 μm or more and 40 μm or less is particularly preferable, and 3 μm or more and 30 μm or less is particularly preferable.

  Also, the indirect lamination type heat equalizing layer 132 may have any number of layers in one heater 1. That is, only one layer may be provided, or two or more layers may be provided. Usually, higher thermal uniformity can be obtained by providing a larger number of layers, but an excessive increase in the number of layers of the indirect lamination type heat equalizing layer 132 can be obtained from the viewpoint of preventing thermal shock of the heater 1 and warpage. Not preferred. For this reason, 1 or more and 10 or less layers are preferable, 1 or more and 5 or less layers are more preferable, and 1 or more and 3 or less layers are especially preferable. When two or more indirect lamination type heat equalizing layers 132 are provided, each heat equalizing layer 13 may have the same thickness or different thicknesses. Furthermore, they may have the same shape (pattern shape or the like) or may have different shapes.

In particular, when the substrate 11 is a stainless steel substrate (stainless steel substrate) having a thickness of 100 μm to 600 μm, the heat equalizing layer 13 is effective by suppressing the total thickness to 60 μm or less (further, 30 μm or less). While preventing the curvature of the whole heater, it can utilize with the layer thickness of the range excellent in the soaking operation.
On the other hand, from the viewpoint of soaking, the thicker the soaking layer 13, the easier it to be effective. For example, the soaking layer 13 having a total thickness of more than 30 μm is provided on the other surface 11b side of the substrate 11. In this case, the heat equalizing layer 13 having the same thickness is disposed symmetrically on one surface 11 a side of the substrate 11 (in particular, the layer between the substrate 11 and the heat generating layer 12 is preferable) to warp the entire heater. It can prevent. Furthermore, when it is difficult to provide the heat equalizing layer 13 having the same thickness, the thickness ratio of 25% to 95% or less with respect to the total thickness of the heat equalizing layer 13 provided on the other surface 11b side of the substrate 11 By providing the heat equalizing layer 13 on the one surface 11 a side of the substrate 11 (in particular, the layer between the substrate 11 and the heat generating layer 12 is preferable), warpage of the entire heater can be sufficiently suppressed. The thickness ratio is preferably 30% or more and 92% or less, more preferably 35% or more and 88%, and particularly preferably 40% or more and 85% or less (see FIG. 7).
The effect is more easily obtained if the thickness of the heat equalizing layer 13 is thicker, but even if the thickness is excessively increased, the heat equalizing effect obtained tends to be smaller with respect to the increase of the thickness. . Therefore, for example, for a stainless steel substrate in which the substrate 11 has a thickness of 100 μm to 600 μm, the total layer thickness of the heat equalizing layer 13 is preferably 250 μm or less as described above.

In the heater 1, when comparing the direct lamination heat equalizing layer 131 and the indirect lamination heat equalizing layer 132, the direct lamination heat equalizing layer 131 tends to exhibit higher heat uniformity. . Therefore, in the heater 1 of the present invention, it is preferable that at least a direct-stacking heat equalizing layer 131 be provided.
In the case where the heater 1 is provided with the direct lamination type heat equalizing layer 131 and then provided with the indirect lamination type heat equalizing layer 132, the direct lamination type heat equalizing layer 131 is provided with the indirect lamination type heat equalizing layer 131. The thermal layer 132 is preferably disposed closer to the heating surface.

  In particular, in the heater 1 (for example, a stainless steel substrate) whose base material is a conductive material, the base 11 and the heat generating layer 12 need to be insulated, and the insulating layer 14 is provided. The insulating layer 14 can be formed by glass glaze. When such an insulating layer 14 is provided, the substrate 11 and the heat generating layer 12 are provided on the substrate 11 so as to provide uniform arrangement and thickness on the front and back, in order to prevent warpage of the entire heater 1. In addition to the above layers, the insulating layer 14 is often provided for the purpose of warpage prevention without the purpose of insulation. Such an insulating layer 14 is usually a material having low thermal conductivity, and for example, the thermal conductivity of glass glazes is 5 W / mK or less. Therefore, in the present heater 1, providing the indirect laminated type heat equalizing layer 132 means providing the heat equalizing layer 13 between the low thermal conductivity insulating layers 14 (which may not be layers intended for insulation). It is preferable from the viewpoint of obtaining the soaking effect.

  Furthermore, as described above, there is a form in which both the front and back surfaces are covered with the glass glaze layer (insulating layer 14) as the heat equalizing layer 13 in the indirect lamination type heat equalizing layer 132, but in this case A glass glaze layer covering the surface of the indirectly laminated heat equalizing layer 132 by providing a missing part (133X) in the laminated heat equalizing layer 132 (see FIG. 8A and FIG. 9) and interposing the missing part 133X. (Insulating layer 14) and the glass glaze layer (insulating layer 14) which covers the back surface of the indirect lamination type heat equalizing layer 132 may be fused. By bonding the glass glaze layer on the front and back in this manner, it is possible to improve the bondability between the layers including the indirect lamination type heat equalizing layer 132 of the heater 1 and also to improve the thermal shock resistance and the warpage prevention property of the heater 1. Can be improved.

As the above-mentioned lack part 133X, the notch (133S) and the penetration hole (133H) penetrated to the front and back are mentioned (refer to Drawing 8 (a) and Drawing 9). These may have only one or both. Further, in the case where the missing portion 133X is provided, it is preferable that the missing portion 133X be disposed at a position where the thermal unevenness is smaller. That is, since the heat uniformity of this portion is lowered compared to the other portions by providing the missing portion 133X, it is preferable to dispose this portion at a position where the temperature difference due to the heat generating layer 12 is small.
More specifically, in the case where the heat generating layer 12 includes a plurality of resistive heat cells electrically connected in parallel, it is preferable to dispose the missing portion 133X between the respective resistive heat cells (FIG. 8 (a )reference). In addition, the resistance heating cell has a plurality of horizontal wiring portions arranged substantially perpendicular to the sweep direction (D ₁ ), and a vertical wiring portion connecting the horizontal wiring portions, and the horizontal wiring portion 122 and In the case of the resistance heating wire 121 which is formed in a zigzag shape by connecting the vertical wiring portions 123, it is preferable to dispose the dropouts 133X while avoiding the corresponding vertical wiring portions 123. That is, when the heater 1 is viewed in plan, it is preferable to arrange the projected image of the vertical wiring portion 123 and the projected image of the missing portion 133X so as not to overlap (see FIG. 8A). Furthermore, in other words, it is preferable that the projected image of the vertical wiring portion 123 overlaps the existing portion of the heat equalizing layer 13.

  Also, as a matter of course, the heat equalizing layer 13 having the above-described missing portion 133X (including the notch 133S and the through holes 133H) is the direct layer heat equalizing layer 131 or the indirect layer heat equalizing layer 132. Regardless of whether or not it is effective in any of the heat equalizing layers 13. That is, in the case where the heat spreader layer 13 has the missing portion 133, the layer adjacent to one surface side of the heat spreader layer and the layer adjacent to the other surface side of the heat spreader layer are joined Thus, the heater 1 having higher durability can be obtained. Specifically, in the case of the indirect lamination type heat equalizing layer 132, as described above, the layer adjacent to one surface side of the heat equalizing layer and the layer adjacent to the other surface side of the heat equalizing layer are also glass glaze layers These glass glaze layers are joined together. Moreover, in the case of the direct-stacking type heat equalizing layer 131, when the substrate 11 is a stainless steel substrate, the layer adjacent to one surface side of the heat equalizing layer is a stainless steel substrate and adjacent to the other surface side of the heat equalizing layer The deposited layer can be a glass glaze layer. In this case, a strong bond between the stainless steel substrate and the glass glaze layer can be obtained.

  In the heater 1, regardless of whether it is the direct lamination type heat equalizing layer 131 or the indirect lamination type heat equalizing layer 132, the heat equalizing layer 13 is patterned (that is, a planar shape having the missing portion 133X) Can have. Specifically, the heat equalizing layer 13 can be disposed as a discontinuous layer. For example, a patch (a part of the heat equalizing layer 13) can be disposed only in a portion where the thermal unevenness is large in a predetermined layer, and a portion where the thermal unevenness is small can be a missing portion 133X (see FIG. 8A). . Furthermore, in the predetermined layer, the thickness of the heat equalizing layer 13 in the portion where the thermal unevenness is large can be increased, and the thickness of the heat equalizing layer 13 in the portion where the heat unevenness is small can be relatively thin.

Furthermore, although the specific shape of the heat spreader 13 which makes the planar shape which has the lack part 133X is not limited, FIG.17 (b)-(g) etc. can be illustrated besides FIG. 8 (a) and FIG. (FIG. 17 (a) illustrates the planar shape which does not have the missing part 133X).
That is, FIG. 17 (b) shows a form in which the heat equalizing layer 13 is formed as an aggregate of separated heat equalizing pieces such as a water ball pattern, and is continued as a gap between the heat equalizing pieces. It has a missing portion 133X. Moreover, FIG.17 (c) and FIG.17 (d) are the soaking layers 13 patterned so that the area ratio to the narrow width direction (sweep direction) might become equal. Among these, FIG. 17C has a rectangular through hole 133H and a rectangular missing portion 133S as the missing portion 133X. On the other hand, FIG. 17 (d) shows a form in which the heat equalizing layer 13 is formed as an aggregate of the heat equalizing pieces separated into a rectangular shape, and the missing part continued as a gap between the heat equalizing pieces. It has 133X.

  Furthermore, FIGS. 17 (e) to 17 (g) each show a form in which the heat spreader 13 is formed as an aggregate of heat spreaders separated into stripes, and It has a stripe-like dropout portion 133X corresponding to the gap. Among these, FIG. 17E shows a heat equalizing layer 13 in the form of stripes along the longitudinal direction (orthogonal to the sweep direction). Further, FIG. 17F shows a stripe-shaped heat equalizing layer 13 which is inclined (inclined in the sweeping direction) so as to cross the longitudinal direction and the width direction. Further, FIG. 17G shows a stripe-shaped heat equalizing layer 13 along the width direction (perpendicular to the longitudinal direction and along the sweep direction). In the stripe-shaped heat equalizing layer 13, it is possible to provide coarse and dense stripes or the width of the missing portion 133 </ b> X as necessary.

<5> Other Layers In the heater 1 of the present invention, other layers can be provided besides the base 11, the heat generating layer 12, the heat equalizing layer 13 and the insulating layer 14. As the other layer, an overcoat layer made of glazed glass, an overcoat layer (polyimide layer) made of a polyimide film, a self-energized blocking layer that can be melted at high temperatures above a predetermined level to block current flow to the heat generating layer 12 Japanese Patent Application Laid-Open No. 2002-359059) can be applied. Among these, the above-mentioned overcoat layer can be used for the purpose of improving the durability (abrasion resistance) of the sliding surface or improving the cleanliness. These layers may be used alone or in combination of two or more.

<6> Heating Surface of Heater In the present heater 1, the heating surface may be disposed on the one surface 11a side or the other surface 11b side with respect to the substrate 11, and further, on both surfaces of these. It may be placed on the side. That is, although the object to be heated may be heated using any surface, it is preferable that the surface on the other surface 11 b side of the substrate 11 be a surface facing the object to be heated. That is, it is preferable that the surface on the opposite side of the heat generating layer 12 with the substrate 11 interposed therebetween be the opposite surface to the object to be heated. By arranging the heating surface in this manner, it is possible to more easily obtain the soaking effect by providing the soaking layer 13.

The base 11 may have a flat plate shape, but may have a curved shape. That is, in the case where the object to be heated is heated while the object to be heated is relatively swept while the heating surface of the heater 1 faces the object to be heated, the sweep direction (D ₁ ) of the substrate 11 is The cross-sectional shape is a circular arc shape (that is, a shape obtained by cutting a cylinder or a cylinder by a plane parallel to the central axis) convex on the opposite side to the object to be heated about an axis orthogonal to the sweep direction (D ₁ ) can do. With such a shape, by attaching the heater 1 to a cylindrical roll and rotating the roll, it is possible to efficiently heat the object to be swept over the roll.

<7> Application The heater 1 is incorporated in an image forming apparatus such as a printing machine, a copying machine, a facsimile machine, or a fixing device, and can be used as a fixing heater for fixing toner, ink, and the like on a recording medium. Moreover, it integrates in a heater and it can utilize as a heating apparatus which heats (drying, baking etc.) to-be-processed objects, such as a panel, uniformly. In addition, heat treatment of a metal product, a coating film formed on a substrate of various shapes, heat treatment of a film, and the like can be suitably performed. Specifically, heat treatment of coating film (filter component material) for flat panel display, paint drying of painted metal products, automobile related products, woodworking products etc, electrostatic flocking adhesion drying, heat treatment of plastic processed products, printing It can be used for solder reflow of a substrate, printing and drying of a thick film integrated circuit, and the like.

[2] Fixing Device The fixing device including the heater 1 can be appropriately selected depending on the object to be heated, the fixing unit, and the like. For example, in the case where a toner or the like is fixed to a recording medium such as paper by using a fixing unit with pressure bonding, or when a plurality of members are bonded together, a fixing unit including a heating unit including a heater and a pressure unit. It can be an apparatus. Of course, it is also possible to use a fixing means without pressure bonding. In the present invention, it is preferable that the fixing device 5 fix an unfixed image including a toner formed on the surface of a recording medium such as paper or film on the recording medium.
FIG. 10 shows the main part of the fixing device 5 disposed in the electrophotographic image forming apparatus. The fixing device 5 includes a rotatable fixing roller 51 and a rotatable pressing roller 54, and the heater 1 is disposed inside the fixing roller 51. The heater 1 is preferably disposed close to the inner surface of the fixing roll 51.
The heater 1 is fixed, for example, inside the heater holder 53 made of a material capable of conducting the heat generated by the heater 1 like the fixing means 5 shown in FIG. Can be transmitted to the outer surface from the inside of the

  FIG. 11 also shows the main part of the fixing device 5 disposed in the electrophotographic image forming apparatus. The fixing device 5 includes a rotatable fixing roller 51 and a rotatable pressing roller 54. The fixing device 5 press-contacts the recording medium with the heater 1 for transferring heat to the fixing roller 51 and the pressing roller 54. A pressure roller 52 is disposed inside the fixing roller 51. The heater 1 is disposed along the cylindrical surface of the fixing roll 51.

  In the fixing device 5 shown in FIG. 10 or 11, the heater 1 generates heat by applying a voltage from a power supply device (not shown), and the heat is transmitted to the fixing roll 51. Then, when the recording medium having the unfixed toner image on the surface is supplied between the fixing roll 51 and the pressing roll 54, the toner is in the pressure contact portion between the fixing roll 51 and the pressing roll 54. It fuses to form a fixed image. Since the pressure contact portion of the fixing roll 51 and the pressure roll 54 is provided, it rotates together. As described above, the heater 1 suppresses local temperature increase that easily occurs when a small recording medium is used, so temperature unevenness in the fixing roll 51 is unlikely to occur, and fixing is performed uniformly. Can.

Another embodiment of the fixing device including the heater 1 may be a mold including an upper mold and a lower mold, and a heater may be disposed in at least one of the upper mold and the lower mold.
The fixing device equipped with the heater 1 is attached to an electrophotographic printing machine, an image forming apparatus such as a copying machine, household electric appliances, business precision instruments for experiments, heating, heat retention, etc. It is suitable as a heat source of

[3] Image Forming Apparatus The image forming apparatus provided with the heater 1 can be appropriately selected depending on the heating target, the heating purpose, and the like. In the present invention, as shown in FIG. 12, an imaging means for forming an unfixed image on the surface of a recording medium such as paper, film and the like, and a fixing means 5 for fixing the unfixed image on the recording medium Preferably, the fixing unit 5 is the image forming apparatus 4 including the main heater 1. The image forming apparatus 4 can be configured to include recording medium transport means and control means for controlling each means, in addition to the above means.

FIG. 12 is a schematic view showing the main part of the electrophotographic image forming apparatus 4. The image forming means may be either a method including a transfer drum or a method not including a transfer drum, but FIG. 12 is an embodiment including a transfer drum.
In the image forming means, while rotating, the laser processing surface of the photosensitive drum 44 charged to a predetermined potential by the charging device 43 is irradiated with the laser output from the laser scanner 41, and the toner supplied from the developing device 45 Thus, an electrostatic latent image is formed. Then, using the potential difference, the toner image is transferred to the surface of the transfer drum 46 interlocked with the photosensitive drum 44. Thereafter, the toner image is transferred onto the surface of the recording medium supplied between the transfer drum 46 and the transfer roll 47, and a recording medium having an unfixed image is obtained. The toner is a particle containing a binder resin, a colorant and an additive, and the melting temperature of the binder resin is usually 90 ° C. to 250 ° C. A cleaning device for removing insoluble toner and the like can be provided on the surfaces of the photosensitive drum 44 and the transfer drum 46.

  The fixing unit 5 may have the same configuration as the fixing unit 5 and includes a pressure roller 54 and a heater holder 53 holding a heater 1 of the sheet passing direction conduction type, and interlocks with the pressure roller 54. And a fixing roll 51. A recording medium having an unfixed image from the imaging means is supplied between the fixing roll 51 and the pressure roll 54. The heat of the fixing roll 51 melts the toner image of the recording medium, and the melted toner is pressed at the pressure contact portion between the fixing roll 51 and the pressure roll 54, and the toner image is a recording medium. It is fixed in The fixing unit 5 of FIG. 12 may have a fixing belt in which the heater 1 is disposed close to the fixing roller 51 instead of the fixing roller 51.

Generally, when the temperature of the fixing roll 51 becomes uneven and the amount of heat given to the toner is too small, the toner is peeled off from the recording medium, while when the amount of heat is too large, the toner comes to the fixing roll 51 The toner may adhere, and the fixing roll 51 may make a round and reattach to the recording medium. According to the fixing unit 5 including the heater of the present invention, the temperature can be quickly adjusted to a predetermined temperature, so that problems can be suppressed.
The image forming apparatus of the present invention suppresses excessive temperature rise in the non-sheet passing area at the time of use, and is suitable as an electrophotographic printing machine, copying machine or the like.

[4] Heating Device The heating device provided with the present heater can be appropriately selected depending on the size, shape, and the like of the object to be heated. In the present invention, for example, a housing unit, a sealable window unit arranged for taking in and out of an object to be heat treated, and a movable heater unit arranged inside the housing unit It can be configured. If necessary, an object-to-be-heat-treated installation portion for placing the object to be heat-treated inside the casing, an exhaust unit for evacuating the gas when the object to be heat-treated is discharged, and A pressure adjustment unit such as a vacuum pump can be provided to adjust the internal pressure. Moreover, heating may be performed in the state which fixed the to-be-processed object and the heater part, and may be performed moving any one.
The heating apparatus is suitable as an apparatus for drying a heat-treated material containing water, an organic solvent and the like at a desired temperature. And it can be used as a vacuum drier (reduced pressure drier), a pressure drier, a dehumidifying drier, a hot air drier, an explosion-proof drier or the like. Moreover, it is suitable as an apparatus which bakes unbaked materials, such as a LCD panel and an organic electroluminescent panel, at desired temperature. And it can be used as a reduced pressure baking machine, a pressure baking machine or the like.

The invention will now be described by way of examples.
[1] Production of Heater The heaters of Examples 1 to 4 and Comparative Example 1 were produced according to the following procedure.
(1) Heater of Example 1 (see FIG. 1)
A 300 μm thick stainless film (SUS 430, thermal conductivity 26 W / mK) was used as the base 11.
A silver paste was applied to the surface on the other surface 11 b side of the substrate 11, and then baked to form an 8 μm-thick heat equalizing layer 13 (directly laminated heat equalizing layer 131).
Next, an insulating glass paste was applied to the surface on the one surface 11 a side of the substrate 11 and the surface of the soaking layer 13, and then baked to form a glass glaze layer (insulating layer 141) having a thickness of 75 μm.
Further, an unsintered layer to be the heat generating layer 12 was formed by patterning on the surface of the insulating layer 141 formed on the one surface 11 a side of the substrate 11 by screen printing, and then baked to form the heat generating layer 12. The heat generating layer 12 is a resistance heating wire containing Ag-Pd and having a positive resistance heating coefficient, and includes a plurality of resistance heating cells electrically connected in parallel, and each resistance heating cell has a sweeping direction A plurality of horizontal wiring portions arranged substantially perpendicular to the above, and a vertical wiring portion connecting the horizontal wiring portions are connected to each other to form resistance heating wiring 121 formed in a zigzag shape. In addition to the resistance heating wiring 121, the heating layer 12 has a power feeding land for feeding power to the resistance heating wiring 121 and a power feeding wiring (not shown). The feed land and the feed wiring are formed by screen printing and baking before and after the formation of the resistance heating wiring 121 by silver paste.
Thereafter, an insulating glass paste was applied to the surface of the insulating layer 141 exposed to the other surface 11 b of the substrate 11 and to both surfaces of the insulating layer 141 and the heat generating layer 12 exposed to the one surface 11 a of the substrate 11. Thereafter, it was baked to form a 50 μm thick glass glaze layer (insulating layer 142).
Next, an insulating glass paste is applied to the insulating layer 142 exposed on the one surface 11 a side of the base 11 and the surface of the insulating layer 142 exposed on the other surface 11 b side of the base 11, and then baked. A 20 μm glass glaze layer (insulating layer 143) was formed to obtain the heater 1 of Example 1 (FIG. 1).

(2) Heater of Example 2 (see FIG. 2)
The same stainless steel film of 300 μm in thickness as in Example 1 was used as the substrate 11.
A silver paste was applied to the surface on the side of one surface 11 a of the substrate 11, and then baked to form an 8 μm-thick heat equalizing layer 13 (directly laminated heat equalizing layer 131).
Next, an insulating glass paste was applied to the surface on the other surface 11 b side of the base 11 and the surface of the soaking layer 13, and then baked to form a glass glaze layer (insulating layer 141) having a thickness of 75 μm.
Further, an unsintered layer to be the heat generating layer 12 was formed by patterning on the surface of the insulating layer 141 formed on the one surface 11 a side of the substrate 11 by screen printing, and then baked to form the heat generating layer 12. The heat generating layer 12 is the same as that of the first embodiment.
Thereafter, an insulating glass paste was applied to the surface of the insulating layer 141 exposed to the other surface 11 b of the substrate 11 and to both surfaces of the insulating layer 141 and the heat generating layer 12 exposed to the one surface 11 a of the substrate 11. Thereafter, it was baked to form a 50 μm thick glass glaze layer (insulating layer 142).
Subsequently, in the same manner as in Example 1, a glass glaze layer (insulating layer 143) having a thickness of 20 μm was formed, to obtain a heater 1 of Example 2 (FIG. 2).

(3) Heater of Example 3 (see FIG. 3)
The same stainless steel film of 300 μm in thickness as in Example 1 was used as the substrate 11.
A silver paste is applied to both surfaces of the surface 11a of the substrate 11 and the surface of the other surface 11b, and then baked to form an 8 μm-thick heat spreader 13 (a direct-stack type heat spreader 131).
Next, an insulating glass paste is applied to the surface of the heat equalizing layer 13 on each of the one surface 11a side and the other surface 11b side of the substrate 11, and then baked to form a 75 μm-thick glass glaze layer (insulation layer 141). Formed.
Further, an unsintered layer to be the heat generating layer 12 was formed by patterning on the surface of the insulating layer 141 formed on the one surface 11 a side of the substrate 11 by screen printing, and then baked to form the heat generating layer 12. The heat generating layer 12 is the same as that of the first embodiment.
Thereafter, an insulating glass paste was applied to the surface of the insulating layer 141 exposed to the other surface 11 b of the substrate 11 and to both surfaces of the insulating layer 141 and the heat generating layer 12 exposed to the one surface 11 a of the substrate 11. Thereafter, it was baked to form a 50 μm thick glass glaze layer (insulating layer 142).
Subsequently, in the same manner as in Example 1, a glass glaze layer (insulating layer 143) having a thickness of 20 μm was formed, to obtain a heater 1 of Example 3 (FIG. 3).

(4) Heater of Example 4 (see FIG. 4)
The same stainless steel film of 300 μm in thickness as in Example 1 was used as the substrate 11.
A silver paste was applied to the surface on the other surface 11 b side of the substrate 11, and then baked to form an 8 μm-thick heat equalizing layer 13 (directly laminated heat equalizing layer 131).
Next, an insulating glass paste was applied to the surface on the one surface 11 a side of the substrate 11 and the surface of the soaking layer 13, and then baked to form a glass glaze layer (insulating layer 141) having a thickness of 75 μm.
Further, an unsintered layer to be the heat generating layer 12 was formed by patterning on the surface of the insulating layer 141 formed on the one surface 11 a side of the substrate 11 by screen printing, and then baked to form the heat generating layer 12. The heat generating layer 12 is the same as that of the first embodiment.
Thereafter, a silver paste is applied to the surface of the insulating layer 141 exposed to the other surface 11b side of the substrate 11, and then baked to form an 8 μm-thick heat equalizing layer 13 (indirectly laminated type heat equalizing layer 132). did.
Thereafter, an insulating glass paste is applied to the surface of the indirect lamination type heat equalizing layer 132 and to both surfaces of the insulating layer 141 and the heat generating layer 12 exposed on the one surface 11a side of the substrate 11, and then baked. A 50 μm-thick glass glaze layer (insulating layer 142) was formed.
Subsequently, in the same manner as in Example 1, a glass glaze layer (insulating layer 143) having a thickness of 20 μm was formed, to obtain a heater 1 of Example 4 (FIG. 4).

(5) Heater of Comparative Example 1 (see FIG. 15)
The same stainless steel film of 300 μm in thickness as in Example 1 was used as the substrate 11.
Insulating glass paste was applied to both the surface on the side of one surface 11a of this substrate 11 and the surface on the other surface 11b side and then baked to form a glass glaze layer (insulating layer 141) having a thickness of 75 μm. .
Further, an unsintered layer to be the heat generating layer 12 was formed by patterning on the surface of the insulating layer 141 formed on the one surface 11 a side of the substrate 11 by screen printing, and then baked to form the heat generating layer 12. The heat generating layer 12 is the same as that of the first embodiment.
Thereafter, insulating glass paste was applied to both surfaces of the insulating layer 141 and the heat generating layer 12 exposed to the one surface 11 a side of the substrate 11 and the insulating layer 141 exposed to the other surface 11 b side of the substrate 11. Thereafter, it was baked to form a 50 μm thick glass glaze layer (insulating layer 142).
Next, in the same manner as in Example 1, a glass glaze layer (insulating layer 143) having a thickness of 20 μm was formed, and a heater of Comparative Example 1 (FIG. 15) was obtained.

[2] Confirmation of the effect of the heat spreader A voltage of AC 45 V is applied to each of the heaters of Examples 1 to 4 and Comparative Example 1 obtained in the above [1], and the maximum temperature of the surface of each heater 1 is When the temperature reached 260 ° C., the temperature data of the entire heaters 1 was collectively acquired using a thermotracer (manufactured by NEC Avio Infrared Technologies, Inc., model “TH9100MR”). Then, temperature data in the width center of the sweep direction (D ₁ ) of each heater 1 was picked up from the obtained data, graphed, and the temperature difference between the maximum temperature and the minimum temperature in this graph was calculated.
The above measurement was performed three times for each heater, the average value of the obtained temperature difference was calculated, and a graph is shown in FIG. As a result, while the temperature difference of the heater of Comparative Example 1 was 18.03 ° C., Example 1 was 13.10 ° C., Example 2 was 13.00 ° C., and Example 3 was 12.43 ° C. Example 4 was at 12.50 ° C. That is, Example 1 is 27.3%, Example 2 is 27.9%, Example 3 is 31.1%, and Example 4 is 30.7%, and the temperature difference can be reduced, and both are excellent averages. It turned out that the thermal effect was obtained.

[3] Correlation between the thickness of the soaking layer and the formation position (1) The heater of Example 5 (see FIG. 1)
The heater 1 of Example 5 is the same as Example 1 except that the 8 μm-thick heat equalizing layer 13 (directly laminated type heat equalizing layer 131) is formed on the surface on the other surface 11 b side of the substrate 11. Obtained. That is, the heater 1 according to the fifth embodiment has the direct layer type heat equalizing layer 131 having a total thickness of 8 μm.

(2) Heater of Example 6 (see FIG. 3)
Example 6 is carried out in the same manner as Example 3, except that the heat equalizing layer 13 (the direct layer heat equalizing layer 131) is formed to a thickness of 8 μm on both surfaces of the one surface 11a and the other surface 11b of the substrate 11, respectively. The heater 1 of was obtained. That is, the heater 1 according to the sixth embodiment has the direct lamination type heat equalizing layer 131 having a total thickness of 16 μm.

(3) The heater of Example 7 (see FIG. 5)
The same stainless steel film of 300 μm in thickness as in Example 1 was used as the substrate 11.
Insulating glass paste was applied to both the surface on the side of one surface 11a of this substrate 11 and the surface on the other surface 11b side and then baked to form a glass glaze layer (insulating layer 141) having a thickness of 75 μm. .
Further, an unsintered layer to be the heat generating layer 12 was formed by patterning on the surface of the insulating layer 141 formed on the one surface 11 a side of the substrate 11 by screen printing, and then baked to form the heat generating layer 12. The heat generating layer 12 is the same as that of the first embodiment.
Furthermore, a silver paste is applied by screen printing on the surface of the insulating layer 141 formed on the other surface 11 b side of the substrate 11 and then baked to form a 8 μm-thick heat spreader 13 (indirect lamination type heat spreader 132). Formed.
Thereafter, insulating glass paste is applied to both surfaces of the insulating layer 141 and the heat generating layer 12 exposed to the one surface 11 a side of the substrate 11 and the heat equalizing layer 13 exposed to the other surface 11 b side of the substrate 11 Then, it was baked to form a 50 μm thick glass glaze layer (insulating layer 142).
Subsequently, in the same manner as in Example 1, a glass glaze layer (insulating layer 143) having a thickness of 20 μm was formed, to obtain a heater of Example 7 (FIG. 5). That is, the heater 1 of the seventh embodiment has the indirect lamination type heat equalizing layer 132 having a total thickness of 8 μm.

(4) Heater of Example 8 (see FIG. 6)
The same stainless steel film of 300 μm in thickness as in Example 1 was used as the substrate 11.
Insulating glass paste was applied to both the surface on the side of one surface 11a of this substrate 11 and the surface on the other surface 11b side and then baked to form a glass glaze layer (insulating layer 141) having a thickness of 75 μm. .
Further, an unsintered layer to be the heat generating layer 12 was formed by patterning on the surface of the insulating layer 141 formed on the one surface 11 a side of the substrate 11 by screen printing, and then baked to form the heat generating layer 12. The heat generating layer 12 is the same as that of the first embodiment.
Furthermore, a silver paste is applied by screen printing on the surface of the insulating layer 141 formed on the other surface 11 b side of the substrate 11 and then baked to form a 8 μm-thick heat spreader 13 (indirect lamination type heat spreader 132). Formed.
Thereafter, insulating glass paste is applied to both surfaces of the insulating layer 141 and the heat generating layer 12 exposed to the one surface 11 a side of the substrate 11 and the heat equalizing layer 13 exposed to the other surface 11 b side of the substrate 11 Then, it was baked to form a 50 μm thick glass glaze layer (insulating layer 142).
Subsequently, in the same manner as in Example 1, a glass glaze layer (insulating layer 143) having a thickness of 20 μm was formed.
Furthermore, a silver paste is applied by screen printing to the surface of the glass glaze layer (insulation layer 143) formed on the other surface 11b side of the substrate 11, and then baked to form an 8 μm-thick heat spreader 13 (indirect lamination type). The heat equalizing layer 132) was formed to obtain the heater of Example 8 (FIG. 6). That is, the heater 1 of the eighth embodiment has the indirect lamination type heat equalizing layer 132 having a total thickness of 16 μm.

(5) The heater of Example 9 (see FIG. 5)
The heater of Example 9 is applied in the same manner as in Example 7 except that a silver paste is applied three times and then baked to form a heat equalizing layer 13 (indirect laminated heat equalizing layer 132) having a thickness of 24 μm. Obtained. That is, the heater 1 of the ninth embodiment has the indirect lamination type heat equalizing layer 132 having a total thickness of 24 μm.

(6) The heater of Example 10 (see FIG. 1)
The heater 1 of Example 10 is the same as Example 1 except that a 24 μm-thick heat equalizing layer 13 (directly laminated heat equalizing layer 131) is formed on the surface on the other surface 11 b side of the base 11. Obtained. That is, the heater 1 of Example 10 will have the direct layer type heat equalizing layer 131 of 24 micrometers in total thickness.

(7) Heater of Example 11 (see FIG. 3)
Example 11 in the same manner as Example 3 except that the heat equalizing layer 13 (directly laminated heat equalizing layer 131) having a thickness of 36 μm was formed on both surfaces of the one surface 11a and the other surface 11b of the substrate 11, respectively. The heater 1 of was obtained. That is, the heater 1 of Example 11 has the heat accumulation layer 131 of the direct lamination type with a total thickness of 72 μm.

(8) The heater of Example 12 (see FIG. 3)
Example 11 in the same manner as Example 3 except that the heat equalizing layer 13 (directly laminated heat equalizing layer 131) having a thickness of 54 μm was formed on both surfaces of the one surface 11a and the other surface 11b of the substrate 11, respectively. The heater 1 of was obtained. That is, the heater 1 of Example 11 has the heat accumulation layer 131 of the direct lamination type of 108 μm in total thickness.

(9) The heater of Example 13 (see FIG. 5)
A heater of Example 13 was obtained in the same manner as Example 7, except that the heat equalizing layer 13 (indirect laminated heat equalizing layer 132) having a thickness of 54 μm was formed. That is, the heater 1 of Example 13 has an indirect laminated type heat equalizing layer 132 having a total thickness of 54 μm.

(10) The heater of Embodiment 14 (see FIG. 6)
A 54 μm thick soaking layer 13 (indirectly laminated type soaking layer 132) is formed on the surface on the other surface side of the insulating layer 141, and an 18 μm thick on the surface of the other surface of the glass glaze layer (insulating layer 143). A heater of Example 14 was obtained in the same manner as Example 8, except that the heat equalizing layer 13 (indirect laminated heat equalizing layer 132) was formed. That is, the heater 1 of Example 14 has an indirect laminated type heat equalizing layer 132 having a total thickness of 72 μm.

(11) Measurement 1
Using the heaters of Examples 5 to 9 obtained in the above [3] (1) to (5), the correlation between the thickness of the soaking layer and the formation position was examined. The same measurement as in [2] above was performed to determine the temperature difference between the maximum temperature and the minimum temperature. Furthermore, the results are shown as a graph in FIG.
In FIG. 14, the line connecting Example 5 to Example 6 shows the correlation between the soaking effect and the thickness of the soaking layer in the case where the direct soaking type soaking layer 131 is used. On the other hand, the line connecting Example 7 to Example 9 shows the correlation between the soaking effect and the thickness of the soaking layer in the case of using the indirectly laminated soaking layer 132.
From the result of FIG. 14, when the thickness of the direct lamination type heat equalizing layer 131 and the thickness of the indirect lamination type heat equalizing layer 132 are the same, the effect of reducing the temperature difference is high. Is a direct-stacking type heat equalizing layer 131.

(12) Measurement 2
Using the heater of Comparative Example 1 obtained in the above [1] (5) and the heaters of Examples 5 to 14 obtained in the above [3] (1) to (10), the thickness and formation of the soaking layer We examined the correlation with the position. The measurement similar to the above [2] was performed, and the temperature difference between the maximum temperature and the minimum temperature (three measurements for each heater, and the average value of the temperature difference in each data obtained) was determined. Furthermore, the result is shown in FIG. 18 as a graph.
From the results shown in FIG. 18, an extremely thin heat equalizing layer 13 having a thickness of 8 μm is provided for the direct layer heat equalizing layer 131 or the indirect layer heat equalizing layer 132 or the comparative example 1. Thus, it can be seen that a dramatic soaking action (action to reduce the temperature difference) is exhibited. That is, while the temperature difference in Comparative Example 1 is 18.3 ° C., in Example 5 (directly laminated type heat equalizing layer 8 μm), 11.2 ° C., in Example 7 (indirectly laminated type heat equalizing layer 8 μm) It became 13.0 ° C. It can be said that in Example 5, a soaking effect of 38.8% was obtained, and in Example 7, a soaking effect of 29.0% was obtained. And, it can be seen from FIG. 18 that this remarkable soaking action can be obtained up to a total thickness of about 30 μm.

However, it can be seen from FIG. 18 that regardless of whether it is the direct lamination type heat equalizing layer 131 or the indirect lamination type heat equalizing layer 132, the soaking effect obtained with respect to the increase of the heat equalizing layer thickness You can see how it shrinks gradually. That is, the respective soaking actions of Example 7, Example 8 and Example 9 for Comparative Example 1 and the respective soaking actions of Example 5, Example 6 and Example 10 for Comparative Example 1 are extremely excellent. On the other hand, the soaking action of Example 12 for Example 11 and the soaking action of Example 14 for Example 13 are reduced as compared to these soaking actions. The same temperature difference is 6.7 ° C. in an example in which the heat spreader layer 13 having a total thickness of 200 μm is formed using both the direct stack heat spreader 131 and the indirect stack heat spreader 132. Met.
From these facts, regardless of whether it is the direct lamination type heat equalizing layer 131 or the indirect lamination type heat equalizing layer 132, if it is intended to obtain a more effective heat equalizing action, The total thickness is preferably 150 μm or less (usually 1 μm or more), more preferably 60 μm or less, still more preferably 40 μm or less, and particularly preferably 30 μm or less.

[4] Correlation between the Plane Shape of the Soaking Layer and the Soaking Function The plane shapes of the soaking layer 13 provided in the heaters 1 of the above-described Examples 1 to 14 are all shown in FIG. 17 (a). It has a rectangular shape (solid form). On the other hand, the planar shape of the heat spreader in FIG. 9 and the planar shape of the heat spreader in FIGS. 17 (b) to 17 (g) are all in the form having the missing portion 133X (including 133H and 133S). is there. Thus, the correlation between the planar shape of the soaking layer and the soaking action was evaluated as follows.

(1) Heater of Embodiment 15 (see FIG. 5)
In the same manner as in Example 7, a heater of Example 15 having a heat equalizing layer 132 with a thickness of 16 μm was obtained. That is, Example 15 has a thickness equal to 16 μm, and has an indirectly laminated heat equalizing layer 132 having a rectangular planar shape (solid form).

(2) The heater of Example 16 (see FIG. 5)
Except for the planar shape of the heat equalizing layer 13 (indirect lamination type heat equalizing layer 132) being the stripe shape shown in FIG. The heater of Example 15 which has is obtained. The area ratio in the planar shape is 60.0% for the heat equalizing layer 132 of the heater of Example 16 when the heat equalizing layer 132 of the heater of Example 15 is 100%.

(3) Measurement 3
Using the heater of Example 15 (see FIG. 5) obtained in the above [4] (1) and the heater (see FIG. 5) of Example 16 obtained in the above [4] (2) The same measurement as in [2] was performed, and the temperature difference between the highest temperature and the lowest temperature (three measurements for each heater, and the average value of the temperature differences in the obtained data) was determined.
As a result, the temperature difference of Example 15 was 10.7 ° C. On the other hand, the temperature difference of Example 16 was 11.5 ° C. That is, it can be seen that the soaking layer 132 of the heater of Example 16 exhibits the same level of soaking action, although the area ratio is 60% with respect to Example 15. Specifically, the soaking layer 132 of the heater of Example 15 has a soaking effect of 0.11 ° C. per 1% of area ratio, while the soaking layer 132 of the heater of Example 16 has an area The soaking effect per percentage of 1% is 0.19 ° C., and it can be seen that the soaking can be efficiently performed with less material. From this result, it can be seen that a higher soaking effect can be obtained by forming the missing portion 133X and optimizing the planar shape.

  In addition, since the heat equalizing layer 13 of the heater of each Example and comparative example which were mentioned above is baking and forming the applied silver paste, the metal porous part 135a in which several metal particles were formed in a row was formed. And a nonmetal portion 135b disposed in the gap between the metal porous portions (see (a) and (b) in FIG. 16). Among them, the metal porous portion 135a has a form in which silver particles are connected, and specifically, takes the form of FIG. 16 (b). On the other hand, the nonmetal portion 135b is formed of glass.

  In the present invention, the present invention is not limited to the specific embodiment described above, and can be variously modified within the scope of the present invention according to the purpose and application.

Further, the present invention includes the following inventions.
(1) A heater whose main point is that the material constituting the substrate is stainless steel.
(2) A heater whose main point is that the surface on the other surface side of the substrate is the opposite surface to the object to be heated (3) The material constituting the heat equalizing layer is silver, copper, aluminum, and A heater, wherein the heater is selected from among alloys containing at least one of the following.
(4) the thickness of the heat equalizing layer is _{D 1,} if the thickness of the substrate was set to _{D 2,} the ratio _D 1 / _{D 2} of the _{D 1} and _{D 2} is summarized in that 0.6 or less And a heater.
(5) The heat generating layer includes a plurality of resistance heating cells electrically connected in parallel;
Each resistance heating cell is a resistance heating wire formed by connecting a plurality of horizontal wiring portions arranged substantially perpendicular to the sweep direction and a vertical wiring portion connecting the horizontal wiring portions and formed in a serpentine shape. A heater whose main point is a certain thing.
(6) A heater whose main point is that the horizontal wiring portion is longer than the vertical wiring portion.
(7) A heater whose main point is that the vertical wiring is inclined with respect to the sweep direction.
(8) Each resistance heating wiring which comprises each resistance heating cell is a heater which has a positive resistance heating coefficient.

1; heater, 1a; one surface of the heater, 1b; the other surface of the heater (heating surface),
11; base 11a; one side of base 11b; other side of base
12; heating layer, 121; resistance heating wire, 122; horizontal wiring portion, 123; vertical wiring portion, 124; resistance heating cell, 125; non-forming portion,
13; Soaking layer, 131; Direct lamination type soaking layer, 132; Indirect lamination type soaking layer,
133X; Missing part, 133H; Through hole, 133S; Notch,
135a; porous metal portion, 135b; non-metallic portion,
14, 141, 142, 143; insulating layer (glass glaze layer),
2; heating object,
4; image forming apparatus, 41: laser scanner, 42: mirror, 43: charging device, 44: photosensitive drum, 45: developing device, 46: transfer drum, 47: transfer roll,
5: fixing device (fixing means) 51: fixing roller 52: pressure roller 53: heater holder 54: pressure roller
P: Recording medium,
D ₁ : sweep direction, D ₂ : width direction.

Claims (17)

A heater which sweeps at least one of the object to be heated and the main heater to heat the object to be heated while facing the object to be heated,
A thin plate-like substrate made of metal,
A heat generating layer disposed on one side of the substrate;
A heat equalizing layer which is disposed on at least one of the layer between the base and the heat generating layer, and the other side of the base and which is formed of a material having a thermal conductivity higher than that of the material constituting the base ,
An insulating layer comprising a glass glaze layer formed between the heat generating layer and the substrate or the heat equalizing layer;
A glass glaze layer formed on the front side and the back side of the substrate ,
The heat equalizing layer has a metal porous portion in which metal particles are formed in a row, and a nonmetal portion disposed in a gap between the metal porous portions, and the nonmetal portion is formed of a glass component. It is characterized by   The heater according to claim 1, further comprising a direct-stacking uniform heating layer directly laminated on the substrate as the uniform heating layer. The heater according to claim 1 or 2 , further comprising an indirect laminated type heat equalizing layer laminated via the glass glaze layer between the substrate and the substrate as the heat equalizing layer. The heat equalizing layer has a notch including a notch or a through hole penetrating from the front to the back;
The layer according to any one of claims 1 to 3 , wherein a layer adjacent to one surface side of the heat spreader layer and a layer adjacent to the other surface side of the heat spreader layer are joined via the missing portion. Heater. A heater which sweeps at least one of the object to be heated and the main heater to heat the object to be heated while facing the object to be heated,
A thin plate-like substrate made of metal,
A heat generating layer disposed on one side of the substrate;
A heat equalizing layer which is disposed on at least one of the layer between the base and the heat generating layer, and the other side of the base and which is formed of a material having a thermal conductivity higher than that of the material constituting the base ,
An insulating layer comprising a glass glaze layer formed between the heat generating layer and the substrate or the heat equalizing layer;
A glass glaze layer formed on the front side and the back side of the substrate,
As the heat equalizing layer, it is characterized in that it has an indirectly laminated heat equalizing layer laminated via the glass glaze layer between the substrate and the substrate. The heat equalizing layer has a metal porous portion in which metal particles are continuously formed, and a non-metal portion disposed in a gap between the metal porous portions, and the non-metal portion is formed of a glass component. The heater according to item 5. The heater according to claim 5 or 6, wherein the heater has a direct-stacking type soaking layer directly laminated on the substrate as the soaking layer. The heat equalizing layer has a notch including a notch or a through hole penetrating from the front to the back;
The layer according to any one of claims 5 to 7, wherein a layer adjacent to one surface side of the heat spreader layer and a layer adjacent to the other surface side of the heat spreader layer are joined via the missing portion. Heater. A heater which sweeps at least one of the object to be heated and the main heater to heat the object to be heated while facing the object to be heated,
A thin plate-like substrate made of metal,
A heat generating layer disposed on one side of the substrate;
A heat equalizing layer which is disposed on at least one of the layer between the base and the heat generating layer, and the other side of the base and which is formed of a material having a thermal conductivity higher than that of the material constituting the base ,
An insulating layer comprising a glass glaze layer formed between the heat generating layer and the substrate or the heat equalizing layer;
A glass glaze layer formed on the front side and the back side of the substrate,
The heat equalizing layer has a notch including a notch or a through hole penetrating from the front to the back;
The layer adjacent to the one surface side of the heat equalizing layer and the layer adjacent to the other surface side of the heat equalizing layer are joined via the missing portion. The heat equalizing layer has a metal porous portion in which metal particles are continuously formed, and a non-metal portion disposed in a gap between the metal porous portions, and the non-metal portion is formed of a glass component. Item 10. The heater according to item 9. The heater according to claim 9 or 10, wherein the heater has a direct-stacking type soaking layer directly laminated on the substrate as the soaking layer. The heater according to any one of claims 9 to 11, further comprising, as the heat equalizing layer, an indirectly laminated heat equalizing layer laminated between the substrate and the substrate via a glass glaze layer. The heat generating layer includes a plurality of resistance heat generating cells arranged in a direction perpendicular to the sweep direction and electrically connected in parallel.
In each of the resistance heating cells, a plurality of horizontal wiring portions disposed substantially perpendicular to the sweep direction and vertical wiring portions connecting the horizontal wiring portions are connected to form a serpentine resistance. Has a heating wire,
The heater according to any one of claims 1 to 12 , further comprising a non-formed portion in which the resistive heating wire is not formed between the resistive heating cells adjacent to each other. The heater according to any one of claims 1 to 13 , wherein the heat equalizing layer has a thickness of 3 μm to 60 μm. A fixing device comprising the heater according to any one of claims 1 to 14 . An image forming apparatus comprising the heater according to any one of claims 1 to 14 . A heating device comprising the heater according to any one of claims 1 to 14 .

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