TW201740227A - Heater and fixing device equipped with same, image forming device, and heating device - Google Patents

Abstract

Provided is a heater 1 that heats an object to be heated, in a state in which the heater is facing the object to be heated, by sweeping the object to be heated and/or the heater, wherein the heater comprises: a base 11; a heat generating layer 12 that is disposed on one surface 11a side of the base 11; and a heat equalizing layer 13 that is disposed in a space between the base 11 and the heat generating layer 12 and/or on the other surface 11b side of the base 11, and that is formed of a material having a higher thermal conductivity than the material that constitutes the base 11. Due to this configuration, fluctuations in heat caused by the heat generating layer are unlikely to influence a heating surface, and thus the heater achieves excellent heat uniformity. Further provided are a fixing device equipped with the heater, an image forming device, and a heating device.

Description

Heater and fixing device therewith, image forming device and heating device

The present invention relates to a heater, a fixing device including the same, an image forming device, and a heating device. Specifically, a heater having excellent heat balance and a fixing device, an image forming apparatus, and a heating device provided therewith are provided.

As a heating means for performing heat treatment of the object, there is known a heater which is used to form a thin substrate and to provide a heat generating layer which is energized and heated on one surface thereof. Since such a heater can be formed into a small size, it is used, for example, in a photocopier or a printer to fix toner or ink on a recording medium, or to be assembled in a dryer to make a panel or the like. The object to be treated is used for the purpose of uniform heating and drying. Such a heater is disclosed in Patent Document 1 below.

[Previous Technical Literature] [Patent Document]

[Patent Document 1] International Publication No. 2013/073276

In such a heater, by utilizing a thin substrate to be formed, power can be saved and fast rising characteristics can be obtained. Further, when a thin substrate is used, there is a problem that heat generation due to a pattern shape or the like of the heat generating layer provided on one surface thereof is likely to occur on the heating surface. Moreover, recently, heaters that are smaller than before have been required, and in particular, heaters that are wider than the sweep direction are required. Such a narrowing in the direction of the sweeping is involved in more prominently reflecting the fluctuation of heat caused by the pattern of the heat generating layer toward the heating surface, and countermeasures are necessary.

The present invention has been made in view of the above-described problems, and an object thereof is to provide a heater which is difficult to be reflected on a heating surface due to heat fluctuations caused by a heat generating layer, and which is excellent in heat uniformity, and a fixing device, an image forming apparatus, and a heating device including the same .

The present invention is as follows.

The heater according to claim 1 is configured to wash one of the object to be heated and the main heater while facing the surface of the object to be heated, and to heat the object to be heated. The heater has a base body and heat. a layer provided on one side of the substrate; and a heat equalizing layer disposed between the layer of the substrate and the heat generating layer and at least one of the other side of the substrate, wherein the thermal conductivity is greater than the composition The material of the material of the above substrate is formed.

The heater according to claim 2, wherein the heater according to claim 1 is a soaking layer, and has a direct laminated layer soaking layer directly laminated on the substrate.

The heater according to claim 3 is characterized in that, in the heater according to claim 1 or 2, the heat-generating layer has a layer in which a glass glaze layer is interposed between the layers and the layer. The soaking layer.

The heater according to claim 4, wherein the heater according to any one of claims 1 to 3 is characterized in that the heat equalizing layer has a slit including a through hole or a through hole penetrating through the front and back. The layer adjacent to the one surface side of the heat equalizing layer is joined to the layer adjacent to the other surface side of the heat equalizing layer via the missing portion.

The heater according to any one of claims 1 to 4, wherein the heat-receiving layer has a plurality of metal particles in which a plurality of metal particles are connected to each other, and is A non-metallic portion disposed in a gap between the metal porous portions.

The heater according to any one of claims 1 to 5, wherein the heat generating layer includes a plurality of resistance heat generating units electrically connected in parallel, and each of the resistors generates heat. The unit has a resistance heating wiring that is connected to a plurality of lateral wiring portions that are arranged to be perpendicular to the scanning direction, and a vertical wiring portion that connects the lateral wiring portions to form a hairpin bent shape, adjacent to each other The resistance heat generating units have a non-formed portion in which the resistance heating wiring is not formed.

The purpose of the fixing device described in claim 7 is as claimed in claim 1 The heater described in any one of the six.

The image forming apparatus according to claim 8 is characterized in that the heater according to any one of claims 1 to 6 is provided.

The heating device described in claim 9 is characterized in that the heater according to any one of claims 1 to 6 is provided.

According to the heater of the present invention, it is possible to make the heater which is caused by the heat generated by the heat generating layer difficult to be reflected on the heating surface and which is excellent in heat uniformity.

As the soaking layer, in the case of having a direct laminated type soaking layer directly laminated on the substrate, it is possible to obtain more excellent heat uniformity than when the soaking layer is not provided.

In the case where the heat absorbing layer has a layered type heat absorbing layer between the glass glaze layer and the substrate, it is possible to obtain more uniform heat absorbing properties than when the heat absorbing layer is not provided. .

1‧‧‧heater

1a‧‧‧ one side of the heater

1b‧‧‧The other side of the heater (heating surface)

11‧‧‧ base

11a‧‧‧One side of the substrate

11b‧‧‧The other side of the substrate

12‧‧‧heat layer

121‧‧‧Resistive heating wiring

122‧‧‧ transverse wiring department

123‧‧‧Vertical wiring department

124‧‧‧Resistance heating unit

125‧‧‧ Non-formation department

13‧‧‧Homothermal layer

131‧‧‧Directly layered soaking layer

132‧‧‧Indirect laminated type soaking layer

133X‧‧‧ Missing Department

133H‧‧‧through hole

133S‧‧‧ incision

135a‧‧Metal porous part

135b‧‧‧Non-Metal Department

14,141,142,143‧‧‧Insulation (glass glaze)

2‧‧‧heated objects

4‧‧‧Portrait forming device

41‧‧‧Laser scanner

42‧‧‧Mirror

43‧‧‧Powered devices

44‧‧‧Photosensitive roller

45‧‧‧Densor

46‧‧‧Transfer roller

47‧‧‧Transfer roller

5‧‧‧Fixing device (fixing device)

51‧‧‧Fixing roller

52‧‧‧Pressure roller

53‧‧‧heater holder

54‧‧‧Pressure roller

P‧‧‧recording media

D ₁ ‧‧‧Sweeping direction

D ₂ ‧‧‧width direction

Fig. 1 is a schematic cross-sectional view showing an example of a form of a main heater (Example 1).

Fig. 2 is a schematic cross-sectional view showing another example (Example 2) of the type of the main heater.

Figure 3 is a view showing another example of the type of the main heater (Embodiment 3) Schematic cross-sectional view.

Fig. 4 is a schematic cross-sectional view showing another example (Example 4) of the type of the main heater.

Fig. 5 is a schematic cross-sectional view showing another example (Example 7) of the type of the main heater.

Fig. 6 is a schematic cross-sectional view showing another example (Example 8) of the type of the main heater.

Fig. 7 is a schematic cross-sectional view showing another example of the form of the main heater.

Fig. 8 is a schematic plan view illustrating the correlation of the heat generating layer and the soaking layer in the main heater.

Fig. 9 is an explanatory view for explaining a missing portion of an example of a soaking layer in the main heater.

Fig. 10 is a schematic perspective view showing an example of a fixing device using a main heater.

Fig. 11 is a schematic perspective view showing another example of a fixing device using a main heater.

Fig. 12 is a schematic view showing an example of an image forming apparatus using a main heater.

Fig. 13 is a graph showing the soaking effect caused by the heaters of Examples 1 to 4.

Fig. 14 is a graph showing the soaking effect caused by the heaters of Examples 5 to 9.

Fig. 15 is a schematic view showing a conventional heater (Comparative Example 1) Sectional view.

Fig. 16 is an explanatory view schematically showing a porous metal portion and a non-metallic portion in a heat equalizing layer.

Fig. 17 is an explanatory view showing various changes in the planar shape of the heat equalizing layer.

Fig. 18 is a graph showing the soaking effect caused by the heaters of Examples 5 to 14.

Hereinafter, the present invention will be described in detail with reference to the drawings.

[1]heater

The main heater (1) is a heater that sweeps at least one of the object to be heated and the main heater (1) while heating the object to be heated in a state of facing the object to be heated.

Further, the main heater (1) includes a base body (11), a heat generating layer (12) disposed on one side (11a) side of the base body (11), and a layer between the disposed base body (11) and the heat generating layer (12), and At least one of the other side (11b) side of the substrate, and a heat equalizing layer (13) formed by a material having a thermal conductivity higher than that of the material constituting the substrate (see FIGS. 1 to 4).

(1) for the substrate

The above "base (11)" is a substrate indicating a heat generating layer. The base body 11 is generally in the form of a thin plate, and the main faces of the front and back sides thereof are in this specification. Set to one side (11a) and the other side (11b). That is, one side 11a and the other side 11b are mutually opposite surfaces.

The material constituting the base 11 is not particularly limited, and the heat generating layer may be heated on the surface thereof, and is not particularly limited. For example, metals, ceramics, composite materials, and the like can be utilized. In the case of using a conductive material such as metal, the substrate may be formed by providing an insulating layer on the conductive material.

Among the materials constituting the substrate, steel or the like can be given as the metal. Even in this case, stainless steel can be suitably used in the present invention. The type of stainless steel is not particularly limited, and ferrite-based stainless steel and ferrite-based iron-based stainless steel are preferred. Further, even among these stainless steels, a variety excellent in heat resistance and oxidation resistance is preferable. For example, SUS430, SUS436, SUS444, SUS316L, etc. are mentioned. These may be used alone or in combination of two or more.

Further, as the metal constituting the substrate, aluminum, magnesium, copper, and an alloy of these metals can be used. These may be used alone or in combination of two or more. Among them, since aluminum, magnesium, and these alloys (aluminum alloy, magnesium alloy, Al-Mg alloy, etc.) have a small specific gravity, these can be used to reduce the weight of the main heater. Further, since copper and its alloys are excellent in thermal conductivity, it is possible to improve the soaking property of the main heater by using these.

Examples of the material constituting the substrate include alumina, aluminum nitride, zirconium oxide, cerium oxide, mullite, spinel, cordierite, tantalum nitride, and the like. These may be used alone or in combination of two or more. Among these, alumina and aluminum nitride are preferred. again As a composite material of a metal and a ceramic, SiC / C, or SiC / Al etc. are mentioned. These may be used alone or in combination of two or more.

Although the size or shape of the base 11 is not particularly limited, the thickness thereof may be set to 50 μm or more and 700 μm or less. In this range, it is especially possible to achieve power saving while fast rising characteristics. The thickness is preferably 100 μm or more and 600 μm or less, more preferably 150 μm or more and 500 μm or less, still more preferably 180 μm or more and 450 μm or less, and particularly preferably 200 μm or more and 400 μm or less.

Further, the shape of the base body is preferably a shape in which the length in the width direction (D ₂ ) is longer than the length in the sweep direction (D ₁ ). Accordingly, the effects of the constitution of the present invention can be easily obtained. Specifically, for example, when the length of the sweep direction (D ₁ ) of the substrate is L _D1 and the length of the width direction (D ₂ ) of the substrate is L _D2 , the ratio of lengths (L _D1 /L _{D2 )} ) can be set to 0.001 or more and 0.25 or less. The ratio is preferably 0.005 or more and 0.2 or less, more preferably 0.01 or more and 0.15 or less.

(2) for the heat layer

The "heat generating layer (12)" is disposed on the side of the one surface 11a of the base 11 by a layer that is electrically heated. The heat generating layer 12 is usually disposed only on the side of the one surface 11a of the base 11, but may be disposed on the side of the other surface 11b.

The specific shape and the like of the heat generating layer 12 are not particularly limited. For example, even a heat-generating sheet of the same thickness can be set even if it has A series of resistance heating wires of a specific pattern shape may also be used. In the present invention, it is preferable that the heat generating layer of the above-described type is provided with a resistance heating wiring including a plurality of resistance heat generating units electrically connected in parallel.

More specifically, each of the resistance heat generating units is connected to a horizontal wiring portion (122) that is disposed to be substantially perpendicular to the sweep direction (D ₁ ), and a vertical wiring portion that is connected between the lateral wiring portions (122). (123) It is preferable that the resistance heating wiring (121) having a hairpin curved shape is formed (see Fig. 8).

In the case where the resistance heating wire 121 having such a hairpin shape is patterned, the horizontal wiring portion 122 may be shorter than the vertical wiring portion 123, but the horizontal wiring portion 122 is preferably longer than the vertical wiring portion 123. Accordingly, the effect of the constitution of the present invention can be easily obtained. In other words, in the case of a plurality of resistance heat generating units electrically connected in parallel, there is a case where heat is generated between the respective resistance heat generating units, and it is effective for soaking. Similarly, even in the case of the vertical wiring portion 123 disposed along the sweeping direction (D ₁ ), the heat accumulation caused by the vertical wiring portion 123 tends to be large, and it is effective for soaking the heat. .

From such a viewpoint, in the case where the vertical wiring portion 123 is provided, the vertical wiring 123 is preferably inclined in the sweep direction (D ₁ ). By tilting, it is possible to diffuse heat accumulation caused by one vertical wiring portion 123, and it is possible to obtain a homogenization effect. Specifically, when it is set to be 0 degrees with respect to the scanning direction (D ₁ ), it is set to be not inclined, and in the case of inclination, it may be set to be - with respect to the sweep direction (D ₁ ) The range of 80 degrees or more and 80 degrees or less is preferably -60 degrees or more and 60 degrees or less, and more preferably -50 degrees or more and 50 degrees or less.

Between each of the above-described resistance heat generating units, the heat is lowered in the resistance heating wiring having the plurality of resistance heat generating units 124 electrically connected in parallel, and the adjacent resistance heat generating units 124 do not form a resistance heating wiring therebetween. The non-formed portion 125 (particularly, a non-formed portion that intersects with respect to the sweeping direction) is remarkable. In the resistance heating wiring having such a non-formation portion 125, the soaking action by the heat equalizing layer 13 can be more effectively obtained. 8(a) to (d) are exemplified as the type of the resistance heating unit 124 (resistance heating wiring 121) or the type of the non-forming portion 125.

In addition, the resistance heating material constituting the heat generating layer may be a material that can generate heat in response to the electric resistance value, and the type thereof is not particularly limited. For example, silver, copper, gold, platinum, palladium, rhodium, tungsten, molybdenum, rhenium (Re), rhodium (Ru), or the like can be used. These may be used alone or in combination of two or more. When two or more types are used together, it can be set as an alloy. More specifically, a silver-palladium alloy, a silver-platinum alloy, a platinum-ruthenium alloy, silver-ruthenium, silver, copper, gold, or the like can be used.

In the case where the resistance heating wiring including the plurality of resistance heat generating units electrically connected in parallel is provided as described above, each of the resistance heating wires constituting each of the resistance heat generating units may have a resistance heating characteristic. However, it is preferable to have a self-temperature balance effect (self-temperature supplementation effect) between the respective resistance heating units. From the viewpoint, the resistance heating wiring constituting the resistance heating unit is preferably formed of a resistance heating material having a positive resistance heating coefficient. Specifically, the temperature coefficient of resistance at a temperature range of -200 ° C or more and 1000 ° C or less is 100 ppm / ° C A resistance heating material of 4400 ppm/° C. or less is preferable, and a resistance heating material of 300 ppm/° C. or more and 3700 ppm/° C. or less is more preferable, and a resistance heating material of 500 ppm/° C. or more and 3000 ppm/° C. or less is particularly preferable. As such a resistance heat generating material, a silver-based alloy such as a silver-palladium alloy can be mentioned.

In this way, the resistance heating wiring formed by using the resistance heating material having a positive temperature coefficient of resistance forms a resistance heating unit, and in the case where each of the plurality of resistance heating units is connected in parallel, the plurality of resistance heating units achieve their own temperature equalization. In other words, for example, when the first resistance heat generating unit and the third resistance heat generating unit are provided with the second resistance heat generating unit, when the temperature of the second resistance heat generating unit drops, the resistance value of the second resistance heat generating unit decline. As a result, the current flowing into the second resistance heat generating unit increases, and the wattage increases, and the second resistance heat generating unit can operate to self-regulate the temperature drop.

When the respective resistance heat generating units are substantially the same amount of heat generation, it is sufficient that each of the resistance heat generating units has substantially the same resistance value. In this case, the resistance heat generating unit can be formed in the same pattern of the resistance heating wiring with the same line length, the same line width, and the same thickness. The thickness of the resistance heating wiring can be, for example, 3 μm or more and 40 μm or less from the viewpoint of the area specific resistance.

In addition, substantially having the same amount of heat generation means that each of the resistance heat generating units has substantially the same temperature coefficient of resistance and resistance value under the same measurement conditions. For example, the difference in the temperature coefficient of resistance between the resistance heating units can be set to within ±20%, and the electricity between the resistance heating units The difference in resistance is set to within ±10%.

(3) for the insulation layer

Further, as described above, in the case where a conductive material is used as the base 11, insulation between the base 11 and the heat generating layer 12 is required. That is, an insulating layer (14) may be provided. The insulating layer 14 may have an insulating property capable of insulating the base 11 and the heat generating layer 12 formed of a conductive material, and does not limit the specific material and shape.

As the insulating layer 14, a glass glaze layer or a ceramic layer can be used. Among these, a glass glaze layer is preferred from the viewpoint of workability. The glass constituting the glass glaze layer may be amorphous, and may be a semi-crystallized glass even if it is a crystallized glass. Specifically, SiO ₂ -Al ₂ O ₃ -MO-based glass can be mentioned. Here, MO is an oxide of an alkaline earth metal (MgO, CaO, BaO, SrO, etc.).

Further, the insulating layer 14 may have only one layer between the substrate 11 and the heat generating layer 12, for example, even if it has two or more layers. In the case of two or more layers, the case where the insulating layer 14 of a different material is provided is mentioned.

Further, the thickness of the insulating layer 14 is not particularly limited, and may be, for example, 10 μm or more and 400 μm or less. In particular, in the case where the base 11 is formed of a conductive material (stainless steel or the like), the insulating layer 14 is responsible for the insulation of the base 11 and the heat generating layer 12. In this case, the thickness of the insulating layer 14 between the substrate 11 and the heat generating layer 12 to be disposed (in the case where the insulating layer 14 of two or more different materials is interposed, the total thickness of the insulating layers 14) More preferably, it is 20 μm or more and 300 μm or less, and is 30 μm or more. It is more preferably 200 μm or less, and particularly preferably 40 μm or more and 100 μm or less.

Further, for example, in FIG. 1, the insulating layer 14 disposed between the base 11 and the heat generating layer 12 is an insulating layer 141. Therefore, the above thickness can be applied to the thickness of the insulating layer 141.

In addition, in the use of the glass glaze layer for the purpose of not insulating, the thickness of the glass glaze layer (the thickness of the entire glass glaze layer which is integrated by sintering without interposing another layer) may be, for example, 1 μm or more. Below 500μm. The thickness is preferably 2 μm or more and 400 μm or less, more preferably 3 μm or more and 300 μm or less, and particularly preferably 4 μm or more and 200 μm or less. Specifically, for example, in FIG. 1, the heat-generating layer 12, the glass glaze layers 142 and 143 disposed on the one surface 1a side of the heater are glass glaze layers not intended for insulation. Further, in Fig. 1, the glass glaze layers 141, 142, and 143 disposed on the other surface 1b side of the heater are the glass glaze layers for the purpose of insulation.

(4) For the soaking layer

The "soaking layer (13)" is disposed between the layers of the substrate 11 and the heat generating layer 12 and at least one of the other surfaces 11b of the substrate, and is formed of a material having a thermal conductivity higher than that of the material constituting the substrate 11. Layer.

The soaking layer 13 has a function of uniformizing the undulation of heat formed in the heat generating layer 12. That is, in the case where the heating temperature is lowered, the temperature can be raised to the same temperature as the surrounding temperature, and if it has the protrusion of the heating temperature, the temperature can be lowered to the same temperature as the surrounding area, and the thermal fluctuation can be made. uniform. In particular, in the case where the heat generating layer 12 is formed using a resistance heating wiring having a specific pattern shape, it is suitable for making the fluctuation of heat generated by the pattern shape uniform. In other words, by having a pattern shape, a portion where the resistance heating wiring exists and a portion where the resistance is not generated are formed, and the temperature at which the portion where the resistance heat is generated is higher than the portion where the heat is not present is generated. Such a hot undulation can be reduced by the uniformity of the soaking layer 13 to narrow the temperature difference. From such a viewpoint, the heat equalizing layer 13 is provided, and the heat generating layer 12 has an effect in a heater including a plurality of resistance heat generating units 121 electrically connected in parallel.

Therefore, the heat equalizing layer 13 is disposed at least between at least one of the layers of the base 11 and the heat generating layer 12 and the other surface 11b side of the base 11 (below the surface side of the object to be heated). That is, it is disposed on the side of the heat generating layer 12 and close to the heating surface (the surface to be joined to the object to be heated). In addition, it is of course also possible to incorporate the side of the heat generating layer 12 which is close to the non-heating surface (the surface which is not in contact with the object to be heated).

The heat equalizing layer 13 may be formed by a material having a thermal conductivity higher than that of the material constituting the substrate 11. Specifically, for example, when a low thermal conductivity stainless steel having a thermal conductivity of 50 W/mK or less is used as the substrate 11, it is preferable to use a material having a thermal conductivity of 100 W/mK or more as the material of the soaking layer 13. . Specifically, silver, copper, gold, aluminum, tungsten, nickel, or the like, or an alloy containing at least one of these metals may be used as the heat conductive metal. These heat conductive metals may be used alone or in combination of two or more. Among these, silver, copper, aluminum, and an alloy containing at least one of these are preferable.

In the case where the ceramic having low thermal conductivity such as aluminum having a thermal conductivity of 50 W/mK or less is used as the substrate 11, a material having a thermal conductivity of 100 W/mK or more is regarded as the soaking layer 13 The material is preferably used. Specifically, in addition to the heat conductive ceramic such as aluminum nitride, various heat conductive metals described above can be used.

It is also possible to form the soaking layer 13 even if it is formed. Specifically, the soaking layer 13 may be provided as a plating layer (electroless plating layer, electric field plating layer, composite plating layer or the like). Further, after printing the paste containing the thermally conductive material, the soaking layer 13 can be formed by sintering the printed coating film. For example, as the thermally conductive material, a printing paste containing metal particles (metal powder) can be used. In this case, the printing paste may contain, in addition to the metal particles, a carrier for the paste, or a glass component or a ceramic component of the same texture.

The soaking layer 13 obtained by sintering such a printing paste can, for example, be obtained by a metal porous portion 135a having a plurality of metal particles shown in Figs. 16(a) and 16(b) connected thereto, and arranged in The soaking layer 13 of the non-metallic portion 135b of the gap of the metal porous portion 135a. Further, in Fig. 16, Fig. 16(a) shows a metal porous portion 135a in which a plurality of metal particles are joined to each other, and Fig. 16(b) shows a porous metal portion in which a plurality of metal particles are mutually fused by sintering. 135a. In the heater 1 of the present invention, even though the heat equalizing layer 13 may be in the form of FIG. 16(a), even if it is in the form of FIG. 16(b), even if it is compositely provided, both of them may be combined. The pattern is also acceptable, but it is preferably in the form of Fig. 16(b). That is, the soaking layer 13 has a plurality of metal particles It is preferable that the metal porous portions 135a are joined to each other and joined together. In this type, higher heat transfer can be achieved.

Further, the non-metal portion 135b is formed by a glass component or a ceramic component (including ceramics and glass ceramics). That is, in the case where the heat equalizing layer 13 in the heater 1 of the present invention has the non-metal portion 135b, the non-metal portion 135b may be composed only of glass, glass, or ceramic.

In the case where the metal porous portion 135a and the non-metal portion 135b are provided, the total amount is 100% by mass (in particular, when the metal porous portion 135a is silver and the non-metal portion 135b is glass), the non-metal portion 135b The ratio is not particularly limited, but is preferably 0.1% by mass or more. By having such a non-metallic portion 135b, the soaking layer 13 can be interposed, and excellent uniformity can be obtained while improving the adhesion between the adjacent layer on one side and the adjacent layer on the other side. Further, the non-metal portion 135b is usually preferably 20% by mass or less. The ratio is preferably 0.2% by mass or more and 15% by mass or less, more preferably 0.5% by mass or more and 12% by mass or less.

As described above, the heat equalizing layer 13 may be disposed between at least one of the layers of the base 11 and the heat generating layer 12 and the other side of the base 11b. Therefore, as the soaking layer 13, for example, a direct lamination type soaking layer (131) of the following (1) and two types of the soaking layer type soaking layer (132) between the following (2) can be obtained. .

(1) The direct laminated type soaking layer 131 is a soaking layer 13 directly laminated on the base 11. The direct laminated type soaking layer 131 does not cause other layers such as the insulating layer 14 to be interposed between the layers of the substrate 11 and the soaking layer 13 Floor.

(2) The indirect laminated type soaking layer 132 is formed by laminating other layers between the substrate 11 and the soaking layer 13. Specific examples of the other layer include a glass glaze layer (insulating layer 14).

The direct laminated type soaking layer 131 and the indirect laminated type soaking layer 132 may be provided in one heater, even if they have both of them.

The case of the direct laminated type soaking layer 131 may be a type provided only on one surface (11a) of the base 11, and only on the other side (11b) of the base 11, on one side of the base 11 (11a) ) and the type on both sides of the other side (11b). Among these, it is preferable that the shape is provided only on one surface (11a) of the base 11 or on both sides of the one surface (11a) and the other surface (11b) of the base 11.

Although the layer thickness of the direct laminated type soaking layer 131 is not particularly limited, in the case where the thickness of the heat equalizing layer (13, 131) is D ₁ and the thickness of the substrate 11 is D ₂ , D The ratio D ₁ /D _{2 of 1} and D ₂ is preferably 0.6 or less. The ratio is more preferably 0.001 or more and 0.6 or less, more preferably 0.005 or more and 0.57 or less, still more preferably 0.008 or more and 0.53 or less, and still more preferably 0.01 or more and 0.50 or less. More specifically, the layer thickness of the direct laminated type soaking layer 131 is preferably 1 μm or more and 250 μm or less, more preferably 1 μm or more and 150 μm or less, still more preferably 2 μm or more and 120 μm or less, and still more preferably 3 μm or more and 60 μm or less. Preferably, it is particularly preferably 3 μm or more and 40 μm or less, and more preferably 3 μm or more and 30 μm or less.

Furthermore, in the above, in the type of both sides, even the direct product The layer-type soaking layers 131 may have the same thickness, and different thicknesses may be used. Further, even if they have the same shape (pattern shape or the like), they may be of different shapes.

In addition, as the inhomogeneous layer type soaking layer 132, a type which is provided only on one surface (11a) side of the base 11 and a type only on the other side (11b) side of the base 11 are provided in the base 11 The shape of the one side (11a) side and the other side (11b) on both sides. Among these, it is preferable that the type is provided only on one surface (11a) of the base 11. The heat storage layer 132 of the indirect buildup type has a lower heat equalization effect on the entire heater 1 caused by the other surface (11b) of the substrate 11 than the heat buildup layer 131 of the direct buildup type.

Although the layer thickness of the indirect laminated type soaking layer 132 is not particularly limited, in the case where the thickness of the soaking layer (13, 132) is D ₁ and the thickness of the substrate 11 is D ₂ , D The ratio D ₁ /D _{2 of 1} and D ₂ is preferably 0.6 or less. The ratio is more preferably 0.001 or more and 0.6 or less, more preferably 0.005 or more and 0.57 or less, still more preferably 0.008 or more and 0.53 or less, and still more preferably 0.01 or more and 0.50 or less. More specifically, the layer thickness of the indirect buildup type soaking layer 132 is preferably 1 μm or more and 250 μm or less, more preferably 1 μm or more and 150 μm or less, still more preferably 2 μm or more and 120 μm or less, and still more preferably 3 μm or more and 60 μm or less. Preferably, it is particularly preferably 3 μm or more and 40 μm or less, and more preferably 3 μm or more and 30 μm or less.

Further, the indirect laminated type soaking layer 132 may have any layer in one heater 1. In other words, even if it has one layer, it may be two or more layers. Usually, by having more layers The number can be higher, but the excessive increase in the number of layers of the indirect laminated type soaking layer 132 is not preferable from the viewpoint of thermal shock resistance of the heater 1 or warpage prevention. Therefore, it is preferably one layer or more and 10 layers or less, more preferably one layer or more and five layers or less, and more preferably one layer or more and three layers or less. When two or more layers of the inhomogeneous layer of the indirect layered type are provided, the respective soaking layers 13 may have the same thickness, and may have different thicknesses. Further, even if they have the same shape (pattern shape or the like), they may be of different shapes.

In particular, when the base 11 is a stainless steel base (a base made of stainless steel) having a thickness of 100 μm or more and 600 μm or less, the heat-generating layer 13 can be effectively suppressed by a total thickness of 60 μm or less (and 30 μm or less). It is possible to prevent the warpage of the entire heater and to utilize the layer thickness in a range in which the soaking action is excellent.

Further, from the viewpoint of the homogenization, it is easy to obtain an effect that the thickness of the heat equalizing layer 13 is thick, for example, in the case where the soaking layer 13 having a total thickness of more than 30 μm is provided on the other surface 11b side of the base 11 On the side of one surface 11a of the base 11 (particularly, between the layers of the base 11 and the heat generating layer 12), the soaking layer 13 of the same thickness is disposed symmetrically to prevent warpage of the entire heater. Further, when it is difficult to provide the heat equalizing layer 13 having the same thickness, the total thickness of the heat equalizing layer 13 provided on the other surface 11b side of the base 11 is a thickness ratio of 25% or more and 95% or less. The soaking layer 13 is provided on the side of the one surface 11a of the base 11 (particularly, preferably between the layers of the base 11 and the heat generating layer 12), whereby the warpage of the entire heater can be sufficiently suppressed. The above thickness ratio is 30% or more and 92% or less are preferable, and 35% or more and 88% or less are more preferable, and 40% or more and 85% or less are particularly preferable (refer to Fig. 7).

Further, it is easy to obtain an effect that the thickness of the heat equalizing layer 13 is thicker, but even if the thickness is excessively increased, the soaking effect obtained with respect to the increase in thickness tends to be small. Therefore, for example, the stainless steel substrate having a thickness of 100 μm or more and 600 μm or less with respect to the base 11 is preferably 250 μm or less as described above.

In the main heater 1, when the direct laminated type heat equalizing layer 131 and the indirect laminated type soaking layer 132 are compared, there is a tendency that one of the direct laminated type soaking layers 131 exhibits high heat uniformity. Therefore, in the heater 1 of the present invention, it is preferable to provide the heat equalizing layer 131 having a direct laminated type.

Further, in the case where the main heater 1 includes the direct laminated type soaking layer 131 and the indirect laminated type soaking layer 132, the indirect laminated type is formed with respect to the direct laminated type soaking layer 131. The soaking layer 132 is preferably disposed on the side closer to the heating surface.

In particular, in the heater 1 (for example, a stainless steel substrate) in which a conductive material is used as a base material, the insulating base 11 and the heat generating layer 12 are required, and the insulating layer 14 is provided. The insulating layer 14 can be formed by a glass glaze. Further, in the case where such an insulating layer 14 is provided, since the arrangement and thickness of the front and back are uniform with respect to the base 11, the warpage of the entire heater 1 is prevented, so that even in the base 11 and the heat generating layer There is no insulation for the purpose of preventing warpage, and there are many cases where the insulating layer 14 is provided. Such an insulating layer 14 is usually a material having low thermal conductivity. The material, for example, the glass glaze has a thermal conductivity of 5 W/mK or less. Therefore, in the main heater 1, the soaking layer type soaking layer 132 is provided such that the soaking layer 13 is provided between the layers of the insulating layer 14 having low thermal conductivity (even if it is not intended for the purpose of insulating). It is better to obtain a soaking effect.

Further, as described above, the heat storage layer 132 of the indirect buildup type has a surface in which the glass glaze layer (insulating layer 14) covers the front surface and the back surface as the soaking layer 13, but in this case, In the inhomogeneous layer type soaking layer 132, a missing portion (133X) is provided (see FIGS. 8(a) and 9), and the glass glaze covering the surface of the indirect laminated type soaking layer 132 via the missing portion 133X is provided. The layer (insulating layer 14) is in a form of fusion with a glass glaze layer (insulating layer 14) covering the back surface of the inhomogeneous layer of the soaking layer 132. By merging the glass glaze layer on the front and back sides in this manner, the bondability between the layers of the heat concentrating layer 132 having the laminated layer type between the heaters 1 can be improved, and the thermal shock resistance and warpage prevention property of the heater 1 can be improved. .

The missing portion 133X may be a slit (133S) or a through hole (133H) penetrating the front and back (see FIGS. 8(a) and 9). These may be even if they have only one side, even if they have both sides. Further, in the case where the missing portion 133X is provided, it is preferable that the missing portion 133X is disposed where the thermal fluctuation is small. In other words, since the heat dissipation property of the portion is lower than that of the other portions by providing the missing portion 133X, it is preferable that the temperature difference between the heat generating layers 12 is small.

More specifically, in the case where the plurality of resistance heat generating units in which the heat generating layers 12 are electrically connected in parallel are provided, it is preferable to arrange the missing portions 133X between the respective resistance heat generating units (see FIG. 8( a )). In addition, the resistance heat generating unit has a plurality of horizontal wiring portions arranged to be slightly perpendicular to the sweep direction (D ₁ ), and a vertical wiring portion connecting the lateral wiring portions, and the horizontal wiring portion 122 and the vertical wiring portion 123 are connected. In the case where the hairpin-shaped resistive heat wiring 121 is formed, it is preferable to arrange the missing portion 133X so as to avoid the corresponding vertical wiring portion 123. In other words, when the heater 1 is viewed in a plan view, it is preferable that the projection image arranged in the vertical wiring portion 123 does not overlap with the projection image of the missing portion 133X (see FIG. 8(a)). Further, in other words, it is preferable that the projection image of the vertical wiring portion 123 overlaps with the actual portion of the heat equalizing layer 13.

Further, of course, the soaking layer 13 having the above-described missing portion 133X (including the slit 133S and the through hole 133H) is a direct laminated type soaking layer 131 or an indirect laminated type soaking layer 132, Even if the soaking layer 13 has an effect. In other words, when the heat equalizing layer 13 has the missing portion 133, the layer adjacent to the one surface side of the heat equalizing layer is joined via the notch portion 133, and the layer adjacent to the other surface side of the heat equalizing layer can be made higher. Durable heater 1. Specifically, in the case of the indirect laminated type soaking layer 132, as described above, the layer adjacent to one side of the soaking layer and the layer adjacent to the other side of the soaking layer are all glass glazes. The layers of the glass glaze are joined to each other. Further, in the case of the direct laminated type soaking layer 131, and the substrate 11 is a stainless steel substrate, the layer adjacent to one surface side of the soaking layer is a stainless steel substrate, and may be adjacent to the other side of the soaking layer. The layer is set to a glass glaze layer. In this case, the fastening of the stainless steel substrate and the glass glaze layer can be achieved.

In the main heater 1, the soaking layer 13 may be patterned (that is, the planar shape having the missing portion 133X) regardless of whether the soaking layer 13 is a direct laminated type soaking layer 131 or an indirect laminated type soaking layer 132. In particular, the soaking layer 13 can be configured in a discontinuous layer. For example, in a specific layer, the patch (one portion of the soaking layer 13) is disposed only at a large thermal undulation, and the small portion of the thermal undulation is a missing portion 133X (see FIG. 8(a)). Further, between the specific layers, the thickness of the soaking layer 13 where the thermal fluctuation is large can be increased, and the thickness of the soaking layer 13 where the thermal fluctuation is small can be made relatively thin.

Further, the specific shape of the heat equalizing layer 13 constituting the plan view shape of the missing portion 133X is not limited, and FIGS. 17(a) and 9(g) can be exemplified (FIG. 17(b) to (g) and the like (FIG. 17 (FIG. 17) a) exemplifies a planar shape that does not have the missing portion 133X).

In other words, Fig. 17(b) is a collection of the soaking layer 13 which is formed into a polka-like pattern, and forms a soaking layer 13, and has a continuous missing portion 133X as a soaking layer. The gap. Further, FIGS. 17(c) and 17(d) are patterned so that the area ratio of the area in the narrow width direction (sweep direction) is uniform. Here, FIG. 17(c) has a rectangular through hole 133H and a rectangular missing portion 133S as a missing portion 133X. In addition, FIG. 17(d) is a type in which the soaking layer 13 is formed of an aggregate of the soaking layer sheets each having a flattened shape, and has a missing portion 133X continuous with the gap of each of the soaking layers.

Further, any one of Figs. 17(e) to (g) forms a soaking layer by an aggregate of the soaking layer sheets which are individually formed into stripe shapes. The pattern of 13 has a corresponding stripe-shaped missing portion 133X as a gap between the respective soaked layers. Here, Fig. 17(e) is a stripe-shaped soaking layer 13 along the longitudinal direction (orthogonal to the sweep direction). Further, Fig. 17 (f) is a stripe-shaped heat equalizing layer 13 having a skewed trade width (inclination in the sweep direction) in the longitudinal direction in the longitudinal direction. Further, Fig. 17(g) is a stripe-shaped heat equalizing layer 13 along the width direction (and the longitudinal direction and along the sweeping direction). Further, in the stripe-shaped heat equalizing layer 13 as needed, it may be provided in the stripe width or the width of the missing portion 133X, and may be thick.

(5) For other layers

In the heater 1 of the present invention, in addition to the base 11, the heat generating layer 12, the heat equalizing layer 13, and the insulating layer 14, other layers may be provided. Examples of the other layer include an outer coating layer made of glazed glass and an outer coating layer (polyimine layer) made of a polyimide film, which melts at a high temperature or higher and can be cut to heat. The self-energizing cut-off layer of the layer 12 is energized (the technique described in JP-A-2002-359059). Among them, the above-mentioned overcoat layer can be utilized for the purpose of improving the durability (wear resistance) of the sliding surface or improving the cleanliness. These layers may be used alone or in combination of two or more.

(6) heating surface for the heater

In the present heater 1, the heating surface may be disposed on the side of the one surface 11a with respect to the base 11, and even if it is disposed on the side of the other surface 11b, Yes, even if it is placed on the sides of the two sides. That is, even if the surface to be heated is heated by using any surface, it is preferable that the surface on the other surface 11b side of the base 11 is the opposing surface of the object to be heated. In other words, it is preferable that the heat generating layer 12 has a surface on the opposite side to the base 11 and a facing surface of the object to be heated. In this way, by arranging the heating surface, it is possible to more easily obtain the soaking effect caused by the soaking layer 13.

Further, the base 11 may have a curved shape even if it has a flat plate shape. That is, in the state where the heating surface of the heater 1 and the object to be heated face each other, and the object to be heated and the heater are relatively swept to heat the object to be heated, the sweep direction (D ₁ ) of the substrate 11 is The cross-sectional shape may be an arc shape that is convex on the side opposite to the object to be heated centering on the axis orthogonal to the sweep direction (D ₁ ) (that is, the cylinder is cut in a plane parallel to the central axis) Or the shape of the cylinder). By having such a shape, the heater 1 can be attached to a cylindrical roller, and by rotating the roller, the object to be swept by the roller can be efficiently heated.

(7) For use

The heater 1 is incorporated in an image forming apparatus such as a printing machine, a photocopier, a facsimile machine, a fixing device, or the like, and can be used as a fixing heater that fixes toner, ink, or the like on a recording medium. Further, it can be used as a heating device that is assembled to a heating machine and uniformly heats (dry, sintered, etc.) a target object such as a panel. Others may be suitable for heat treatment of a metal product, heat treatment of a coating film formed on a substrate of various shapes, and coating. Specifically, a coating film for a flat display can be utilized (filter Heat treatment of coated materials, coated metal products, automotive related products, woodworking products, coating drying, electrostatic flocking followed by drying, heat treatment of plastic processed products, solder reflow of printed substrates, printing and drying of thick film integrated circuits Wait.

[2] Fixing device

The fixing device including the heater 1 can be appropriately selected by a heating target, a fixing means, or the like. For example, when a toner or the like is fixed to a recording medium such as paper, or a plurality of members are bonded together with a fixing means by pressure bonding, a heating unit having a heater and a pressing portion may be used. Fixing device. Of course, it is also possible to use a fixing means that is not accompanied by pressure bonding. In the present invention, it is preferable to fix the unfixed image of the carbon powder formed on the surface of the recording medium such as paper or film to the fixing device 5 for recording medium.

FIG. 10 shows an important part of the fixing device 5 that is disposed in the image forming apparatus of the electrophotographic system. The fixing device 5 includes a rotatable fixing roller 51 and a rotatable pressing roller 54 which is disposed inside the fixing roller 51. The heater 1 is desirably disposed close to the inner surface of the fixing roller 51.

The heater 1 can be fixed to the inside of the heater holder 53 composed of a material capable of conducting heat generated by the heater 1 like the fixing means 5 shown in Fig. 12, and can heat the heater 1. The structure is transmitted from the inner side of the fixing roller 51 to the outer surface.

Figure 11 also shows the image that is assigned to the electronic photo mode. An important part of the fixing device 5 forming the device. The fixing device 5 includes a rotatable fixing roller 51 and a rotatable pressing roller 54, and heat is transmitted to the heater 1 of the fixing roller 51, and the recording medium is pressure-bonded to the pressing roller 54 at the same time. The pressing roller 52 is disposed inside the fixing roller 51. The heater 1 is disposed along the cylindrical surface of the fixing roller 51.

In the fixing device 5 shown in FIG. 10 or FIG. 11, the heater 1 is heated by applying a voltage from a power supply device (not shown), and the heat is transmitted to the fixing roller 51. In addition, when the recording medium having the unfixed toner image on the surface is supplied between the fixing roller 51 and the pressure roller 54, the toner is fixed at the pressure contact portion between the fixing roller 51 and the pressure roller 54. Melt to form a fixed image. Since the crimping portion of the fixing roller 51 and the pressing roller 54 is provided, the rotation is accompanied. As described above, since the heater 1 is suppressed from being locally heated in temperature when a small recording medium is used, it is difficult to cause temperature unevenness in the fixing roller 51, and uniform fixing can be performed.

As another aspect of the fixing device including the main heater 1, a mold having an upper mold and a lower film may be used, and a heater may be disposed inside at least one of the upper mold and the lower mold.

The fixing device including the main heater 1 is an image forming apparatus such as a printer or a photocopier in the direction of an electronic photograph, and is installed in a household appliance, a business, an experimental precision machine, etc., and is used as heating, heat preservation, or the like. The heat source is better.

[3] Portrait forming device

The image forming device including the heater 1 can be set by heating Image or heating purpose, etc., are appropriately selected. In the present invention, as shown in FIG. 12, an image forming means for forming an unfixed image on the surface of a recording medium such as paper or film, and a fixing means 5 for fixing the unfixed image to the recording medium are provided. It is preferable that the fixing means 5 includes the image forming apparatus 4 of the main heater 1. The image forming apparatus 4 may be configured to include a recording medium transport means or a control means for controlling each means in addition to the above means.

FIG. 12 is a schematic view showing a main part of the image forming apparatus 4 of the electrophotographic system. The image forming means may be any one of a mode including a transfer roller and a mode without a transfer roller, and FIG. 12 is a view including a transfer roller.

In the image forming means, while rotating, the charged surface of the photosensitive drum 44 charged to a specific potential by the charging device 43 is irradiated onto the laser beam output from the laser scanner 41, and the image is imaged by the slave image. The toner is supplied to the toner 45 to form an electrostatic latent image. Next, the toner image is transferred on the surface of the transfer roller 46 that is linked to the photosensitive drum 44 by the potential difference. After that, the toner image is transferred onto the surface of the recording medium between the transfer roller 46 and the transfer roller 47, and a recording medium having an unfixed image can be obtained. The carbon powder contains particles of a binder resin and a colorant and an additive, and the melting temperature of the binder resin is usually from 90 ° C to 250 ° C. Further, a cleaning device for removing insoluble carbon powder or the like may be provided on the surfaces of the photosensitive drum 44 and the transfer roller 46.

The fixing device 5 can be configured similarly to the above-described fixing device 5, and includes a pressure roller 54 and a paper feed holder therein. The heater holder 53 of the heater 1 of the energization type is the fixing roller 51 that is interlocked with the pressure roller 54. The recording medium having the unfixed image from the image forming means is supplied between the fixing roller 51 and the pressing roller 54. The toner image of the medium for the heat of the fixing roller 51 is melted, and the molten carbon powder is pressurized at the pressure-bonding portion of the fixing roller 51 and the pressure roller 54, and the toner image is fixed to the recording medium. In the fixing device 5 of FIG. 12, a fixing belt disposed close to the heater 1 may be provided instead of the fixing roller 51.

In general, the temperature of the fixing roller 51 is uneven, and when the amount of heat supplied to the toner is too small, the carbon powder is peeled off from the recording medium, and when the amount of heat is too large, the toner adheres to the fixing. With the roller 51, the fixing roller 51 is attached to the recording medium one turn. When the fixing means 5 including the heater of the present invention is provided, it is quickly adjusted to a specific temperature, so that it is possible to suppress a problem.

In the image forming apparatus of the present invention, it is suitable to use an electrophotographic type printer or a photocopier to suppress excessive temperature rise in the non-feeding area.

[4] Heating device

The heating device including the heater can be appropriately selected by heating the size or shape of the object. In the present invention, for example, a frame portion, a window portion that can be sealed to be placed in and out of the heat-treated material, and a movable heater portion that is disposed inside the frame portion can be provided. If necessary, it is possible to provide a portion to be heat-treated by disposing the object to be heat-treated in the inside of the frame portion, and to discharge it by heating of the object to be heat-treated. In the case of a gas, a pressure adjusting unit such as a vacuum pump that discharges the exhaust portion of the gas or a pressure inside the frame portion is discharged. Further, the heating may be performed while the heat-treated material and the heater portion are fixed, and may be performed while moving either one.

The main heating device is suitable for drying a heat-treated material containing water or an organic solvent at a desired temperature. Further, it can be used as a vacuum dryer (pressure reducing dryer), a pressure dryer, a dehumidifying dryer, a hot air dryer, an explosion-proof dryer, and the like. Further, it is suitable as an apparatus for sintering an unsintered material such as an LCD panel or an organic EL panel at a desired temperature. Further, it can be used as a reduced pressure sintering machine, a pressure sintering machine or the like.

[Examples]

In the following, the invention will be described using examples.

[1] Production of heaters

The heaters of Examples 1 to 4 and Comparative Example 1 were produced by the following methods.

(1) Heater of Example 1 (refer to Fig. 1)

A stainless steel film (SUS430, thermal conductivity: 26 W/mK) having a thickness of 300 μm was used as the substrate 11.

On the surface of the other surface 11b side of the base 11, a silver paste was applied and then sintered to form a soaking layer 13 having a thickness of 8 μm (the direct laminated type soaking layer 131).

Next, the insulating glass paste is coated on the side 11a side of the substrate 11. After the surface and the surface of the soaking layer 13, sintering was performed to form a glass glaze layer (insulating layer 141) having a thickness of 75 μm.

Then, on the surface of the insulating layer 141 formed on the one surface 11a side of the substrate 11, the unsintered layer which is the heat generating layer 12 is formed by pattern printing, and then sintered to form the heat generating layer 12. The heat generating layer 12 includes Ag-Pd, and has a resistance heating line having a positive resistance heating coefficient, that is, a plurality of resistance heat generating units electrically connected in parallel, and each of the resistance heat generating unit links is arranged to be opposed to the sweep. The horizontal wiring portion having a plurality of vertical directions is formed, and the vertical wiring portion between the lateral wiring portions is formed to form a hairpin-shaped resistance heating wiring 121. In addition to the resistance heating wiring 121, the heat generating layer 12 has a power supply pad and a power supply wiring (not shown) for supplying power to the resistance heating wiring 121. The power supply pads and the power supply wiring are formed by screen printing and sintering before and after formation of the silver paste by the resistance heating wires 121.

After that, the insulating glass paste is applied to the surface of the insulating layer 141 exposed on the other surface 11b side of the substrate 11, and exposed to both surfaces of the insulating layer 141 and the heat generating layer 12 on the side 11a of the substrate 11, and then sintered. And a glass glaze layer (insulating layer 142) having a thickness of 50 μm was formed.

Next, the insulating glass paste is applied to the surface of the insulating layer 142 exposed on the one surface 11a side of the substrate 11, and the surface of the insulating layer 142 exposed on the other surface 11b side of the substrate 11 is sintered to form a glass having a thickness of 20 μm. In the glaze layer (insulating layer 143), the heater 1 of Example 1 (Fig. 1) was obtained.

(2) The heater of the second embodiment (refer to FIG. 2)

In the same manner as in Example 1, a stainless steel film having a thickness of 300 μm was used as the substrate 11.

On the surface of the one surface 11a side of the base 11, a silver paste was applied and then sintered to form a soaking layer 13 having a thickness of 8 μm (the direct laminated type soaking layer 131).

Next, the insulating glass paste was applied onto the surface of the other surface 11b side of the substrate 11, and the surface of the soaking layer 13, and then sintered to form a glass glaze layer (insulating layer 141) having a thickness of 75 μm.

Then, on the surface of the insulating layer 141 formed on the one surface 11a side of the substrate 11, the unsintered layer which is the heat generating layer 12 is formed by pattern printing, and then sintered to form the heat generating layer 12. This heat generating layer 12 is the same as that of the first embodiment.

After that, the insulating glass paste is applied to the surface of the insulating layer 141 exposed on the other surface 11b side of the substrate 11, and exposed to both surfaces of the insulating layer 141 and the heat generating layer 12 on the side 11a of the substrate 11, and then sintered. And a glass glaze layer (insulating layer 142) having a thickness of 50 μm was formed.

Next, in the same manner as in Example 1, a glass glaze layer (insulating layer 143) having a thickness of 20 μm was formed, and the heater 1 of Example 2 (Fig. 2) was obtained.

(3) The heater of the third embodiment (refer to FIG. 3)

In the same manner as in Example 1, a stainless steel film having a thickness of 300 μm was used as the substrate 11.

On the surface of one side 11a of the base 11, and the side of the other side 11b After the silver paste was applied to both surfaces of the surface, sintering was performed to form a soaking layer 13 (direct laminated type soaking layer 131) having a thickness of 8 μm.

Next, the insulating glass paste was applied to the surface of one surface 11a of the base 11 and the surface of each of the heat-receiving layers 13 on the side of the other surface 11b, followed by sintering to form a glass glaze layer (insulating layer 141) having a thickness of 75 μm.

Then, on the surface of the insulating layer 141 formed on the one surface 11a side of the substrate 11, the unsintered layer which is the heat generating layer 12 is formed by pattern printing, and then sintered to form the heat generating layer 12. This heat generating layer 12 is the same as that of the first embodiment.

After that, the insulating glass paste is applied to the surface of the insulating layer 141 exposed on the other surface 11b side of the substrate 11, and exposed to both surfaces of the insulating layer 141 and the heat generating layer 12 on the side 11a of the substrate 11, and then sintered. And a glass glaze layer (insulating layer 142) having a thickness of 50 μm was formed.

Next, in the same manner as in Example 1, a glass glaze layer (insulating layer 143) having a thickness of 20 μm was formed, and the heater 1 of Example 3 (Fig. 3) was obtained.

(4) The heater of the embodiment 4 (refer to FIG. 4)

In the same manner as in Example 1, a stainless steel film having a thickness of 300 μm was used as the substrate 11.

On the surface of the other surface 11b side of the base 11, a silver paste was applied and then sintered to form a soaking layer 13 having a thickness of 8 μm (the direct laminated type soaking layer 131).

Next, the insulating glass paste is applied to the surface of the one surface 11a side of the substrate 11 and the surface of the heat equalizing layer 13, and then sintered to form a thick layer. A 75 um glass glaze layer (insulating layer 141).

Then, on the surface of the insulating layer 141 formed on the one surface 11a side of the substrate 11, the unsintered layer which is the heat generating layer 12 is formed by pattern printing, and then sintered to form the heat generating layer 12. This heat generating layer 12 is the same as that of the first embodiment.

Thereafter, a silver paste is applied to the surface of the insulating layer 141 exposed on the other surface 11b side of the substrate 11, and then sintered to form a soaking layer 13 (indirect laminated type soaking layer 132) having a thickness of 8 μm.

After that, the insulating glass paste is applied to the surface of the heat insulating layer 132 exposed to the indirect buildup type, and exposed to both surfaces of the insulating layer 141 and the heat generating layer 12 on the side 11a of the substrate 11, and then sintered to form A glass glaze layer (insulating layer 142) having a thickness of 50 μm.

Next, in the same manner as in Example 1, a glass glaze layer (insulating layer 143) having a thickness of 20 μm was formed, and the heater 1 of Example 4 (Fig. 4) was obtained.

(5) Heater of Comparative Example 1 (refer to Fig. 15)

In the same manner as in Example 1, a stainless steel film having a thickness of 300 μm was used as the substrate 11.

On both surfaces of the surface 11a side of the base 11 and the surfaces of the side surfaces of the other surface 11b, an insulating glass paste was applied and then sintered to form a glass glaze layer (insulating layer 141) having a thickness of 75 μm.

Then, on the surface of the insulating layer 141 formed on the one surface 11a side of the substrate 11, the unsintered layer which is the heat generating layer 12 is formed by pattern printing, and then sintered to form the heat generating layer 12. The heat generating layer 12 is the same as in the first embodiment.

After that, the insulating glass paste is applied to both surfaces of the insulating layer 141 and the heat generating layer 12 exposed on the surface 11a of the substrate 11, and the surface of the insulating layer 141 exposed on the other surface 11b side of the substrate 11 is sintered. And a glass glaze layer (insulating layer 142) having a thickness of 50 μm was formed.

Next, in the same manner as in Example 1, a glass glaze layer (insulating layer 143) having a thickness of 20 μm was formed, and a heater of Comparative Example 1 (Fig. 15) was obtained.

[2] Confirmation of the effect of the soaking layer

For each of the heaters of Examples 1 to 4 and Comparative Example 1 obtained in the above [1], a voltage of 45 V was applied, and when the maximum temperature of the surface of each heater 1 reached 260 ° C, infrared heat was utilized. The image data (model "TH9100MR" manufactured by NEC Avio Infrared Technology Co., Ltd.) was used to obtain the temperature data of all the heaters 1 together. Thereafter, the information obtained from the pickup heaters sweep direction (D ₁₎ of a width of the center portion of the temperature in the information, but to be patterned, the pattern of the calculated maximum temperature and minimum temperature difference.

The above measurement was performed three times for each heater, and the average value of the obtained temperature differences was calculated and graphically shown in FIG. As a result, the temperature difference of the heater of Comparative Example 1 was 18.03 ° C, Example 1 was 13.10 ° C, Example 2 was 13.00 ° C, Example 3 was 12.43 ° C, and Example 4 was 12.50 ° C. That is, Example 1 was 27.3%, Example 2 was 27.9%, Example 3 was 31.1%, and Example 4 was 30.7%. It was found that each temperature difference can be reduced, and either of them can achieve an excellent soaking effect.

[3] Correlation between the thickness of the soaked layer and the formation position

(1) Heater of Example 5 (refer to Fig. 1)

The heater 1 of the fifth embodiment was obtained in the same manner as in the first embodiment except that the soaking layer 13 having a thickness of 8 μm (the soaking type soaking layer 131) was formed on the surface of the other surface 11b side of the substrate 11. That is, the heater 1 of the fifth embodiment has a direct laminated type soaking layer 131 having a total thickness of 8 μm.

(2) The heater of the embodiment 6 (refer to FIG. 3)

The heating of Example 6 was obtained in the same manner as in Example 3 except that the soaking layer 13 having a thickness of 8 μm (the soaking layer of the direct laminated layer) was formed on each of the surfaces 11a and 11b of the base 11 . Device 1. That is, the heater 1 of the sixth embodiment has a direct laminated type soaking layer 131 having a total thickness of 16 μm.

(3) The heater of the embodiment 7 (refer to FIG. 5)

In the same manner as in Example 1, a stainless steel film having a thickness of 300 μm was used as the substrate 11.

On both surfaces of the surface 11a side of the base 11 and the surfaces of the other surface 11b side, an insulating glass paste was applied and then sintered to form a glass glaze layer (insulating layer 141) having a thickness of 75 μm.

Further, on the surface of the insulating layer 141 formed on the one surface 11a side of the substrate 11, the pattern is formed into the heat generating layer 12 by screen printing. After the unsintered layer, sintering is performed to form the heat generating layer 12. This heat generating layer 12 is the same as that of the first embodiment.

Further, on the surface of the insulating layer 141 formed on the other surface 11b side of the substrate 11, the silver paste is applied by screen printing, followed by sintering to form a soaking layer 13 having a thickness of 8 μm (indirect laminated type) Thermal layer 132).

After that, the insulating glass paste is applied to both surfaces of the insulating layer 141 and the heat generating layer 12 exposed on the one surface 11a side of the substrate 11, and after being exposed on the surface of the heat equalizing layer 13 on the other surface 11b side of the substrate 11, Sintering was performed to form a glass glaze layer (insulating layer 142) having a thickness of 50 μm.

Next, in the same manner as in Example 1, a glass glaze layer (insulating layer 143) having a thickness of 20 μm was formed, and a heater of Example 7 (Fig. 5) was obtained. That is, the heater 1 of the seventh embodiment has a soaking layer type soaking layer 132 having a total thickness of 8 μm.

(4) The heater of the embodiment 8 (refer to FIG. 6)

In the same manner as in Example 1, a stainless steel film having a thickness of 300 μm was used as the substrate 11.

On both surfaces of the surface 11a side of the base 11 and the surfaces of the other surface 11b side, an insulating glass paste was applied and then sintered to form a glass glaze layer (insulating layer 141) having a thickness of 75 μm.

Then, on the surface of the insulating layer 141 formed on the one surface 11a side of the substrate 11, the unsintered layer which is the heat generating layer 12 is formed by pattern printing, and then sintered to form the heat generating layer 12. The heat generating layer 12 is the same as in the first embodiment.

Further, on the surface of the insulating layer 141 formed on the other surface 11b side of the substrate 11, the silver paste is applied by screen printing, followed by sintering to form a soaking layer 13 having a thickness of 8 μm (indirect laminated type) Thermal layer 132).

After that, the insulating glass paste is applied to both surfaces of the insulating layer 141 and the heat generating layer 12 exposed on the one surface 11a side of the substrate 11, and after being exposed on the surface of the heat equalizing layer 13 on the other surface 11b side of the substrate 11, Sintering was performed to form a glass glaze layer (insulating layer 142) having a thickness of 50 μm.

Next, in the same manner as in Example 1, a glass glaze layer (insulating layer 143) having a thickness of 20 μm was formed.

Further, on the surface of the glass glaze layer (insulating layer 143) formed on the other surface 11b side of the substrate 11, the silver paste is applied by screen printing, followed by sintering to form a soaking layer 13 having a thickness of 8 μm ( The heat storage layer 132) of the indirect buildup type was used to obtain the heater of Example 8 (Fig. 6). That is, the heater 1 of the eighth embodiment has a soaking layer type soaking layer 132 having a total thickness of 16 μm.

(5) The heater of the embodiment 9 (refer to FIG. 5)

The heater of Example 9 was obtained in the same manner as in Example 7 except that the silver paste was applied three times and then sintered to form a soaking layer 13 having a thickness of 24 μm (the inhomogeneous layer of the indirect layered layer). That is, the heater 1 of the ninth embodiment has a soaking layer type soaking layer 132 having a total thickness of 24 μm.

(6) The heater of the embodiment 10 (refer to FIG. 1)

The heater 1 of the tenth embodiment was obtained in the same manner as in the first embodiment except that the heat equalizing layer 13 having a thickness of 24 μm (the direct laminated type soaking layer 131) was formed on the surface of the other surface 11b side of the substrate 11. That is, the heater 1 of the tenth embodiment has a direct laminated type soaking layer 131 having a total thickness of 24 μm.

(7) Heater of Example 11 (refer to Fig. 3)

The heating of Example 11 was obtained in the same manner as in Example 3 except that the soaking layer 13 having a thickness of 36 μm (the soaking layer of the direct laminated layer) was formed on each of the surfaces 11a and 11b of the base 11. Device 1. That is, the heater 1 of the eleventh embodiment has a direct laminated type soaking layer 131 having a total thickness of 72 μm.

(8) The heater of the embodiment 12 (refer to FIG. 3)

The heating of Example 11 was obtained in the same manner as in Example 3 except that the soaking layer 13 having a thickness of 54 μm (the soaking type of the direct laminated layer) was formed on each of the surfaces 11a and 11b of the base 11. Device 1. That is, the heater 1 of the eleventh embodiment has a direct laminated type soaking layer 131 having a total thickness of 108 μm.

(9) The heater of the embodiment 13 (refer to FIG. 5)

In addition to forming a soaking layer 13 having a thickness of 54 μm (indirect layered type of soaking) The heater of Example 13 was obtained in the same manner as in Example 7 except for layer 132). That is, the heater 1 of the thirteenth embodiment has a soaking layer type soaking layer 132 having a total thickness of 54 μm.

(10) The heater of the embodiment 14 (refer to Fig. 6)

A soaking layer 13 (indirect laminated type soaking layer 132) having a thickness of 54 μm is formed on the surface of the other surface side of the insulating layer 141, and a thickness of 18 μm is formed on the surface of the other surface side of the glass glaze layer (insulating layer 143). The heater of Example 14 was obtained in the same manner as in Example 8 except that the hot layer 13 (the inhomogeneous layer soaking layer 132). That is, the heater 1 of the fourteenth embodiment has a soaking layer type soaking layer 132 having a total thickness of 72 μm.

(11) Measurement 1

The heaters of Examples 5 to 9 obtained in the above [3] (1) to (5) were used to discuss the correlation between the thickness and the formation position of the soaking layer. The same measurement as in the above [2] was performed, and the temperature difference between the highest temperature and the lowest temperature was obtained. And, the result is shown graphically in FIG.

In Fig. 14, the straight line connecting Examples 5 to 6 shows the correlation between the soaking effect and the thickness of the soaking layer in the case where the direct laminated layer soaking layer 131 is used. Further, the straight line connecting Examples 7 to 9 indicates the correlation between the soaking effect and the thickness of the soaking layer in the case where the inhomogeneous layer type soaking layer 132 is used.

From the results of Fig. 14, it is understood that the thickness of the direct laminated layer soaking layer 131 is the same as the thickness of the indirect laminated type soaking layer 132. In the case of the thickness, the direct thermal layer 131 of the direct lamination type having a higher effect of lowering the temperature difference is more preferable.

(12) Measurement 2

Using the heater of Comparative Example 1 obtained in the above [1] (5), the thickness and formation of the soaking layer for the heaters of Examples 5 to 14 obtained in the above [3] (1) to (10) The relevance of the location is discussed. The same measurement as in the above [2] was carried out, and the temperature difference between the highest temperature and the lowest temperature was determined (the average value of the temperature difference in each of the obtained data was measured three times for each heater). And, the result is shown graphically in FIG.

From the results of FIG. 18, it is understood that the direct laminated layer type soaking layer 131 or the indirect layered type soaking layer 132 is provided with a very thin thickness of 8 μm of the soaking layer 13 in Comparative Example 1, and is considered to be highly pulsating. Homogeneous action (lowering effect of temperature difference). That is, the temperature difference in Comparative Example 1 was 18.3 ° C, which was 11.2 ° C in Example 5 (direct laminated type soaking layer 8 μm), and in Example 7 (indirect laminated type soaking layer 8 μm). 13.0 ° C. It can be said that in Example 5, a soaking effect of 38.8% can be obtained, and in Example 7, a soaking effect of 29.0% can be obtained. Further, this remarkable soaking action can be obtained to a total thickness of about 30 μm, as is apparent from Fig. 18.

However, as is clear from Fig. 18, regardless of the direct laminated type soaking layer 131 or the indirect laminated type soaking layer 132, the soaking effect obtained is gradually reduced as the thickness of the soaking layer is increased. That is, with respect to the soaking action of each of Example 7, Example 8, and Example 9 of Comparative Example 1, Example 5, Example 6, and Example 10 of Comparative Example 1 Each of the soaking actions is excellent, and the soaking effect with respect to Example 12 of Example 11 or the soaking effect with respect to Example 14 of Example 13 is reduced compared to the soaking action. Further, the same temperature difference in the example of forming the soaking layer 13 having a total thickness of 200 μm was 6.7 ° C using both the direct laminated type heat equalizing layer 131 and the indirect laminated type soaking heat 132.

From these circumstances, it can be said that regardless of the direct laminated type soaking layer 131 or the indirect layered type soaking layer 132, when a more effective soaking action is obtained, the total thickness of the soaking layer is set to 150 μm. The following (usually 1 μm or more) is preferable, and it is more preferably 60 μm or less. It is more preferably 40 μm or less, and particularly preferably 30 μm or less.

[4] The shape of the soaking layer is related to the soaking effect

Any one of the planar shapes of the heat equalizing layers 13 of the heaters 1 of the above-described Embodiments 1 to 14 is a rectangular shape (adhesive coating type) as shown in Fig. 17 (a). On the other hand, either the planar shape of the soaking layer of FIG. 9 or the planar shape of the soaking layer of FIGS. 17(b) to (g) is the type of the missing portion 133X (including 133H and 133S). As a result, the correlation between the planar shape of the soaked layer and the soaking action was evaluated as follows.

(1) Heater of Example 15 (refer to Fig. 5)

In the same manner as in Example 7, the heater of Example 15 having a soaking layer 132 having a thickness of 16 μm was obtained. That is, Example 15 is a soaking layer type 132 having a thickness of 16 μm and having a planar shape in a rectangular shape (adhesive coating type).

(2) The heater of the embodiment 16 (refer to FIG. 5)

Except that the planar shape of the soaking layer 13 (the inhomogeneous layer of the indirect layered layer) is a stripe shape as shown in FIG. 17(e), the same as in the seventh embodiment, the implementation of the soaking layer 132 having a thickness of 16 μm is obtained. The heater of Example 15. Further, in the case of the area ratio in the planar shape, when the heat equalizing layer 132 of the heater of Example 15 was set to 100%, the soaking layer 132 of the heater of Example 16 was 60.0%.

(3) Measurement 3

Using the heater of Example 15 obtained in the above [4] (1) (see Fig. 5), and the heater of Example 16 obtained in the above [4] (2) (refer to Fig. 5), In the same measurement as in [2] above, the temperature difference between the highest temperature and the lowest temperature was determined (the measurement was performed three times for each heater, and the average of the temperature differences in each of the obtained data).

As a result, the temperature difference of Example 15 was 10.7 °C. Further, the temperature difference of Example 16 was 11.5 °C. That is, it is understood that the soaking layer 132 of the heater of Example 16 exhibits the same level of soaking action regardless of the area ratio of 60% with respect to Example 15. Specifically, the soaking layer 132 of the heater of Example 15 has a soaking effect of 1% per area ratio of 0.11 ° C, and the soaking layer 132 of the heater of Example 16 is 1% per area ratio. The thermal effect was 0.19 ° C, and it was found that the homogenization can be efficiently performed with less material. From this result, it is understood that by forming the missing portion 133X, the planar shape is optimized, and a higher soaking action can be obtained.

In addition, since any of the soaking layers 13 of the heaters of the above-described respective examples and comparative examples is formed by sintering and coating a silver paste, the metal porous portion 135a having a plurality of metal particles connected thereto is formed. And the type of the non-metal portion 135b disposed in the gap between the porous portions of the metal (see FIGS. 16(a) and (b)). Among them, the metal porous portion 135a is in a form in which silver particles are connected, and specifically, in the form of FIG. 16(b). Further, the non-metal portion 135b is formed by glass.

In addition, in the present invention, it is not limited to the above-described specific embodiments, and various modifications can be made within the scope of the present invention in accordance with the purpose and application.

Furthermore, the present invention encompasses the following inventions.

(1) A heater in which the material constituting the substrate is stainless steel.

(2) A heater having a surface on the other surface side of the substrate as a direction opposite to the object to be heated.

(3) The material constituting the heat equalizing layer is a heater selected from the group consisting of silver, copper, aluminum, and an alloy containing at least one of these.

(4) to the average thickness of the thermal layer to D _1, the thickness of the substrate is set in the case of the D _2, D ₁ and D ₂ ratio D ₁ / D ₂ is 0.6 or less as the gist of the heater.

(5) The heat generating layer includes a plurality of resistance heat generating units electrically connected in parallel, and each of the resistance heat generating units has a resistance heating wiring that is connected to a plurality of horizontal wiring portions that are arranged to be slightly perpendicular to the sweeping direction, and A heater in which a vertical wiring portion between the lateral wiring portions is connected and a hairpin is bent is formed.

(6) A heater in which the horizontal wiring portion is the same as the vertical wiring unit.

(7) A heater in which the vertical wiring is inclined in the sweep direction.

(8) A heater having a positive resistance heating coefficient for each of the resistance heating wires constituting each of the resistance heat generating units.

1‧‧‧heater

1a‧‧‧ one side of the heater

1b‧‧‧The other side of the heater (heating surface)

11‧‧‧ base

11a‧‧‧One side of the substrate

11b‧‧‧The other side of the substrate

12‧‧‧heat layer

13‧‧‧Homothermal layer

131‧‧‧Directly layered soaking layer

14,141,142,143‧‧‧Insulation (glass glaze)

Claims (9)

A heater that sweeps one of the object to be heated and a main heater to face the object to be heated, and heats the object to be heated. The heater is characterized in that it has a base body and a heat generating layer. And a heat equalizing layer disposed between the layer of the substrate and the heat generating layer and at least one of the other side of the substrate, wherein the thermal conductivity is greater than the substrate The material of the material is formed. The heater according to claim 1, wherein the heat equalizing layer has a direct laminated type soaking layer directly laminated on the substrate. The heater according to claim 1 or 2, wherein the heat equalizing layer has a layered type in which a layer of a glass glaze is interposed between the layers and the layer. The heater according to any one of claims 1 to 3, wherein the heat equalizing layer has a slit including a slit or a through hole penetrating through the front and back, and the heat equalizing layer is interposed between the missing portion One of the layers adjacent to the side faces is joined to the layer adjacent to the other side of the above-mentioned heat equalizing layer. The heater according to any one of claims 1 to 4, wherein the soaking layer has a plurality of metal particles connected to each other to form a metal The porous portion and the non-metallic portion disposed in the gap between the metal porous portions. The heater according to any one of claims 1 to 5, wherein the heat generating layer includes a plurality of resistance heat generating units electrically connected in parallel, and each of the resistance heat generating units has a resistance heating wiring, and the connection is configured to be a horizontal wiring portion that is slightly perpendicular to the scanning direction and a vertical wiring portion that connects the lateral wiring portions are formed in a hairpin shape, and are not formed between the adjacent resistance heat generating units. The non-formed portion of the above-described resistance heating wiring. A fixing device characterized by comprising the heater according to any one of claims 1 to 6. An image forming apparatus comprising the heater according to any one of claims 1 to 6. A heating device characterized by comprising the heater according to any one of claims 1 to 6.